TL 7705 A
TL 7705 A
TL 7705 A
SUPPLY-VOLTAGE SUPERVISORS
SLVS028I APRIL 1983 REVISED JULY 2009
Drop
Wide Supply-Voltage Range
Precision Voltage Sensor
Temperature-Compensated Voltage
Reference
True and Complement Reset Outputs
Externally Adjustable Pulse Duration
REF
RESIN
CT
GND
VCC
SENSE
RESET
RESET
description/ordering information
ORDERING INFORMATION{
PACKAGE}
TA
PDIP (P)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Tube of 50
TL7702ACP
Tube of 75
TL7702ACD
Reel of 2500
TL7702ACDR
Tube of 50
TL7705ACP
Tube of 75
TL7705ACD
Reel of 2500
TL7705ACDR
SOP (PS)
Reel of 2000
TL7705ACPSR
T7705A
PDIP (P)
Tube of 50
TL7709ACP
TL7709ACP
Tube of 75
TL7709ACD
Reel of 2500
TL7709ACDR
Tube of 50
TL7712ACP
Tube of 75
TL7712ACD
Reel of 2500
TL7712ACDR
PDIP (P)
Tube of 50
TL7715ACP
TL7715ACP
SOIC (D)
Tube of 75
TL7715ACD
7715AC
PDIP (P)
Tube of 50
TL7702AIP
TL7702AIP
Tube of 75
TL7702AID
Reel of 2500
TL7702AIDR
Tube of 50
TL7705AIP
Tube of 75
TL7705AID
Reel of 2500
TL7705AIDR
Reel of 2500
TL7712AIDR
SOIC (D)
PDIP (P)
SOIC (D)
0C to 70C
0 C 70 C
SOIC (D)
PDIP (P)
SOIC (D)
SOIC (D)
40C to 85C
40 C 85 C
PDIP (P)
SOIC (D)
SOIC (D)
TL7702ACP
7702AC
TL7705ACP
7705AC
7709AC
TL7709ACP
7712AC
7702AI
TL7705AIP
7705AI
7712AI
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2009, Texas Instruments Incorporated
Reference
Voltage
CT
SENSE
100 A
6
3
7
RESET
RESET
R1
(see Note A)
R2
(see Note A)
2
RESIN
1
GND
REF
timing diagram
VCC and SENSE
Threshold Voltage
VCC 3.6 V
VCC 2 V
RESET
td
Output
Undefined
td
Output
Undefined
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V
Input voltage range, VI, RESIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
Input voltage range, VI, SENSE: TL7702A (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6 V
TL7705A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
TL7709A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
TL7712A, TL7715A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 20 V
High-level output current, IOH, RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Low-level output current, IOL, RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Package thermal impedance, JA (see Notes 3 and 4): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC 1 V or 6 V, whichever
is less.
3. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
VIH
18
VIL
MAX
3.5
VCC
V
0.6
TL7702A
0
0
10
TL7709A
15
TL7712A
20
TL7715A
See Note 2
TL7705A
VI
UNIT
20
IOH
16
mA
IOL
16
mA
TA
TL77xxAC
70
40
TL77xxAI
85
NOTE 2: For proper operation of the TL7702A, the voltage applied to the SENSE terminal should not exceed VCC 1 V or 6 V, whichever is less.
TEST CONDITIONS
PARAMETER
MIN
VOH
IOH = 16 mA
VOL
IOL = 16 mA
Vref
Reference voltage
TA = 25C
TYP
UNIT
MAX
VCC1.5
V
0.4
2.48
2.53
2.58
2.48
2.53
2.58
4.5
4.55
4.6
7.5
7.6
7.7
TL7712A
10.6
10.8
11
TL7715A
13.2
13.5
13.8
TL7702A
TL7705A
VIT
Negative-going i
N
ti
i input th h ld voltage,
t threshold lt
SENSE
TL7709A
TA = 25 C
25C
TL7702A
Vhys
10
TL7705A
15
TL7709A
TA = 25 C
25C
TL7712A
II
IOH
0.5
All electrical characteristics are measured with 0.1-F capacitors connected at REF, CT, and VCC to GND.
2
50
1.8
50
VO = 0
Supply current
100
VO = 18 V
ICC
IOL
20
VI = 0.4 V
TL7702A
mV
45
VI = 2.4 V to VCC
RESIN
SENSE
20
35
TL7715A
Input current
mA
TEST CONDITIONS
PARAMETER
UNIT
MIN
MAX
0.65
CT = 0.1 F
TYP
1.2
2.6
msec
0.4
tw(S)
Pulse duration
at SENSE input to switch outputs
tpd
tf
Fall time
VCC = 5 V
tr
1
0.2
RESET
VCC = 5 V,
V
VCC = 5 V,
V
RESET
See Note 5
See Note 5
3.5
3.5
RESET
RESET
0.2
s
s
s
s
s
All switching characteristics are measured with 0.1-F capacitors connected at REF and VCC to GND.
NOTE 5: The rise and fall times are measured with a 4.7-k load resistor at RESET and RESET.
VIT+
VIT
VIT+
0V
VIH
RESIN
Undefined
2V
0.7 V
tf
tr
VIL
tpd
90%
90%
90%
RESET
VOH(RESET)
50%
10%
td
td
tf
90%
RESET
50%
10%
10%
10%
td
10%
VOL(RESET)
tr
TYPICAL CHARACTERISTICS
DEASSERTION TIME
vs
LOAD RESISTANCE
ASSERTION TIME
vs
LOAD RESISTANCE
7
42
VCC = 5 V
CT = 0.1 F
CL = 10 pF
TA = 25C
6
t Deassertion Time s
t Assertion Time ns
38
34
30
VCC = 5 V
CT = 0.1 F
CL = 10 pF
TA = 25C
RESET tr
26
5
4
RESET tf
3
2
RESET tr
22
RESET tf
1
0
18
0
8
4
6
RL Load Resistance k
10
4
6
8
RL Load Resistance k
Figure 2
Figure 3
DEASSERTION TIME
vs
LOAD CAPACITANCE
ASSERTION TIME
vs
LOAD CAPACITANCE
3.6
44
VCC = 5 V
CT = 0.1 F
RL = 4.7 k
TA = 25C
36
RESET tr
32
28
RESET tf
24
VCC = 5 V
CT = 0.1 F
RL = 4.7 k
TA = 25C
3.2
t Deassertion Time s
t Assertion Time ns
40
2.8
RESET tf
2.4
2
RESET tr
1.6
1.2
0.8
20
0
25
50
75
100 125 150
CL Load Capacitance pF
175
200
25
50
75
100
125
150
175
200
CL Load Capacitance pF
Figure 4
10
Figure 5
For proper operation, both RESET and RESET should be terminated with resistors of similar value. Failure to do so may cause unwanted
plateauing in either output waveform during switching.
APPLICATION INFORMATION
5V
12 V
8
TL7712A
3
CT
RESIN
RESET
System Reset
TL7705A
3
6
RESET
1
REF
CT
10 k
GND
10 k
VCC
SENSE
10 k
REF
CT
RESET
22 k
VCC
7
SENSE
2
5
RESET
RESIN
GND
0.1 F
10 k
CT
0.1 F
GND
8
7
2
C T(F) +
VCC
SENSE
RESET
RESIN
t d(s)
1.3
10 4
TL7712A
6
RESET
3
1
REF
CT
10 k
GND
4
CT
0.1 F
12 V
5V
8
VCC
7
SENSE
2
RESIN
RESET
C T(F) +
t d(s)
1.3
10 k
5
VCC
RESET
TMS7000
TL7705A
6
RESET
3
1
CT
REF
10 4
CT
GND
4
10 k
VSS
0.1 F
GND
APPLICATION INFORMATION
5V
A7805
INPUT
4.7 k
OUTPUT
VCC
7 SENSE
Input
System RESET
5
RESET
TL7705A
6
RESET
1
3
CT
REF
COMMON
CI
CO
25 k
GND
4
4.7 k
CT
Q1
2N3994
D
0.1 F
VCC
10 k
750
Q1
2N4036
8
SENSE Input
2.7 k
VCC
7
5
RESET
SENSE
System RESET
TL77xxA
2
3
RESET
RESIN
CT
REF
6
1
10 k
1 k
GND
CT
0.1 F
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
TL7702ACD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7702AC
TL7702ACDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7702AC
TL7702ACDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7702AC
TL7702ACDRE4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7702AC
TL7702ACDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7702AC
TL7702ACP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7702ACP
TL7702AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIDE4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIDRE4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7702AI
TL7702AIP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TL7702AIP
TL7702AIPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TL7702AIP
TL7702AMFKB
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
TL7702AMJG
OBSOLETE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
TL7702AMJGB
OBSOLETE
CDIP
JG
TBD
Call TI
Call TI
-55 to 125
TL7705ACD
ACTIVE
SOIC
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
75
Addendum-Page 1
7705AC
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
TL7705ACDE4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7705AC
TL7705ACDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7705AC
TL7705ACDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7705AC
TL7705ACDRE4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7705AC
TL7705ACDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7705AC
TL7705ACP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7705ACP
TL7705ACPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7705ACP
TL7705ACPSLE
OBSOLETE
SO
PS
TBD
Call TI
Call TI
0 to 70
TL7705ACPSR
ACTIVE
SO
PS
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
T7705A
TL7705AID
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIDE4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIDRE4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
7705AI
TL7705AIP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TL7705AIP
TL7705AIPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
-40 to 85
TL7705AIP
TL7709ACD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
Addendum-Page 2
7709AC
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
TL7709ACDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7709AC
TL7709ACDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7709AC
TL7709ACP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7709ACP
TL7709ACPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7709ACP
TL7709AID
OBSOLETE
SOIC
TBD
Call TI
Call TI
-40 to 85
TL7709AIP
OBSOLETE
PDIP
TBD
Call TI
Call TI
-40 to 85
TL7712ACD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACDE4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACDR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACDRE4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACDRG4
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7712AC
TL7712ACP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7712ACP
TL7712ACPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7712ACP
TBD
Call TI
Call TI
-40 to 85
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Call TI
Call TI
-40 to 85
TL7712AID
OBSOLETE
SOIC
TL7712AIDR
ACTIVE
SOIC
TL7712AIP
OBSOLETE
PDIP
TL7715ACD
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7715AC
TL7715ACDE4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7715AC
TL7715ACDG4
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
7715AC
Addendum-Page 3
7712AI
Samples
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
TL7715ACP
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7715ACP
TL7715ACPE4
ACTIVE
PDIP
50
Pb-Free
(RoHS)
CU NIPDAU
0 to 70
TL7715ACP
TL7715AID
OBSOLETE
SOIC
TBD
Call TI
Call TI
-40 to 85
TL7715AIP
OBSOLETE
PDIP
TBD
Call TI
Call TI
-40 to 85
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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Addendum-Page 4
Samples
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10-Jun-2014
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Addendum-Page 5
14-Jul-2012
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TL7702ACDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7702ACDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7702AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7705ACDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7705ACPSR
SO
PS
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
TL7705AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7709ACDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7712ACDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TL7712AIDR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
14-Jul-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TL7702ACDR
SOIC
2500
340.5
338.1
20.6
TL7702ACDR
SOIC
2500
367.0
367.0
35.0
TL7702AIDR
SOIC
2500
340.5
338.1
20.6
TL7705ACDR
SOIC
2500
340.5
338.1
20.6
TL7705ACPSR
SO
PS
2000
367.0
367.0
38.0
TL7705AIDR
SOIC
2500
340.5
338.1
20.6
TL7709ACDR
SOIC
2500
340.5
338.1
20.6
TL7712ACDR
SOIC
2500
340.5
338.1
20.6
TL7712AIDR
SOIC
2500
340.5
338.1
20.6
Pack Materials-Page 2
MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
0.280 (7,11)
0.245 (6,22)
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.023 (0,58)
0.015 (0,38)
015
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
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