9326 D2uv2 NodeB Product Description V2.0 Sep08

Alcatel-Lucent 9326 digital 2U
V2 Node B

Product Description

_________________________________________________________________________________________
Document Number: UMT/BTS/INF/024277
Document Issue: 02.00 / EN
Document Status: Standard
Date of Issue: 29/SEP/2008
_________________________________________________________________________________________
9326 DIGITAL 2U V2 NODE B PRODUCT DESCRIPTION SEPTEMBER 2008

Document Number: UMT/BTS/INF/024227 | Document Issue: 02.00 / EN | Document Status: Standard
Alcatel-Lucent Proprietary
See Notice on Page 2
2 / 33

Copyright 2008 by Alcatel-Lucent Technologies. All Rights Reserved.
About Alcatel-Lucent
Alcatel-Lucent (Euronext Paris and NYSE: ALU) provides solutions that enable service
providers, enterprises and governments worldwide, to deliver voice, data and video
communication services to end-users. As a leader in fixed, mobile and converged broadband
networking, IP technologies, applications, and services, Alcatel-Lucent offers the end-to-end
solutions that enable compelling communications services for people at home, at work and on
the move. For more information, visit Alcatel-Lucent on the Internet: http://www.alcatel-
lucent.com.
Notice
The information contained in this document is subject to change without notice. At the time
of publication, it reflects the latest information on Alcatel-Lucents offer, however, our policy
of continuing development may result in improvement or change to the specifications
described.
All the photos and drawings are not contractual and can change without notice.
Trademarks
The following trademarks are used throughout this document:
Alcatel-Lucent, Alcatel, Lucent Technologies and their respective logos are trademarks and
service marks of Alcatel-Lucent, Alcatel and Lucent Technologies.

3 / 33

CONTENTS
1 INTRODUCTION ................................................................................................6
1.1 OVERVIEW..................................................................................................... 6
1.2 SCOPE OF THIS DOCUMENT ..................................................................................... 6
2 PRODUCT OVERVIEW..........................................................................................7
2.1 TARGET CONTEXT ............................................................................................. 7
2.2 PHYSICAL OVERVIEW........................................................................................... 7
2.2.1 Main Characteristics............................................................................... 7
2.2.2 Layout ............................................................................................... 8
2.2.3 External Dimensions ............................................................................... 9
2.2.4 Weight ............................................................................................... 9
3 PRODUCT DESCRIPTION .................................................................................... 10
3.1 ICCM-U.....................................................................................................11
3.1.1 ICCM-U Interfaces.................................................................................11
3.1.2 Dimensions .........................................................................................11
3.1.3 ICCM-U Face Plate ................................................................................12
3.2 CHANNEL ELEMENT MODULE (ICEM-U)........................................................................13
3.2.1 ICEM-U Interfaces .................................................................................13
3.2.2 Dimensions .........................................................................................13
3.2.3 ICEM-U Face Plate ................................................................................14
3.3 XCCM-U.....................................................................................................15
3.3.1 xCCM-U Interfaces ................................................................................15
3.3.2 Dimensions .........................................................................................16
3.3.3 xCCM-U Face Plate................................................................................16
3.4 CHANNEL ELEMENT MODULE (XCEM-U) .......................................................................16
3.4.1 xCEM-U Interfaces ................................................................................16
3.4.2 Dimensions .........................................................................................16
3.4.3 xCEM-U Face Plate................................................................................17
3.5 RBP .........................................................................................................17
3.6 RUC.........................................................................................................18
3.7 POWER SYSTEM...............................................................................................18
3.8 CONTROL UNIT ...............................................................................................19
3.9 OPTIONS .....................................................................................................19
3.10 ENVIRONMENTAL AND REGULATORY REQUIREMENTS .........................................................19
3.10.1 General .............................................................................................19
3.10.2 Operation Temperature and Humidity.........................................................22
3.10.3 Acoustic Noise .....................................................................................22
3.10.4 Vibration ...........................................................................................22
3.10.5 Shock................................................................................................22
3.10.6 Ingress Protection.................................................................................22
3.10.7 Regulatory Requirements........................................................................22
3.10.8 Safety...............................................................................................22
3.10.9 EMC .................................................................................................23
3.10.10 Ecology..........................................................................................23
4 EVOLIUM INTEGRATION .................................................................................... 24
4.1 MAXIMUM GSM CONFIGURATION SUPPORTED....................................................................25
4.1.1 Indoor...............................................................................................25
4.1.2 Outdoor.............................................................................................25
5 POWER SUPPLY UNITS INTEGRATION .................................................................... 26
5.1 MAIN CHARACTERISTICS .......................................................................................27

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6 APPENDIX A: RELATED READING.......................................................................... 29
6.1 EMC DOCUMENTS ............................................................................................29
6.2 SAFETY DOCUMENTS ..........................................................................................29
6.3 ENVIRONMENTAL DOCUMENTS .................................................................................29
6.4 POWER SUPPLY ...............................................................................................30
6.5 SITE SPECIFICATION...........................................................................................30
6.6 ECOLOGY.....................................................................................................30
6.7 GSM ENGINEERING DOCUMENTS ...............................................................................30
6.8 POWER SUPPLY UNITS DOCUMENTS ............................................................................30
7 APPENDIX B: PUBLICATION HISTORY..................................................................... 31
8 APPENDIX C: GLOSSARY & ACRONYMS................................................................... 32
8.1 GLOSSARY....................................................................................................32
8.2 ACRONYMS ...................................................................................................32

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LIST OF FIGURES
Figure 1 - Shelf Overview
(1)
................................................................................................... 7
Figure 2 Layout
(1)
............................................................................................................. 8
Figure 3 back view
(1)
......................................................................................................... 8
Figure 4 - External Dimensions
(1)
............................................................................................. 9
Figure 5 - d2U in Node B ...................................................................................................... 10
Figure 6 - iCCM-U adaptation for V2 form factor .......................................................................... 12
Figure 7 - iCCM-U Face Plate................................................................................................. 12
Figure 8 - iCEM-U adaptation for V2 form factor .......................................................................... 14
Figure 9 - iCEM-U face plate.................................................................................................. 14
Figure 10 - xCCM-U Face Plate............................................................................................... 16
Figure 11 - xCEM-U face plate................................................................................................ 17
Figure 12 - RBP Front View ................................................................................................... 17
Figure 13 - RUC face plate
(1)
................................................................................................. 18
Figure 14 - Air Flow............................................................................................................ 19
Figure 15 - d2U in Restricted Environment ................................................................................. 20
Figure 16 - d2U in Unrestricted Environment .............................................................................. 21
Figure 17 d2U integration within MBI5 .................................................................................... 24
Figure 18 Small Outdoor Power Supply unit .............................................................................. 26
Figure 19 Medium Outdoor Power Supply unit ........................................................................... 27

LIST OF TABLES
Table 1 - Weight of Main Items ............................................................................................... 9
Table 2 - Power Consumptions ............................................................................................... 18
Table 3 Indoor GSM Cabinets ............................................................................................... 25
Table 4 Outdoor GSM Cabinets ............................................................................................. 26


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1 INTRODUCTION
1.1 Overview
This document describes the specifications of the Alcatel-Lucent 9326 digital 2U V2 Node B
(d2U V2) for iModules and xModules.
For more information on feature availability, please refer to the Feature Planning Guide,
Baselines and Release Notes.
1.2 Scope of this Document
The Alcatel-Lucent d2U Product Description covers the high level description of the digital
base station, as well as a description of the main modules. Alcatel-Lucent has a full portfolio
of UMTS Node B, including:
- the macro range (9311 Macro Node B Indoor, 9311 Macro Node B Outdoor),
- the 9326 digital 2U V2 Node B (d2U V2) and associated Remote Radio Heads (9341 RRH20-
21, 9341 RRH40-21, 9341 RRH40-08, 9341 RRH40-19, 9341 RRH40-AWS and future) or Radio
Compact Node B (rCompact),,
- the 9313 Micro Node B,
- the 9314 Pico Node B.
This document only covers the d2U V2 equipped with iModules (iCCM-U and iCEM-U) adapted
to the V2 rack form factor and the xModules (xCCM-U and xCEM-U).


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2 PRODUCT OVERVIEW
2.1 Target Context
The d2U offers a cost-effective entry into the UMTS market for areas where site selection is
difficult. It is particularly suited for fast deployment in the user space of existing Node B or in
existing standard 19 inch racks. This Digital Node B can be used with the Radio cabinet (9332
rCompact) or Remote Radio Head (9341 RRH20-21, 9341 RRH40-21, 9341 RRH40-08, 9341
RRH40-19, 9341 RRH40-AWS and future).
2.2 Physical Overview
2.2.1 Main Characteristics

Figure 1 - Shelf Overview
(1)

The d2U has been specifically designed for coverage within constrained environments:
Dense areas where site acquisition is difficult for a regular size macro Node B.
Easier site deployment due to its low volume: no need to add a base station on the
site, installation is possible within a user space.
It can be deployed in indoor environments (standard 19 inch rack or 2G Evolium
cabinets) and outdoor environments (2G Evolium cabinets or Power supply units).
This Digital Node B can be used with the Radio cabinet (rCompact) or Remote Radio
Head (9341 RRH20-21, 9341 RRH40-21, 9341 RRH40-08, 9341 RRH40-19, 9341 RRH40-
AWS and future).
This Digital Node B uses the same W-CDMA Module features, repackaged to 19 inch
dimensions (iCCM2, iCEM2-128, xCCM, xCEM, GPSAM, OIM). Note that the iCCM-U /
xCCM-U modules provide more functionality than (respectively) the iCCM/xCCM as they
also incorporate the functionality of the GPSAM and interface to remote radios (OIM).
(1)
Photo not contractual.

8 / 33

2.2.2 Layout
The layout of the d2U is displayed in Figure 2 and 3.

Figure 2 Layout
(1)

Figure 3 back view
(1)

(1)
Photos not contractual.

iCEM-U
iCCM-U
Fans (x2)
RUC
RBP
xCEM-U

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2.2.3 External Dimensions
The external dimensions of the d2U are (HxWxD) 88.1mm (2U) x 482.6mm (19 inches) x
300mm as shown below.

Figure 4 - External Dimensions
(1)

2.2.4 Weight
The weights of the main components are as follows:

Individual Weight System Shipping
Item lbs kg Qty lbs kg
19 inches subrack + RBP + RUC + Fans 11.9 5.4 1 11.9 5.4
Filler 3.75 1.7 2..0 3.75 1.7
iCCM-U/xCCM-U 2.2/2.58 1/1.17 1 2.58 1.17
iCEM-U/xCEM-U 2.2/3.3 1/1.5 1..3 9.9 4.5
Total (fully configured) <24.38 <11.07
Table 1 - Weight of Main Items

(1)
Photos not contractual.
19 inches = 482.6mm
2U = 88.1mm
300mm
447mm

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3 PRODUCT DESCRIPTION

Figure 5 - d2U in Node B
The d2U consists of four types of hardware boards:
CCM which controls OAM management, part of call processing and internal/external
data flow switching/combining, supporting external/internal alarm connectivity and
external synchronization reference interface. The two types of CCM boards are usable;
i.e. iCCM-U adapted to the V2 form factor and xCCM-U. A single CCM-U (either iCCM-U
or xCCM-U) can be used inside a d2U V2 Node B.
CEM, controls part of call processing and base band transmit/receive digital signal
processing. One, up to a maximum three, of these modules can be inserted in the
dNode B 2U V2. The two types of CEM boards are usable; i.e. iCEM-U adapted to the V2
form factor and xCEM-U. Mixed configurations are also supported.
RBP (user Rack Back Plane), supports all internal links between CCM-U and CEM-U
modules.
RUC (Rack User Commissioning), which supports all commissioning of non-volatile
memories, and fan alarms.
The d2U V2 can be added in the user space of any Node B or in a standard 19 inch indoor rack,
when the environmental conditions are compliant with the requirements detailed in the Site
Specification document [A10].

Sector
Sector
RF feeders
:
-
RNC
d2U
i/xCCM-U i/xCEM-U
Iub
RRH RRH RRH
RUC
-48VDC
LPPCM
(Option)
EAM
Customer Alarms
or rCompact
(Option)
Sector
Sector
RRH
....
-48VDC power supply

11 / 33

3.1 ICCM-U
The iCCM-U board provides the following features:
Network interfaces : 8 E1/T1 (Iub connectivity),
o 16x16 PCM Switch
o ATM TC Layer
o 1 IMA groups,
Internal interfaces (HSSL) for iCEM-U boards,
Base band samples routing and summing,
ATM plane support,
CPU power to manage the Node B terminated flows,
Node B synchronization,
O&M functions,
Simple drop and insert functions.
GPSAM features, by collecting the information about the state of the d2U (alarms,
inventory and commissioning);
OIM features to support up to three optical links.
3.1.1 ICCM-U Interfaces
2 x Ethernet debug ports, 1 x 10BT and 1 x 10/100 BT;
2 RS232 debug ports;
3 HSSL/CPRI interfaces with SFP connection;
10MHz output reference clock based on the OVCXO 52fc, sinus wave 10dBm PPS in
connector;
1 RS485 GPS/UCPS link;
7 segment display showing the synchronization mode;
1 Ethernet backhaul port with SFP connection;
1 RJ45 port for external alarms
Various LED indications.
3.1.2 Dimensions
The iCCM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 223.6mm. It is
mandatory to add an adaptation board at the back of the module and to change the front
plate to be compatible with the V2 form factor. Once modified the Code of the module is
changed.


12 / 33

Figure 6 - iCCM-U adaptation for V2 form factor
3.1.3 ICCM-U Face Plate

Figure 7 - iCCM-U Face Plate
Leds
2x
Ethernet
Extracting
hole
PCM
E1/T1
3 Optical
SFP cages
Alarm
GPS
Synchro
10MHz
ref
100Bfx
SFP cages
New face
plate
Adaptation board
to be added to the
iCCM-U module

13 / 33

3.2 Channel Element Module (ICEM-U)
The iCEM-U board can be divided in three main functional blocks:
The Interface & Control Unit (ICU);
The Base Band Unit 1 (BBU1);
The Base Band Unit 2 (BBU2) for more processing power.
With the following functional split:
The ICU (Interface and Control Unit) performs:
The physical data interface functions for the entire CEM;
The call processing functions (NBAP) of the CEM;
The OAM functions of the CEM;
Base Band signal processing of some common channels.
The BBU (Base Band Unit) performs :
All transmit and receive base band signal processing functions: layer 1 functions of
the UMTS radio network.
3.2.1 ICEM-U Interfaces
1 x Ethernet debug port 1 x 10/100 BT;
1 RS232 debug port, on the same connector as Ethernet;
Multiple synchronization signals (from/to PDCP_RX, U2_TX FPGA);
3.2.2 Dimensions
The iCEM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 223.6mm. It is
mandatory to add an adaptation board at the back of the module and to change the front
plate to be compatible with the V2 form factor. Once modified the Code of the module is
changed.

14 / 33

Figure 8 - iCEM-U adaptation for V2 form factor

3.2.3 ICEM-U Face Plate

Figure 9 - iCEM-U face plate
Leds
Ethernet
Synchro
Extracting
hole
New face
plate
Adaptation board
to be added to the
iCEM-U module

15 / 33

3.3 xCCM-U
The xCCM-U is an enhanced version of the iCCM-U. It provides increased processing
capabilities to adapt the Node B to the evolution of the last mile connectivity using state of
the art hardware and software components. The xCCM-U board is composed of a main board
and an MDA (Media Dependent Adaptor), allowing for future evolutions and support of
additional backhauling options.
The xCCM-U board provides the following features:
Network interfaces :
o 8 E1/T1 (ATM Iub connectivity) 4 on mother board, 4 on MDA
16x16 PCM Switch
ATM TC Layer
2 IMA groups (optional feature),
o 1 FE (Fast Ethernet) port (IP Iub connectivity)
Internal interfaces (HSSL) for iCEM-U/xCEM-U boards,
Base band samples routing and summing,
ATM plane support,
CPU power to manage the Node B terminated flows,
Node B synchronization,
O&M functions,
Simple drop and insert functions.
GPSAM features, by collecting the information about the state of the d2U (alarms,
inventory and commissioning);
OIM features to support up to six optical links.
3.3.1 xCCM-U Interfaces
2 x E1 connectors (4E1s each, one on mother board, one on MDA)
1 x 100 BT connector for SiteLAN or debug
1 x 100BT connector for IP Iub backhaul
3 CPRI interfaces with SFP connection
3 CPRI or HSSL interfaces with SFP connection
10MHz output reference clock based on the OVCXO 52fc, sinus wave 10dBm PPS in
connector;
1 RS485 GPS/UCPS link
1 RJ45 port for external alarms
Two LEDs (one green, one red) are used to indicate the status of the module
One bi-color LED (green or red) is used to indicate the activity status of the board
Twelve tri-colour LEDs are used to indicate the status of synchronisation and of E1
links.

16 / 33

3.3.2 Dimensions
The ixCCM-U is a 21mm face plate board. PCB dimensions are 389.6mm x 273.0mm.
3.3.3 xCCM-U Face Plate

Figure 10 - xCCM-U Face Plate
3.4 Channel Element Module (xCEM-U)
The two main functional elements of the xCEM-U are:
The base-band units (BBU), which perform all of the base-band signal processing
functionality for each of the UMTS channels supported, and,
The interface and control unit (ICU), which provides the data, control and timing
interfaces to the Base Station. It also performs xCEM-U control and management
functions.
Compared to the previous CEM generations, the xCEM-U provides:
High capacity on a single board (capacity of iCEM-U doubled)
Support of R99, HSDPA and HSUPA on a single board
Support of 6 cells and 2 frequencies
High flexibility in board configuration
Future capacity increase via Multi-mode BBU through optimized software only.
Future proof architecture with upgrade capability towards HSPA+ and LTE
3.4.1 xCEM-U Interfaces
1 x Ethernet debug port 1 x 10/100 BT;
1 RS232 debug port, on the same connector as Ethernet;
Multiple synchronization signals (from/to PDCP_RX, U2_TX FPGA);
3.4.2 Dimensions
The xCEM-U is a 21mm face plate board. PCB dimensions are 389.6 mm x 273 mm.
Leds
Extracting
hole
PCM
E1/T1
6 Optical
SFP cages
Alarm
GPS
Synchro
10MHz
ref
2x
Ethernet

17 / 33

3.4.3 xCEM-U Face Plate

Figure 11 - xCEM-U face plate
3.5 RBP
The d2U V2 houses one iCCM-U modified or xCCM-U and up to three iCEM-U modified and/or
xCEM-U. The Rack Back Plane (RBP) is part of the d2U and allows the signalling
interconnections between the CCM-U and the CEM-U modules inserted within the digital shelf.
The backplane board also gives a power supply to the CCM-U and CEM-U modules. The
transmitted signals are:
Base Band links : HSSL between CCM-U and CEM-U;
-48V power supply;
Dallas bus for remote inventory;
Presence detect for modules.
The RBP has also its own signals:
Dallas bus for remote inventory;
Backplane identification;
Module slot identification.

Figure 12 - RBP Front View
Leds
Ethernet Synchro
Extracting
hole
Hight frequencies
connection
Power connectors for
CEM-U
Digital connector
Power connector
for CCM-U
Imput Power
connector
Hight frequencies
connection
Power connectors for
CEM-U
Digital connector
Power connector
for CCM-U
Imput Power
connector

18 / 33

3.6 RUC
The Rack User Commissioning (RUC) manages the following functionalities:
Power filtering,
Current limitation,
Commissioning,
Inventory,
Fan alarms report and power supply,
DC power supply connectivity,

Figure 13 - RUC face plate
(1)
(1)
Photo not contractual.
3.7 Power System
The d2U operates with -48 VDC power supply in accordance with [A9].
The nominal DC voltage range is 40,5VDC to -57VDC. Within the nominal voltage range, the
d2U operates at full performance. The d2U will not suffer any irreversible damage when
powered within an abnormal voltage within the range -0 VDC to -40,5 VDC and -57VDC to -60
VDC.
Configuration Max DC power
Consumption
Typ DC power
Consumption
iCCM-U + 1 iCEM-U 107W 90W
xCCM-U + 1 xCEM-U 167W 145W
Table 2 - Power Consumptions
Power
filter
Alarms

19 / 33

3.8 Control Unit
Two fans are integrated to the digital shelf to cool the boards. As shown, the cooling air path
within the shelf is:
1. Air enters on the right side of the shelf;
2. The air is drawn through the shelf to cool boards;
3. It is exhausted on the left side of the shelf.

Figure 14 - Air Flow
3.9 Options
Several options are supported by the product:
Number of CEM-U (from one to three). In case some CEM-U are not used, they have to
be replaced by fillers.
External alarms kit (16 external alarms can be managed by the d2U) - requires 1U
additional free space.
PCM Lightning Protection kit - requires 1U additional free space.
Standard standalone Installation cables.
Specifics kit for the integration in GSM Evolium cabinets.
3.10 Environmental and Regulatory Requirements
3.10.1 General
The cabinet is designed to operate under climatic condition described by [A5], Class 3.2,
except for:
High temperature: +65C;
Icy conditions;
High absolute humidity: 36g/m
3.


20 / 33

The d2U is manufactured according to WEEE (Waste of Electrical and Electronic Equipment)
and RoHS (Restriction of Hazardous Substances) recommendations.
3.10.1.1 d2U in restricted environment
The environmental boundary conditions for d2U standalone deployment are:
Air inlet and outlet shall be free of any blockage across the full height of the
module (see figures below in green)
Maximum inlet (right hand side) air temperature of +60 C
Pressure drop generated by the air inlet and outlet shall not be greater than
5 Pa @ 120m
3
/h

Air inlet and
outlet

Figure 15 - d2U in Restricted Environment

21 / 33

3.10.1.2 d2U in unrestricted environment
The environmental boundary conditions for d2U standalone deployment are:
Air inlet and outlet shall be free of any blockage across the full height of the module
(see below in green)
Maximum inlet (right hand side) air temperature of +65 C
Pressure drop generated by the air inlet and outlet shall not be greater than 5 Pa @
120m
3
/h

Figure 16 - d2U in Unrestricted Environment

Air inlet and
outlet
40 40

22 / 33

3.10.2 Operation Temperature and Humidity
The total operational temperature range of the d2U is 5C/+65C.
The rack shall be compatible with sitting at locations where the surrounding air may have a
high moisture content as describe by [A5]:
Relative humidity: +8% to +100%
Absolute humidity: 0.03 g/m
3
to 36 g/m
3

3.10.3 Acoustic Noise
The maximum d2U sound power levels emitted in accordance with [A7] are the following:
LwAd = 56 dB(A) at 25C
3.10.4 Vibration
Once fully installed, the d2U meets the requirements of [A6], class 3M5.
3.10.5 Shock
Once fully installed, the d2U meets the requirements of [A6], class 3M5.
3.10.6 Ingress Protection
The d2U shelf is weather resistant to prevent ingress of rain, snow, dust, and other solid
foreign objects to a minimum level of IP20 as specified by [A4].
3.10.7 Regulatory Requirements
For Europe, the standards mentioned below are part of mandatory standards to obtain CE
Mark under European EMC directive 89/336/EEC and new European EMC Directive
2004/108/EC.
3.10.8 Safety
The d2U is designed to meet the following Safety Regulatory standards:
For European deployment: [A3].
For North America deployment: [A16] and [A17].
For deployment in others countries or regions: [A2].

23 / 33

3.10.9 EMC
The d2U meets the following EMC standards:
For European deployment: [A1].
For North America deployment: [A18].
For deployment in others countries or regions: [A19].

3.10.10 Ecology
The cabled cabinet is compliant to WEEE [A11] and RoHS [A12] directives.


24 / 33

4 EVOLIUM INTEGRATION
Integration of the d2U is possible in the following GSM cabinets (MBI5, CIDE, CIMA, MBO1,
MBO2, MBO1E, MBO2E, COME, CODE). Nevertheless, because the d2U is integrated in one of
the subrack in MBI5 - MBO1 and MBO1E, the modules initially in this subrack must be moved to
other positions and single-TRX may be replaced by Twin-TRX in order to maintain the previous
number of carriers. For more information, please refer to Engineering document [A13].

Figure 17 d2U integration within MBI5

D2U
GSM
Modules

25 / 33

4.1 Maximum GSM configuration supported
The maximum GSM configurations supported when the d2U is integrated in the 2G cabinets are
the followings.
4.1.1 Indoor
DC AC Cabinet
Initial Final with
Single TRX
Final with
Twin TRX
Initial Final with
Single TRX
Final with
Twin TRX
Up to 12 8 12 Up to 12 8 12
Up to 6/6 4/4 6/6 Up to 6/6 4/4 6/6
MBI5
Up to 4/4/4 3/3/3 4/4/4 Up to 4/4/4 3/3/3 wo BATS 4/4/4
Up to 12 8 12 Up to 8 8 wo BATS
Up to 6/6 4/4 6/6 Up to 2/2 2/2 wo BATS
Medi G4 (CIDE)

Up to 4/4/4 3/3/3 4/4/4 Up to 2/2/2 2/2/2 wo BATS
Up to 12 8 12
Up to 6/6 4/4 6/6
Medi G3 (CIMA)

Up to 4/4/4 3/3/3 4/4/4
Table 3 Indoor GSM Cabinets
4.1.2 Outdoor
Cabinet Initial Final with
Single TRX
Final with
Twin TRX
Up to 8 4 8
Up to 4/4 2/2 4/4
G4 Evol MBO1E
Up to 2/2/2 1/1/1 2/2/2
Up to 12
Up to 6/6
G4 Evol MBO2E
Up to 4/4/4

No change
Up to 8 4 8
Up to 4/4 2/2 4/4
G4 MBO1
Up to 2/2/2 1/1/1 2/2/2
Up to 12
Up to 6/6
G4 MBO2
Up to 4/4/4

No change

26 / 33

Up to 12
Up to 6/6
G4 Medi COME
Up to 4/4/4

No change
Up to 12
Up to 6/6
G4 Medi CODE
Up to 4/4/4

No change
Table 4 Outdoor GSM Cabinets
5 POWER SUPPLY UNITS INTEGRATION
Integration of the d2U V2 is possible in the Small and Medium Outdoor Power supply unit. For
more information, please refer to Small d2U Outdoor Power Supply unit Product description
[A14] and Medium d2U Outdoor Power Supply unit Product description [A15].

Figure 18 Small Outdoor Power Supply unit

d2U
PCM LP
External Alarm module
Power Unit
Batteries
Controller
Rectifiers
Inputs / Outputs

27 / 33

Figure 19 Medium Outdoor Power Supply unit
5.1 Main characteristics
The main characteristic of the Outdoor Power supply units are the followings:
Small Medium
Dimensions (HxWxD)
- w/o plinth
- With Plinth

740x581x586mm
890x581x586mm

N/A
1500x820x700mm
Net Weight with plinth 66 kg 174kg
Ingress Protection IP55 IP55
Operating temperature range -40C+50C (+55C
under conditions)
-40C+50C (+55C
under conditions)
Number of RRH supported by the
PSU
Up to 3 Up to 6
User space 4U (d2U room) 8U + 5U (Top d2U
room)
d2U
PCM LP
External Alarm module
Power Unit
Batteries
Inputs / Outputs
User space or
Second battery

28 / 33

Supported options - PCM LP or RETA
- Ext Alarms
- PCM LP or RETA
- Ext Alarms
- 7705 SAR
- 2
nd
battery shelf or
Microwave
Battery back up time - Up to 2 hours for
d2U + 3 RRH
- Up to 8 hours for
d2U + 3 RRH


29 / 33

6 APPENDIX A: RELATED READING
For further information please refer to:
6.1 EMC Documents
[A1] ETSI EN 300 386: Electromagnetic compatibility and Radio spectrum Matters (ERM);
Telecommunication network equipment; ElectroMagnetic Compatibility (EMC)
requirements.
[A18] 47 CFR Part 15 - RADIO FREQUENCY DEVICES
[A19] CISPR 22 - Limits and methods of measurement of radio disturbance characteristics
of information technology equipment

6.2 Safety Documents
[A2] IEC 60950-1 Information Technology Equipment Safety Part1: General
Requirements, Ed.1 2001.
[A3] EN 60950-1 Information Technology Equipment Safety Part1: General
Requirements, Ed.1 2001.
[A16] CAN/CSA C22.2 No.60950-01 Information Technology Equipment Safety Part1:
General Requirements
[A17] UL 60950-1 Information Technology Equipment Safety Part1: General
Requirements
6.3 Environmental Documents
[A4] IEC 60529 Degrees of Protection Provided by Enclosure, (IP code) Ed.2.1 2001.
[A5] ETS 300 019-2-3 Equipment Engineering (EE); Environmental conditions and
environmental tests for telecommunications equipment; part 2-3: classification of
environmental conditions stationary use at weather protected locations: class 3.2,
except for:
High temperature: +65 C,
Condition of icing
High absolute humidity (36g/m
3
)
[A6] ETS 300 019-1-3, Environmental Engineering (EE); Environmental conditions and
environmental tests for telecommunications equipment; Part 1-3: Classification of
environmental conditions; Stationary use at weather protected locations.
[A7] ISO 7779 Acoustic: Measurement of Airborne Noise emitted by computers and
business equipment.

30 / 33

6.4 Power Supply
[A9] ETS 300 132-2 Power supply interface at the input to telecommunications
equipment; Part 2: Operated by direct current (DC).
6.5 Site Specification
[A10] IM 06-0406 UMTS dNode B 2U Site Specification.
6.6 Ecology
[A11] Directive 2002/96/EC of 27 January 2002 on waste electrical and electronic
equipment (WEEE)
[A12] 2002/95/EC Directive 2002/95/EC of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment (RoHS)

6.7 GSM Engineering documents
[A13] Engineering rules for configuration (TBD)

6.8 Power Supply Units documents
[A14] Small S6 Outdoor enclosure (MIFR)
[A15] Medium Outdoor enclosure (TBD)

31 / 33

7 APPENDIX B: PUBLICATION HISTORY
29/FEB/2008
Issue 01.00/EN, Preliminary
Creation

11/APR/2008
New Photos
Weight updated

21/APR/2008
Power consumptions updated

29/SEP/2008
Issue 02.00/EN, Standard
Main characteristics of the Small and Medium Power Supply units
Minors corrections


32 / 33

8 APPENDIX C: GLOSSARY & ACRONYMS
8.1 Glossary
Node B A logical node responsible for UMTS radio transmission/reception in one or more cells
to/from the User Equipment.
Iub Interface between a Node B and an RNC.

8.2 Acronyms
This section provides a list of the terms and acronyms used within this document.

1 11 1 - -- - 10 10 10 10
2U 3.5 inch
3GPP Third Generation Partnership
Project
A A A A - -- - E EE E
ATM Asynchronous Transfer Mode
BBU Base Band Unit
BTS Base Station Transceiver
Subsystem
CCM Alpha version of iCCM
CEM Alpha version of iCEM
CPRI Common Public Radio Interface
DBP Digital Back Plane
dBTS Digital BTS
DC Direct Current (Power source)
E1 Standard European PCM link
nickname
EMC Electro-Magnetic Compatibility
EMI Electro-Magnetic Interference
G G G G O OO O
GPS Global Positioning System
GPSAM GPS/Alarm Module
GPxOIM GPSAM + Xoim
GSM Global System for Mobile
HSDPA High Speed Downlink Packet
Access
HSSL High Speed Serial Link
HW Hardware
ICCM-U Specific module with function of
GPSAM, CCM and OIM
ICEM-U Specific Icem128 module
ICU Interface Control Unit
IEC International Electro-technical
Committee
IMA Inverse Multiplexing for ATM
IP Ingress Protection
ISO International Standards
Organization
OAM Operation Administration and
Maintenance
OEM Original Equipment
Manufacturer
OIM Optical Interface Module

3 / 33

P P P P - -- - Z ZZ Z
PCM Pulse Code Modulation
RBP Rack Back Plane
rBTS Radio BTS
RNC Radio Network Controller for
UMTS
RoHS Restriction of Hazardous
Substance
RRH Remote Radio Head
RUC Rack User Commissioning
SFP Small Form-factor Pluggable
SW Software
T1 Standard US PCM system
(1.544Mbit/s)
UL Underwriters Laboratories
UMTS Universal Mobile
Telecommunication System
UTRAN UMTS Terrestrial Radio Access
Network
WEEE Waste Electrical and Electronic
Equipment
xCCM-U 2
nd
generation of CCM module
with function of GPSAM, xCCM
and OIM
xCEM-U Specific xCEM module with 256
channel elements

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