Id Emc e

Noiae Eureaaion Oevioe and
EEO Proteotion Oevioe

CATALOG
ENC Comonenta
2013
nd,ral.ana,nc.cm/
1
EMC Components / Noise Suppression Device and ESD Protection Device CONTENTS
Classication Product Item Type Page
Safety Precautions (Common precautions for Noise Suppression Device and ESD Suppressor) 2
Noise
Suppression Device
Common mode Noise Filters
EXC X4CE 3
EXC 14CX 5
EXC 14CG, 14CE 7
EXC 24CH 9
EXC 24CG 11
EXC 24CE, 24CF 13
EXC 34CG, 34CE 15
Common mode Noise Filter Array
EXC 18CG, 18CE 17
EXC 28CH 19
EXC 28CG 21
EXC 28CE 23
Common specications for Common mode Noise Filters / Array 25
2 mode Noise Filters
EXC 14CP 28
EXC 24CB, 24CP, 24CN 30
Coil type EMI Filters ELK EA, E, EV 34
ESD
Protection Device
ESD Suppressor
EZA EG1A, EG2A, EG3A 40
EZA EG1N, EG2N 42
ESD Suppressor Array EZA EGCA 44
Common specications for ESD Suppressor / Array 46
Multilayer Varistor
(DC voltage lines / High speed signal lines)
EZJ Z / EZJ P 47
Multilayer Varistor
(2 Array Type for high speed signal lines)
EZJ ZSV-A 52
Multilayer Varistor (DC voltage lines) EZJZ S 54
Common specications for Multilayer Varistor 56
All products in this catalog comply with the RoHS Directive.
The RoHS Directive is the Directive (2011/65/EU) on the Restriction of the Use of Certain
Hazardous Substances in Electrical and Electronic Equipment and its revisions.
Oct. 2013
2
Safety Precautions (Common precautions for Noise Suppression Device and ESD Suppressor)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specications with us in advance. The design and specications in this catalog are subject
to change without prior notice.
Do not use the products beyond the specications described in this catalog.
This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signicant dam age, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, ofce equipment, information and communication equipment)
These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inammables, such as vinyl-coated wires, near these products.
Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
Carefully select a ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 C to 35 C and a relative humidity of 45 % to 85 %.
The performance of Noise Suppression Device is guaranteed for 6 months or a year after our delivery, provided that
they are stored at a temperature of -5 C to +40 C and a relative humidity of 40 % to 60 %. Check the guarantee
period in the specications.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Nov. 2012 00
3
Design and specications are each subject to change without notice. Ask factory for the current technical specications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
10
11 12
Noise Filter
High speed
Differential transmission
E
Coupled
type
The rst two digits are
signicant gure of
impedance value, and the
third one denotes the
number of zeros following
Packing
Punched Carrier Taping
2 mm pitch, 10,000 pcs.
Code
U
Product Code Type Characteristics Size Nominal Impedance Form Sufx
C
Number of
Terminals
4 Terminals
Dimensions(mm)
0.65 0.50 0.30
(L) (W) (H)
Code
X
4 3
1 2
4 3
1 2
E
F
A
B
D
C
Ferrite
Inner Conductor
Electrode
Type:
EXCX4CE
Features
Small size and low-prole
L 0.65 mmW 0.50 mmH 0.30 mm
Filtering the noise of high-speed differential signaling
lines and minimizing deformations of transmitted signal
waveforms
Rigidly layered and sintered structure with high
resistance to reow heat and mounting reliability
Lead, halogen, and antimony free
RoHS compliant
Recommended Applications
Smart phone, Tablet PCs and DSC
Noise suppression of high-speed data lines such as
MIPI, USB and LVDS
Explanation of Part Numbers
Dimensions in mm (not to scale) Construction
Circuit Confguration(No Polarity)
Type
(inch size)
Dimensions (mm) Mass
(Weight)
[mg/pc.]
A B C D E F
EXCX4CE
(0202)
0.500.05 0.650.05 0.300.05 0.120.10 0.400.10 0.150.10 0.56
The pin numbers shown here are for reference purposes
only. Conrm the actual pin number arrangement with
the exchanged specication documents.
Nov. 2012 00
4
(B) Differential Mode (A) Common Mode
Z Z
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1 10 100 1000 10000
Common Mode
Differential Mode
Ratings
Impedance Characteristics (Typical)
Measurement Circuit
Part Number
Impedance () at 100 MHz
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()
Common Mode Differential Mode
EXCX4CE900U 90 20 % 20 max. 5 100 3.230 %
EXCX4CE900
Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Related Information
Category Temperature Range 40 C to +85 C
Nov. 2012 00
5
10
11 12
Noise Filter
Both Common mode
and Differential mode
noise suppression type
E
Coupled
type
signicant gure of
Packing
Embossed Carrier Taping
Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
0.85 0.65 0.45
(L) (W) (H)
Code
1
4 3
1 2
4 3
1 2
E
F
A
B
D
C
Ferrite
Inner Conductor
Electrode
Type:
EXC14CX
Features
L 0.85 mmW 0.65 mmH 0.45 mm
This EXC14CX type are designed to suppress noise
from MIPI interface in Mobile Phone
This lter can suppress not only common mode noise
but also differential mode noise at mobile phone RF
band
RoHS compliant
Mobile phone, DSC, notebook PCs and Digital displays
MIPI, USB and LVDS
Type
(inch size)
(Weight)
[mg/pc.]
A B C D E F
EXC14C
(0302)
0.650.05 0.850.05 0.450.05 0.10 min. 0.500.10 0.270.10 1.4
Nov. 2012 00
6
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1 10 100 1000 10000
Differential Mode
Common Mode
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1 10 100 1000 10000
Common Mode
Differential Mode
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-35
-30
-25
-5
-10
-15
-20
0
1 10 100 1000 10000
Common Mode
Differential Mode
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-35
-30
-25
-5
-10
-15
-20
0
1 10 100 1000 10000
Common Mode
Differential Mode
Z Z
Ratings
Measurement Circuit
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max.
EXC14CX280U 28 20 % 25 max. 5 130 3.0
EXC14CX400U 40 25 % 30 max. 5 130 4.0
EXC14CX400U EXC14CX280U
Insertion Loss (Typical)
EXC14CX400U EXC14CX280U
Nov. 2012 00
7
10
11 12
Noise Filter
High-Q type G
High speed
E
Coupled
type
signicant gure of
Packing
Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
0.85 0.65 0.45
(L) (W) (H)
Code
1
4 3
1 2
4 3
1 2
E
F
A
B
D
C
Ferrite
Inner Conductor
Electrode
Type:
EXC14CG
EXC14CE
Features
L 0.85 mmW 0.65 mmH 0.45 mm
waveforms
Low DC resistance and insertion loss
High-Q lters with high impedance at around 1 GHz
: CG type
RoHS compliant
USB, LVDS and HDMI lines
Type
(inch size)
(Weight)
[mg/pc.]
A B C D E F
EXC14CG/CE
(0302)
0.650.05 0.850.05 0.450.05 0.10 min. 0.500.10 0.270.10 1.4
Nov. 2012 02
8
Z Z
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1 10 100 1000 10000
Common Mode
Differential Mode
1
10
100
1000
1 10 100 1000 10000
Common Mode
Differential Mode
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1 10 100 1000 10000
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
Common Mode
Differential Mode
Ratings
Measurement Circuit
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max.
EXC14CG430U 43 25 % 15 max. 5 100 2.7
EXC14CE650U 65 20 % 20 max. 5 130 2.5
EXC14CE900U 90 20 % 20 max. 5 130 2.5
EXC14CG430U
EXC14CE900U
EXC14CE650U
Nov. 2012 02
9
E
1
X
2
C
3
2
4
4
5
C
6
H
7
9
8
0
9
0
10
U
11 12
Noise Filter
High speed
(for Gbps)
H
Coupled
type
signicant gure of
Packing Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
1.25 1.00 0.50
(L) (W) (H)
Code
2
Ferrite
Inner Conductor
Electrode
E
F
A
B
D
C
4 3
1 2
4 3
1 2
Type:
EXC24CH
Features
(L 1.25 mmW 1.00 mmH 0.50 mm)
The achievement of the 6 GHz to 10 GHz signal
cutoff frequency minimized the adverse effects
on high-speed differential signaling lines, such as
rounding of signal waveforms, and also enabled the
suppression of high-frequency noise.
Rigid multi-layer sintered structure with high resistance
to reow heat and mounting reliability
RoHS compliant
Noise suppression for high-speed transmission circuits
of the following equipment:
Digital AV equipment (TV, DVD/Blu-ray drives)
Information equipment (PCs, HDD)
Communications equipment (mobile phones, smart
phones)
Interface examples
USB 3.0, HDMI, SATA, DisplayPort
Construction Dimensions in mm (not to scale)
Circuit Confguration (No Polarity)
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
[mg/pc.] A B C D E F
EXC24CH
(0504)
1.250.15 1.000.15 0.500.10 0.200.15 0.550.10 0.300.10 3
Nov. 2012 02
10
Z Z
EXC24CH500U
EXC24CH900U
1 10 100 1000 10000
Frequency (MHz)
0
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-4
-2
-6
-8
-10
Common Mode
EXC24CH500U
EXC24CH900U
EXC24CH900U
EXC24CH500U
Differential Mode
1 10 100 1000 10000
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1000
100
10
1
Ratings
Measurement Circuit
Part Number
Catoff Frequency
(GHz)
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max.
EXC24CH500U 50 25 % 13 max. 10 Typ. 5 160 1.5
EXC24CH900U 90 20 % 15 max. 6 Typ. 5 130 2.5
Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautionss
Nov. 2012 02
11
E
1
X
2
C
3
2
4
4
5
C
6
G
7
9
8
0
9
0
10
U
11 12
Noise Filter
High speed
(for Gbps)
G
Coupled
type
signicant gure of
Packing Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
1.25 1.00 0.50
(L) (W) (H)
Code
2
Ferrite
Inner Conductor
Electrode
E
F
A
B
D
C
4 3
1 2
4 3
1 2
Type:
EXC24CG
Features
Reduce the common mode noise and reform the signal
wave by high-coupled inductors
Characteristic impedance is controlled to near 100 ,
suppressing the signal reection
Meet the Mask-test for HDMI and suppressing the
overshoot and skew etc
Realize the high reliability and mounting by the simple
multi-layer structure
(L 1.25 mmW 1.00 mmH 0.50 mm)
RoHS compliant
HDMI date lines such as TV, STB, DVD, DVC.
S-ATA date lines such as PCs, HDD.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC24CG
(0504)
1.250.15 1.000.15 0.500.10 0.200.15 0.550.10 0.300.10 3
Nov. 2012 02
12
Z Z
Differential Mode
Common Mode
1 10 100 1000 10000 1 10 100 1000 10000
Frequency (MHz) Frequency (MHz)
10000
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
1000
100
10
1
10000
1000
100
10
1
Differential Mode
Common Mode
Ratings
Measurement Circuit
EXC24CG240U
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max.
EXC24CG240U 24 25 % 15 max. 5 160 1.5
EXC24CG900U 90 25 % 20 max. 5 100 3.0
EXC24CG900U
Nov. 2012 02
13
10
11 12
Noise Filter
High speed
(for Mbps)
E
Coupled
type
signicant gure of
High speed
(for Mbps) High-Q type
F
C
Number of
Terminals
4 Terminals
Dimensions(mm)
1.25 1.00 0.50
(L) (W) (H)
Code
2
Packing Code
U
Ferrite
Inner Conductor
Electrode
E
F
A
B
D
C
4 3
1 2
4 3
1 2
Type:
EXC24CE
EXC24CF
Features
Reduce the common mode noise and reform the signal
wave by high-coupled inductors
The strong multi-layer structure provides high resistance
to reow soldering heat and a high mounting reliability
Magnetic shield type
High-Q impedance : EXC24CF type is also available
(L 1.25 mmW 1.00 mmH 0.50 mm)
RoHS compliant
USB data lines such as PCs, DSC, Mobile phone.
LVDS data lines such as PCs, TV.
IEEE1394 data lines such as PCs, TV.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC24CE/CF
(0504)
1.250.15 1.000.15 0.500.10 0.200.15 0.550.10 0.300.10 3
Nov. 2012 02
14
Z Z
1
10
100
1000
10000
1 10 100 1000 10000
1
10
100
1000
10000
1 10 100 1000 10000
Frequency (MHz)
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
1000
1
10
100
1000
1 10 100 1000 10000
1
10
100
1000
1 10 100 1000 10000 1 10 100 1000 10000
Common Mode
Common Mode
Common Mode
Differential Mode
Differential Mode
Differential Mode
Common Mode
Differential Mode
Common Mode
Differential Mode
Ratings
Measurement Circuit
EXC24CE121U EXC24CE201U
EXC24CF900U
EXC24CE360UP EXC24CE900U
Part Number
Impedance () at 100 MHz Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max. Common Mode Differential Mode
EXC24CE360UP 36 25 % 20 max. 5 200 1.00
EXC24CE900U 90 25 % 15 max. 5 160 1.75
EXC24CE121U 120 25 % 18 max. 5 140 2.20
EXC24CE201U 200 25 % 20 max. 5 130 2.70
EXC24CF900U 90 25 % 20 max. 5 130 2.50
Nov. 2012 02
15
E
1
X
2
C
3
3
4
4
5
C
6
G
7
9
8
0
9
0
10
U
11 12
Noise Filter
High speed
(for Mbps)
E
High speed
(for Gbps)
G
Coupled
type
signicant gure of
Packing Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
2.00 1.25 0.50
(L) (W) (H)
Code
3
Ferrite
Inner Conductor
Electrode
E
F
A
B
D
C
4 3
1 2
4 3
1 2
Type:
EXC34CG/CE
Features
Low-prole
(L 2.0 mmW 1.25 mmH 0.50 mm)
waveforms
RoHS compliant
Digital AV equipment (TV, Digital displays, DVD)
Interface examples
USB, LVDS, HDMI, LAN
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC34C
(0805)
2.000.15 1.250.15 0.500.10 0.300.20 0.800.10 0.300.15 5
Nov. 2012 01
16
Z Z
Frequency (MHz)
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
I
m
p
e
d
a
n
c
e

(
)
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1
10
100
10
100
1000
1 10 100 1000
Common Mode
Differential Mode
1
10
100
1000
10000
1 10 100 1000 10000
1
1000
1 10 100 1000
1
10
100
10
100
1000
1 10 100 1000
1
1000
1 10 100 1000
Differential Mode
Differential Mode
Differential Mode
Differential Mode
Common Mode Common Mode
Common Mode
Common Mode
Ratings
Part Number
Rated Current
(mA DC)
Rated Voltage
(V DC)
Insulation Re sis tance
(M min.)
Withstand Voltage
(V DC)
DC Re sis tance
()max.
Common Mode
EXC34CE670U 67 25 % 250 5 10 M 125 0.8
EXC34CE900U 90 25 % 250 5 10 M 125 0.8
EXC34CE121U 120 25 % 200 5 10 M 125 1.0
EXC34CE201U 200 25 % 200 5 10 M 125 1.0
EXC34CG900U 90 25 % 100 5 10 M 125 3.0
EXC34CG900U

Nov. 2012 01
17
10
11 12
Noise Filter
High speed
E
Coupled
type
signicant gure of
Packing
Code
U
High-Q type G
C
Number of
Terminals
8 Terminals
Dimensions(mm)
1.6 0.8 0.4
(L) (W) (H)
Code
1
Ferrite
Inner Conductor
Electrode
A
C
B
F
D
E
6 5
3 4
8 7
1 2
8 7
1 2
6 5
3 4
Type:
EXC18CG

EXC18CE
Features
2 Common mode noise lters in one package
(L 1.6 mmW 0.8 mmH 0.4 mm)
waveforms
Low DC resistance and insertion loss
High-Q lters with high impedance at around 1 GHz
: CG type
RoHS compliant
USB, LVDS and HDMI lines
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC18CG/CE
(0603)
0.80.1 1.60.1 0.40.1 0.20.1 0.40.1 0.20.1 2.6
The pin numbers shown here are for reference purposes only. Conrm the actual
pin number arrangement with the exchanged specication documents.
Nov. 2012 02
18
1
10
100
1000
1 10 100 1000 10000
1
10
100
1000
1 10 100 1000 10000
1
10
100
1000
1 10 100 1000 10000
Frequency (MHz)
I
m
p
e
d
a
n
c
e
(
)
I
m
p
e
d
a
n
c
e
(
)
Frequency (MHz)
I
m
p
e
d
a
n
c
e
(
)
Common Mode
Differential Mode
Common Mode
Common Mode
Differential Mode
Common Mode
Differential Mode
1
10
100
1000
1 10 100 1000 10000
Differential Mode
I
m
p
e
d
a
n
c
e
(
)
Z Z
EXC18CG430U
EXC18CE201U
EXC18CE650U
Ratings
Part Number
Impedance () at 100 MHz Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max. Common Mode Differential Mode
EXC18CG430U 43 25 % 15 max. 5 100 2.7
EXC18CE650U 65 20 % 18 max. 5 140 1.8
EXC18CE900U 90 20 % 20 max. 5 130 2.0
EXC18CE201U 200 20 % 22 max. 5 100 3.5
Measurement Circuit
EXC18CE900U
Nov. 2012 02
19
E
1
X
2
C
3
2
4
8
5
C
6
H
7
9
8
0
9
0
10
U
11 12
Noise Filter
High speed
(for Gbps)
H
Coupled
type
signicant gure of
Packing Code
U
C
Number of
Terminals
8 Terminals
Dimensions(mm)
2.0 1.0 0.5
(L) (W) (H)
Code
2
Ferrite
Inner Conductor
Electrode
A
C
B
F
D
E
6 5
3 4
8 7
1 2
8 7
1 2
6 5
3 4
Type:
EXC28CH
Features
(L 2.0 mmW 1.0 mmH 0.5 mm)
The achievement of the 6 GHz to 10 GHz signal cutoff
frequency minimized the adverse effects on high-
speed differential signaling lines, such as rounding of
signal waveforms, and also enabled the suppression
of high-frequency noise.
RoHS compliant
Noise suppression for high-speed transmission circuits
of the following equipment:
Digital AV equipment (TV, DVD/Blu-ray drives)
Communications equipment (mobile phones, smart
phones)
Interface examples
USB 3.0, HDMI, SATA, DisplayPort
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC28CH
(0804)
1.000.15 2.00.2 0.50.1 0.200.15 0.50.1 0.250.10 5
Nov. 2012 02
20
Z Z
EXC28CH500U
EXC28CH900U
1 10 100 1000 10000
Frequency (MHz)
0
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-4
-2
-6
-8
-10
Common Mode
EXC28CH500U
EXC28CH900U
EXC28CH900U
EXC28CH500U
Differential Mode
1 10 100 1000 10000
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
1000
100
10
1
Ratings
Measurement Circuit
Part Number
Catoff Frequency
(GHz)
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max.
EXC28CH500U 50 25 % 13 max. 10 Typ. 5 160 1.5
EXC28CH900U 90 20 % 15 max. 6 Typ. 5 130 2.5
Nov. 2012 02
21
E
1
X
2
C
3
2
4
8
5
C
6
G
7
9
8
0
9
0
10
U
11 12
Noise Filter
High speed
(for Gbps)
G
Coupled
type
signicant gure of
C
Number of
Terminals
8 Terminals
Dimensions(mm)
2.0 1.0 0.5
(L) (W) (H)
Code
2
Packing Code
U
Ferrite
Inner Conductor
Electrode
A
C
B
F
D
E
6 5
3 4
8 7
1 2
8 7
1 2
6 5
3 4
Type:
EXC28CG
Features
Small size and low-prole(L 2.0 mmW 1.0 mmH 0.5 mm)
The 3 GHz or wider signal pass band prevents rounding of transmitted signal waveforms.
The TDR value is controlled to 100 (typ.), preventing transmission signal reection
The lter passed the HDMI eye pattern test, and was improved against jitters, phase shifting, and other waveform
deformations.
Reduce the common mode noise and reform the signal wave by high-coupled inductors
RoHS compliant
HDMI data lines such as TV, STB, DVD, DVC.
S-ATA data lines such as PCs , HDD.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC28CG
(0804)
1.000.15 2.00.2 0.50.1 0.200.15 0.50.1 0.250.10 5
Nov. 2012 02
22
Z Z
1 10 100 1000 10000
Frequency (MHz)
10000
I
m
p
e
d
a
n
c
e
(
)
1000
100
10
1
1 10 100 1000 10000
Frequency (MHz)
10000
I
m
p
e
d
a
n
c
e
(
)
1000
100
10
1
Common Mode
Differential Mode
Common Mode
Differential Mode
Ratings
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
()max.
EXC28CG240U 24 25 % 15 max. 5 160 1.5
EXC28CG900U 90 25 % 17 max. 5 130 3.0
Measurement Circuit
EXC28CG900U EXC28CG240U
Nov. 2012 02
23
10
11 12
Noise Filter
High speed
(for Mbps)
E
Coupled
type
signicant gure of
C
Number of
Terminals
8 Terminals
Dimensions(mm)
2.0 1.0 0.5
(L) (W) (H)
Code
2
Packing Code
U
Ferrite
Inner Conductor
Electrode
A
C
B
F
D
E
6 5
3 4
8 7
1 2
8 7
1 2
6 5
3 4
Type:
EXC28CE
Features
(L 2.0 mmW 1.0 mmH 0.5 mm)
Reduce the common mode noise and reform the sig-
nal wave by high-coupled inductors
RoHS compliant
IEEE1394 data lines such as PCs, DVC, TV.
LVDS data lines such as PCs, TV.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
EXC28CE
(0804)
1.000.15 2.00.2 0.50.1 0.200.15 0.50.1 0.250.10 5
Nov. 2012 02
24
Frequency (MHz)
I
m
p
e
d
a
n
c
e
(
)
Common Mode
Differential Mode
Common Mode
Differential Mode
1
10
100
1000
1 10 100 1000 10000
1
10
100
1000
1 10 100 1000 10000
Frequency (MHz)
Frequency (MHz)
I
m
p
e
d
a
n
c
e
(
)
I
m
p
e
d
a
n
c
e
(
)
Common Mode
Common Mode
Differential Mode
1
10
100
1000
1 10 100 1000 10000
Frequency (MHz)
I
m
p
e
d
a
n
c
e
(
)
1
10
100
1000
1 10 100 1000 10000
Differential Mode
Z Z
EXC28CE900U
EXC28CE301U
EXC28CE121U
Ratings
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max.
EXC28CE900U 90 25 % 15 max. 5 160 1.5
EXC28CE121U 120 25 % 18 max. 5 140 2.0
EXC28CE201U 200 25 % 20 max. 5 130 2.5
EXC28CE301U 300 25 % 30 max. 5 80 5.0
Measurement Circuit
EXC28CE201U
Nov. 2012 02
25
Common mode Noise Filters / Array
B
F
W
E
P1 P2
fD0
P0
A
Tape running direction
T
Chip component
Sprocket hole
Compartment
t1
t2
D0
P1 P2
A
B
F
E
W
f
P0
Chip component
Sprocket hole
Compartment
Tape running
direction
t1
t2 P1 P2 P0
A
B
F
E
W
fD0
Chip component
Sprocket hole Compartment
Packaging Methods (Taping)
Standard Quantity
Part Number Size (inch) Kind of Taping Pitch (P
1
) Quantity
EXCX4CU 0202 Punched Carrier Taping 2 mm 10000 pcs./reel
EXC14CU 0302
2 mm 10000 pcs./reel
EXC24CU 0504
4 mm 5000 pcs./reel
EXC18CU 0603
EXC28CU 0804
EXC34CU 0805
(mm)
Type A B W F E P
1
P
2
P
0
fD
0
T
EXCX4C 0.600.10 0.800.10 8.00.2 3.500.05 1.750.10 2.00.1 2.00.1 4.00.1 1.5
+0.1
0.35 typ.
0
(mm)
Type A B W F E P
1
P
2
P
0
fD
0
t
1
t
2
EXC14C 0.750.10 0.950.10 8.00.2 3.500.05 1.750.10 2.00.1 2.00.1 4.00.1 1.5
+0.1
0.250.05 0.850.15
0
(mm)
A B W F E P
1
P
2
P
0
fD
0
t
1
t
2
EXC18C 1.000.10 1.800.10
8.00.2 3.50.1 1.750.10 4.00.1 2.00.1 4.00.1 1.5
+0.1
0.250.05
0.800.05
EXC24C
1.200.15
1.450.15
0.900.15 EXC28C 2.250.15
EXC34C 1.500.20 2.300.20
0
Nov. 2012 03
26
A
D
C
D
E F E
B
A
D
C
D
E F
B
E
T
W
fD
fC
fA
f
B
Taping Reel
Standard Reel Dimensions (mm)
Type 0A 0B 0C 0D
EXCX4C
180.03.0 60.01.0
13.00.2
21.00.8
EXC14C
EXC18C
EXC24C
EXC28C
EXC34C
13.00.5
Type E W T
EXCX4C
2.00.5 9.00.3
11.41.0
EXC14C
EXC18C
EXC24C
EXC28C
EXC34C
11.41.5
Recommended Land Pattern Design
Type
Dimensions (mm)
A B C D E F
EXC18 C 1.4 1.4 0.4 0.5 0.2 0.4
EXC28 C 1.4 1.75 0.4 0.5 0.25 0.5
Type
Dimensions (mm)
A B C D E F
EXCX4C
0.80 to
0.90
0.60 to
0.75
0.20 to
0.30
0.30
0.20 to
0.25
0.20 to
0.25
EXC14C
0.80 to
1.00
0.80 0.30
0.25 to
0.35
0.30 0.20
EXC24 C
1.60 to
2.00
0.95 0.70
0.45 to
0.65
0.35 0.25
EXC34C 2.60 1.20 1.10 0.75 0.40 0.40
EXCX4, EXC14, EXC24, EXC34
EXC18C, EXC28C
Nov. 2012 03
27
Preheating
Peak
Heating
T
e
m
p
e
r
a
t
u
r
e
Time
Recommended Soldering Conditions
Recommendations and precautions are described below
Safety Precations
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based ux or halogen-free ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Common mode Noise Filters (hereafter called the filters) or pinch them with a hard tool
(e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive me-
chanical stress may damage the filters. Handle with care.
4. Store the lters in a location with a temperature ranging from 5 C to +40 C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
5. Use the lters within half a year after the date of the outgoing inspection indicated on the packages.
<Repair with hand soldering>
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder
each electrode for 3 seconds or less.
Never touch this product with the tip of a soldering iron.
Temperature Time
Preheating 140 C to 160 C 60 s to 120 s
Main heating Above 200 C 30 s to 40 s
Peak 235 10 C max. 10 s
Temperature Time
Peak max. 260 C max. 10 s
Recommended soldering conditions for reow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Reow soldering shall be performed a maximum of
two times.
Please contact us for additional information when
used in conditions other than those specied.
Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Flow soldering
We do not recommend ow soldering , because ow soldering may cause bridges between the electrodes.
Nov. 2012 03
28
10
11 12
Noise Filter
Low DCR Type P
Coupled
type
signicant gure of
Packing
Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
0.85 0.65 0.45
(L) (W) (H)
Code
1
E
F
A
B
D
C
Ferrite
Inner Conductor
Electrode
4 3
1 2
4 3
1 2
Features
Small size and low-prole : 0302 inch size
(L 0.85 mmW 0.65 mmH 0.45 mm)
Burst/radiation noise ltering for audio circuits
The optimally magnetic-coupled ferrite beads allow for
the ltering of both common and normal mode noises
RoHS compliant
Type:
EXC14CP
Receiver lines, speaker lines, microphone lines and
headset of Smart phone.
Audio signal lines of Portable audio equipment, PCs,
PDAs.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
[mg/pc.]
A B C D E F
EXC14CP
(0302)
0.650.05 0.850.05 0.450.05 0.10 min. 0.500.10 0.270.10 1.2
Jul. 2013 00
29
0
100
200
300
1 10 100 1000 10000
0
100
200
300
400
500
1 10 100 1000 10000
I
m
p
e
d
a
n
c
e

(
)
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
Frequency (MHz)
Open Mode
Common Mode
Open Mode
Common Mode
(A)Open Mode (B)Common Mode

Ratings
Part Number
Impedance() at 100 MHz
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max.
Open mode Common mode
EXC14CP121U 120 30 % 75 25 %
5
300 0.5
EXC14CP221U 220 30 % 140 25 % 200 0.7
EXC14CP221U EXC14CP121U
Measurement Circuit
Jul. 2013 00
30
E
1
X
2
C
3
2
4
4
5
C
6
B
7
1
8
0
9
2
10
U
11 12
Noise Filter
High Impedance Type B
Low DCR Type P
Coupled
type
signicant gure of
Packing
Code
U
C
Number of
Terminals
4 Terminals
Dimensions(mm)
1.25 1.00 0.50
(L) (W) (H)
Code
2
E
1
X
2
C
3
2
4
4
5
C
6
N
7
6
8
0
9
1
10
X
11 12
Noise Filter
High Impedance Type
and Low DCR Type
N
Coupled
type
signicant gure of
Packing
Pressed Carrier Taping
Code
X
C
Number of
Terminals
4 Terminals
Dimensions(mm)
1.25 1.00 0.50
(L) (W) (H)
Code
2
Ferrite
Inner Conductor
Electrode
E
F
A
B
D
C
Features
Burst/radiation noise ltering for audio circuits
The optimally magnetic-coupled ferrite beads allow for
the ltering of both common and normal mode noises
High Impedance : 220 to 1 kEXC24CB type)
Low Resistance Value : 0.4 max. (EXC24CP type)
High Impedance : 600 ,
Low Resistance Value : 0.9 max. (EXC24CN type)
RoHS compliant
Type:
EXC24CB/CP
EXC24CN
EXC24CB/CP Type
Receiver lines, speaker lines, microphone lines and
headset of mobile phones.
Audio signal lines of Portable audio equipment, PCs,
PDAs.
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
[mg/pc.]
A B C D E F
EXC24C
(0504)
1.000.15 1.250.15 0.500.10 0.200.15 0.650.10 0.350.10 3
EXC24CN Type
Jul. 2013 03
31
4 3
1 2
4 3
1 2
I
m
p
e
d
a
n
c
e
(
)
Frequency(MHz)
I
m
p
e
d
a
n
c
e
(
)
Frequency(MHz)
0
100
200
300
400
500
1 10 100 1000 10000
0
100
200
300
400
500
1 10 100 1000 10000
Normal mode
Open mode
Common mode
Normal mode
Open mode
Common mode
I
m
p
e
d
a
n
c
e
(
)
Frequency(MHz)
500
400
300
200
100
0
1 10 100 1000 10000
Open mode
Normal mode
Common mode
I
m
p
e
d
a
n
c
e
(
)
Frequency(MHz)
1200
1000
800
600
400
200
0
1 10 100 1000 10000
Open mode
Normal mode
Common mode
(A)Open Mode (B)Common Mode (C)Normal Mode

Measurement Circuit
EXC24CP121U
EXC24CB221U
EXC24CP221U
EXC24CB102U
Part Number
Impedance (Open mode)
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max.
() at 100 MHz Tolerance(%)
EXC24CP121U 120
25 5
500 0.3
EXC24CP221U 220 350 0.4
EXC24CB221U 220 100 0.7
EXC24CB102U 1000 50 1.5
Ratings
Part Number
Impedance (Common mode)
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Re sis tance
() max.
() at 100 MHz Tolerance(%)
EXC24CN601X 600 25 5 200 0.9
Jul. 2013 03
32
t1
t2 P1 P2 P0
A
B
F
E
W
fD0
Chip component
Sprocket hole Compartment
E
T
W
fD
fC
fA
f
B
(A)Open Mode
(C)Differential Mode
(B)Common Mode

I
m
p
e
d
a
n
c
e
(
)
Frequency(MHz)
200
400
600
800
1000
1200
1400
1600
1 10 100 1000 10000
Common mode
Open mode
Differential mode
Chip component
Sprocket hole
Compartment
P0 P2
P1
t2
F
W
E
A
B
fD0
Taping Reel
Standard Quantity
Embossed Carrier Dimensions (mm)
Standard Reel Dimensions (mm)
Measurement Circuit EXC24CN601X
Pressed Carrier Dimensions (mm)
Kind of Taping Pitch (P
1
) Quantity
EXC14CPU
2 mm 10000 pcs./reel
EXC24CP/CBU 4 mm 5000 pcs./reel
EXC24CNX Pressed Carrier Taping 2 mm 10000 pcs./reel
Part Number fA fB fC fD E W T
EXC14C/EXC24C 180.03.0 60.01.0 13.00.5 21.00.8 2.00.5 9.00.3 11.41.5
Part Number A B W F E P
1
P
2
P
0
fD
0
t
1
t
2
EXC14CP 0.750.10 0.950.10 8.00.2 3.500.05 1.750.10 2.00.1 2.00.1 4.00.1 1.5
+0.1
0.250.05 0.850.15
EXC24CP/CB 1.200.15 1.450.15 8.00.2 3.50.1 1.750.10 4.00.1 2.00.1 4.00.1 1.5
+0.1
0.250.05 0.900.15
0
0
Part Number A B W F E P
1
P
2
P
0
fD
0
t
2
EXC24CN 1.140.10 1.380.15 8.00.2 3.50.1 1.750.10 2.00.1 2.00.1 4.00.1 1.5
+0.1
0.680.10 0
Jul. 2013 03
33
A
D
C
D
E F E
B
Preheating
Peak
Heating
T
e
m
p
e
r
a
t
u
r
e
Time
Recommended Land Pattern Design
Recommendations and precautions are described below.
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
1. Use rosin-based ux or halogen-free ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to 2 mode Noise Filters (hereafter called the lters) or pinch them with a hard tool (e.g. pli-
ers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive me chanical
stress may damage the lters. Handle with care.
4. Store the lters in a lo ca tion with a temperature ranging from 5 C to +40 C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
5. Use the lters within half a year after the date of the outgoing inspection indicated on the packages.
Safety Precautions
<Repair with hand soldering>
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder
each electrode for 3 seconds or less.
Never touch this product with the tip of a soldering iron.

Temperature Time
Peak 235 10 C max. 10 s
Temperature Time
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
two times.
Flow soldering
We do not recommend ow soldering , because ow soldering may cause bridges between the electrodes.
Part
Number
Dimension (mm)
A B C D E F
EXC14CP
0.80 to
1.00
0.80 0.30
0.25 to
0.35
0.30 0.20
EXC24 CP
EXC24CB
EXC24CN
1.50 to
1.90
1.10 0.50
0.50 to
0.70
0.40 0.30
Jul. 2013 03
Coil type EMI Filters
34
E
1
L
2
K
3
E
4
A
5
1
6
0
7
3
8 9 10
A F
Product Code Model Type Capacitance
E 3218 (1207)
size : mm (inch)
A A 6 A model
Packaging Design No.
F Embossed Carrier Taping Use only for reow soldering
Nil 2 A model
E
1
L
2
K
3
E
4
V
5
3
6
5
7
2
8 9 10
C F
Product Code Model Type Capacitance
V
F
E
C
15 V
12 V
5 V
Included varistor
Packaging Design No.
F Embossed Carrier Taping Circuit voltage E 3218 (1207)
size : mm (inch)
1
2
3
4
(Digital Noise Filters)
Type:
ELKE
[ELKE, ELKEA Series]
Data lines, secondary power supply lines (DC lines) for game, digital AV and communications equipment.
Features
3218 case size, 6 A rated current (ELKEA) and 2 A rated
current (ELKE).
High ESD suppression with varistor and included coils.
No variation in attenuation characteristics as current changes.
The stable P/N marking using laser technology makes the
part number check easier.
RoHS compliant
[ELKEV Series]
No. Part Name Material
1 Enclosure PPS resin mixed with ferrite powder
2 Coil Copper alloy plate
3 Terminal Copper alloy plate with SnCu
4 Capacitor Chip capacitor
Construction
May. 2013 02
35
300
T
e
m
p
.

(
C
)
Time
200
260 C max.
180 C
230 C
150 C
100
60 to 120 s 30 to 40 s
0
0.8
2.3
0
.
7
2
.
2
3.2 1.8
0
.
8
P/N, Date Code
5.0
2.2
2
.
6
1
.
8
0.8
Content indication
Top tape
Embossed carrier tape
Reel
Pulling direction
Reel Product Pocket Empty Pocket Leader tape
Terminal Product
Soldering conditions for refow
Dimensions in mm (not to scale) Land Pattern in mm (not to scale)
Reel Size : 0178
Qty : 2000 pcs./Reel
Packaging : Embossed Carrier Taping
Packaging state
Storage Conditions
Package : Normal temperature (5 to 35 C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
Operating Temperature : 40 to +85 C
Storage Period
Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specied limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
May. 2013 02
36
Month Code : 1 Letter
Inner Capacitance : 3 Letters
Top
View
Side
View
1 0 3 P
103P
ndication 1 ndication 2
ELKEA103FA 2 2 2 PELKEA100FA
ELKEA220FA
ELKEA470FA
ELKEA101FA
ELKEA221FA
ELKEA471FA
ELKEA102FA
ELKEA222FA
ELKEA333FA
L L
C
SG
5
0
5
0
VV
1 10 100 1000 10000
-60
-50
-40
-30
-20
-10
0
10
ELKEAFA
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
100
220
470
101
221
471
102
222
103
333
Large Current Coil type EMI Filters (Digital Noise Filters)
SMD
Type:
ELKEA
Features
3218 case size, 6 A rated current.
No variation in attenuation characteristics as current
changes.
The stable P/N marking using laser technology makes
the part number check easier.
RoHS compliant
Part No.
Cut off frequency
(MHz)
Inner Capacitance
(pF typ.)
Rated
Voltage
(V)
Rated
Current
(A)
Indication
min.
Packaging
unit (pcs.)
ELKEA100FA 500 10
50
6.0
100
Indication 2
2000
ELKEA220FA 300 22 220
ELKEA470FA 150 47 470
ELKEA101FA 70 100 101
ELKEA221FA 30 220 221
ELKEA471FA 15 470 471
ELKEA102FA 7 1000 102
ELKEA222FA 3 2200 222
ELKEA103FA 0.5/DC 10000 103 Indication 1
ELKEA333FA 0.2/DC 33000 25 333 Indication 2
Typical Specifcation
Operating temperature : 40 to +85 C
Rated Voltage : DC 50 V (Except ELKEA333FA : DC25 V)
Rated Current : DC 6 A
Standard Parts
note1 : 4th letter () of marking indicates the Month Code.
note2 : Indication 1, 2 refer to Indication examples.
Indication Examples
Performance characteristics (Reference) Equivalent circuit, measurement block diagram
May. 2013 02
37
1 10 100 1000 10000
-60
-50
-40
-30
-20
-10
0
10
ELKEFA
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
100
220
470
101
221
471
102
222
103
333
L L
C
SG
5
0
5
0
VV
1 0 3 P
103P
(Top View)
(Side View)
Coil type EMI Filters (Digital Noise Filters)
SMD
Type:
ELKE
Rated Voltage : DC 50 V (Except ELKE333FA : DC25 V)
Standard Parts
note1 : 4th letter () of marking indicates the Month Code.
Part No.
Cut off frequency
(MHz)
Inner Capacitance
(pF typ.)
Rated
Voltage
(V)
Rated
Current
(A)
Indication
min. Packaging unit
(pcs.)
ELKE100FA 250 10
50
2.0
100
2000
ELKE220FA 200 22 220
ELKE470FA 100 47 470
ELKE101FA 50 100 101
ELKE221FA 25 220 221
ELKE471FA 10 470 471
ELKE102FA 5 1000 102
ELKE222FA 2 2200 222
ELKE103FA 0.5/DC 10000 103
ELKE333FA 0.2/DC 33000 25 333
Features
3218 case size, 2 A rated current.
No variation in attenuation characteristics as current
changes.
RoHS compliant
Indication Examples
May. 2013 02
38
L L
C
SG
5
0
5
0
VV
3 5 2 P
352P
-50
-40
-30
-20
-10
0
10
ELKEVF
1 10 100 1000 10000
150
300
161
352
102
561
431
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
Varistor included Coil type EMI Filters (Digital Noise Filters)
SMD
Type:
ELKEV
Features
High ESD suppression with varistor and included coils.
No variation in attenuation characteristics as current changes.
RoHS compliant
Rated Voltage : Applicable normal voltage for varistor
Standard Parts
Note1 : 4th letter () of marking indicates the Month Code.
Part No.
Cut off frequency
(MHz)
Inner Capacitance
(pF typ.)
Rated
Voltage
(V)
Applicable
circuit voltage
(V max.)
Indication
min.
Packaging
unit (pcs.)
ELKEV150FF 250 15 27 15
2.0
150
2000
ELKEV300FF 200 30 27 15 300
ELKEV161FF 50 160 27 15 161
ELKEV431FF 20 430 27 15 431
ELKEV561FE 10 560 22 12 561
ELKEV112FC 8 1050 12 5 112
ELKEV352FC 1/DC 3500 12 5 352
Indication Examples
May. 2013 02
39
The following are precautions for individual products.Please also refer to the common precautions for Noise Suppression
1. Operation range and environments
1 These products are designed and manufactured for general and stan dard use i n general el ec tron i c
equipment (e.g. AV equipment, home electric ap pli anc es, office equipment, information and com mu ni ca tion
equipment)
2 These products are not intended for use in the following special conditions. Be fore using the products, care ful ly check
the effects on their quality and performance, and determine whether or not they can be used.
In liquid, such as water, oil, chemicals, or organic solvent
In direct sunlight, outdoors, or in dust
In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
In an environment where these products cause dew condensation
2. Handling
1 Do not bring magnets or magnetized materials close to the product. The inuence of their magnetic eld can
change the inductance value.
2 Do not apply strong mechanical shocks by either dropping or collision with other parts.
Excessive schock can damage the part.
3. Land pattern design
1 Please refer to the recommended land pattern for each type shown on the datasheet.
2 In case of reow soldering, consider the layout because taller components close to EMI lters tend to block
thermal conduction.
4. Mounting
1 Avoid excessive placement force.
2 Do not bend or twist the PWB after mounting the part.
5. Cleaning
1 Do not use acid or alkali agents. Some cleaning solvents may damage the part.
Conrm by testing the reliability in advance of mass production.
2 If Ultrasonic cleaning is used, please conrm the reliability in advance.
It is possible that combined resonance of component and PWB and cavitation can cause an abnormal vibration
mode to exist causing damage.
Safety Precautions
May. 2013 02
ESD Suppressor
40
10
11
Product Code
ESD Suppressor
Size
Code
1
2
3
Size (inch)
0603 (0201)
1005 (0402)
1608 (0603)
Packaging Methods
Code
C EZAEG1A
Packaging Type
2 mm Pitch, 15,000 pcs.
X EZAEG2A
V EZAEG3A
Design Specication
Code
A
Design Specication
Rated Voltage 30 V
Special Feature
Code
A
Special Feature
Standard
Peak Voltage
Code
50
Peak Voltage
500 V
a
b
t
W
L
Protective coating
Alumina substrate
Gap electrode
Electrode
(Between)
ESD absorbent material Electrode (Outer)
ESD Suppressor
Type:
EZAEG
EZAEG1A, 2A, 3A
Features
ESD protection of high-speed data lines
Low capacitance 0.04 pF : 0603(0201) size
0.05 pF : 1005(0402) size
0.10 pF : 1608(0603) size
Good ESD suppression characteristics
Good ESD withstanding
RoHS compliant
High-Speed Data Lines
(HDMI, Serial ATA, USB, IEEE1394, Display Port)
Antenna Circuitry and RF Modules (Cellular Phones)
Circuit Confguration
Type
(inch size)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
L W a b t
EZAEG1A
(0201)
0.60
0.03
0.30
0.03
0.15
0.10
0.15
0.10
0.23
0.03
0.12
EZAEG2A
(0402)
1.00
0.10
0.50
0.05
0.20
0.10
0.25
0.10
0.38
0.05
0.6
EZAEG3A
(0603)
1.60
0.15
0.80
0.15
0.30
0.20
0.30
0.20
0.50
0.10
2.2
Nov. 2012 01
ESD Suppressor
41
-30
-25
-20
-15
-10
-5
0
5
1 10 100 1000 10000
Frequency(MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-50
0
50
100
150
200
250
300
350
400
-20 0 20 40 60 80 100 120 140 160 180 200
Times (nSecs)
V
o
l
t
s

(
V
)
HDMI Controller
Antenna
Ga/As-SW
or
ASM
c
a
b
ESD Suppressor
Type
(inch size)
Dimensions (mm)
a b c
EZAEG1A
(0201)
0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
EZAEG2A
(0402)
0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
EZAEG3A
(0603)
0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
(1) Capacitance = The capacitance value shall be measured under the conditions specifed below.
Frequency : 1 MHz10 %, Voltage : 1 Vrms0.2 Vrms, Temperature : 25 C2 C
(2) Peak Voltage = The peak voltage value shall be measured under the following conditions. ESD test conditions : IEC61000-4-2, 8 kV contact discharge
(3) Clamping Voltage = The clamping voltage value shall be measured at 30 ns after initiation of pulse and measured under the conditions specifed below.
ESD test conditions : IEC61000-4-2, 8 kV contact discharge
Ratings
Frequency Characteristics ESD Suppression Voltage Waveform
Typical Circuits Requiring Protection
HDMI circuit Antenna circuit
Type
(inch size)
Capacitance
(1)
Peak Voltage
(2)
Clamping
Voltage
(3)
Rated Voltage Category Temperature Range
EZAEG1A (0201) 0.04
+0.04
pF
500 V max.
(350 V typ.)
100 V max. 30 V max 55 to +125 C EZAEG2A (0402) 0.05
+0.05
pF
EZAEG3A (0603) 0.10
+0.10
pF
0.04
0.03
0.08
Recommended land pattern design for ESD Suppressor is shown below.
Recommended Land Pattern
Packaging Methods, Soldering Conditions and Safety Precautions
Please see Data Files
Nov. 2012 01
ESD Suppressor
42
E
1
Z
2
A
3
E
4
G
5
2
6
N
7
5
8
0
9
A
10
X
11
Product Code
ESD Suppressor
Size
Code
1
2
Size (inch)
0603 (0201)
1005 (0402)
Packaging Methods
Code
X EZAEG2N
Packaging Type
Design Specication
Code Design Specication
N
ESD withstanding 15 kV
Rated Voltage 30 V
Special Feature
Code
A
Special Feature
Standard
Peak Voltage
Code
50
Peak Voltage
500 V
C EZAEG1N
a
b
t
W
L
Protective coating
Alumina substrate
Gap electrode
Electrode
(Between)
ESD absorbent material Electrode (Outer)
ESD Suppressor
Type:
EZAEG
EZAEG1N, 2N
Features
(IEC61000-4-2 15 kV contact/air Discharge)
Low capacitance 0.04 pF : 0603(0201) size
0.05 pF : 1005(0402) size
RoHS compliant
Antenna Circuitry and RF Modules for Smart phones
and Cellular Phones
(NFC,GPS)
High-Speed Data Lines
(HDMI, Serial ATA, USB, IEEE1394, Display Port)
Type
(inch size)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
L W a b t
EZAEG1N
(0201)
0.60
0.03
0.30
0.03
0.15
0.10
0.15
0.10
0.23
0.03
0.12
EZAEG2N
(0402)
1.00
0.10
0.50
0.05
0.20
0.10
0.27
0.10
0.38
0.05
0.60
Mar. 2013 02
ESD Suppressor
43
-30
-25
-20
-15
-10
-5
0
5
1 10 100 1000 10000
Frequency(MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
-50
0
50
100
150
200
250
300
350
400
-20 0 20 40 60 80 100 120 140 160 180 200
Times (nSecs)
V
o
l
t
s

(
V
)
HDMI Controller
Antenna
Ga/As-SW
or
ASM
c
a
b
ESD Suppressor Type
(inch size)
Dimensions (mm)
a b c
EZAEG1N
(0201)
0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
EZAEG2N
(0402)
0.5 to 0.6 1.4 to 1.6 0.40 to 0.60
(4) ESD test conditions : IEC61000-4-2 contact discharge
Ratings
Frequency Characteristics ESD Suppression Voltage Waveform
Typical Circuits Requiring Protection
HDMI circuit Antenna circuit
Type
(inch size)
Capacitance
(1)
Peak
Voltage
(2)
Clamping
Voltage
(3)
ESD
withstanding
(4)
Rated
Voltage
Category Temperature
Range
EZAEG1N (0201) 0.04
+0.04
pF
500 V max.
(350 V typ.)
100 V max.
Contact/Air
15 kV
30 V max 55 to +125 C
EZAEG2N (0402) 0.05
+0.05
pF 0.04
Recommended land pattern design for ESD Suppressor is shown below.
0.03
Mar. 2013 02
ESD Suppressor Array
44
10
11
Product Code
ESD Suppressor
Size
Code
C
Size (inch)
2012 (0805)
4 Line use
Packaging Methods
Code
V
Packaging
Design Specication
Code
A
Design Specication
Rated Voltage 15 V
Special Feature
Code
A
Special Feature
Standard
Peak Voltage
Code
50
Peak Voltage
500 V
4 5
6 1
2 3
(0.5)
2.00.1
0.200.15
0.300.15
8 7 10 9
1
.
2
5
0
.
1
0
0
.
2
5
0
.
1
5
0
.
3
5
0
.
1
5
0.500.10
GND
Electrode
(Outer)
Marking
Protective coating Alumina substrate
Electrode
(Outer)
GND terminal : 1, 6
I/O terminal : 2 to 5, 7 to 10
1 6
10 9 8 7
2 3 4 5
Type:
EZAEGCA
Features
4 ESD suppressors in one package
Low capacitance (0.25 pF)
RoHS compliant
High-Speed Data Lines (HDMI, IEEE1394)
( ) Reference
Mass (Weight) [1000 pcs.] :4 g
Nov. 2012 01
45
-50
0
50
100
150
200
250
300
350
400
-20 0 20 40 60 80 100 120 140 160 180 200
Times (nSecs)
V
o
l
t
s

(
V
)
HDMI Controller
HDM
Rx/Tx
e a
h
g
c
P b
d
Land pattern
(4) Rated voltage between I/O terminal and GND.
(5) Rated current between input terminal and output terminal.
Ratings
ESD Suppression Voltage Waveform Typical Circuits Requiring Protection
HDMI circuit
Type
(inch size)
Capacitance
(1)
Peak Voltage
(2)
Clamping
Voltage
(3)
Rated
Voltage
(4)
Rated Current
(5)
Category Temperature Range
EZAEGCA
(0805)
0.25+0.05/-0.10pF
500 V max.
(350 V typ.)
100 V max. 15 V max. 100 mA max. 55 to +125 C
Recommended land pattern design for ESD Suppressor Array is shown below.
a b c d
Dimensions
(mm)
0.75 0.25 1.70 0.35
e h g P
Dimensions
(mm)
1.85 2.60 0.25 0.50
Nov. 2012 01
ESD Suppressor / Array
46
f
N
W2
W1
fA
fC
T T A
P0 P2 P1
P1
fD0
B
F
W
E
(2 mm Pitch)
Pressed
Carrier
Punched
Carrier
Preheating
Peak
Heating
T
e
m
p
e
r
a
t
u
r
e
Time
Standard Quantity
Type Kind of Taping Pitch (P1) Quantity
EZAEG1A,1N
Pressed Carrier Taping 2 mm
15000 pcs./reel
EZAEG2A,2N 10000 pcs./reel
EZAEG3A
Punched Carrier Taping 4 mm 5000 pcs./reel
EZAEGCA
Taping Reel Carrier Taping
(Unit : mm)
Type 0A 0N 0C W
1
W
2
EZAEG1A,1N
180.0
+0
60.0
+1.0
13.0
0.2
9.0
+1.0
11.4
1.0
EZAEG2A,2N
EZAEG3A
EZAEGCA
1.5
Type P1 P2 P0 0D0 T
EZAEG1A,1N
2.00
0.10
2.00
0.05
4.00
0.10
1.50
+0.10
0.42
0.05
EZAEG2A,2N 0.60
0.05
EZAEG3A
4.00
0.10
0.70
0.05
EZAEGCA 0.85
0.05
Type A B W F E
EZAEG1A,1N 0.38
0.05
0.68
0.05
8.00
0.20
3.50
0.05
1.75
0.10
EZAEG2A,2N 0.70
0.05
1.20
0.05
EZAEG3A 1.10
0.10
1.90
0.10
EZAEGCA 1.55
0.15
2.30
0.20
0
0 0
Temperature Time
Peak 235 5 C max. 10 s
Temperature Time
Recommendations and precautions are described below.
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)

Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for ESD Suppressor
shown on this catalog.
1. If a large electric surge (especially, one which is larger than an ESD) is expected to be applied, be sure to test and
conrm proper ESD Suppressor (hereafter called the suppressors) functionality when mounted on your board. When
the applied load is more than the allowable rated power under normal load conditions, it may impair performance and/or
the reliability of the suppressors. Never exceed the rated power. If the product will be used under these special conditions,
be sure to contact a Panasonic representative rst.
2. Do not use halogen-based or other high-activity ux. Otherwise, the residue may impair the suppressors' performance
and/or reliability.
3. When soldering with a soldering iron, never touch the suppressors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 C max.).
4. Avoid excessive bending of printed circuit boards in order to protect the suppressors from abnormal stress.
5. Do not immerse the suppressors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.
two times.
(Unit : mm)
Mar. 2013 02
Multilayer Varistors
47
5
4
3
2
1
L
T
W
L1 L2
E
1
Z
2
J
3
Z 0
4 5 6 7 8 9 10 11 12
Z
0
1
V 2 7 0 E
Product Code
Size Code
0201
0402
0603
V
Packaging Style Code
The rst and second digits
denote the rst 2 numbers
of the varistor voltage and
the third digit indicates the
number of zeros following.
The decimal point denotes
in R.
Nomiral Varitor Voltage
0402, 0603 Paper Taping Z
P
Series Code
EZJZ series
EZJP series
Design Code
Design Code
(Example)
Below 3 pF, the 10 or 11th
position of the P/N indicates the
capacitance value as follows :
2.0 pF20, 1.5 pF15
Nil Cap. Tolerance : max.
Cap. Tolerance : 0.25 pF
Cap. Tolerance : 0.50 pF
C
D
Cap. Tolerance : 0.1 pF B
K
Cap. Tolerance : 10 %
M Cap. Tolerance : 20 %
A
Capacitance Code
3 pF
20 pF
27 pF
47 pF
56 pF
68 pF
A
R
D
E
W
F
100 pF
150 pF
220 pF
330 pF
680 pF
G
H
J
K
M
Packaging Methods, Handling Precautions
Features
Excellent ESD suppression due to advanced material
technology
Meets IEC61000-4-2, Level 4 standard
Can replace 2 Zener Diodes and 1 Capacitor
Low capacitance versions for DC voltage lines of high
speed busses
Ultra low capacitance for signal lines of high speed
busses
Ideal usage for USB 2.0, IEEE1394, and HDMI high
speed data busses
RoHS compliant
Multilayer Varistor for ESD pulse
[DC voltage lines/High speed signal lines]
Series :
EZJZ, EZJP
Construction
No. Name
1 Semiconductive Ceramics
2 Internal electrode
3
Terminal electrode
Substrate electrode
4 Intermediate electrode
5 External electrode
Dimensions in mm (not to scale)
Size Code Size(inch) L W T L1, L2
Z 0201 0.600.03 0.300.03 0.300.03 0.150.05
0 0402 1.000.05 0.500.05 0.500.05 0.20.1
1 0603 1.60.1 0.80.1 0.80.1 0.30.2
Nov. 2012 01
48
1000
100
10
10
6
10
5
10
4
10
3
Current (A)
Max. Leakage Current
EZJZV171AA
EZJZV171AA
EZJZV800AA
EZJZ
V800AA
EZJZV500AA
EZJZV500AA
Max. Clamping Voltage
V
o
l
t
a
g
e

(
V
)
10
2
10
1
10
0
10
1
(Typical curve)
Features
Multilayer monolithic ceramic construction for high
speed signal lines
speed data busses
Capacitance : 0.8 to 2.1 pF typ.
Multilayer Varistor, Low Capacitance Type
[High speed signal lines]
Mobile phone Antenna circuit, External IF
DSC, DVC USB2.0, IEEE1394
PC, PDA USB2.0, IEEE1394, LAN1000BASE
TV, DVD USB2.0, IEEE1394, HDMI
Game console Controller, External IF
Ratings and Characteristics
Size Part No.
Maximum
allowable voltage
DC (V)
Nominal varistor
voltage
at 1mA (V)
Capacitance (pF)
at 1MHz
Maximum ESD
IEC61000-4-2
0402
EZJZ0V80010 10 80 1 max. [0.8 typ.]
Contact discharge : 8kV
EZJZ0V80015D 5 80 1.50.5
EZJZ0V500AA 5 50 3 max. [2.1 typ.]
EZJZ0V800AA 18 80 3 max. [2.1 typ.]
EZJZ0V171AA 18 170 3 max. [2.1 typ.]
0603
EZJZ1V80010 10 80 1 max. [0.8 typ.]
EZJZ1V500AA 5 50 3 max. [2.1 typ.]
EZJZ1V800AA 18 80 3 max. [2.1 typ.]
EZJZ1V171AA 18 170 3 max. [2.1 typ.]
Operating Temperature Range : 40 to 85 C
Recommend soldering method : Reow soldering
Voltage vs. Current
Nov. 2012 01
49
1
0.1
1
10
100
10 100
Frequency (MHz)
C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
1000 10000
3 pF max. [2.1 pF typ.]
1.5 pF typ.
(Typical curve)
1.5 pF typ.
1
Frequency (MHz)
I
m
p
e
d
a
n
c
e

(
)
10
10 100 1000 10000 1
100
1000
10000
100000
1000000
10000000
(Typical curve)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
40
35
30
25
20
15
10
5
0
5
10
1 10 100 1000 10000
Frequency (MHz)
3 pFmax.[2.1pFtyp.]
1.5 pFtyp.
1 pFmax.[0.8pFtyp.]
(Typical curve)
Frequency vs. Capacitance Frequency vs. Impedance
Frequency vs. Transmission
Nov. 2012 01
50
3.7
3 5 12 24 40
6.7
5.6
11
13
16
26
30
40
Circuit voltage DC (V)
M
a
x
i
m
u
m

a
l
l
o
w
a
b
l
e

v
o
l
t
a
g
e
D
C

(
V
)
Features
Multilayer monolithic ceramic construction for use
protecting DC voltage lines or signal lines
Circuit voltage
Multilayer Varistor, Low Voltage Type (Standard Type)
[DC voltage lines/Low speed signal lines]
Mobile phone
SW, LCD, LED, Audio terminal,
Battery pack, Memory card, External IF
DSC, DVC SW, LCD, LED, USB
PC, PDA SW, LCD, LED, USB
TV, DVD Audio, Video terminal
Audio Audio terminal, Microphone, Receiver
Game console Controller, External IF
Varistor voltage : 6.8 to 65 V [at 1 mA]
Capacitance : 8.5 to 420 pF typ. [at 1 MHz]
Size Part No.
Maximum
allowable
voltage
DC (V)
Nominal
varistor
voltage
at 1mA (V)
Capacitance (pF)
Maximum
peak current
at 8/20s, 2times
(A)
Maximum ESD
IEC61000-4-2
at 1MHz at 1kHz
0201
EZJPZV6R8JA 3.7 6.8 220 max. [180 typ.] 175 typ. 5
Contact discharge
8 kV
EZJPZV6R8GA 3.7 6.8 100 max. [ 85 typ.] 100 typ. 5
EZJPZV080GA 5.6 8 100 max. [ 85 typ.] 100 typ. 5
EZJPZV120GA 7.5 12 100 max. [ 85 typ.] 100 typ. 5
EZJPZV120DA 7.5 12 27 max. [ 22 typ.] 33 typ. 1
EZJPZV120RA 7.5 12 20 max. [ 15 typ.] 18 typ. 1
EZJPZV150RA 9 15 20 max. [ 15 typ.] 18 typ. 1
EZJPZV270RA 16 27 20 max. [ 15 typ.] 16.5 typ. 1
EZJPZV270BA 16 27 10 max. [8.5 typ.] 10 typ. 1
0402
EZJP0V6R8MA 3.7 6.8 680 max. [420 typ.] 650 typ. 20
EZJP0V6R8GA 3.7 6.8 100 max. [ 85 typ.] 100 typ. 3
EZJP0V080MA 5.6 8 680 max. [420 typ.] 650 typ. 20
EZJP0V080KA 5.6 8 330 max. [290 typ.] 480 typ. 15
EZJP0V080GA 5.6 8 100 max. [ 65 typ.] 100 typ. 3
EZJP0V080DA 5.6 8 27 max. [ 22 typ.] 33 typ. 1
EZJZ0V120JA 6.7 12 220 max. [150 typ.] 175 typ. 10
EZJZ0V180HA 11 18 150 max. [120 typ.] 140 typ. 10
EZJZ0V220HA 13 22 150 max. [100 typ.] 116 typ. 10
EZJP0V270EA 16 27 47 max. [ 33 typ.] 37 typ. 4
EZJP0V270RA 16 27 20 max. [ 15 typ.] 16.5 typ. 1
EZJZ0V420WA 30 42 56 max. [ 40 typ.] 45 typ. 10
EZJZ0V650DA 40 65 27 max. [ 22 typ.] 33 typ. 5
0603
EZJZ1V120KA 6.7 12 330 max. [250 typ.] 290 typ. 20
EZJZ1V180JA 11 18 220 max. [180 typ.] 210 typ. 20
EZJZ1V220JA 13 22 220 max. [160 typ.] 185 typ. 20
EZJZ1V270GA 16 27 100 max. [ 85 typ.] 100 typ. 20
EZJZ1V270EA 16 27 47 max. [ 33 typ.] 37 typ. 20
EZJZ1V270RA 16 27 20 max. [ 15 typ.] 16.5 typ. 3
EZJZ1V330GA 26 33 100 max. [ 85 typ.] 100 typ. 20
EZJZ1V420FA 30 42 68 max. [ 55 typ.] 63 typ. 15
EZJZ1V650DA 40 65 27 max. [ 22 typ.] 33 typ. 5
Operating Temperature Range : 40 to 85 C
Maximum Allowable Voltage Maximum DC Voltage that can be applied continuously within the operating temperature range
Varistor Voltage Varistor starting voltage between terminals at DC 1 mA, also known as Breakdown voltage
Maximum Peak Current Varistors maximum current under the standard pulse 8/20s, 2 times based
Maximum ESD
Varistors maximum voltage under ESD based on IEC61000-4-2, 10 times
(5 times of each positive-negative polarity)
Recommend soldering method : Reow soldering
Nov. 2012 01
51
10
6
10
5
10
4
10
3
10
2
Current (A)
10
1
10
0
10
1
10
2
300
200
100
10
1
V
o
l
t
a
g
e

(
V
)
Max. Leakage Current Max. Clamping Voltage
EZJZV420A
EZJZV330A
EZJZV270A
EZJZV220A
EZJZV180A
EZJZV120A
EZJZV650A
EZJZV420A
EZJZV330A
EZJZV270A
EZJZV220A
EZJZV180A
EZJZV120A
EZJZV650A
10
6
10
5
10
4
10
3
10
2
Current (A)
10
1
10
0
10
1
100
10
1
V
o
l
t
a
g
e

(
V
)
(Typical curve) (Typical curve)
EZJPV270RA
EZJPV270RA
EZJPZV120GA
EZJPV080A
EZJPV6R8A
EZJPZV120GA
EZJPV080A
EZJPV6R8A
EZJPZV150RA
EZJPZV150RA
0.1 1 10 100
Frequency (MHz)
C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
1000 10000
330 pF max.
220 pF max.
100 pF max.
47 pF max.
20 pF max.
10000
1
10
100
1000
0.1 1 10 100
Frequency (MHz)
C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
1000 10000
680 pFmax.
330 pFmax.
100 pFmax.
27 pFmax.
20 pFmax.
10000
1
10
100
1000
10 pFmax.
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
20 pF max.
47 pF max.
100 pF max.
220 pF max.
330 pF max.
10
50
0.1 1 10 100 1000 10000
60
40
30
20
0
10
Frequency (MHz)
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
27 pFmax.
20 pFmax.
330 pFmax.
680 pFmax.
100 pFmax.
10
50
0.1 1 10 100 1000 10000
60
40
30
20
0
10
10 pFmax.
Frequency vs. Capacitance
EZJP Series
Frequency vs. Transmission
EZJP Series
Voltage vs. Current
EZJP Series
EZJZ Series
EZJZ Series
EZJZ Series
Nov. 2012 01
52
E
1
Z
2
J
3
Z S
4 5 6 7 8 9 10 11 12
S
V 2 7 0 E
Product Code Series Code
Size Code
0504 2 Array Type V
Packaging Style Code Nomiral Varistor Voltage Capacitance Code
2 Array Paper Taping
Design Code
Design Code
(Example)
A 3 pF max.
D
P
R
S
J
20 pF max.
27 pF max.
33 pF max.
T
E
39 pF max.
43 pF max.
47 pF max.
220 pF max.
Nil Cap. Tolerance : max.
K Cap. Tolerance : 10 %
M Cap. Tolerance : 20 %
A
The rst and second
digits denote the rst 2
gures of varistor voltage
and the third digit
indicates the number of
zeros following.
a c
d b
W
T
B
W
1
L
BW
P
b d
a c
Features
technology
Meets IEC61000-4-2, Level 4 standard
2 Array per package for multiple lines
Ultra low capacitance for high speed signal lines
speed data busses
RoHS compliant
[2 Array Type for high speed signal lines]
Series :
EZJZS
No. Name
3
Terminal electrode
Substrate electrode
Size(inch) L W T BW BW1 P
0504
(2 Array)
1.370.15 1.00.1 0.60
+0.06
0.360.10 0.20.1 0.640.10
Construction
Schematic
0.10
Nov. 2012 01
53
1000
EZJZSV171AA
EZJZSV800AA
EZJZSV500AA
EZJZSV171AA
EZJZSV800AA
EZJZSV500AA
EZJZSV270A
EZJZSV270A
EZJZSV120JA
EZJZSV120JA
1
10
10
6
10
5
10
4
10
3
10
2
Current (A)
V
o
l
t
a
g
e

(
V
)
10
1
10
0
10
1
10
2
100
(Typical curve)
10000
100
10
0.1 1 10 100
Frequency (MHz)
C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
1000 10000
220 pF max.
47 pF max.
20 pF max.
3 pF max.
1
1000
(Typical curve)
Frequency (MHz)
10
0
10
20
30
40
50
60
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
220 pF max.
47 pF max.
20 pF max.
3 pF max.
0.1 1 10 100 1000 10000
(Typical curve)
Size Part No.
Maximum
allowable
voltage
DC (V)
Nominal
varistor
voltage
at 1mA (V)
Capacitance (pF)
Maximum
peak current
at 8/20s, 2times
(A)
Maximum ESD
IEC61000-4-2
at 1MHz at 1kHz
0504
(2 Array)
EZJZSV120JA 6.7 12 220 max. [150 typ.] 175 typ. 5
Contact discharge
8 kV
EZJZSV270EA 16 27 47 max. [ 33 typ.] 37 typ. 5
EZJZSV270RA 16 27 20 max. [ 15 typ.] 16.5 typ. 3
EZJZSV270DA 16 27 2710 %/20 % 30 typ. 5
EZJZSV270PA 16 27 3310 %/20 % 37 typ. 5
EZJZSV270SA 16 27 3910 %/20 % 43 typ. 5
EZJZSV270TA 16 27 4310 %/20 % 47 typ. 5
EZJZSV270EA 16 27 4710 %/20 % 52 typ. 5
EZJZSV500AA 5 50 3 max. [ 2.1 typ.]
EZJZSV800AA 18 80 3 max. [ 2.1 typ.]
EZJZSV171AA 18 170 3 max. [ 2.1 typ.]
Operating Temperature Range: 40 to 85 C
: Capacitance Tolerance Code K:10 %, M:20 %
Avoid ow soldering.
Frequency vs. Capacitance Frequency vs. Impedance
Voltage vs. Current
Nov. 2012 01
54
5
4
3
2
1
L
T
W
L1 L2
E
1
Z
2
J
3
S 2
4 5 6 7 8 9 10 11 12
Y D 4 7 2
1
2
Product Code Series Code
Size Code
0603
0805
V
Y
Packaging Style Code Nominal Capacitance
f180 reel, Paper Taping
f180 reel, Embossed Taping
Design Code
(Example)
B
Max. Allowable
Voltage Code
C
D
DC 6 V
DC 18 V
DC 30 V
The rst and second
digits denote the rst 2
gures of capacitance
and the third digit
indicates the number
of zeros following.
Features
technology
Meets IEC61000-4-2, Special Level 30 kV standard
RoHS compliant
[DC voltage lines]
Series :
EZJS
No. Name
3
Terminal electrode
Substrate electrode
Construction
Size Code Size(inch) L W T L1, L2
1 0603 1.600.15 0.80.1 0.80.1 0.30.2
2 0805 2.00.2 1.250.20
0.80.2
0.500.25
1.250.20
Nov. 2012 01
55
Max. Leakage Current
1000
Max. Clamping Voltage
100
10
10
6
10
5
10
4
10
3
10
2
Current (A)
10
1
EZJSD
EZJSC
EZJSB
10
0
10
1
10
2
V
o
l
t
a
g
e

(
V
)
1
(Typical curve)
1000
1 10 100 1000
Frequency (kHz)
10000 100000 1000000
10000
C
a
p
a
c
i
t
a
n
c
e

(
p
F
)
100000
22000 pF typ.
8200 pF typ.
4700 pF typ.
1800 pF typ.
3900 pF typ.
(Typical curve)
10
10
40
Frequency (kHz)
8200 pF typ.
4700 pF typ.
3900 pF typ.
1800 pF typ.
22000 pF typ.
50
1 10 100 1000 10000 100000 1000000 10000000
60
70
30
A
t
t
e
n
u
a
t
i
o
n

(
d
B
)
20
0
(Typical curve)
Size Part No.
Maximum Allowable
Voltage
DC (V)
Nominal Varistor
Voltage
at 0.1 mA (V)
Capacitance
at 1 kHz (pF)
Maximum ESD
IEC61000-4-2
0603
EZJS1VB822 6 12 8200 typ.
Contact discharge
: 30 kV
EZJS1VC392 18 30 3900 typ.
EZJS1VD182 30 50 1800 typ.
0805
EZJS2VB223 6 12 22000 typ.
EZJS2YC822 18 30 8200 typ.
EZJS2YD472 30 50 4700 typ.
Operating Temperature Range: 40 to 85 C
Avoid ow soldering
Frequency vs. Capacitance Frequency vs. Transmission
Voltage vs. Current
Nov. 2012 01
56
Current (A)
Zener diode
Zener diode
monopolar 2pcs.
Multilayer Varistor
Capacitor 1 pc.
Voltage (V)
Time (ns)
V
o
l
t
a
g
e

(
V
)
1400
1200
1000
800
600
400
200
0
-200
20 0 20 40 60 80 100 120 140 160 180 200
Without Varistor
EZJP0V080GA
[V1 mA:8 V, C1 MHz:100 pF max.]
Attenuator : 60 dB
MLCV
150 pF
330
50
Electrostatic discharger
Oscillo-scope
Mounting area
Approx .83 % space saving
MLCV
Size 0402
Zener diode
S-79
1.5 2.6
0.5
1.7
0.3
MLCC
Size 0402
Varistor Characteristics and Equivalent Circuit
A Multilayer Varistor does not have an electrical polarity like zener diodes and is equivalent to total 3 pcs. of 2 zener di-
odes and 1 capacitor.
[Equivalent Circuit]
[ESD suppressed waveform]
ESD Suppressive Effects
Typical effects of ESD suppression
Test conditions: IEC61000-4-2
Level 4 Contact discharge, 8 kV

IEC61000-4-2 International Standard of the ESD testing method (HBM) setting 4 levels of severity
Replacement of Zener diode
Using a Multilayer Varistor to replace a Zener diode & Capacitor saves both the amount of space and number of
components used
Severity Level 1 Level 2 Level 3 Level 4
Contact discharge 2 kV 4 kV 6 kV 8 kV
Air discharge 2 kV 4 kV 8 kV 15 kV
Dimensions in mm
Nov. 2012 01
57
Audio lines LCD/Camera lines
/O data lines
EEE1394 lines USB1.1/2.0 lines
Mobile Phone
HDM lines
LCD/Camera
controller
/O
controller
EEE1394
controller
USB
controller
LED
SW/Keyboard
2 mode noise filter AMP
C
C
TMDS
FPC LCD/Camera
Connector
Connector
Power
C
VDD
GND
TPA+
TPA-
VDD
GND
HDM
C
Clock
Ch : 0
Ch : 1
Ch : 2
D+
D-
TPB+
TPB-
Applications Series
Circuit
DC 1k 1M 1G (Hz)
Mobile phones, DSC, PC, PDA,
HDD TV (PDP, LC etc.), DVD, DVC,
Game consoles, Audio equipment
Series
EZJZ, P
Ultra low capacitance
(Cap. : 3 pF or less)
DC to GHz
Antenna, RF circuit, LVDS
USB, IEEE1394, HDMI etc.
Low capacitance
(Cap. : 20 to 680 pF)
DC to millions of Hz
PWR, SW, Audio terminals
LCD, RS232C, etc.
PWR, Photoelectronic sensors,
SSR, Motors, Pressure sensors,
Proximity switches
Series
EZJS
High capacitance
(Cap. : 1800 to 22000 pF)
DC to thousands of Hz
PWR, SW, Audio terminals etc.
Applications
Nov. 2012 01
58
Characteristics Specications Testing Method
Standard test
conditions
Electrical characteristics shall be measured under the following conditions.
Temp. : 5 to 35 C, Relative humidity : 85 % or less
Varistor voltage
To meet the specied
value.
The voltage between both end terminals of a varistor when the specified
measuring current (CmA) is applied to the Varistor (Vc1, or VcmA.) The measurement
shall be made as quickly as possible to avoid heating effects.
Maximum
allowable voltage
To meet the specied
value.
The maximum DC voltage that can be applied continuously to a varistor
Capacitance
To meet the specied
value.
Capacitance shall be measured at the specied frequency, bias voltage 0 V,
measuring voltage 0.2 to 2 Vrms.
Maximum peak
current
To meet the specied
value.
The maximum current measured (while the varistor voltage is within 10 % of
its nominal value) when a standard impulse current of
8/20 seconds is applied twice within an interval of 5 minutes.
Maximum ESD
To meet the specied
value.
The maximum ESD measured (while the varistor voltage is within 30 % of its
nominal value) when exposed to ESD 10 times
(ve times for each positive-negative polarity) based on IEC61000-4-2.
Solderability
To meet the specied
value.
The part shall be immersed into a soldering bath under the conditions below.
Solder: H63A
Soldering ux : Ethanol solution of rosin (Concentration approx. 25 wt%)
Soldering temp. : 2305 C
Period : 41 s
Soldering position : So that both termi nal el ectrodes are compl etel y
immersed in the soldering bath
Resistance to
soldering heat
Vc / Vc : within 10 %
The part shall be immersed into a soldering bath under the conditions below
(before being subjected to standard conditions) for 242 hours to evaluate its
characteristics.
Soldering conditions : 270 C, 3 s / 260 C, 10 s
Soldering position : So that both terminal electrodes are completely
immersed in the soldering bath
Temperature cycle Vc / Vc : within 10 %
Repeat the following cycle on the part for the specified number of times
(before being subjected to standard conditions) for 242 hours to evaluate its
characteristics.
Cycle : 5 cycles
Step Temperature Period
1 Max. Operating Temp. 303 min
2 Ordinary temp. 3 min max.
3 Min. Operating Temp. 303 min
4 Ordinary temp. 3 min max.
Damp heat load Vc / Vc : within 10 %
The part shall be tested under the conditions below (before being subjected
to standard conditions) for 242 hours to evaluate its characteristics.
Temp. : 402 C
Humidity : 90 to 95 %RH
Applied voltage : Maximum allowable voltage (Individually specied)
Period : 500+24 / 0 h
High temperature
load
Vc / Vc : within 10 %
The part shall be tested under the conditions below (before being subjected
to standard conditions) for 242 hours to evaluate its characteristics.
Temp. : Maximum operating temperature 3 C (Individually specied)
Applied voltage : Maximum allowable voltage (Individually specied)
Period : 500+24 / 0h
Performance and Testing Methods
Nov. 2012 01
59
E
C
D
A
W1
W2
B
100 min.
Vacant position
400 min.
Cover tape
160 min.
Vacant position
t1
t2
Feeding hole Chip pocket
Chip component Tape running direction P1 P2 P0
F
B
W
E
A
fD0
t2 Chip component
fD0
P1 P2 P0
E
F
W
B
A
t1
Chip component
t
P1 P2 P0
K0
fD0
A
B
F
W
E
Chip component
t1
P1 P2 P0
t2
fD0
A
B
F
W
E
Packaging Methods
Standard Packing Quantity
Series Size Code
Thickness
(mm)
Kind of Taping
Pitch
(mm)
Qty
(pcs./reel)
EZJZ
EZJP
Z (0201) 0.3 Pressed Carrier Taping
2
15,000
0 (0402) 0.5
10,000
1 (0603) 0.8
4
4,000
S (0504 2Array) 0.6 4,000
EZJS
1(0603) 0.8 4,000
2(0805)
0.8 5,000
1.25 Embossed Carrier Taping 2,000
Reel for Taping
Pitch 2mm (Pressed Carrier Taping) : Size 0201
(Unit : mm)
Symbol A B W F E P1 P2 P0 0D0 t1 t2
Dim
(mm)
1.55
0.20
2.35
0.20
8.0
0.2
3.50
0.05
1.75
0.10
4.0
0.1
2.00
0.05
4.0
0.1
1.5
+0.1
0
0.6
max.
1.5
max.
1
(0603)
1.0
0.1
1.8
0.1
8.0
0.2
3.50
0.05
1.75
0.10
4.0
0.1
2.00
0.05
4.0
0.1
1.5
+0.1
0
1.1
max.
1.4
max.
S
(0504 2 Arry)
1.18
0.10
1.63
0.10
2
(0805)
1.65
0.20
2.4
0.2
Symbol A B W F E P1 P2 P0 0D0 t K0
Dim
(mm)
0.36
0.08
0.66
0.03
8.0
0.2
3.50
0.05
1.75
0.10
2.00
0.05
2.00
0.05
4.0
0.1
1.5
+0.1
0
0.55
max.
0.36
0.03
(Unit : mm)
(Unit : mm)
Embossed Carrier Taping : Size 0805
Pitch 4mm (Punched Carrier Taping) :
Size 0603, 0805, 0504/2Array
Leader Part and Taped End
Leader part
Tape end
Dimensions in mm
Symbol 0A 0B C D E W1 W2
Dim
(mm)
1803 60.0
+1.0
13.00.5 21.00.8 2.00.5 9.0
+1.0
11.41.0
0
0 0
Pitch 2mm (Punched Carrier Taping) : Size 0402
(Unit : mm)
Dim
(mm)
0.62
0.05
1.12
0.05
8.0
0.2
3.50
0.05
1.75
0.10
2.00
0.05
2.00
0.05
4.0
0.1
1.5
+0.1
0
0.7
max.
1.0
max.
Nov. 2012 01
60
Multilayer Varistors,Chip Type
Series:
EZJZ, EZJP
(For DC voltage lines, high speed signal lines)
Series:
EZJS
(For DC voltage lines)
Handling Precautions
Safety Precautions
Multilayer Varistors (hereafter referred to as Varistors) should be used for general purpose applications as
countermeasures against ESD and noise found in consumer electronics (audio/visual, home, ofce, information
& communication) equipment. When subjected to severe electrical, environmental, and/or mechanical stress
beyond the specications, as noted in the Ratings and Specied Conditions section, the Varistors may fail in a
short circuit mode or in an open-circuit mode. This case results in a burn-out, smoke or aming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such
as setting up protecting circuits, etc.
For the following applications and conditions, please contact us for additional specications not found in this document.
When your application may have difculty complying with the safety or handling precautions specied below.
For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions
which could result in death or injury;
1 Aircraft and Aerospace Equipment (articial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, trafc signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
Strict Observance
1. Conrmation of Rated Performance
The Varistors shall be operated within the specied rating/performance.
Applications exceeding the specications may cause deteriorated performance and/or breakdown, resulting in
degradation and/or smoking or ignition of products. The following are strictly observed.
(1) The Varistors shall not be operated beyond the specied operating temperature range.
(2) The Varistors shall not be operated in excess of the specied maximum allowable voltage.
(3) The Varistors shall not be operated in the circuits to which surge current and ESD are applied exceeding the
specied maximum peak current and maximum ESD.
(4) Never use for AC power supply circuits.
2. The Varistors shall not be mounted near ammables.
Operating Conditions and Circuit Design
1. Circuit Design
1.1 Operating Temperature and Storage Temperature
The specified Operating Temperature Range
found in the Specication is the absolute maximum
and minimum temperature rating. Every Varistor
shall be operated within the specified Operating
Temperature Range.
The Varistors mounted on PCB shall be stored
without operating within the specified Storage
Temperature Range in the Specications.
1.2 Operating Voltage
The Varistors shall not be operated in excess of
the Maximum allowable voltage.
If the Varistors are operated beyond the specied
Maximum allowable voltage, it may cause short
and/or damage due to thermal run away.
When high frequency and steep pulse voltages
are continuously used, even when less than the
Maximum allowable voltage, in a circuit, please
examine the reliability of the Varistor while also
checking the safety and reliability of your circuit.
1.3 Self-heating
The surface temperature of the Varistors shall
be under the specified Maximum Operating
Temperature in the Specications including the
Nov. 2012 01
61
Land
SMD
a b
c
Solder resist
Land
c
a
b
P
SMD
(a) Excessive amount (b) Proper amount (c) Insufcient amount
Solder resist
Land
Portion to be
Excessively soldered
A lead wire of
Retrotted
component
Soldering
iron
Solder
(ground solder)
Chassis
Electrode pattern
Solder resist
Solder resist
Solder resist
The lead wire of a
Component With lead wires
temperature rise caused by self-heating. Check
temperature rise of the Varistor in your circuit.
1.4 Environmental Restrictions
The Varistors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under condi ti ons contai ni ng corrosi ve
gases such as hydrogen sulde, sulfurous
acid, chlorine and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact
beyond the specified conditions found in the
Specications,
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
When the Varistors are mounted and soldered on
an Alumina Substrate, the substrate influences
the Varistors reliability against Temperature
Cycles and Heat shock due to the difference
in the thermal expansion coefficient between
them. Confirm that the actual board used does
not deteriorate the characteristics of the Varistors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive
stress on the Varistors.
Recommended Land Dimensions
Unit (mm)
Size
Code
Component dimensions
a b c
L W T
Z(0201) 0.6 0.3 0.3 0.2 to 0.3 0.25 to 0.30 0.2 to 0.3
0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8
2(0805) 2.0 1.25 0.8 to 1.25 0.8 to 1.2 0.8 to 1.0 0.8 to 1.0
Size
Code
Component
dimensions a b C P
L W T
S (0504
2Array)
1.37 1.0 0.6
0.3 to
0.4
0.45 to
0.55
0.3 to
0.4
0.54 to
0.74
(2) The size of lands shall be designed to have
equal spacing between the right and left sides. If
the amount of solder on the right land is different
from that on the left land, the component may
be cracked by stress since the side with a larger
amount of solder solidies later during cooling
Recommended Amount of Solder
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the pattern
for the following cases;
Components are arranged closely.
The Varistor is mounted near a component
with lead wires.
The Varistor is placed near a chassis.
See the table below.
Prohibited Applications and Recommended Applications
Item
Prohibited
applications
Improved applications
by pattern division
Mixed mounting
with a component
with lead wires
Arrangement
near chassis
Retro-tting of
component with
lead wires
Lateral
arrangement
2.4 Component Layout
The Varistors/components shall be placed on the
PC board such that both electrodes are subject-
ed to uniform stresses, or to position the compo-
nent electrodes at right angles to the grid glove
or bending line. This should be done to avoid
cracking the Varistors from bending the PC board
after or during placing/mounting on the PC board.
Nov. 2012 01
62
A
B
C
E
D
Slit
Magnitude of stress A>B=C>D>E
Perforation
Supporting
pin
Supporting Crack Separation of solder
Crack
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Varistors layout below.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Varistors.
(3) The magnitude of mechanical stress applied to
the Varistors when the circuit board is divided
is in the order of push back < slit < V-groove
< perforation.
Also take into account the layout of the Varistors
and the dividing/breaking method.
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space,
the components can be affected by solder bridges
and solder balls. The space between components
should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Varistors shall be stored between 5 - 40 C
and 20 - 70 % RH, not under severe conditions
of high temperature and humidity.
(2) If stored in a place that is humid, dusty, or
contains corrosive gasses (hydrogen sulfide,
sulfurous acid, hydrogen chloride and ammonia
etc.), the solderability of terminal electrodes
may deteriorate.
In addition, storage in a place subjected to
heati ng and/or exposure to di rect sunlight
will cause deformed tapes and reel s, and
component sticking to tapes, both of which
can result in mounting problems
(3) Do not store components longer than 6 months.
Check the solderability of products that have
been stored for more than 6 months before use.
2. Adhesives for Mounting
(1) The amount and viscosity of an adhesive for
mounting shall be such that the adhesive shall
not ow off on the land during its curing.
(2) If the amount of adhesive is insufficient for
mounting, the Varistors may fall off after or during
soldering.
(3) If the adhesive is too low in its viscosity, the
Varistors may be out of alignment af ter or
during soldering.
(4) Adhesives for mounting can be cured by ultraviolet
or infrared radiation. In order to prevent the terminal
electrodes of the Varistors from oxidizing, the
curing shall be under the following conditions:
160 C max., for 2 minutes max.
(5) Insufficient curing may cause the Varistors to fall
off after or during soldering. In addition, insulation
resistance between terminal electrodes may
deteriorate due to moisture absorption. In order
to prevent these problems, please observe
proper curing conditions.
3. Chip Mounting Consideration
(1) When mounting the Varistors/components on a
PC board, the Varistor bodies shall be free from
excessive impact loads such as mechanical
impact or stress due to the positioning, pushing
force and displacement of vacuum nozzles during
mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle
is too low, the Varistor will crack from excessive
force during mounting.
The following precautions and recommendations
are for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For doubl e sur face mount i ng, appl y a
supporting pin on the rear surface of the
PC board to suppress the bending of the
PC board in order to minimize the impact
of the vacuum nozzles. Typical examples
are shown in the table below.
Item Prohibited mounting Recommended mounting
Single surface
mounting
The supporting pin does not necessarily
have to be positioned beneath the Varistor.
Double surface
mounting
Prohibited layout Recommended layout
Layout the Varistors sideways
against the stressing direction.
Nov. 2012 01
63
260
240
0
T
e
m
p
e
r
a
t
u
r
e
(
C
)
Time
3 to 5 sec
Soldering
T
Gradual cooling
(at ordinary mperature)
60 to 120 sec
Gradual
cooling
5
Heating 3
Peak 4
Temp. rise
T
2
Preheating 1
260
220
180
140
T
e
m
p
e
r
a
t
u
r
e

(
C
)
Time
60 to 120 sec 60 sec max.
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Varistors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so
that the maximum bending of PC board does not
exceed 0.5 mm at 90 mm span. The PC board
shall be supported by an adequate number of
supporting pins.
4. Selection of Soldering Flux
Soldering ux may seriously affect the performance
of the Varistors. Please confirm whether soldering
ux does not have an inuence on performance of
the Varistor before using enough.
5. Soldering
5.1 Flow Soldering
For ow soldering, abnormal and large thermal and
mechanical stress, caused by the Temperature
Gradient between the mounted Varistors and melted
solder in a soldering bath may be applied directly to
the Varistors, resulting in failure and damage of the
Varistors. Therefore it is essential that soldering process
follow these recommended conditions.
(1) Application of Soldering ux :
The soldering flux shall be applied to the
mounted Varistors thinly and uniformly by
foaming method.
(2) Preheating :
The mounted Varistors/Components shall be
pre-heated sufciently so that the Temperature
Gradient between the Varistors/Components
and the melted solder shall be 150 C max.
(100 to 130 C)
(3) Immersion into Soldering bath :
The Varistors shall be immersed into a soldering
bath of 240 to 260 C for 3 to 5 seconds
(4)Gradual Cooling :
The Varistors shall be cooled gradually to
room ambient temperature with the cooling
temperature rates of 8 C/s max. from 250 C to
170 C and 4 C/s max. from 170 C to 130 C.
(5) Flux Cleaning :
When the Varistors are immersed into a cleaning
solvent, be sure that the surface temperatures of
devices do not exceed 100 C.
(6) Performing ow soldering once under the conditions
shown in the figure below [Recommended
prole of Flow soldering (Ex)] will not cause any
problems. However, pay attention to the possible
warp and bending of the PC board.
Recommended profle for Flow Soldering [Ex.]
5.2 Refow Soldering
The reflow soldering temperature conditions are
each temperature curves of Preheating, Temp.
rise, Heating, Peak and Gradual cooling. Large
temperature difference caused by rapid heat
application to the Varistors may lead to excessive
thermal stresses, contributing to the thermal cracks.
The Preheating temperature requires controlling with
great care so that tombstone phenomenon may be
prevented.
Item Temperature Period or Speed
1 Preheating 140 to 180 C 60 to 120 sec
2 Temp. rise
Preheating temp
to Peak temp.
2 to 5 C /sec
3 Heating 220 C min. 60 sec max.
4 Peak 260 C max. 10 sec max.
5 Gradual cooling
Peak temp.
to 140 C
1 to 4 C /sec
Recommended profle of Refow soldering (EX)
T : Allowable temperature difference T < 150 C
<Allowable temperature difference>
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Varistors are immersed into a cleaning
solvent, make sure that the surface temperatures
of the devices do not exceed 100 C.
Performing reflow soldering t wice under the
conditions shown in the gure above [Recommended
prole of Reow soldering (EX)] will not cause any
problems. However, pay attention to the possible
warp and bending of the PC board.
For products specied in individual specications,
avoid ow soldering.
Size Temp. Tol.
0603 T < 150 C
Nov. 2012 01
64
T
Preheating
60 to 120 sec 3 sec max.
Gradual cooling
Supporting pin
Separated, Crack
Check pin
Check pin
5.3 Hand Soldering
Hand sol deri ng t ypi call y causes signi fi cant
temperature change, which may induce excessive
thermal stresses inside the Varistors, resulting in
the thermal cracks, etc.
In order to prevent any defects, the following
should be observed.
The temperature of the soldering tips should
be controlled with special care.
The direct contact of soldering tips with the
Varistors and/or terminal electrodes should be
avoided.
Dismounted Varistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering :
01.0 mm or below Thread eutectic solder with
soldering ux
in the core.
Rosin-based and non-activated flux is
recommended.
(b) Preheating :
The Varistors shall be preheated so that the
Temperature Gradient between the devices
and the tip of soldering iron is 150 C or below.
(c) Temperature of Iron tip: 300 C max.
(The required amount of solder shall be melted
in advance on the soldering tip.)
(d) Gradual cooling :
After soldering, the Varistors shall be cooled
gradually at room temperature.
Recommended profle of Hand soldering [EX]
(2) Condition 2 (without preheating)
Hand sol deri ng can be performed wi thout
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly touch
the ceramic and terminal electrodes of the
Varistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Varistors for soldering.
Conditions of Hand soldering without preheating
Condition
Temperature of Iron tip 270 C max.
Wattage 20 W max.
Shape of Iron tip 03 mm max.
Soldering time with a soldering iron 3 sec max.
6. Post Soldering Cleaning
6.1 Cleaning solvent
Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics
and reliability of the Varistors.
6.2 Cleaning conditions
I nappropri ate cl eani ng condi t i ons such as
i nsuf fi ci ent cl eani ng or excessi ve cl eani ng
may impair the electrical characteristics and
reliability of the Varistors.
(1) Insufcient cleaning can lead to :
(a) The halogen substance found in the residue
of the soldering ux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Varistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering ux.
(2) Excessive cleaning can lead to :
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and/or ceramic bodies of
the Varistors due to vibration of the PC boards.
Please follow these conditions for Ultrasonic
cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
6.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning
due to the high density of liberated halogen.
7. Inspection Process
When mounted PC boards are inspected with
measuring terminal pins, abnormal and excess
mechanical stress shall not be applied to the PC
broad or mounted components, to prevent failure
or damage to the devices.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins with bend
settings of 90 mm span 0.5 mm max.
(2) Conrm that the measuring pins have the right
tip shape, are equal in height and are set in
the correct positions.
The following gures are for your reference to
avoid bending the PC board.
T : Allowable temperature difference T<150 C
Prohibited setting Recommended setting
Bending of
PC board
Nov. 2012 01
65
Bending Torsion
PC board
splitting jig
V-groove
PC board
Outline of Jig
PC
board
Chip
component
Loading
point
V-groove
Loading direction
PC
board
Chip component
Loading
point
V-groove
Loading direction
Floor
Crack
Mounted PCB
Crack
8. Protective Coating
When the surface of a PC board on which the
Capacitors have been mounted is coated with
resi n to protect agai nst moi sture and dust, i t
shall be confirmed that the protective coating
which is corrosive or chemically active is not
used, in order that the reliability of the Varistors
in the actual equipment may not be influenced.
Coating materials that expand or shrink also may
lead to damage to the Varistors during the curing
process.
9. Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stress such
as bending or torsion shown below can cause
cracking in the Varistors
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a
jig or apparatus to prevent the Varistors on the
boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below.
When PC board are broken or divided, loading
points should be close to the jig to minimize the
extent of the bending.
Also, planes with no parts mounted on should
be used as plane of loading, which generates
a compressive stress on the mounted plane, in
order to prevent tensile stress induced by the
bending, which may cause cracks of the Varistors
or other parts mounted on the PC boards.
Prohibited dividing Recommended dividing
10. Mechanical Impact
(1) The Varistors shall be free from any excessive
mechanical impact. The Varistor body is made
of ceramics and may be damaged or cracked if
dropped. Never use a Varistor which has been
dropped; their quality may be impaired and failure
rate increased.
(2) When handling PC boards with Varistors mounted
on them, do not allow the Varistors to collide
with another PC board.
When mounted PC boards are handled or stored
in a stacked state, impact between the corner of
a PC board and the Varistor may cause damage
or cracking and can deteriorate the withstand
voltage and insulation resistance of the Varistor.
Other
The various precautions described above are typical.
For special mounting conditions, please contact us.
Nov. 2012 01
Please contact Factory
1hq n!rman n h, caalQ , vald a, ! cqr /01.
1. The electronic components contained in this catalog are designed and produced for use in home electric appliances, ofce equipment, information equipment,
communications equipment, and other general purpose electronic devices.
Before use of any of these components for equipment that requires a high degree of safety, such as medical instruments, aerospace equipment, disaster-prevention
equipment, security equipment, vehicles (automobile, train, vessel),
please be sure to contact our sales representative.
2. When applying one of these components for equipment requiring a high degree of safety, no matter what sort of application it might be, be sure to install a protective
circuit or redundancy arrangement to enhance the safety of your equipment. In addition, please carry out the safety test on your own responsibility.
3. When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specications with us in advance.
4. Technical information contained in this catalog is intended to convey examples of typical performances and/or applications and is not intended to make any
warranty with respect to the intellectual property rights or any other related rights of our company or any third parties nor grant any license under such rights.
5. In order to export products in this catalog, the exporter may be subject to the export license requirement under the Foreign Exchange and Foreign Trade Law of
Japan.
6. No ozone-depleting substances (ODSs) under the Montreal Protocol are used in the manufacturing processes of Automotive & Industrial Systems Company, Panasonic
Corporation.
CAUTION AND WARNING
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