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bq21040
SLUSCE2A APRIL 2016 REVISED MAY 2016

bq21040 0.8-A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
1 Features 3 Description
1 Charging The bq21040 device is a highly integrated Li-Ion and
Li-Pol linear battery charger device targeted at space-
1% Charge Voltage Accuracy limited portable applications. The device operates
10% Charge Current Accuracy from either a USB port or AC adapter. The high input
Low Battery Leakage Current (1 A) voltage range with input overvoltage protection
supports low-cost unregulated adapters.
Programmable Charge Current using External
Resistor up to 800 mA The bq21040 has a single power output that charges
4.2-V Li-Ion and Li-Pol Charger the battery. A system load can be placed in parallel
with the battery as long as the average system load
Protection does not keep the battery from charging fully during
30-V Input Rating; with 6.6-V Input the 10 hour safety timer.
Overvoltage Protection
The battery is charged in three phases: conditioning,
Input Voltage Dynamic Power Management constant current and constant voltage. In all charge
125C Thermal Regulation; 150C Thermal phases, an internal control loop monitors the IC
Shutdown Protection junction temperature and reduces the charge current
if an internal temperature threshold is exceeded.
OUT Short-Circuit Protection and ISET Short
Detection The charger power stage and charge current sense
Overtemperature Sensing Protection Through functions are fully integrated. The charger function
has high accuracy current and voltage regulation
NTC
loops, charge status display, and charge termination.
Fixed 10-Hour Safety Timer The pre-charge current and termination current
System threshold are fixed to 20% and 10%, respectively.
Status Indication Charging/Done The fast charge current value is programmable
through an external resistor.
Available in Small SOT-23 Package
Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
EPOS bq21040 SOT-23 (6) 3.00 mm 1.75 mm
Medical Endoscopes (1) For all available packages, see the orderable addendum at
BLE Speaker and Headsets the end of the data sheet.

Low-Power Handheld Devices

Simplified Schematic
bq21040

VIN
VIN VOUT
BAT PACK+ System
1 F Load
TEMP 1 F
+ RCHG

ISET TS NTC
RISET RTS PACK

GND CHG

Copyright 2016, Texas Instruments Incorporated

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ......................................... 9
2 Applications ........................................................... 1 8.3 Feature Description................................................. 10
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 13
4 Revision History..................................................... 2 9 Application and Implementation ........................ 17
9.1 Application Information............................................ 17
5 Device Comparison ............................................... 3
9.2 Typical Application .................................................. 17
6 Pin Configuration and Functions ......................... 3
10 Power Supply Recommendations ..................... 22
7 Specifications......................................................... 3
7.1 Absolute Maximum Ratings ...................................... 3 11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
7.2 ESD Ratings.............................................................. 4
11.2 Layout Example .................................................... 22
7.3 Recommended Operating Conditions....................... 4
11.3 Thermal Considerations ........................................ 23
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 4 12 Device and Documentation Support ................. 24
7.6 Timing Requirements ................................................ 6 12.1 Community Resources.......................................... 24
7.7 Typical Operational Characteristics (Protection 12.2 Trademarks ........................................................... 24
Circuits Waveforms)................................................... 7 12.3 Electrostatic Discharge Caution ............................ 24
8 Detailed Description .............................................. 8 12.4 Glossary ................................................................ 24
8.1 Overview ................................................................... 8 13 Mechanical, Packaging, and Orderable
Information ........................................................... 24

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (April 2016) to Revision A Page

Changed from Product Preview to Production Data .............................................................................................................. 1

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5 Device Comparison

PART NO. VO(REG) VOVP TS PACKAGE

bq21040 4.20 V 6.6 V TS 3.00 mm 1.75 mm 1.45 mm SOT-23

6 Pin Configuration and Functions

DBV Package
6-Pin SOT-23
Top View

TS 1 6 VIN

OUT 2 5 GND

CHG 3 4 ISET

Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
Low (FET on) indicates charging and Open Drain (FET off) indicates no Charging or Charge
CHG 3 O
complete.
GND 5 Ground terminal
Programs the Fast-charge current setting. External resistor from ISET to VSS defines fast charge
ISET 4 I
current value. Range is 10.8k (50mA) to 675 (800mA).
Battery connection. System load may be connected. Expected range of bypass capacitors 1F to
OUT 2 O
10F.
Temperature sense terminal connected to bq21040 -10k at 25C NTC thermistor, in the battery
pack. Floating T terminal or pulling High puts part in TTDM Charger Mode and disable TS
TS 1 I monitoring, Timers and Termination. Pulling terminal Low disables the IC. If NTC sensing is not
needed, connect this terminal to VSS through an external 10 k resistor. A 250k from TS to
ground will prevent IC entering TTDM mode when battery with thermistor is removed.
Input power, connected to external DC supply (AC adapter or USB port). Expected range of
VIN 6 I
bypass capacitors 1F to 10F, connect from IN to VSS.

7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)

MIN MAX UNIT

IN (with respect to VSS) 0.3 30 V
Input voltage OUT (with respect to VSS) 0.3 7 V
PRE-TERM, ISET, ISET2, TS, /CHG (with respect to VSS) 0.3 7 V
Input current IN 1.25 A
Output current (continuous) OUT 1.25 A
Output sink current CHG 15 mA
Junction temperature, TJ 40 150 C
Storage temperature, Tstg 65 150 C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.

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7.2 ESD Ratings

VALUE UNIT
Electrostatic Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 1000
V(ESD) V
discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (1) 250

(1) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
IN voltage range 3.5 28 V
VIN
IN operating voltage range, restricted by VDPM and VOVP 4.45 6.45 V
IIN Input current, IN terminal 0.8 A
IOUT Current, OUT terminal 0.8 A
TJ Junction temperature 0 125 C
RISET Fast-charge current programming resistor 0.675 10.8 k
RTS 10k NTC thermistor range without entering TTDM 1.66 25.8 k

7.4 Thermal Information

bq21040
THERMAL METRIC (1) DBV (SOT-23) UNIT
6 PINS
RJA Junction-to-ambient thermal resistance 130.8 C/W
RJC(top) Junction-to-case (top) thermal resistance 75.2 C/W
RJB Junction-to-board thermal resistance 45.5 C/W
JT Junction-to-top characterization parameter 31.8 C/W
JB Junction-to-board characterization parameter 45.5 C/W
RJC(bot) Junction-to-case (bottom) thermal resistance n/a C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
UVLO Undervoltage lockout exit VIN: 0 V to 4 V 3.15 3.3 3.45 V
VIN: 0 V to 4 V, VUVLO_FALL =
VHYS-UVLO Hysteresis on VUVLO_RISE falling 175 227 280 mV
VUVLO_RISE VHYS-UVLO
Input power good detection (Input power good if VIN > VOUT + VIN-
VIN-DT 30 80 145 mV
threshold is VOUT+VIN-DT DT); VOUT = 3.6 V, VIN: 3.5 V to 4 V
VHYS-INDT Hysteresis on VIN-DT falling VOUT = 3.6 V, VIN: 4 V to 3.5 V 31 mV
Input overvoltage protection
VOVP VIN: 5 V to 12 V 6.5 6.65 6.8 V
threshold
VHYS-OVP Hysteresis on OVP VIN: 11 V to 5 V 95 mV
Adaptor low input voltage Feature active in adaptor mode; Limit
VIN-DPM protection. Restricts lout at VIN- Input Current to 50 mA; VOUT = 3.5 V; 4.24 4.3 4.46 V
DPM RISET = 825
ISET SHORT CIRCUIT TEST
Highest resistance considered a
RISET: 250 to 540 , Iout latches off.
RISET_SHORT fault (short). Monitored for 500
Cycle power to reset
IOUT>90mA
Maximum OUT current limit VIN = 5 V, VOUT = 3.6 V, RISET: 250 to
IOUT_CL 1.05 1.4 A
regulation (clamp) 540 , Iout latches off after tDGL-SHORT

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Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BATTERY SHORT PROTECTION
OUT terminal short-circuit detection
VOUT(SC) Vout:3V to 0.5V, no deglitch 0.75 0.8 0.85 V
threshold/precharge threshold
Recovery VOUT(SC) + VOUT(SC-HYS);
VOUT(SC-HYS) OUT terminal short hysteresis 77 mV
Rising, no deglitch
Source current to OUT terminal
IOUT(SC) 10 15 20 mA
during short-circuit detection
QUIESCENT CURRENT
IOUT(PDWN) Battery current into OUT terminal VIN = 0V 1 A
OUT pin current, charging VIN = 6 V, VBAT > VBAT(REG), net current
IOUT(DONE) 6 A
terminated is into OUT pin
IIN(STDBY) Standby current into IN pin TS = Low, VIN 6 V 125 A
TS = Low, VIN = 6 V, no load on OUT
ICC Active supply current, IN pin 1000 A
pin, VBAT > VBAT(REG)
BATTERY CHARGER FAST-CHARGE
VOUT(REG) Battery regulation voltage VREG = 4.2 V, IL = 25 mA, VIN = 5.5 V 4.16 4.2 4.23 V
Programmed output fast charge VOUT(REG) > VOUT > VLOWV; VIN = 5 V,
IOUT(RANGE) 10 800 mA
current range RISET = 0.675 to 52 k
Adjust VIN down until IOUT = 0.5 A, VOUT
VDO(IN-OUT) Drop-Out, VIN VOUT 325 550 mV
= 4.15 V, RISET = 1.08k
KISET/ KISET/ KISET/
IOUT Output fast charge formula VOUT(REG) > VOUT > VLOWV; VIN = 5 V A
RISET RISET RISET
RISET = KISET / IOUT; 50 < IOUT < 800
510 540 570
mA
KISET Fast charge current factor A
RISET = KISET / IOUT; 25< IOUT < 50 mA 480 527 600
RISET = KISET / IOUT; 10 < IOUT < 25 mA 350 520 680
PRECHARGE
Pre-charge to fast-charge transition
VLOWV 2.4 2.5 2.6 V
threshold
Pre-charge Default pre-charge current VBAT < VLOWV, ICHG = 50 mA 18 20 22 %ISET
TERMINATION
Termination Threshold Current, %IOUT-
%TERM VOUT > VRCH; RISET = 1 k 9 10 11
default setting CC
RECHARGE OR REFRESH
VIN = 5 V, VTS = 0.5 V, VOUT = 4.25 V to VO(REG) - VO(REG) - VO(REG) -
VRCH Recharge detection threshold mV
VRCH 120 mV 95 mV 70 mV
BATT DETECT
VOUT Reduced regulation during VO(REG) - VO(REG) - VO(REG) -
VREG-BD mV
battery detect VIN = 5 V, VTS = 0.5 V, battery absent 450 mV 400 mV 350 mV
IBD-SINK Sink current during VREG-BD 7 10 mA
VO(REG) - VO(REG) - VO(REG) -
VBD-HI High battery detection threshold V
150 mV 100 mV 50 mV
VIN = 5 V, VTS = 0.5 V, battery absent
VREG- VREG- VREG-
VBD-LO Low battery detection threshold V
BD+0.50 BD+0.1 BD+0.15
BATTERY-PACK NTC MONITOR
INTC 50A NTC bias current 48 50 53 A
10K NTC bias current when
INTC-DIS-10K VTS = 0 V 27 30 34 A
charging is disabled
INTC is reduced prior to entering
INTC-FLDBK -10K TTDM to keep cold thermistor from VTS = 1.525 V 4 5 6.5 A
entering TTDM

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Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Termination and timer disable
VTTDM(TS) VTS: 0.5 V to 1.7 V; timer held in reset 1550 1600 1650 mV
mode-Threshold-Enter
IHYS-TTDM(TS) Hysteresis exiting TTDM VTS: 1.7 V to 0.5 V; timer enabled 100 mV
VCLAMP(TS) TS maximum voltage clamp VTS = Open (float) 1800 1950 2000 mV
TS voltage where INTC is reduce to INTC adjustment (90 to 10%; 45 to 6.6
VTS_I-FLDBK keep thermistor from entering s) takes place near this spec 1475 mV
TTDM threshold. VTS: 1.425 V to 1.525 V
CTS Optional capacitance ESD 0.22 F
Low temperature charging to pending;
VTS-0C Low temperature CHG pending 1220 1250 1280 mV
VTS: 1 V to 1.5 V
Charge pending to low temperature
VHYS-0C Hysteresis at 0C 100 mV
charging; VTS: 1.5 V to 1 V
High temperature charging to pending;
VTS-45C High temperature CHG disable 260 275 290 mV
VTS: 0.5 V to 0.2 V
Charge pending to high temperature
VHYS-45C Hysteresis at 45C 20 mV
charging; VTS: 0.2 V to 0.5 V
VTS-EN-10K Charge enable threshold (10k NTC) VTS: 0 V to 0.175 V 80 88 96 mV
HYS below VTS-EN-10k to disable
VTS-DIS_HYS-10K VTS: 0.125 V to 0 V 12 mV
(10k NTC)
THERMAL REGULATION
TJ(REG) Temperature regulation limit 125
TJ(OFF) Thermal shutdown temperature 155 C
TJ(OFF-HYS) Thermal shutdown hysteresis 20
CHG INDICATION
Output Low Voltage-CHG FET on -
VOL ISINK = 5 mA 0.4 V
first charge after power-up
ILEAK Leakage current into IC V CHG = 5 V 1 A

7.6 Timing Requirements

MIN NOM MAX UNIT
INPUT
tDGL(OVP_SET) Input over-voltage blanking time VIN: 5 V to 12 V 113 s
tDGL(OVP_REC) Deglitch time exiting OVP Time measured from VIN: 12V to 5V 30 s
ISET SHORT CIRCUIT TEST
Deglitch time transition from ISET short Clear fault by disconnecting IN or cycling
tDGL_SHORT 1 ms
to IOUT disable (high / low) TS
PRECHARGE SET INTERNALLY
Deglitch time on pre-charge to fast-
tDGL1(LOWV) 70 s
charge transition
Deglitch time on fast-charge to pre-
tDGL2(LOWV) 32 ms
charge transition
TERMINATION
tDGL(TERM) Deglitch time, termination detected 29 ms
RECHARGE OR REFRESH
Deglitch time, recharge threshold VIN = 5 V, VTS = 0.5 V, VOUT: 4.25 V to 3.5
tDGL1(RCHG) 29 ms
detected V in 1 s; tDGL(RCHG) is time to ISET ramp
BATTERY DETECT ROUTINE
tDGL(HI/LOW REG) Regulation time at VREG or VREG-BD 25 ms
BATTERY-PACK NTC MONITOR; TS TERMINAL
tDGL(TS) Deglitch for TS thresholds: 0/45C. Battery charging 30 ms

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7.7 Typical Operational Characteristics (Protection Circuits Waveforms)

SETUP: bq21040 typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)

546 4.212
VO at 0C ROUT = 100
Kiset
544 4.21

VOUT - Output Voltage DC - V

542 4.208

540 Low to High Currents

(may occur in recharge to fast charge transion) 4.206 VO at 25C
Kiset - W

538
4.204
High to Low Currents
536
(may occur in Voltage Regulation - Taper Current) VO at 85C
4.202
534
4.2
532

530 4.198

528 4.196
0 .15 0.2 0.4 0.6 0.8 4.5 5 5.5 6 6.5
IO - Output Current - A VI - Input Voltage DC - V

Figure 1. Kiset for Low and High Currents Figure 2. Line Regulation

4.2 4.352
VREG at 0C
4.199
Vreg at 25C 4.35

4.198
VOUT - Output Voltage - V

VREG at 25C
VREG - Voltage - V

Vreg at 85C 4.348

4.197
VREG at 85C

4.196 4.346
VREG at 125C
4.195 Vreg at 0C
4.344

4.194
4.342
4.193

4.192 4.34
0 100 200 300 400 500 600 700 800 900
0 0.2 0.4 0.6 0.8 1
IO - Output current - A ILOAD - Current - mA

Figure 3. Load Regulation Over Temperature Figure 4. Load Regulation

4.3450 363.4

363.2
4.3445
IO at 25C
VREG at 0C 363
IO - Output Current - mA

4.3440
VOUT - Output Voltage - V

362.8
4.3435
VREG at 25C 362.6 IO at 85C

4.3430
362.4

4.3425
362.2 IO at 0C
VREG at 25C
4.3420 362

4.3415 361.8
4.5 5 5.5 6 6.5 7 2.5 3 3.5 4 4.5
VIN - Input Voltage - V VO - Output Voltage - V
Figure 5. Line Regulation Figure 6. Current Regulation Over Temperature

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8 Detailed Description

8.1 Overview
The bq21040 is a highly integrated single cell Li-Ion and Li-Pol charger. The charger can be used to charge a
battery, power a system or both. The charger has three phases of charging: Pre-charge to recover a fully
discharged battery, fast-charge constant current to supply the buck charge safely and voltage regulation to safely
reach full capacity. The charger is very flexible, allowing programming of the fast-charge current. This charger is
designed to work with a USB connection or Adaptor (DC out). The charger also checks to see if a battery is
present.
The charger also comes with a full set of safety features: Temperature Sensing Standard, Over-Voltage
Protection, DPM-IN, Safety Timers, and ISET short protection. All of these features and more are described in
detail below.
The charger is designed for a single power path from the input to the output to charge a single cell Li-Ion or
Li-Pol battery pack. Upon application of a 5VDC power source the ISET and OUT short checks are performed to
assure a proper charge cycle.
If the battery voltage is below the LOWV threshold, the battery is considered discharged and a preconditioning
cycle begins. The amount of the current goes into the battery during this phase is called pre-charge current. It is
fixed to 20% of the fast charge current.
Once the battery voltage has charged to the VLOWV threshold, fast charge is initiated and the fast charge
current is applied. The fast charge constant current is programmed using the ISET terminal. The constant current
provides the bulk of the charge. Power dissipation in the IC is greatest in fast charge with a lower battery voltage.
If the IC reaches 125C the IC enters thermal regulation, slows the timer clock by half and reduce the charge
current as needed to keep the temperature from rising any further. Figure 7 shows the charging profile with
thermal regulation. Typically under normal operating conditions, the ICs junction temperature is less than 125C
and thermal regulation is not entered.
Once the cell has charged to the regulation voltage the voltage loop takes control and holds the battery at the
regulation voltage until the current tapers to the termination threshold. The termination current is set to 10% of
the fast charge current. The CHG terminal is low (LED on) during the first charge cycle only and turns off once
the termination threshold is reached, regardless if termination, for charge current, is enabled or disabled.

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8.2 Functional Block Diagram

Internal Charge Current Sense

w/Multiple Outputs

IN OUT

+
-
80 mV
Input
Power IN -
OUT
+ Detect +
OUT IN,DPM + VO,REG
- -
Charge
IOUT x 1.5V Pump TjC
540 A -
Fast Charge
125 CREF
ISET Pre-Charge
+
IN
+

1.5V -
Pre-CHG Reference

75uA
Term Reference TjC
+ +
_ 150 CREF _
Thermal Shutdown Charge
Pump
+
IN +
X2 Gain (1:2)
_ Term: Pre-CHGX2 _
OVPREF
CHG

On During 1st
Charge Only
VREF_0C_COLD _ ON
TS_0C
+ OFF:

CHARGE
CONTROL
VREF_45C_HOT _ TS_45C
+

_ TTDM MODE

TS +
VTTDM
TS Cold Temperature TS Disable
Sink Current Sink Current
45uA VCLAMP 20uA +
+
_ _
5uA 45uA

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8.3 Feature Description

Pre- Thermal Current Voltage Regulation and
Conditioning Regulation Regulation Charge Termination DONE
Phase Phase Phase Phase
VO(REG)

IO(OUT)

Battery Current,
FAST-CHARGE
I(OUT)
CURRENT
Battery
Voltage,
V(OUT) Charge
PRE-CHARGE Complete
CURRENT AND VO(LOWV) Status,
TERMINATION Charger
THRESHOLD Off

I(TERM)
IO(PRECHG)

T(THREG)
0A
Temperature, Tj

T(CHG) DONE
T(PRECHG)

Figure 7. Charging Profile With Thermal Regulation

8.3.1 Power-Down or Undervoltage Lockout (UVLO)

The bq21040 is in power-down mode if the IN terminal voltage is less than UVLO. The part is considered dead
and all the terminals are high impedance. Once the IN voltage rises above the UVLO threshold the IC will enter
Sleep Mode or Active mode depending on the OUT terminal (battery) voltage.

8.3.2 Power-up
The IC is alive after the IN voltage ramps above UVLO (see sleep mode), resets all logic and timers, and starts
to perform many of the continuous monitoring routines. Typically the input voltage quickly rises through the
UVLO and sleep states where the IC declares power good, starts the qualification charge at 100mA starts the
safety timer and enables the CHG terminal. See Figure 8.

8.3.3 Sleep Mode

If the IN terminal voltage is between than VOUT+VDT and UVLO, the charge current is disabled, the safety timer
counting stops (not reset) and the CHG terminal is high impedance. As the input voltage rises and the charger
exits sleep mode, the safety timer continues to count, charge is enabled and the CHG terminal returns to its
previous state. See Figure 9.

8.3.4 New Charge Cycle

A new charge cycle is started when a good power source is applied, performing a chip disable/enable (TS
terminal), exiting Termination and Timer Disable Mode (TTDM), detecting a battery insertion or the OUT voltage
dropping below the VRCH threshold. The CHG terminal is active low only during the first charge cycle, therefore
exiting TTDM or a dropping below VRCH will not turn on the CHG terminal FET, if the CHG terminal is already
high impedance.

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VSS
4.06 V 4.06 V
1.8V HOT HOT Cold Normal
Operation Operation Operation LDO Operation Normal
Disabled Normal HOT Normal Cold Cold Cold LDO
Disabled Mode Operation
Operation Fault Operation Fault Fault Operation Mode
tDGL(TTDM) tDGL(TTDM)
Enter t < tDGL(IS) Enter
tDGL(TTDM)
Exit
LDO

LDOHYS t < tDGL(TTDM)

Exit

tDGL(TS) tDGL(TS) tDGL(TS1_IOC)

Cold to Normal
0C
0CHYS
tDGL(TS_IOC)
Rising

tDGL(TS_IOC)
Falling
10C
10CHYS
tDGL(TS)

tDGL(TS) tDGL(TS)

45CHYS

45C
tDGL(TS)

tDGL(TS)

60CHYS
Dots Show Threshold Trip Points
60C fllowed by a deglitch time before
transitioning into a new mode.

EN
DISHYS

0V
Drawing Not to Scale t

A. JEITA timing does not apply to bq21040

Figure 8. TS Battery Temperature Bias Threshold and Deglitch Timers

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Apply Input
Power

Is power good? No
VBAT + VDT < VOVP &
VUVLO < VIN

Yes

Is chip enabled? No
VTS > VEN

Yes

Set the Current Limit to 100 mA

and Start Charge Perform ISET &
OUT short tests

Yes

Set the charge current based on

ISET

Yes

Return to Charge

Figure 9. bq21040 Power-Up Flow Diagram

8.3.5 Overvoltage-Protection (OVP) Continuously Monitored

If the input source applies an overvoltage, the pass FET, if previously on, turns off after a deglitch, tBLK(OVP). The
timer ends and the CHG terminal goes to a high impedance state. After the overvoltage returns to a normal
voltage, the timer continues, charge continues, and the CHG terminal goes low after a 25ms deglitch.

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8.3.6 CHG Terminal Indication

The charge terminal has an internal open drain FET which is on (pulls down to VSS) during the first charge only
(independent of TTDM) and is turned off once the battery reaches voltage regulation and the charge current
tapers to the termination threshold set by the PRE-TERM resistor. The bq21040 does not terminate charge,
however, the CHG terminal will turn off once the battery current reaches 10% of the programmed charge current.
The charge terminal is high impedance in sleep mode and OVP and returns to its previous state once the
condition is removed.
Cycling input power, pulling the TS terminal low and releasing or entering pre-charge mode causes the CHG
terminal to go reset (go low if power is good and a discharged battery is attached) and is considered the start of
a first charge.

8.4 Device Functional Modes

8.4.1 CHG LED Pull-up Source
For host monitoring, a pullup resistor is used between the STATUS terminal and the VCC of the host and for a
visual indication a resistor in series with an LED is connected between the STATUS terminal and a power
source. If the CHG source is capable of exceeding 7 V, a 6.2-V Zener should be used to clamp the voltage. If the
source is the OUT terminal, note that as the battery changes voltage, and the brightness of the LEDs vary.

Table 1. Charging States and CHG LED

CHARGING STATE CHG FET/LED
First charge after VIN applied ON
Refresh charge
OVP OFF
SLEEP
TEMP FAULT ON for 1st Charge

8.4.2 IN-DPM (VIN-DPM or IN-DPM)

The IN-DPM feature is used to detect an input source voltage that is folding back (voltage dropping), reaching its
current limit due to excessive load. When the input voltage drops to the VIN-DPM threshold the internal pass FET
starts to reduce the current until there is no further drop in voltage at the input. This would prevent a source with
voltage less than VIN-DPM to power the out terminal. This works well with current limited adaptors and USB ports
as long as the nominal voltage is above 4.3 V. This is an added safety feature that helps protect the source from
excessive loads.

8.4.3 OUT
The Chargers OUT terminal provides current to the battery and to the system, if present. This IC can be used to
charge the battery plus power the system, charge just the battery or just power the system (TTDM) assuming the
loads do not exceed the available current. The OUT terminal is a current limited source and is inherently
protected against shorts. If the system load ever exceeds the output programmed current threshold, the output
will be discharged unless there is sufficient capacitance or a charged battery present to supplement the
excessive load.

8.4.4 ISET
An external resistor is used to Program the Output Current (50 to 800 mA) and can be used as a current monitor.
RISET = KISET / IOUT
where
IOUT is the desired fast charge current;
KISET is a gain factor found in the electrical specification (1)
For greater accuracy at lower currents, part of the sense FET is disabled to give better resolution. Figure 1
shows the transition from low current to higher current. Going from higher currents to low currents, there is
hysteresis and the transition occurs around 0.15 A.

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The ISET resistor is short protected and will detect a resistance lower than 340 . The detection requires at
least 80mA of output current. If a short is detected, then the IC will latch off and can only be reset by cycling the
power. The OUT current is internally clamped to a maximum current between 1.05 A and 1.4 A and is
independent of the ISET short detection circuitry, as shown in Figure 10. Also, see Figure 25 and Figure 26.

IOUT Fault min - max

1.8

IOUT Clamp min - max

1.6

1.4
IO - Output Current - A

IOUT Internal Clamp Range

1.2

0.8
max IOUT Programmed
0.6
ISET Short
0.4 Fault
Range
min Non Restricted
0.2 Operating Area

0
100 1000 10000
ISET - W

Figure 10. Programmed/Clamped Out Current

8.4.5 TS
The TS function is designed to follow the temperature sensing standard for Li-Ion and Li-Pol batteries. There are
two thresholds, 45C and 0C. Normal operation occurs between 0C and 45C.
The TS feature is implemented using an internal 50A current source to bias the thermistor (designed for use
with a 10k NTC = 3370 (SEMITEC 103AT-2 or Mitsubishi TH05-3H103F) connected from the TS terminal to
VSS. If this feature is not needed, a fixed 10k can be placed between TS and VSS to allow normal operation.
This may be done if the host is monitoring the thermistor and then the host would determine when to pull the TS
terminal low to disable charge.
The TS terminal has two additional features, when the TS terminal is pulled low or floated/driven high. A low
disables charge (similar to a high on the BAT_EN feature) and a high puts the charger in TTDM.
Above 45C or below 0C the charge is disabled. Once the thermistor reaches 10C the TS current folds back
to keep a cold thermistor (between 10C and 50C) from placing the IC in the TTDM mode. If the TS terminal
is pulled low into disable mode, the current is reduce to 30A, see Figure 8. Since the ITS curent is fixed along
with the temperature thresholds, it is not possible to use thermistor values other than the 10k NTC (at 25C).

8.4.6 Termination and Timer Disable Mode (TTDM) - TS Terminal High

The battery charger is in TTDM when the TS terminal goes high from removing the thermistor (removing battery
pack/floating the TS terminal) or by pulling the TS terminal up to the TTDM threshold.
When entering TTDM, the 10 hour safety timer is held in reset and termination is disabled. A battery detect
routine is run to see if the battery was removed or not. If the battery was removed then the CHG terminal will go
to its high impedance state if not already there. If a battery is detected the CHG terminal does not change states
until the current tapers to the termination threshold, where the CHG terminal goes to its high impedance state if
not already there (the regulated output will remain on).
The charging profile does not change (still has pre-charge, fast-charge constant current and constant voltage
modes). This implies the battery is still charged safely and the current is allowed to taper to zero.

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When coming out of TTDM, the battery detect routine is run and if a battery is detected, then a new charge cycle
begins and the CHG LED turns on.
If TTDM is not desired upon removing the battery with the thermistor, one can add a 237k resistor between TS
and VSS to disable TTDM. This keeps the current source from driving the TS terminal into TTDM. This creates
0.1C error at hot and a 3C error at cold.

8.4.7 Timers
The pre-charge timer is set to 30 minutes. The pre-charge current, can be programmed to off-set any system
load, making sure that the 30 minutes is adequate. The bq21040 does not have a safety timer.
The fast charge timer is fixed at 10 hours and can be increased real time by going into thermal regulation, IN-
DPM or if in USB current limit. The timer clock slows by a factor of 2, resulting in a clock than counts half as fast
when in these modes. If either the 30 minute or ten hour timer times out, the charging is terminated and the CHG
terminal goes high impedance if not already in that state. The fast charge timer is reset by disabling the IC,
cycling power or going into and out of TTDM.

8.4.8 Termination
Once the OUT terminal goes above VRCH, (reaches voltage regulation) and the current tapers down to the
termination threshold (10% of the fast charge current), the CHG terminal goes high impedance and a battery
detect route is run to determine if the battery was removed or the battery is full. If the battery is present, the
charge current will terminate. If the battery was removed along with the thermistor, then the TS terminal is driven
high and the charge enters TTDM. If the battery was removed and the TS terminal is held in the active region,
then the battery detect routine will continue until a battery is inserted.

8.4.9 Battery Detect Routine

The battery detect routine should check for a missing battery while keeping the OUT terminal at a useable
voltage. Whenever the battery is missing the CHG terminal should be high impedance.
The battery detect routine is run when entering and exiting TTDM to verify if battery is present, or run all the time
if battery is missing and not in TTDM. On power-up, if battery voltage is greater than VRCH threshold, a battery
detect routine is run to determine if a battery is present.
The battery detect routine is disabled while the IC is in TTDM, or has a TS fault. See Figure 11 for the Battery
Detect Flow Diagram.

8.4.10 Refresh Threshold

After termination, if the OUT terminal voltage drops to VRCH (100mV below regulation) then a new charge is
initiated, but the CHG terminal remains at a high impedance (off).

8.4.11 Starting a Charge on a Full Battery

The termination threshold is raised by 14%, for the first minute of a charge cycle so if a full battery is removed
and reinserted or a new charge cycle is initiated, that the new charge terminates (less than 1 minute). Batteries
that have relaxed many hours may take several minutes to taper to the termination threshold and terminate
charge.

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Start
BATT_DETECT

Start 25ms timer

No
Timer Expired?

Yes

Yes Battery Present

Is VOUT<VREG-100mV? Turn off Sink Current
Return to flow

No

Set OUT REG

to VREG-400mV
Enable sink current
Reset & Start 25ms timer

No
Timer Expired?

Yes

Yes Battery Present

Is VOUT>VREG-300mV? Turn off Sink Current
Return to flow

No

Battery Absent
Dont Signal Charge
Turn off Sink Current
Return to Flow

Figure 11. Battery Detect Routine (bq21040)

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9 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information

The bq21040 device is a highly integrated Li-Ion and Li-Pol linear charger device targeted at space-limited
portable applications. The device operates from either a USB port or AC adapter. The high input voltage range
with input overvoltage protection supports low-cost unregulated adapters. This device has a single power output
that charges the battery. A system load can be placed in parallel with the battery as long as the average system
load does not keep the battery from charging fully during the 10 hour safety timer.

9.2 Typical Application

IOUT_FAST_CHG = 540mA; IOUT_PRE_CHG = 108mA; IOUT_TERM = 54mA
bq21040

VIN
VIN VOUT
BAT PACK+ System
1 F Load
TEMP 1 F
+ RCHG

ISET TS NTC
RISET RTS PACK

GND CHG

Copyright 2016, Texas Instruments Incorporated

Figure 12. Typical Application Circuit

9.2.1 Design Requirements

Supply voltage = 5 V
Fast charge current: IOUT-FC = 540 mA; ISET-terminal 2
Termination Current Threshold: %IOUT-FC = 10% of Fast Charge or about 54mA
Pre-Charge Current by default is twice the termination Current or about 108mA
TS Battery Temperature Sense = 10k NTC (103AT)

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Typical Application (continued)

9.2.2 Detailed Design Procedure

9.2.2.1 Calculations

9.2.2.1.1 Program the Fast Charge Current, ISET:

RISET = [K(ISET) / I(OUT)] (2)
From the Electrical Characteristics table:
K(SET) = 540A
RISET = [540A/0.54A] = 1.0 k
Selecting the closest standard value, use a 1.0 k resistor between ISET (terminal 16) and Vss.

9.2.2.1.2 Pre-Charge and Termination Current Thresholds, ITERM, and PRE-CHG

TERM = I(OUT) 10%IOUT-FC (3)
TERM = 540mA 10% = 54mA (4)
One can calculate the pre-charge current by using 20% of the fast charge current (factor of 2 difference).
PRE-Charge = I(OUT) 20%IOUT-FC (5)
PRE-Charge = 540mA 20% = 108mA (6)

9.2.2.1.3 TS Function
Use a 10k NTC thermistor in the battery pack (103AT).
To Disable the temp sense function, use a fixed 10k resistor between the TS (terminal 1) and Vss.

9.2.2.1.4 CHG
LED Status: connect a 1.5k resistor in series with a LED between the OUT terminal and the CHG terminal.
Processor Monitoring: Connect a pull-up resistor between the processors power rail and the CHG terminal.

9.2.2.2 Selecting In and Out Terminal Capacitors

In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power terminal,
input and output terminals. Using the values shown on the application diagram, is recommended. After
evaluation of these voltage signals with real system operational conditions, one can determine if capacitance
values can be adjusted toward the minimum recommended values (DC load application) or higher values for fast
high amplitude pulsed load applications. Note if designed for high input voltage sources (bad adaptors or wrong
adaptors), the capacitor needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values
so a 16V capacitor may be adequate for a 30V transient (verify tested rating with capacitor manufacturer).

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Typical Application (continued)

9.2.3 Application Curves
SETUP: bq21040 typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)

Figure 13. Power-Up Timing Figure 14. Power-Up Timing No Battery or Load in TTDM

Figure 15. Start-Up in Thermal Regulation Figure 16. TS Entering and Leaving Cold Temperature

Figure 17. OVP 8-V Adaptor Hot Plug Figure 18. OVP From Normal Power-Up
Operation VIN 0 V 6 V 7 V 6 V 0 V

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Typical Application (continued)

. Fixed 10k resistor, between TS and GND.

Figure 19. TS Enable and Disable Figure 20. Power-Up Timing with No Battery and No
Load Battery Detection

Figure 21. Battery Removal GND Removed 1st, 42- Figure 22. Battery Removal With OUT and
Load TS Disconnect 1st, With 100- Load

Continuous battery detection when not in TTDM CH4: IOUT (1A/Div)

Battery voltage swept from 0V to 4.25V to 3.9V.

Figure 23. Battery Removal With Fixed TS = 0.5 V Figure 24. Battery Charge Profile

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Typical Application (continued)

CH4: IOUT (1A/Div) CH4: IOUT (0.2A/Div)

Figure 25. ISET Shorted During Normal Operation Figure 26. ISET Shorted Prior to USB Power-up

CH4: IOUT (0.2A/Div)

Figure 27. DPM Adaptor Current Limits VIN Regulated Figure 28. DPM USB Current Limits VIN Regulated to
4.4 V

The IC temperature rises to 125C and enters thermal

regulation. Charge current is reduced to regulate the IC at
125C. VIN is reduced, the IC temperature drops, the charge
VIN swept from 5 V to 3.9 V to 5 V VBAT = 4 V
current returns to the programmed value

.
Figure 29. Charge Cycle With Thermal Regulation Figure 30. Entering and Exiting UVLO

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10 Power Supply Recommendations

The devices are designed to operate from an input voltage supply range between 3.5 V and 28 V and current
capability of at least the maximum designed charge current. This input supply should be well regulated. If located
more than a few inches from the bq21040 IN and GND terminals, a larger capacitor is recommended.

11 Layout

11.1 Layout Guidelines

To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter
capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq21040, with short
trace runs to both IN, OUT, and GND (thermal pad).
All low-current GND connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
The high current charge paths into IN terminal and from the OUT terminal must be sized appropriately for the
maximum charge current in order to avoid voltage drops in these traces
The bq21040 is packaged in a thermally-enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is
also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. It is
best to use multiple 10mil vias in the power pad of the IC and close enough to conduct the heat to the bottom
ground plane. The bottom ground place should avoid traces that cut off the thermal path. The thinner the
PCB the less temperature rise. The EVM PCB has a thickness of 0.031 inches and uses 2 oz. (2.8mil thick)
copper on top and bottom, and is a good example of optimal thermal performance.

11.2 Layout Example

Figure 31. Board Layout

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11.3 Thermal Considerations

The bq21040 is packaged in a thermally-enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the IC and the printed circuit board (PCB). The power pad should
be directly connected to the VSS terminal. The most common measure of package thermal performance is
thermal impedance (RJA) measured (or modeled) from the chip junction to the air surrounding the package
surface (ambient). The mathematical expression for JT is:
JT = (TJ T) / P
where
TJ = Chip junction temperature
P = Device power dissipation
T = Case temperature (7)
Factors that can influence the measurement and calculation of JT include:
1. Whether or not the device is board mounted
2. Trace size, composition, thickness, and geometry
3. Orientation of the device (horizontal or vertical)
4. Volume of the ambient air surrounding the device under test and airflow
5. Whether other surfaces are in close proximity to the device being tested
Due to the charge profile of Li-Ion and Li-Pol batteries the maximum power dissipation is typically seen at the
beginning of the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack
voltage increases to 3.4V within the first 2 minutes. The thermal time constant of the assembly typically takes a
few minutes to heat up so when doing maximum power dissipation calculations, 3.4V is a good minimum voltage
to use. This is verified, with the system and a fully discharged battery, by plotting temperature on the bottom of
the PCB under the IC (pad should have multiple vias), the charge current and the battery voltage as a function of
time. The fast charge current will start to taper off if the part goes into thermal regulation.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation when a battery pack is being charged:
P = [V(IN) V(OUT)] I(OUT) + [V(OUT) V(BAT)] I(BAT) (8)
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or
higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop
is always active.

11.3.1 Leakage Current Effects on Battery Capacity

To determine how fast a leakage current on the battery will discharge the battery is an easy calculation. The time
from full to discharge can be calculated by dividing the Amp-Hour Capacity of the battery by the leakage current.
For a 0.75AHr battery and a 10A leakage current (750 mAHr / 0.010 mA = 75000 hours), it would take 75k
hours or 8.8 years to discharge. In reality the self discharge of the cell would be much faster so the 10A
leakage would be considered negligible.

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12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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 PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

BQ21040DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 125 130E
& no Sb/Br)
BQ21040DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS Call TI Level-1-260C-UNLIM 0 to 125 130E
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Feb-2017

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-May-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ21040DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
BQ21040DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 17-May-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ21040DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
BQ21040DBVT SOT-23 DBV 6 250 180.0 180.0 18.0

Pack Materials-Page 2
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