Data Sheet IC Ina106

Download as pdf or txt
Download as pdf or txt
You are on page 1of 14

INA106

INA

INA

10 6

106

SBOS152A AUGUST 1987 REVISED OCTOBER 2003

Precision Gain = 10
DIFFERENTIAL AMPLIFIER
FEATURES

APPLICATIONS

ACCURATE GAIN: 0.025% max


HIGH COMMON-MODE REJECTION: 86dB min
NONLINEARITY: 0.001% max
EASY TO USE
PLASTIC 8-PIN DIP, SO-8 SOIC
PACKAGES

G = 10 DIFFERENTIAL AMPLIFIER
G = +10 AMPLIFIER
G = 10 AMPLIFIER
G = +11 AMPLIFIER
INSTRUMENTATION AMPLIFIER

DESCRIPTION
The INA106 is a monolithic Gain = 10 differential amplifier
consisting of a precision op amp and on-chip metal film
resistors. The resistors are laser trimmed for accurate gain
and high common-mode rejection. Excellent TCR tracking
of the resistors maintains gain accuracy and common-mode
rejection over temperature.
The differential amplifier is the foundation of many commonly used circuits. The INA106 provides this precision
circuit function without using an expensive resistor network.
The INA106 is available in 8-pin plastic DIP and SO-8
surface-mount packages.

In

R1
10k

R2
100k

5
7

+In

R3
10k

R4
100k

Sense
V+

Output

V
Reference

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright 1987-2003, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.


Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

www.ti.com

SPECIFICATIONS
ELECTRICAL
At +25C, VS = 15V, unless otherwise specified.
INA106KP, U
PARAMETER

CONDITIONS

MIN

GAIN
Initial(1)
Error
vs Temperature
Nonlinearity(2)
OUTPUT
Related Voltage
Rated Current
Impedance
Current Limit
Capacitive Load
INPUT
Impedance
Voltage Range
Common-Mode Rejection(3)
OFFSET VOLTAGE
Initial
vs Temperature
vs Supply
vs Time
NOISE VOLTAGE
fB = 0.01Hz to 10Hz
fO = 10kHz
DYNAMIC RESPONSE
Small Signal
Full Power BW
Slew Rate
Settling Time: 0.1%
0.01%
0.01%
POWER SUPPLY
Rated
Voltage Range
Quiescent Current

TYP
10
0.01
4
0.0002

IO = +20mA, 5mA
VO = 10V

10
+20, 5

MAX

0.025
0.001

12

Differential
Common-Mode
Differential
Common-Mode
TA = TMIN to TMAX

10
110
1
11
86

V/V
%
ppm/C
%
V
mA

mA
pF

0.01
+40/10
1000

To Common
Stable Operation

UNITS

k
k
V
V
dB

100

RTI(4)
50
0.2
1
10

VS = 6V to 18V

200
10

V
V/C
V/V
V/mo

RTI(5)

3dB
VO = 20Vp-p

30
2

VO = 10V Step
VO = 10V Step
VCM = 10V Step, VDIFF = 0V

Derated Performance
VO = 0V

TEMPERATURE RANGE
Specification
Operation
Storage

0
40
65

1
30

Vp-p
nV/Hz

5
50
3
5
10
5

MHz
kHz
V/s
s
s
s

15
1.5

18
2

V
V
mA

+70
+85
+150

C
C
C

NOTES: (1) Connected as difference amplifier (see Figure 1). (2) Nonlinearity is the maximum peak deviation from the best-fit straight line as a percent of full-scale peakto-peak output. (3) With zero source impedance (see Maintaining CMR section). (4) Includes effects of amplifierss input bias and offset currents. (5) Includes effect
of amplifiers input current noise and thermal noise contribution of resistor network.

INA106
www.ti.com

SBOS152A

PIN CONFIGURATION
Top View

ELECTROSTATIC
DISCHARGE SENSITIVITY

DIP/SOIC

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.

(1)
Ref

In

+In

10k

NC

V+

Output

Sense

100k

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.

10k
100k
INA106
NOTE: (1) Pin 1 indentifier for SO-8 package.
Model number identification may be abbreviated
on SO-8 package due to limited available space.

PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.

ABSOLUTE MAXIMUM RATINGS


Power Supply Voltage ...................................................................... 18V
Input Voltage Range ............................................................................ VS
Operating Temperature Range: P, U ................................ 40C to +85C
Storage Temperature Range ............................................ 40C to +85C
Lead Temperature (soldering, 10s): P .......................................... +300C
Wave Soldering (3s, max) U .......................................................... +260C
Output Short Circuit to Common .............................................. Continuous
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.

INA106
SBOS152A

www.ti.com

TYPICAL PERFORMANCE CURVES


At TA = +25C, VS = 15V, unless otherwise noted.

SMALL SIGNAL RESPONSE


(No Load)

STEP RESPONSE

Output Voltage (mV)

50

50

2s/div

2s/div

TOTAL HARMONIC DISTORTION AND NOISE


vs FREQUENCY

SMALL SIGNAL RESPONSE


(RLOAD = , CLOAD = 100pF)
1

A = 20dB, 3Vrms, 10k load

THD + N (%)

Output Voltage (mV)

50

0.1

Inverting
Noninverting
0.01

50
30kHz low-pass filtered
0.001
1k

2s/div

10k

100k

Frequency (Hz)

MAXIMUM VOUT vs IOUT


(Negative Swing)

MAXIMUM VOUT vs IOUT


(Positive Swing)

17.5

17.5

VS = 18V

15

15

VS = 15V

10

VS = 12V

12.5
VOUT (V)

VOUT (V)

VS = 18V

12.5

7.5
5

VS = 12V

7.5
5

VS = 5V

2.5

2.5

VS = 5V

10

12

IOUT (mA)

VS = 15V
10

12

18

24

30

36

IOUT (mA)

INA106
www.ti.com

SBOS152A

TYPICAL PERFORMANCE CURVES (CONT)


At TA = +25C, VS = 15V, unless otherwise noted.

POWER SUPPLY REJECTION


vs FREQUENCY

110

140

100

120

PSRR (dB)

CMR (dB)

CMR vs FREQUENCY

90

80

70

100
V
80

60
V+

60

40
10

100

1k

10k

100k

10

Frequency (Hz)

100

1k

10k

100k

Frequency (Hz)

APPLICATIONS INFORMATION
Figure 1 shows the basic connections required for operation
of the INA106. Power supply bypass capacitors should be
connected close to the device pins as shown.
V

V+

1F

Figure 2 shows a voltage applied to pin 1 to trim the offset


voltage of the INA106. The known 100 source impedance
of the trim circuit is compensated by the 10 resistor in
series with pin 3 to maintain good CMR.

1F
4

7
INA106

V2

R2
100k

R1
10k

Ref terminal will be summed with the output signal. The


source impedance of a signal applied to the Ref terminal
should be less than 10 to maintain good common-mode
rejection.

INA106
R1

V3

R3
10k

6
+

R2

V2

VOUT = 10(V3 V2)


10

R4
100k

V3

R3

Compensates for
some impedance
at pin 1. See text.

R4
+15V
1

The differential input signal is connected to pins 2 and 3 as


shown. The source impedance connected to the inputs must
be equal to assure good common-mode rejection. A 5
mismatch in source impedance will degrade the commonmode rejection of a typical device to approximately 86dB. If
the source has a known source impedance mismatch, an
additional resistor in series with one input can be used to
preserve good common-mode rejection.
The output is referred to the output reference terminal
(pin 1) which is normally grounded. A voltage applied to the

100k
100
15V

FIGURE 2. Offset Adjustment.


Referring to Figure 1, the CMR depends upon the match of
the internal R4/R3 ratio to the R1/R2 ratio. A CMR of 106dB
requires resistor matching of 0.005%. To maintain high
CMR over temperature, the resistor TCR tracking must be
better than 2ppm/C. These accuracies are difficult and
expensive to reliably achieve with discrete components.

INA106
SBOS152A

499k

VO = V2 V3
Offset Adjustment Range = 3mV

FIGURE 1. Basic Power Supply and Signal Connections.

VO

www.ti.com

INA106
V1

10

10k

E1
In
100k

A1

E0

R2

Gain
Adjust

200

INA106
5

R1

E0
Output

R2
V2

10

10k

100k

1
200

INA106
10k

E0 = 10(1 + 2R2 /R1) (E2 E1)

E2
+In

FIGURE 3. Difference Amplifier with Gain and CMR Adjust.

100k

To make a high performance high gain instrumentation amplifier, the INA106


can be combined with state-of-the-art op amps. For low source impedance
applications, OPA37s will give the best noise, offset, and temperature drift. At
source impedances above about 10k, the bias current noise of the OPA37
reacting with input impedance degrades noise. For these applications, use an
OPA111 or a dual OPA2111 FET input op amp for lower noise. For an
electrometer grade IA, use the OPA128see table below.
Using the INA106 for the difference amplifier also extends the input commonmode range of the instrumentation amplifier to 10V. A conventional IA with
a unity-gain difference amplifier has an input common-mode range limited to
5V for an output swing of 10V. This is because a unity-gain difference amp
needs 5V at the input for 10V at the output, allowing only 5V additional for
common-mode.

VO

VO = 10V2
10k

100k

A2

To eliminate adjustment interactions,


first adjust gain with V2 grounded.

V2

CMR
Adjust

A1, A2

R1
()

R2
(k)

GAIN
(V/V)

CMRR
(dB)

Ib (pA)

NOISE AT 1kHz
(nV/ Hz)

OPA37A
OPA111B
OPA128LM

50.5
202
202

2.5
10
10

1000
1000
1000

128
110
118

40000
1
0.075

4
10
38

FIGURE 6. Precision Instrumentation Amplifier.


Gain Error = 0.01% maximum
Nonlinearity = 0.001% maximum
Gain Drift = 2.ppm/C

INA106

FIGURE 4. Precision G = 10 Inverting Amplifier.

INA106
2

R2
100k

R1
10k

V1

R4
100k

V0

V0 = V1 + 10 V3

R3
10k

VO

FIGURE 7. Precision Summing Amplifier.

VO = VIN

100V
Safe Input

R2
100k

R4
100k

5
V3

VIN

R1
10k

R3
10k

INA106

10k

100k

This circuit follows an 11/1 divider with a gain of 11 for an overall gain of unity.
With an 11/1 divider, the input signal can exceed 100V without damage.

FIGURE 5. Voltage Follower with Input Protection.

1
VIN

100k
10k

VO
VO = 11VIN

Gain Error =
0.01% maximum

FIGURE 8. Precision G = 11 Buffer.


6

INA106
www.ti.com

SBOS152A

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2015

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

INA106KP

ACTIVE

PDIP

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 85

INA106KP

INA106KPG4

ACTIVE

PDIP

50

Green (RoHS
& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

-40 to 85

INA106KP

INA106U

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU-DCC

Level-3-260C-168 HR

INA
106U

INA106U/2K5

ACTIVE

SOIC

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU-DCC

Level-3-260C-168 HR

INA
106U

INA106UE4

ACTIVE

SOIC

75

Green (RoHS
& no Sb/Br)

CU NIPDAU-DCC

Level-3-260C-168 HR

INA
106U

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2015

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

INA106U/2K5

Package Package Pins


Type Drawing
SOIC

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

2500

330.0

12.4

Pack Materials-Page 1

6.4

B0
(mm)

K0
(mm)

P1
(mm)

5.2

2.1

8.0

W
Pin1
(mm) Quadrant
12.0

Q1

PACKAGE MATERIALS INFORMATION


www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

INA106U/2K5

SOIC

2500

367.0

367.0

35.0

Pack Materials-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products

Applications

Audio

www.ti.com/audio

Automotive and Transportation

www.ti.com/automotive

Amplifiers

amplifier.ti.com

Communications and Telecom

www.ti.com/communications

Data Converters

dataconverter.ti.com

Computers and Peripherals

www.ti.com/computers

DLP Products

www.dlp.com

Consumer Electronics

www.ti.com/consumer-apps

DSP

dsp.ti.com

Energy and Lighting

www.ti.com/energy

Clocks and Timers

www.ti.com/clocks

Industrial

www.ti.com/industrial

Interface

interface.ti.com

Medical

www.ti.com/medical

Logic

logic.ti.com

Security

www.ti.com/security

Power Mgmt

power.ti.com

Space, Avionics and Defense

www.ti.com/space-avionics-defense

Microcontrollers

microcontroller.ti.com

Video and Imaging

www.ti.com/video

RFID

www.ti-rfid.com

OMAP Applications Processors

www.ti.com/omap

TI E2E Community

e2e.ti.com

Wireless Connectivity

www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2015, Texas Instruments Incorporated

You might also like