Vlsi Design: CMOS Transistor Theory
Vlsi Design: CMOS Transistor Theory
Vlsi Design: CMOS Transistor Theory
Design
EE3:447
CMOS Transistor
VLSI Design Theory 2
Introduction
So far, we have treated transistors as ideal switches
An ON transistor passes a finite amount of current
Depends on terminal voltages
Derive current-voltage (I-V) relationships
Transistor gate, source, drain all have capacitance
I = C (DV/Dt) -> Dt = (C/I) DV
Capacitance and current determine speed
Also explore what a “degraded level” really means
EE3:447
CMOS Transistor
VLSI Design Theory 3
MOS Capacitor
Gate and body form MOS capacitor
Operating modes Vg < 0
polysilicon gate
silicon dioxide insulator
Accumulation +
- p-type body
Depletion (a)
Inversion
0 < V g < Vt
depletion region
+
-
(b)
V g > Vt
Example with an NMOS +
inversion region
depletion region
capacitor -
(c)
EE3:447
CMOS Transistor
VLSI Design Theory 4
Terminal Voltages
Vg
Mode of operation depends on Vg, Vd, Vs
+ +
Vgs = Vg – Vs Vgs Vgd
- -
Vgd = Vg – Vd
Vs Vd
Vds = Vd – Vs = Vgs - Vgd -
Vds +
EE3:447
CMOS Transistor
VLSI Design Theory 5
nMOS Cutoff
Let us assume Vs = Vb
No channel, if Vgs = 0
Ids = 0 Vgs = 0
g
Vgd
+ +
- -
s d
n+ n+
p-type body
b
EE3:447
CMOS Transistor
VLSI Design Theory 6
NMOS Linear
Channel forms if Vgs > Vt
Vgs > Vt
No Currernt if Vds = 0 + g +
Vgd = Vgs
- -
s d
n+ n+ Vds = 0
p-type body
b
Linear Region:
Vgs > Vt
Vgs > Vgd > Vt
If Vds > 0, Current flows + g +
- -
from d to s ( e- from s to d) s d
Ids
EE3:447
CMOS Transistor
VLSI Design Theory 7
NMOS Saturation
Channel pinches off if Vds > Vgs – Vt.
Ids “independent” of Vds, i.e., current saturates
Similar to current source
Vgs > Vt
g Vgd < Vt
+ +
- -
s d Ids
n+ n+
Vds > Vgs-Vt
p-type body
b
EE3:447
CMOS Transistor
VLSI Design Theory 8
I-V Characteristics
In Linear region, Ids depends on
How much charge is in the channel
How fast is the charge moving
EE3:447
CMOS Transistor
VLSI Design Theory 9
Channel Charge
MOS structure looks like parallel plate capacitor while
operating in inversion
Gate – oxide (dielectric) – channel
Qchannel =
gate
Vg
polysilicon + +
gate source Vgs Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, ox = 3.9) p-type body
p-type body
EE3:447
CMOS Transistor
VLSI Design Theory 10
Channel Charge
MOS structure looks like parallel plate capacitor while
operating in inversion
Gate – oxide – channel
Qchannel = CV
C=
gate
Vg
polysilicon + +
gate source Vgs Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, ox = 3.9) p-type body
p-type body
EE3:447
CMOS Transistor
VLSI Design Theory 11
Channel Charge
MOS structure looks like parallel plate capacitor while
operating in inversion
Gate – oxide – channel
Qchannel = CV
C = Cg = oxWL/tox = CoxWL Cox = ox / tox
V = Vgc – Vt = (Vgs – Vds/2) – Vt
gate
Vg
polysilicon + +
gate source Vgs Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, ox = 3.9) p-type body
p-type body
EE3:447
CMOS Transistor
VLSI Design Theory 12
Carrier velocity
Charge is carried by e-
Carrier velocity v proportional to lateral E-field
between source and drain
v = mE m called mobility
E = Vds/L
Time for carrier to cross channel:
t=L/v
EE3:447
CMOS Transistor
VLSI Design Theory 13
NMOS Linear I-V
Now we know
How much charge Qchannel is in the channel
How much time t each carrier takes to cross
Qchannel
I ds
t
mCox
W V V Vds V
gs ds
2
t
L
W
= mCox
Vgs Vt ds Vds
V
L
2
EE3:447
CMOS Transistor
VLSI Design Theory 14
NMOS Saturation I-V
If Vgd < Vt, channel pinches off near drain
When Vds > Vdsat = Vgs – Vt
Now drain voltage no longer increases
current
I ds Vgs Vt
Vdsat V
dsat
2
Vt
2
V gs
2
EE3:447
CMOS Transistor
VLSI Design Theory 15
NMOS I-V Summary
Shockley 1st order transistor models (valid for
Large channel devices only)
0 Vgs Vt cutoff
V V V V
I ds Vgs Vt ds ds linear
2
ds dsat
Vgs Vt
2
Vds Vdsat saturation
2
EE3:447
CMOS Transistor
VLSI Design Theory 16
Example
For a 0.6 mm process (MOSIS site)
From AMI Semiconductor
2.5
tox = 100 Å Vgs = 5
m = 350 cm2/V*s
2
Ids (mA)
Plot Ids vs. Vds 1
Vgs = 3
Vgs = 0, 1, 2, 3, 4, 5
0.5
Use W/L = 4/2 l Vgs = 2
Vgs = 1
0
0 1 2 3 4 5
Vds
W 3.9 8.85 1014 W W
mCox 350 8 120 m A /V 2
L 100 10 L L
EE3:447
CMOS Transistor
VLSI Design Theory 17
PMOS I-V
EE3:447
CMOS Transistor
VLSI Design Theory 18
Capacitance
Any two conductors separated by an insulator have
capacitance
Gate to channel capacitor is very important
Creates channel charge necessary for operation
Source and drain have capacitance to body
Across reverse-biased diodes
Called diffusion capacitance because it is
associated with source/drain diffusion
EE3:447
CMOS Transistor
VLSI Design Theory 19
Gate Capacitance
Approximate channel as connected to source
Cgs = oxWL/tox = CoxWL = CpermicronW
Cpermicron is typically about 2 fF/mm
polysilicon
gate
W
tox
L SiO2 gate oxide
n+ n+ (good insulator, ox = 3.90)
p-type body
EE3:447
CMOS Transistor
VLSI Design Theory 20
Diffusion Capacitance
Csb, Cdb
Undesirable, called parasitic capacitance
Capacitance depends on area and perimeter
Use small diffusion nodes
Comparable to Cg
for contacted diff
½ Cg for uncontacted
Varies with process
EE3:447
CMOS Transistor
VLSI Design Theory 21
Pass Transistors
We have assumed source is grounded
What if source > 0? VDD
e.g. pass transistor passing VDD VDD
EE3:447
CMOS Transistor
VLSI Design Theory 22
NMOS Pass Transistors
We have assumed source is grounded
What if source > 0? VDD
e.g. pass transistor passing VDD
VDD
Let Vg = VDD
Now if Vs > VDD-Vt, Vgs < Vt
Vs
Hence transistor would turn itself off
NMOS pass transistors pull-up no higher than VDD-Vtn
Called a degraded “1”
Approach degraded value slowly (low Ids)
PMOS pass transistors pull-down no lower than Vtp
Called a degraded “0”
EE3:447
CMOS Transistor
VLSI Design Theory 23
Pass Transistor Ckts
VDD
VDD
VSS
EE3:447
CMOS Transistor
VLSI Design Theory 24
Pass Transistor Ckts
VDD
Vs = |Vtp| VDD-Vtn
VDD VDD-2Vtn
VSS
EE3:447
CMOS Transistor
VLSI Design Theory 25
Effective Resistance
Shockley models have limited value
Not accurate enough for modern transistors
Too complicated for much hand analysis
Simplification: treat transistor as resistor
Replace Ids(Vds, Vgs) with effective resistance R
Ids = Vds/R
EE3:447
CMOS Transistor
VLSI Design Theory 26
RC Delay Model
Use equivalent circuits for MOS transistors
Ideal switch + capacitance and ON resistance
Unit nMOS has resistance R, capacitance C
Unit pMOS has resistance 2R, capacitance C
Capacitance proportional to width
Resistance inversely proportional to width
d
s
kC
kC
R/k
d 2R/k
d
g k g k kC
g k g
s kC kC
kC s
s
d
EE3:447
CMOS Transistor
VLSI Design Theory 27
RC Values
Capacitance
C = Cg = Cs = Cd = 2 fF/mm of gate width
Values similar across many processes
Resistance
R 6 KW*mm in 0.6um process
Improves with shorter channel lengths
Unit transistors
May refer to minimum contacted device (4/2 l)
Or maybe 1 mm wide device
Doesn’t matter as long as you are consistent
EE3:447
CMOS Transistor
VLSI Design Theory 28
Inverter Delay Estimate
Estimate the delay of a fanout-of-1 inverter
2 Y 2
A
1 1
EE3:447
CMOS Transistor
VLSI Design Theory 29
Inverter Delay Estimate
Estimate the delay of a fanout-of-1 inverter
2C
2C
2C
2 Y 2
A Y
1 1
C
R C
EE3:447
CMOS Transistor
VLSI Design Theory 30
Inverter Delay Estimate
Estimate the delay of a fanout-of-1 inverter
2C
2C 2C
2C 2C
2 Y 2
A Y
1 1 R C
C
R C C
EE3:447
CMOS Transistor
VLSI Design Theory 31
Inverter Delay Estimate
Estimate the delay of a fanout-of-1 inverter
2C
2C 2C
2C 2C
2 Y 2
A Y
1 1 R C
C
R C C
d = 6RC
EE3:447
CMOS Transistor
VLSI Design Theory 32