TA8429H/HQ

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA8429H, TA8429HQ
Full-bridge Driver (H-Switch) for DC Motor
(Driver for Switching between Forward and Reverse Rotation)

The TA8429H/HQ is a full-bridge driver IC for brush motor

rotation control. Four operating modes are selectable from
forward, reverse, stop and brake.
The TA8429H/HQ is best suited to drive medium-sized DC and
bipolar stepping motors.
Since the motor drive section and control section have separate
power supply pins, the TA8429H/HQ also allows servo control.

Weight : 4.04 g (typ.)

Features
z Output current of up to 3.0 A (AVE.) and 4.5 A (PEAK)
z Four different modes (forward rotation, reverse rotation, stop, and brake) are supported.
A counter-electromotive force absorber diode is also incorporated.
z Stand-by mode available: IST ≤ 100 μA
z Built-in thermal shutdown and short circuit protection circuits
z HZIP power package sealed
z Wide range of operating voltage: VCC = 7 to 27 V
VS = 0 to 27 V
*Please consider the internal loss (Vsat) to operate the IC though minimum VS
is defined zero.

Terminals of TA8429 written below are sensitive to electrostatic discharge. When handling this product, ensure that
the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an
ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels.
Terminals which are sensitive to electrostatic discharge: No. 1, 2, and 12.

The IC should be installed correctly. Otherwise, the IC or peripheral parts and devices may be degraded or
permanently damaged.

The TA8429HQ is a Sn-plated product. (The Pb-containing

materials with a high melting point that are exempted from RoHS
directives are used inside the IC.)
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245°C
*dipping time = 5 seconds
*the number of times = once
*use of R-type flux

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Block Diagram

Pin Function

Pin No. Symbol Functional Description

1 IN1 These pins receive inputs for controlling the state of the outputs.
The input sections incorporate a PNP-type voltage comparator.
2 IN2
3 N.C Non-connection
This pin connects to a DC motor. It has a current carrying capacity of 3 A in both sink and
source modes.
4 OUT1
A diode for absorbing counter-electromotive force in the motor is incorporated on both VCC and
ground sides.
5 N.C Non-connection
6 GND GND terminal
7 N.C Non-connection
This pin, along with pin 4, connects to a motor. It has the same function as pin 4. Its state is
8 OUT2
controlled with inputs to pins 1 and 2.
9 N.C Non-connection
10 VS Supply voltage terminal for motor drive
11 VCC This is a supply voltage pin for the control section. It is completely separated from VS.
When this pin is open or connected to a ground, the current flowing through the motor is
12 ST
minimized (100 μA).

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How Multi-Protection Works
The TA8429H/HQ incorporates two protection functions: over-current (ISD) and overheat (TSD).

Control logic

Note 1: These protection functions are only a means of temporarily avoiding some output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.

Note 2: If used under conditions where the absolute maximum ratings are exceeded, the IC may break down before
the protection circuits start operating.

Overheat Protection (TSD)

● Basic operation
The input signal of the IC controls the output while the junction temperature (chip temperature) of the IC
is equal to or lower than the TSD detection temperature. If the junction temperature becomes higher than
the TSD detection temperature, the output enters a high-impedance state regardless of the level of the input
signal.

● Explanation of the operation

The junction temperature is detected by monitoring the VF of a diode on the chip. When the VF becomes
lower than the internal reference voltage, the control logic is directed to turn off the output transistor. While
the VF is higher than the reference voltage, the input signal at pins 1 and 2 controls the logic section.

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Over-current Protection (ISD)
● Basic operation
When the output current (pin 4 or 8, that is, Isink or Isource) is equal to or lower than the ISD detection
current, the input signal controls the output. If the output current exceeds the detection current, it changes
to a switching waveform shown in Figure 1.

Detection current of 5 A
(typically)

Figure 1 Basic operation

● Explanation of the operation

The output current is detected by monitoring the VBE of each output transistor. A detector element is
connected to each output transistor and to a short-circuit prevention circuit. If a current higher than the ISD
detection current flows through one of the four output transistors, the short-circuit prevention circuit starts
operating. This circuit incorporates a timer. If the over-current mode lasts for 20 μs (typically), the output is
switched to the high-impedance state. It returns to the ON mode in 80 μs (typically). If the IC is still in the
over current mode, the switching mode stated above is repeated until the IC is released from the
over-current mode.
This circuit cannot limit all types of over current. If the outputs are short-circuited to each other or to a
ground, the IC may break down before the protection circuit starts operating. Therefore use a resistor or fuse
in the supply voltage (VS) line.

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 TA8429H/HQ
Internal Circuit

Function
Input Output Mode
IN1 IN2 ST OUT1 OUT2 Motor
H H H L L Short brake
L H H L H CCW (CW)
H L H H L CW (CCW)
L L H OFF (high impedance) Stop
H/L H/L L OFF (high impedance) Stand-by

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Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC, VS 30 V

Input voltage VIN −0.3 to VCC V
AVE. IO (AVE.) 3.0
Output current A
PEAK IO (PEAK) 4.5 (Note 1)
2.25 (Note 2)
Power dissipation PD W
21.6 (Note 3)
Operating temperature Topr −30 to 85 °C
Storage temperature Tstg −55 to 150 °C

Note 1: t = 100 ms

Note 2: No heat sink

Note 3: TC = 85°C

Electrical Characteristics (VCC = 24 V, VS = 24 V, Ta = 25°C)

Test
Characteristics Symbol circuit Test Condition Min Typ. Max Unit

ICC1 Stop mode ― 6 12

Quiescent current (I)
ICC2 1 Forward/reverse mode ― 20 40 mA
(VCC Line)
ICC3 Brake mode ― 20 40
IS1 Stop mode ― 3 8
Quiescent current (II)
IS2 1 Forward/reverse mode ― 16 40 mA
(VS Line)
IS3 Brake mode ― 3 8
VINL ― ― ― 0.8
Input voltage 2 V
VINH ― 2.0 ― ―
IINL VIN = GND ― ― 12
Input current 2 μA
IINH VIN = VCC ― ― 10
Vsat1 IO = 1.5 A ― 2.1 2.8
Output saturation voltage (Note) 3 V
Vsat2 IO = 3.0 A ― 3.3 4.1
ILU VL = 25 V ― ― 50
Output leakage current 4 μA
ILL VL = 25 V ― ― 50
VFU IF = 3.0 A ― 5.0 ―
Diode forward voltage 5 V
VFL IF = 3.0 A ― 1.5 ―
Thermal shutdown circuit
TSD ― ― ― 150 ― °C
operating temperature
Stand-by current IST 1 ― ― ― 100 μA
tpLH 2 ― ― 1 ―
Propagation delay time μs
tpHL 2 ― ― 1 ―

Note: Upper and lower side total

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Test Circuit 1
IS1, IS2, IS3, ICC1, ICC2, ICC3, IST

TA8429H/HQ

Test Circuit 2
VINH, VINL, IINH, IINL, tpHL, tpLH

TA8429H/HQ

Test Circuit 3
Vsat

TA8429H/HQ

Note 1: Vsat = VSU + VSL

Note 2: Calibrate IO to 1.5/3.0 A by RL

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Test Circuit 4
ILU, ILL

TA8429H/HQ

Test Circuit 5
VFU, VFL

TA8429H/HQ

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Rth (j-a) – tw FOR SINGLE PULSES

IC only
TRANSIENT THERMAL RESISTANCE
Rth (j-a) (°C/W)

PULSE WIDTH tw (s)

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Application Circuit 1

TA8429H/HQ

Application Circuit 2 (Separated standby function)

TA8429H/HQ

Note 1: Insert OFF-TIME (100 μs or more) when the input signal is

switched (between forward and reverse rotation and between
forward/reverse rotation and brake).

Note 2: Connect if required.

Note 3: When turning on the power (VCC/VS), keep both IN1 and IN2
on a low level. Do not switch the inputs (IN1/IN2) before the
VCC/VS reaches its rated value (as shown in Application Circuit
Example 1). If the ST pin is connected to a CPU (Application
Circuit Example 2), turn on the power while ST, IN1, and IN2
are kept on a low level. After this, switch the ST/IN1/IN2.
Note 4: Utmost care is necessary in the design of the output, VCC,
and GND lines since the IC may be destroyed by
short-circuiting between outputs, air contamination faults, or
faults due to improper grounding, or by short-circuiting between
contiguous pins.

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Package Dimensions

Weight: 4.04 g (typ.)

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Notes on Contents

1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.

2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.

3. Timing Charts
Timing charts may be simplified for explanatory purposes.

4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.

5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.

IC Usage Considerations
Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.

[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.

[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.

[4] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.

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Points to remember on handling of ICs

(1) Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect
ICs under all circumstances. If the Over current protection circuits operate against the over current,
clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before
operation. In addition, depending on the method of use and usage conditions, if over current
continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.

(2) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(3) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.

(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.

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