Intel 82802 Firmware Hub

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Intel® 82802AB/82802AC
Firmware Hub (FWH)
Datasheet
November 2000
Document Number: 290658-004
This datasheet has been downloaded from http://www.digchip.com at this page

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Intel 82802AB/AC Firmware Hub
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Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® 82802AB/AC Firmware Hub (FWH) may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
2 2
I C is a 2-wire communications bus/protocol developed by Philips. SMBus is a subset of the I C bus/protocol and was developed by Intel. Implementations
of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation.
Alert on LAN is a result of the Intel-IBM Advanced Manageability Alliance and a trademark of IBM
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*Third-party brands and names are the property of their respective owners.
Copyright © Intel Corporation 1999-2001
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Contents
1. Architectural Overview ................................................................................................................. 9
1.1. Interface Overview........................................................................................................... 9
1.1.1. Intel Firmware Hub Interface....................................................................... 10
1.1.2. Address/Address-Multiplexed Interface ...................................................... 10
1.2. Nonvolatile Flash Memory Core .................................................................................... 10
2. Pinout Configurations ................................................................................................................. 13
2.1. Pin Descriptions............................................................................................................. 14
3. Interface Operation Description ................................................................................................. 17
3.1. Read 17
3.2. Write 17
3.3. Output Disable............................................................................................................... 17
3.4. Reset 17
3.5. Operational Effects of Hardware Write-Protect Pins TBL# and WP# ........................... 18
4. Functional Descriptions.............................................................................................................. 19
4.1. Read Array Command................................................................................................... 21
4.2. Read Identifier Codes Command .................................................................................. 21
4.3. Read Status Register Command................................................................................... 21
4.4. Clear Status Register Command................................................................................... 21
4.5. Block Erase Command ................................................................................................. 22
4.6. Program Command....................................................................................................... 22
4.7. Block Erase Suspend Command .................................................................................. 23
4.8. Program Suspend Comand........................................................................................... 23
4.9. Register Based Locking, General-Purpose Input, and Random Number Generator
Registers 23
4.9.1. T_BLOCK_LK and T_MINUSxx_LK — Block-Locking Registers ............... 25
4.9.2. General-Purpose Input Register ................................................................. 26
4.9.2.1. GPI_REG — General-Purpose Input Register ............................... 26
4.9.3. Random Number Generator Registers ....................................................... 27
4.9.3.1. RNG Hardware Status Register ..................................................... 27
4.9.3.2. RNG Data Status Register ............................................................. 27
4.9.3.3. RNG Data Register......................................................................... 28
4.10. Using the Random Number Generator ......................................................................... 28
4.11. Detecting and Initializing the RNG Device..................................................................... 28
4.11.1. Detecting the RNG Device .......................................................................... 28
4.11.2. Initializing the RNG Device.......................................................................... 29
4.11.3. Selecting Appropriate FWH IDs and Densities ........................................... 29
4.11.4. Mapping FWH Devices onto Memory Map ................................................. 30
4.11.5. Paging FWH Devices for Greater Than 4 MB of FWH Memory ................. 30
4.11.6. Programming Multiple FWH Devices .......................................................... 30
4.12. CUI Automation Flowcharts........................................................................................... 31
5. Electrical Specifications ............................................................................................................. 33
5.1. Absolute Maximum Ratings........................................................................................... 33
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5.2. Operating Conditions .....................................................................................................33

5.2.1. Interface DC Input/Output Specifications ....................................................34
5.2.2. Interface AC Input/Output Specifications.....................................................36
5.2.3. Intel FWH Interface AC Timing Specifications ............................................37
5.2.3.1. Clock Specification..........................................................................37
5.2.3.2. Signal Timing Parameters...............................................................38
5.3. Block Programming Times ............................................................................................40
5.4. Intel Firmware Hub Interface..........................................................................................40
5.4.1. Intel FWH Interface Cycles..........................................................................40
5.4.1.1. Read Cycle Sequence.....................................................................40
5.4.1.2. Single-Byte Read Waveforms.........................................................42
5.4.1.3. Write Cycle Sequence.....................................................................42
5.4.1.4. Write Waveforms ............................................................................43
5.4.1.5. Response To Invalid Fields.............................................................43
5.4.1.6. Abort Operations .............................................................................44
5.4.1.7. Intel FWH Cycle Timing Information ...............................................44
5.5. RNG Parameters ...........................................................................................................45
6. PROM Programming Specifications ...........................................................................................47
6.1. Programming (“A/A Mux”) Mode Operation ...................................................................47
6.2. Bus Operation ................................................................................................................47
6.2.1. Output Disable/Enable.................................................................................47
6.2.2. Row/Column Addresses ..............................................................................47
6.2.3. Read Operation ...........................................................................................47
6.2.4. Read Identifier Codes Operation .................................................................48
6.2.5. Write Operation ...........................................................................................48
6.3. Command Definitions ....................................................................................................48
6.4. Electrical Characteristics in A/A Mux Mode ...................................................................48
6.4.1. Reset Operations.........................................................................................49
6.4.2. AC Waveforms for Reset Operations ..........................................................49
(1,3)
6.4.3. A/A Mux Read-Only Operations .............................................................49
(1,2)
6.4.4. A/A Mux Write Operations .....................................................................51
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Figures
Figure 1. Simplified Block Diagram ..................................................................................... 8
Figure 2. Device Memory Map with Intel FWH Hardware Lock Architecture .................... 11
Figure 3. Intel FWH Boot-Configuration System Memory Map......................................... 11
Figure 4. 32-Lead PLCC Intel Firmware Hub Pinout......................................................... 13
Figure 5. 40-Lead TSOP Intel Firmware Hub Pinout ........................................................ 13
Figure 6. Automated Block Erase Flowchart..................................................................... 31
Figure 7. Clock Waveform ................................................................................................ 37
Figure 8. Output Timing Parameters................................................................................. 38
Figure 9. Input Timing Parameters ................................................................................... 39
Figure 10. FWH Single-Byte Read Waveforms .................................................................. 42
Figure 11. Write Waveforms ............................................................................................... 43
Figure 12. Intel FWH Output Timing Parameters ............................................................... 45
Figure 13. Intel FWH Input Timing Parameters .................................................................. 46
Figure 14. A/A Mux Read Timing Diagram ......................................................................... 50
Figure 15. A/A Mux Write Timing Diagram ......................................................................... 52
Tables
Table 1. Pin Descriptions ................................................................................................. 14
Table 2. Command Definitions......................................................................................... 19
Table 3. Status Register Definition .................................................................................. 20
Table 4. Identifier Codes .................................................................................................. 21
Table 5. Intel Firmware Hub Register Configuration Map................................................ 24
Table 6. Register-Based Locking Value Definitions......................................................... 25
Table 7. Temperature and VCC....................................................................................... 33
Table 8. Intel FWH Interface DC Input/Output Specifications.......................................... 34
Table 9. Power Supply Specifications — All Interfaces ................................................... 35
Table 10. Intel FWH Interface AC Input/Output Specifications.......................................... 36
Table 11. Clock Specification............................................................................................. 37
Table 12. Signal Timing Parameters.................................................................................. 38
Table 13. Interface Measurement Condition Parameters .................................................. 39
Table 14. AC Waveform for Reset Operation.................................................................... 39
Table 15. Programming Times .......................................................................................... 40
Table 16. FWH Read Cycle ............................................................................................... 41
Table 17. FWH Write Cycle ............................................................................................... 42
Table 18. Signal Timing Parameters.................................................................................. 44
Table 19. RNG Timing Characteristics .............................................................................. 45
Table 20. RNG Statistical Characteristics.......................................................................... 45
Table 21. Bus Operations .................................................................................................. 48
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Revision History
Rev. Draft/Changes Date
-001 • Initial Release April 1999
-002 • Added Chapter 6 May 1999

• Updated programmer vendor/service provider information.
-003 • Changed VIH min. spec to reflect actual value. May 2000
• Updated programmer vendor/service provider information.

• Clarification of part numbering.
• Spec now includes all known issues from all densities/lithographies.
• Included FWH memory cycle and RNG information.
-004 • Removed All references to multi-byte read cycles November 2000

• Added DC Characteristics for A/A Mux mode
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Intel® 82802AB/AC Firmware Hub

(FWH)
Product Features
§ Intel platform compatability § Two configurable interfaces
 Enables security-enhanced platform  Firmware hub interface for platform
infrastructure; facilitates option to remove ISA. operation
§ Firmware hub hardware interface mode  Address/Address-Multiplexed (A/A Mux)
 5-Signal communication interface supporting interface for programming during
byte-at-a-time reads and writes manufacturing
 Register-based read and write protection for § 4 or 8 Mbits of flash memory for platform
each code/data storage block code/data nonvolatile storage
 Hardware write protect pins for the top boot  Symmetrically blocked, 64-KB memory
block and the remaining code/data storage sections
blocks  Available in 8-Mbit (Intel® 82802AC) and 4-
 5 Additional GPIs for platform design Mbit (Intel® 82802AB) densities
flexibility  Automated byte program and block erase via
 Contains a hardware Random Number an integrated Write State Machine (WSM)
Generator (RNG) for enhancing platform § Address/Address-Multiplexed (A/A Mux)
security interface/mode
 Integrated Command User Interface (CUI) for  11-Pin multiplexed address and 8-pin data
requesting access to locking, programming, and I/O interface
erasing options. The CUI also handles requests  Supports fast on-board or out-of-system
for data residing in status, ID, and block-lock programming for manufacturing
registers. § Case temprature operating range
 Operates with 33-MHz PCI clock and § Power supply specifications
3.3 V I/O.  Vcc: 3.3 V ± 0.3 V
§ Industry-standard packages  Vpp: 3.3 V and 12 V for fast programming,
(40L TSOP or 32L PLCC) (80 hours maximum)
The Intel® 82802 (FWH) firmware hub may contain design defects or errors known as errata that may cause the products to
deviate from published specifications. Current characterized errata are available upon request.
Datasheet 7
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Figure 1. Simplified Block Diagram
Processor
Memory Memory
Controller
ISA Bridge
(optional)
SMBus Device(s) SMBus
PCI Bus PCI Slot
AC’97 Codec(s) AC’97 I/O
(optional) Controller PCI Agent
IDE LPC Interface

IDE (4 drives)
USB
GPIO
Super I/O
82802
Keyboard,
Mouse, FD,
PP, SP, IR
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1. Architectural Overview
The Intel® 82802 Firmware Hub (FWH) discrete component is compatible with several Intel chipset
platforms and a variety of applications. The device operates under the LPC/FWH interface/protocol. The
hardware features of this device include a Random Number Generator (RNG), five General-Purpose
Inputs (GPIs), register-based block locking, and hardware-based locking. This combination of logic
features and non-volatile memory enables better protection for the storage and update of platform code
and data, adds platform flexibility through additional GPIs, and allows for quicker introduction of new
security/manageability features into current and future platforms. The platform RNG, accessed through
the Intel® Security Driver and third-party software, enables security features for the PC platform. See the
product features listed previously for a list of more key features that the Intel FWH provides.
1.1. Interface Overview

This device is equipped with two hardware interfaces. The state of the device’s “IC”
(InterfaceConfiguration) pin determines which interface is in use. The interface mode must be selected
prior topower-up or before return from reset (RST# or INIT# low-to-high transition). The Intel FWH
interface isdesigned to work with the Intel family of I/O Controller Hubs (ICH) during platform
operation. The A/A Mux interface is designed as a programming interface for OEMs, for use during
motherboard manufacturing or component pre-programming. The A/A Mux interface is not intended for
use during regular personal computer operation. Such a configuration would cause the expected (Intel
FWH) interface to be disabled, and the system boot sequence would fail upon power-up.
An internal Command User Interface (CUI) serves as the internal control center for the
nonvolatilememory core in either of the two device interfaces (Intel FWH or A/A Mux). A single valid
commandsequence written to the CUI initiates an automated sequence of internal events to complete
various tasks. An internal Write State Machine (WSM) automatically executes the algorithms and
timings necessary for block erase and program operations.
Driving RST# or INIT# low resets the device, which resets the block-lock registers to their default
(write-locked) condition and clears the status register. A reset time (tPHQV A/A Mux) is required from
RST# or INIT# switching high until outputs are valid. Likewise, the device has a wake time (tPHRH A/A
Mux) from RST# or INIT# high until writes to the CUI are recognized. A reset latency will occur if a
reset procedure is performed during a programming or erase operation. Resetting the component will put
the component back into read-array mode.
Note: There is no chip enable (like CE#) in either interface. Stand-by current control in the Inel FWH interface
is enabled automatically, if the Intel FWH4 is high and the device is not working to complete a requested
activity.
Datasheet 9
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1.1.1. Intel Firmware Hub Interface

The Intel Firmware Hub (Intel FWH) interface consists primarily of a 5-signal communication interface
used to control the operation of the device in a system environment. The buffers for this interface were
designed to be PCI compliant. To ensure the effective delivery of security and manageability features, the
Intel FWH interface is the only way access the full feature set of the device. The Intel FWH interface is
equipped to operate at 33 MHz, synchronous with the PCI bus.
1.1.2. Address/Address-Multiplexed Interface

The A/A Mux refers to the multiplexed row and column addresses in this interface. This approach is
required so that the device can be tested and programmed quickly with automated test equipment (ATE)
or off-board PROM programmers in the OEM’s manufacturing flow. This interface also allows the
device to have an efficient programming interface with potentially large future densities, while still fitting
into a 32-pin package. Only basic reads, programming, and erasure of the nonvolatile memory blocks can
be performed through the A/A Mux interface. In this mode, the Intel FWH features, security features, and
registers are unavailable. A row/column (R/C#) pin determines which set of addresses (rows or columns)
is latched. See the A/A Mux pin description table for more information.
1.2. Nonvolatile Flash Memory Core

The primary feature of the Intel FWH component is a nonvolatile memory core based on Intel® Flash
Technology. This high-performance memory array is arranged in eight (4-Mbit device) or sixteen (8-
Mbit device) 64-KB blocks.
Intel® Flash Technology enables fast factory programming and low-power designs. Specifically designed
for 3-V systems, this component supports read operations at 3.3 V VCC and block erase and program
operations at 3.3 V and 12 V VPP. The 12 V VPP option yields the fastest program performance, which
will increase factory throughput, but is not recommended for standard in-system FWH operation in the
platform, due to an 80-hr limit for 12 V on the VPP pin over the lifetime of the device, whether or not
programming is taking place. With the 3.3-V VPP option (recommended for in-system operation), VCC
and VPP may be tied together for a simple, low-power 3-V design. In addition to the voltage flexibility,
the dedicated VPP pin provides complete data protection when VPP ≤ VPPLK. Internal VPP detection
circuitry automatically configures the device for block erase and program operations. While current for
12-V programming will be drawn from VPP, 3.3-V programming solutions should design their board such
that VPP draws from the same supply as VCC, and should assume that full programming current may be
drawn from either pin.
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Figure 2. Device Memory Map with Intel FWH Hardware Lock Architecture
0FFFFF
0F0000 64-Kbyte Block 15 } TBL# (8 Mb)
0EFFFF
0E0000
64-Kbyte Block 14
0DFFFF
0D0000 64-Kbyte Block 13
0CFFFF
0C0000
64-Kbyte Block 12
0BFFFF
0B0000 64-Kbyte Block 11
0AFFFF
0A0000
64-Kbyte Block 10
09FFFF
090000
64-Kbyte Block 9
08FFFF WP# (8 Mb)
080000 64-Kbyte Block 8
07FFFF Blocks 0-14
070000 64-Kbyte Block 7 }TBL# (4 Mb)
06FFFF
060000
64-Kbyte Block 6
05FFFF
04FFFF
03FFFF WP# (4 Mb)
02FFFF
01FFFF
010000
64-Kbyte Block 1
00FFFF
000000
64-Kbyte Block 0
mem_map_lock
Figure 3. Intel FWH Boot-Configuration System Memory Map
System Memory FWH FWH

(Top 4 MB) 4 Mbit 8 Mbit
FFFFFFFFh Block 7 Block 15
FFF80000h
Block0
FFF00000h
Block 0
Range for other

FWH devices
FFC00000h
Sys_memmap_boot
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2. Pinout Configurations
Figure 4. 32-Lead PLCC Intel Firmware Hub Pinout
A/A A/A
A8 A9 RST# VPP VCC R/C# A10
Mux Mux
FGPI2 FGPI3 RST# VPP VCC CLK FGPI4
4 3 2 1 32 31 30
A7 FGPI1 5 29 IC (VIL) IC(VIH)
A6 FGPI0 28 GNDa
6 GNDa
A5 WP# 7 27 VCCa VCCa

IntelFirmware Hub
A4 TBL# (IntelFWH) 26 GND GND
8
32-Lead PLCC
A3 ID3
0.450" x 0.550" 25 VCC VCC
9 Top View
A2 ID2 10 24 INIT# OE#
A1 ID1 11 23 FWH4 WE#
A0 ID0 12 22 RFU RY/BY#
DQ0 FWH0 13 21 RFU DQ7
14 15 16 17 18 19 20
FWH1 FWH2 GND FWH3 RFU RFU RFU

A/A DQ1 DQ2 GND DQ3 DQ4 DQ5 DQ6 A/A
Mux Mux
Figure 5. 40-Lead TSOP Intel Firmware Hub Pinout
A/A Mux A/A Mux
NC NC 1 40 GNDa GNDa
IC (VIH) IC (VIL) 2 39 VCCa VCCa
NC NC 3 38 FWH4 WE#
NC NC 4 37 INIT# OE#
NC NC 5 36 RFU RY/BY#
NC NC 6 35 RFU DQ7
A10 FGPI4 7 34 RFU DQ6
NC NC 8 Firmware Hub (FWH) 33 RFU DQ5
R/C# CLK 9 32 RFU DQ4
VCC 40-LEAD TSOP
VCC
10 31 VCC VCC
VPP VPP 11 10mm x 20mm 30 GND GND
RST# RST# 12 TOP VIEW 29 GND GND

NC NC 13 28 FWH3 DQ3
NC NC 14 27 FWH2 DQ2
A9 FGPI3 15 26 FWH1 DQ1
A8 FGPI2 16 25 FWH0 DQ0
A7 FGPI1 17 24 ID0 A0
A6 FGPI0 18 23 ID1 A1
A5 WP# 19 22 ID2 A2
A4 TBL# 20 21 ID3 A3
Datasheet 13
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2.1. Pin Descriptions

The pin descriptions table details the usage of each device pin. Most pins have dual functionality, with
functions in both the Intel Firmware Hub and A/A Mux interfaces. The A/A Mux functionality for pins is
shown bold italic in the description box for that pin. All pins are designed to be compliant with
VCC + 0.3 V max. unless otherwise noted.
Table 1. Pin Descriptions
Symbol Type Interface Name and Function
Intel A/A Mux

FWH
IC I X X Interface Configuration Pin. This pin determines which interface is

used to communicate with the device. When it is held low, the Intel
FWH interface is enabled. When it is held High, the A/A Mux
interface is enabled. This pin must be set at power-up or before
return from reset, and must not be changed during device operation.
This pin is pulled down with an internal resistor of between 20 and
100 kΩ. When the IC is High (A/A Mux mode), this pin will exhibit a
leakage current of approximately 200 µA. This pin may be floated,
which will select the Intel FWH mode.
RST# I X X Interface Reset. Valid for both A/A Mux and Intel FWH interface
operation. When driven low, RST# inhibits write operations to
provide data protection during power transitions, resets internal
automation, and tri-states pins FWH[3:0] (in Intel FWH interface
mode). RST#-high enables normal operation. When exiting from
reset, the device defaults to read array mode.
INIT# I X Processor Reset. This is a second reset pin for in-system use. This
pin is internally combined with the RST# pin. If this pin or RST# is
driven low, identical operation is exhibited. This signal is designed to
be connected to the chipset INIT signal (Max. voltage depends on
the processor. Do not use 3.3 V).
A/A Mux = OE#
CLK I X 33-MHz Clock for Intel FWH Interface. This input is the same as
that for the PCI clock and adheres to the PCI specification.
A/A Mux = R/C#
FWH[3:0] I/O X Intel FWH I/Os. I/O communication

A/A Mux = DQ[3:0]
FWH4 I X Intel FWH Input. Input communication

A/A Mux = WE#
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Intel A/A Mux

FWH
ID[3:0] I X Identification Inputs. These four pins are part of the mechanism
that allows multiple parts to be attached to the same bus. The
strapping of these pins is used to identify the component. The boot
device must have ID[3:0] = 0000, and it is recommended that all
subsequent devices use sequential up-count strapping (0001,
0010,0011,...). These pins are pulled down with internal resistors, with
values between 20 and 100 kΩ, when in the Intel FWH mode. Any
ID pins pulled high will exhibit a leakage current of approximately
200 µA. Any pins intended to be low may be left to float. In a single
Intel FWH system, all may be left floating.
A/A Mux = A[3:0]
Intel FWH General Purpose Inputs. These individual inputs can be

used for additional board flexibility. The state of these pins can be
read immediately at boot, through Intel FWH registers. These inputs
should be at their desired state before the start of the PCI clock
FGPI[4:0] I X cycle during which the read is attempted, and they should remain at
the same level until the end of the read cycle. They may only be
used for 3.3-V signals. Unused FGPI pins must not be floated.
A/A Mux = A[10:6]
Top Block Lock. When low, it prevents programming or block erase

to the highest addressable block (7 in a 4-Mbit, 15 in an 8-Mbit
component), regardless of the state of the lock register. TBL#-high
TBL# I X disables hardware write protection for the top block, though register-
based protection still applies. The status of TBL# does not affect the
status of block-locking registers.
A/A Mux = A4
Write Protect. When low, prevents programming or block erase to

all but the highest addressable block (0-6 in a 4-Mbit, 0-14 in an 8-
Mbit component), regardless of the state of the corresponding lock
WP# I X registers. WP#-high disables hardware write protection for these
blocks, though register-based protection still applies. The status of
TBL# does not affect the status of block-locking registers.
A/A Mux = A5
Low-Order Address Inputs. Inputs for low-order addresses during

read and write operations. Addresses are internally latched during a
A[0:10] I X
write cycle. For the A/A Mux interface, these addresses are latched
by R/C# and share the same pins as the high-order address inputs.
Data Input/Outputs. These pins receive data and commands during

CUI write cycles and transmit data during memory array, status
DQ[0:7] I/O X register, and identifier code read cycles. Data pins float to high
impedance when outputs are disabled. Data is internally latched
during a write cycle.
OE# I X Output Enable. Gates the device’s outputs during a read cycle
Row-Column Address Select. For the A/A Mux interface, this pin
R/C# I X determines whether the address pins are pointing to the row
addresses (A[0:10]) or the column addresses (A[11:19]).
Write Enable. Controls writes to the CUI and array blocks.

WE# I X Addresses and data are latched on the rising edge of the WE#
pulse.
Datasheet 15
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Intel A/A Mux

FWH
Block Erase/Program Power Supply. For erasing array blocks or

programming data. VPP = 3.3 V or 12 V VPP. With VPP ≤ VPPLK,
memory contents cannot be altered. Attempting a block erase or
VPP PWR X X
program with an invalid VPP (see DC Characteristics) will produce
spurious results and should not be attempted. VPP may only be held
at 12 V for 80 hours over the lifetime of the device.
Device Power Supply. Internal detection automatically configures

the device for optimized read performance. Do not float any power
pins. With VCC ≤ VLKO, all attempts to write to flash memory are
VCC PWR X X
inhibited. Device operations at invalid VCC voltages (see DC
Characteristics) produce spurious results and should not be
attempted.
GND PWR X X Ground. Do not float any ground pins.
Analog Power Supply. This supply should share the same system
VCCa PWR X X
supply as VCC.
GNDa PWR X X Analog Ground. Should be tied to same plane as GND.
Reserved For Future Use. These pins are reserved for future
generations of this product. They may be left disconnected or driven.
RFU X If they are driven, the voltage levels should satisfy VIH and VIL
requirements.
A/A Mux = DQ[7:4]
No Connect. Pin may be driven or floated. If it is driven, the voltage

NC X X levels should satisfy VIH and VIL. No connects appear only on the
40ld TSOP package.
Ready/Busy. Valid only in A/A Mux Mode. This output pin is a

Ry/By# 0 X reflection of bit 7 in the Status Register. This pin is used to
determine block erase or program completion.
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3. Interface Operation Description
3.1. Read
Memory information, identifier codes, GPI registers or the status register can be read, regardless of the
VPP voltage. Commands using the read mode include: reading memory from the array, reading the
identifier codes, reading the status register, reading the lock bit registers, reading the random number
generator, reading the GPI registers, and reading the RNG status register. Upon initial device power-up
or after exit from reset, the device automatically resets to read array mode.
3.2. Write
Writes to the memory array’s CUI are initiating by issuing a write through the Intel FWH interface. (See
the following information on timing and Intel FWH cycle write protocol specifics.) The CUI does not
occupy a single, specific memory location—any valid address may be given. However, certain
commands, such as block erase, require the address be within the range of the desired address block.
3.3. Output Disable

When the Intel FWH is not selected through a FWH read or write cycle, the Intel FWH interface outputs
(FWH[3:0]) are disabled and is placed in a high-impedance state.
3.4. Reset
RST# or INIT# at VIL initiates a device reset. In the read mode, RST# or INIT# low deselects the
memory, places output drivers in a high-impedance state, and turns off all internal circuits. RST# or
INIT# must be held low for time tPLPH (A/A Mux and FWH operation). The Intel FWH resets to read
array mode upon return from reset, and all blocks are set to default (locked) status (see 4.9.1), regardless
of their locked state prior to reset.
During block erase or program, driving RST# or INIT# low will abort the operation underway, in
addition to causing a reset latency. Memory contents being altered are no longer valid, since the data may
be partially erased or programmed.
It is important to assert RST# or INIT# during system reset. When the system comes out of reset, it will
expect to read from the memory array of the device. If a system reset occurs with no FWH reset—this is
hardware dependent—it is possible that proper processor initialization will not occur. (The Intel FWH
memory may be providing status information instead of memory array data.)
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3.5. Operational Effects of Hardware Write-Protect Pins

TBL# and WP#
The TBL# and WP# pins on the Intel FWH provide hardware write protect capabilities. The Top Block
Lock (TBL#) pin, when held low (active), prevents program or block erase operations in the top-most
block of the device where critical code can be stored. When TBL# is high, hardware write protection of
the top block is disabled. The Write Protect (WP#) pin has a function similar to TBL#, but affects all
remaining blocks. WP# operates independently from TBL# and does not affect the lock status of the top
block.
The TBL# and WP# pins must be set to the desired protection state prior to starting a program or erase
operation, since they are sampled at the beginning of the operation. Changing the state of TBL# or WP#
during a program or erase operation may cause unpredictable results.
If the state of TBL# or WP# changes during a program suspend or erase suspend state, the changes to the
device’s locking status do not take place immediately. The suspended operation may be resumed to
successfully complete the program or erase operation. The new lock status will take place after the
program or erase operation completes.
These pins function in combination with the register-based block locking described in Section 4.9. When
active, these pins write-protect the appropriate block(s), regardless of the associated block-locking
registers. (For example, when TBL# is active, writing to the top block is prevented, regardless of the
state of the write-lock bit for the top block’s locking register. In such a case, clearing the write-protect bit
in the register will have no functional effect, even though the register may indicate that the block is no
longer locked. The register may still be set to read-lock the block, if desired.) See Section 4.9 for further
information.
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4. Functional Descriptions
When the VPP voltage ≤ VPPLK, read operations from the status register, identifier codes or memory are
enabled, but programming and erase functions are disabled. Placing VPPH1/2 on VPP enables successful
block erase and program operations.
Table 2. Command Definitions
Command Bus Cycles Notes First Bus Cycle Second Bus Cycle
Required
Oper. Addr.(1) Data(2) Oper. Addr.(1) Data(2)
Read Array/Reset 1 Write X FFh
Read Identifier Codes ≥2 2 Write X 90h Read IA ID
Read Status Register 2 Write X 70h Read X SRD
Clear Status Register 1 Write X 50h
Block Erase 2 3 Write BA 20h Write BA D0h
Program 2 3,4 Write WA 40h Write WA WD

or
10h
Block Erase and Program 1 3 Write X B0h

Suspend
Block Erase and Program 1 3 Write X D0h

Resume
Note:
1. Key:
X = Any valid address within the device
IA = Identifier Code Address
BA = Address within the block being erased
WA = Address of memory location to be written
SRD = Data read from status register.
WD = Data to be written at location WA
ID = Data read from identifier codes
2. Following the Read Identifier Codes command, read operations access manufacturer and device.
See Table 4 for the read identifier code data.
3. The block must not be write locked when attempting block erase or program operations. Attempts
to issue a block erase or program to a write-locked block will fail.
4. Either 40h or 10h are recognized by the WSM as the program setup.
Note: Commands other than those shown previously are reserved by Intel for future device implementations
and should not be used.
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Table 3. Status Register Definition
7 6 5 4 3 2 1 0
WSMS ESS ES PS VPPS PSS DPS R
Bit Description
7 Write State Machine Status (SR.7). Check SR.7 to determine block erase or program completion.
SR.6–0 are invalid while SR.7 = 0.
1 = Ready
0 = Busy
6 Erase Suspend Status (SR.6).

1 = Block erase suspended
0 = Block erase in progress/completed
5 Erase Status (SR.5). If both SR.5 and SR.4 are 1s after a block erase attempt, an improper command
sequence was entered.
1 = Error in block erasure
0 = Successful block erase
4 Program Status (SR.4).

1 = Error in program
0 = Successful program
3 VPP Status (SR.3). SR.3 does not provide a continuous indication of VPP level. The WSM interrogates
and indicates the VPP level only after a block erase or program operation. SR.3 is not guaranteed to
reports accurate feedback only when VPP ≠ VPPH1/2.
1 = VPP low detect, operation abort
0 = VPP OK
2 Program Suspend Status (SR.2).

1 = Program suspended
0 = Program in progress/completed
1 Device Protect Status (SR.1). SR.1 does not provide a continuous indication of write-lock bit, TBL# pin
or WP# pin values. The WSM interrogates the write-lock bit, TBL# pin or WP# pin only after a block
erase or program operation. Depending on the attempted operation, it informs the system whether or not
the selected block is locked.
1 = Write-lock bit, TBL# pin, or WP# pin Detected, operation abort
0 = Unlock
0 Reserved for future enhancements (SR.0). SR.0 is reserved for future use and should be masked out
when polling the status register.
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4.1. Read Array Command

Upon initial device power-up and after exit from reset, the device defaults to the read array mode. This
operation can also be initiated by writing the Read Array command. The device remains available for
array reads until another command is written. Once the internal write state machine (WSM) has started a
block erase or program, the device will not recognize the Read Array command until the operation is
completed, unless the operation is suspended via an Erase Suspend or Program Suspend command. The
Read Array command functions independently of the VPP voltage.
4.2. Read Identifier Codes Command

The identifier code operation is initiated by writing the Read Identifier Codes command. Following the
write of the command, the device will read back the (manufacturer and device) ID data from the
addresses shown in the following table. To terminate the read identifier code operation, write another
valid command to the Intel FWH. The Read Identifier Codes command functions independently of the
VPP voltage.
Table 4. Identifier Codes
Code Address Data
Manufacturer code 000000 89
Device code 4 Mbit 000001 AD
Device code 8 Mbit 000001 AC
4.3. Read Status Register Command

The status register may be read to determine when a block erase or program completes, and whether the
operation completed successfully. The status register may be read at any time by writing the Read Status
Register command. After writing this command, all subsequent read operations will return data from the
status register until another valid command is written. The Read Status Register command functions
independently of the VPP voltage.
4.4. Clear Status Register Command

Error flags in the status register can only be set to 1s by the WSM and can only be reset by the Clear
Status Register command. These bits indicate various conditions that may cause failure. The Clear Status
Register command functions independently of the applied VPP voltage.
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4.5. Block Erase Command

The erase command operates on one block at a time. This command requires an (arbitrary) address
within the block to be erased. Recall that erasure changes all block data to FFh. Block preconditioning,
erase, and erase verify are handled internally by the WSM, which is transparent to the system. After
issuing the erase command, the device automatically outputs status register data when read. When the
block erase completes, the status register may be checked. If the FWH detects a block erase error, the
status register should be cleared before system software attempts corrective actions. After a block erase,
the CUI remains in read status register mode until a new command is issued.
Successful block erasure requires that the corresponding block’s write-lock-bit is cleared, and the
corresponding write-protect pin (TBL# or WP#) is inactive. If a block erase is attempted when the block
is locked, the block erase will fail, with the reason for failure in the status register.
Successful block erase only occurs when VPP = VPPH1 or VPPH2. If the erase operation is attempted at
VPP ≠ VPPH1 or VPPH2, erratic results may occur.
4.6. Program Command

Program command operates on one byte at a time. This command specifies the address and data to be
programmed. After the CUI receives the command, the WSM takes over, controlling the program and
verify algorithms internally. After the program command is written, the device automatically outputs the
status register data when read. When programming is complete, the status register may be checked. If a
program error is detected, the status register should be cleared before corrective action is taken by the
software. The internal WSM verification error checking only detects 1s that does not successfully
program to 0s. The CUI remains in read status register mode until it receives another command.
Reliable programming only occurs when VPP = VPPH1 or VPPH2. If programming is attempted at
VPP ≠ VPPH1 or VPPH2, erratic results may occur.
Successful program operation also requires that the corresponding block’s write-lock bit be cleared and
that the corresponding write-protect pin (TBL# or WP#) be inactive. If program operation is attempted
when the block is locked, the operation will fail.
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4.7. Block Erase Suspend Command

The Block Erase Suspend command allows block-erase interruption to read or program data in another
block of memory. Once the block erase process starts, writing the Block Erase Suspend command
requests that the WSM suspend the block erase sequence at a predetermined point in the algorithm. The
device outputs status register data when read after the Block Erase Suspend command is written. Polling
the status register can help determine when the block erase operation was suspended.
After a successful suspend, a Read Array command may be written to read data from a block other than
the suspended block. A Program command sequence may also be issued during erase suspend to program
data in blocks other that the block currently in the erase suspend mode.
The other valid commands while block erase is suspended include Read Status Register and Block Erase
Resume. After a Block Erase Resume command is written, the WSM will continue the block erase
process. VPP must remain at VPPH1/2 (the same VPP level initially used for the block erase) while block
erase is suspended. RST# or INIT# must also remain at VIH. Block erase cannot resume until program
operations initiated during block erase suspend have completed.
4.8. Program Suspend Comand

The Program Suspend command allows program interruption to read data in other memory locations.
Once the program process starts, writing the Program Suspend command requests that the WSM suspend
the program sequence at a predetermined point in the algorithm. The device continues to output status
register data when read after the Program Suspend command is written. Polling status register bits will
help determine when the program operation was suspended.
After a successful suspend, a Read Array command can be written to read data from locations other than
that which is suspended. The only other valid commands while program is suspended are Read Status
Register and Program Resume. After Program Resume command is written, the WSM will continue the
programming process. VPP must remain at VPPH1/2 (the same VPP level used for program) while in program
suspend mode. RST# or INIT# must also remain at VIH.
4.9. Register Based Locking, General-Purpose Input, and

Random Number Generator Registers
A series of registers are available in the Intel FWH to provide software read- and write-locking and GPI
feedback. Also available are the set of control registers for controlling and gathering random numbers.
These registers are accessible through standard addressable memory space (see the following table).
It is recommended that the GPI pins be in the desired state before FWH4 is brought low for the
beginning of the next bus cycle, and remain in that state until the end of the read.
Datasheet 23
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Table 5. Intel Firmware Hub Register Configuration Map
Memory Mnemonic Register Name Default Type

Address
FFBF0002h T_BLOCK_LK Top Block Lock Register (4-8-Mbit FWH) 01h R/W
FFBE0002h T_MINUS01_LK Top Block [-1] Lock Register (4-8-Mbit FWH) 01h R/W
FFBD0002h T_MINUS02_LK Top Block [-2] Lock Register (4-8-Mbit FWH) 01h R/W
FFBC0002h T_MINUS03_LK Top Block [-3] Lock Register (4-8-Mbit FWH) 01h R/W
FFBB0002h T_MINUS04_LK Top Block [-4] Lock Register (4-8-Mbit FWH) 01h R/W
FFBA0002h T_MINUS05_LK Top Block [-5] Lock Register (4-8-Mbit FWH) 01h R/W
FFB90002h T_MINUS06_LK Top Block [-6] Lock Register (4-8-Mbit FWH) 01h R/W
FFB80002h T_MINUS07_LK Top Block [-7] Lock Register (4-8-Mbit FWH) 01h R/W
FFB70002h T_MINUS08_LK Top Block [-8] Lock Register (8-Mbit FWH) 01h R/W
FFBC0100h FGPI_REG FWH General-Purpose Input Register N/A RO
FFBC015Fh RNG Hardware Status Register 40h* R/W
FFBC0160h RNG Data Status Register 0 RO
FFBC0161h RNG Data Register N/A RO
* Assumes RNG is present and not disabled.
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4.9.1. T_BLOCK_LK and T_MINUSxx_LK — Block-Locking Registers

Memory Address: FFBx0002h (x = F-0h)
Default Value: 01h
Access: R/W
Size: 8 bits (each)
Bit Function
7:3 Reserved
Read-Lock
2 1 = Prevents read operations in the block where set.
0 = Normal operation for reads in the block where clear. This is the default state.
Lock-Down
1 = Prevents further set or clear operations to the Write Lock and Read Lock bits. Lock-Down only can
be set, but not cleared. The block will remain locked-down until reset (with RST# or INIT#), or until
1
the device is power-cycled.
0 = Normal operation for Write Lock and Read Lock bit altering in the block where clear. This is the
default state.
Write-Lock
0 1 = Prevents program or erase operations in the block where set. This is the default state.
0 = Normal operation for programming and erase in the block where clear.
Table 6. Register-Based Locking Value Definitions
Data Reserved Read Lock, Lock-Down, Write Lock, Resulting block state (1).
Data 7:3 Data 2 Data 1 Data 0
00h 00000 0 0 0 Full access
01h 00000 0 0 1 Write locked. Default state at power-

up
02h 00000 0 1 0 Locked open (full access locked down).
03h 00000 0 1 1 Write-locked down.
04h 00000 1 0 0 Read locked.
05h 00000 1 0 1 Read and write locked.
06h 00000 1 1 0 Read-locked down.
07h 00000 1 1 1 Read- and write-locked down.
Note: The write-lock bit must be set to the desired protection state prior to starting a program or erase
operation, since it is sampled at the beginning of the operation. Changing the state of the write-lock bit
during a program or erase operation may cause unpredictable results. If the state of the write-lock bit
changes during a program suspend or erase suspend state, changes in the block’s locking status do not
occur immediately. The suspended operation may be resumed successfully. The new lock status will take
place after the program or erase operation completes. The individual bit functions are described in the
following sections.
Datasheet 25
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Write Lock
The default write status of all blocks upon power-up is write-locked. Any program or erase operations
attempted on a locked block will return an error in the status register (indicating block lock). The status
of the locked block can be changed to unlocked by clearing the write-lock bit, provided the lock-down
bit also is not set. The current write-lock status of a particular block can be determined by reading the
corresponding write-lock bit. The write-lock functions in conjunction with the hardware write-lock pins,
TBL# and WP#. When active, these pins take precedence over the register locking function and write-
lock the top block or remaining blocks, respectively. Reading this register will not read the state of the
TBL# or WP# pin.
Read Lock
The default read status of all blocks upon power-up is read-unlocked. When a block’s read-lock bit is set,
data cannot be read from that block. An attempted read from a read-locked block will result in the data
00h. (Note that failure is not reflected in the status register.) The read-lock status can be unlocked by
clearing the read-lock bit, provided the lock-down bit has not been set. The current read-lock status of a
particular block can be determined by reading the corresponding read-lock bit.
Lock-Down
In the Intel FWH interface mode, the default lock-down status of all blocks upon power-up is not-locked-
down. The lock-down bit for any block may be set, but only once, because future attempts to change that
block-locking register will be ignored. The lock-down bit is cleared only upon a device reset with RST#
or INIT#. The current lock-down status of a particular block can be determined by reading the
corresponding lock-down bit. Once a block’s lock-down bit is set, the read- and write-lock bits for that
block can no longer be modified, and the block is locked-down in its current state of read and write
accessibility.
4.9.2. General-Purpose Input Register

This register reads the status of the FGPI [4:0] pins on the Intel FWH. Since this is a pass-through
register, there is no default value, only the state of the pins at power-up.
4.9.2.1. GPI_REG — General-Purpose Input Register

Memory Address: FFBC0100h
Default Value: N/A
Access: R0
Size: 8 bits
Bit Function
7:5 Reserved
4 FGPI[4]. Reads status of general-purpose input pin (PLCC-30/TSOP-7).
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4.9.3. Random Number Generator Registers

When enabled and active, the Random Number Generator (RNG) is designed to fill an 8-bit register, a
bit at a time, with hardware-generated random numbers. When this register is full, a flag bit in the RNG
data status register transitions to a 1, indicating that a valid random number is ready to be read. This bit
will immediately reset to 0 upon reading the RNG data register.
The advantages of random numbers over pseudo-random numbers as well as a brief overview of the
simple mathematics of testing RNGs are discussed superficially in the companion document, The Intel®
Platform RNG Tech Brief, which is available online.
4.9.3.1. RNG Hardware Status Register

Memory Address: FFBC015Fh
Default Value: 40h, for typical component out of reset
Access: RO
Size: 8 bits
Bit Function
7 Reserved
6 RNG Present—RO. Determines whether or not an RNG is present on this component, or if it has been
disabled.
1 = RNG Present
0 = RNG not present
5:1 Reserved
0 RNG Enabled—R/W. Determines whether the RNG is generating a random number.

1 = RNG enabled
0 = RNG disabled
4.9.3.2. RNG Data Status Register

Default Value: 00h
Access: RO
Size: 8 bits
Bit Function
7:1 Reserved
0 RNG Output Valid. Determines whether the RNG data register contains a valid random number.
1 = RNG data register contians valid random data
0 = RNG data register contents not valid
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4.9.3.3. RNG Data Register

Default Value: 40h, for typical component out of reset
Access: RO
Size: 8 bits
Bit Function
7:0 RNG Output: (Should only be used if RNG Data Status Register indicates valid output.)
4.10. Using the Random Number Generator

The Intel Firmware Hub integrates a Random Number Generator that utilizes thermal noise generated as
a result of the inherently random quantum mechanical properties of silicon, in order to modulate a proven
hardware RNG design. Internal circuitry is included to enhance the entropy of the output. Since the
output of the RNG is non-deterministic, it is an excellent choice for cryptography applications, but it also
is a convenient source of random numbers for mathematics, modeling, graphics algorithms, artificial
intelligence, entertainment, and many other applications. The fact that it is a component of the platform
and may be utilized remotely on a locked-away server makes it an ideal (and much more reliable) source
of entropy for applications that, in the past, have relied exclusively on a key press or other environmental
input. Several Intel Firmware Hub components may be used in tandem (see the following section) when
additional RNG bandwidth is required. When not generating new random bits, the RNG circuitry will
enter a low power state.
4.11. Detecting and Initializing the RNG Device

Before any process attempts to read random data directly from the Intel Firmware Hub RNG device, it
should execute a process to verify that a supported RNG device is available for use, enable the device,
and verify the correct functionality. This initialization process is described in a following subsection.
4.11.1. Detecting the RNG Device

The Manufacturer Code and Hardware Status registers are used to determine whether a supported RNG
device is available on the system.
Step 1: From the system BIOS or using the Read Identifier Codes command, as specified in the
Intel® 82802AB/82802AC Firmware Hub (FWH) datasheet, verify the Intel® 82802
manufacturer code.
Step 2: If a valid Intel® 82802 FWH is found, then the RNG Present bit (bit 6) of the Hardware
Status register should be checked in order to verify that an RNG device is available.
Note: There is a chance that, even if no RNG device is present, the physical memory locations described above
may coincidentally match the values expected for an RNG device. For this reason, before random data is
sent to an application, the device should be exercised to verify that it is indeed an RNG. This can be
accomplished by enabling the device and running an initial test (e.g., FIPS (Federal Information
Processing Standard) 140-1) before use.
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4.11.2. Initializing the RNG Device

Once the RNG device is detected, it must be enabled and should be tested before use.
Step 1: The RNG Enabled bit (bit 0) of the Hardware Status register must be set to enable the
RNG device.
Step 2: Once the RNG is enabled, an initial read of the RNG Data register should be made to
clear any preexisting data from the register.
Step 3: A test (e.g., FIPS 140-1) should be run on the RNG Device. This test will ensure that
there was no error in detecting the device and that the device is functioning properly.
4.11.3. Selecting Appropriate FWH IDs and Densities

It is possible, using different ID strapping, to use multiple FWH components in a system. While the
FWH protocol supports up to 16 FWH devices, the BIOS support, bus loading or the attaching bridge
may limit this number. Note that, regardless of the number of FWH components, the maximum
“window” of the FWH array visible at one time is 4 MB (for Intel® ICH1) and 8MB for Intel® ICH2. The
boot device must have an ID (as determined by ID [0:3]) of 0. For clarity, it is advisable that subsequent
devices use incremental numbering.
The most straightforward method of using multiple FWH components is to use devices of equal density.
This is the recommended technique.
In special applications, when it is desirable to use multiple FWH components of different densities—if
multiple RNGs or more GPIs are required, for instance, without the need for greater array space—IDs
must be chosen such that component memory array spaces do not cross the boundaries delimited by the
highest-capacity device, as illustrated in the following table.
For example, in a design with 8- and 4-Mbit components, the 8-Mbit part must either be first or must be
after enough 4-Mbit parts to add up to a multiple of 8 Mbits.
Yes No Yes
8 Mbits 4 Mbits 4 Mbits
8 Mbits 4 Mbits
4 Mbits 8 Mbits
Biggest is 8 Mbits.
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4.11.4. Mapping FWH Devices onto Memory Map

There is 4 MB of available memory space devoted to the FWH. Therefore, the Intel ICH has the ability
to select which FWH device maps into each region of the system address space.
In the existing Intel ICH, the address map is broken up into eight 512-KB segments. The BIOS Select
Register in the Intel ICH is a 32-bit register that contains the needed mapping information, thereby
determining which FWH receives requests from which portion of the address map. For example, in a
system with four 8-Mbit devices, this register would be 00112233h, which is the default power-up state
for this register. In a system with eight 4-Mbit devices, the register must be changed to 01234567h.
Note: The FWH indicated in the most-significant nibble of the register may be shadowed elsewhere in the
system memory map. The FWH with ID 0 may not be re-mapped.
4.11.5. Paging FWH Devices for Greater Than 4 MB of FWH Memory

In certain applications, even a 4-MB window of flash memory is inadequate. It is possible to exceed this
amount by using a paging scheme. Individual FWH devices may then be “swapped” in and out of system
memory space. This must be implemented at the BIOS level, to permit modification of the Intel ICH
BIOS Select Register. A number of paging algorithms may be used successfully with the FWH memory
space, using the Intel ICH BIOS Select Register. This register, then, determines which FWH device gets
mapped into each 512 KB “slice” of the system memory map. The 0th FWH (ID=0) may not be
remapped. Reference the Intel® 82801AA (ICH) and Intel® 82801AB (ICH0) I/O Controller Hub
Datasheet (order number: 290655) for information regarding these components and the BIOS Select
Register.
Note: The paging of FWH devices will also “page” features, potentially affecting the visibility or location of
the FGPI register (see Section 4.9.2.1) or of an active/ready RNG. When a paging scheme is used, it is
recommended that critical FPGIs be used only on the ID 0 FWH device, which must remain mapped at
the top of memory. Ideally, the RNG driver in a system with more than four FWHs should verify the
mapping of FWHs in order to keep track of which RNGs are active and which are present in the memory
map. There is no convenient way, aside from checking the select register, to determine which IDed FWH
is in which location in the memory map.
4.11.6. Programming Multiple FWH Devices

Special considerations must be taken into account when programming multiple FWH devices in-system.
Since there is no ID support in the A/A Mux mode, the recommended means of programming multiple
devices is either out-of-system programming with standalone PROM programmers or in-system
programming using the FWH mode. In cases where programming time is critical or ATE programming is
required, provisions should be made to isolate the component from its neighboring devices during A/A
Mux programming, or the other devices should be held in a reset (or otherwise disabled) state until
programming of the intended device is complete. Do not switch one component into the A/A Mux mode,
thereby leaving the others in the FWH mode.
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4.12. CUI Automation Flowcharts

Figure 6. Automated Block Erase Flowchart
Start Bus
Command Comments
Operation
Write Erase Setup Data = 20h

Write 20h,
Addr = Within Block to Be Erased
Block Address
Write Erase Data = D0h

Confirm Addr = Within Block to Be Erased
Write D0h,
Block Address
Read Status Register Data

Read Status
Register
Standby Check SR.7

1 = WSM Ready
0 0 = WSM Busy
SR.7 =
Repeat for subsequent block erasures.
Full status check can be done after each block erase, or after a
1
sequence of block erasures.
Full Status Write FFh after the last operation to place device in read array mode.
Check if Desired
Block Erase
Complete
Full Status Check Procedure
Read Status Register Bus

Command Comments
Data (See Above) Operation
Standby Check SR.3

1 = VPP Error Detect
1
SR.3 = VPP Range Error
Check SR.4,5
Standby
Both 1 = Command Sequence Error
Check SR.5
1 Standby
Command Sequence 1 = Block Erase Error
SR.4,5 = Error
0 SR.5, SR.4, and SR.3 are only cleared by the Clear Status
Register command in cases where multiple blocks are erased
before full status is checked.
1 Block Erase If error is detected, clear the Status Register before attempting
SR.5 = retry or other error recovery.
Error
Block Erase
Successful
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5. Electrical Specifications
5.1. Absolute Maximum Ratings
Case temperature under bias:......................... –10 °C to +85 °C *WARNING: Stressing the device
beyond the “Absolute Maximum
Storage temperature: ................................... –65 °C to +125 °C Ratings” may cause permanent
damage. These are stress ratings
Supply voltage with respect to VSS ..................-0.2 V to 4.1 V only. Operation beyond the
“Operating Conditions” is not
Voltage On Any Pin (except VPP):–0.5 V to +VCC + 0.5 V(1,2,5)
recommended and extended exposure
VPP voltage: ........................................... –0.5 V to +14.0 V(1,2,4) beyond the “Operating Conditions”
may affect device reliability.
Output short-circuit current: ...................................... 100 mA(3)
Note:
1. All specified voltages are with respect to GND. The minimum DC voltage on the VPP pin is –0.5 V.
During transitions, this level may undershoot to –2.0 V for periods of <20 ns. During transitions,
this level may overshoot to VCC + 2.0 V for periods of <20 ns.
2. The maximum DC voltage on VPP may overshoot to +14.0 V for periods of <20 ns.
3. Output shorted for no more than one second. No more than one output is shorted at a time. This
note applies only to non-PCI outputs.
4. Connection to supply of VHH is allowed for a maximum cumulative period of 80 hours.
5. Do not violate processor or chipset limitations on the INIT# pin.
5.2. Operating Conditions

Table 7. Temperature and VCC
Symbol Parameter Notes Min. Max. Unit Test Condition
TC Operating temperature 1 0 +85 °C Case temperature
VCC VCC supply voltage (3.3 V ± 0.3 V) 3.0 3.6 V
Note:
1. This temperature requirement differs from the normal commercial operating condition of flash
memories.
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5.2.1. Interface DC Input/Output Specifications

Table 8. Intel FWH Interface DC Input/Output Specifications
Symbol Parameter Conditions Min. Max. Units Notes
VIH Input high voltage 0.5 VCC VCC +0.5 V 3
VIH (INIT#) INIT# input high voltage 1.35 VCC +0.5 V 5
VIL Input low voltage -0.5 0.3 VCC V 3
IIL Input leakage current 0 < Vin < VCC ±10 µA 1,4
VOH Output high voltage Iout = -500 µA 0.9 VCC V
VOL Output low voltage Iout = 1500 µA 0.1 VCC V
CIN Input pin capacitance 13 pF
CCLK CLK pin capacitance 3 12 pF
Lpin Recommended pin 20 nH 2

inductance
Note:
1. Input leakage currents include hi-Z output leakage for all bi-directional buffers with tri-state
outputs.
2. Refer to PCI spec.
3. Inputs are not “5 volt safe.”
4. IIL may be changed on IC and ID pins (up to 200µ µA), if pulled against internal pull-downs. Refer
to the pin descriptions (Table 1).
5. Do not violate processor or chipset specifications regarding the INIT# pin voltage.
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Table 9. Power Supply Specifications — All Interfaces
Symbol Parameter Conditions Min. Max. Units Notes
VPPH1 VPP voltage 3.0 3.6 V
VPPH2 VPP voltage 11.4 12.6 V
VPPLK VPP lockout voltage 1.5 V
VLKO VCC lockout voltage 1.5 V
ICCSL1 VCC stand-by current Voltage range of all inputs is 100 µA 2,3,4
VIH to VIL, FWH4 = VIH,
(FWH interface)
VCC = 3.6 V,
CLK f = 33 MHz
No internal operations in
progress.
ICCSL2 VCC stand-by current FWH4 = VIL 10 mA 2,3,4

(FWH interface) VCC = 3.6 V,
CLK f = 33 MHz
No internal operations in
progress.
ICCA VCC active current VCC = VCC Max, 67 mA 2,3,5

CLK f = 33 MHz
Any internal operation in
progress,
IOUT = 0mA
IPPR VPP read current VPP ≥ VCC 200 µA 2
IPPWE VPP program or VPP = 3.0-3.6 V 40 mA 2
erase current VPP = 11.4-12.6 V 15 mA 2
Note:
1. All currents are RMS, unless otherwise noted. These currents are valid for all packages.
2. VPP = VCC
3. VIH = 0.9 VCC , VIL = 0.1 VCC per the PCI output VOH and VOL specifications of Table 8.
4. This number is the worst case of IPP + ICC memory core + ICC FWH interface.
Datasheet 35
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5.2.2. Interface AC Input/Output Specifications

Table 10. Intel FWH Interface AC Input/Output Specifications
Symbol Parameter Condition Min. Max. Units Notes
Ioh(AC) Switching 0 < VOUT ≤ 0.3 VCC -12 VCC mA

current High
0.3 VCC < VOUT < 0.9 VCC -17.1 (VCC -VOUT) mA
0.7 VCC < VOUT < VCC Equation C
(Test point) VOUT = 0.7 VCC -32 VCC mA
Iol(AC) Switching VCC > VOUT ≥ 0.6 VCC 16 VCC mA

current Low
0.6 VCC > VOUT > 0.1 VCC -17.1 (VCC -VOUT) mA
0.18 VCC > VOUT > 0 Equation D
(Test point) VOUT = 0.18 VCC 38 VCC mA
Icl Low clamp -3 < VIN ≤ -1 -25 + (VIN+1) / 0.015 mA

current
Ich High clamp VCC +4 > VIN ≥ VCC+1 25 + (VIN-VCC-1) / mA

current 0.015
slewr Output rise 0.2 VCC - 0.6 VCC load 1 4 V/ns 1

slew rate
slewf Output fall 0.6 VCC - 0.2 VCC load 1 4 V/ns 1

slew rate
Note:
1. PCI specification output load is used.
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5.2.3. Intel FWH Interface AC Timing Specifications
5.2.3.1. Clock Specification

Table 11. Clock Specification
Symbol Parameter Condition Min. Max. Units Notes
tcyc CLK cycle time 30 ∞ ns 1
thigh CLK high time 11 ns
tlow CLK low time 11 ns
- CLK slew rate Peak-to-peak 1 4 V/ns
- RST# or INIT# slew rate 50 mV/ns 2
Note:
1. PCI components must work with any clock frequency between nominal DC and 33 MHz.
Frequencies less than 16 MHz may be guaranteed by design rather than testing. Refer to the PCI
specificaiton.
2. Applies only to the rising edge of the signal. See Chapter 4 of the PCI electrical specification.
Figure 7. Clock Waveform
T_cyc
T_high
T_low
0.6 Vcc
0.5 Vcc
0.4 Vcc 0.4 Vcc, p-to-p

(minimum)
0.3 Vcc
0.2 Vcc
Datasheet 37
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5.2.3.2. Signal Timing Parameters

Table 12. Signal Timing Parameters
Symbol PCI Parameter Condition Min. Max. Units Notes

Symbol
TCHQV tval CLK to data out 2 11 ns 1

TCHQX ton CLK to active (float to active delay) 2 ns 2
TCHQZ toff CLK to inactive (active to float delay) 28 ns 2
TAVCH tsu Input setup time 7 ns 3
TDVCH
TCHAX th Input hold time 0 ns 3
TCHDX
TVSPL trst Reset active time after power stable 1 ms
TCSPL trst-clk Reset active time after CLK stable 100 µs
TPLQZ trst-off Reset active to output float delay 48 ns 2
Note:
1. Minimum and maximum times have different loads. See PCI spec.
2. For purposes of active/float timing measurements, the Hi-Z or Off state is defined as that in which
the total current delivered through the component pin is less than or equal to the leakage current
specification.
3. This parameter applies to any input type (excluding CLK).
Figure 8. Output Timing Parameters
V_th
CLK
V_test
V_tl
T_val
FWH[3:0]
(Valid Output Data)
FWH[3:0]
(Float Output Data)
T_on
T_off
38 Datasheet
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Figure 9. Input Timing Parameters
V_th
CLK
V_test
V_tl
T_su
T_h
FWH[3:0]
Inputs V_max
(Valid Input Data) Valid
Table 13. Interface Measurement Condition Parameters
Symbol Value Units Notes
Vth 0.6 VCC V 1
Vtl 0.2 VCC 1
Vtest 0.4 VCC
Vmax 0.4 VCC 1
Input signal 1 V/ns

edge rate
Note:
1. The input test environment uses 0.1 VCC of overdrive over VIH and VIL. Timing parameters must
be met with no more overdrive than this. Vmax specifies the maximum peak-to-peak waveform
allowed for measuring the input timing. Production testing may use different voltage values, but
must correlate results back to these parameters.
Reset Operations
VIH
RST# (P)
V
IL
P1
Table 14. AC Waveform for Reset Operation
# Symbol Parameter Min. Max. Unit Notes
P1(1) tPLPH RST# or INIT# pulse low time (If RST# or INIT# is tied 100 ns 1
to VCC, this specification is not applicable.)
Note:
1. There will be a 20-µs reset latency if a reset procedure is performed during a programming or
erase operation.
Datasheet 39
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5.3. Block Programming Times

Table 15. Programming Times
3.3 V VPP 12 V VPP
Parameter Notes Typ.(1) Max. Typ.(1) Max. Unit
Byte program time 2 17 300 7.0 125 µs
Block program time 2 1.1 4.0 0.5 1.5 sec
Block erase time 2 0.8 6.0 0.3 4.0 sec
Note:
1. Typical values measured at TA = +25°C and nominal voltages.
2. Excludes system-level overhead.
5.4. Intel Firmware Hub Interface

The firmware hub relies on the Intel Firmware Hub interface to communicate with the outside world.
This interface consists of four bi-directional signals and one “control” input. The timing and electrical
parameters of the FWH interface are similar to those of the LPC interface, to provide compatibility
between the interfaces, but differ in cases mentioned earlier in this section (clock pin capacitance), as
well as in certain timing parameters. The Intel ICH has been engineered to accommodate both interfaces,
which allows the Intel FWH interface signals to be communicated over the same set of pins as LPC. The
Intel FWH interface is designed to use an LPC-compatible start cycle, with a reserved cycle type code.
This ensures that all LPC devices present on the shared interface will ignore cycles destined for the
FWH, without becoming “confused” by the different protocol.
This section contains timing and protocol information for the Intel FWH interface. Note that the Intel
FWH interface is a licensed interface, so the appropriate license must be obtained from Intel for
components supporting the Intel FWH interface (e.g., ASICs, PLDs).
5.4.1. Intel FWH Interface Cycles

When the Intel FWH interface is active, information is transferred to and from the FWH by a series of
“fields,” where each field contains 4 bits of data. Many fields are one clock cycle in length but can be of
variable length, depending upon the nature of the field. Field sequences and contents are strictly defined
for read and write operations. The following tables list the field sequences for read and write cycles.
Addresses in this section refer to addresses as seen from the FWH’s “point of view,” so some calculation
will be required to translate these to the actual locations in the memory map (and vice versa).
5.4.1.1. Read Cycle Sequence

The firmware hub supports single-byte or multibyte reads. The logic waveforms for these cycles are
shown in Table 16 and Figure 11
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Table 16. FWH Read Cycle
Clock Field Field Contents1 FWH[3:0] Comments

Cycle Name FWH[3:0] Direction
1 START 1101 IN FWH4 must be active (low) for the part to respond.
Only the last start field (before FWH4 transitioning high)
should be recognized. The START field contents
indicate an FWH memory read cycle.
2 IDSEL 0000 IN Indicates which FWH device should respond. If the
IDSEL (ID select) field matches the value ID[3:0], then
to
that particular device will respond to subsequent
1111 commands.
3-9 IMADDR YYYY IN These seven clock cycles make up the 28-bit memory
address. YYYY is one nibble of the entire address.
Addresses are transferred most-significant nibble first.
On multibyte data transfers, lower-order addresses will
be zero, depending on page size.
10 IMSIZE 0000 (1 byte) IN A field of this size indicates how many bytes will be
transferred during multibyte operations. The FWH will
only support single-byte transfers.
11 TAR0 1111 IN In this clock cycle, the master (Intel ICH) has driven the
then float bus to all 1s and then floats the bus, prior to the next
clock cycle. This is the first part of the bus “turnaround
cycle.”
12 TAR1 1111 (float) Float then The FWH takes control of the bus during this cycle.
OUT During the next clock cycle, it will be driving “sync
data.”
13-14 WSYNC 0101 (WAIT) OUT The FWH outputs the value 0101, a wait-sync
(WSYNC, a.k.a. “short-sync”), for two clock cycles. This
value indicates to the master (Intel ICH) that data is not
yet available from the part. This number of wait-syncs
is a function of the device’s access time.
15 RSYNC 0000 (READY) OUT During this clock cycle, the FWH will generate a “ready-
sync” (RSYNC) indicating that the least-significant
nibble of the least-significant byte will be available
during the next clock cycle.
16 DATA YYYY OUT YYYY is the least-significant nibble of the least-
significant data byte.
17 DATA YYYY OUT YYYY is the most-significant nibble of the least-
significant data byte.
17+ “DATA” 2 WSYNCS + OUT n = IMSIZE. Each subsequent byte of data requires 2
3 x 2n-1 + 1 RSYNC + wait-syncs + 1 ready-sync + 2 data nibbles.
2n 2 DATA The FWH supports only n=0000 (single-byte) reads.
Previous TAR0 1111 OUT In this clock cycle, the Inel FWH has driven the bus to
+1 then float all ones and then floats the bus prior to the next clock
cycle. This is the first part of the bus “turnaround cycle.”
Previous TAR1 1111 (float) Float then The master (Intel ICH) resumes control of the bus
+1 IN during this cycle.
Note:
1. Field contents are valid on the rising edge of the present clock cycle.
Datasheet 41
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5.4.1.2. Single-Byte Read Waveforms

Figure 10. FWH Single-Byte Read Waveforms
CLK
FWH4
FWH[3:0] STR IDS IMADDR IMS TAR SYNC(3) DATA TAR
5.4.1.3. Write Cycle Sequence

The firmware hub only supports single-byte writes. Each byte represents either the data to be written or a
valid flash command. Refer to the waveforms in Figure 11.
Table 17. FWH Write Cycle

1 START 1110 IN FWH4 must be active (low) for the part to respond.
Only the last start field (before FWH4 transitioning
high) should be recognized. The START field
contents indicate an FWH memory write cycle.
2 IDSEL 0000 IN Indicates which FWH device should respond. If the

to IDSEL (ID select) field matches the value ID[3:0],
1111 then that particular device will respond to subsequent
commands.
3-9 IMADDR YYYY IN These seven clock cycles make up the 28-bit
memory address. YYYY is one nibble of the entire
address. Addresses are transferred most-significant
nibble first.
10 IMSIZE 0000 (1 byte) IN This size field indicates how many bytes will be
transferred during read/write operations. The FWH
only supports single-byte writes.
11 DATA YYYY IN This field is the least-significant nibble of the data

byte. This data is either the data to be programmed
into the flash memory or any valid flash command.
12 DATA YYYY IN This field is the most-significant nibble of the data

byte.
13 TAR0 1111 IN In this clock cycle, the master (Intel ICH) has driven
then float the bus to all 1s and then floats the bus prior to the
next clock cycle. This is the first part of the bus
“turnaround cycle.”
14 TAR1 1111 (float) Float then The FWH takes control of the bus during this cycle.
OUT During the next clock cycle it will be driving the “sync”
data.
15 RSYNC 0000 OUT The FWH outputs the values 0000, indicating that it
has received data or a flash command.
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16 TAR0 1111 OUT In this clock cycle, the FWH has driven the bus to all
then float 1s and then floats the bus prior to the next clock
cycle. This is the first part of the bus “turnaround
cycle.”
17 TAR1 1111 (float) Float then The master (Intel ICH) resumes control of the bus
IN during this cycle.
Note:
1. Field contents are valid on the rising edge of the present clock cycle.
5.4.1.4. Write Waveforms

Figure 11. Write Waveforms
CLK
FWH4
FWH[3:0] STR IDS IMADDR IMS DATA TAR SYN TAR

C
5.4.1.5. Response To Invalid Fields

During FWH operations, the Intel FWH will not explicitly indicate that it has received invalid field
sequences. The response to specific invalid fields or sequences is as follows:
• Address out of range: The Intel FWH address sequence is 7 fields long (28 bits), but only the last
five address fields (20 bits) will be decoded by an 8-Mbit FWH. (For a 4-Mbit density, the most-
significant bit (FWH3) in the third address field also will be ignored.) The Intel FWH will respond
to these lower addresses, regardless of the value of the more-significant address bits. Address A22
has the special function of directing reads and writes to the flash core (A22 = 1) or to the register
space (A22 = 0).
• Invalid IMSIZE field: If the Intel FWH receives an invalid size field during a read or write
operation, the internal state machine will reset and no operation will be attempted. The Intel FWH
will generate no response of any kind in this situation. Invalid-size fields for a read cycle are
anything but 0000. Invalid-size fields for a write cycle are anything but 0000. When accessing
register space, invalid field sizes are anything but 0000.
• Non-page-aligned address: The Intel FWH assumes that multibyte read addresses are page aligned
(i.e., for a 32-byte access, the lower 5 address bits will be zero). If they are not zero, the first byte
of data returned by the Intel FWH will correspond to that explicit address, and subsequent data will
be as if the first address was indeed page aligned.
Once valid START, IDSEL, and IMSIZE fields are received, the Intel FWH always will respond to
subsequent inputs as if they were valid. As long as the states of FWH [3:0] and FWH4 are known, the
response of the Intel FWH to signals received during the FWH cycle should be predictable. The Intel
FWH will make no attempt to check the validity of incoming flash operation commands.
Datasheet 43
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5.4.1.6. Abort Operations

FWH4 active (low) indicates either that a START cycle will eventually occur or that an abort is in
progress. In either case, if FWH4 is asserted, the Intel FWH will “immediately” tri-state its outputs and
the FWH state machine will reset.
During a write cycle, there is a possibility that an internal flash write or erase operation is in progress (or
has just been initiated). If FWH4 is asserted during this time frame, the internal operation will not abort.
The software must send an explicit flash command to terminate or suspend the operation.
The internal FWH state machine will not initiate a flash write or erase operation until it has received the
last data nibble from the chipset. This means that FWH4 can be asserted as late as this cycle (“cycle 12”)
and no internal flash operation will be attempted. However, since the Intel FWH will start “processing”
incoming data before it generates its SYNC field, it should be considered a non-buffered peripheral
device.
5.4.1.7. Intel FWH Cycle Timing Information

Refer to Figure Figure 12 and Figure 13.
Table 18. Signal Timing Parameters
Symbol “PCI Symbol” Parameter Condition Min. Max. Units Notes
TCHQV tval CLK to data out 2 11 ns 1
TCHQX ton CLK to active 2 ns 2

(float to active delay)
TCHQZ toff CLK to inactive 28 ns 2

(active to float delay)
TAVCH tsu Input setup time 7 ns 3

TDVCH
TCHAX th Input hold time 0 ns 3

TCHDX
TVSPL trst Reset active time after 1 ms

power stable
TCSPL trst-clk Reset active time after 100 µs

CLK stable
TPLQZ trst-off Reset active to output 48 ns 2

float delay
Note:
1. Minimum and maximum times have different loads. See the PCI specification.
2. For purposes of active/float timing measurements, the Hi-Z or “off” state is defined as the state
where the total current delivered through the component pin is less than or equal to the leakage
current specification.
3. This parameter applies to any input type (excluding CLK).
44 Datasheet
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5.5. RNG Parameters

Table 19. RNG Timing Characteristics
# Sym Parameter Notes Typ. Max. Unit
Write RE = 1 to DWord ready or read DWord to new DWord 1 450 1500 µs

ready
Average sustained throughput 1 13 50 µs/bit
Note:
1. Sampled, not 100% tested.
Table 20. RNG Statistical Characteristics
# Sym Parameter Notes Min. Typ. Max. Unit
B2 Fractional probability of excess 1s 1,2,3 ±316 10-6
AC Auto correlation coefficient 3 ± 632 10-6
FOM Figure of merit 3 7.5 17
Note:
1. Sampled, not 100% tested.
Figure 12. Intel FWH Output Timing Parameters
V_th
CLK
V_test
V_tl
T_val
FWH[3:0]
(Valid Output Data)
FWH[3:0]
(Float Output Data)
T_on
T_off
Datasheet 45
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Figure 13. Intel FWH Input Timing Parameters
V_th
CLK
V_test
V_tl
T_su
T_h
FWH[3:0]
Inputs V_max
(Valid Input Data) Valid
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6. PROM Programming Specifications
6.1. Programming (“A/A Mux”) Mode Operation

The Intel® 82802 is designed to offer a parallel programming mode for faster factory programming. This
mode, called the A/A Mux mode, is selected by IC high. The IC pin is pulled down internally in the
Intel® 82802, so it should be expected that a modest current will be drawn. (See the pin descriptions in
Table 1 for further information.)
The following information applies only to the Intel® 82802 when in the A/A Mux mode. Information
regarding the FWH mode (i.e., the standard operating mode) is provided in earlier chapters of this
document
6.2. Bus Operation

All A/A mux bus cycles can be conformed to operate on most automated test equipment and PROM
programmers.
6.2.1. Output Disable/Enable

With OE# at the logic-high level (VIH), the device outputs are disabled. Output pins DQ0–DQ7 are
placed in the high-impedance state. With OE# at the logic-low level (VIL), the device outputs are
enabled. Output pins DQ0–DQ7 are placed in the output-drive state.
6.2.2. Row/Column Addresses

R/C# is the A/A mux control pin used to latch row (A0–A10) and column addresses (A11–A18/4 Mbits,
or A[11:19] /8 Mbits). R/C# latches row addresses on the falling edge and column addresses on the rising
edge.
6.2.3. Read Operation

Block information, identifier codes or status register data can be read independently of the VPP voltage.
The first task is to write the appropriate read-mode command (Read Array, Read Identifier Codes or
Read Status Register) to the CUI. Upon initial device power-up or after exit from reset, the device
defaults to the read array mode. Four control pins dictate the data flow into and out of the component:
R/C#, OE#, WE#, and RST#. R/C# is the A/A mux control pin used to latch row and column addresses.
OE#, the data output control pin (DQ0–DQ7), drives the selected memory data onto the I/O bus, when
active. WE# and RST# must be at VIH.
Datasheet 47
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6.2.4. Read Identifier Codes Operation

The read identifier codes operation outputs the manufacturer and device codes (see Table 4). Using the
manufacturer and device codes, automated test equipment (ATE) or PROM programmer software can
confirm the proper device ID.
6.2.5. Write Operation

The CUI does not occupy a specific addressable memory location. It is written to when WE# is active
and OE# = VIH. The address previously captured by R/C# transitions and the data needed to execute a
command are latched on the WE# rising edge.
Table 21. Bus Operations
Mode Notes RST# OE# WE# Address VPP DQ[0:7]
Read 1,2,6 VIH VIL VIH X X DOUT
Output Disable 6 VIH VIH VIH X X High Z
Read Identifier Codes 3,6 VIH VIL VIH Note 3 X Note 3
Write 4,5,6 VIH VIH VIL X X DIN
Note:
1. When VPP ≤ VPPLK, the memory contents can be read, but not altered.
2. X can be VIL or VIH for the control and address input pins and VPPLK or VPPH1/2 for the VPP supply
pin. See the DC characteristics for the VPPLK and VPPH1/2 voltages.
3. See Table 4 for the read identifier code data and addresses.
4. Command writes involving block erase or program are reliably executed when VPP = VPPH1/2 and
VCC = VCC ± 0.3 V.
5. Refer to Table 2 for the valid DIN during a write operation.
6. VIH and VIL refer to the DC Characteristics associated flash memory output buffers:
VIL min = -0.5V, VIL max = 0.8V and VIH min = 2.0V, VIH max = VCC + 0.5V.
6.3. Command Definitions

Flash core programming commands in A/A Mux mode are identical to commands for the FWH mode.
Refer to Section 4 of this document.
6.4. Electrical Characteristics in A/A Mux Mode

Certain specifications differ from the previous sections, when programming in the A/A Mux mode. The
following subsections provide this data. Any information not provided here is not specific to the A/A
Mux mode. Refer to Section 5 of this document and use the Intel FWH mode specifications.
48 Datasheet
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6.4.1. Reset Operations

# Symbol Parameter Notes Min. Max. Unit
P1 tPLPH RST# pulse low time (If RST# is tied to VCC, this 100 ns
specification is not applicable.)
P2 tPLRH RST# low to reset during block erase or program 1, 2 20 µs
Note:
1. If RST# is asserted when the WSM is not busy (RY/BY# = ‘1’), the reset will complete within 100
ns.
2. A reset time, tPHAV, is required from the latter of RY/BY# or RST# going high until outputs are
valid.
6.4.2. AC Waveforms for Reset Operations
VIH
RY/BY# (R)
VIL
P2
RST# (P) VIH

VIL
P1
6.4.3. A/A Mux Read-Only Operations (1,3)

# Symbol Parameter Notes Min. Max. Unit
R1 tAVAV Read cycle time 250 ns

R2 tAVCL Row address setup to R/C# low 50 ns
R3 tCLAX Row address hold from R/C# low 50 ns
R4 tAVCH Column address setup to R/C# high 50 ns
R5 tCHAX Column address hold from R/C# high 50 ns
R6 tCHQV R/C# high to output delay 2 150 ns
R7 tGLQV OE# low to output delay 2 50 ns
R8 tPHAV RST# high to row address setup 1 µs
R9 tGLQX OE# low to output in low Z 0 ns
R10 tGHQZ OE# high to output in high Z 50 ns
R11 tQXGH Output hold from OE# high 0 ns
Note:
1. See the AC input/output reference waveform for the maximum allowable input slew rate.
2. OE# may be delayed up to tCHQV – tGLQV after the rising edge of R/C# without affecting tCHQV.
3. Tc = 0 °C to + 85 °C, 3.3 V ± 0.3 V VCC
Datasheet 49
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Figure 14. A/A Mux Read Timing Diagram
R1
VIH x x
Row Address Column Address Next Address
ADDRESSES (A)
Stable Stable Stable
VIL x x
R2 R5
VIH
R3 R4
R/C# (C) R6
VIL
R7
VIH
OE# (G)
R10
VIL
R8 R11
VOH
High Z High Z
DATA (D/Q) Data Valid
VOL
R9
VIH
WE# (W)
VIL
VIH
RP# (P)
VIL
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6.4.4. A/A Mux Write Operations (1,2)

# Symbol Parameter Notes Min. Max. Units
W1 tPHWL RP# high recovery to WE# low 1 µs
W2 tWLWH Write pulse width low 100 ns
W3 tDVWH Data setup to WE# high 1 50 ns
W4 tWHDX Data hold from WE# high 1 5 ns
W5 tAVCL Row address setup to R/C# low 1 50 ns
W6 tCLAX Row address hold from R/C# low 1 50 ns
W7 tAVCH Column address setup to R/C# high 1 50 ns
W8 tCHAX Column address hold from R/C# high 1 50 ns
W9 tWHWL Write pulse width high 100 ns
W10 tCHWH R/C# high setup to WE# high 50 ns
W11 tVPWH VPP1,2 setup to WE# high 100 ns
W12 tWHGL Write recovery before read 150 ns
W13 tWHRL WE# high to RY/BY# going low 0 ns
W14 tQVVL VPP1,2 hold from valid SRD, RY/BY# high 0 ns
Note:
1. Refer to Table 6-28 [?] for valid AIN and DIN for block erase or program or other commands.
2. Tc = 0 °C to + 85 °C, 3.3 V ± 0.3 V VCC
Datasheet 51
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Figure 15. A/A Mux Write Timing Diagram
A B C D E F
VIH
ADDRESSES (A) R1 C1 R2 C2
VIL
W5 W6 W7 W8
VIH
R/C# (C)
VIL
W1 W9 W10
VIH W2
WE# (W)
VIL W12
VIH
OE# (G)
VIL W4
W3
VOH
Valid
DATA (D/Q) DIN DIN SRD
VOL
W13
VIH
RY/BY# (R)
VIL
VIH
RP# (P) W15
VIL
W11 W14
VPPH1,2
VPP (V)
VIL
Note:
A VCC power-up and stand-by
B Write block erase or program setup
C Write block erase confirm or valid address and data
D Automated erase or program delay
E Read status register data
F Ready to write another command
52 Datasheet
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Intel 82802 Firmware Hub

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Document Number: 290658-004

This datasheet has been downloaded from http://www.digchip.com at this page

5.2. Operating Conditions .....................................................................................................33

-001 • Initial Release April 1999

-002 • Added Chapter 6 May 1999

• Updated programmer vendor/service provider information.

-004 • Removed All references to multi-byte read cycles November 2000

Intel® 82802AB/AC Firmware Hub

Figure 1. Simplified Block Diagram

IDE LPC Interface

1.1. Interface Overview

1.1.1. Intel Firmware Hub Interface

1.1.2. Address/Address-Multiplexed Interface

1.2. Nonvolatile Flash Memory Core

Figure 3. Intel FWH Boot-Configuration System Memory Map

System Memory FWH FWH

Range for other

This page is intentionally left blank.

A7 FGPI1 5 29 IC (VIL) IC(VIH)

A5 WP# 7 27 VCCa VCCa

A2 ID2 10 24 INIT# OE#

A1 ID1 11 23 FWH4 WE#

A0 ID0 12 22 RFU RY/BY#

DQ0 FWH0 13 21 RFU DQ7

FWH1 FWH2 GND FWH3 RFU RFU RFU

Figure 5. 40-Lead TSOP Intel Firmware Hub Pinout

A/A Mux A/A Mux

RST# RST# 12 TOP VIEW 29 GND GND

2.1. Pin Descriptions

Table 1. Pin Descriptions

Symbol Type Interface Name and Function

Intel A/A Mux

IC I X X Interface Configuration Pin. This pin determines which interface is

FWH[3:0] I/O X Intel FWH I/Os. I/O communication

FWH4 I X Intel FWH Input. Input communication

Symbol Type Interface Name and Function

Intel A/A Mux

Intel FWH General Purpose Inputs. These individual inputs can be

Top Block Lock. When low, it prevents programming or block erase

Write Protect. When low, prevents programming or block erase to

Low-Order Address Inputs. Inputs for low-order addresses during

Data Input/Outputs. These pins receive data and commands during

Write Enable. Controls writes to the CUI and array blocks.

Symbol Type Interface Name and Function

Intel A/A Mux

Block Erase/Program Power Supply. For erasing array blocks or

Device Power Supply. Internal detection automatically configures

GND PWR X X Ground. Do not float any ground pins.

GNDa PWR X X Analog Ground. Should be tied to same plane as GND.

No Connect. Pin may be driven or floated. If it is driven, the voltage

Ready/Busy. Valid only in A/A Mux Mode. This output pin is a

3. Interface Operation Description

3.3. Output Disable

3.5. Operational Effects of Hardware Write-Protect Pins

Table 2. Command Definitions

Read Array/Reset 1 Write X FFh

Read Identifier Codes ≥2 2 Write X 90h Read IA ID

Read Status Register 2 Write X 70h Read X SRD

Clear Status Register 1 Write X 50h