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2011, Microfluidics and Nanofluidics
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6 pages
1 file
SU-8 photoresist is commonly used in the field of microfabrication as structural material or for molding of microfluidic devices. One major limitation, however, is the difficulty to process partially freestanding SU-8 structures or monolithic closed cavities and channels on-chip. We propose here a simple method for the fabrication of suspended structures, in particular of monolithic SU-8 microchannels. The method is based on the processing of a SU-8 doublelayer. Appropriate modification of the optical properties of the upper layer allows for selective crosslinking in the layer sandwich. This process is suitable for versatile layouts comprising open and hollow SU-8 structures on the same chip.
Journal of Micromechanics and Microengineering, 2007
The application of cantilevered structures as check valves or flow sensors can provide new possibilities towards the integration of accurate sample preparation systems within a lab-on-a-chip. The cantilevers presented in this paper act as flaps enclosed within a channel in a direction perpendicular to the flow. This orientation allows simpler designs and easier integration of the valve or flow sensor within the microfluidic network. The cantilevers have been embedded in a microfluidic channel by low temperature full wafer adhesive bonding. In this way, electrodes, microchannels, microchambers and cantilevers can be fabricated and sealed at the same time at a wafer level. To the author's knowledge, this is the first example of flap cantilevers embedded in a polymeric microfluidic channel. The mobility of the structure and the leakage are dependent on the size of the sealing gaps between the cantilever and the enclosing channel. In this paper, we present three different fabrication methods for a range of bottom sealing gaps from the micro to the nanometer size. The top sealing gap is determined by the adhesive bonding and is 11 µm wide. Furthermore, various geometrical features have been introduced in order to optimize a valve or flow sensor. The characterization of the structures comprises measurements of the sensitivity of each cantilever design by obtaining their relative spring constant, measurements of their elastic and plastic working regimes and Young's modulus of the SU-8.
Sensors and Actuators A: Physical, 2003
This paper proposes a novel method to fabricate multi-layers, embedded micro¯uidic structures by simply employing dosage-controlled UV exposure on thick SU-8 resist and anti-re¯ection coating on the bottom surface to prevent the re¯ection UV-light from inducing exposure. Experimental results show the top wall thickness of the embedded micro-channels can be well controlled in a resolution of 2 mm for the UV dosage from 120 to 190 mJ/cm 2. Stacked micro-channels have also been successfully realized and showed no interference on the bottom structures when the top structures are being exposed. Numerical simulation of the top wall thickness by UV exposure dosage control has also been conducted, and the comparison between the calculated and experimental results showed similarity in trend. This simple and inexpensive method can be applied to fabricate multi-layers of complex¯uidic systems for the applications of mTAS (MicroTotal Analysis System), inkjet printhead, capillary electrophoresis, and micro PCR (Polymerase Chain Reaction).
Journal of Micromechanics and Microengineering, 2005
This paper reports on a novel multilayer SU-8 lift-off technology which allows for low cost rapid prototyping of microfluidic devices. The process presented is based on a multi-layer structure of SU-8 which can be released from the substrate after processing and enables the creation of through holes. The lift-off is accomplished during the development by making use of the volume shrinkage of the SU-8 during postbaking and by modification of the adhesion to the substrate. To demonstrate the technology, prototypes of a multichannel microdispenser according to the Dispensing Well Plate (DWP TM ) principle (Koltay et al 2004 Sensors Actuators A 116 472, 483) were fabricated. The samples contain 24 parallel dispensing units with 100 µm through holes and a dosage volume of 60 nl. For the first time all functional structures such as reservoirs, channels and through holes (nozzles) of the DWP TM were realized exclusively in the photodefinable epoxy SU-8. To assess the quality of the SU-8 process the geometry of the presented prototypes is characterized by profiler measurements and scanning electron microscopy. Furthermore, the dispensing performance is studied experimentally by gravimetrical measurements. A reproducibility of the dosage volume of 1% and a homogeneity within individual droplet arrays of 3.6% were achieved.
Sensors and Actuators A: Physical, 2005
Free-standing SU-8 chips with enclosed microchannels and high density of fluidic inlets have been made in a three-layer process which involves SU-8 to SU-8 adhesive bonding and sacrificial etching. With this process we can fabricate microchannels with depths ranging from 10 to 500 m, channel widths from 10 to 2000 m and lengths up to 6 cm. The process is optimized with respect to SU-8 glass transition temperature. Thermal stresses and thickness non-uniformities of SU-8 are compensated by novel mask design features, the auxiliary moats. With these process innovations filling of microchannels can be prevented, non-bonded area is minimized and bonding yields are 90% for large-area microfluidic chips. We have released up to 100 mm in diameter sized microfluidic chips completely from carrier wafers. These free-standing SU-8 chips are mechanically strong and show consistent wetting and capillary filling with aqueous fluids. Fluidic inlets were made in SU-8 chips by adding one lithography step, eliminating through-wafer etching or drilling. In our process the inlet size and density is limited by lithography only.
Journal of Micromechanics and Microengineering, 2002
In this paper we describe a new process for fabricating ultra-thick microfluidic devices utilizing SU-8 50 negative photoresist (PR) by standard UV lithography. Instead of using a conventional spin coater, a simple 'constant-volume-injection' method is used to create a thick SU-8 PR film up to 1.5 mm with a single coating. The SU-8 PR is self-planarized during the modified soft-baking process and forms a highly-uniform surface without any edge bead effect, which commonly occurs while using a spin coater. Photomasks can be in close contact with the PR and a better lithographic image can be generated. Experimental data show that the average thickness is 494.32 ± 17.13 µm for a 500 µm thick film (n = 7) and the uniformity is less than 3.1% over a 10 × 10 cm 2 area. In this study, the temperatures for the soft-baking process and post-exposure baking are 120 • C and 60 • C, respectively. These proved to be capable of reducing the processing time and of obtaining a better pattern definition of the SU-8 structures. We also report on an innovative photomask design for fabricating ultra-deep trenches, which prevents the structures from cracking and distorting during developing and hard-baking processes. In this paper, two microfluidic structures have been demonstrated using the developed novel methods, including a micronozzle for thruster applications and a microfluidic device with micropost arrays for bioanalytical applications.
Journal of Micromechanics and Microengineering, 2008
We present a versatile fabrication process for the precise fabrication of embedded three-dimensional microfluidic structures in SU-8 photoresist. The full-wafer bond process based on a polyester (PET) handling layer enhances the previous low-temperature bonding technology. We achieved an extremely high bond strength of 45 MPa while requiring only small anchoring structures. Small channel structures with an aspect ratio >2 as well as wide membranes with an aspect ratio <0.02 were successfully bonded to realize precisely defined channel structures. Furthermore, the developed process features high yields (>80%) and enables the integration of microelectronics. The flexibility of the fabrication process is presented in two contrary applications. A completely freestanding and transparent SU-8 foil with a thickness of 225 µm featuring embedded 3D microchannels was fabricated. Also, high quality ink-jet dispensers were successfully fabricated whereas the dispenser quality mainly depends on the channel quality.
Journal of Micromechanics and Microengineering, 2004
A simple method is presented to reduce the contact angle of the photo-resist SU-8. A low contact angle is valuable in micro total analysis systems for the fabrication of micro channels where the capillary pressure is linearly related to the cosine of the contact angle, θ . If the surface of the channel is hydrophilic, the capillary pressure can be used as the only means to direct the liquid through the channels and the need for external pumps can be avoided. This is very useful, especially in the fabrication of devices for 'lab-on-a-chip' where it is important to keep the design as simple as possible. A commonly used technique for releasing structures fabricated on Si wafers is to use a sacrificial Cr layer. It is shown that the contact angle of SU-8 decreases by 40 • after etching this layer. A further reduction in contact angle is desirable and can be achieved by treating the sample with ethanolamine at 50 • C for only 10 min. The resulting contact angle is 23 • ± 7 • . Using a wet chemical treatment, a selective change in contact angle between different areas of a micro channel system can be achieved, without the need to involve different materials in the fabrication process.
Lab on a Chip, 2005
Journal of Micromechanics and Microengineering, 2006
The fabrication of three-dimensional (3D) microfluidic networks entirely made of SU-8 with integrated electrodes is reported. The described technology allows the fabrication of uncrosslinked SU-8 dry film on a polyester (PET) sheet and its subsequent lamination to form closed microstructures. Unlike other reported methods, transferred layers are patterned following the bonding step allowing a more accurate and simple alignment between levels than techniques using already patterned layers. Dry release of the complete polymer microstructure was demonstrated. Flexible microfluidic chips were obtained. This technique uses simple tools and no wafer bonder is used but lamination techniques which are more collective processes. Limitations in the method for layers thicker than 50 µm have been observed and are discussed. Hydraulic flow experiments have been performed to study the deformation of the cover layer which could influence adjacent flow in a three-dimensional configuration. Important deformations have been observed for layers 10 µm thick and an average pressure greater than 100 kPa. No deformations have been noted for layers with thicknesses greater than 35 µm and for average pressures up to 200 kPa. No failures occurred within the range of the experimental set-up, i.e. up to 300 kPa.
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