MR758
MR758
MR758
HIGH CURRENT
LEAD MOUNTED
SILICON RECTIFIERS
501000 VOLTS
DIFFUSED JUNCTION
CASE 19404
MAXIMUM RATINGS
Symbol
MR750
MR751
MR752
MR754
MR756
MR758
MR760
Unit
Characteristic
VRRM
VRWM
VR
50
100
200
400
600
800
1000
Volts
VRSM
60
120
240
480
720
960
1200
Volts
VR(RMS)
35
70
140
280
420
560
700
Volts
IO
Amps
IFSM
TJ, Tstg
Amps
*65 to +175
ELECTRICAL CHARACTERISTICS
Characteristic and Conditions
Symbol
Max
Unit
vF
1.25
Volts
VF
0.90
Volts
IR
25
1.0
A
mA
TJ = 25C
TJ = 100C
Designers Data for Worst Case Conditions The Designers Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves representing boundaries on device characteristics are given to facilitate worst case design.
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 2
500
700
TJ = 25C
300
MAXIMUM
200
TYPICAL
70
50
400
300
25C
175C
200
25C
TJ = 175C
100
80
60
30
1.0
2.0
5.0
20
10
20
50
100
NUMBER OF CYCLES AT 60 Hz
10
7.0
5.0
+0.5
3.0
0
COEFFICIENT (mV/ C)
100
600
2.0
1.0
0.7
0.5
TYPICAL RANGE
0.5
1.0
1.5
0.3
0.2
2.0
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0.2
2.6
1.0
2.0
5.0
10
20
50
100
200
0.5
20
10
1/2
3/8
1/4
5.0
1/8
HEAT SINK
3.0
2.0
1.0
0.5
0.3
0.2
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
20
30
50
70
t, TIME (SECONDS)
28
RESISTIVE INDUCTIVE
LOADS
L = 1/8
24
1/4
20
3/8
16
12
5/8
8.0
4.0
0
20
40
60
80
100
120
140
160
180
200
7.0
RJA = 25C/W
SEE NOTE
6.0
5.0
I(pk) = 5 Iavg
I(pk) = 10 Iavg
I(pk) = 20 Iavg
4.0
3.0
RJA = 40C/W
SEE NOTE
2.0
6 (IPK/IAVE = 6.28)
1.0
0
f = 60 Hz
40
20
80
60
100
120
140
160
180
200
NOTES
THERMAL CIRCUIT MODEL
32
CAPACITANCE LOADS
I(pk) = 5 Iavg
28
24
10 Iavg
20
20 Iavg
6
RS(A)
1 & 3
RL(A)
RJ(A)
TA(A)
RL(K)
RJ(K)
RS(K)
TA(K)
PF
TL(A)
TC(A)
TJ
TC(K)
TL(K)
16
12
RESISTIVE INDUCTIVE LOADS
8.0
4.0
0
8.0
4.0
12
16
20
24
28
32
R JL , THERMAL RESISTANCE,
JUNCTIONTOLEAD( C/W)
40
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
THROUGH OTHER LEAD
35
30
25
20
15
10
5.0
0
0
1/8
1/4
3/8
1/2
5/8
3/4
7/8
1.0
Use of the above model permits junction to lead thermal resistance for
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
TA = Ambient Temperature
TC = Case Temperature
TL = Lead Temperature
TJ = Junction Temperature
RS = Thermal Resistance, Heat Sink to Ambient
RL = Thermal Resistance, Lead to Heat Sink
RJ = Thermal Resistance, Junction to Case
PF = Power Dissipation
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
RL = 40C/W/in. Typically and 44C/W/in Maximum.
RJ = 2C/W typically and 4C/W Maximum.
Since RJ is so low, measurements of the case temperature, TC, will be
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds TJ(PK) close to TJ(AVG). Therefore maximum lead temperature may
be found from: TL = 175RJL PF. PF may be found from Figure 7.
The recommended method of mounting to a P.C. board is shown on the
sketch, where RJA is approximately 25C/W for a 11/2 x 11/2 copper
surface area. Values of 40C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
30
t rr , REVERSE RECOVERY TIME ( m s)
100
TJ = 25C
70
TJ = 175C
50
20
1.0
2.0
5.0 7.0 10
3.0
20
30
50
20
TJ = 25C
10
7.0
IF = 5 A
3A
1A
5.0
IF
3.0
0
2.0
IR
trr
1.0
0.1
70 100
0.2
1.0
TJ = 25C
C, CAPACITANCE (pF)
300
200
100
70
50
20
uf
tfr
0.5
ufr
ufr = 1.0 V
0.3
0.2
ufr = 2.0 V
5.0 7.0 10
3.0
2.0
20
30
50
70 100
2.0
1.0
10
VO
(1)
V 2o (dc)
.100%
V 2o (ac) V 2o (dc)
7.0
RL
5.0
RS
P (dc)
3.0
TJ = 25C
0.7
5.0 7.0 10
0.1
10
1.0
(sine)
3.0
30
2.0
0.3
+ 42 .100% + 40.6%
(2)
(square)
V 2m
2R L
.
V 2m 100%
RL
+ 50%
(3)
PACKAGE DIMENSIONS
A
D
NOTES:
1. CATHODE SYMBOL ON PACKAGE.
DIM
A
B
D
E
MILLIMETERS
MIN
MAX
8.43
8.69
5.94
6.25
1.27
1.35
25.15
25.65
INCHES
MIN
MAX
0.332
0.342
0.234
0.246
0.050
0.053
0.990
1.010
STYLE 1:
PIN 1. CATHODE
2. ANODE
K
2
CASE 19404
ISSUE F
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
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Rectifier Device
Data
MR750/D