Technical Note

TN_166

FTDI Example IC PCB Footprints

Version 1.1

Issue Date: 2017-05-16

This Technical Note shows examples of FTDI IC PCB footprints which can be
used as a guide for creating your own IC PCB footprints.

Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold FTDI harmless from any and all damages, claims, suits
or expense resulting from such use.

Future Technology Devices International Limited (FTDI)

Unit 1, 2 Seaward Place, Glasgow G41 1HH, United Kingdom
Tel.: +44 (0) 141 429 2777 Fax: + 44 (0) 141 429 2758
Web Site: http://ftdichip.com
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Table of Contents
1 Introduction .............................................................. 6
1.1 Scope ..................................................................................6
1.1.1 Unavailable Footprints ......................................................................... 6

2 All Scaled Footprints .................................................. 7

2.1 DFN Packages......................................................................7
2.2 QFP Packages ......................................................................7
2.3 QFN Packages......................................................................7
2.4 SSOP Packages ....................................................................7

3 Packages by Product ................................................. 8

3.1 DFN Packages......................................................................8
3.2 QFP Packages ......................................................................8
3.3 QFN Packages......................................................................8
3.4 SSOP Packages ....................................................................9

4 10-pin DFN .............................................................. 10

4.1 Scaled Footprint ................................................................ 10
4.2 Annotated Footprint .......................................................... 10

5 12-pin DFN .............................................................. 11

5.1 Scaled Footprint ................................................................ 11
5.2 Annotated Footprint .......................................................... 11

6 16-pin QFN (3mm x 3mm) ....................................... 12

6.1 Scaled Footprint ................................................................ 12
6.2 Annotated Footprint .......................................................... 12

7 16-pin QFN (4mm x 4mm) ....................................... 13

7.1 Scaled Footprint ................................................................ 13
7.2 Annotated Footprint .......................................................... 13

8 16-pin SSOP- ........................................................... 14

8.1 Scaled Footprint ................................................................ 14

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8.2 Annotated Footprint .......................................................... 14

9 16-pin TSSOP........................................................... 15
9.1 Scaled Footprint ................................................................ 15
9.2 Annotated Footprint .......................................................... 15

10 20-pin QFN ............................................................ 16

10.1 Scaled Footprint.............................................................. 16
10.2 Annotated Footprint ........................................................ 16

11 20-pin SSOP .......................................................... 17

11.1 Scaled Footprint.............................................................. 17
11.2 Annotated Footprint ........................................................ 17

12 24-pin QFN ............................................................ 18

12.1 Scaled Footprint.............................................................. 18
12.2 Annotated Footprint ........................................................ 18

13 24-pin SSOP .......................................................... 19

13.1 Scaled Footprint.............................................................. 19
13.2 Annotated Footprint ........................................................ 19

14 28-pin QFN ............................................................ 20

14.1 Scaled Footprint.............................................................. 20
14.2 Annotated Footprint ........................................................ 20

15 28-pin SSOP .......................................................... 21

15.1 Scaled Footprint.............................................................. 21
15.2 Annotated Footprint ........................................................ 21

16 28-pin TSSOP ........................................................ 22

16.1 Scaled Footprint.............................................................. 22
16.2 Annotated Footprint ........................................................ 22

17 28-pin WQFN ......................................................... 23

17.1 Scaled Footprint.............................................................. 23
17.2 Annotated Footprint ........................................................ 23

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18 32-pin LQFP ........................................................... 24

18.1 Scaled Footprint.............................................................. 24
18.2 Annotated Footprint ........................................................ 24

19 32-pin VQFN/QFN (5mm x 5mm) .......................... 25

19.1 Scaled Footprint.............................................................. 25
19.2 Annotated Footprint ........................................................ 25

20 32-pin QFN (7mm x 7mm) ..................................... 26

20.1 Scaled Footprint.............................................................. 26
20.2 Annotated Footprint ........................................................ 26

21 48-pin LQFP........................................................... 27
21.1 Scaled Footprint.............................................................. 27
21.2 Annotated Footprint ........................................................ 27

22 48-pin VQFN/WQFN (7mm x 7mm) ....................... 28

22.1 Scaled Footprint.............................................................. 28
22.2 Annotated Footprint ........................................................ 28

23 48-pin QFN (8mm x 8mm) ..................................... 29

23.1 Scaled Footprint.............................................................. 29
23.2 Annotated Footprint ........................................................ 29

24 56-pin QFN (7mm x 7mm) ..................................... 30

24.1 Scaled Footprint.............................................................. 30
24.2 Annotated Footprint ........................................................ 30

25 56-pin VQFN (8mm x 8mm) .................................. 31

25.1 Scaled Footprint.............................................................. 31
25.2 Annotated Footprint........................................................ 31

26 64-pin LQFP ........................................................... 32

26.1 Scaled Footprint.............................................................. 32
26.2 Annotated Footprint........................................................ 32

27 64-pin TQFP .......................................................... 33

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27.1 Scaled Footprint.............................................................. 33

27.2 Annotated Footprint ........................................................ 33

28 64-pin QFN (8mm x 8mm) ..................................... 34

28.1 Scaled Footprint.............................................................. 34
28.2 Annotated Footprint ........................................................ 34

29 64-pin QFN (9mm x 9mm) ..................................... 35

29.1 Scaled Footprint.............................................................. 35
29.2 Annotated Footprint ........................................................ 35
29.2.1 Additional Information ....................................................................... 36

30 76-pin QFN ............................................................ 37

30.1 Scaled Footprint.............................................................. 37
30.2 Annotated Footprint ........................................................ 37

31 80-pin LQFP ........................................................... 38

31.1 Scaled Footprint.............................................................. 38
31.2 Annotated Footprint ........................................................ 38

32 100-pin LQFP ......................................................... 39

32.1 Scaled Footprint.............................................................. 39
32.2 Annotated Footprint ........................................................ 39

33 100-pin QFN .......................................................... 40

33.1 Scaled Footprint.............................................................. 40
33.2 Annotated Footprint ........................................................ 40

34 Contact Information .............................................. 41

Appendix A – References ............................................. 42
Document References ............................................................... 42
Acronyms and Abbreviations..................................................... 42

Appendix B – List of Tables & Figures .......................... 43

List of Tables............................................................................. 43
List of Figures ........................................................................... 43

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Appendix C – Revision History ..................................... 45

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1 Introduction
This Technical Note shows examples of FTDI IC PCB footprints which can be used as a guide for
creating your own PCB footprints.
The IC footprints in this document are sourced from various FTDI hardware such as development
and application modules and demo hardware, using the most common and cost effective package
types.
Most FTDI IC footprints are included in this document; however some are missing when a package
type has not been used for specific FTDI hardware. See Table 1.1 for unavailable footprints.
The IC footprints in this document provide:
 A 1:1 scaled IC footprint
 An annotated IC footprint showing some key measurements
All dimensions shown are in millimeters (mm).

Additionally, a range of USB Interface IC solutions from FTDI Chip available through AltiumLive.
To view Altium files, you need either the full version of ‘Altium Designer’, or ‘Altium Viewer’ which
can be downloaded for free from Altium’s web site.
http://www.ftdichip.com/Support/Documents/PCBData.htm
Note that all IC footprints may not be available through AltiumLive. It is a live dBase continually
being updated.

1.1 Scope
These IC PCB footprints can be used as a guide to create your own IC PCB footprints with
particular PCB design tools other than Altium.
Please refer to the IC datasheet for full IC package parameters.
Note: No guarantees can be provided in this document. These can be used as a guide
only.
Note: FTDI Cables and Modules are recommended for product test and development prior to
custom hardware development.

1.1.1 Unavailable Footprints

Table 1.1 shows that there are some footprints not included in this document as, for example, they
have never been used for specific hardware developments within FTDI. Other package options for
those products exist and are included in this document.
Note: This is correct at the time of writing and newer products may not be included.

Package Part Numbers

32-pin WQFN FT51BQ
44-pin LQFP FT51AL
Table 1.1 Unavailable Footprints

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2 All Scaled Footprints

This section shows all packages scaled to 1:1 size to show the exact package size which can help
when selecting a package to use in your design.
Note that not all packages are available for all products. See Section 3 ‘Packages by Product’ in
this document, the product datasheet, or check the IC webpage:
http://www.ftdichip.com/Products/ICs.htm

2.1 DFN Packages

Figure 2.1 shown in pin count order from left to right:
DFN-10, DFN-12.

Figure 2.1 DFN Packages

2.2 QFP Packages

Figure 2.2 shown in pin count order from left to right:
LQFP-32, LQFP-48, LQFP-64, TQFP-64, LQFP-80, LQFP-100.

Figure 2.2 QFP Packages

2.3 QFN Packages

Figure 2.3 shown in pin count order from left to right:
QFN-16 (3x3), QFN-16 (4x4), QFN-20, QFN-24, QFN-28, WQFN-28, QFN-32 (5x5), QFN-32 (7x7),
QFN-48 (7x7), QFN-48 (8x8), QFN-56 (7x7), VQFN-56 (8x8), QFN-64 (8x8), QFN-64 (9x9), QFN-
76, QFN-100.

Figure 2.3 QFN Packages

2.4 SSOP Packages

Figure 2.4 shown in pin count order from left to right:
SSOP-16, TSSOP-16, SSOP-20, SSOP-24, SSOP-28, TSSOP-28.

Figure 2.4 SSOP Packages

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3 Packages by Product
Package availability for FTDI products is shown in this section.

3.1 DFN Packages

Package Part Numbers
DFN-10 FT200XD
DFN-12 FT234XD
Table 3.1 DFN Packages

3.2 QFP Packages

Package Part Numbers
LQFP-32 FT232BL, FT245BL, FT311D-32L1C,
FT312D-32L1C, VNC2-32L1B
LQFP-48 FT232HL, FT2232D, VNC1L-1A, VNC2--
48L1B
LQFP-64 FT2232HL, FT4232HL, FT313HL, VNC2-
64L1B
TQFP-64 FT313HP
LQFP-80 FT905L, FT906L, FT907L, FT908L
LQFP-100 FT900L, FT901L, FT902L, FT903L
Table 3.2 QFP Packages

3.3 QFN Packages

Package Part Numbers
QFN-16 (3x3) FT121Q
QFN-16 (4x4) FT201XQ, FT220XQ, FT230XQ
QFN-20 FT221XQ, FT231XQ
QFN-24 FT240XQ
QFN-28 FT120Q, FT122Q
WQFN-28 FT260Q
QFN-32 (5x5) FT232RQ, FT245RQ, FT4222HQ
QFN-32 (7x7) FT311D-32Q1C, FT312D-32Q1C,
VNC2-32Q1B
QFN-48 (7x7) FT51AQ, FT800Q, FT801Q, FT810Q,
FT811Q
QFN-48 (8x8) FT232HQ, VNC2-48Q1B
QFN-56 (7x7) FT600Q
VQFN-56 (8x8) FT2232H-56Q, FT4232H-56Q,
FT812Q, FT813Q

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Package Part Numbers

QFN-64 (8x8) VNC2-64Q1B
QFN-64 (9x9) FT2232HQ, FT4232HQ, FT313HQ
QFN-76 FT601Q, FT905Q, FT906Q, FT907Q,
FT908Q
QFN-100 FT900Q, FT901Q, FT902Q, FT903Q
Table 3.3 QFN Packages

3.4 SSOP Packages

Package Part Numbers

SSOP-16 FT201XS, FT220XS, FT230XS
TSSOP-16 FT121T
SSOP-20 FT221XS, FT231XS
SSOP-24 FT240XS
SSOP-28 FT232RL, FT245RL, FT51CS
TSSOP-28 FT120T, FT122T, FT260S
Table 3.4 SSOP Packages

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4 10-pin DFN
The 10-pin DFN is used on the following product:
 FT200XD
This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

4.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 4.1 10-pin DFN Scaled Footprint

4.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 4.2 10-pin DFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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5 12-pin DFN
The 12-pin DFN is used on the following product:
 FT234XD
This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.45mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

5.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 5.1 12-pin DFN Scaled Footprint

5.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 5.2 12-pin DFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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6 16-pin QFN (3mm x 3mm)

The 16-pin QFN (3mm x 3mm) is used on the following product:
 FT121Q
This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

6.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 6.1 16-pin QFN (3mm x 3mm) Scaled Footprint

6.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 6.2 16-pin QFN (3mm x 3mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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7 16-pin QFN (4mm x 4mm)

The 16-pin QFN (4mm x 4mm) is used on the following products:
 FT201XQ
 FT220XQ
 FT230XQ
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.65mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

7.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 7.1 16-pin QFN (4mm x 4mm) Scaled Footprint

7.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 7.2 16-pin QFN (4mm x 4mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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8 16-pin SSOP-
The 16-pin SSOP is used on the following products:
 FT201XS
 FT220XS
 FT230XS
This package is nominally 4.90mm x 3.91mm body (4.90mm x 5.99mm including pins). The solder
pads are on a 0.635mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

8.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 8.1 16-pin SSOP Scaled Footprint

8.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 8.2 16-pin SSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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9 16-pin TSSOP
The 16-pin TSSOP is used on the following product:
 FT121T
This package is nominally 5.0mm x 4.4mm body (5.0mm x 6.4mm including pins). The solder
pads are on a 0.65mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

9.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 9.1 16-pin TSSOP Scaled Footprint

9.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 9.2 16-pin TSSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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10 20-pin QFN
The 20-pin QFN is used on the following products:
 FT221XQ
 FT231XQ
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

10.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 10.1 20-pin QFN Scaled Footprint

10.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 10.2 20-pin QFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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11 20-pin SSOP
The 20-pin SSOP is used on the following products:
 FT221XS
 FT231XS
This package is nominally 8.66mm x 3.91mm body (8.66mm x 5.99mm including pins). The solder
pads are on a 0.635mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

11.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 11.1 20-pin SSOP Scaled Footprint

11.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 11.2 20-pin SSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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12 24-pin QFN
The 24-pin QFN is used on the following product:
 FT240XQ
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

12.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 12.1 24-pin QFN Scaled Footprint

12.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 12.2 24-pin QFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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13 24-pin SSOP
The 24-pin SSOP is used on the following products:
 FT240XS
This package is nominally 8.66mm x 3.91 mm body (8.66mm x 5.99mm including pins). The
solder pads are on a 0.635mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

13.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 13.1 24-pin SSOP Scaled Footprint

13.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 13.2 24-pin SSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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14 28-pin QFN
The 28-pin QFN is used on the following products:
 FT120Q
 FT122Q
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

14.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 14.1 28-pin QFN Scaled Footprint

14.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 14.2 28-pin QFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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15 28-pin SSOP
The 28-pin SSOP is used on the following products:
 FT232RL
 FT245RL
 FT51CS
This package is nominally 5.30mm x 10.20mm body (7.80mm x 10.20mm including pins). The
solder pads are on a 0.65mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

15.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 15.1 28-pin SSOP Scaled Footprint

15.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 15.2 28-pin SSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers

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16 28-pin TSSOP
The 28-pin TSSOP is used on the following products:
 FT120T
 FT122T
 FT260S
This package is nominally 9.7mm x 4.4mm body (9.7mm x 6.4mm including pins). The solder
pads are on a 0.65mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

16.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 16.1 28-pin TSSOP Scaled Footprint

16.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 16.2 28-pin TSSOP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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17 28-pin WQFN
The 28-pin WQFN is used on the following product:
 FT260Q
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

17.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 17.1 28-pin WQFN Scaled Footprint

17.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 17.2 28-pin WQFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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18 32-pin LQFP
The 32-pin LQFP is used on the following products:
 VNC2-32L1B
 FT311D-32L1C
 FT312D-32L1C
 FT232BL
 FT245BL
This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.80mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

18.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 18.1 32-pin LQFP Scaled Footprint

18.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 18.2 32-pin LQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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19 32-pin VQFN/QFN (5mm x 5mm)

The 32-pin VQFN/QFN (5mm x 5mm) is used on the following products:
 FT232RQ
 FT245RQ
 FT4222HQ
This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

19.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 19.1 32-pin VQFN/QFN (5mm x 5mm) Scaled Footprint

19.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 19.2 32-pin VQFN/QFN (5mm x 5mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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20 32-pin QFN (7mm x 7mm)

The 32-pin QFN (7mm x 7mm) is used on the following products:
 VNC2-32Q1B
 FT311D-32Q1C
 FT312D-32Q1C
This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.65mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

20.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 20.1 32-pin QFN (7mm x 7mm) Scaled Footprint

20.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 20.2 32-pin QFN (7mm x 7mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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21 48-pin LQFP
The 48-pin LQFP is used on the following products:
 FT232HL
 FT2232D
 VNC1L-1A
 VNC2-48Q1B
This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

21.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 21.1 48-pin LQFP Scaled Footprint

21.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 21.2 48-pin LQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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22 48-pin VQFN/WQFN (7mm x 7mm)

The 48-pin VQFN/WQFN (7mm x 7mm) is used on the following products:
 FT800Q
 FT801Q
 FT810Q
 FT811Q
 FT51AQ
This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

22.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 22.1 48-pin VQFN/WQFN (7mm x 7mm) Scaled Footprint

22.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 22.2 48-pin VQFN/WQFN (7mm x 7mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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23 48-pin QFN (8mm x 8mm)

The 48-pin QFN (8mm x 8mm) is used on the following products:
 VNC2-48Q1B
 FT232HQ
This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

23.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 23.1 48-pin QFN (8mm x 8mm) Scaled Footprint

23.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 23.2 48-pin QFN (8mm x 8mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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24 56-pin QFN (7mm x 7mm)

The 56-pin QFN (7mm x 7mm) is used on the following product:
 FT600Q
This package is nominally 7.00mm x 7.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

24.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 24.1 56-pin QFN (7mm x 7mm) Scaled Footprint

24.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 24.2 56-pin QFN (7mm x 7mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area. Cross-hatching designs used for less solder paste and less heat up rate required.

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25 56-pin VQFN (8mm x 8mm)

The 56-pin VQFN (8mm x 8mm) is used on the following products:
 FT812Q
 FT813Q
 FT2232HQ
 FT4232HQ
This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

25.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 25.1 56-pin VQFN (8mm x 8mm) Scaled Footprint

25.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 25.2 56-pin VQFN (8mm x 8mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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26 64-pin LQFP
The 64-pin LQFP is used on the following products:
 VNC2-64L1B
 FT313HL
 FT2232HL
 FT4232HL
This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

26.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 26.1 64-pin LQFP Scaled Footprint

26.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 26.2 64-pin LQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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27 64-pin TQFP
The 64-pin TQFP is used on the following products:
 FT313HP
This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

27.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 27.1 64-pin TQFP Scaled Footprint

27.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 27.2 64-pin TQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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28 64-pin QFN (8mm x 8mm)

The 64-pin QFN (8mm x 8mm) is used on the following product:
 VNC2-64Q1B
This package is nominally 8.00mm x 8.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

28.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 28.1 64-pin QFN (8mm x 8mm) Scaled Footprint

28.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 28.2 64-pin QFN (8mm x 8mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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29 64-pin QFN (9mm x 9mm)

The 64-pin QFN (9mm x 9mm) is used on the following products:
 FT313HQ
 FT2232HQ
 FT4232HQ
This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

29.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 29.1 64-pin QFN (9mm x 9mm) Scaled Footprint

29.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 29.2 64-pin QFN (9mm x 9mm) Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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29.2.1 Additional Information

This package is unique to all the other packages where there is extra strain relief between the
exposed pad in the center and the IC pins at the edge of the IC.
The exposed strain relief is connected to the pins so it is very important to ensure that the center
exposed pad is not larger than specified, otherwise it could short all the signals together rendering
the device and PCB useless.
The exposed strain relief should not be connected to the PCB in any way and this area should be
marked as keep out. Only the pins at the edge of the package and the center exposed pad should
be connected to the PCB.

Figure 29.3 64-pin QFN (9mm x 9mm) Bottom View

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30 76-pin QFN
The 76-pin QFN is used on the following products:
 FT601Q
 FT905Q
 FT906Q
 FT907Q
 FT908Q
This package is nominally 9.00mm x 9.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

30.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 30.1 76-pin QFN Scaled Footprint

30.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 30.2 76-pin QFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area. Cross-hatching design used for less solders paste and less heat up rate required.

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31 80-pin LQFP
The 80-pin LQFP is used on the following products:
 FT905L
 FT906L
 FT907L
 FT908L
This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

31.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 31.1 80-pin LQFP Scaled Footprint

31.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 31.2 80-pin LQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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32 100-pin LQFP
The 100-pin LQFP is used on the following products:
 FT900L
 FT901L
 FT902L
 FT903L
This package is nominally 16.00mm x 16.00mm. The solder pads are on a 0.50mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

32.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 32.1 100-pin LQFP Scaled Footprint

32.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 32.2 100-pin LQFP Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.

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33 100-pin QFN
The 100-pin QFN is used on the following products:
 FT900Q
 FT901Q
 FT902Q
 FT903Q
This package is nominally 12.00mm x 12.00mm. The solder pads are on a 0.40mm pitch.
Please see the IC Package Parameters in the IC datasheet for full information.

33.1 Scaled Footprint

This 1:1 scaled footprint is the exact size when viewed or printed at 100%.

Figure 33.1 100-pin QFN Scaled Footprint

33.2 Annotated Footprint

The annotated footprint shows key measurements.

Figure 33.2 100-pin QFN Annotated Footprint

Note: Red = top layer copper, other colors are mechanical layers.
Note: Connect exposed center pad to GND. Do not place tracks on the top layer of the PCB in this
area.

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34 Contact Information

Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA

Future Technology Devices International Limited Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park (USA)
Glasgow G41 1HH 7130 SW Fir Loop
United Kingdom Tigard, OR 97223-8160
Tel: +44 (0) 141 429 2777 USA
Fax: +44 (0) 141 429 2758 Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales) [email protected]
E-mail (Support) [email protected] E-Mail (Sales) [email protected]
E-mail (General Enquiries) [email protected] E-Mail (Support) [email protected]
E-Mail (General Enquiries) [email protected]

Branch Office – Taipei, Taiwan Branch Office – Shanghai, China

Future Technology Devices International Limited Future Technology Devices International Limited
(Taiwan) (China)
2F, No. 516, Sec. 1, NeiHu Road Room 1103, No. 666 West Huaihai Road,
Taipei 114 Shanghai, 200052
Taiwan , R.O.C. China
Tel: +886 (0) 2 8797 1330 Tel: +86 21 62351596
Fax: +886 (0) 2 8751 9737 Fax: +86 21 62351595

E-mail (Sales) [email protected] E-mail (Sales) [email protected]

E-mail (Support) [email protected] E-mail (Support) [email protected]
E-mail (General Enquiries) [email protected] E-mail (General Enquiries) [email protected]

Web Site

http://ftdichip.com

Distributor and Sales Representatives

Please visit the Sales Network page of the FTDI Web site for the contact details of our
distributor(s) and sales representative(s) in your country.

System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology
Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level
performance requirements. All application-related information in this document (including application descriptions, suggested
FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this
information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications
assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from
such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is
implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product
described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent
of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,
Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640

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Appendix A – References

Document References
http://www.ftdichip.com/Support/Documents/PCBData.htm
http://www.ftdichip.com/Products/ICs.htm

Acronyms and Abbreviations

Terms Description

DFN Dual-Flat No-Leads Package

IC Integrated Circuit

LQFP Low Profile Quad Flat Package

PCB Printed Circuit Board

QFN Quad Flat No-Leads Package

SSOP Shrink Small-Outline Package

TSSOP Thin-Shrink Small Outline Package

VQFN / WQFN Very Thin Quad Flat No-Lead Package

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Appendix B – List of Tables & Figures

List of Tables
Table 1.1 Unavailable Footprints ........................................................................................... 6
Table 3.1 DFN Packages....................................................................................................... 8
Table 3.2 QFP Packages ....................................................................................................... 8
Table 3.3 QFN Packages ...................................................................................................... 9
Table 3.4 SSOP Packages ..................................................................................................... 9

List of Figures
Figure 2.1 DFN Packages ..................................................................................................... 7
Figure 2.2 QFP Packages ...................................................................................................... 7
Figure 2.3 QFN Packages ..................................................................................................... 7
Figure 2.4 SSOP Packages.................................................................................................... 7
Figure 4.1 10-pin DFN Scaled Footprint................................................................................ 10
Figure 4.2 10-pin DFN Annotated Footprint .......................................................................... 10
Figure 5.1 12-pin DFN Scaled Footprint................................................................................ 11
Figure 5.2 12-pin DFN Annotated Footprint .......................................................................... 11
Figure 6.1 16-pin QFN (3mm x 3mm) Scaled Footprint .......................................................... 12
Figure 6.2 16-pin QFN (3mm x 3mm) Annotated Footprint ..................................................... 12
Figure 7.1 16-pin QFN (4mm x 4mm) Scaled Footprint .......................................................... 13
Figure 7.2 16-pin QFN (4mm x 4mm) Annotated Footprint ..................................................... 13
Figure 8.1 16-pin SSOP Scaled Footprint .............................................................................. 14
Figure 8.2 16-pin SSOP Annotated Footprint......................................................................... 14
Figure 9.1 16-pin TSSOP Scaled Footprint ............................................................................ 15
Figure 9.2 16-pin TSSOP Annotated Footprint ....................................................................... 15
Figure 10.1 20-pin QFN Scaled Footprint .............................................................................. 16
Figure 10.2 20-pin QFN Annotated Footprint......................................................................... 16
Figure 11.1 20-pin SSOP Scaled Footprint ............................................................................ 17
Figure 11.2 20-pin SSOP Annotated Footprint ....................................................................... 17
Figure 12.1 24-pin QFN Scaled Footprint .............................................................................. 18
Figure 12.2 24-pin QFN Annotated Footprint......................................................................... 18
Figure 13.1 24-pin SSOP Scaled Footprint ............................................................................ 19
Figure 13.2 24-pin SSOP Annotated Footprint ....................................................................... 19
Figure 14.1 28-pin QFN Scaled Footprint .............................................................................. 20
Figure 14.2 28-pin QFN Annotated Footprint......................................................................... 20
Figure 15.1 28-pin SSOP Scaled Footprint ............................................................................ 21

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Figure 15.2 28-pin SSOP Annotated Footprint ....................................................................... 21

Figure 16.1 28-pin TSSOP Scaled Footprint .......................................................................... 22
Figure 16.2 28-pin TSSOP Annotated Footprint ..................................................................... 22
Figure 17.1 28-pin WQFN Scaled Footprint ........................................................................... 23
Figure 17.2 28-pin WQFN Annotated Footprint ...................................................................... 23
Figure 18.1 32-pin LQFP Scaled Footprint............................................................................. 24
Figure 18.2 32-pin LQFP Annotated Footprint ....................................................................... 24
Figure 19.1 32-pin VQFN/QFN (5mm x 5mm) Scaled Footprint ............................................... 25
Figure 19.2 32-pin VQFN/QFN (5mm x 5mm) Annotated Footprint .......................................... 25
Figure 20.1 32-pin QFN (7mm x 7mm) Scaled Footprint ........................................................ 26
Figure 20.2 32-pin QFN (7mm x 7mm) Annotated Footprint ................................................... 26
Figure 21.1 48-pin LQFP Scaled Footprint ............................................................................. 27
Figure 21.2 48-pin LQFP Annotated Footprint ....................................................................... 27
Figure 22.1 48-pin VQFN/WQFN (7mm x 7mm) Scaled Footprint............................................. 28
Figure 22.2 48-pin VQFN/WQFN (7mm x 7mm) Annotated Footprint ....................................... 28
Figure 23.1 48-pin QFN (8mm x 8mm) Scaled Footprint ........................................................ 29
Figure 23.2 48-pin QFN (8mm x 8mm) Annotated Footprint ................................................... 29
Figure 24.1 56-pin QFN (7mm x 7mm) Scaled Footprint ........................................................ 30
Figure 24.2 56-pin QFN (7mm x 7mm) Annotated Footprint ................................................... 30
Figure 25.1 56-pin VQFN (8mm x 8mm) Scaled Footprint ...................................................... 31
Figure 25.2 56-pin VQFN (8mm x 8mm) Annotated Footprint ................................................. 31
Figure 26.1 64-pin LQFP Scaled Footprint ............................................................................. 32
Figure 26.2 64-pin LQFP Annotated Footprint ....................................................................... 32
Figure 27.1 64-pin TQFP Scaled Footprint ............................................................................ 33
Figure 27.2 64-pin TQFP Annotated Footprint ....................................................................... 33
Figure 28.1 64-pin QFN (8mm x 8mm) Scaled Footprint ........................................................ 34
Figure 28.2 64-pin QFN (8mm x 8mm) Annotated Footprint ................................................... 34
Figure 29.1 64-pin QFN (9mm x 9mm) Scaled Footprint ........................................................ 35
Figure 29.2 64-pin QFN (9mm x 9mm) Annotated Footprint ................................................... 35
Figure 29.3 64-pin QFN (9mm x 9mm) Bottom View ............................................................. 36
Figure 30.1 76-pin QFN Scaled Footprint .............................................................................. 37
Figure 30.2 76-pin QFN Annotated Footprint......................................................................... 37
Figure 31.1 80-pin LQFP Scaled Footprint ............................................................................. 38
Figure 31.2 80-pin LQFP Annotated Footprint ....................................................................... 38
Figure 32.1 100-pin LQFP Scaled Footprint ........................................................................... 39
Figure 32.2 100-pin LQFP Annotated Footprint ...................................................................... 39
Figure 33.1 100-pin QFN Scaled Footprint ............................................................................ 40
Figure 33.2 100-pin QFN Annotated Footprint ....................................................................... 40

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Appendix C – Revision History

Document Title: TN_166 FTDI Example IC PCB Footprints
Document Reference No.: FT_001321
Clearance No.: FTDI# 501
Product Page: http://www.ftdichip.com/FTProducts.htm
Document Feedback: Send Feedback

Revision Changes Date

1.0 Initial Release 2016-04-27

1.1 Updated Release 2017-05-16

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