Tda 1023
Tda 1023
Tda 1023
DATA SHEET
Philips Semiconductors
Product specication
TDA1023/T
The TDA1023 is a bipolar integrated circuit for controlling triacs in a proportional time or burst firing mode. Permitting precise temperature control of heating equipment it is especially suited to the control of panel heaters. It generates positive-going trigger pulses but complies with regulations regarding mains waveform distortion and RF interference.
QUICK REFERENCE DATA SYMBOL VCC VZ I16(AV) tw Tb -IOH(1) Tamb Note 1. Negative current is defined as conventional current flow out of a device. A negative output current is suited for positive triac triggering. ORDERING INFORMATION EXTENDED TYPE NUMBER TDA1023 TDA1023T Note 1. TDA1023: 16 DIL; plastic (SOT38); SOT38-1; 1996 November 27. 2. TDA1023T: 16 mini-pack; plastic (SO16; SOT109A); SOT109-1; 1996 November 27. PACKAGE PINS 16 16 PIN POSITION DIL mini-pack MATERIAL plastic plastic CODE SOT38(1) SO16; SOT109A(2) PARAMETER supply voltage (derived from mains voltage) stabilized supply voltage for temperature bridge supply current (average value) trigger pulse width ring burst repetition time at CT = 68 F output current operating ambient temperature range MIN. TYP. 20 13.7 8 10 200 41 MAX. 150 +75 UNIT V V mA s s mA C
May 1991
Philips Semiconductors
Product specication
TDA1023/T
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DESCRIPTION internal pull-down resistor not connected output hysteresis control input proportional range control input control input unbuffered reference input output of reference buffer buffered reference input pulse width control input reference supply output ring burst repetition time control input ground positive supply not connected external resistor connection
n.c.
Rpd 1 n.c. 2 Q 3 HYS 4 16 RX 15 n.c. 14 VCC
TDA1023
PR 5 CI 6 UR 7 QR 8
MBA484
13 VEE 12 TB 11 VZ 10 PW 9 BR
n.c. RX
May 1991
Philips Semiconductors
Product specication
TDA1023/T
Control and reference inputs CI, BR and UR (pins 6, 9 and 7) For the control of room temperature (5 C to 30 C) optimum performance is obtained by using the translation circuit. The buffered reference input BR (pin 9) is used as a reference input whilst the output reference buffer QR (pin 8) is connected to the unbuffered reference input UR (pin 7). This ensures that the range of room temperature is encompassed in most of the rotation of the potentiometer to give a linear temperature scale with accurate setting. Should the translation circuit not be required, the unbuffered reference input UR (pin 7) is used as a reference input. The buffered reference input BR (pin 9) must then be connected to the reference supply output VZ (pin 11). For proportional power control the unbuffered reference input UR (pin 7) must be connected to the firing burst repetition time control input TB (pin 12).The buffered reference input BR (pin 9), which is in this instance inactive, must then be connected to the reference supply output VZ (pin 11). Proportional range control input PR (pin 5) The output duty factor changes from 0% to 100% by a variation of 80 mV at the control input CI (pin 6) with the proportional range control input PR open. For temperature control this corresponds to a temperature difference of 1 K. By connecting the proportional range control input PR (pin 5) to ground the range may be increased to 400 mV, i.e. 5 K. Intermediate values may be obtained by connecting the PR input to ground via a resistor R5 (see Table 1). Hysteresis control input HYS (pin 4) With the hysteresis control input HYS (pin 4) open, the device has a built-in hysteresis of 20 mV. For temperature control this corresponds with 0.25 K. Hysteresis is increased to 320 mV, corresponding to 4 K, by grounding HYS (pin 4). Intermediate values are obtained by connecting pin 4 via resistor R4 to ground. Table 1 provides a set of values for R4 and R5 giving a fixed ratio between hysteresis and proportional range.
May 1991
Philips Semiconductors
Product specication
TDA1023/T
UNIT V
mA mA A V mA V V
mA mA mW C C
May 1991
Philips Semiconductors
Product specication
TDA1023/T
TYP.
MAX.
UNIT
15 6
V mV/mA mA
pins 4 and 5 grounded Reference supply output VZ (pin 11) for external temperature bridge V11-13 I11 V6-13 I6, 7, 9 V6 V6 V6 V6 tw output voltage output current
7.1 1 2
mA
V mA
Control and reference inputs CI, BR and UR (pins 6, 9 and 7) input voltage to inhibit the output input current V1 = 4 V pin 4 open pin 4 grounded 7.6 V A
Proportional control range input PR (pin 5) proportional range proportional range pin 5 open pin 5 grounded 50 80 400 130 mV mV s
Pulse width control input PW (pin 10) pulse width I10(RMS) = 1mA; f = 50 Hz 100 200 300
Firing burst repetition time control input TB (pin 12) TbCT ring burst repetition time, ratio to capacitor CT output voltage at input voltage: V8-13 V8-13 V8-13 Output Q (pin 3) VOH IOH output voltage HIGH output current HIGH IOH = 150 mA 10 150 V mA V9-13 = 1.6 V V9-13 = 4.8 V V9-13 = 8 V 3.2 4.8 6.4 V V V 320 600 960 ms/F
May 1991
Philips Semiconductors
Product specication
TDA1023/T
Proportional range
Effective DC value
Catalogue number(1)
F 68 47 33 22 15 10 Note
F 47 33 22 15 10 6.8
handbook, halfpage
RX 16
14
VCC
STABILIZER
11 V Z
13 VEE
MBA483
May 1991
Philips Semiconductors
Product specication
TDA1023/T
RSD VCC 14 CS RX 16
TDA1023
13 V EE
RG
MBA470
a.
D1
load (heater) RD VCC 14 CS 13 V EE RX 16 AC mains voltage VS
U
3
TDA1023
RG
MBA482
b.
RX 16 3
TDA1023
RG
c.
May 1991
Philips Semiconductors
Product specication
TDA1023/T
May 1991
Philips Semiconductors
Product specication
TDA1023/T
May 1991
10
Philips Semiconductors
Product specication
TDA1023/T
Fig.9 VS = 110 V.
Fig.10 VS = 220 V.
May 1991
11
Philips Semiconductors
Product specication
TDA1023/T
Fig.11 VS = 240 V.
Fig.12 VS = 380 V.
May 1991
12
Philips Semiconductors
Product specication
TDA1023/T
Fig.13 Synchronization resistor Rs as a function of required trigger pulse width tw with a mains voltage Vs as a parameter.
Fig.14 Nominal value of voltage dropping capacitor CD and power PRSD dissipated in a voltage dropping resistor RSD as a function of average supply current I16 (AV) with the mains supply voltage VS as a parameter.
May 1991
13
Philips Semiconductors
Product specication
TDA1023/T
D1
load (heater) RD VCC R1 CS VZ CI BR C1 R NTC Rp 11 6 9 14 RX 16 RS PW 10 3 Q 1 R pd RG triac line AC mains voltage VS neutral
TDA1023
13 8 7 4 5 12 VEE QR UR HYS PR TB
CT
MBA513
Conditions:- Mains supply; VS = 220 V; Temperature range = 5 to 30 C. BT139 data at Tj = 25 C; Vgt < 1.5 V; Igt > 70 mA; IL < 60 mA
Fig.15 The TDA1023/T used in a 1200 to 2000 W heater with triac BT139. For component values see Table 3.
May 1991
14
Philips Semiconductors
Product specication
TDA1023/T
VALUE 75 s 180 k 110 4.1 mA n.c. n.c. 11.1 mA 6.2 k 4.6 W 68 F 250 V AC BYW56 18.7 k 22 k 22 k 47 nF 220 F; 16 V
If RD and D1 are replaced by CD and RSD CD RSD PRSD VDR Notes 1. ON/OFF control: pin 12 connected to pin 13. 2. If translation circuit is not required: slider of Rp to pin 7; pin 8 open; pin 9 connected to pin 11. mains dropping capacitor series dropping resistor power dissipated in RSD voltage dependent resistor see Fig.14 cat. no. 2322 594 62512 470 nF 390 0.6 W 250 V AC
May 1991
15
Philips Semiconductors
Product specication
TDA1023/T
SOT38-1
D seating plane
ME
A2
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
May 1991
16
Philips Semiconductors
Product specication
TDA1023/T
SOT109-1
A X
c y HE v M A
Z 16 9
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
8 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
May 1991
17
Philips Semiconductors
Product specication
TDA1023/T
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
May 1991
18
Philips Semiconductors
Product specication
TDA1023/T
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
May 1991
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