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1994, Le Journal de Physique IV
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5 pages
1 file
Si2p core level photoemission as well as X-ray polarization dependent surface extended absorption fine structure (SEXAFS) have been used to characterize the interface of a twodimensional erbium silicide with Si(l1 l). This silicide, which consists of a hexagonal erbium monolayer located underneath a buckled Si top layer, was grown by deposition of one monolayer of erbium on clean Si(1 l l ) and annealing in the 400-6W°C temperature range. Photoemission experiments reveal a Schottky barrier height 6 as low as 0.13 rt 0.05 eV while for thicker erbium silicide layers Idg is found to be = 0.3 eV. SEXAFS measured at the Er L3 edge shows the location of erbium atoms in the eclipsed threefold hollow sites of the Si substrate.The average distance of erbium to the silicon of the substrate is found to be 3.10 * 0.04 A, whereas the distance of erbium atoms to their three first neighbors in the Si top layer is found to be 2.94 k 0.04 A.
Surface Science Letters, 1991
The present study is mainly motivated by the recent interest in rare-earth/Si interfaces for technological applications. Furthermore there is by now a rather poor understanding of their electronic structure. We present the first spectroscopic investigation of epitaxial erbium silicide using angle-resolved uitraviokt ~hot~~~ion spectroscopy (ARUPS) a.nd low-energy electron diffraction (LEED). Thermal treatment at 70a°C of a 15 monolayers Er deposit results in epitaxial f?~Si,.~ formation characterized by sharp 6 x fiR30° LEED pattern. The relevant ARUPS spectra exhibit essentially emission of Erlf multiplet states in the 4-11 eV binding energy window and structures at lower binding energies assigned to hybridized Er 5d and Si 3sp states. Finatiy, we have shown that in contrast with pure Er, there is apparentfy no surface-related 4f component for rn~~~~st~ine ErSi,,,.
Applied Surface Science, 1993
Er deposits on Si(lI1) upon annealing is studied hy low-energy electron ditfraction (I.ELJD).
Surface Science, 1995
High-resolution angle-resolved ultraviolet photoemission measurements of ultra-thin (12 ,~) epitaxial V'3 X v~R30 ° ErSil. 7 films on Si(lll) are presented. Band dispersions of typical surface states or resonances are followed along the high-symmetry FK and KM lines of the (1 X 1) surface Brillouin zone (SBZ). Extensive studies of two-dimensional p(1 X 1) Er silicide allowed us to fold back its band structure into the reduced vC3 X x/3R30 ° SBZ. A comparison of these data to the surface bands recorded on the ultra-thin lacunary ErSil. 7 indicates that this "bulk" silicide is terminated with a buckled Si layer quite similar to the surface silicide termination. Of particular interest are the conspicuous effects of folding back on relative intensities of the spectral features recorded with He I photon energy at equivalent high-symmetry points of the ~ X v~R30 ° SBZ.
Surface Science, 2002
The surface structures of thin erbium silicide layers formed on Si(1 0 0) substrate by solid phase epitaxy are studied by using the in situ high energy electron diffraction, low energy electron diffraction, Auger electron spectroscopy, scanning tunneling microscopy, and ex situ grazing X-ray diffraction. Nanowires and nanoislands of Er silicide coexist on the Si substrate surface and a c(2 Â 2) reconstruction is observed on the top of these nanostructures. The crystalline structure of the Er silicide nanostructure is found to be tetragonal ErSi 2 . A Si-adatom model for the c(2 Â 2) reconstruction is proposed. The total energy calculation based on the discrete-variational self-consistent multipolar cluster method identifies that the hollow site Si adatom model might be the most energetically favorable one. Ó
Thin Solid Films, 1990
The epitaxial growth of ErSi2 is described. In this study, erbium metal is evaporated onto Si(111) and annealed to form erbium silicide, where the pressure during all procedures is maintained below 5 x 10 -1° Tort. The interdiffusion of erbium with silicon occurs as low as 300 °C, as determined by in situ Auger electron spectroscopy. Low energy electron diffraction shows the xf3 x x/3 pattern of the hexagonal silicide, with evidence of surface faceting. Both X-ray and Rutherford backscattering analyses indicate single-crystal growth with a channeling minimum yield of 2~o-3~o for silicide films of 200-400-/~ thickness annealed to 800-900 °C. The surface morphology of these films is smooth but pitted with an average pinhole size of less than 1 lam. These results support growth models based on nucleation reaction mechanisms and not those based on interfacial contamination effects. Electrical measurements show metallic conduction with a room temperature resistivity of 35 ~tf~ cm. 0040-6090/90/$3.50
Journal of The Electrochemical Society, 2009
Erbium silicide ͑ErSi 2−x ͒ formation was investigated on Si 1−x C x epitaxial layers grown on Si substrates. Substitutional carbon incorporation in the epitaxial layers was in the range of 0.6-1.6%. The silicide films were formed by rapid thermal annealing of sputter-deposited erbium layers in the temperature range of 350-700°C. The sheet resistance of the silicide films formed on Si 1−x C x epitaxial layers was found to be equal to or less than the sheet resistance of the films formed on Si epitaxial layers. At 600°C, an average resistivity of 114 Ϯ 4 ⍀ cm was obtained. The silicide grains were found to be epitaxially aligned to the substrate along the ͑100͒ orientation, regardless of the carbon concentration in the underlying epitaxial layer. Compositional analysis of the films indicated carbon accumulation at the ErSi 2−x /Si 1−x C x interface with no carbon incorporation in the silicide. The films formed on Si 1−x C x epitaxial layers exhibited a smooth interface/surface morphology free of pinholes, contrary to the silicides formed on Si. The root-mean-square surface roughness was found to be less than 1.5 nm, which was found to be the case with both substitutional and interstitial incorporation of carbon atoms in the epitaxial layer.
In this paper, we present results of transmission electron microscopy studies on erbium silicide structures fabricated under various thermal conditions. A titanium cap has been used as a protective layer against oxidation during rapid thermal annealing of an erbium layer in a temperature range of 300-700 • C. Both layers (200 nm Ti and 25 nm Er) were deposited by electron-beam sputtering. The investigations have shown that the transformation of the 25-nm-thick erbium into erbium silicide is completed after annealing at 500 • C. At higher temperatures, the formation of a titanium silicide layer above erbium silicide is observed. The lowest Schottky barrier has been measured in the sample annealed at 700 • C.
Applied Physics Letters, 2006
Pyramidal structural defects, 5–8μm wide, have been discovered in thin films of epitaxial ErSi2−x formed by annealing thin Er films on Si(001) substrates at temperatures of 500–800°C. The formation of these defects is not due to oxidation. We propose that they form as a result of the separation of the silicide film from the substrate and its buckling in order to relieve the compressive, biaxial epitaxial stresses. Silicon can then diffuse through the silicide or along the interface to fully or partially fill the void between the buckled erbium disilicide film and the substrate.
Journal of …, 2006
Very thin erbium silicide layers have been used as source and drain contacts to n-type Si in low Schottky barrier MOSFETs on silicon-on-insulator substrates. Erbium silicide is formed by a solid-state reaction between the metal and silicon during annealing. The influence of annealing temperature (450 °C, 525 °C and 600 °C) on the formation of an erbium silicide layer in the Pt/Er/Si/SiO2/Si structure was analysed by means of cross-sectional transmission electron microscopy. The Si grains/interlayer formed at the interface and the presence of Si grains within the Er-related layer constitute proof that Si reacts with Er in the presence of a Pt top layer in the temperature range 450–600 °C. The process of silicide formation in the Pt/Er/Si structure differs from that in the Er/Si structure. At 600 °C, the Pt top layer vanishes and a (Pt–Er)Six system is formed.
Thin Solid Films, 1990
Molecular beam epitaxy (MBE) growth of erbium silicide (ERS) thin films on (111) silicon surface and their characterization are discussed. We demonstrated that continuous and monocrystalline films can be prepared by co-deposition of both erbium and silicon in a 1:2 ratio, on either high or room temperature (RT) silicon substrates, followed by solid phase epitaxy (SPE). Using X-ray diffraction (XRD), transmission electron microscopy (TEM), transmitted electron diffraction (TED) and Rutherford backscattering spectrometry (RBS) we identified the silicide as ErSi2_ ~, i.e. erbium disilicide with a large concentration of vacancies. The films were shown to be monocrystalline with possible vacancy ordering. The Si/ErSiz/Si structures were subsequently prepared and shown to have a minimum RBS channelling yield Zmin value of about 5% for erbium in ErSi 2_x and of 7% for the overgrown silicon. The resistivity ofepitaxial ErSi 2-x films was found to be about 35 p.~ cm at RT. The Hall coefficient was found to change sign (at about 150 K) which was explained in terms of a two-band conduction model. At about 4.5 K both resistivity and Hall coefficient exhibit anomalies associated with magnetic ordering of erbium atoms demonstrated by divergence of the magnetic susceptibility. The Schottky diodes made on p-silicon show excellent rectifying properties, with a barrier height of 0.74___ 0.01 eV. The diodes on n-silicon were ohmic at RT and rectifying at low temperatures with a barrier height of 0.29 __+ 0.01 eV. Possible electronic applications of ERS are also discussed.
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