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    Oxford, England 1Hr From London

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    This document provides information about AML, a company located in Oxford, England that was founded in 1992 to design and manufacture MEMS devices and is now focused on wafer bonding equipment and services. It discusses AML's products including wafer bonding machines and a new micro-nano polymer embossing tool. It also outlines the wafer bonding and related process development services offered through AML's Bondcentre including commercial wafer bonding, technology transfer and training.

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    Oxford, England 1Hr From London

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    api-3709410
    31 views12 pages
    This document provides information about AML, a company located in Oxford, England that was founded in 1992 to design and manufacture MEMS devices and is now focused on wafer bonding equipment and services. It discusses AML's products including wafer bonding machines and a new micro-nano polymer embossing tool. It also outlines the wafer bonding and related process development services offered through AML's Bondcentre including commercial wafer bonding, technology transfer and training.

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    This document provides information about AML, a company located in Oxford, England that was founded in 1992 to design and manufacture MEMS devices and is now focused on wafer bonding equipment and services. It discusses AML's products including wafer bonding machines and a new micro-nano polymer embossing tool. It also outlines the wafer bonding and related process development services offered through AML's Bondcentre including commercial wafer bonding, technology transfer and training.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    31 views12 pages

    Oxford, England 1Hr From London

    Uploaded by

    api-3709410
    This document provides information about AML, a company located in Oxford, England that was founded in 1992 to design and manufacture MEMS devices and is now focused on wafer bonding equipment and services. It discusses AML's products including wafer bonding machines and a new micro-nano polymer embossing tool. It also outlines the wafer bonding and related process development services offered through AML's Bondcentre including commercial wafer bonding, technology transfer and training.

    Copyright:

    Attribution Non-Commercial (BY-NC)
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    Download as ppt, pdf, or txt
    of 12

    OXFORD, ENGLAND

    1HR FROM LONDON

    AML

    1 Hour from London


    AML History
    • Company founded 1992 - Private SME
    • One of the first Companies in the world formed to exploit
    MEMS; Design & Manf of Field emitters (Nano-tips), Cap
    P sensors.. (founders 1985!)
    • Designed & made MEMS devices. Also Design house for
    Bosch, Tronics, Onstream & SensorNor
    • High Risk low return - Goodbye Mr. Chips
    • Easier to make $ building machines!
    • Last 9 years AML moved to equipment manufacturer &
    service provider centred around WAFER BONDING
    Worldwide installed base of machines
    • New Micro-Nano polymer emboss – print tool
    AML Products
    1. Aligned Wafer Bonding machines
    2. Aligned Micro-Nano Polymer Emboss tool
    3. Advanced Substrates: Si-Glass, Si-Quartz….

    Services - BONDCENTRE
    • Commercial Wafer Bonding service
    • Bonding process development, tech transfer & training
    • Associated Processes: cleaning, activation, structuring e.g.
    Powder blasting (holes) Deposition; Glass frit, Eutectic
    Electroplating (e.g.vias), CMP & wafer characterisation; Profile,
    TTV, Ra, & inspection; SAM, IR..
    Wafer bonding has found many applications in the
    field of MST, MEMS, III-V, ICs & Optical devices:
    • MEMS devices - Pressure Sensors, Accelerometers, Microfluidics

    • Vacuum encapsulation (absolute pressure, IR detectors…)

    • 1st Level Packaging to isolate package induced stresses.

    • Wafer scale Packaging – MEMS & IC

    • III-Vs e.g. high performance LEDs bonded reflector - heat sink

    • 3D Interconnects

    • Temporary bonds for handle wafers (interlayer & direct)

    • Advanced bonded substrates e.g. Si on Glass (SOG), GaAs on Si…

    • Layer transfer - Smart cut


    Bonded WLP
    Front FAB Back
    Substrates 3D
    End Device construction End
    Starting material Packaging & Int
    AML Wafer Bonders
    Wafer bonding capabilities:-

    • Anodic Bonding Si-Glass


    • Direct Bonding e.g. Si-Si
    • Glass Frit Bonding
    • Eutectic Bonding
    • Thermo-compression
    • Adhesive Bonding
    • Aligned Embossing
    RAD activation for low T bonding

    In situ chamber alignment & bonding

    = more process flexibility & higher throughput


    AML in-situ Bonding Platform

    Anodic, Adhesive, Eutectic,


    Glass Frit, Direct, Adhesive &
    Thermo-compression
    AWB Platform Outline Spec:-
    • Unique In-situ alignment system (X,Y,Z & θ)
    • Up to 1 micron accuracy manual & Auto alignment
    • Full automatic PC control & data acquisition,
    • Application of High Voltage up to 2.5KV
    • Temperatures up to 560oC,
    • Forces up to 15000N
    • Self contained dry pumping system for vacuum up to 10-6 mBar.
    • Forced nitrogen cooling.
    • 2” to 8” wafers (Depending on model chosen)
    • RAD
    • Remote interrogation – connect to customer machine via Teamviewer http://www.teamviewer.com
    • CMOS compatible machine

    Coming Soon
    • UV adhesive cure
    • Automated wafer handling
    • 12”
    AML Aligner Wafer Bonder Technical Benefits
    One System Does it ALL (Align, Activate and Bond in one bond chamber)
    ALIGN / BOND
    • No wafer movement between alignment & bonding – guaranteed alignment accuracy
    • Simultaneous alignment, heating and vac pump-down (fastest cycle time)
    • In-bond chamber alignment at bond temperature (reduces expansion misalignment effects you
    would see with competitors jigging)
    • No flags touching bond surfaces so no possibility of contamination, damage or flag removal
    issues
    • Best system for vacuum encapsulation (Large gap between wafers during pump-down)
    • Independent control of upper & Lower wafer temperatures – (useful for getter activation)
    • Best system for reducing / forming gas environment - e.g. for eutectic bonding.
    (reproducible wafer surface environment)
    • Wide range of processes possible – Including Nano-Imprint
    ACTIVATE (enables low temperature Direct Bonding)
    • In-bond chamber RAD activation option – activated surfaces cannot be re-contaminated
    • Less surface roughening and more uniform activation than plasma
    • No exposure of wafers to energetic ions --> can be used with sensitive device wafers
    • Wider process time window for activation than with plasma- process time less critical
    • In-situ system provides better reproducibility and therefore better process stability
    AML Aligner Wafer Bonder Commercial Benefits
    ECONOMIC
    • Lowest cost per bond & ownership
    • No mask aligner required- free to choose best mask aligner for your ‘mask aligning’
    • System is complete – no other equipment required
    • Reasonably priced spares

    EASY
    • Very high reliability – minimal servicing – fast & simple to maintain
    • Standard machines as well as custom options to suit specific customer needs
    • Easy to use - system up and running and in use in minimum time

    SUPPORT
    • Excellent process support via BONDCENTRE – fast response
    • More than 20 years machine & wafer bonding process experience.
    • Worldwide Machine base.

    • New Embossing Upgrade – 3 Machines for the price of One!


    Aligner, Bonder & Embosser!
    New Polymer Micro-Nano Hot Emboss & Print tool Upgrade

    Applications: e.g.
    Bio-sensors & Microfluidics
    Nano arrays, Polymer electronics
    Polymers: SU8, PDMS, PMMA..

    < 100nm structures


    Based on same equipment platform
    Outline Specification
    ALIGN, EMBOSS
    Force up to15kN Stroke < 750 microns to 2mm & BOND WITH
    T </= 500 C 700N De-emboss force ONE MACHINE
    Operation in 2 micron alignment
    Vacuum between stamp & substrate

    Long stroke with high lateral precision for the formation of high aspect
    ratio embossed structures
    BONDCENTRE SERVICES OFFERED
    • Development of Wafer Bonding & associated Processs e.g. for many
    novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,
    …
    • Wafer Bonding process selection & design for your application
    • Commercial Wafer Bonding Service prototype to production &
    products e.g substrates
    • Wafer Bonding Technology Transfer (inc Equipment) & Training
    • Associated Processes (Pre & Post Bond)
    • Applications knowledge for:
    MEMS Smart cut layer transfer
    Advanced Substrates Wafer Level Packaging
    3D integration Vacuum Encapsulation
    Temporary Bonding LEDs

    Recognised experts & Funded by UK Government to provide services to Industry


    Pre & Post Bonding Services & Equipment

    • WAFER ALIGNER BONDERS 4 machines in Class 10


    • Wafer METROLOGY; AFM, Ra, PROFILE, TTV
    • WAFER CLEANING MEGASONIC & Activation
    • NEW ‘RAD’ dry ACTIVATION
    • INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR
    • ELECTROPLATING: e.g. VIAS in Au, In, Cu & Ni
    • SCREEN PRINT - GLASS FRIT/ADHESIVE
    • Structuring e.g. Holes via POWDER BLASTING
    • CMP

    Also access via long term collaboration with CMF @ Rutherford to:
    • PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES
    • Standard ETCHING – DRY & WET
    • WAFER SAW WIRE & BUMP BONDING
    • METROLOGY: THIN FILM, LINE WIDTH, SEM

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