Power Electronics

The thermal characteristics of power transistors and their measurement are discussed. Topic areas addressed include general methods for measuring device temperature, control of the thermal environment, selection of a temperature-sensitive electrical parameter, measurement of temperature-sensitive electrical parameters, reasons for measuring temperature, and temperature measurement of integrated power devices. Procedures for detecting nonthermal switching transients, extrapolation of the measured temperature to the instant of switching, and for measuring the temperature of Darlington transistors are included.

Since electrical systems power losses dissipated as heat, they can be determined directly by measuring the heat generated. Calorimetry methods, there is several measurement methods and means (usually air or water) used to take the heat produced by the tested device. Ideally, the heat is completely absorbed by this means. The calorimeter of open type in which the device under test is placed directly on the circuit and that the refrigerant has to be air. The main disadvantages with the air as refrigerant are difficulties for heat capacitance, temperature increase and the volume flow, we also have that air is very sensitive to environmental changes, humidity, temperature and density, which in its entirety all leads to major errors in measurement each time. Some of its benefits are a simple construction and a response time fast. Improve the accuracy of the open type calorimeter, it performs a balancing test is basically a measure of reference with a certain amount of power that is supplied to the heaters in the test Chamber. With these plays the main measure. Therefore, measures losses can be recalculated by the relationship between the State of temperatures in both tests and the power known as reference. A very common and very important in all types of calorimeter error is the escape of heat through the walls of the calorimeter. The design proposed is based on the technique of direct calorimetry. Presents some design points for its construction methods and the results obtained. As well know the importance having the thermal behavior in an electronic circuit to determine the correct operation, it is of utmost importance to determine quantitatively the flow of heat generated during operation. To do this you need a system that allows us to know this type of data, complying with these limitations and features: A direct and real-time analysis. Designing a system that throw us real results of their thermal behavior during operation, thus will know how it behaves for some time in which it is running. Is suitable for different measurements of heat flow, taking into account their size and geometry of the Board. Reproducible, precise and repeatable measurements, to make reliable thrown results. Visualization of results in a manner that is clear and clean, for ease in understanding and management of results. Materials used are inexpensive and are available in our midst. Make a system that throw us reliable results to evaluate the thermal behavior of an electronic circuit, and thus be able to design, construct and verify, electronic circuits more efficient and better quality standards. Electronic Design Display of data on the PC, the LabView software was used. Design necessarily conformed to economic needs, the way to get a good team at a low cost. The utilities of this software is that it can monitor the temperature (aim), storing data, analysis and transmission of data.

This paper deals with the experimental characterization of the thermal properties of a power hybrid electronic circuit used for motorbike electrical power regulation. The main power devices were MOS transistors mounted in "naked chip" configuration. These devices suffered for an abnormal over-heating, causing the system failure, due to unsuitable heat dissipation capabilities of the assembling structure. The thermal characterization was carried out by means of the TRAIT (Thermal Resistance Analysis by Induced Transient) method based on the careful analysis of the device temperature cooling transients. This technique is able to measure the thermal resistance as a sum of several contributions due to the various parts of the system, so that it possible to localize within the assembling structure the sources of heat conduction impediments. Several measurements, carried out on samples mounted on allumina and insulated aluminium substrates, clearly indicated the thin Sn-Pb soldering layer, between the die and the top metal pads, as the main responsible for the thermal resistance high values. Unsuitable solder deposition and annealing methods probably caused the incomplete removal of the organic matrix and the formation of a mixed metallic-dielectric layer with bad thermal conductivity.

International Journal of Engineering Research in Mechanical and Civil Engineering (IJERMCE), 2016

Power amplifier is a device which amplifies the signal of communicating device. Thermal analysis was done on the key Componentsof the power amplifier in orderto dissipate maximum heat from the device. The heat input was given to keyComponents i.e. MR (TRANSISTOR) PA COMPONENT of the amplifier ,located on the PCB with a capacity around 195W .Remaining amount of heat distribution was on other components and analysis was done to measure the maximum temperature ofthe components through "SOLID WORKS SOFTWARE ". Three analyses were done in order to achieve optimum operating temperature of maximum heat dissipatingcomponents. First, each part of the power amplifier device was modeled and then assembled. After the assembly, thermal analysis was done on the device with 25 fins. Themaximumtemperature of heat dissipating component was around 225 Degree Celsius much higher than the operating junction temperature of the component which is 150 Degree Celsius;hence this design was not acceptable. During second analysis, in order to minimize the temperature of maximum heat dissipating device less than the operating junction temperature number offins were increased from 25 to 30 .Analysis done with this modification gave the resulting temperatures as165.417Degree Celsius. During third analysis, in which the number of the fins remained samebuta cutout given to the PCB and device mounted on inner surface of the housing. As a result the thermal resistance(K/ L) reduced which allowed more heat dissipation and resulted in minimizing the temperature under the given operating conditions.The temperature measured was around 126.7 Degree Celsius. Hence, design was acceptable. This helps the device to runefficiently for definite time period.

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006

with the interfaces, we have developed and fabricated a Thermal simulation is nowadays the basic thermal test chip showing a similar thermal behaviour than that of standard Silicon power devices (power dissipation on management design tool to predict temperature tp,btseilydsge oesl esr t distributions and power fluxes of complex assemblies. teperature. From tespower disipi mand cip

Energies

In the exploration of new energy sources and the search for a path to sustainable development the reliable operation of wind turbines is of great importance to the stability of power systems. To ensure the stable and reliable operation of the Insulated Gate Bipolar Transistor (IGBT) power module, in this work the influence of changes with aging of different electro-thermal parameters on the junction temperature and the case temperature was studied. Firstly, power thermal cycling tests were performed on the IGBT power module, and the I-V characteristic curve, switching loss and transient thermal impedance are recorded every 1000 power cycles, and then the electrical parameters (saturation voltage drop and switching loss) and the thermal parameters (junction-to-case thermal resistance) of the IGBT are obtained under different aging states. The obtained electro-thermal parameters are substituted into the established electro-thermal coupling model to obtain the junction temperature and ...

14th International Workshop on Thermal Investigation of Ics and Systems, 2008

in this paper is presented a new method for characterisation of temperature of AlGaN -GaN transistor. An ellipsometer is also explained for measure of refractive index and so propagation time constant.

Electronics

This paper presents a critical and detailed overview of experimental techniques for the extraction of the thermal resistance of bipolar transistors from simple DC current/voltage measurements. More specifically, this study focuses on techniques based on a thermometer, i.e., the relation between the base-emitter voltage and the junction temperature. The theory behind the techniques is described with a unified and comprehensible nomenclature. Advantages, underlying approximations, and limitations of the methods are illustrated. The accuracy is assessed by emulating the DC measurements with PSPICE electrothermal simulations of a transistor model, applying the techniques to the simulated currents/voltages, and comparing the extracted thermal resistance data with the values obtained from the target formulation embedded in the transistor model. An InGaP/GaAs HBT and an Si/SiGe HBT for high-frequency applications are considered as case-studies.

Energies, 2019

In the optimized design of power converters, loss analysis of power devices is important. Compared with estimation methods, measuring the power device loss directly in the circuit under test is more accurate. The loss measurement method can be divided into two categories: electrical measurement and calorimetric measurement. The accuracy of the electrical measurement result is restricted to the accuracy of the measurement equipment and parasitic parameters, especially for fast switching devices like SiC devices. The results obtained from calorimetric measurement are more convincing. Based on the measurement principle, calorimetric measurement can be divided into four categories: flow density measurement, temperature equivalent measurement, double jacket measurement, and temperature sensor measurement. This paper proposes an optimized temperature sensor measurement method, which has shorter time consumption, a simpler setup, and lower cost. The principles of the optimized method are d...