MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

RF Transistor
NPN Silicon
COLLECTOR
1
BF224
3
BASE

2
EMITTER

1
2
3

CASE 29–04, STYLE 21

TO–92 (TO–226AA)
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector – Emitter Voltage VCEO 30 Vdc
Collector – Base Voltage VCBO 45 Vdc
Emitter – Base Voltage VEBO 4.0 Vdc
Collector Current — Continuous IC 50 mAdc
Total Device Dissipation @ TA = 25°C PD 350 mW
Derate above 25°C 2.8 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.0 Watts
Derate above 25°C 8.0 mW/°C
Operating and Storage Junction TJ, Tstg – 55 to +150 °C
Temperature Range

THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 357 °C/W
Thermal Resistance, Junction to Case RqJC 125 °C/W

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = 1.0 mAdc, IB = 0) 30 — —
Collector – Base Breakdown Voltage V(BR)CBO Vdc
(IC = 100 mAdc, IE = 0) 45 — —
Emitter – Base Breakdown Voltage V(BR)EBO Vdc
(IE = 100 mAdc, IC = 0) 4.0 — —
Collector Cutoff Current ICBO nAdc
(VCB = 20 Vdc, IE = 0) — — 100
Emitter Cutoff Current IEBO nAdc
(VEB = 3.0 Vdc, IC = 0) — — 100

Motorola Small–Signal Transistors, FETs and Diodes Device Data 2–235

BF224
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued)
Characteristic Symbol Min Typ Max Unit

ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 7.0 mAdc, VCE = 10 Vdc) 30 — —
Base–Emitter On Voltage VBE(on) mVdc
(IC = 7.0 mAdc, VCE = 10 Vdc) — 0.77 0.9
Collector–Emitter Saturation Voltage VCE(sat) Vdc
(IC = 10 mAdc, IB = 1.0 mAdc) — — 0.15

SMALL–SIGNAL CHARACTERISTICS
Current Gain — Bandwidth Product fT MHz
(IC = 1.5 mAdc, VCE = 10 Vdc, f = 100 MHz) 300 600 —
(IC = 7.0 mAdc, VCE = 10 Vdc, f = 100 MHz) — 850 —
Common Emitter Feedback Capacitance Cre pF
(VCE = 10 Vdc, IE = 0, f = 1.0 MHz) — 0.28 —
Noise Figure Nf dB
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 Ω, f = 100 MHz) — 2.5 —
(IC = 1.0 mAdc, VCE = 10 Vdc, RS = 50 Ω, f = 200 MHz) — 3.5 —

2–236 Motorola Small–Signal Transistors, FETs and Diodes Device Data

 BF224

f T, CURRENT–GAIN — BANDWIDTH PRODUCT (MHz)

1000 10
700 VCE = 10 V BF224
TA = 25°C
500
300

C, CAPACITANCE (pF)
200 2
Cib
100 1
0.7 Cob
0.5
0.4
0.3
20 0.2 Cre @ IE = 0

10
0.2 0.3 0.5 0.7 1 3 5 10 20 100 0.1 0.2 0.5 1 3 5 10 20
IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Current–Gain — Bandwidth Product Figure 2. Capacitances

100
VCE = 10 V VCE = 10 V
TA = 25°C 50
hFE, DC CURRENT GAIN

100 MHz
200 20

100 mmhos 10
BF224
70
50 5 45 MHz
30
10.7 MHz
20 2
b11e 470 kHz < 0.2 mmhos
10 1
0.1 0.2 0.3 0.5 0.7 1 2 3 5 7 10 20 2 3 4 5 6 7 8
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain Figure 4. b11e

–100 2000
VCE = 10 V 100 MHz
–50 1000 100 MHz
VCE = 10 V
45 MHz 500
–20
mmhos

µmhos

45 MHz
–10 10.7 MHz 200

–5 100
10.7 MHz
50
–2
b21e, at 470 kHz < 0.5 mmhos 470 kHz
–1 20
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 5. b21e Figure 6. b22e (boe)

Motorola Small–Signal Transistors, FETs and Diodes Device Data 2–237

BF224
10 200
VCE = 10 V 100 MHz
VCE = 10 V
5 100
45 MHz
10.7 MHz f = 0.47 to 45 MHz
50
2 470 kHz

mmhos
mmhos

1 20

0.5 10

5
0.2

0.1 2
2 3 4 5 6 7 8 1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)

Figure 7. g11e (gie) Figure 8. g21e (Yfe)

200
VCE = 10 V 100 MHz
100

50 45 MHz
10.7 MHz
µmhos

20 470 kHz

10

2
1 2 3 4 5 6 7
IC, COLLECTOR CURRENT (mA)

Figure 9. g22e (goe)

2–238 Motorola Small–Signal Transistors, FETs and Diodes Device Data

 EMBOSSED TAPE AND REEL
SOT-23, SC-59, SC-70/SOT-323, SC–90/SOT–416, SOT-223 and SO-16 packages are available only in
Tape and Reel. Use the appropriate suffix indicated below to order any of the SOT-23, SC-59,
SC-70/SOT-323, SOT-223 and SO-16 packages. (See Section 6 on Packaging for additional information).

SOT-23: available in 8 mm Tape and Reel

Use the device title (which already includes the “T1” suffix) to order the 7 inch/3000 unit reel.
Replace the “T1” suffix in the device title with a “T3” suffix to order the 13 inch/10,000 unit reel.

SC-59: available in 8 mm Tape and Reel

Use the device title (which already includes the “T1” suffix) to order the 7 inch/3000 unit reel.
Replace the “T1” suffix in the device title with a “T3” suffix to order the 13 inch/10,000 unit reel.

SC-70/ available in 8 mm Tape and Reel

SOT-323: Use the device title (which already includes the “T1” suffix) to order the 7 inch/3000 unit reel.
Replace the “T1” suffix in the device title with a “T3” suffix to order the 13 inch/10,000 unit reel.

SOT-223: available in 12 mm Tape and Reel

Use the device title (which already includes the “T1” suffix) to order the 7 inch/1000 unit reel.
Replace the “T1” suffix in the device title with a “T3” suffix to order the 13 inch/4000 unit reel.

SO-16: available in 16 mm Tape and Reel

Add an “R1” suffix to the device title to order the 7 inch/500 unit reel.
Add an “R2” suffix to the device title to order the 13 inch/2500 unit reel.

RADIAL TAPE IN FAN FOLD BOX OR REEL

TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels.
Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in
printed circuit boards.

TO-92: available in Fan Fold Box

Add an “RLR” suffix and the appropriate Style code* to the device title to order the Fan Fold box.

available in 365 mm Radial Tape Reel

Add an “RLR” suffix and the appropriate Style code* to the device title to order the Radial Tape
Reel.

*Refer to Section 6 on Packaging for Style code characters and additional information on ordering
*requirements.

DEVICE MARKINGS/DATE CODE CHARACTERS

SOT-23, SC-59, SC-70/SOT-323, and the SC–90/SOT–416 packages have a device marking and a date
code etched on the device. The generic example below depicts both the device marking and a representa-
tion of the date code that appears on the SC-70/SOT-323, SC-59 and SOT-23 packages.

ABC D
The “D” represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the
part was manufactured.

2–2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

 Tape and Reel Specifications
and Packaging Specifications
Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the
shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure
cavity for the product when sealed with the “peel–back” cover tape.
• Two Reel Sizes Available (7″ and 13″) • SOD–123, SC–59, SC–70/SOT–323, SC–70ML/SOT–363,
• Used for Automatic Pick and Place Feed Systems SOT–23, TSOP–6, in 8 mm Tape
• Minimizes Product Handling • SOT–223 in 12 mm Tape
• EIA 481, –1, –2 • SO–14, SO–16 in 16 mm Tape
Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual
reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is
one full reel for each line item, and orders are required to be in increments of the single reel quantity.

SC–70ML/SOT–363, TSOP–6
SOD–123 SC–59, SC–70/SOT–323, SOT–23 T1 ORIENTATION
8 mm
8 mm 8 mm

SC–70ML/SOT–363
SOT–223 SO–14, 16 T2 ORIENTATION DIRECTION
12 mm 16 mm 8 mm OF FEED

EMBOSSED TAPE AND REEL ORDERING INFORMATION

Devices Per Reel

Tape Width Pitch Reel Size and Minimum Device
Package (mm) mm (inch) mm (inch) Order Quantity Suffix
SC–59 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1
SC–70/SOT–323 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1
8 330 (13) 10,000 T3
SO–14 16 8.0 ± 0.1 (.315 ± .004) 178 (7) 500 R1
16 330 (13) 2,500 R2
SO–16 16 8.0 ± 0.1 (.315 ± .004) 178 (7) 500 R1
16 330 (13) 2,500 R2
SOD–123 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1
8 330 (13) 10,000 T3
SOT–23 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1
8 330 (13) 10,000 T3
SOT–223 12 8.0 ± 0.1 (.315 ± .004) 178 (7) 1,000 T1
12 330 (13) 4,000 T3
SC–70ML/SOT–363 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1
8 178 (7) 3,000 T2
TSOP–6 8 4.0 ± 0.1 (.157 ± .004) 178 (7) 3,000 T1

Tape and Reel Specifications Motorola Small–Signal Transistors, FETs and Diodes Device Data
6–2
 EMBOSSED TAPE AND REEL DATA FOR DISCRETES
CARRIER TAPE SPECIFICATIONS

10 Pitches Cumulative Tolerance on Tape

K P0 ± 0.2 mm
(± 0.008″)
D P2
t
E
Top Cover
Tape A0
F W

B1 K0 B0
See
Note 1 P
D1
Embossment Center Lines
For Components
of Cavity
2.0 mm x 1.2 mm and Larger

For Machine Reference Only

Including Draft and RADII
User Direction of Feed
Concentric Around B0

* Top Cover Tape

Bar Code Label Thickness (t1)
0.10 mm
R Min
(.004″) Max.
Tape and Components
Shall Pass Around Radius “R”
Without Damage
Bending Radius Embossed Carrier
10° 100 mm Embossment
Maximum Component Rotation
(3.937″)
1 mm Max

Typical Component
Cavity Center Line
Tape

1 mm
(.039″) Max 250 mm
(9.843″)
Typical Component Camber (Top View)
Center Line Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm

DIMENSIONS
Tape
Size B1 Max D D1 E F K P0 P2 R Min T Max W Max
8 mm 4.55 mm 1.5 + 0.1 mm 1.0 Min 1.75 ± 0.1 mm 3.5 ± 0.05 mm 2.4 mm Max 4.0 ± 0.1 mm 2.0 ± 0.1 mm 25 mm 0.6 mm 8.3 mm
(.179″) – 0.0 (.039″) (.069 ± .004″) (.138 ± .002″) (.094″) (.157 ± .004″) (.079 ± .002″) (.98″) (.024″) (.327″)
( 0 9 + .004″
(.059 004
12 mm 8.2 mm 1.5 mm Min 5.5 ± 0.05 mm 6.4 mm Max 30 mm 12 ± .30 mm
– 0.0)
(.323″) (.060″) (.217 ± .002″) (.252″) (1.18″) (.470 ± .012″)
16 mm 12.1 mm 7.5 ± 0.10 mm 7.9 mm Max 16.3 mm
(.476″) (.295 ± .004″) (.311″) (.642″)
24 mm 20.1 mm 11.5 ± 0.1 mm 11.9 mm Max 24.3 mm
(.791″) (.453 ± .004″) (.468″) (.957″)
Metric dimensions govern — English are in parentheses for reference only.
NOTE 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max.,
NOTE 1: the component cannot rotate more than 10° within the determined cavity.
NOTE 2: If B1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders.
NOTE 3: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg. 5.12–3.

Motorola Small–Signal Transistors, FETs and Diodes Device Data Tape and Reel Specifications
6–3
 EMBOSSED TAPE AND REEL DATA FOR DISCRETES

T Max
Outside Dimension
Measured at Edge

1.5 mm Min 13.0 mm ± 0.5 mm

(.06″) (.512″ ± .002″)

A 20.2 mm Min 50 mm Min

(.795″) (1.969″)

Full Radius

Inside Dimension
G
Measured Near Hub

Size A Max G T Max

8 mm 330 mm 8.4 mm + 1.5 mm, – 0.0 14.4 mm
(12.992″) (.33″ + .059″, – 0.00) (.56″)
12 mm 330 mm 12.4 mm + 2.0 mm, – 0.0 18.4 mm
(12.992″) (.49″ + .079″, – 0.00) (.72″)
16 mm 360 mm 16.4 mm + 2.0 mm, – 0.0 22.4 mm
(14.173″) (.646″ + .078″, – 0.00) (.882″)
24 mm 360 mm 24.4 mm + 2.0 mm, – 0.0 30.4 mm
(14.173″) (.961″ + .070″, – 0.00) (1.197″)

Reel Dimensions
Metric Dimensions Govern — English are in parentheses for reference only

Tape and Reel Specifications Motorola Small–Signal Transistors, FETs and Diodes Device Data
6–4
TO–92 EIA, IEC, EIAJ
Radial Tape in Fan Fold TO–92
Box or On Reel RADIAL
TAPE IN
Radial tape in fan fold box or on reel of the reliable TO–92 package are
the best methods of capturing devices for automatic insertion in printed
FAN FOLD
circuit boards. These methods of taping are compatible with various
equipment for active and passive component insertion.
BOX OR
• Available in Fan Fold Box ON REEL
• Available on 365 mm Reels
• Accommodates All Standard Inserters
• Allows Flexible Circuit Board Layout
• 2.5 mm Pin Spacing for Soldering
• EIA–468, IEC 286–2, EIAJ RC1008B

Ordering Notes:
When ordering radial tape in fan fold box or on reel, specify the style per
Figures 3 through 8. Add the suffix “RLR” and “Style” to the device title, i.e.
MPS3904RLRA. This will be a standard MPS3904 radial taped and
supplied on a reel per Figure 9.
Fan Fold Box Information — Order in increments of 2000.
Reel Information — Order in increments of 2000.

US/European Suffix Conversions

US EUROPE

RLRA RL

RLRE RL1

RLRM ZL1

Motorola Small–Signal Transistors, FETs and Diodes Device Data Packaging Specifications
6–5
 TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2A H2A
H2B H2B

W2
H4 H5
T1
L1
H1
W1 W
L T

F1 T2
F2
P2 P2 D

P1
P

Figure 1. Device Positioning on Tape

Specification
Inches Millimeter
Symbol Item Min Max Min Max
D Tape Feedhole Diameter 0.1496 0.1653 3.8 4.2
D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51
F1, F2 Component Lead Pitch 0.0945 0.110 2.4 2.8
H Bottom of Component to Seating Plane .059 .156 1.5 4.0
H1 Feedhole Location 0.3346 0.3741 8.5 9.5
H2A Deflection Left or Right 0 0.039 0 1.0
H2B Deflection Front or Rear 0 0.051 0 1.0
H4 Feedhole to Bottom of Component 0.7086 0.768 18 19.5
H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5
L Defective Unit Clipped Dimension 0.3346 0.433 8.5 11
L1 Lead Wire Enclosure 0.09842 — 2.5 —
P Feedhole Pitch 0.4921 0.5079 12.5 12.9
P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75
P2 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95
T Adhesive Tape Thickness 0.06 0.08 0.15 0.20
T1 Overall Taped Package Thickness — 0.0567 — 1.44
T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65
W Carrier Strip Width 0.6889 0.7481 17.5 19
W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3
W2 Adhesive Tape Position .0059 0.01968 .15 0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.

Packaging Specifications Motorola Small–Signal Transistors, FETs and Diodes Device Data
6–6
 TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
FAN FOLD BOX STYLES

ÇÇÇÇÇÇÇ
ADHESIVE TAPE ON ADHESIVE TAPE ON
TOP SIDE

ÇÇÇÇÇÇÇ
TOP SIDE 330 mm
FLAT SIDE
13”

ÇÇÇÇÇÇÇ
ROUNDED SIDE
CARRIER MAX
CARRIER

ÇÇÇÇÇÇÇ
STRIP
STRIP 252 mm
MAX
9.92”

FLAT SIDE OF TRANSISTOR ROUNDED SIDE OF TRANSISTOR AND

AND ADHESIVE TAPE VISIBLE. ADHESIVE TAPE VISIBLE. 58 mm
2.28”
Style M fan fold box is equivalent to styles E and F of Style P fan fold box is equivalent to styles A and B of
MAX
reel pack dependent on feed orientation from box. reel pack dependent on feed orientation from box.

Figure 2. Style M Figure 3. Style P Figure 4. Fan Fold Box Dimensions

ADHESION PULL TESTS

500 GRAM PULL FORCE

70 GRAM
100 GRAM
PULL FORCE
PULL FORCE
16 mm
16 mm

HOLDING
HOLDING
FIXTURE
FIXTURE HOLDING
FIXTURE

There shall be no deviation in the leads and

no component leads shall be pulled free of
The component shall not pull free with a 300 gram The component shall not pull free with a 70 gram the tape with a 500 gram load applied to the
load applied to the leads for 3 ± 1 second. load applied to the leads for 3 ± 1 second. component body for 3 ± 1 second.

Figure 5. Test #1 Figure 6. Test #2 Figure 7. Test #3

Motorola Small–Signal Transistors, FETs and Diodes Device Data Packaging Specifications
6–7
 TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
REEL STYLES

CORE DIA.
ARBOR HOLE DIA. 82mm ± 1mm
30.5mm ± 0.25mm

MARKING NOTE

HUB RECESS
76.2mm ± 1mm

RECESS DEPTH
365mm + 3, – 0mm
9.5mm MIN

38.1mm ± 1mm
48 mm
MAX

Material used must not cause deterioration of components or degrade lead solderability

Figure 8. Reel Specifications

ADHESIVE TAPE ON REVERSE SIDE

CARRIER STRIP CARRIER STRIP

ROUNDED
SIDE FLAT SIDE
ADHESIVE TAPE

FEED FEED

Rounded side of transistor and adhesive tape visible. Flat side of transistor and carrier strip visible
(adhesive tape on reverse side).

Figure 9. Style A Figure 10. Style B

ADHESIVE TAPE ON REVERSE SIDE

CARRIER STRIP ROUNDED

CARRIER STRIP
FLAT SIDE SIDE
ADHESIVE TAPE

FEED FEED

Flat side of transistor and adhesive tape visible. Rounded side of transistor and carrier strip visible
(adhesive tape on reverse side).

Figure 11. Style E Figure 12. Style F

Packaging Specifications Motorola Small–Signal Transistors, FETs and Diodes Device Data
6–8
 INFORMATION FOR USING SURFACE MOUNT PACKAGES
RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total face between the board and the package. With the correct
design. The footprint for the semiconductor packages must pad geometry, the packages will self align when subjected to
be the correct size to ensure proper solder connection inter- a solder reflow process.

POWER DISSIPATION FOR A SURFACE MOUNT DEVICE

The power dissipation for a surface mount device is a func- Although the power dissipation can almost be doubled with
tion of the drain/collector pad size. These can vary from the this method, area is taken up on the printed circuit board
minimum pad size for soldering to a pad size given for which can defeat the purpose of using surface mount
maximum power dissipation. Power dissipation for a surface technology. For example, a graph of RθJA versus drain pad
mount device is determined by TJ(max), the maximum rated area is shown in Figure 1.
junction temperature of the die, RθJA, the thermal resistance
from the device junction to ambient, and the operating Another alternative would be to use a ceramic substrate or
temperature, TA. Using the values provided on the data an aluminum core board such as Thermal Clad. Using a
sheet, PD can be calculated as follows: board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
TJ(max) – TA
PD = footprint.
RθJA
160

RθJA , THERMAL RESISTANCE, JUNCTION

The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into Board Material = 0.0625″ TA = 25°C
the equation for an ambient temperature TA of 25°C, one can 140 G–10/FR–4, 2 oz Copper
calculate the power dissipation of the device. For example, TO AMBIENT (°C/W) 0.8 Watts
for a SOT–223 device, PD is calculated as follows.
120
PD = 150°C – 25°C = 800 milliwatts 1.25 Watts* 1.5 Watts
156°C/W
100
The 156°C/W for the SOT–223 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 800 milliwatts. There *Mounted on the DPAK footprint
80
are other alternatives to achieving higher power dissipation 0.0 0.2 0.4 0.6 0.8 1.0
from the surface mount packages. One is to increase the A, AREA (SQUARE INCHES)
area of the drain/collector pad. By increasing the area of the Figure 1. Thermal Resistance versus Drain Pad
drain/collector pad, the power dissipation can be increased. Area for the SOT–223 Package (Typical)

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed SOT–23, SC–59, SC–70/SOT–323, SC–90/SOT–416,
circuit board, solder paste must be applied to the pads. SOD–123, SOT–223, SOT–363, SO–14, SO–16, and
Solder stencils are used to screen the optimum amount. TSOP–6 packages, the stencil opening should be the same
These stencils are typically 0.008 inches thick and may be as the pad size or a 1:1 registration.
made of brass or stainless steel. For packages such as the

Surface Mount Information Motorola Small–Signal Transistors, FETs and Diodes Device Data
7–10
 SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated • The soldering temperature and time should not exceed
temperature of the device. When the entire device is heated 260°C for more than 10 seconds.
to a high temperature, failure to complete soldering within a • When shifting from preheating to soldering, the maximum
short time could result in device failure. Therefore, the temperature gradient shall be 5°C or less.
following items should always be observed in order to mini- • After soldering has been completed, the device should be
mize the thermal stress to which the devices are subjected. allowed to cool naturally for at least three minutes.
• Always preheat the device. Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and will
• The delta temperature between the preheat and soldering
result in latent failure due to mechanical stress.
should be 100°C or less.*
• Mechanical stress or shock should not be applied during
• When preheating and soldering, the temperature of the
cooling.
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When * Soldering a device without preheating can cause excessive
using infrared heating with the reflow soldering method, thermal shock and stress which can result in damage to the
the difference should be a maximum of 10°C. device.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control actual temperature that might be experienced on the surface
settings that will give the desired heat pattern. The operator of a test board at or near a central solder joint. The two
must set temperatures for several heating zones and a figure profiles are based on a high density and a low density board.
for belt speed. Taken together, these control settings make The Vitronics SMD310 convection/infrared reflow soldering
up a heating “profile” for that particular circuit board. On system was used to generate this profile. The type of solder
machines controlled by a computer, the computer remem- used was 62/36/2 Tin Lead Silver with a melting point
bers these profiles from one operating session to the next.
between 177 –189°C. When this type of furnace is used for
Figure 2 shows a typical heating profile for use when
solder reflow work, the circuit boards and solder joints tend to
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems, but it is a heat first. The components on the board are then heated by
good starting point. Factors that can affect the profile include conduction. The circuit board, because it has a large surface
the type of soldering system in use, density and types of area, absorbs the thermal energy more efficiently, then
components on the board, type of solder used, and the type distributes this energy to the components. Because of this
of board or substrate material being used. This profile shows effect, the main body of a component may be up to 30
temperature versus time. The line on the graph shows the degrees cooler than the adjacent solder joints.

STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7

PREHEAT VENT HEATING HEATING HEATING VENT COOLING
ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7
“RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C
200°C 170°C PEAK AT
DESIRED CURVE FOR HIGH SOLDER JOINT
MASS ASSEMBLIES 160°C

150°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
100°C 140°C (DEPENDING ON
100°C MASS OF ASSEMBLY)

DESIRED CURVE FOR LOW

MASS ASSEMBLIES
50°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

Figure 2. Typical Solder Heating Profile

Motorola Small–Signal Transistors, FETs and Diodes Device Data Surface Mount Information
7–11
Footprints for Soldering
0.037 0.037
0.037 0.95 0.037 0.95
0.95 0.95

0.094 0.079
2.4 2.0

0.039 0.035
1.0 0.9
inches
0.031 0.031 inches
mm
0.8 0.8 mm

SC–59 SOT–23

ÉÉÉ
0.025
0.025

ÉÉÉ
0.65
0.65

ÉÉÉ ÉÉÉ
0.5 min. (3x)

ÉÉÉ

0.5
0.075

ÉÉÉ ÉÉÉ
ÉÉÉ

1
1.9
0.5 min. (3x)

ÉÉÉ
0.035
0.9

0.028
1.4
0.7 inches
mm

SC–70/SOT–323 SOT 416/SC–90

0.15 0.060
3.8 1.52

0.079
2.0

0.248 0.275 0.155

6.3 7.0 4.0
0.091 0.091
2.3 2.3

0.079
2.0 0.024 0.050
0.6 1.270
0.059 0.059 0.059 inches
inches
1.5 1.5 1.5 mm
mm

SOT–223 SO–14, SO–16

Surface Mount Information Motorola Small–Signal Transistors, FETs and Diodes Device Data
7–12
 0.5 mm (min)

ÉÉÉÉ ÉÉÉ
0.91
ÉÉÉ ÉÉÉ
ÉÉÉÉ ÉÉÉ
0.036
ÉÉÉ
ÉÉÉ ÉÉÉ
ÉÉÉ

0.65 mm 0.65 mm
ÉÉÉÉ ÉÉÉ 1.22
ÉÉÉ ÉÉÉ
ÉÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ
0.048

ÉÉÉ ÉÉÉ

0.4 mm (min)
2.36
0.093
4.19
0.165
mm
inches ÉÉÉ ÉÉÉ
1.9 mm

SOD–123 SOT–363
(SC–70 6 LEAD)

0.094
2.4

0.037
0.95

0.074
1.9
0.037
0.95

0.028
0.7

0.039 inches
1.0 mm

TSOP–6

Motorola Small–Signal Transistors, FETs and Diodes Device Data Surface Mount Information
7–13
Package Outline Dimensions
Dimensions are in inches unless otherwise noted.

A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
R 3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
P 4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
L MINIMUM. LEAD DIMENSION IS UNCONTROLLED
SEATING F IN P AND BEYOND DIMENSION K MINIMUM.
PLANE K
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
X X D C 0.125 0.165 3.18 4.19
D 0.016 0.022 0.41 0.55
G F 0.016 0.019 0.41 0.48
H J G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
V C J 0.015 0.020 0.39 0.50
K 0.500 ––– 12.70 –––
SECTION X–X L 0.250 ––– 6.35 –––
1 N N 0.080 0.105 2.04 2.66
P ––– 0.100 ––– 2.54
N R 0.115 ––– 2.93 –––
V 0.135 ––– 3.43 –––

STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 7:

PIN 1. EMITTER PIN 1. BASE PIN 1. ANODE PIN 1. CATHODE PIN 1. DRAIN PIN 1. SOURCE
2. BASE 2. EMITTER 2. ANODE 2. CATHODE 2. SOURCE 2. DRAIN
3. COLLECTOR 3. COLLECTOR 3. CATHODE 3. ANODE 3. GATE 3. GATE

STYLE 14: STYLE 15: STYLE 17: STYLE 21: STYLE 22: STYLE 30:
PIN 1. EMITTER PIN 1. ANODE 1 PIN 1. COLLECTOR PIN 1. COLLECTOR PIN 1. SOURCE PIN 1. DRAIN
2. COLLECTOR 2. CATHODE 2. BASE 2. EMITTER 2. GATE 2. GATE
3. BASE 3. ANODE 2 3. EMITTER 3. BASE 3. DRAIN 3. SOURCE

CASE 029–04
(TO–226AA) TO–92
PLASTIC

A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
B 3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
SEATING
DIMENSIONS D AND J APPLY BETWEEN L AND K
P PLANE
MIMIMUM. LEAD DIMENSION IS UNCONTROLLED
L IN P AND BEYOND DIMENSION K MINIMUM.
F
K INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.175 0.205 4.44 5.21
B 0.290 0.310 7.37 7.87
C 0.125 0.165 3.18 4.19
X X D D 0.018 0.022 0.46 0.56
G F 0.016 0.019 0.41 0.48
H G 0.045 0.055 1.15 1.39
J H 0.095 0.105 2.42 2.66
J 0.018 0.024 0.46 0.61
V K 0.500 ––– 12.70 –––
L 0.250 ––– 6.35 –––
SECTION X–X
1 2 3 N C N
P
0.080
–––
0.105
0.100
2.04
–––
2.66
2.54
R 0.135 ––– 3.43 –––
N V 0.135 ––– 3.43 –––

STYLE 1: STYLE 14: STYLE 22:

PIN 1. EMITTER PIN 1. EMITTER PIN 1. SOURCE
2. BASE 2. COLLECTOR 2. GATE
3. COLLECTOR 3. BASE 3. DRAIN

CASE 029–05
(TO–226AE) TO–92
1–WATT PLASTIC

Package Outline Dimensions Motorola Small–Signal Transistors, FETs and Diodes Device Data
8–2
PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. PACKAGE CONTOUR OPTIONAL WITHIN DIA B
D AND LENGTH A. HEAT SLUGS, IF ANY, SHALL BE
INCLUDED WITHIN THIS CYLINDER, BUT SHALL
NOT BE SUBJECT TO THE MIN LIMIT OF DIA B.
K 2. LEAD DIA NOT CONTROLLED IN ZONES F, TO
ALLOW FOR FLASH, LEAD FINISH BUILDUP,
AND MINOR IRREGULARITIES OTHER THAN
F HEAT SLUGS.

MILLIMETERS INCHES
A DIM MIN MAX MIN MAX
A 5.84 7.62 0.230 0.300
B 2.16 2.72 0.085 0.107
F D 0.46 0.56 0.018 0.022
F ––– 1.27 ––– 0.050
K 25.40 38.10 1.000 1.500
K
All JEDEC dimensions and notes apply.

CASE 51–02
(DO–204AA)
DO–7

A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
R 2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
PLANE
UNCONTROLLED.

ÉÉ
D 4. DIMENSION F APPLIES BETWEEN P AND L.
P L DIMENSIONS D AND J APPLY BETWEEN L AND K
F

ÉÉ
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
K J IN P AND BEYOND DIM K MINIMUM.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.21
SECTION X–X B 0.170 0.210 4.32 5.33
X X C 0.125 0.165 3.18 4.49
D D 0.016 0.022 0.41 0.56
F 0.016 0.019 0.407 0.482
G G 0.050 BSC 1.27 BSC
H H 0.100 BSC 3.54 BSC
J 0.014 0.016 0.36 0.41
K 0.500 ––– 12.70 –––
V L 0.250 ––– 6.35 –––
C
N 0.080 0.105 2.03 2.66
P ––– 0.050 ––– 1.27
R 0.115 ––– 2.93 –––
1 2 N V 0.135 ––– 3.43 –––

N
STYLE 1:
PIN 1. ANODE
2. CATHODE

CASE 182–02
(T0–226AC) TO–92
PLASTIC

Motorola Small–Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions
8–3
PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A 3. MAXIUMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
L THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
3 INCHES MILLIMETERS
B S DIM MIN MAX MIN MAX
1 2 A 0.1102 0.1197 2.80 3.04
B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440 0.89 1.11
V G D 0.0150 0.0200 0.37 0.50
G 0.0701 0.0807 1.78 2.04
H 0.0005 0.0040 0.013 0.100
J 0.0034 0.0070 0.085 0.177
C K 0.0140 0.0285 0.35 0.69
L 0.0350 0.0401 0.89 1.02
H S 0.0830 0.1039 2.10 2.64
D J
K V 0.0177 0.0236 0.45 0.60

STYLE 6: STYLE 8: STYLE 9: STYLE 10: STYLE 11:

PIN 1. BASE PIN 1. ANODE PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE
2. EMITTER 2. NO CONNECTION 2. ANODE 2. SOURCE 2. CATHODE
3. COLLECTOR 3. CATHODE 3. CATHODE 3. GATE 3. CATHODE–ANODE

STYLE 12: STYLE 18: STYLE 19: STYLE 21:

PIN 1. CATHODE PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. GATE
2. CATHODE 2. CATHODE 2. ANODE 2. SOURCE
3. ANODE 3. ANODE 3. CATHODE–ANODE 3. DRAIN

CASE 318–08
(TO–236AB) SOT–23
PLASTIC

A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
L Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.

MILLIMETERS INCHES
3
S B DIM MIN MAX MIN MAX
2 1 A 2.70 3.10 0.1063 0.1220
B 1.30 1.70 0.0512 0.0669
C 1.00 1.30 0.0394 0.0511
D 0.35 0.50 0.0138 0.0196
D G 1.70 2.10 0.0670 0.0826
H 0.013 0.100 0.0005 0.0040
G J 0.09 0.18 0.0034 0.0070
K 0.20 0.60 0.0079 0.0236
L 1.25 1.65 0.0493 0.0649
S 2.50 3.00 0.0985 0.1181
J
C

K
H

STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:

PIN 1. EMITTER PIN 1. N.C. PIN 1. ANODE PIN 1. N.C. PIN 1. CATHODE
2. BASE 2. ANODE 2. ANODE 2. CATHODE 2. CATHODE
3. COLLECTOR 3. CATHODE 3. CATHODE 3. ANODE 3. ANODE

CASE 318D–04
SC–59

Package Outline Dimensions Motorola Small–Signal Transistors, FETs and Diodes Device Data
8–4
PACKAGE OUTLINE DIMENSIONS (continued)

A
F
NOTES:
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
4
INCHES MILLIMETERS
S B DIM MIN MAX MIN MAX
1 2 3
A 0.249 0.263 6.30 6.70
B 0.130 0.145 3.30 3.70
C 0.060 0.068 1.50 1.75
D 0.024 0.035 0.60 0.89
D F 0.115 0.126 2.90 3.20
G 0.087 0.094 2.20 2.40
L
G H 0.0008 0.0040 0.020 0.100
J 0.009 0.014 0.24 0.35
J K 0.060 0.078 1.50 2.00
C L 0.033 0.041 0.85 1.05
M 0_ 10 _ 0_ 10 _
0.08 (0003) M S 0.264 0.287 6.70 7.30
H
K

STYLE 1: STYLE 2: STYLE 3:

PIN 1. BASE PIN 1. ANODE PIN 1. GATE
2. COLLECTOR 2. CATHODE 2. DRAIN
3. EMITTER 3. NC 3. SOURCE
4. COLLECTOR 4. CATHODE 4. DRAIN

CASE 318E–04
SOT–223

A
NOTES:
L 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
6 5 4 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
S B FINISH THICKNESS. MINIMUM LEAD THICKNESS
1 2 3 IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
MILLIMETERS INCHES
D DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220
G B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
M G 0.85 1.05 0.0335 0.0413
J H 0.013 0.100 0.0005 0.0040
0.05 (0.002) C J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
K 0_ 10 _ 0_ 10 _
H M
S 2.50 3.00 0.0985 0.1181

STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN

CASE 318G–02
TSOP–6
PLASTIC

Motorola Small–Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions
8–5
PACKAGE OUTLINE DIMENSIONS (continued)

A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
3 Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
S B
INCHES MILLIMETERS
1 2
DIM MIN MAX MIN MAX
A 0.071 0.087 1.80 2.20
B 0.045 0.053 1.15 1.35
V D C 0.035 0.049 0.90 1.25
D 0.012 0.016 0.30 0.40
G G 0.047 0.055 1.20 1.40
H 0.000 0.004 0.00 0.10
J 0.004 0.010 0.10 0.25
K 0.017 REF 0.425 REF
R N J L 0.026 BSC 0.650 BSC
C N 0.028 REF 0.700 REF
R 0.031 0.039 0.80 1.00
S 0.079 0.087 2.00 2.20
0.05 (0.002) K V 0.012 0.016 0.30 0.40
H

STYLE 2: STYLE 3: STYLE 4: STYLE 5:

PIN 1. ANODE PIN 1. BASE PIN 1. CATHODE PIN 1. ANODE
2. N.C. 2. EMITTER 2. CATHODE 2. ANODE
3. CATHODE 3. COLLECTOR 3. ANODE 3. CATHODE

STYLE 7: STYLE 9: STYLE 10:

PIN 1. BASE PIN 1. ANODE PIN 1. CATHODE
2. EMITTER 2. CATHODE 2. ANODE
3. COLLECTOR 3. CATHODE–ANODE 3. ANODE–CATHODE

CASE 419–02
SC–70/SOT–323

A NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
G Y14.5M, 1982.
V 2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.071 0.087 1.80 2.20
6 5 4 B 0.045 0.053 1.15 1.35
C 0.031 0.043 0.80 1.10
S –B– D 0.004 0.012 0.10 0.30
G 0.026 BSC 0.65 BSC
1 2 3 H ––– 0.004 ––– 0.10
J 0.004 0.010 0.10 0.25
K 0.004 0.012 0.10 0.30
N 0.008 REF 0.20 REF
S 0.079 0.087 2.00 2.20
D 6 PL 0.2 (0.008) M B M
V 0.012 0.016 0.30 0.40

STYLE 1:
PIN 1. EMITTER 2
N 2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
J 5. BASE 1
6. COLLECTOR 2
C

STYLE 6:
PIN 1. ANODE 2
K 2. N/C
H 3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2

CASE 419B-01
SOT–363

Package Outline Dimensions Motorola Small–Signal Transistors, FETs and Diodes Device Data
8–6
PACKAGE OUTLINE DIMENSIONS (continued)

A
C NOTES:

ÂÂÂ
1. DIMENSIONING AND TOLERANCING PER ANSI
H Y14.5M, 1982.

ÂÂÂ
2. CONTROLLING DIMENSION: INCH.
1
INCHES MILLIMETERS

ÂÂÂ
DIM MIN MAX MIN MAX
A 0.055 0.071 1.40 1.80
B 0.100 0.112 2.55 2.85
C 0.037 0.053 0.95 1.35
K B D 0.020 0.028 0.50 0.70
E 0.004 ––– 0.25 –––
H 0.000 0.004 0.00 0.10
J ––– 0.006 ––– 0.15
K 0.140 0.152 3.55 3.85

2
E
STYLE 1:
PIN 1. CATHODE
2. ANODE
D J

CASE 425–04
SOD–123

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–A– Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
S
MILLIMETERS INCHES
2
DIM MIN MAX MIN MAX
3 A 0.70 0.80 0.028 0.031
G –B– B 1.40 1.80 0.055 0.071
1 C 0.60 0.90 0.024 0.035
D 3 PL D 0.15 0.30 0.006 0.012
G 1.00 BSC 0.039 BSC
0.20 (0.008) M B H ––– 0.10 ––– 0.004
K 0.20 (0.008) A J 0.10 0.25 0.004 0.010
K 1.45 1.75 0.057 0.069
L 0.10 0.20 0.004 0.008
S 0.50 BSC 0.020 BSC

STYLE 1:
J PIN 1. BASE
C 2. EMITTER
3. COLLECTOR

L H STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE

CASE 463–01
SOT–416/SC–90

Motorola Small–Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions
8–7
PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
14 8 POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
B 2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
1 7 3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
A
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F L A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
C D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC 2.54 BSC
N J H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
SEATING K 0.115 0.135 2.92 3.43
PLANE K L 0.300 BSC 7.62 BSC
H G D M M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01

CASE 646–06
14–PIN DIP
PLASTIC

NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01

CASE 648–08
16–PIN DIP
PLASTIC

Package Outline Dimensions Motorola Small–Signal Transistors, FETs and Diodes Device Data
8–8
PACKAGE OUTLINE DIMENSIONS (continued)

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–A– Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
14 8 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
–B– P 7 PL 5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
1 7
0.25 (0.010) M B M PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
G R X 45 _ F DIM MIN MAX MIN MAX
C A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
–T– F 0.40 1.25 0.016 0.049
K M J G 1.27 BSC 0.050 BSC
SEATING D 14 PL
PLANE J 0.19 0.25 0.008 0.009
0.25 (0.010) M T B S A S K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

CASE 751A–03
SO–14
PLASTIC

–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16 9 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
–B– MOLD PROTRUSION.
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
1 8
0.25 (0.010) M B S PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
F A 9.80 10.00 0.386 0.393
K R X 45 _ B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
C F 0.40 1.25 0.016 0.049
–T– SEATING G 1.27 BSC 0.050 BSC
PLANE
M J J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
D 16 PL M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
0.25 (0.010) M T B S A S R 0.25 0.50 0.010 0.019

CASE 751B–05
SO–16
PLASTIC

Motorola Small–Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions
8–9