MRF89XAM8A Data Sheet

868 MHz Ultra-Low Power Sub-GHz Transceiver Module

2010 Microchip Technology Inc.

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Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable.

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-637-1
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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MRF89XAM8A
868 MHz Ultra-Low Power Sub-GHz Transceiver Module
Features
Module designed from the MRF89XA integrated ultra low-power, sub-GHz transceiver IC. Supports proprietary sub-GHz wireless protocols Simple, SPI Interface with Interrupts Small size: 0.7" x 1.1" (17.8 mm x 27.9 mm), surface mountable Integrated crystal, internal voltage regulator, matching circuitry and Printed Circuit Board (PCB) antenna Easy integration into final product: minimize product development, quicker time to market Compatible with Microchips Microcontroller families (PIC16, PIC18, PIC24, dsPIC33 and PIC32) Conforms to the following ETSI standards: - EN 300 220-2 V2.3.1 (200102) - EN 301 489-3 V1.4.1 (200208)

RF/Analog Features
863870 MHz operation Modulation: FSK and OOK Data rate (to conform to ETSI standards): - FSK: 40 kbps - OOK: 16 kbps Reception sensitivity - FSK: -107 dBm (typical) at 25 kbps - OOK: -113 dBm (typical) at 2 kbps +10 dBm typical output power with 21 dB Tx power control range

Media Access Controller (MAC)/Baseband Features

Packet handling features with data whitening and automatic CRC generation Incoming sync word (pattern) recognition Built-in bit synchronizer for incoming data, and clock synchronization and recovery 64-byte transmit/receive FIFO with preload in stand-by mode Supports Manchester encoding/decoding techniques

Operational
Operating voltage: 2.13.6V (3.3V typical) Temperature range: -40C to +85C Industrial Low-current consumption: - Rx mode: 3 mA (typical) - Tx mode: 25 mA at +10 dBm (typical) - Sleep: 0.1 A (typical)

Pin diagram

GND RESET CSCON IRQ0 SDI SCK

1 2 3 4 5 6

12 11 10 9 8 7

GND GND VIN IRQ1 CSDATA SDO

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Table of Contents
.0 Device Overview .......................................................................................................................................................................... 3 2.0 Circuit Description ........................................................................................................................................................................ 9 3.0 Regulatory Approval ................................................................................................................................................................... 19 4.0 Electrical Characteristics ............................................................................................................................................................ 21 Appendix A: Revision History............................................................................................................................................................... 27 The Microchip Web Site ....................................................................................................................................................................... 29 Customer Change Notification Service ................................................................................................................................................ 29 Customer Support ................................................................................................................................................................................ 29 Reader Response ................................................................................................................................................................................ 30 Product Identification System............................................................................................................................................................... 31

TO OUR VALUED CUSTOMERS

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Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.

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1.0 DEVICE OVERVIEW
1.1 Interface description
The MRF89XAM8A is an ultra-low power sub-GHz surface mount transceiver module with integrated crystal, internal voltage regulator, matching circuitry and PCB antenna. The MRF89XAM8A module operates in the European 863870 MHz frequency band and is ETSI compliant. The integrated module design frees the integrator from the extensive RF and antenna design, and regulatory compliance testing, allowing quicker time to market. The MRF89XAM8A module is compatible with Microchips MiWi Development Environment software stacks. The software stacks are available as a free download, including source code, from the Microchips web site http://www.microchip.com/wireless. The MRF89XAM8A module has been tested and conforms to EN 300 220-2 V2.3.1 (200102) and EN 301 489-3 V1.4.1 (200208) European Standards. The module tests can be applied toward final product certification and Declaration of Conformity (DoC). To maintain conformance, refer to module settings in Section 1.3, Operation. Additional testing may be required depending on the end application. The simplified block diagram of the MRF89XAM8A module is illustrated in Figure 1-1. The module is based on the Microchip Technology MRF89XA ultra-low power sub-GHz transceiver Integrated Circuit (IC). The module interfaces to many popular Microchip PIC microcontrollers through a 3-wire serial SPI interface, two chip selects (configuration and data), two interrupts Interrupt Request 0 (IRQ0) and Interrupt Request 1 (IRQ1), Reset, power and ground as illustrated in Figure 1-2. Table 1-1 provides the related pin descriptions. Serial communication and module configuration are documented in the MRF89XA Ultra-Low Power, Integrated Sub-GHz Transceiver (DS70622) Data Sheet. Refer to the MRF89XA Data Sheet for specific serial interface protocol and general register definitions. Also, see Section 1.3, Operation for specific register settings that are unique to the MRF89XAM8A module operation to maintain regulatory compliance.

FIGURE 1-1:

MRF89XAM8A BLOCK DIAGRAM

MRF89XAM8A Module MRF89XA CSCON Control Interface RF Baseband IRQ0 Power Management IRQ1 RESET Power VCO Tank Loop Filter 12.8 MHz Crystal CSDATA SPI Digital I/O

PCB Antenna

Matching Circuitry and SAW Filter

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MRF89XAM8A
TABLE 1-1:
Pin 1 2 3 4 5 6 7 8 9 10 11 12

PIN DESCRIPTION
Symbol GND RESET CSCON IRQ0 SDI SCK SDO CSDATA IRQ1 Vin GND GND Type Power DI DI DO DI DI DO DI DO Power Power Power Description Ground Reset Pin Serial Interface Configure Chip Select Interrupt Request Output Serial Interface Data Input Serial Interface Clock Serial Interface Data Output Serial Interface Data Chip Select Interrupt Request Output Power Supply Ground Ground

FIGURE 1-2:

MICROCONTROLLER TO MRF89XAM8A INTERFACE

MRF89XAM8A CSCON CSDATA SDI Vin GND SDO SCK IRQ0 IRQ1 RESET PIC Microcontroller I/O I/O SDO SDI SCK INTx INTx I/O

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1.2 Mounting Details
The MRF89XAM8A is a surface mountable module, the module dimensions are illustrated in Figure 1-3. The module PCB is 0.032" thick with castellated mounting holes on the edge. Figure 1-4 is the recommended host PCB footprint for the MRF89XAM8A. The MRF89XAM8A has an integrated PCB antenna. For the best performance, follow the mounting details as illustrated in Figure 1-5. It is recommended that the module be mounted on the edge of the host PCB and an area around the antenna, approximately 3.4" (8.6 cm), be kept clear of metal objects for best performance. A host PCB ground plane around the MRF89XAM8A acts as a counterpoise to the PCB antenna. Extend the host PCB top copper ground plane under and to the left and right side of the module at least 0.4 inches (1 cm) for best antenna performance.

FIGURE 1-3:

MODULE DETAILS

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FIGURE 1-4: RECOMMENDED PCB FOOTPRINT

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FIGURE 1-5: MOUNTING DETAILS

3.4

Keep area around antenna (approximately 3.4 inches (8.6 cm)) clear of metallic structures for best performance.

Edge of PCB 0.470

3.4

0.4

0.4

Host PCB Top Copper Ground Plane (Antenna Counterpoise): Extend the host PCB top copper ground plane under and to the left and right side of the module at least 0.4 inches (1 cm) for best antenna performance.

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1.3 Operation
1.3.4
The MRF89XAM8A module is based on the Microchip Technology MRF89XA ultra-low power, integrated ISM band sub-GHz transceiver IC. Serial communication and module configuration are documented in the MRF89XA Ultra-Low Power, Integrated ISM Band Sub-GHz Transceiver Data Sheet (DS70622). This section emphasizes operational settings that are unique to the MRF89XAM8A module design that must be followed in order for the module to conform to the tested European standards summarized in Section 3.0, Regulatory Approval. Note: To maintain conformance to tested ETSI standards, the module shall not be modified and settings in Section 1.3, Operation must be observed.

FREQUENCY SHIFT KEYING MODULATION (FSK)

The following settings must be followed for FSK modulation mode to conform to the European standards summarized in Section 3.0, Regulatory Approval. Bit Rate Maximum Setting: 40 kbps Frequency Deviation Maximum Setting: 40 kHz Transmit Bandwidth Maximum Setting: 125 kHz Lower Frequency Setting: 863.5 MHz Upper Frequency Setting: 869.5 MHz

1.3.5

ON-OFF KEYING MODULATION (OOK)

1.3.1

RESET

The following settings must be followed for OOK modulation mode to conform to the European standards summarized in Section 3.0, Regulatory Approval. Bit Rate Maximum Setting: 16 kbps Frequency Deviation Maximum Setting: 80 kHz Transmit Bandwidth Maximum Setting: 125 kHz Lower Frequency Setting: 863.5 MHz Upper Frequency Setting: 869.5 MHz

Pin 2 of the module, RESET, enables an external reset of the MRF89XA IC. RESET is connected to the TEST8 pin of the MRF89XA IC. During normal operations of the MRF89XAM8A, the RESET pin should be held in a high impedance state. For more information on assertion of the RESET pin, refer to Section 3.1.2 Manual Reset of MRF89XA Data Sheet (DS70622).

1.3.2

CRYSTAL FREQUENCY

When calculating frequency deviation, bit rate, receiver bandwidth, and PLL R, P and S values, use crystal frequency fxtal = 12.8 MHz.

1.3.3

CLOCK OUTPUT (CLKOUT)

The CLKOUT pin 19 of the MRF89XA IC is not used on the module. Ensure that the CLKOUT signal is disabled to minimize current consumption.

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2.0 CIRCUIT DESCRIPTION
The MRF89XAM8A module interfaces to Microchips PIC16, PIC18, PIC24, dsPIC33 and PIC32 microcontrollers with a minimum of external components through digital only connections. An example application schematic is illustrated in Figure 2-1. Figure 2-2 illustrates the MRF89XAM8A schematics. Table 2-1 details the Bill of Materials (BOM).

2.1

Module Schematic

The MRF89XAM8A module is based on the Microchip Technology MRF89XA Ultra-Low Power, Integrated ISM Band sub-GHz Transceiver IC. The serial I/O (CSCON, CSDATA, SCK, SDO and SDI), RESET, IRQ0 and IRQ1 pins are brought to the module pins. Crystal X1 is a 12.8 MHz crystal with a frequency tolerance of 10 ppm at 25C. The RFIO output is matched to the SAW filter FL1 and further matched to the PCB trace antenna.

FIGURE 2-1:

MRF89XAM8A APPLICATION SCHEMATIC

+ 3.3V Note 1

C1 0.1 F U1 MRF89XAMxA-I/RM

+ C2 1 0 F

1 GND 2 3 To Host Microcontroller 4 IRQ0 5 SDI 6 SCK SDO CSDATA IRQ1 RESET CSCON GND GND

12 11 10 VIN 9 8 7 To Host Microcontroller

Note:

For battery powered applications, place a 10 F capacitor in parallel with the 0.1 F bypass capacitor to provide a low impedance during startup sequences.

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MRF89XAM8A SCHEMATIC

FIGURE 2-2:

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Note:

Designators not used: C6, L5

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TABLE 2-1:
Designator C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 FL1 L1 L2 L3 L4 L5 L6 R1 R2 R3 U1 X1 10 nH 1 100K 6.8K MRF89XA 12.8 MHz

MRF89XAM8A BILL OF MATERIALS

Value 0.047 F 0.22 F 1 F 22 pF 1.8 pF 33 pF 0.1 F 680 pF 0.01 F 4.3 pF 1.5 pF TA0801A 8.2 nH 100 nH 6.8 nH 6.8 nH Description Capacitor, Ceramic, 10V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 6.3V, 10%, X5R, SMT 0603 Manufacturer Murata Murata Murata Part Number GRM155R71A473KA 01D GRM155R71C224KA 12D GRM188R60J105KA 01D 500R07S220JV4 500R07S1R8BV4 GRM1555C1H330JZ 01D GRM155R71C104KA 88D GRM1555C1H681JA 01D GRM155R71C103KA 01D 500R07S4R3BV4 500R07S1R5BV4 TA0801A L-07C8N2JV6T L-07CR10JV6T L-07W6N8JV4T L-07W6N8JV4T L-07C10NJV6T CRCW04021R00FKE D RC0402JR-07100KL RC0402FR-076K8L MRF89XA-I/MQ ABM3B-155-12.800M Hz-T

Capacitor, Ceramic, 50V, 5%, UHI-Q NP0, Johanson Technology SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Designator not used Capacitor, Ceramic, 50V, 5%, C0G, SMT 0402 Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 50V, 5%, C0G, SMT 0402 Capacitor, Ceramic, 16V, 10%, X7R, SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Capacitor, Ceramic, 50V, 0.1 pF, UHI-Q NP0, SMT 0402 Filter, SAW, 863870 MHz Inductor, Ceramic, 5%, SMT 0402 Inductor, Ceramic, 5%, SMT 0402 Inductor, Wirewound, 5%, SMT 0402 Inductor, Wirewound, 5%, SMT 0402 Designator not used Inductor, Ceramic, 5%, SMT 0402 Resistor, 1%, 100 ppm/0C, SMT 0402 Resistor, 5%, 100 ppm/0C, SMT 0402 Resistor, 1%, 100 ppm/0C, SMT 0402 Transceiver, Ultra-Low Power, Integrated sub-GHz Crystal, 10 ppm, 15 pF, ESR 100 ohms, SMT 5 x 3.2mm Johanson Technology Vishay/Dale Yageo Yageo Microchip Technology Abracon Johanson Technology Murata Murata Murata Murata Johanson Technology Johanson Technology Tai-saw Technology Johanson Technology Johanson Technology Johanson Technology Johanson Technology

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2.2 Printed Circuit Board
FIGURE 2-5:
The MRF89XAM8A module PCB is constructed with high temperature FR4 material, 4 layers and 0.032 inches thick. These layers are shown in Figure 2-3 through Figure 2-8. The stack up of the PCB is shown in Figure 2-9

LAYER 2 GROUND PLANE

FIGURE 2-3:

TOP SILK SCREEN

FIGURE 2-6:

LAYER 3 POWER PLANE

FIGURE 2-4:

TOP COPPER

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FIGURE 2-7: BOTTOM COPPER

FIGURE 2-8:

BOTTOM SILK SCREEN

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FIGURE 2-9: PCB LAYER STACK UP

1/2 oz. Copper 8 mil FR4 1/2 oz. Copper 0.032 0.005 12 mil FR4 1/2 oz. Copper 8 mil FR4 1/2 oz. Copper

Top Copper

Ground Plane

Power Plane

Bottom Copper

2.3

PCB Antenna

FIGURE 2-10:

The PCB antenna is fabricated on the top copper trace. Figure 2-10 illustrates the trace dimensions. The layers below the antenna have no copper traces. The ground and power planes under the components serve as a counterpoise to the PCB antenna. Additional ground plane on the host PCB will substantially enhance the performance of the module. For best performance, place the module on the host PCB by following the recommendations given in the Section 1.2, Mounting Details. The PCB antenna was designed and simulated using Ansoft Designer and HFSS 3D full-wave solver software by ANSYS Inc. (www.ansoft.com). The goal of the design was to create a compact, low-cost antenna with the best radiation pattern. Figure 2-11 illustrates the simulation drawing and Figure 2-12 and Figure 2-13 illustrates the 2D and 3D radiation patterns. As shown by the radiation patterns, the performance of the antenna is dependant upon the orientation of the module. Figure 2-14 illustrates the impedance simulation and Figure 2-15 illustrates the simulated PCB antenna VSWR. The discrete matching circuitry matches the impedance of the antenna with the SAW filter and MRF89XA transceiver IC.

PCB ANTENNA DIMENSIONS

16.8mm 2.5mm

1.0mm 1.1mm

0.5mm 8.4mm

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FIGURE 2-11: PCB ANTENNA SIMULATION DRAWING

FIGURE 2-12:

SIMULATED 2D RADIATION PATTERN

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FIGURE 2-13: SIMULATED 3D RADIATION PATTERN

FIGURE 2-14:

SIMULATED PCB ANTENNA IMPEDANCE

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FIGURE 2-15: SIMULATED PCB ANTENNA VSWR

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NOTES:

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MRF89XAM8A
3.0
3.1

REGULATORY APPROVAL
Europe

3.1.1

HELPFUL WEB SITES

The MRF89XAM8A module conforms to the emission and immunity standards summarized in Table 3-1. The module tests can be applied toward final product certification and DoC. Note: To maintain conformance tested ETSI standards, the module shall not be modified and settings in Section 1.3, Operation must be observed.

A helpful document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, can be downloaded from the following websites: European Radio Communications Office (ERO): http://www.ero.dk. Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org/ European Telecommunications Standards Institute (ETSI): http://www.etsi.org/

The European Standards do not provide a modular approval similar to the USA (FCC) and Canada (IC). However, the completed compliance testing can be used as part of the customer's application for product certification. The module test report data can be included in the customer's product test plan and can significantly lower customer's certification burden. Depending on the end application, additional testing may be required. The integrator is responsible for testing the end product for any additional compliance requirements that become necessary with this module installed (for example, digital device emission, PC peripheral requirements and so on) in the specific country where end device is marketed.

TABLE 3-1:

EMISSIONS AND IMMUNITY STANDARDS TESTED

Specification Emission Standards Test Method

EN 300 220-2 V2.3.1 (200102) EN 300 220-2 V2.3.1 (200102) EN 300 220-2 V2.3.1 (200102) EN 300 220-2 V2.3.1 (200102) EN 300 220-2 V2.3.1 (200102) EN 300 220-2 V2.3.1 (200102) EN 301 489-3 V1.4.1 (200208) EN 301 489-3 V1.4.1 (200208) EN 301 489-3 V1.4.1 (200208)

7.1.2 7.3.2 7.5.2 7.7.2 8.6.4 Immunity Standards

Frequency error and drift Effective Radiated Power Transient power Modulation bandwidth Unwanted emissions on the spurious domain Receiver spurious radiation Conducted emissions Radiated emissions Radiated immunity

5.1.3.1 5.1.3.3 5.1.3.4 5.1.3.6 5.1.3.7 5.1.4.6 EN 55022:2007 EN 55022:2007 EN 61000-4-3

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4.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. -40C to +85C Storage temperature .............................................................................................................................. -55C to +125C Voltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6V Voltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V) Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mA Electrostatic discharge with human body model .................................................................................................... 1000V NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

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TABLE 4-1: RECOMMENDED OPERATING CONDITIONS
Parameter Ambient Operating Temperature Supply Voltage for RF, Analog and Digital Circuits Supply Voltage for Digital I/O Input High Voltage (VIH) Input Low Voltage (VIL) Note 1: Min -40 2.1 2.1 0.5 * VIN -0.3V Typ Max +85 3.6 3.6 VIN + 0.3 0.2 * VIN VIN + 1.5 Unit C V V V V V Condition

AC Peak Voltage on Open Collector Outputs (IO)(1) VIN 1.5 At minimum, VIN 1.5V should not be lower than 1.8V.

TABLE 4-2:
Symbol IDDSL IDDST IDDFS IDDTX IDDRX Note 1:

CURRENT CONSUMPTION
Chip Mode Sleep Idle Min Typ 0.1 65 1.3 25 16 3.0 Max 2 80 1.7 30 21 3.5 Unit A A mA mA mA mA Condition Sleep clock disabled, all blocks disabled Oscillator and baseband enabled Frequency synthesizer running Output power = +10 dBm Output power = +1 dBm(1)

Frequency Synthesizer Tx Rx

Guaranteed by design and characterization.

TABLE 4-3:
Symbol VIL VIH IIL IIH VOL VOH Note 1: 2:

DIGITAL I/O PIN INPUT SPECIFICATIONS(1)

Characteristic Input Low Voltage Input High Voltage Min 0.8 * VIN -0.5 -0.5 0.9 * VIN Typ Max 0.2 * VIN 0.5 0.5 0.1 * VIN Unit V V A A V Condition VIL = 0V VIH = VIN, VIN = 3.7 IOL = 1 mA IOH = -1 mA

Input Low Leakage Current(2) Input High Leakage Current Digital Low Output Voltage Digital Low Output

Measurement Conditions: TA = 25C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified. Negative current is defined as the current sourced by the pin.

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TABLE 4-4:
Symbol FRO BRFSK BROOK FDFSK FXTAL FSSTP TSOSC TSFS

PLL PARAMETERS AC CHARACTERISTICS(1)

Parameter Frequency Ranges Bit Rate (FSK) Bit Rate (OOK) Frequency Deviation (FSK) Crystal Oscillator Frequency Frequency Synthesizer Step Oscillator Wake-up Time Frequency Synthesizer Wake-up Time; at most, 10 kHz away from the target Frequency Synthesizer Hop Time; at most, 10 kHz away from the target Min 863 1.56 1.56 33 9 Typ 50 12.8 2 1.5 500 Max 870 40 16 200 5 800 Unit MHz kbps kbps kHz MHz kHz ms s NRZ NRZ Variable, depending on the frequency From Sleep mode(1) From Stand-by mode Condition

TSHOP

180 200 250 260 290 320 340

s s s s s s s

200 kHz step 1 MHz step 5 MHz step 7 MHz step 12 MHz step 20 MHz step 27 MHz step

Note 1:

Guaranteed by design and characterization.

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TABLE 4-5:
Symbol RSF

RECEIVER AC CHARACTERISTICS(1)
Parameter Sensitivity (FSK) Min Typ -107 -103 -113 -106 -12 27 52 57 -48 -37 -33 -28 280 600 400 400 460 480 520 550 600 70 Max 250 400 500 900 1/fdev Unit dBm dBm dBm dBm dBc dB dB dB dBm dBm dBm kHz kHz dBm s s s s s s s s s s dB Condition 869 MHz, BR = 25 kbps, fdev = 50 kHz, fc = 100 kHz 869 MHz, BR = 66.7 kbps, fdev = 100 kHz, fc = 200 kHz 869 MHz, 2 kbps NRZ fc fo = 50 kHz, fo = 50 kHz 869 MHz, 16.7 kbps NRZ fc fo = 100 kHz, fo = 100 kHz Modulation as wanted signal Offset = 300 kHz, unwanted tone is not modulated Offset = 600 kHz, unwanted tone is not modulated Offset = 1.2 MHz, unwanted tone is not modulated Offset = 1 MHz, unmodulated Offset = 2 MHz, unmodulated, no SAW Offset = 10 MHz, unmodulated, no SAW Single side BW, Polyphase Off Single side BW, Polyphase On Interferers at 1 MHz and 1.950 MHz offset From FS to Rx ready From Stand-by to Rx ready 200 kHz step 1 MHz step 5 MHz step 7 MHz step 12 MHz step 20 MHz step 27 MHz step From Rx ready Ranging from sensitivity

RSO

Sensitivity (OOK)

CCR ACR

Co-Channel Rejection Adjacent Channel Rejection

BI

Blocking Immunity

RXBWF RXBWU ITP3 TSRWF TSRWS TSRHOP

Receiver Bandwidth in FSK Mode(2) Receiver Bandwidth in OOK Mode(2) Input Third Order Intercept Point Receiver Wake-up Time Receiver Wake-up Time Receiver Hop Time from Rx Ready to Rx Ready with a Frequency Hop

50 50

RSSIST RSSTDR Note 1: 2:

RSSI Sampling Time RSSI Dynamic Range

Guaranteed by design and characterization. This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.

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TABLE 4-6:
Symbol RFOP

TRANSMITTER AC CHARACTERISTICS(1)
Description Min Typ +12.5 -8.5 -112 Max -47 Unit dBm dBm dBc/Hz dBc Condition Maximum power setting Minimum power setting Measured with a 600 kHz offset at the transmitter output At any offset between 200 kHz and 600 kHz, unmodulated carrier, fdev = 50 kHz No modulation, see Note(2) -40 dBm

RF Output Power, Programmable with 8 Steps of typ. 3 dB Phase Noise Transmitted Spurious

PN TXSP

Tx2 Tx3 Tx4 Txn FSKDEV TSTWF TSTWS Note 1: 2:

Second Harmonic Third Harmonic Fourth Harmonic Harmonics above Tx4 FSK Deviation Transmitter Wake-up Time Transmitter Wake-up Time 33 55 120 600 200 500 900 kHz s s

Programmable From FS to Tx ready From Stand-by to Tx ready

Guaranteed by design and characterization. Transmitter in-circuit performance with SAW filter and crystal.

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4.1 Timing Specification and Diagram
SPI TIMING SPECIFICATION(1,2)
Parameter SPI Configure Clock Frequency SPI Data Clock Frequency Data Hold and Setup Time SDI Setup Time for SPI Configure SDI Setup Time for SPI Data CSCON Low to SCK Rising Edge; SCK Falling Edge to CSCON High CSDATA Low to SCK Rising Edge; SCK Falling Edge to CSDATA High CSCON Rising to Falling Edge CSDATA Rising to Falling Edge Note 1: 2: Min 2 250 312 500 625 500 625 Typ Max 6 1 Unit MHz MHz s ns ns ns ns ns ns Condition

TABLE 4-7:

Typical Values: TA = 25C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified. Negative current is defined as the current sourced by the pin.

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APPENDIX A: REVISION HISTORY
Revision A (November 2010)
This is the Initial release of the document.

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MRF89XAM8A
NOTES:

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THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Product Support Data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software General Technical Support Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchips customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

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MRF89XAM8A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: RE: Technical Publications Manager Reader Response Total Pages Sent ________

From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: MRF89XAM8A Questions: 1. What are the best features of this document? Y N Literature Number: DS70651A FAX: (______) _________ - _________

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

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PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
PART NO M X T -X
Example: a) b) MRF89XAM8A-I/RM: Industrial temperature tray. MRF89XAM8AT-I/RM: Industrial temperature tape and reel,

Device

Module Module Type

Tape and Temperature Reel Range

Device

MRF89XAM8A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz Transceiver module I = -40C to +85C (Industrial)

Temperature Range

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Worldwide Sales and Service

AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509

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08/04/10

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