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SN65HVD10, SN65HVD10Q, SN75HVD10, SN65HVD11

SN65HVD12, SN75HVD12, SN65HVD11Q, SN75HVD11
SLLS505N FEBRUARY 2002 REVISED JULY 2015
SNx5HVD1x 3.3-V RS-485 Transceivers

1 Features
3 Description
The SN65HVD10, SN75HVD10, SN65HVD11,

SN75HVD11, SN65HVD12, and SN75HVD12 bus
transceivers combine a 3-state differential line driver
and differential input line receiver that operate with a
single 3.3-V power supply. They are designed for
balanced transmission lines and meet or exceed
ANSI standard TIA/EIA-485-A and ISO 8482:1993.
These differential bus transceivers are monolithic
integrated circuits designed for bidirectional data
communication on multipoint bus-transmission lines.
The drivers and receivers have active-high and
active-low enables, respectively, that can be
externally connected together to function as direction
control. Very low device standby supply current can
be achieved by disabling the driver and the receiver.
Operates With a 3.3-V Supply

Bus-Pin ESD Protection Exceeds 16-kV HBM
1/8 Unit-Load Option Available (Up to 256 Nodes
on the Bus)
Optional Driver Output Transition Times for
Signaling Rates (1) of 1 Mbps, 10 Mbps, and
32 Mbps
Meets or Exceeds the Requirements of ANSI
TIA/EIA-485-A
Bus-Pin Short-Circuit Protection From 7 V to
12 V
Low-Current Standby Mode: 1 A, Typical
Open-Circuit, Idle-Bus, and Shorted-Bus Failsafe
Receiver
Thermal Shutdown Protection
Glitch-Free Power-Up and Power-Down Protection
for Hot-Plugging Applications
SN75176 Footprint
The driver differential outputs and receiver differential

inputs connect internally to form a differential input/
output (I/O) bus port that is designed to offer
minimum loading to the bus whenever the driver is
disabled or VCC = 0. These parts feature wide positive
and negative common-mode voltage ranges making
them suitable for party-line applications.
2 Applications
(1)
Device Information(1)
Digital Motor Control

Utility Meters
Chassis-to-Chassis Interconnects
Electronic Security Stations
Industrial Process Control
Building Automation
Point-of-Sale (POS) Terminals and Networks
PART NUMBER
PACKAGE
SN65HVD12
SN75HVD12
SN65HVD11
SN75HVD12
SN65HVD10
SN75HVD10
BODY SIZE (NOM)
SOIC (8)
4.90 mm 3.91 mm
PDIP (8)
9.81 mm 6.35 mm
(1) For all available packages, see the orderable addendum at

the end of the data sheet.
The signaling rate of a line is the number of voltage

transitions that are made per second expressed in the units
bps (bits per second).
Typical Application Diagram

R
RE
DE
D
R
A
A
RT
RT
R RE DE D
RE
DE
D
R RE DE D
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
9
1
1
1
2
3
3
4
Absolute Maximum Ratings ...................................... 4

ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Driver Electrical Characteristics ................................ 6
Receiver Electrical Characteristics ........................... 7
Power Dissipation Characteristics ............................ 7
Driver Switching Characteristics ............................... 8
Receiver Switching Characteristics........................... 9
Dissipation Ratings ................................................. 9
Typical Characteristics .......................................... 10
Parameter Measurement Information ................ 12

Detailed Description ............................................ 18
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
18
18
18
18
10 Application and Implementation........................ 20

10.1 Application Information.......................................... 20
10.2 Typical Application ................................................ 21
11 Power Supply Recommendations ..................... 24

12 Layout................................................................... 24
12.1 Layout Guidelines ................................................. 24
12.2 Layout Example .................................................... 25
12.3 Thermal Considerations ........................................ 25
13 Device and Documentation Support ................. 27

13.1
13.2
13.3
13.4
13.5
13.6
Device Support......................................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
27
27
14 Mechanical, Packaging, and Orderable

Information ........................................................... 28
4 Revision History
Changes from Revision M (July 2013) to Revision N
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision L (July 2013) to Revision M
Page
Changed the VIT+ TYP value From: 0.65 V To: 0.065 V ................................................................................................... 7
Changes from Revision K (September 2011) to Revision L
Page
Added TYP = 0.65 V to VIT+ ................................................................................................................................................ 7
Added TYP = 0.1 V to VIT ................................................................................................................................................... 7
Changes from Revision J (February 2009) to Revision K
Page
Added new section 'LOW-POWER STANDBY MODE', in the Application Information section........................................... 19
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Copyright 20022015, Texas Instruments Incorporated
Product Folder Links: SN65HVD10 SN65HVD10Q SN75HVD10 SN65HVD11 SN65HVD12 SN75HVD12

SN65HVD11Q SN75HVD11

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5 Device Comparison Table

PART NUMBER
SIGNALING RATE
UNIT LOADS
SN65HVD10P
32 Mbps
1/2
SN65HVD11D
SN65HVD11P
10 Mbps
1/8
SN65HVD12D
SN65HVD12P
1 Mbps
1/8
VP12
SN75HVD10D
SN75HVD10P
32 Mbps
1/2
VN10
SN75HVD11D
SN75HVD11P
10 Mbps
1/8
SOIC (1)
PDIP
SN65HVD10D
TA
SOIC MARKING
VP10
40C to 85C
0C to 70C
VP11
VN11
SN75HVD12D
SN75HVD12P
1 Mbps
1/8
VN12
SN65HVD10QD
SN65HVD10QP
32 Mbps
1/2
VP10Q
SN65HVD11QD
SN65HVD11QP
10 Mbps
1/8
(1)
40C to 125C
VP11Q
The D package is available as a tape and reel. Add an R suffix to the part number (that is, SN75HVD11DR) for this option.
6 Pin Configuration and Functions

D or P Package
8-Pin SOIC or PDIP
Top View
R
RE
DE
D
VCC
B
A
GND
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
Bus input/output
Driver output or receiver input (complementary to B)
Bus input/output
Driver output or receiver input (complementary to A)
Digital input
Driver data input
DE
Digital input
Active-high driver enable
GND
Reference potential
Local device ground
Digital output
Receive data output
RE
Digital input
VCC
Supply
Active-low receiver enable

3-V to 3.6-V supply


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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range unless otherwise noted
VCC
(1) (2)
Supply voltage
Voltage at A or B
IO
MIN
MAX
UNIT
0.3
14
Input voltage at D, DE, R, or RE
0.5
VCC + 0.5
Voltage input, transient pulse, A and B, through 100 , see Figure 22
50
50
11
11
mA
Receiver output current

Continuous total power dissipation
See Dissipation Ratings
TJ
Junction temperature
170
Tstg
Storage temperature
145
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(2)
7.2 ESD Ratings

VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
Electrostatic
discharge
V(ESD)
(1)
(2)
(3)
Pins 5, 6, and 7
16000
All pins
4000
Charged device model (CDM), per JEDEC specification

JESD22-C101 (2)
All pins
1000
Electrical fast transient/burst (3)
Pins 5, 6, and 7
UNIT
4000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Tested in accordance with IEC 61000-4-4.
7.3 Recommended Operating Conditions

over operating free-air temperature range unless otherwise noted
MIN
VCC
Supply voltage
VI or VIC
Voltage at any bus terminal (separately or common mode)
VIH
High-level input voltage
VIL
VID
12
VCC
Low-level input voltage
D, DE, RE
0.8
Differential input voltage
See Figure 18
12
12
Driver
60
IOL
Low-level output current
RL
Differential load resistance
CL
Differential load capacitance

Signaling rate
(1)
(2)
Junction temperature
Receiver
mA
Driver
60
Receiver
8
54
UNIT
3.6
D, DE, RE
High-level output current
(2)
MAX
7 (1)
IOH
TJ
NOM
mA
60
50
pF
HVD10
32
HVD11
10
HVD12
1
145
Mbps
C
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
See thermal characteristics table for information regarding this specification.


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7.4 Thermal Information

SNx5HVD1xx
THERMAL METRIC
D (SOIC) P (PDIP)
8 Pins
RJA
Junction-to-ambient thermal resistance (1)
RJB
Junction-to-board thermal resistance
RJC
Junction-to-case thermal resistance
(1)
(2)
(3)
HighK board (2), No airflow

No airflow
See
121
(3)
HighK board
UNIT
8 Pins
93
67
(3)
57
41
55
C/W
C/W
C/W
The intent of RJA specification is solely for a thermal performance comparison of one package to another in a standardized
environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment.
JSD517, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
JESD5110, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements.


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7.5 Driver Electrical Characteristics

over recommended operating conditions unless otherwise noted
PARAMETER
VIK
TEST CONDITIONS
Input clamp voltage
II = 18 mA
Differential output voltage (2)
RL = 54 , See Figure 11
1.5
Vtest = 7 V to 12 V, See Figure 12
1.5
Change in magnitude of differential output

voltage
VOC(PP)
Peak-to-peak common-mode output voltage
VOC(SS)
Steady-state common-mode output voltage
VOC(SS)
Change in steady-state common-mode

output voltage
IOZ
High-impedance output current
II
Input current
IOS
Short-circuit output current
7 V VO 12 V
C(OD)
Differential output capacitance
VOD = 0.4 sin(4E6t) + 0.5 V, DE at 0 V
(1)
(2)
See Figure 11 and Figure 12
VCC
V
0.2
0.2
400
See Figure 13
UNIT
V
|VOD|
ICC
MAX
1.5
IO = 0
|VOD|
MIN TYP (1)
V
mV
1.4
2.5
0.05
0.05
See receiver input currents

D
DE
Supply current
100
100
250
250
16
A
mA
pF
RE at VCC,
D and DE at VCC,
No load
Receiver disabled and

driver enabled
15.5
mA
RE at VCC,
D at VCC,
DE at 0 V,
No load
Receiver disabled and

driver disabled
(standby)
RE at 0 V,
D and DE at VCC,
No load
Receiver enabled and

driver enabled
15.5
mA
All typical values are at 25C and with a 3.3-V supply.

For TA > 85C, VCC is 5%.


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7.6 Receiver Electrical Characteristics

PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
IO = 8 mA
VIT
Negative-going input threshold

voltage
IO = 8 mA
Vhys
Hysteresis voltage (VIT+ VIT)
VIK
Enable-input clamp voltage
II = 18 mA
VOH
High-level output voltage
VID = 200 mV, IOH = 8 mA, see Figure 18
VOL
Low-level output voltage
VID = 200 mV, IOL = 8 mA, see Figure 18
IOZ
High-impedance-state output current
VO = 0 or VCC, RE at VCC
MIN
TYP (1)
MAX
0.065
0.01
0.2
35
VA or VB = 7 V
2.4
HVD11, HVD12,
Other inputs at 0 V
HVD10,
Other inputs at 0 V
0.06
0.13
0.05
0.04
0.2
0.5
0.25
0.5
0.4
0.2
0.15
VA or VB = 7 V, VCC = 0 V
0.4
High-level input current, RE
VIH = 2 V
30
IIL
Low-level input current, RE
VIL = 0.8 V
30
CID
Differential input capacitance
VID = 0.4 sin(4E6t) + 0.5 V, DE at 0 V
(1)
1
0.11
0.05
IIH
Supply current
0.05
0.1
VA or VB = 12 V
VA or VB = 7 V
0.4
1
ICC
mV
1.5
Bus input current
0.1
VA or VB = 12 V
II
UNIT
mA
mA
15
pF
RE at 0 V
D and DE at 0 V
No load
Receiver enabled and driver

disabled
mA
RE at VCC
D at VCC
DE at 0 V
No load
Receiver disabled and driver

disabled (standby)
RE at 0 V
D and DE at VCC
No load
Receiver enabled and driver

enabled
15.5
mA
7.7 Power Dissipation Characteristics

PARAMETER
PD
Device power dissipation
TEST CONDITIONS
RL= 60 , CL = 50 pF,
DE at VCC, RE at 0 V,
Input to D is a 50% duty-cycle
square wave at indicated signaling
rate
MIN
MAX
198
250
HVD11
(10Mbps)
141
176
HVD12
(500 kbps)
133
161
High-K board, no airflow
D pkg
40
116
No airflow (2)
P pkg
40
123
TA
Ambient air temperature (1)
TJSD
Thermal shutdown junction temperature (1)
(1)
(2)
TYP
HVD10
(32Mbps)
UNIT
165
mW
C
C
See Thermal Characteristics of IC Packages section for an explanation of these parameters.

JESD5110, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements.


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7.8 Driver Switching Characteristics

MIN
TYP (1)
MAX
HVD10
8.5
16
HVD11
18
25
40
HVD12
135
200
300
HVD10
8.5
16
PARAMETER
Propagation delay time,
low-to-high-level output
tPLH

high-to-low-level output
tPHL
TEST CONDITIONS
HVD11
18
25
40
HVD12
135
200
300
4.5
10
HVD10
Differential output signal
rise time
tr
Differential output signal

fall time
tf
tsk(p)
tsk(pp)
tPZH
tPHZ
tPZL
tPLZ
Pulse skew (|tPHL tPLH|)
(2)
Part-to-part skew

high-impedance-to-highlevel output
high-level-to-highimpedance output
high-impedance-to-lowlevel output
low-level-to-highimpedance output
HVD11
RL = 54 , CL = 50 pF
See Figure 14
10
20
30
HVD12
100
170
300
HVD10
4.5
10
HVD11
10
20
30
HVD12
100
170
300
HVD10
1.5
HVD11
2.5
HVD12
HVD10
HVD11
11
HVD12
100
HVD10
31
HVD11
55
HVD12
HVD10
RL = 110 , RE at 0 V
See Figure 15
ns
ns
ns
ns
ns
ns
25
55
HVD12
300
HVD10
26
HVD11
55
HVD12
300
RL = 110 , RE at 0 V
See Figure 16
ns
300
HVD11
HVD10
UNIT
ns
ns
26
HVD11
75
HVD12
400
ns
tPZH
Propagation delay time, standby-to-high- RL = 110 , RE at 3 V

level output
See Figure 15
tPZL
Propagation delay time, standby-to-lowlevel output
RL = 110 , RE at 3 V
See Figure 16
(1)
(2)

tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.


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7.9 Receiver Switching Characteristics

PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
tPLH

HVD10
12.5
20
25
tPHL

HVD10
12.5
20
25
tPLH

HVD11
HVD12
30
55
70
ns
tPHL

HVD11
HVD12
30
55
70
ns
tsk(p)
Pulse skew (|tPHL tPLH|)
tsk(pp)
(2)
Part-to-part skew
tr
Output signal rise time
tf
Output signal fall time
ns
HVD10
1.5
HVD11
HVD12
HVD10
HVD11
15
HVD12
15
CL = 15 pF
See Figure 19
tPZH
(1)
Output enable time to high level
tPZL
(1)
Output enable time to low level

Output disable time from high level
tPLZ
Output disable time from low level

(2)
tPZL
(2)
(1)
(2)
ns
ns
ns
15
tPHZ
tPZH
VID = 1.5 V to 1.5 V

CL = 15 pF
See Figure 19
15
CL = 15 pF, DE at 3 V
See Figure 20
20
ns
15
Propagation delay time, standby-to-highlevel output

CL = 15 pF, DE at 0
Propagation delay time, standby-to-low- See Figure 21
level output
6
s
6
All typical values are at 25C and with a 3.3-V supply

tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices
operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
7.10 Dissipation Ratings

PACKAGE
TA 25C
POWER RATING
DERATING FACTOR (1)

ABOVE TA = 25C
TA = 70C
POWER RATING
TA = 85C
POWER RATING
TA = 125C
POWER RATING
D (2)
597 mW
4.97 mW/C
373 mW
298 mW
100 mW
D (3)
990 mW
8.26 mW/C
620 mW
496 mW
165 mW
1290 mW
10.75 mW/C
806 mW
645 mW
215 mW
(1)
(2)
(3)
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
Tested in accordance with the Low-K thermal metric definitions of EIA/JESD51-3.
Tested in accordance with the High-K thermal metric definitions of EIA/JESD51-7.


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7.11 Typical Characteristics

70
TA = 25C
RE at VCC
DE at VCC
RL = 54 W
CL = 50 pF
VCC = 3.6 V
60
50
VCC = 3 V
VCC = 3.3 V
40
30
10
15
20
25
30
35
TA = 25C
RE at VCC
DE at VCC
I CC RMS Supply Current mA
70
50
VCC = 3 V
VCC = 3.3 V
40
30
0
2.5
Signaling Rate Mbps
TA = 25C
RE at VCC
DE at VCC
5
7.5
Signaling Rate Mbps
10
Figure 2. HVD11 RMS Supply Current vs Signaling Rate

300
RL = 54 W
CL = 50 pF
250
VCC = 3.6 V
I I Bus Input Current mA
70
VCC = 3.6 V
60
40
RL = 54 W
CL = 50 pF
60
VCC = 3.3 V
50
VCC = 3 V
40
TA = 25C
DE at 0 V
200
VCC = 0 V
150
100
50
VCC = 3.3 V
0
50
100
150
30
100
400
700
Signaling Rate kbps
200
7 65 43 21 0 1 2 3 4 5 6 7 8 9 10 11 12
VI Bus Input Voltage V
1000
Figure 4. HVD10 Bus Input Current vs Bus Input Voltage
90
I I Bus Input Current mA
70
150
TA = 25C
DE at 0 V
60
50
40
VCC = 0 V
30
20
10
0
VCC = 3.3 V
10
20
30
40
IOH High-Level Output Current mA
80
TA = 25C
DE at VCC
D at VCC
VCC = 3.3 V
100
50
0
50
100
150
50
60
76 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10 11 12
VI Bus Input Voltage V
Figure 5. HVD11 or HVD12 Bus Input Current vs Bus Input

Voltage
10
200
2
0
2
4
VOH Driver High-Level Output Voltage V
Figure 6. High-Level Output Current vs Driver High-Level

Output Voltage


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Typical Characteristics (continued)

200
2.5
TA = 25C
DE at VCC
D at 0 V
VCC = 3.3 V
160
140
2.4
VOD Driver Differential Output V
I OL Low-Level Output Current mA
180
120
100
80
60
40
20
2.2
2.1
2.0
1.9
1.8
1.7
1.6
0
20
4
2
0
2
4
6
VOL Driver Low-Level Output Voltage V
1.5
40
Figure 7. Low-Level Output Current vs Driver Low-Level

Output Voltage
15
10
35
60
TA Free-Air Temperature C
85
Figure 8. Driver Differential Output vs Free-Air Temperature

600
40
TA = 25C
DE at VCC
D at VCC
RL = 54
35
30
500
HVD12
Enable Time ns
I O Driver Output Current mA
2.3
VCC = 3.3 V
DE at VCC
D at VCC
25
20
15
400
HVD11
300
HVD10
200
10
100
5
0
0
0
0.50
1.50
2.50
3.50
VCC Supply Voltage V
Figure 9. Driver Output Current vs Supply Voltage
-7
-2
13
V(TEST) Common-Mode Voltage V
Figure 10. Enable Time vs Common-Mode Voltage

11

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8 Parameter Measurement Information

VCC
II
DE
IOA
VOD
0 or 3 V
B
54 1%
IOB
VI
VOB
VOA
Figure 11. Driver VOD Test Circuit and Voltage and Current Definitions
375 1%
VCC
DE
0 or 3 V
A
VOD
60 1%
+
_ 7 V < V(test) < 12 V
375 1%
Figure 12. Driver VOD With Common-Mode Loading Test Circuit
VCC
DE
Input
27 1%
A
VA
VB
VOC(PP)
27 1%
B
CL = 50 pF 20%
VOC
VOC(SS)
VOC
CL Includes Fixture and

Instrumentation Capacitance
Input: PRR = 500 kHz, 50% Duty Cycle,tr<6ns, tf<6ns, ZO = 50
Figure 13. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
3V
VCC
DE
D
Input
Generator
VI
50
CL = 50 pF 20%
A
B
VOD
RL = 54
1%
CL Includes Fixture
and Instrumentation
Capacitance
1.5 V
VI
tPLH
1.5 V
tPHL
90%
VOD
90%
tr
2V
0V
10%
2 V
0V
10%
tf
Generator: PRR = 500 kHz, 50% Duty Cycle, tr <6 ns, tf <6 ns, Zo = 50
Figure 14. Driver Switching Test Circuit and Voltage Waveforms
12


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Parameter Measurement Information (continued)

A
3V
3V
S1
VO
VI
1.5 V
1.5 V
B
DE
Input
Generator
VI
50
CL Includes Fixture
and Instrumentation
Capacitance
0V
0.5 V
RL = 110
1%
CL = 50 pF 20%
tPZH
VOH
VO
2.3 V
0V
tPHZ
Figure 15. Driver High-Level Enable and Disable Time Test Circuit and Voltage Waveforms
3V
A
3V
VI
3V
1.5 V
VI
S1
1.5 V
VO
DE
Input
Generator
RL = 110
1%
50
0V
tPZL
tPLZ
3V
CL = 50 pF 20%
0.5 V
CL Includes Fixture
and Instrumentation
Capacitance
VO
2.3 V
VOL
Figure 16. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms
375 W 1%
Y
D
0 or 3 V
-7 V < V(TEST) < 12 V

VOD
60 W
1%
Z
DE
375 W 1%
Input
Generator
50 W
50%
tpZH(diff)
VOD (high)
1.5 V
0V
tpZL(diff)
-1.5 V
VOD (low)
The time tPZL(x) is the measure from DE to VOD(x). VOD is valid when it is greater than 1.5 V.
Figure 17. Driver Enable Time from DE to VOD

13

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IA
VA + VB
2
VID
VB
VIC
A
R
VA
IO
B
VO
IB
Figure 18. Receiver Voltage and Current Definitions

A
Input
Generator
R
VI
50
1.5 V
0V
VO
CL = 15 pF 20%
RE
CL Includes Fixture
and Instrumentation
Capacitance
3V
1.5 V
VI
1.5 V
0V
tPLH
VO
tPHL
90% 90%
1.5 V
10%
tr
VOH
1.5 V
10% V
OL
tf
Figure 19. Receiver Switching Test Circuit and Voltage Waveforms
14


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3V
3V
A
DE
0 V or 3 V
VO
B
RE
Input
Generator
VI
1 k 1%
S1
CL = 15 pF 20%
CL Includes Fixture
and Instrumentation
Capacitance
50
3V
VI
1.5 V
1.5 V
0V
tPZH(1)
tPHZ
VOH 0.5 V
VOH
D at 3 V
S1 to B
1.5 V
VO
0V
tPZL(1)
tPLZ
3V
VO
1.5 V
VOL +0.5 V
D at 0 V
S1 to A
VOL
Figure 20. Receiver Enable and Disable Time Test Circuit and Voltage Waveforms With Drivers Enabled

15

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3V
A
0 V or 1.5 V
1.5 V or 0 V
RE
Input
Generator
VI
1 k 1%
VO
S1
CL = 15 pF 20%
CL Includes Fixture
and Instrumentation
Capacitance
50
3V
1.5 V
VI
0V
tPZH(2)
VOH
A at 1.5 V
B at 0 V
S1 to B
1.5 V
VO
GND
tPZL(2)
3V
1.5 V
VO
A at 0 V
B at 1.5 V
S1 to A
VOL
Figure 21. Receiver Enable Time From Standby (Driver Disabled)

0 V or 3 V
RE
Pulse Generator,
15 s Duration,
1% Duty Cycle
tr, tf 100 ns
100
1%
+
_
DE
3 V or 0 V
NOTE: This test is conducted to test survivability only. Data stability at the R output is not specified.
Figure 22. Test Circuit, Transient Over Voltage Test
16


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D and RE Inputs
DE Input
VCC
VCC
100 kW
1 kW
1 kW
Input
Input
100 kW
9V
9V
A Input
B Input
VCC
VCC
16 V
16 V
R3
R1
R1
R3
Input
Input
16 V
R2
16 V
A and B Outputs
R2
R Output
VCC
VCC
16 V
5W
Output
Output
9V
16 V
R1/R2
R3
SN65HVD10
9 kW
45 kW
SN65HVD11
36 kW
180 kW
SN65HVD12
36 kW
180 kW
Figure 23. Equivalent Input and Output Schematic Diagrams

17

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9 Detailed Description
9.1 Overview
The SN65HVD10, SN65HVD11, and SN65HVD12 are 3.3 V, half-duplex, RS-485 transceivers available in 3
speed grades suitable for data transmission up to 32 Mbps, 10 Mbps, and 1 Mbps, respectively.
These devices have active-high driver enables and active-low receiver enables. A standby current of less than
5 A can be achieved by disabling both driver and receiver.
9.2 Functional Block Diagram
9.3 Feature Description

Internal ESD protection circuits protect the transceiver bus terminals against 16-kV Human Body Model (HBM)
electrostatic discharges and 4-kV electrical fast transients (EFT) according to IEC61000-4-4.
The SN65HVD1x half-duplex family provides internal biasing of the receiver input thresholds for open-circuit,
bus-idle, or short-circuit failsafe conditions, and a typical receiver hysteresis of 35 mV.
9.4 Device Functional Modes

When the driver enable pin, DE, is logic high, the differential outputs A and B follow the logic states at data input
D. A logic high at D causes A to turn high and B to turn low. In this case the differential output voltage defined as
VOD = VA VB is positive. When D is low, the output states reverse, B turns high, A becomes low, and VOD is
negative.
When DE is low, both outputs turn high-impedance. In this condition the logic state at D is irrelevant. The DE pin
has an internal pulldown resistor to ground; thus, when left open, the driver is disabled (high-impedance) by
default. The D pin has an internal pullup resistor to VCC; thus, when left open while the driver is enabled, output A
turns high and B turns low.
Table 1. Driver Functions (1)
(1)
18
INPUT
ENABLE
DE
OUTPUTS
Actively drive bus High
Actively drive bus Low
Driver disabled
OPEN
Driver disabled by default
OPEN
Actively drive bus High by default
FUNCTION
H = high level; L = low level; Z = high impedance; X = irrelevant; ? = indeterminate


www.ti.com
When the receiver enable pin, RE, is logic low, the receiver is enabled. When the differential input voltage
defined as VID = VA VB is positive and higher than the positive input threshold, VIT+, the receiver output, R,
turns high. When VID is negative and lower than the negative input threshold, VIT, the receiver output, R, turns
low. If VID is between VIT+ and VIT, the output is indeterminate.
When RE is logic high or left open, the receiver output is high-impedance and the magnitude and polarity of VID
are irrelevant. Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is
disconnected from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven
(idle bus).
Table 2. Receiver Functions (1)
(1)
DIFFERENTIAL INPUT
VID = VA VB
ENABLE
RE
OUTPUT
R
VID > VIT+
Receive valid bus High
VIT < VID < VIT+
Indeterminate bus state
FUNCTION
VID < VIT
Receive valid bus Low
Receiver disabled
OPEN
Receiver disabled by default
Open-circuit bus
Fail-safe high output
Short-circuit bus
Fail-safe high output
H = high level; L = low level; Z = high impedance; X = irrelevant; ? = indeterminate
9.4.1 Low-Power Standby Mode

When both the driver and receiver are disabled (DE low and RE high) the device is in standby mode. If the
enable inputs are in this state for less than 60 ns, the device does not enter standby mode. This guards against
inadvertently entering standby mode during driver or receiver enabling. Only when the enable inputs are held in
this state for 300 ns or more, the device is assured to be in standby mode. In this low-power standby mode, most
internal circuitry is powered down, and the supply current is typically less than 1 A. When either the driver or the
receiver is re-enabled, the internal circuitry becomes active.

19

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10 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information

The SN65HVD10, 'HVD11, and 'HVD12 are half-duplex RS-485 transceivers commonly used for asynchronous
data transmissions. The driver and receiver enable pins allow for the configuration of different operating modes.
R
RE
RE
RE
DE
DE
DE
a) Independent driver and

receiver enable signals
b) Combined enable signals for

use as directional control pin
c) Receiver always on
Figure 24. Half-Duplex Transceiver Configurations

a. Using independent enable lines provides the most flexible control as it allows for the driver and the receiver
to be turned on and off individually. While this configuration requires two control lines, it allows for selective
listening into the bus traffic, whether the driver is transmitting data or not.
b. Combining the enable signals simplifies the interface to the controller by forming a single direction-control
signal. In this configuration, the transceiver operates as a driver when the direction-control line is high, and
as a receiver when the direction-control line is low.
c. Only one line is required when connecting the receiver-enable input to ground and controlling only the driverenable input. In this configuration, a node not only receives the data from the bus, but also the data it sends
and can verify that the correct data have been transmitted.
20


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10.2 Typical Application

An RS-485 bus consists of multiple transceivers connected in parallel to a bus cable. To eliminate line
reflections, each cable end is terminated with a termination resistor, RT, whose value matches the characteristic
impedance, Z0, of the cable. This method, known as parallel termination, allows for higher data rates over a
longer cable length.
R
RE
DE
D
R
A
A
RT
RT
R RE DE D
RE
DE
D
R RE DE D
Figure 25. Typical RS-485 Network With Half-Duplex Transceivers

10.2.1 Design Requirements
RS-485 is a robust electrical standard suitable for long-distance networking that may be used in a wide range of
applications with varying requirements, such as distance, data rate, and number of nodes.
10.2.1.1 Data Rate and Bus Length
There is an inverse relationship between data rate and bus length, meaning the higher the data rate, the shorter
the cable length; and conversely, the lower the data rate, the longer the cable may be without introducing data
errors. While most RS-485 systems use data rates between 10 kbps and 100 kbps, some applications require
data rates up to 250 kbps at distances of 4000 feet and longer. Longer distances are possible by allowing for
small signal jitter of up to 5 or 10%.
10000
Cable Length (ft)
5%, 10%, and 20% Jitter

1000
Conservative
Characteristics
100
10
100
1k
10k
100k
1M
10M
100M
Data Rate (bps)
Figure 26. Cable Length vs Data Rate Characteristic

21

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Typical Application (continued)

10.2.1.2 Stub Length
When connecting a node to the bus, the distance between the transceiver inputs and the cable trunk, known as
the stub, should be as short as possible. Stubs present a nonterminated piece of bus line which can introduce
reflections as the length of the stub increases. As a general guideline, the electrical length, or round-trip delay, of
a stub should be less than one-tenth of the rise time of the driver, thus giving a maximum physical stub length as
shown in Equation 1.
L(STUB) 0.1 tr v c
where
tr is the 10/90 rise time of the driver

v is the signal velocity of the cable or trace as a factor of c
c is the speed of light (3 108 m/s)
(1)
Per Equation 1, Table 3 lists the maximum cable-stub lengths for the minimum-driver output rise-times of the
SN65HVD1x full-duplex family of transceivers for a signal velocity of 78%.
Table 3. Maximum Stub Length
MAXIMUM STUB LENGTH
DEVICE
MINIMUM DRIVER OUTPUT

RISE TIME (ns)
(m)
(ft)
SN65HVD10
0.07
0.23
SN65HVD11
10
0.23
0.75
SN65HVD12
100
2.34
7.67
10.2.1.3 Bus Loading

The RS-485 standard specifies that a compliant driver must be able to driver 32 unit loads (UL), where 1 unit
load represents a load impedance of approximately 12 k. Because the SN65HVD11 and HVD12 are each 1/8
UL transceivers, it is possible to connect up to 256 receivers to the bus. The SN65HVD10 is a 1/4 UL
transceiver, and up to 64 receivers may be connected to the bus.
10.2.1.4 Receiver Failsafe
The differential receivers of the SN65HVD1x family are failsafe to invalid bus states caused by:
Open bus conditions, such as a disconnected connector
Shorted bus conditions, such as cable damage shorting the twisted-pair together
Idle bus conditions that occur when no driver on the bus is actively driving.
In any of these cases, the differential receiver will output a failsafe logic High state so that the output of the
receiver is not indeterminate.
Receiver failsafe is accomplished by offsetting the receiver thresholds such that the input indeterminate range
does not include zero volts differential. To comply with the RS-422 and RS-485 standards, the receiver output
must output a High when the differential input VID is more positive than +200 mV, and must output a Low when
VID is more negative than 200 mV. The receiver parameters which determine the failsafe performance are VIT(+)
and VIT(). As shown in Receiver Electrical Characteristics, differential signals more negative than 200 mV will
always cause a Low receiver output, and differential signals more positive than +200 mV will always cause a
High receiver output.
When the differential input signal is close to zero, it is still above the maximum VIT(+) threshold of 10 mV, and
the receiver output will be High.
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10.2.2 Detailed Design Procedure

To protect bus nodes against high-energy transients, the implementation of external transient protection devices
is therefore necessary. Figure 27 shows a protection circuit against 10-kV ESD (IEC 61000-4-2), 4-kV EFT (IEC
61000-4-4), and 1-kV surge (IEC 61000-4-5) transients.
Vcc
Vcc
10k
1
RE
DIR
DE
TxD
RxD
MCU
Vcc
GND
XCVR
0.1F
R1
TVS
R2
10k
Figure 27. Transient Protection Against ESD, EFT, and Surge Transients
Table 4. Bill of Materials
DEVICE
FUNCTION
ORDER NUMBER
SN65HVD1xD
MANUFACTURER
XCVR
3.3-V, full-duplex RS-485

transceiver
R1, R2
10-, pulse-proof, thick-film CRCW0603010RJNEAHP

resistor
Vishay
TVS
Bidirectional 400-W
transient suppressor
Bourns
CDSOT23-SM712
TI
10.2.3 Application Curve

Figure 28 demonstrates operation of the SN65HVD12 at a signaling rate of 250 kbps. Two SN65HVD12
transceivers are used to transmit data through a 2,000 foot (600 m) segment of Commscope 5524 category 5e+
twisted pair cable. The bus is terminated at each end by a 100- resistor, matching the cable characteristic
impedance.
Driver Input
Driver Output
Receiver Input
Receiver Output
Figure 28. SN65HVD12 Input and Output Through 2000 Feet of Cable

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11 Power Supply Recommendations

To assure reliable operation at all data rates and supply voltages, each supply must be buffered with a 100-nF
ceramic capacitor located as close to the supply pins as possible. The TPS76333 linear voltage regulator is
suitable for the 3.3-V supply.
12 Layout
12.1 Layout Guidelines
On-chip IEC-ESD protection is sufficient for laboratory and portable equipment but never sufficient for EFT and
surge transients occurring in industrial environments. Therefore, robust and reliable bus node design requires the
use of external transient protection devices.
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3 MHz to 3 GHz, highfrequency layout techniques must be applied during PCB design.
1. Place the protection circuitry close to the bus connector to prevent noise transients from entering the board.
2. Use VCC and ground planes to provide low-inductance. Note that high-frequency currents follow the path of
least inductance and not the path of least impedance.
3. Design the protection components into the direction of the signal path. Do not force the transient currents to
divert from the signal path to reach the protection device.
4. Apply 100-nF to 220-nF bypass capacitors as close as possible to the VCC pins of transceiver, UART, and
controller ICs on the board.
5. Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to
minimize effective via-inductance.
6. Use 1-k to 10-k pull-up or pull-down resistors for enable lines to limit noise currents in these lines during
transient events.
7. Insert pulse-proof series resistors into the A and B bus lines if the TVS clamping voltage is higher than the
specified maximum voltage of the transceiver bus terminals. These resistors limit the residual clamping
current into the transceiver and prevent it from latching up.
8. While pure TVS protection is sufficient for surge transients up to 1 kV, higher transients require metal-oxide
varistors (MOVs) which reduce the transients to a few hundred volts of clamping voltage, and transient
blocking units (TBUs) that limit transient current to less than 1 mA.
24


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12.2 Layout Example
Via to ground
Via to VCC
6 R
MCU
6 R
XCVR
JMP
TVS
Figure 29. SN65HVD1x Layout Example
12.3 Thermal Considerations

12.3.1 Thermal Characteristics of IC Packages
RJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient
temperature divided by the operating power.
RJA is not a constant and is a strong function of:
the PCB design (50% variation)
altitude (20% variation)
device power (5% variation)
RJA can be used to compare the thermal performance of packages if the specific test conditions are defined and
used. Standardized testing includes specification of PCB construction, test chamber volume, sensor locations,
and the thermal characteristics of holding fixtures. RJA is often misused when it is used to calculate junction
temperatures for other installations.
TI uses two test PCBs as defined by JEDEC specifications. The low-k board gives average in-use condition
thermal performance, and it consists of a single copper trace layer 25 mm long and 2-oz thick. The high-k board
gives best case in-use condition, and it consists of two 1-oz buried power planes with a single copper trace layer
25 mm long and 2-oz thick. A 4% to 50% difference in RJA can be measured between these two test cards.
RJC (Junction-to-Case Thermal Resistance) is defined as difference in junction temperature to case divided
by the operating power. It is measured by putting the mounted package up against a copper block cold plate to
force heat to flow from die, through the mold compound into the copper block.
RJC is a useful thermal characteristic when a heatsink is applied to package. It is not a useful characteristic to
predict junction temperature because it provides pessimistic numbers if the case temperature is measured in a
nonstandard system and junction temperatures are backed out. It can be used with RJB in 1-dimensional thermal
simulation of a package system.
RJB (Junction-to-Board Thermal Resistance) is defined as the difference in the junction temperature and the
PCB temperature at the center of the package (closest to the die) when the PCB is clamped in a cold-plate
structure. RJB is only defined for the high-k test card.
RJB provides an overall thermal resistance between the die and the PCB. It includes a bit of the PCB thermal
resistance (especially for BGAs with thermal balls) and can be used for simple 1-dimensional network analysis of
package system, see Figure 30.

25

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Thermal Considerations (continued)
Figure 30. PCB Thermal Resistances
26


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13 Device and Documentation Support

13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN65HVD12
Click here
Click here
Click here
Click here
Click here
SN75HVD12
Click here
Click here
Click here
Click here
Click here
SN65HVD11
Click here
Click here
Click here
Click here
Click here
SN65HVD11Q
Click here
Click here
Click here
Click here
Click here
SN75HVD11
Click here
Click here
Click here
Click here
Click here
SN65HVD10
Click here
Click here
Click here
Click here
Click here
SN65HVD10Q
Click here
Click here
Click here
Click here
Click here
SN75HVD10
Click here
Click here
Click here
Click here
Click here
13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

27

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14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
28

PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
SN65HVD10D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP10
SN65HVD10DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP10
SN65HVD10DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP10
SN65HVD10DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP10
SN65HVD10P
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD10
SN65HVD10QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP10Q
SN65HVD10QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP10Q
SN65HVD10QDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP10Q
SN65HVD10QDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP10Q
SN65HVD11D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP11
SN65HVD11DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP11
SN65HVD11DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP11
SN65HVD11DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP11
SN65HVD11P
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD11
SN65HVD11PE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD11
SN65HVD11QD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP11Q
SN65HVD11QDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VP11Q
Addendum-Page 1
Samples
www.ti.com
Orderable Device
24-Apr-2015
Status
(1)

Drawing
Qty
2500
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
TBD
Call TI
Call TI
-40 to 125
Device Marking
(4/5)
SN65HVD11QDR
ACTIVE
SOIC
SN65HVD11QDRG4
ACTIVE
SOIC
SN65HVD12D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP12
SN65HVD12DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP12
SN65HVD12DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP12
SN65HVD12DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP12
SN65HVD12P
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD12
SN65HVD12PE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD12
SN75HVD10D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN10
SN75HVD10DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN10
SN75HVD10DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN10
SN75HVD10DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN10
SN75HVD10P
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
75HVD10
SN75HVD11D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN11
SN75HVD11DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN11
SN75HVD11DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN11
SN75HVD11DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN11
SN75HVD12D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN12
Addendum-Page 2
VP11Q
Samples
www.ti.com
Orderable Device
24-Apr-2015
Status
(1)

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
SN75HVD12DG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN12
SN75HVD12DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN12
SN75HVD12DRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN12
SN75HVD12P
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
75HVD12
SN75HVD12PE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
75HVD12
(1)
The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 3
Samples
www.ti.com
24-Apr-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN65HVD10, SN65HVD11, SN65HVD12 :
Enhanced Product: SN65HVD10-EP, SN65HVD12-EP

NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION

www.ti.com
1-Oct-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins

Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65HVD10DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD10QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD11DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD11QDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD12DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75HVD10DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75HVD11DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75HVD12DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com
1-Oct-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65HVD10DR
SOIC
2500
340.5
338.1
20.6
SN65HVD10QDR
SOIC
2500
340.5
338.1
20.6
SN65HVD11DR
SOIC
2500
340.5
338.1
20.6
SN65HVD11QDR
SOIC
2500
340.5
338.1
20.6
SN65HVD12DR
SOIC
2500
340.5
338.1
20.6
SN75HVD10DR
SOIC
2500
340.5
338.1
20.6
SN75HVD11DR
SOIC
2500
340.5
338.1
20.6
SN75HVD12DR
SOIC
2500
340.5
338.1
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Applications
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www.ti.com/audio
Automotive and Transportation
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Sample &

SN65HVD10, SN65HVD10Q, SN75HVD10, SN65HVD11

SNx5HVD1x 3.3-V RS-485 Transceivers

The SN65HVD10, SN75HVD10, SN65HVD11,

Operates With a 3.3-V Supply

The driver differential outputs and receiver differential

Digital Motor Control

BODY SIZE (NOM)

(1) For all available packages, see the orderable addendum at

The signaling rate of a line is the number of voltage

Typical Application Diagram

SN65HVD10, SN65HVD10Q, SN75HVD10, SN65HVD11

Absolute Maximum Ratings ...................................... 4

Parameter Measurement Information ................ 12

10 Application and Implementation........................ 20

11 Power Supply Recommendations ..................... 24

13 Device and Documentation Support ................. 27

14 Mechanical, Packaging, and Orderable

Changes from Revision L (July 2013) to Revision M

Changes from Revision K (September 2011) to Revision L

Added TYP = 0.65 V to VIT+ ................................................................................................................................................ 7

Added TYP = 0.1 V to VIT ................................................................................................................................................... 7

Changes from Revision J (February 2009) to Revision K

Submit Documentation Feedback

Copyright 20022015, Texas Instruments Incorporated

Product Folder Links: SN65HVD10 SN65HVD10Q SN75HVD10 SN65HVD11 SN65HVD12 SN75HVD12

SN65HVD10, SN65HVD10Q, SN75HVD10, SN65HVD11

SLLS505N FEBRUARY 2002 REVISED JULY 2015

5 Device Comparison Table

6 Pin Configuration and Functions

Driver output or receiver input (complementary to B)

Driver output or receiver input (complementary to A)

Driver data input

Active-high driver enable

Local device ground

Receive data output

Copyright 20022015, Texas Instruments Incorporated

Active-low receiver enable

Submit Documentation Feedback

Product Folder Links: SN65HVD10 SN65HVD10Q SN75HVD10 SN65HVD11 SN65HVD12 SN75HVD12

SN65HVD10, SN65HVD10Q, SN75HVD10, SN65HVD11

Input voltage at D, DE, R, or RE

Voltage input, transient pulse, A and B, through 100 , see Figure 22

Receiver output current

See Dissipation Ratings

7.2 ESD Ratings

Charged device model (CDM), per JEDEC specification

Electrical fast transient/burst (3)

7.3 Recommended Operating Conditions

Voltage at any bus terminal (separately or common mode)

High-level input voltage

Low-level input voltage

Differential input voltage

Low-level output current

Differential load resistance

Differential load capacitance

High-level output current

Submit Documentation Feedback

Copyright 20022015, Texas Instruments Incorporated