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2006, 2006 IEEE International Conference on IC Design and Technology
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4 pages
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In this paper, we propose a new structure of FPGA based on MRAM technology; we name it MFPGA (Magnetic FPGA). FPGA i based on SRAM technology has been developed in the last years, because of its high speed and near limitless number of reprogramming, however SRAM is volatile thereby the configuration information and the intermediate data will be lost when power is turned off. By using MTJs (Magnetic Tunnel Junction) as the storage elements of FPGA, 1 the position of MTJs we can realize the non-volatility of FPGA, and then we will not need the external memory. In our simulation, the start-up time of circuit
2007 International Conference on Field-Programmable Technology, 2007
As one of the most promising Spintronics applications, MRAM combines the advantages of high writing and reading speed, limitless endurance and non-volatility. The integration of MRAM in FPGA allows the logic circuit to rapidly configure the algorithm, the routing and logic functions, easily realize the dynamical reconfiguration and multicontext configuration. However, the conventional MRAM technology based on Field Induced Magnetic Switching (FIMS) writing approach consumes very high power and large circuit surface, and produces high disturbance between memory cells. These drawbacks prevent FIMS-MRAM's further development in memory and logic circuit. Thermally Assisted Switching (TAS) based MRAM is then evaluated to address these issues and some design techniques for FPGA logic circuits based on TAS-MRAM technology are presented. By using STMicroelectronics CMOS 90nm technology, some chip characteristic results have been calculated to demonstrate the expected performance of TAS-MRAM based FPGA logic circuits.
International Journal of Reconfigurable Computing, 2008
This paper describes the integration of field-induced magnetic switching (FIMS) and thermally assisted switching (TAS) magnetic random access memories in FPGA design. The nonvolatility of the latter is achieved through the use of magnetic tunneling junctions (MTJs) in the MRAM cell. A thermally assisted switching scheme helps to reduce power consumption during write operation in comparison to the writing scheme in the FIMS-MTJ device. Moreover, the nonvolatility of such a design based on either an FIMS or a TAS writing scheme should reduce both power consumption and configuration time required at each power up of the circuit in comparison to classical SRAM-based FPGAs. A real-time reconfigurable (RTR) micro-FPGA using FIMS-MRAM or TAS-MRAM allows dynamic reconfiguration mechanisms, while featuring simple design architecture.
International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006., 2006
In this paper, we propose a non-volatile flip-flop, which presents simultaneously low power dissipation and high speed. This flip-flop is based on MRAM (Magnetic RAM) technology on standard CMOS. In this non-volatile flip-flop design, we use Magnetic Tunnel Junctions (MTJ) as storage element. Contrary to the complex sense amplifier circuit in standard MRAM circuits, a simple one based on SRAM cell is used to couple with two MTJs per bit in Magnetic logic circuit. The flip-flop works exactly as a classical flip-flop but the information is stored simultaneously in the two MTJs, which makes this flip-flop non-volatile. As the writing frequency has a strong impact on the power consumption, the MTJ writing frequency is designed to be defined by the users depending on different usage. During the startup or reset phase, the flip-flop master stage is used as the MTJ sense amplifier and the flipflop is initialized to the previously stored state in about 200 ps. This figure has been demonstrated by electrical simulation on a 90 nm CMOS technology and with a complete and precise MTJ model.
Low power has emerged as a principal theme in today’s electronics industry. With ever increasing level of device integration and the growth in complexity of electronic circuits, increasing the demand of portable electronics devices and also depend ence on the battery operated devices motivating the VLSI designers to reduce the power dissipation, of the VLSI circuits. The reduction of power is the most often used measures of the efficiency of VLSI circuits. Low power circuits have long battery life. Power consumption due to memory accesses in a computing system often constitutes the dominant portion of the total power consumption. Measures have to be taken to reduce power consumption in memories. FPGA provide a short time to market and low design cost , which make them increasingly attractive. So a FPGA is designed with various blocks in it.The basic motive of this paper is to analyze the SRAM memory cell which will consume lesser power. FPGA consists of memory block, logical block, switch block, connec tion block. The memory block consists of memory cell. The memory cell used is 10T SRAM cell. The 10T SRAM cell is designed using c2mos logic which consumes less power. The designed 10T SRAM cell is used in the read circuit of the memory block. The logic bl ock and switch block is also designed. Power results of FPGA blocks have been obtained and power results of existing system and proposed system have been compared. Simulation results show significant improvements in reduction of power consumption. All the simulations have been carried out on 180nm technology at Tanner s - edit tool.
ACM Transactions on Reconfigurable Technology and Systems, 2009
As one of the most promising Spintronics applications, MRAM combines the advantages of high writing and reading speed, limitless endurance, and nonvolatility. The integration of MRAM in FPGAs allows the logic circuit to rapidly configure the algorithm, the routing and logic functions, and easily realize the Runtime Reconfiguration (RTR) and multicontext configuration. However, the conventional MRAM technology based on the Field Induced Magnetic Switching (FIMS) writing approach consumes very high power, large circuit surfaces, and produces high disturbance between memory cells. These drawbacks prevent FIMS-MRAM’s further development in memory and logic circuit. Thermally Assisted Switching (TAS)-based MRAM is then evaluated to address these issues. In this article, some design techniques, novel computing architecture, and logic components for FPGA logic circuits based on TAS-MRAM technology are presented. By using STMicroelectronics CMOS 90nm technology and a complete TAS-MTJ spice ...
2008 International Conference on Field Programmable Logic and Applications, 2008
This paper describes the integration of a thermally assisted switching magnetic random access memory (TAS-MRAM) in FPGA design. The non-volatility of the latter is achieved through the use of magnetic tunneling junctions (MTJ) in the MRAM cell. A thermally assisted switching scheme is used to write data in the MTJ device, which helps to reduce power consumption during write operation in comparison to the writing scheme in classical MTJ device. Plus, the non-volatility of such a design should reduce both power consumption and configuration time required at each power up of the circuit in comparison to classical SRAM based FPGAs. A real time reconfigurable (RTR) micro-FPGA using TAS-MRAM allows dynamic reconfiguration mechanisms, while featuring simple design architecture.
ACM Transactions on Embedded Computing Systems, 2009
As the minimum fabrication technology of CMOS transistor shrink down to 90nm or below, the high standby power has become one of the major critical issues for the SRAM-based FPGA circuit due to the increasing leakage currents in the configuration memory. The integration of MRAM in FPGA instead of SRAM is one of the most promising solutions to overcome this issue, because its nonvolatility and high write/read speed allow to power down completely the logic blocks in “idle” states in the FPGA circuit. MRAM-based FPGA promises as well as some advanced reconfiguration methods such as runtime reconfiguration and multicontext configuration. However, the conventional MRAM technology based on field-induced magnetic switching (FIMS) writing approach consumes very high power, large circuit surface and produces high disturbance between memory cells. These drawbacks prevent FIMS-MRAM's further development in memory and logic circuit. Spin transfer torque (STT)-based MRAM is then evaluated to ...
The VLSI design of volatile memories SRAM and DRAM has been carried out with 180nm and 45nm CMOS technology for FPGA architecture. The design of the schematics and layout has been carried out using Cadence CAD-Tools. The simulation results of the memory design showing timing analysis and attributes are examined. The power and delay time estimated for the two cases are compared. The results of the VLSI design of the SRAM and DRAM memories show significant reduction in power and delay time for the 45 nm technology compared to 180 nm technology
International Journal of Engineering Research and Technology (IJERT), 2015
https://www.ijert.org/design-of-sram-and-dram-volatile-memories-using-45nm-technology-for-fpga-architecture https://www.ijert.org/research/design-of-sram-and-dram-volatile-memories-using-45nm-technology-for-fpga-architecture-IJERTV4IS051279.pdf The VLSI design of volatile memories SRAM and DRAM has been carried out with 180nm and 45nm CMOS technology for FPGA architecture. The design of the schematics and layout has been carried out using Cadence CAD-Tools. The simulation results of the memory design showing timing analysis and attributes are examined. The power and delay time estimated for the two cases are compared. The results of the VLSI design of the SRAM and DRAM memories show significant reduction in power and delay time for the 45 nm technology compared to 180 nm technology
2012
As the technolody node shrinks down to 90nm and below, high standby power becomes one of the major critical issues for CMOS highspeed computing circuits (e.g. logic and cache memory) due to the high leakage currents. A number of non-volatile storage technologies, such as FRAM, MRAM, PCRAM and RRAM, are under investigation to bring the non-volatility into the logic circuits and then eliminate completely the standby power issue. Thanks to its infinite endurance, high switching/sensing speed and easy integration on top of CMOS process, MRAM is considered as the most promising one. Numerous logic circuits based on MRAM technology have been proposed and prototyped in the last years. In this paper, we present an overview and current status of these logic circuits and discuss their potential applications in the future from both physical and architectural points of view.
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