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    sm8 113

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    Sadie Hnatow
    This document presents a problem involving calculating the temperature rise of coolant flowing past computer chips and through cooling channels in a substrate. It provides assumptions about material properties, fully developed flow, and heat transfer exclusively to the water. The analysis uses conservation of energy equations, thermal circuit analysis, and correlations for turbulent flow in a circular channel to calculate the coolant temperature rise, chip temperatures, and substrate surface temperature. It concludes that the coolant temperature rise is less than 0.5°C and all chip temperatures will be within 0.5°C of each other.

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    © All Rights Reserved

    sm8 113

    Uploaded by

    Sadie Hnatow
    66 views1 page
    This document presents a problem involving calculating the temperature rise of coolant flowing past computer chips and through cooling channels in a substrate. It provides assumptions about material properties, fully developed flow, and heat transfer exclusively to the water. The analysis uses conservation of energy equations, thermal circuit analysis, and correlations for turbulent flow in a circular channel to calculate the coolant temperature rise, chip temperatures, and substrate surface temperature. It concludes that the coolant temperature rise is less than 0.5°C and all chip temperatures will be within 0.5°C of each other.

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    sm8-113

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    This document presents a problem involving calculating the temperature rise of coolant flowing past computer chips and through cooling channels in a substrate. It provides assumptions about material properties, fully developed flow, and heat transfer exclusively to the water. The analysis uses conservation of energy equations, thermal circuit analysis, and correlations for turbulent flow in a circular channel to calculate the coolant temperature rise, chip temperatures, and substrate surface temperature. It concludes that the coolant temperature rise is less than 0.5°C and all chip temperatures will be within 0.5°C of each other.

    Copyright:

    © All Rights Reserved
    66 views1 page

    sm8 113

    Uploaded by

    Sadie Hnatow
    This document presents a problem involving calculating the temperature rise of coolant flowing past computer chips and through cooling channels in a substrate. It provides assumptions about material properties, fully developed flow, and heat transfer exclusively to the water. The analysis uses conservation of energy equations, thermal circuit analysis, and correlations for turbulent flow in a circular channel to calculate the coolant temperature rise, chip temperatures, and substrate surface temperature. It concludes that the coolant temperature rise is less than 0.5°C and all chip temperatures will be within 0.5°C of each other.

    Copyright:

    © All Rights Reserved
    of 1

    PROBLEM 8.

    113
    KNOWN: Arrangement of chips and cooling channels for a substrate. Contact and conduction resistances. Coolant velocity and inlet temperature. FIND: (a) Coolant temperature rise, (b) Chip and substrate temperatures. SCHEMATIC:

    ASSUMPTIONS: (1) Constant properties, (2) Fully-developed flow, (3) Incompressible liquid with negligible viscous dissipation, (4) Heat transfer exclusively to water, (5) Steady-state conditions. 3 PROPERTIES: Water (given): = 1000 kg/m , cp = 4180 J/kgK, k = 0.610 W/mK, Pr = 5.8, = -6 855 10 kg/sm. ANALYSIS: (a) For a single flow channel, the overall energy balance yields
    u m A c c p 1000 kg/m3 (1 m/s )( 0.005 m )2 4180 J/kg K From the thermal circuit, To Tm 2 q= R t,c = R / As = 0.5 104 m 2 K/W /10 ( 0.005 m ) = 0.2 K/W. t,c R t,c + R cond + R conv 2 With Dh = 4Ac/P = 4(0.005 m) /4(0.005 m) = 0.005 m,
    & m cp Tm,o Tm,i = q = NLP = 10 5 W = 0.48 C.
    o

    <

    Re D =

    u m D h 1000 kg/m (1 m/s ) 0.005 m = = 5848. 855 106 kg/s m


    3

    With turbulent flow, the Gnielinski correlation yields (f / 8)(Re D 1000) Pr k 0.61W / m K (0.0368 / 8)(5848 1000)5.8 = = 5406W / m 2 K h= D 1 + 12.7(f / 8)1/ 2 (Pr 2 / 3 1) 0.005m 1 + 12.7(0.0368 / 8)1/ 2 (5.82 / 3 1)

    where f = (0.79lnReD-1.64)-2 = 0.0368.


    R conv = ( hAs )
    1

    = 5406 W/m 2 K 4 0.005 m 0.2 m

    = 0.046 K/W.

    Approximating Tm as (Tm,i + Tm,o)/2 = 25.24C, Tc = Tm + q R t,c + R cond + R conv = 25.24o C + 50 W ( 0.2 + 0.12 + 0.046 ) K/W = 43.6oC. Similarly, from the thermal circuits,

    < <

    Ts = Tm + q R conv = 25.24o C + 50W 0.046K/W = 27.6oC

    COMMENTS: (1) Since the coolant temperature rise is less than 0.5C, all chip temperatures will be within 0.5C of each other. (2) The channel surface temperature may also be obtained from Eq. 8.41b, yielding the same result.

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