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    Soldering & Soldering Techniques: Electronic Workshop

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    JAy16 KATAKIYAindia
    This document provides information on soldering techniques and equipment for electronic work. It discusses the soldering process, which involves melting and flowing a filler metal into joints to make a permanent connection between electronic components. It describes common soldering equipment like soldering irons, solder, flux, and heat sinks. It outlines the basic soldering procedure of preparing components, applying solder, and finishing. It also provides tips, safety guidelines, and techniques for inspecting and desoldering joints.

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    Soldering & Soldering Techniques: Electronic Workshop

    Uploaded by

    JAy16 KATAKIYAindia
    46 views21 pages
    This document provides information on soldering techniques and equipment for electronic work. It discusses the soldering process, which involves melting and flowing a filler metal into joints to make a permanent connection between electronic components. It describes common soldering equipment like soldering irons, solder, flux, and heat sinks. It outlines the basic soldering procedure of preparing components, applying solder, and finishing. It also provides tips, safety guidelines, and techniques for inspecting and desoldering joints.

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    This document provides information on soldering techniques and equipment for electronic work. It discusses the soldering process, which involves melting and flowing a filler metal into joints to make a permanent connection between electronic components. It describes common soldering equipment like soldering irons, solder, flux, and heat sinks. It outlines the basic soldering procedure of preparing components, applying solder, and finishing. It also provides tips, safety guidelines, and techniques for inspecting and desoldering joints.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    46 views21 pages

    Soldering & Soldering Techniques: Electronic Workshop

    Uploaded by

    JAy16 KATAKIYAindia
    This document provides information on soldering techniques and equipment for electronic work. It discusses the soldering process, which involves melting and flowing a filler metal into joints to make a permanent connection between electronic components. It describes common soldering equipment like soldering irons, solder, flux, and heat sinks. It outlines the basic soldering procedure of preparing components, applying solder, and finishing. It also provides tips, safety guidelines, and techniques for inspecting and desoldering joints.

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    © All Rights Reserved
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    You are on page 1of 21

    SOLDERING & SOLDERING

    TECHNIQUES

    ELECTRONIC WORKSHOP
    (CC142)

    B.V.M.ENGINEERING COLLEGE
    V.V.NAGAR

    PREPARED BY : KATAKIYA JAYKUMAR(16IT445)


    * Process for join two or metal items by melting
    & then flowing a filler metal into joint.
    * Melting point of filler metal is low respectively.
    * Used for permanent connection between
    electronic components.

    *SOLDERING
    SOLDERING IRON

    .Heats up the connection to be soldered

    .25-40 watt needed for electronic use

    .Various types : conical & chisel type

    * EQUIPMENTS
     ROSIN CORE SOLDER
     filler metal to join.
     responsible for connection.

     alloy of tin and lead in ratio of 60/40.

     ROSIN coated : keeps oxides away from joint.

    * EQUIPMENTS
     SOLDERING STAND
    Holds the solder iron
    “Always return solder iron to the stand
    when not in use”
    don’t put iron on bench for a moment.

    * EQUIPMENTS
     SPONGE SOLDER BRAID
    Used for desoldering.
     To clean solder iron
    tip.
    It is braided copper
    To remove burnt flux. tape.
     To remove excess Absorbs solder when
    solder.
    heated.

    * EQUIPMENTS
    STEEL WOOL HEAT SINK
    Clean component Protects heat
    leads. sensitive components
    Removes moistures. Absorbs heat ,stop
    heat flow to
    component.
    Ex. crocodile pin.

    EQUIPMENTS
    *FLUX
    IT IS A MATERIAL USED TO REMOVE
    OXIDES FROM CONTACT OF PARTS TO
    BE SOLDERED.
    FLUX IS MADE UP OF LIKE
    HYDROCHLORIC ACID , ZINC
    CHLORIDE OR ROSIN.

    * EQUIPMENTS
    * PROCEDURE--
    PREPARATION
    *Clean components by emery cloth or steel
    wool.
    *Remove dirt, oil, grease, oxidation-effect.
    *Causes dry.
     solder tend to bead up
    Components becomes bright and shiny.
    *PLUG-IN
    *Clean it by wet or dampen sponge.
    *Apply solder to iron tip.(TINNING)
    *Again wipe the tip.
    *Giving silver shiny tip.
    *Getting clean & deoxidised tip.
    *PUT IRON TO THE STAND.

    * PROCEDURE--PREPARE
    SOLDERING IRON
    *Place the component on prototype board.
    Bend leads at 90 degree to fit it.
    *Insert leads into proper holes of non
    copper side.
    (before execute soldering prepare circuit
    diagram on board)
    *Bend leads little outwards to holding.
    *Attach heat sink if required.

    * PROCEDURE-
    -SOLDERING
    *Clean solder iron by dampen sponge again.

    *Apply tiny solder to tip(tinning solder iron)

    *With hot iron tip ,touch the pad and lead


    to be joined.(temperature )

    * Procedure--
    soldering
    APPLY SOLDER(HEART
    OF ENTIRE PROCESS)
    take required solder on tip of hot iron , solder
    will melt.
    Take iron to the opposite side from component.
    (copper side).
    Apply it on the point , letting solder flow.
    Molten solder will feel up the joint because of
    capillary action.
    Hold the joint till cooling (<=3 sec)
    Solder is done. within 5 seconds.

    * Procedure--
    soldering
    Cut the excess length of leads.
    Clean residual flux by alcohol.
    Prevents oxidation
    Prevents unwanted short circuiting.

    * Procedure--
    finishing
    Process to coating solder on wire.
    Attach heat sink below insulation.
    Heat wire end , Touch solder to
    wire from opposite side.
    Solder would wick up wire.
    don’t heat too much.

    * Technique—
    wire tinning
    oSoldering iron heats up to 400 degree celcious.
    oCause burn and fire , be care full.
    oUnplug solder iron when not in use.
    oGreat care to avoid touching tip with power line(cause burn ,
    shock , fire).
    oReturn solder iron to stand , not put it on bench.
    oWork in vantilated area.
     Smoke by flux is irritating.
     Breathing problem.
    oSolder with lead is poisonous , wash hands after soldering.

    *SAFETY
    *Pre-plan and collect all parts.
    *Prepare circuit design.
    *Some components placed correct way due
    to function.(LED).
    *SOLDER PARTS IN THIS SEQUENCE:
     Resistor
     Small then large capacitors
     Diode
     LED
     Transistor
     Wire
     IC ALWAYS AT LAST : orientation is important.

    * TIPS
    * inspection
     Quality of joint should be checked.
    BAD JOINT:
    • Balled up or spiked.
    • Dull coloured.
    • Crystallised or grainy.
    • Convex solder surface.
    REASONS:
     dirty leads
     dirty pads
     joint moved during cooling.
     Over-heating.
    GOOD JOINT:
     Always looks volcano or cone shaped.
     Looks shiny and bright.
     To do good joint , require practice.

    * inspection
    Unnecessarily bridges made sometimes.
    They should be rapaired.
    Excess solder unnecessarily connects two
    leads , holes .(it is unwanted).
    PROCEED TO REMOVE COMPONENTS(REMOVE
    SOLDER)
     Place solder braid on that joint.
     Heat braid from opposite side of joint.
     Solder will absorbed by braid.
     Remove braid.

    * DESOLDERING
    THANK YOU
    PRESENTED BY : .
    KATAKIYA JAYKUMAR (16IT445)
    RAHI PATEL (16IT471)
    MEHUL RATHOD (16IT442)

    B.TECH(F.Y) IT :2016-17

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