INTEGRATED CIRCUITS

DATA SHEET

SAA3049A
Infrared remote control decoder
Product specification 1996 Sep 13
Supersedes data of 1996 Apr 15
File under Integrated Circuits, IC02
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

FEATURES GENERAL DESCRIPTION

Decodes 64 remote control commands with a maximum The main function of the SAA3049A is to check and
of 32 subaddresses convert the received coded data (RECS80/RC5) into
Accepts RECS80 codes with pulse position modulation latched binary outputs. The device address can be
(SAA3004, SAA3007, SAA3008) or RC5 codes with hard-wired for a particular address, allowing several
bi-phase transmission (SAA3006, SAA3010) devices in one location. Alternatively, received data with
any address can be accepted; the received data and
Suitable for low voltage and low SAA3049A supply
address are then outputs.
current applications
Adding circuitry for binary decoding allows a maximum
of 2048 commands to be used, for example 1-of-16
decoder (HEF4515).

ORDERING INFORMATION

TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
SAA3049AP DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
SAA3049AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1996 Sep 13 2
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SYSTEM DIAGRAM

handbook, full pagewidth command acknowledge

VBatt +5 V VCC
CA bits
A
REMOTE B
CONTROL REMOTE C
TRANSMITTER data
CONTROL D
DECODER
SAA3004 E
SAA3007 F
SAA3008 CQW89A IR IN
or IR BPW50
CQY89A PREAMPLIFIER T0 toggle
SAA3006
SAA3010 SAA3049A
A0 (S0)
A1 (S1)
A2 (S2) address
A3 (S3)
A4

4 MHz MGE374

Remote control transmitters (see individual data sheet for full specification):
SAA3004: VBatt = 4 to 11 V (max.); 7 64 = 448 commands (RECS80 code).
SAA3007: VBatt = 2 to 6.5 V (max.); 20 64 = 1280 commands (RECS80 code).
SAA3008: VBatt = 2 to 6.5 V (max.); 20 64 = 1280 commands (RECS80 code).
SAA3006: VBatt = 2 to 7 V (max.); 32 64 = 2048 commands (RC5 code).
SAA3010: VBatt = 2 to 7 V (max.); 32 64 = 2048 commands (RC5 code).

Fig.1 System diagram.

1996 Sep 13 3
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

PINNING

SYMBOL PIN DESCRIPTION

A 1 data output
B 2 data output
C 3 data output handbook, halfpage
A 1 20 VCC
D 4 data output
E 5 data output B 2 19 CRI

F 6 data output C 3 18 T0

A0 (S0) 7 data/address output/input D 4 17 A2 (S2)

A1 (S1) 8 data/address output/input E 5 16 A3 (S3)
IN 9 digital input SAA3049A
F 6 15 A4
GND 10 ground
A0 (S0) 7 14 RESET
MODE 11 RC5/RECS80 mode selection
A1 (S1) 8 13 XTAL2
XTAL1 12 crystal oscillator
XTAL2 13 crystal oscillator IN 9 12 XTAL1

RESET 14 reset input GND 10 11 MODE

A4 15 address output/input MGD347

A3 (S3) 16 address output/input

A2 (S2) 17 address output/input
T0 18 T0 bit
CRI 19 command received indicator
Fig.2 Pin configuration.
VCC 20 supply voltage

1996 Sep 13 4
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage 0.5 +7 V
VI input voltage any pin 0.5 VCC + 0.5 V
II DC input current any pin 10 mA
IO DC output current any pin 10 mA
Ptot total power dissipation 125 mW
Po power dissipation per output 30 mW
IDD positive supply current 50 +50 mA
ISS negative supply current 100 +50 mA
Tamb operating ambient temperature 40 +85 C
Tstg storage temperature 65 +150 C

HANDLING
Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see Handling MOS Devices).

1996 Sep 13 5
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

CHARACTERISTICS
VCC = 2.5 to 5.5 V; Tamb = 40 to +85 C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply
VCC supply voltage 2.5 5.5 V
ICC supply current VDD = 3 V, 0.3 0.7 mA
fxtal = 4 MHz
Input signals (pin 9)
VIH HIGH level input voltage 0.7VCC VCC V
VIL LOW level input voltage 0 0.3VCC V
Mode selection (pin 11)
VIH HIGH level input voltage 0.7VCC VCC V
VIL LOW level input voltage 0 0.3VCC V
Command received indicator and mode control (pin 19); note 1
VIH HIGH level input voltage 0.7VCC VCC V
VIL LOW level input voltage 0 0.3VCC V
Crystal oscillator
fosc oscillator frequency note 2 4 MHz
Outputs
OPEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3
IOL(sink) LOW level output sink current VCC = 5 V; 1.6 12 mA
VOL = 0.4 V

Notes
1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs.
With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs.
a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series
resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is
acknowledged, can be used to activate (flash) an LED indicator.
2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application.
3. Application as output requires connection of an external pull-up resistor.

1996 Sep 13 6
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

Reset
The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power
supply transients by generating a reset.
The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS,
a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (500 mV accuracy).

handbook, full pagewidth VCC 20

390 1.8 k 1 F SAA3049A

1N4148
zener diode 14
3.6 V
BC548
1N4148 68 k
1 k

MGE375

Fig.3 Proposed improved reset circuit.

Infrared signal input (pin 9) APPLICATION INFORMATION

This pin is sensitive to a negative-going edge. In Fig.5, the circuit shown is for use with transmitters
SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for
Command received indicator (pin 19) RECS80 code.
In Fig.6, the circuit shown is for use with transmitter types
SAA3006 or SAA3010; pin 11 is LOW for RC5 code.

handbook, halfpage
In Fig.7, the decoder is set for the required subaddress by
signal at holding the address pins HIGH or LOW. Pin 11 is HIGH for
pin 19
use with transmitter types SAA3004, SAA3007 or
15 ms SAA3008 (RECS80 code). Pin 11 is LOW for use with
120 ms MGE376
transmitter types SAA3006 or SAA3010 (RC5 code).
The remote control decoder is for up to 32 subaddresses
with 6 + 1-bit parallel outputs (RC5 code).
Fig.4 Output diagram of command acknowledge.

1996 Sep 13 7
 handbook, full pagewidth T0-bit

1996 Sep 13
VCC
command (+5 V)
acknowledge 68 k

1 F 1N4148
Philips Semiconductors

220 D1 S2-bit
CQW24
address
S3-bit outputs
33 5.6 (1)
5.6 k k k
BC548

BC548

4 MHz
subaddress
Infrared remote control decoder

range (2)

8
20 19 18 17 16 15 14 13 12 11

SAA3049A

1 2 3 4 5 6 7 8 9 10

IN

input
S1-bit
address
A B C D E F S0-bit outputs
data outputs MGE377

(1) Only for subaddress 8 to 20.

(2) subaddress range:
when LOW (subaddress 8 to 20) pin 15 is connected to ground
when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.

Fig.5 Remote control decoder with latched 11 (10) -bit parallel outputs [10 (9) -bits inverted].
SAA3049A
Product specification
1996 Sep 13
handbook, full pagewidth T0-bit

VCC
command (+5 V)
acknowledge 68 k
Philips Semiconductors

1 F 1N4148

220 D1
A2-bit
CQW24
A3-bit address
33 5.6 outputs
5.6 k k k A4-bit
BC548

BC548
Infrared remote control decoder

4 MHz

9
20 19 18 17 16 15 14 13 12 11

SAA3049A

1 2 3 4 5 6 7 8 9 10

IN

input
A1-bit
address
A B C D E F A0-bit outputs
data outputs MGE378

Fig.6 Remote control decoder with latched 12 -bit parallel outputs (11 bits inverted).
SAA3049A
Product specification
 handbook, full pagewidth mode
VCC
H selects RECS80 code
command (+5 V) L selects RC5 CODE
68 k

1996 Sep 13
acknowledge
1 F 1N4148
set subaddresses
220 H or L (1)
D1
CQW24
Philips Semiconductors

S2 (A2)
S3 (A3)
33 5.6
5.6 k k k (A4) (2)
BC548
S1 (A1)
68 k S0 (A0)
BC548
for address see
data sheets of
4 MHz transmitter ICs
Infrared remote control decoder

10
20 19 18 17 16 15 14 13 12 11

SAA3049A

1 2 3 4 5 6 7 8 9 10

IN

input
T0 A B C D E F

data outputs MGE379

(1) Address inputs:

when LOW address input pin is connected to ground
when HIGH address input pin is connected via pull-up resistor to VCC.
(2) subaddress range RECS80 code:
when LOW (subaddress 8 to 20) pin 15 is connected to ground
when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to VCC.

Fig.7 Remote control decoder for up to 20 subaddresses with 6 + 1-bit parallel outputs (RECS80 code).
SAA3049A
Product specification
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

PACKAGE OUTLINES

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

D ME
seating plane

A2 A

L A1

c
Z e w M
b1
(e 1)
b
20 11 MH

pin 1 index
E

1 10

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 c D
(1)
E
(1)
e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 0.36 26.92 6.40 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.0
1.30 0.38 0.23 26.54 6.22 3.05 7.80 8.3
0.068 0.021 0.014 1.060 0.25 0.14 0.32 0.39
inches 0.17 0.020 0.13 0.10 0.30 0.01 0.078
0.051 0.015 0.009 1.045 0.24 0.12 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT146-1 SC603
95-05-24

1996 Sep 13 11
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

D E A
X

c
y HE v M A

20 11

Q
A2 A
A1 (A 3)

pin 1 index

Lp
L

1 10 detail X
e w M
bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z
(1)

0.30 2.45 0.49 0.32 13.0 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1 o
0.10 2.25 0.36 0.23 12.6 7.4 10.00 0.4 1.0 0.4 8
0.012 0.096 0.019 0.013 0.51 0.30 0.42 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.49 0.29 0.39 0.016 0.039 0.016

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT163-1 075E04 MS-013AC
95-01-24

1996 Sep 13 12
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt.
Introduction
Dwell times vary between 50 and 300 seconds depending
There is no soldering method that is ideal for all IC on heating method. Typical reflow temperatures range
packages. Wave soldering is often preferred when from 215 to 250 C.
through-hole and surface mounted components are mixed
Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is
the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for
45 C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our IC Package Databook (order code 9398 652 90011).
A double-wave (a turbulent wave with high upward
DIP pressure followed by a smooth laminar wave) soldering
technique should be used.
SOLDERING BY DIPPING OR BY WAVE
The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is parallel to the solder flow.
260 C; solder at this temperature must not be in contact The package footprint must incorporate solder thieves at
with the joint for more than 5 seconds. The total contact the downstream end.
time of successive solder waves must not exceed
5 seconds. During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe
the temperature of the plastic body must not exceed the dispensing. The package can be soldered after the
specified maximum storage temperature (Tstg max). If the adhesive is cured.
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260 C, and
temperature within the permissible limit. maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 C within
REPAIRING SOLDERED JOINTS 6 seconds. Typical dwell time is 4 seconds at 250 C.

Apply a low voltage soldering iron (less than 24 V) to the A mildly-activated flux will eliminate the need for removal
lead(s) of the package, below the seating plane or not of corrosive residues in most applications.
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in REPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is Fix the component by first soldering two diagonally-
between 300 and 400 C, contact may be up to 5 seconds. opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO time must be limited to 10 seconds at up to 300 C. When
REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO 270 and 320 C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Sep 13 13
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Sep 13 14
Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

NOTES

1996 Sep 13 15
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Philips Electronics N.V. 1996 SCA51

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 537021/25/02/pp16 Date of release: 1996 Sep 13 Document order number: 9397 750 01145
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