Datasheet NEC
Datasheet NEC
Datasheet NEC
PC8190K,PC8191K
DESCRIPTION
The PC8190K and PC8191K are silicon monolithic integrated circuit designed as receiver (RX) and transmitter (TX) IF section for W-CDMA. The PC8190K is a RX-IF IC including IF-AGC amplifier and demodulator. The
PC8191K is a TX-IF IC including IF-AGC amplifier and quadrature modulator. These two ICs are suitable for kit-use
for W-CDMA IF section. The ICs are developed using NECs new ultra high speed silicon bipolar process.
FEATURES
RX-IF: 380 MHz, TX-IF: 570 MHz Low power consumption Built-in power saving function Small size: 20-pin plastic QFN package (3.2 4.2 0.8 mm)
APPLICAION
W-CDMA
ORDERING INFORMATION
Part Number Package 20-pin plastic QFN (3.2 4.2 0.8 mm) Supplying Form Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape Qty 2.5 kpcs/reel
PC8190K-E1 PC8191K-E1
Remark To order evaluation samples, please contact your local NEC sales office. Part number for sample order: PC8190K, PC8191K
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P15669EJ2V0DS00 (2nd edition) Date Published August 2001 NS CP(K) Printed in Japan
2001
PC8190K,PC8191K
APPLICATION EXAMPLE
Variation of IF plan
PC8190K, PC8191K: RX-IF = 380 MHz, TX-IF = 570 MHz PC8194K, PC8195K: RX-IF = 190 MHz, TX-IF = 380 MHz
AGC + I/Q Demodulator PC8190K, PC8194K
LNA
MIX
BPF H 90 To Baseband
1st LO DUPLX
PC8190K,PC8191K
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION PC8190K (RX)
(Top View)
15 VCC (AGC, REG.) 14 GND (AGC, REG.)
IF_IN 16 IF_INb 17 GND (AGC, REG.) 18 N.C. 19 VPS 20 REG. and Gain Control Phase Shifter (1/2)
11 VCC (Demod.)
13 TEST2
12 TEST1
10 I 9 Ib 8 Q 7 Qb 6 GND (Demod.)
GND (Demod.) 5
N.C. 2
LO 3
LOb 4
Vcont 1
PC8190K,PC8191K
PIN EXPLANATIONS PC8190K (RX)
Pin No. 1 Applied Voltage (V) 0 to 3.0 Pin Voltage (TYP.) Note (V)
Pin Name
Vcont
Gain cnotrol pin of AGC amplifier. Variable gains are available in accordance with applied voltage.
VCC 54 k 1 5k 12 k
2 19
N.C.
Non connection. This pin is not connected to internal circuit. This pin should be opened or grounded.
LO
Local signal input pin of I/Q demodulator. Input frequency is 760 MHz.
3 VCC
LOb
Bypass pin of local signal input for I/Q demodulator. In the case of single local input, this pin must be decoupled with capacitor ex. 100 to 1 000 pF.
50
50
GND
5 6
GND (Demod.)
Ground pin of I/Q demodulator. This pin should be grounded with minimum inductance. Form the ground pattern as widely as possible to minimize ground impeadance.
Qb
VCC
Ib
10
GND
PC8190K,PC8191K
PC8190K (RX)
Applied Voltage (V) 2.7 to 3.3 Pin Voltage (TYP.) Note (V)
Pin No. 11
Pin Name
Supply voltage pin of I/Q demodulator (phase shifter + I/Q Mixer). TEST pin. In actual use, this pin should be grounded. Ground pin of AGC amplifier and internal regulator. This pin should be grounded with minimum inductance. Form the ground pattern as widely as possible to minimize ground impedance.
12 13 14 18
0 0 0
15
2.7 to 3.3
16
IF signal input pin. This pin is input of AGC amplifier. Balance input between 16, 17 pin. Input frequency is 380 MHz.
16
1.1 k
VCC
17
IF_INb
IF signal input pin. In the case of signal local input, this pin must be decoupled with capacitor.
17
1.2 k 1.2 k
GND
20
VPS
H: 2.2 to VCC
Power saving pin. This pin modulator can control Active/Sleep state with bias as follows. VPS (V) 0 to 0.5 2.2 to 3 State Sleep Mode Active Mode
20 100 k GND VCC 100 k
L: 0 to 0.5
PC8190K,PC8191K
ABSOLUTE MAXIMUM RATINGS PC8190K (RX)
Parameter Supply Voltage Applied Voltage Operating Ambient Temperature Storage Temperature Symbol VCC VPS, Vcont TA Tstg Ratings 4.0 0.3 to VCC + 0.3 40 to +85 55 to +150 Unit V V C C
ELECTRICAL CHARACTERISTICS PC8190K (RX) (Unless otherwise specified, VCC = 3.0 V, TA = +25C, fIF = 382.5 MHz, fLO = 760 MHz, PLO = 15 dBm, fI/Q = 2.5 MHz)
Parameter Circuit Current Symbol ICC Test Conditions No input signal At power-saving mode Voltage Gain V G1 VG2 Input 3rd Order Intercept Point IIP3 Vcont = 2.5 V Vcont = 0.5 V Gain = +65 dB (RS= 600 balanced), PIFin = 70 dBm Gain = 10 dB (RS= 600 balanced), PIFin = 10 dBm Local Leakage LOL Leakage to I/Q port when local = 380 MHz and output = 30 mVP-P balanced 3 dB down Balanced output fI/Q = 2.5 MHz fI/Q = 2.5 MHz Vcont = 1 to 2 V MIN. 68 60 TYP. 9 77 20 55 MAX. 12 1 15 20 Unit mA
A
dB dB dBm
dBm
dBc
I/Q Bandwidth I/Q Maximum Output Swing I/Q Gain Balance I/Q Phase Error Gain Accuracy Rise Time from Power-saving Mode Rising Voltage from Power-saving Mode Falling Voltage from Power-saving Mode Gain Flatness
10 1 2.2
0.5
4
4.6
6
20
s
V
0.5
Flat
0.5
dB
PC8190K,PC8191K
STANDARD CHARACTERISTICS FOR REFERENCE PC8190K (RX) (Unless otherwise specified, VCC = 3.0 V, TA = +25C, fIF = 382.5 MHz, fLO = 760 MHz, PLO = 15 dBm, fI/Q = 2.5 MHz)
Parameter Noise Figure Error Vector Magnitude (Vector Error) Symbol NF EVM Test Conditions Gain = +65 dB IF = 380 MHz, 3.84 Msps QPSK modulation, gain is adujsted Gain = +50 dB MIN. TYP. 9.5 3 45 MAX. 12 Unit dB %rms
Pin (1 dB)
dBm
PC8190K,PC8191K
MEASUREMENT CIRCUIT PC8190K (RX)
VCC 2.2 nF TOKO Balun transformer 616DB-1078 100 pF IF in 12 pF 100 pF 68 nH 15 nH 1 pF 1.2 k 2.2 nF
PC8190K
AGC1 AGC2 AGC3 1F 1F 1F 1F 3.3 k
I
3.3 k
IX
3.3 k
Q
3.3 k
QX
100 pF
Remark
100 pF
Vcont
LOin
PC8190K,PC8191K
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION PC8191K (TX)
(Top View)
14 GND (AGC, MIX) 13 GND (AGC, MIX) 15 VCC (AGC, MIX)
12 GND (REG.)
11 VCC (REG.)
7 LO 6 LOb
GND (Shifter) 3
Qb 1
Q 2
Tank 4
Tank 5
PC8190K,PC8191K
PIN EXPLANATIONS PC8191K (TX)
Pin No. 1 Applied Voltage (V) VCC/2 Pin Voltage (TYP.) Note (V)
Pin Name
Qb
Q signal input pin. Apply bias voltage externally. Maximum balance input voltage is 1 000 mVP-P (balance).
VCC/2
GND (Shifter)
Ground pin of I/Q modulator. This pin should be grounded with minimum inductance. Form the ground pattern as widely as possible to minimize ground impedance.
4 5
Tank
2.65
External inductor and capcitor can supress harmonics spurious of LO frequency. LC value should be determined according to LO input frequency and suppression level.
4 5
External
LOb
2.02
Bypass pin of local signal inpu for I/Q modulator. In the case of single local input, this pin must be decoupled with capacitor ex. 1 000 pF.
LO
2.02
Local signal input of I/Q modulator. The DC cut capacitor ex. 1 000 pF must be attaced to this pin.
8 9
Supply voltage pin of I/Q modulator. Power saving pin of I/Q modulator + AGC amplifier. This pin modulator can control Active/Sleep state with bias as follows. VPS (V) 0 to 0.5 2.2 to 3 State Sleep Mode Active Mode
9
50 k
10
PC8190K,PC8191K
PC8191K (TX)
Applied Voltage (V) 0 to 3.0 Pin Voltage (TYP.) Note (V)
Pin No. 10
Pin Name
Vcont
Gain control pin of AGC amplifier. Variable gains are available in accordance with applied voltage between 0 to 3.0 V.
10.5 k
2.5 k
11 12
2.7 to 3.3 0
Supply voltage pin of internal regulator. Ground pin internal regulator. This pin should be grounded with minimum inductance. Form the ground pattern as widely as possible to minimize ground impedance.
13 14 18
Ground pin of AGC amplifier + I/Q Mixer. This pin should be grounded with minimum inductance. Form the ground pattern as widely as possible to minimize ground impedance.
15
2.7 to 3.3
Supply voltage pin of AGC amplifier + I/Q Mixer. IF output pin. The inductor must be attached between VCC and output pin due to open collector. Output frequency is 570 MHz which is 3/4 of local signal frequency 760 MHz.
16
16
2.7 to 3.3
External 17
1 k
17
IFoutb
2.7 to 3.3
Balance output of IFout pin. The inductor must be attached between VCC and output pin due to open collector.
19
VCC/2
I signal input pin. Apply bias voltage externally. Maximum balance input voltage is 1 000 mVP-P (balance).
20
Ib
VCC/2
19
20
11
PC8190K,PC8191K
ABSOLUTE MAXIMUM RATINGS PC8191K (TX)
Parameter Supply Voltage Applied Voltage Operating Ambient Temperature Storage Temperature Symbol VCC VPS, Vcont TA Tstg Ratings 4.0 0.3 to VCC + 0.3 40 to +85 55 to +150 Unit V V C C
ELECTRICAL CHARACTERISTICS PC8191K (TX) (Unless otherwise specified, VCC = 3.0 V, TA = +25C, fIF = 570 MHz, fLO = 760 MHz, PLO = 15 dBm, fI/Q = 10 kHz, 400 mVP-P balanced sine-wave)
Parameter Circuit Current Symbol ICC Test Conditions No input signal At power-saving mode Output Power Pout Vcont = 2.3 V, I/Q = 400mVP-P balanced Vcont = 0.3 V, I/Q = 400mVP-P balanced Local Leakage Image Rejection Output Harmonics 1 Output Harmonics 2 Rise Time from Power-saving Mode Rising Voltage from Power-saving Mode Falling Voltage from Power-saving Mode LOL ImR Hm1 Hm2 tPS VPS on Leakage when IF output = 190 MHz Leakage when IF output = 380 MHz MIN. 17 TYP. 30.5 0 13 93 MAX. 38 1 88 30 30 20 30 10 2.2 Unit mA
A
dBm
dBm
s
V
VPS off
0.5
12
PC8190K,PC8191K
STANDARD CHARACTERISTICS FOR REFERENCE PC8191K (TX) (Unless otherwise specified, VCC = 3.0 V, TA = +25C, fIF = 570 MHz, fLO = 760 MHz, PLO = 15 dBm, fI/Q = 10 kHz, 400 mVP-P balanced sine-wave)
Parameter Output Noise Level 1 Output Noise Level 2 Error Vector Magnitude (Vector Error) Adjacent Channel Power Symbol NFL1 NFL2 EVM ACPR fIF 5 MHz Test Conditions Pout = 25 dBm, fIF 20 MHz Pout = 65 dBm, fIF 20 MHz MIN. TYP. 148 162 3 55 MAX. Unit dBm/Hz dBm/Hz %rms dBc
13
PC8190K,PC8191K
MEASUREMENT CIRCUIT PC8191K (TX)
VCC VCC
1 F
1 F
VCC 1 F 8 pF 12 nH IFout 82 nH REG. and AGC_Control 1 F TOKO Type B4F 617DB-1024 82 nH VCC 1 F 1 F 1 F LPF 1/2 Phase Shifter (1/2) 1nF LOin 1nF Vcont VPS VCC
I Ib
1 pF
Remark
: AC connector : DC terminal
Qb
15 nH
14
PC8190K,PC8191K
PACKAGE DIMENSIONS 20-PIN PLASTIC QFN (PIN-PITCH: 0.4 mm, UNIT: mm)
4.20.2 4.00.2
3.00.2
3.20.2
3.20.2
Pin 20
Pin 1
(Bottom View)
0.180.05 0.300.15
4.00.2
0.80.1
4.20.2
3.00.2
0.4
15
PC8190K,PC8191K
NOTE ON CORRECT USE
(1) Observe precautions for handling because this IC is an electrostatic sensitive device. (2) Form a ground pattern as widely as possible to minimize its impedance (to prevent undesires oscillation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor to the VCC pin.
For soldering
VPS
VP15-00-3
Partial Heating
Note After opening the dry pack, store it at 25C or less and 65% RH or less for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For the details the recommended soldering conditions, refer to the document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
16
PC8190K,PC8191K
[MEMO]
17
PC8190K,PC8191K
[MEMO]
18
PC8190K,PC8191K
[MEMO]
19
PC8190K,PC8191K
The information in this document is current as of August, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4