Engineers Guide To VME VPX and VXS

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Engineers Guide to
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VME Gathers No Moss
VPX: Heir Apparent to VME
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2 Engineers Guide to VME, VPX & VXS 2011
Welcome to the 2011 Engineers
Guide to VME, VPX &VXS
VME is healthy quite healthy. Thats the word from VDC Research senior analyst Eric
Gulliksen, who continues, Based on projected market shares of various avors of VME,
VPX is the one to watch. But how to keep track of all those avors?Jerry Gipper director
of marketing for VITA explains,VPX is the over-arching term for technology dening a
3U/6U form factor computer system that uses a variety of widely accepted switch fabric
interconnects.
Heres a quick look at the three specications that form the VPX family:
VPX breaks from traditional VME to merge the latest in connector and packaging
technology with the latest in bus and serial fabric technology. VPX denes 3U and 6U
format boards and systems with a choice of several high-speed serial fabrics.
OpenVPX manages and constrains module and backplane designs, including dening
pin-outs, and sets interoperability points within VPX while maintaining full compliance.
VPX REDI(Ruggedized Enhanced Design Implementation) describes how to implement
layout techniques to better support cooling methodologies on specic board form factors
and addresses the use of ESD covers on both sides of the board.
As for VXS? VMEbus Switched Serial, or VXS, combines parallel VMEbus with
enhancements to support switched serial fabrics including PCI Express, RapidIO,
StarFabric and InniBand over a new high-speed P0 connector. Backward compatibility is
maintained with existing backplanes without a conicting P0 scheme.
In this issue, we show you the trends and predictions for VME and its relatives, an
overview of the VXS ecosystem, and in-depth look at one VPX design process. And our
virtual roundtable takes input from several industry experts to help you anticipate whats
coming next.
Going forward, well be watching the new small form factor (SFF)developments currently
in VITA workgroups. PCI-Systems VITA-73 can be used as a mezzanine in VPX and
OpenVPX systems and in the new VPXi a VPX version for instrumentation. The PCI-
Systems product is already shipping, based on specications and pin-outs by current
customers. Themiss VITA-74 design was based on a need to develop some technology
that would attract a following from the existing COTS community, as well as being
transformational in the marketplace, and has also already been selected by several
manufacturers, according to Bill Ripley, director of business development for Themis
Mission & Payload Systems. In contrast to these customer-centric approaches, the
VITA-75 approach from Curtiss-Wright started from scratch to create essentially a smaller
form-factor, VITA-46-compatibleboard that accommodates higher power. Well be eager
to see this ecosystem evolve.
We hope you enjoy the 2011 Engineers Guide to VME, VPX & VXS. As always, wed love to
hear your feedback, thoughts and comments. Send them to [email protected].
Cher yl B er gl u n d Cou p
Editor
EECatalog.com
P.S. To subscribe to our series of Resource Catalogs for developers and other
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Engineers Guide to VME, VPX
& VXS 2011
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Engineers Guide to VME, VPX & VXS is Copyright
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X
TSY-305X Series
ATR Style or Footpad Mounting
Standard 3U VPX Backplane
Natural Air Convection Cooled
I/O Transition Board
28 VDC Power Supply Unit
150 Watts
5 x 1.0Pitch Slots
Applications
Data Recording
Display Processing
Digital Mapping
SIGINT / Electronic Warfare
Mission Computing
Network Attached Storage
Payload Controllers
Sensor Management
Image Processing
Fire Control
Command and Control
Data Link Processing
Network Processing
Benefts
LOWER PRICE
t Design-to-cost goals
tBetter value
SHORT LEAD TIME
temjeaeat. re+e ler
prototype builds
|+. ler jre-cealaree
rugged systems
STATE-OF-THE-ART
|lc|eat t|erm+| m+a+emeat
0at.t+ae|a .|ec| +ae .||r+t|ea
SMALL PROGRAMS ARE OK
t.e jrecealaree ..tem.ler ||||,
jretetje., +ae .m+|| jrer+m.
Available 3U VPX Cards
TSBCi7-300X
3U VPX Single Board Computer
with Intel CoreTM-i7 CPU
TIOC-300X
3U VPX XMC/PMC Carrier Module
TSC-300X
3U VPX 8-Port SATA/SAS RAID
Module with PMC/XMC Site
TSM-300X
3U VPX SATA/SAS
Mass Storage Drive Module
TGA 300X
3U VPX Graphics Processor
w|t| |M| |1 0|
2010 Themis Computer.
All rights reserved. Themis
Computer, Themis and the
Themis logo are trademarks
or registered trademarks of
Themis Computer. All other
trademarks are the property
of their respective owners.
www.themis.com
(510) 252-0870
TSY-300X Series
Standard ATR Footprint
Standard 3U VPX Backplane
I/O Transition Board
Forced Air Conduction Cooled Standard
Optional External FLASH Drive Receptacles
||aaee, te|ej|+te er |||a|e tee| 0jt|ea
Integrated Chassis Manager
Multi-port Ethernet Switch
Optional Electronic Hour-Meter
I2C Interface to Cards & Test Port
Multiple Temperature Sensors
Dynamic Fan Speed Control
Web Browser Management Interface
Variable Speed Redundant Fans
28 VDC Power Supply Unit
350 Watts
8 x 1.0Pitch Slots
Contents
VME Gathers No Moss
By Cheryl Coup ........................................................................................................................................................................................ 6
Elma Electronic Systems Division
By GE Intelligent Platforms ...................................................................................................................................................................... 12
Cost-Effective COTS Rugged Systems Shorten Development Time
By GE Intelligent Platforms ...................................................................................................................................................................... 13
XCalibur4331 Intel Core i7 Processor-Based Conduction- or Air-Cooled 6U VME SBC
By Extreme Engineering Solutions, Inc. ................................................................................................................................................... 15
Extreme Engineering Solutions (X-ES)
By Extreme Engineering Solutions, Inc. ................................................................................................................................................... 16
By Cheryl Coup ...................................................................................................................................................................................... 18
Wide-Area Airborne Surveillance (WAAS) application is ideal for VPX
By Cheryl Coup ...................................................................................................................................................................................... 20
Online & Ofine VME & VPX Resources................................................................................................... 22
Products and Services
Chips and Cores
Protocol Analysis Tools ICs
LeCroy Corporation
LeCroys PCI Express
Protocol Analysis and Test Tools ............ 25

Hardware
Backplanes
Elma Bustronic
What is OpenVPX? ................................................................ 26
SIE Computing Solutions
VPX Backplanes..................................................................... 27
Card Rack Hardware and Accessories
Elma Electronic
VPX/VXS Handles & Panels .................................................. 28
Connectors
Tyco Electronics
Fortis Zd Connector ............................................................... 29
Mezalok Connector ............................................................... 29
CPU or Single Board Computers
CES - Creative Electronic Systems SA
RIOV-2478 ............................................................................. 30
Dynatem, Inc
VPQ Intel Quad-Core based VPX SBC with 24-port
10Gb ENET switch................................................................. 31
Emerson Network Power
Extended Temp VMEbus SBCs.............................................. 32
Industry-leading VME Support and Longevity ...................... 32
iVME7210 Dual-Core VMEbus SBC ...................................... 33
MVME2500 VME64 Processor Board ................................... 33
Kontron
Single Board Computers ....................................................... 34
Enclosures
Schroff
Varistar - Versatile Cabinet Platform.................................... 35
716 Conduction Cooled ATR Enclosures ............................... 36
720 Liquid Cooled ATR Enclosures........................................ 37
Mass Storage
Elma Electronic
VME RAIDStor....................................................................... 38
Video
GE Intelligent Platforms
IPN250................................................................................... 39
MAGIC1................................................................................. 39
OpenVPX Development Platform
Call us or visit our
website for more details
www.elma.com
510.656.3400
www.elmasystems.com
215.956.1200
Embedded Computing Solutions by Elma
Making Sense of
Box Level Solutions
ATRs & Chassis Platforms
Pre-Integrated Subsystems
SystemPaks
Open VPX
Storage
ATR Platform
High Performance FPGA
PMC/XMC Carrier
Fabric Switch
Elmas solid foundation of core capabilities is based on
decades of hardware design expertise, extensive thermal
management techniques, and in-depth knowledge of all
the building blocks required for an application ready
platform. We leverage that experience along with the
long term relationships built with best in class partners to
deliver truly interoperable COTS based platforms.
Call us to find out how to navigate through the new
OpenVPX standard to design the right high performance
platform you need.
EECatalog
SPECIAL FEATURE
Despite more than three decades since its introduction, VME con-
tinues to roll, picking up speed and market share with a variety of
new and under-development standards. To understand these devel-
opments, EE Catalog went to the experts. We talked to Jerry Gipper,
director of marketing for VITA, the international standards organi-
zation that promotes and manages VME and related open standards;
Justin Moll, the VXS Marketing Alliance chair for VITA and director
of marketing for Elma Bustronic; James B. Doyle, congressional
aairs liaison and director of Military, Aerospace & Government
Embedded Computing for Emerson Network Power; and Bill Ripley,
director of business development for Temis, Mission & Payload
Systems.
EE Catalog: Two key transitions seem to be the evolution to small
form factors and optical interconnections. How are these changes
impacting embedded developers?
Jerry Gipper, VITA: A key role of VITAs Stan-
dards Organization (VSO) is to look to the
technology needs of the future. To that end, the
VSO has initiatives that are evaluating small form
factor and optical interconnection options for
critical embedded systems.
Te evolution to smaller form factors has been
underway for many years. As computing technology increases in
functional density, smaller boards can do the work that required
much larger boards in the past. We saw this in the late 1980s with
VME when single board computers incorporated the features that
initially required multiple VME slots. Today, entire systems that
took large VME racks can now be built on a small form factor board
or system. Systems-on-chip or module technology continues to
improve in functional density and the resulting boards can also be
smaller. Te small form factor initiatives are developing standards
now as well as stepping back and looking closer at the big picture of
various options suitable to our markets.
Te move to optical interconnections for critical embedded systems
is in the formative stage. VITA 66 is dening blind mate ber optic
interconnects for use with VPX backplanes and plug-in modules.
Tere are still many details to be worked out by the industry before
there will be widespread deployment of systems with optical inter-
connections at the backplane.
Developers using small form factor boards and systems are already
doing so. Te VSO work will eventually give them better options for
use in critical embedded systems. Developers planning to use optical
interconnections at the backplane have to remain patient as the
technology and specications are developed.
Justin Moll, Elma Bustronic: Te VME family is
not necessarily making any transitions to small
form factors and optical interconnects yet. Te
jury is still out on how they will impact VITA stan-
dards and member products. It is clear that some
applications will benet from small form factors
(SFF) due to size, weight, and power (SWaP). Te
VITA-based concepts are all new and will address
certain niche requirements initially. Which of these solutions will
succeed in the market remains to be seen. However, many applica-
tions will continue to be able to use the established architectures
like 3U VPX. SFF will likely gain the most traction in areas where 3U
VPX is not a strong t or where COM Express or PC/104 do not meet
performance requirements. Optical interconnections over the back-
plane (mainly pass-through) have been around for a long time, but
the increased density and modular nature of the backplane interface
will make this an increasingly interesting solution. Tere are new
concepts like VITA 66 which are being explored today. Tese are two
areas to watch.
Perhaps the biggest impact that the transition to VPX oers is the
interconnect speed; VPX backplanes today oer speeds of up to
6.125 Gbps per lane, higher than anything else currently oered in
the embedded market space.
James B. Doyle, Emerson Network Power:
Smaller user equipment and reduced power con-
sumption are driving the standardization of more
small form factor embedded boards, such as Nano-
ITX and smaller Computer-on-Module (COM)
formats. User expectations, especially younger
users, have changed. Tese customers expect the
total mobility of applications. Tis is the iPhone
VME Gathers No Moss
Industry leaders chime in on new standards and market
opportunities that keep the venerable technology moving forward
By Cheryl Coup
This is the iPhone and netbook
generation.
They expect embedded
equipment to keep pace
with improved user interfaces
and smaller,
better industrial design.

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EECatalog
SPECIAL FEATURE
and netbook generation. Tey expect embedded equipment to keep
pace with improved user interfaces and smaller, better industrial
design. Concern over climate change and the cost of energy are
making power consumption a major factor in the choice of form factor
as well as processor. Te Intel Atom processor has brought a widely
adopted processing environment to smaller embedded boards.
Bill Ripley, Temis: Last year, Temis made a
conscious decision to enter the small form factor
(SFF) market. We did an extensive study of what
was in the marketplace, both from commercial-
o-the-shelf (COTS) market perspective, and
the custom marketplace as well. We saw a need
to develop some technology that would attract a
following from the existing COTS community, as
well as being transformational in the marketplace. We developed a
framework around an architecture that took features from a variety of
VITA and PICMG standards and rolled them into a new SFF proposed
standard, VITA-74. We believe that this standard oers the optimal
trade-o between space, weight, power and price. Te standard has
already been selected as a way forward by several manufacturers, so
it appears that this ecosystem will continue to quickly evolve.
EE Catalog: Which optical interconnect technologies seem to have
the most traction, and what issues should embedded developers con-
sider in investigating these options?
Jerry Gipper, VITA: VITA members recognize the need for higher
density, higher performing interconnect technologies to meet the
speeds of 10 gigabit serial channels and higher that will be used in
next-generation critical embedded systems. As the transfer rates
continue to increase, it is clear that optical technology oers many
advantages. Since optical interconnects work best as a point-to-point
connection, future systems are going to need much higher density
supporting hundreds of connections in a single board or line-replace-
able unit (LRU).
Achieving the projected level of combined performance and con-
nector density is no easy challenge. Te lead time to develop
technologies and supporting specications is very long. To that
end, VITA launched a study group, VITA Architectures for Optical
(VAO) Study Group, to research potential technologies and propose
an architecture that could become part of future solutions. At this
stage, it is very premature to determine which optical interconnect
technologies have established themselves.
Te mission of the VITA Architectures for Optical Study Group is
to research and determine the feasibility of developing a standard
architecture for optical interconnects suitable for deployment in
critical embedded systems. Te study group will focus on high-den-
sity options for backplanes and connections between line-replaceable
units, mezzanines and daughter cards. Te study group will explore
the needs and ascertain the interest in developing a standard. (See
www.vita.com/vao)
VITA is also providing guidance in the formation of OpComp.
OpComp is a technical forum that brings together academia, research
and development and application developers to one place to discuss
optical computing technologies for critical embedded computing
systems. A forum event is in planning for later in 2011. Visit www.
op-comp.com for more details.
Developers interested in backplane optical interconnect technology
and specications are encouraged to join or monitor the study group
and participate in future forums on this technology.
Justin Moll, Elma Bustronic: A key question for optical inter-
connects across the backplane is whether they will use polymer
waveguides. Tese have shown heavy signal losses in some early
testing, but improvements continue to emerge. However, it is again
still way too early to understand the impact of optical interconnects
on VITA standards and products. One that is making some inroads
is being considered under the VITA 66 Working Group. It is still early
in its development, and very expensive in terms of implementation
right now.
Doyle, Emerson Network Power: Emerson is an active participant
in the VITA standards organization, which is currently looking at
optical interconnect technologies for embedded systems. History
shows us that the technology which succeeds will balance technical
and commercial issues. Being the best technology doesnt guar-
antee success; being good enough technically and having a broad
ecosystem of support is more likely to win in the long term.
EE Catalog: What do developers need to know about the recently
ratied VPX REDI standard?
Jerry Gipper, VITA: Te Ruggedized Enhanced Design Implementa-
tion (REDI) laid out in VPX REDI describes how to implement layout
techniques to better support cooling methodologies on specic board
form factors such as VPX. Currently, it covers enhanced forced-air
cooling (using baes and plenums), advanced conduction cooling
(using larger and more ecient thermal interfaces), and liquid
cooling. It also addresses the use of ESD covers on both sides of the
board, a necessary feature for military two-level maintenance strate-
gies. Both board and system developers need to be familiar with the
various cooling and maintenance strategies specied by VPX REDI.
Being the best technology
doesnt guarantee
success; being good enough
technically and
having a broad ecosystem of
support is more likely
to win in the long term.
EECatalog
SPECIAL FEATURE
Justin Moll, Elma Bustronic: One thing they should know is that
the front panel width of VPX REDI deviates from the traditional IEEE
1101.10 mechanical standard. VPX front panels are set up at .85-inch,
1.0-inch, or 1.2-inch widths, and oer module covers to support Level
2 maintenance and rear extensions to protect the connector.
Doyle, Emerson Network Power: As is often the case, it boils down
to interoperability. Tere are many prole schemes within the speci-
cation and it is important to understand these when starting to put
together a system.
Bill Ripley, Temis: In my mind, the VPX REDI initiative enhances
the 3U and 6U VPX standards by signicantly improving the cooling
and handling performance of the modules. It was a bit of a paradigm
shift for me (personally) to recommend a card that has a built-in
weight and space penalty for the REDI covers, but after seeing the
improved thermal performance and tidy packaging with not much
real penalty, I have become a solid believer in the initiatives. Our
standard 3U VPX systems are built around VPX REDI, and our 3U
VPX modules come standard with VPX REDI covers. For those that
have not jumped on the VPX REDI bandwagon, we still oer the cards
the old fashioned way.
EE Catalog: What test issues do developers need to be aware of
around VPX?
Justin Moll, Elma Bustronic: VPX provides for data rates from 10
to 25 Gbps for a typical x4 Fat Pipe (4 bi-directional lanes). Terefore,
signal integrity is an important issue, and monitoring and testing is
advised. Tere are SerDes test units and other devices to characterize
the backplane, plug-in boards or the full interconnect path. Heat dis-
sipation is another critical issue, particularly for applications where
forced-air cooling may not be feasible. Termal simulation studies
can conrm the chassis are meeting the cooling specications. Tere
are test accessories such as load boards, test extender boards, SerDes
test units and development systems specically for VPX available in
the marketplace to help perform testing/prototyping.
Bill Ripley, Temis: We have found that it is essential to plan for
some integration time, to make sure that all the hardware really plays
together like it should, and that the system is performing optimally.
For example, on Temis VPX and VITA-74 boards and modules, we
have added support for common clocks, should the system designer
feel that common clocking improves the reliability and performance
of the system. We have undertaken an eort to be compatible with
third-party COTS suppliers high-performance embedded computing
modules by testing our ability to work with those third-party cards,
in advance, with and without a common clock architecture.
EE Catalog: What are the opportunities for VME/VPX in traditional
markets (e.g., mil/aero) as well as new markets such as smart grid,
healthcare and others?
Jerry Gipper, VITA: Growth is going to come from all sectors that
use embedded computing technology. Developers will continue
to nd new and innovative ways to use computing technology to
enhance their existing products. Te best growth sectors for VITAs
technologies will remain the mil/aero markets, industrial and com-
munications. Each will have dierent growth curves and timing as
external inuences impact their market opportunities. Short-term
growth is stied for the time being as the global economy struggles
to get back on track.
Justin Moll, Elma Bustronic: VME was ubiquitous in many markets
prior to the PC becoming more widely adopted. Any requirements for
image or signal processing that also require a more rugged solution
could benet from the new 3U and 6U VPX solutions. Tese applica-
tions could include factory automation, security, remote surveillance
and outdoor inspection. Markets that might have such applications
may include energy, research/education, healthcare, outdoor/mobile
computing, and homeland or facility security markets.
Bill Ripley, Temis: From my perspective, I see VPX as a solid
contender for both upgrade programs and new programs alike. We
have seen solid support in programs needing scalable computing
and I/O, where the system is being built to meet the current require-
ments, but has provisions for expansion and upgrade in the future.
A solid roadmap is the key. Customers want to know that their COTS
suppliers have a rm grasp on what they are doing now, as well as
where they are headed with the design-after-next. We have worked
very hard taking cost out of our VPX designs, which translates to
lower average sales price. Tis allows us to be more competitive in
the commercial marketplace, particularly on programs where high
performance or high compute density is key. We see a lot of potential
for lower performance VPX applications migrating to VITA-74, since
we have preserved the VPX electrical connectivity, but taken a lot
of cost out of the modules by changing to a dierent connector and
simplifying the cooling solutions.
Cheryl Berglund Coup is Editor of EECatalog.
com. Her articles have appeared in EE Times,
Electronic Business, Microsoft Embedded Re-
view and Windows Developers Journal and she
has developed presentations for the Embedded
Systems Conference and ICSPAT. She has held
a variety of production, technical marketing and writing
positions within technology companies and agencies in the
Northwest.
The best growth sectors for
VITAs technologies
will remain the mil/aero
markets, industrial
and communications.
The intelligence behind the
world's leading business events
www.marcusevans.com
I really need
a one-to-one
meeting to
discuss business
challenges
Brian Hillen, Manufacturing Director
(Would benefit from attending this marcus evans summit)
9 11 February 2011
The Westin Diplomat Resort & Spa,
Hollywood, FL, USA
[email protected]
www.aerospacedefensesummit.com/EECad
The Aerospace and Defense Manufacturing Summit
2011 serves as the primary forum for leading manufacturing
executives to network with industry leaders, while gaining
insight into innovative solutions currently being developed
for the market.
CONTACT INFORMATION
Elma Electronic Systems Division
Elma Electronic Inc. supplies a rst class oering of VITA standards
based products for standard and rugged COTS electronics pack-
aging and sub-systems integration: chassis, boards, backplanes,
mechanical components, and cabinets. Elmas Embedded Computing
products and services make the company a leading supplier of VME,
VXS and VPX based integrated embedded boards and sub-systems.
System architecture, hardware, and software design services enable
delivery of complete solutions. For rugged requirements, we take
COTS products, such as single board computers, then enhance and
qualify them to meet certain MIL Standards.
Our extensive chassis product oering is unparalleled in the
industry: rugged COTS 19 rackmount chassis, ATR boxes, and non-
rugged and lab appropriate chassis and enclosures. Te 12R2 series is
an extrusion-based modular design, which provides a cost-eective
way to customize designs. Elmas rugged chassis platforms meet the
EMI/RFI requirements for MIL-STD-461D, and shock and vibration
according to MIL-STD-167, MIL-STD-810F and MIL-STD-910D. Our
popular Type 32 towers and E-Frame chassis are perfect for new
board-level and system development in the lab.
Elma is capable of quickly turning projects from initial system archi-
tecture through to specication, design, manufacturing and test. We
also work with you to manage the entire project including EOL issues,
spares inventory and lifecycle management. Elma is truly qualied to
oer the widest range of best of class products and by teaming with
our partners, we provide complete standard or custom integrated
embedded sub-system platforms to meet your requirements.
19 and Portable VME, VXS and VPX Chassis
Modular designs with rugged, high quality construction
19 rackmount, desktop or portable tower versions designed
to meet a wide range of applications
1U 15U heights are available with depths from 15 to 24
Vertical or horizontal card cages accommodate 3U and 6U
board heights
All systems come fully assembled, wired and tested prior to
shipment
Horizontal and vertical card mounting congurations
Backplanes are available in 3U and 6U sizes using single star,
dual star, mesh, or custom fabric implementations
Rugged COTS Chassis
High quality, cost-ecient rugged package
Tested for shock, vibration, and structural integrity per
MIL-STD-810F, MIL-STD-167 and MIL-STD-901D
Integrates standard o-the-shelf parts to reduce lead time
Uses MIL-grade components
Powerful, ecient cooling system
Lighter weight 12R1 line of chassis for applications where
weight is a major factor.
ATR (Air Transport Rack)
Conduction or convection cooled
Available in sizes 1/2, 3/4, 1, or 1 1/2 ATR per ARINC 404A
Built with a modular design to ensure easy customization
with reduced cost and lead time
Short and Long chassis depths available
Advanced airow distribution, removable front panels, rear
panels, and top and bottom covers
Designed to meet MIL-STDs 5400, 810E, 461E, 704A, 275A
VME, VXS, and VPX Embedded Computing
Boards
COTS and rugged Single Board Computers and FPGA Pro-
cessing Engines
Ethernet switches
Storage Direct Attached, Network Attached, RAID, Arrays
FPGA based and mezzanine based I/O solutions
Application ready development bricks (AppliPaks) and plat-
forms (SystemPaks)
Deployable embedded subsystems per customer congura-
tion requirements
Elma Electronic
44350 Grimmer Blvd
Fremont, CA 94538
USA
510-656-3400 Telephone
[email protected]
www.elma.com
www.eecatalog.com/vme 13
Cost-Effective COTS
Rugged Systems Shorten
Development Time
Custom rugged subsystems in the defense and aerospace market are
focused on specic application requirements and are often built from
the ground up. Because they are custom designed to the customers
requirements, custom rugged systems incur high design and engi-
neering costs and long delivery times.
Qualication testing, documentation, and I/O pin out for custom
systems are driven by the customer, who pays for those necessary
elements with longer lead times and higher costs. With a COTS pack-
aged solution, this all comes standard and it saves the customer both
time and money.
A large percentage of system applications often do not require custom
subsystems. A standard COTS packaged system equipped with a
exible array of I/O and storage congurations can oer system
designers a quicker start on their application at a lower cost.
GE Intelligent Platforms new COTS Rugged Systems oer a packaged
solution that reduces non-recoverable engineering (NRE) expenses
and still have the exibility to meet various I/O requirements all
with a shortened lead time. Now more than ever, project engineers
need an inexpensive solution designed for various control and data
processing applications for UAVs, manned and unmanned ground
vehicles, and launch vehicles.
GEs new CRS series of COTS packaged computer systems can be
deployed in the eld as soon as the customers application is ready,
or as a starting point from which GE can make modications to meet
the specic needs of the application. Te arduous task of integrating
o-the-shelf boards has already been done for the customer, whose
time to project completion is greatly shortened. To further help
reduce program risk, the customer has one point of contact for pur-
chase and a single part number, not a collection of parts numbers.
Te CRS series successfully integrates GEs wide selection of COTS
products into subsystems that are tested and designed for rugged
systems deployment in harsh environments such as extreme tem-
peratures and high humidity.
GE Intelligent Platforms Mil/Aero Group is fully compliant with
AS9100 processes and brings years of experience designing rugged
systems to defense and aerospace projects. Our world-class program
management competencies are tailored to help mitigate program risk.
GE maintains a parts, materials and processes plan, and performs
design, manufacturing, and testing in accordance with industry stan-
dards including IPC (Class 3) and ANSI/VITA and applicable military
standards. For systems containing MIL-STD-1553 or ARINC inter-
faces, we include the Integrated Avionics Library with a full suite of
C functions to help reduce software development cycle time.
To help jump start mil/aero projects, GE oers Engineering Develop-
ment Units, or starter kits, precongured for development purposes.
Based on the required system controller architecture, GE can provide
the appropriate development system for customers specic needs.
In addition, GE oers its proven Product Lifecycle Management
(PLM) program of innovative Long-Term Support services to
reduce the overall cost of ownership and provide industry-leading
safeguards against component obsolescence. We are committed to
supporting customer programs throughout their lifecycles.
To learn more about GE Intelligent Platforms COTS Rugged Systems
go to: www.defense.ge-ip.com/systems
CONTACT INFORMATION
2500 Austin Drive
Charlottesville, VA 22911
USA
1-800-433-2682 Toll Free
1-800-433-2682 Telephone
www.ge-ip.com
The XCalibur4331 is a high-performance 6U VME single
board computer that is ideal for ruggedized systems requiring
high bandwidth processing and low power consumption.
With the Intel Core i7 processor, the XCalibur4331
delivers enhanced performance and efficiency for today's
network information processing, military, industrial, and
medical imaging embedded computing applications.
The XCalibur4331 provides two separate channels of up to
16 GB (8 GB each) DDR3-1066 ECC SDRAM, two PrPMC/
XMC slots, 32 MB of boot flash and up to 128 GB of user
flash. The XCalibur4331 also supports four Gigabit Ethernet
ports, one DVI graphics port, IC, PMC I/O, XMC I/O, and
RS-232/RS-422/RS-485 serial ports out the back panel.
The XCalibur4331 is a powerful, feature-rich solution for
the next generation of compute intensive embedded appli-
cations. Operating system support for Wind River VxWorks,
QNX Neutrino, Linux, and Windows is available.
The XIt1010 is a Rear Transition Module (RTM) that sup-
ports XCalibur4331 rear I/O. The XIt1010 routes three
10/100/1000BASE-T Ethernet ports to RJ-45 connectors,
two RS-232 ports to a micro DB9 connector, four USB ports
to type A connectors (three via on-board USB hub), and
a SATA port to an eSATA connector. An additional SATA
port and two Mini-HDMI (DVI) ports are made available
by mounting an optional XIt1071 PIM onto the XIt1070.
Features & Benets
v Intel Core i7-610E, i7-620LE, and i7-620UE processors
v Dual-core with hyper-threading technology
v VME 6U module
v Conduction or air cooling
v Two channels of up to 16 GB (8 GB each) DDR3-1066 ECC
SDRAM
v 32 MB of boot ash
v Up to 128 GB of user ash
v Four Gigabit Ethernet ports
v Two x8 Gen2 at 2.5 GT/s PCI Express lanes from CPU to XMC
sites
v One DVI graphics port
v Tree USB 2.0 ports (one front-panel and two backplane)
v Two RS-232/RS-422/RS-485 serial ports
v Two PrPMC/XMC interfaces
v VxWorks, Integrity, and Linux BSPs and Windows drivers
XCalibur4331 Intel Core i7
Processor-Based Conduction-
or Air-Cooled 6U VME SBC
Extreme Engineering
Solutions, Inc.
3225 Deming Way, Suite 120
Middleton, WI 53562
608-827-6171 Fax
[email protected]
www.xes-inc.com
CONTACT INFORMATION
Extreme Engineering
Solutions (X-ES)
X-ES has an extensive portfolio of rugged VPX products.
Designed for conduction- and air-cooled applications, X-ES
provides single board computers (SBCs), switch cards, carriers,
storage modules, power modules, backplanes, RTMs, and plat-
forms and enclosures.
Product
Name
Form
Factor
Rugged
Level Processor
Max
CPU
Speed Memory NVRAM Mezzanines Ethernet USB
XCalibur1541 6U VPX 1, 3,5 MPC8572E 1.5 GHz 4 GB DDR2-800 256 MB NOR 2 PMC/ XMC 4 1000BASE-T 3 USB 2.0
16 GB NAND
XCalibur4341 6U VPX 1, 3,5 Core i7 2.53 GHz 16 GB
DDR3-1066
32 MB NOR 2 PMC/ XMC 5 1000BASE-BX
or 1000BASE-T
3 USB 2.0
128 GB NAND
XPedite5170 3U VPX 1, 3,5 MPC8640D 1.25 GHz 4 GB DDR2-533 256 MB NOR 1 PMC/ XMC 2 1000BASE-T
4 GB NAND
XPedite5370 3U VPX 1, 3,5 MPC8572E 1.5 GHz 4 GB DDR2-800 256 MB NOR 1 PMC/ XMC 2 1000BASE-T
4 GB NAND
XPedite5470 3U VPX 1, 3,5 P4080 1.5 GHz 8 GB DDR3-1333 256 MB NOR 1 PMC/ XMC 2 1000BASE-T or
1000BASE-BX
2 USB 2.0
16 GB NAND
XPedite5570 3U VPX 1, 3,5 P2020 1.2 GHz 4 GB DDR3-800 256 MB NOR 1 PMC/ XMC 2 1000BASE-T 1 USB 2.0
16 GB NAND
XPedite7170 3U VPX 1, 3,5 Core 2 Duo 1.8 GHz 4 GB DDR2-400 4 MB NOR 1 PMC/ XMC 1-2 1000BASE-T 0-2 USB 2.0
4 GB NAND
XPedite7172 3U VPX 1, 3,5 Core 2 Duo 1.8 GHz 4 GB DDR2-400 2 MB NOR 1 PMC/ XMC 2 1000BASE-T or
1000BASE-BX
2 USB 2.0
4 GB NAND
XPedite7370 3U VPX 1, 3,5 Core i7 2.53 GHz 8 GB DDR3-1066 32 MB NOR 1 PMC/ XMC 2 1000BASE-T or
1000BASE-BX
2 USB 2.0
16 GB NAND
XPedite7371 3U VPX 1, 3,5 Core i7 2.53 GHz 8 GB DDR3-1066 32 MB NOR 1 PMC/ XMC 2 1000BASE-T or
1000BASE-BX
2 USB 2.0
16 GB NAND
Product
Name
Form
Factor Chassis Type Dimensions
Chassis
Cooling
Supported
Modules Backplane
# of
slots
ADP 3U VPX Development 11.5"D x 5.5"W x 16.5"H Air Conduction 3U VPX 10
XPand1000 3U VPX Development 8.3"D x 4.2"W x 8.5"H Air Conduction 3U VPX 2
XPand1300 3U VPX Development 11.5"D x 5.5"W x 16.5"H Air Air 3U VPX or 3U cPCI 15
XPand3200 3U VPX ATR 8.75"D x 4.88"W x 5.62"H Conduction Conduction 3U VPX or 3U cPCI 6
XPand4200 3U VPX ATR 13.5"D x 4.88"W x 6"H Air Conduction 3U VPX or 3U cPCI 6
Single Board Computers
Platforms and Enclosures
Storage Solutions
To address the storage requirements of deployed embedded
applications, X-ES oers high density Solid State Disk (SSD)
storage solutions and removable SSD storage options. X-ES can
build removable storage options into system-level solutions,
such as the XPand4200 sub-1/2 ATR box.
XPort6192 3U VPX Removable SSD Carrier
XPort6170 Small Form Factor 256 GB Removable SATA Solid State
Drive (SSD) with 256-bit Encryption
Switches and Carriers
To facilitate system integration, X-ES provides a number of
switch and carrier options. All are available in both conduc-
tion- and air-cooled versions.
XChange3000 3U VPX PMC/XMC carrier card
XChange3010 3U VPX four-port VPX PCI Express switch with
bridging to cPCI
XChange3011 3U VPX conduction- or air-cooled redundant Gigabit
Ethernet switch
XChange3012 3U VPX PCI Express and Gigabit Ethernet Inte-
grated Switch with XMC and Management Support
Backplanes, Power Modules, and Rear
Transition Modules (RTMs)
Design margins for VPX backplanes are much narrower than
traditional backplane due to the number and the speed of the
signals on the backplane. Power requirements of VPX systems
can be much higher than with traditional systems. To ensure
robust system designs, X-ES develops VPX backplanes and
power modules. X-ES provides RTMs to support air-cooled
applications and development eorts.
XTend41310 3U VPX development backplane with centralized
switching for single or dual star topology
XTend4131 3U VPX development backplane with centralized
switching and expansion plane support
XPm2020 MIL-STD-704 28V input to 12V, 5V, and 3.3V output
3U VITA 62.0 VPX power supply with integrated MIL-STD-461E
ltering
XIt1040 6U VPX rear transition module with Gigabit Ethernet,
SATA, USB, Serial, and DVI
XIt1070 3U VPX rear transition module with Gigabit Ethernet,
SATA, USB, Serial, and DVI
XIt3012 3U VPX rear transition module (RTM) for the
XChange3012
Extreme Engineering
Solutions, Inc.
3225 Deming Way, Suite 120
Middleton, WI 53562
608-827-6171 Fax
[email protected]
www.xes-inc.com
CONTACT INFORMATION
EECatalog
SPECIAL FEATURE
Despite a still-sluggish economy, the worldwide VME market
remains quite healthy. In a recent report, VDC Research pro-
jected a compound annual growth rate of more than 9% in the
period from 2009-2014 for all VME single board computer (SBC)
incarnations. This is due in large part, of course, to VMEs con-
tinued stronghold in military and aerospace applications. And
while mil/aero activity doesnt appear to be slowing down, VDC
senior analyst Eric Gulliksen also doesnt expect VME to have
a serious impact in any other industry outside of it. VME is
an excellent technology but its also an expensive one, and the
bullet-proof nature that it has for mission-critical applications
isnt needed for other applications, said Gulliksen. VMEs
second largest market is industrial automation and control, but
that share is less than 10 percent of mil/aero, and its share in
other markets such as telecom and medical drops another order
of magnitude from there.
Within the VME market, Gulliksen sees traditional shared
multidrop-bus VME rapidly declining, while newer standards
such as VPX is expected to see tremendous growth. VPX
(ANSI/VITA 46) breaks from the traditional VME connector
scheme with a 7-row, high-speed connector rated up to 6.25
Gbps and support for a variety of switch fabric technologies in
3U and 6U format blades. The growth of VPX will also be sup-
ported by OpenVPX, the architecture framework that defines
system-level VPX interoperability for multi-vendor, multi-
module, integrated system environments. And VPX REDI the
Ruggedized Enhanced Design Implementation (REDI) laid out
in VITA 48 extends VPX with layout techniques to better
support enhanced forced-air, conduction cooling, and liquid
cooling methodologies, as well as the use of ESD covers on both
sides of the board.
While VPX emerges as the next generation of VME, VXS
(ANSI/VITA 41, VMEbus Switched Serial) will see only modest
growth. VXS offers backward compatibility to standard VME
systems by combining parallel VMEbus with enhancements to
support switched serial fabrics including PCI Express, RapidIO,
VM E-BASED SINGLE BOARD
COM PUTERS
2009 Tot al : US$ 376.5 M i l l i on
0.9%4.9%
13.5%
80 7%
VXS
VPX
VM E2eSST
Ot her VM E-based
VM E-BASED SINGLE BOARD
COM PUTERS
2012 Tot al : US$ 515.7 M i l l i on
1.8%
22.4%
22.5%
.3%
VXS
VPX
VM E2eSST
Ot her VM E-based
VME market is healthy overall, and VPX is the new standard to watch
By Cheryl Coup
VDC Research
projected a compound
annual growth rate of
more than 9% in the
period from 2009-2014
for all VME single
board computer (SBC)
incarnations.
EECatalog
SPECIAL FEATURE
StarFabric and InfiniBand over a high-speed P0 connector.
But the connectors are expensive and space-consuming, so
VXS makes sense only if the system truly demands backwards
compatibility. If you dont need that backward compatibility,
you dont want to bring all that baggage with you, says Gul-
liksen. He sees growth in the VXS market, but its minimal in
comparison to VPX. For perspective: in 2009 VPX represented
less than five percent of the VME market and VXS less than one
percent. By 2012, VPX will represent more than 20 percent of
the overall VME market while VXS is expected to comprise less
than two percent.
From an architecture standpoint, VMEs traditional Power
Architecture domination seems to be on the decline, being
replaced by multicore Intel architecture. In 2009, Power rep-
resented 65 percent of the market in SBCs, with an expected
share of 48 percent in 2012. While this is significant, the
market will continue to grow, so this is a decline specifically
in market share, not overall growth. On the operating system
side, VxWorks continues to dominate but is losing share to
Linux. From 2009 to 2012, VxWorks share is expected to drop
from 57 percent to 52 percent, while Linux moves from 27 per-
cent to 35 percent in the same time period.
The board market overall has continued to undergo consolida-
tion, with acquisitions occurring even during the height of the
recession. Kontron, the biggest embedded board supplier overall
in VDCs research, has been acquiring in VME to emerge with
about eight percent VME market share today, but still trailing
VME leaders GE Intelligent Platforms and Curtiss-Wright.
Gulliksen believes the majority of the market consolidation is
done at this point. As a result, he expects to start seeing more
board start-ups in future, although thats less likely for VME
a market thats expensive to break into and tricky to crack
the military hierarchy. As investments begin to f low again,
Gulliksen expects to see more new companies building ATCA
boards as well as smaller form factors other than rack mount.
On the topic of VME small form factor (SFF) development, Gul-
liksen is waiting to see what emerges. Last year, PCI-Systems,
Themis Computer and Curtiss-Wright each proposed separate
small form factor standards and were each granted working
group status. Since then, each company has introduced small
cube-like systems that seem primarily aimed at unmanned
aerial and ground vehicle applications. Gulliksen sees this
development akin to the evolution from AdvancedTCA to
MicroTCA, and says, I wouldnt be surprised if theres a market
for it. VITA doesnt waste a lot of time if theres not a market.
Gulliksen expects these SFF systems, with several small cards
plugged into a cube enclosure, will help combat the inroads
that MicroTCA has been making into VMEs avionics market.
The development is taking a different approach than that
taken by PICMG with MicroTCA, however. Gul liksen explains:
MicroTCA evolved because they developed a mezzanine card
that could be used as a blade. VITA doesnt have a mezzanine
card that they can quickly adapt to a microVPX system, so
theyre starting from scratch. It may lead to the same place
that PICMG went but in the other direction. They ll start with a
small form factor system and once they have these little blades
in a microVPX system, why not use them as mezzanine cards
in a full-size system? Its a very logical thing to do and can
multiply the market opportunities.
Northwest.
VPX is expected to see
tremendous growth.
EECatalog
SPECIAL FEATURE
Richard Lourette, chief scientist and principal investigator for
ITT, worked closely with Dynatem to develop a VPX board for
a payload sensor processing application that he describes as
similar to the US Air Forces Gorgon Stare program deployed
last year. That program is a wide-area airborne surveillance
(WAAS) system that supports multiple cameras and gives
ground operators access to imagery from up to 12 different
angles at the same time, at rates of 16 MegaPi xels per second
for each camera. For the new system, demands were high and
the project was underway at the same time that the draft stan-
dard for VPX was being developed. Together, Dynatem and ITT
started the design, tracked changes as the standard developed,
and spun the final board to meet the ratified standard.
The resulting VPX single board computer (SBC) (which Dynatem
dubbed VPQ) includes a 24-port, 10 Gigabit Ethernet switch
that allows full-mesh backplane data-layer interconnectivity
and up to eight VPQ SBCs to be integrated into a single chassis
without the use of an additional switch board. The board is
based on a quad-core Intel Xeon processor for high perfor-
mance, and a PCI Express switch provides connectivity to two
fully capable PMC/XMC sites with extensive user I/O.
Despite the challenges of designing the board in parallel with
the standard, Lourette explains why VPX was the way to go for
this demanding sensor application:
Intel Friendly
With support for PCI Express and 10 Gigabit Ethernet, VPX is
inherently Intel CPU-friendly and Lourette needed the pro-
cessing power of the high-performance quad-core Intel Xeon
processor. When Apple bought P. A. Semi (in 2008), Lourette
abandoned all efforts around Power Architecture. I looked at
that and said Im not going to wait around for someone else to
come up with something more powerful, he stated. At that
point, all my designs were based on the Intel platform and Ive
never looked back.
Signaling in Backplane
At the time, VPX was the only mil/aero backplane that could
accommodate up to 6 Gigahertz of digital signaling in the back-
plane. ITT used XAUI, following the Open VPX standard for the
VPX P1 connector for 10 Gigabit Ethernet. The additional slot
The Dynatem VPQ is a high-performance single board computer (SBC)
based on the 6U VPX (VITA 46) form factor.
Wide-Area Airborne Surveillance
(WAAS) application is ideal for VPX
By Cheryl Coup
Looking forward,
Lourette is watching
new VME technologies,
including small form
factor and optical
developments.
EECatalog
SPECIAL FEATURE
width in the design also allows room for more cooling fins and
higher signal integrity for the XMC sites.
GPGPU Friendly
The VPX platform lends itself well to utilizing general-purpose
computing on graphics processing units (GPGPU) technology.
ITT and Dynatem repurposed NVIDIA and ATI graphics con-
trollers for very high-performance number-crunching.
Cluster-capable
The 10 Gigabit Ethernet
switch built into the board
supported f lexible data f low
topologies. Lourette was able
to gang multiple CPUs in a
system to create a super-
computing cluster that can
process massive amounts of
sensor data. The predecessor
system to this design used a
CompactPCI board that was
limited to Gen 1 SATA IO
signaling and had reached
capacity at 65 watts per slot.
The new VPX board can go
up to 150 watts per slot for
plenty of payload processing.
Developing the VPX board
was not without its chal-
lenges:
Cooling. Termal design is somewhat less of a challenge now that
the standard is ratied, but ITT and Dynatem worked closely with
backplane and chassis vendors to develop a reference design that
software developers could use that was electrically and software
equivalent to the nal system. Plenty of advanced thermal analysis
ensured that ITT could power a system with seven boards and pro-
vide both air- and conduction-cooled designs depending on the nal
applications mission.
Mechanical. One of biggest and unexpected challenges was
seating the cards in the backplane. Lourette explains, It takes
250 pounds of force to insert a VPX card into the backplane.
As thick as a 20-layer backplane is, it would bow like a credit
card. Reinforcements had to be applied to the backplane to
make sure all the contacts were made. ITT and Dynatem also
had to find metal front panel ejectors that were robust enough
to handle the cards and adapted conduction-cooled levers to
air-cooled cards so they could get them in and out without
special tooling.
Looking forward, Lourette is watching new VME technologies,
including small form factor and optical developments. ITT
has worked with Dynatem
on 3U VPX and will be inter-
ested to watch developments
in smaller form factors.
About new small form factor
developments he says, It
needs to be a little bit more
mature before I can stand up
a project on it, but I would
certainly entertain that. As
for optical developments, he
says, Everything I work on
is always pushing the enve-
lope on data processing.
He continues, Im already
saturating the VPX bus with
data. VPX is only good to 20
gigabits per channel and then
it runs out of steam. Right
now Im at 10 gigabits per
channel. Theres technology available for us to go faster but
the limit is 20 gigabits and then you have to go to optical.
Northwest.
It takes 250 pounds of
force to insert a VPX
card into the backplane.
As thick as a 20-layer
backplane is, it would
bow like a credit card.
EECatalog
INDUSTRY RESOURCES
Online&OfflineVME&VPXResources
Websites and Blogs
Your guide to the most essential news,
blogs, videos and other essential con-
tent for VME, VPX and VXS system
engineers
www.vita.com
VITA is the international standards
organization for VME and related
technologies and is the rst stop for
information.
www.op-comp.com
VITA is also providing guidance in
the formation of OpComp, a technical
forum to discuss optical computing
technologies for critical embedded com-
puting systems. A forum event is being
planned for 2011. .
http://www.
iccmedia-vcon.com/conference/
technical-trends-vme-technologies
Tis FREE virtual conference does
not purely focus on the traditional
VMEbus market, but will discuss
advanced technologies and hot
topics too.
www.vdcresearch.com
VDC Research provides custom and
standard research reports on embedded
markets and technologies.
www.emsoft.org
Embedded Systems Week brings
together conferences, tutorials, and
workshops centered on various aspects
of embedded systems research and
development.
Events
Te Aerospace and Defense Manu-
facturing Summit
February 9-11, 2011 Hollywood, FL
www.aerospacedefensesummit.com
Embedded Systems Conference
May 2-5, 2011 Silicon Valley.
http://esc-sv09.techinsightsevents.com/
6th International Conference
on Embedded and Multimedia
Computing (EMC-11)
August 11-13, 2011 - Enshi, China
http://grid.hust.edu.cn/EMC2011/
Embedded Systems Conference
Boston 2011, registration will open
April 4
http://esc-boston.techinsightsevents.com/
www.rtecc.com
Real-Time Embedded & Computing
Conference (RTECC) oers one-day
embedded computing events in cities
worldwide.
AeroCon
February 8-10, 2011 Aneheim;
March 16-17, 2011 Orlando;
September 20-22, 2011 Chicago;
March 14-15, 2012 Forth Worth
http://www.aeroconshows.com
MILCOM 2011
November 7-10, 2011 - Baltimore, MD
www.milcom.org
RTECC
TRANSPORTING
ENGINEERS
INTO THE WORLD
OF EMBEDDED
ARE YOU BEING LEFT BEHIND?
UPCOMING
LOCATIONS
Santa Clara
1/27/11
Huntsville, AL
2/15/11
Melbourne, FL
2/17/11
Can you afford to miss it? FREE admission, lunch,
parking and prize drawing entries at each event.
RTECC is your best opportunity to discover a new
world of possibilities within the embedded market.
Market-revealing keynote speakers
Technically focused embedded
seminars and workshops
Vendors demonstrating
newest technologies
Network with the
brightest engineers
ANNOUNCING
Distinguished Speaker @ RTECC
Don't Miss this Keynote...
Santa Clara - January 27th
David Francis Doody, Lead Engineer
Realtime Flight Operations, JPL
www.RTECC.com
Register for a FREE
Guest Pass Today!
www.eecatalog.com/vme Chips and Cores 25
CONTACT INFORMATION
LeCroy Corporation
V Zero Time Search provides a fast way to search large
traces for specic protocol terms.
V Cong space can be displayed in its entirety so that
driver registers can be veried.
V Test Arcs in the exerciser let PCie 3.0 devices to be
tested at any speed and link width.
TECHNICAL SPECS
V Analyzer
Lanes supported: X1,x2,x4,x8,x16
Speeds: 2.5GT/s, 5GT/s and 8GTs
Probes/Interposers: active and passive PCIe slot,
VPX, XMC, AMC, expresscard, expressmodule,
minicard, MidBus, multi-lead, and others.
Form factor: Card, Chassis
V Exerciser
Lanes supported: X1,x2,x4,x8,x16
Speeds: 2.5GT/s, 5GT/s, 8GT/s
Emulation: root complex and endpoint emulation
V Protocol Test Card
Speeds: 2.5GT/s and 5GT/s operation
Tests: Add-in-card test
BIOS Platform Test
Single Root IO Virtualization Test
APPLICATION AREAS
Mezzanine Boards, Add-in Cards, Host Carrier Systems,
System Boards, Chips
LeCroys PCI Express
Protocol
Analysis and Test Tools
Compatible Operating Systems: Windows 7/XP/Vista
Specication Compliance: PCI Express Standards: 1.1, 2.0, and 3.0
Whether you are a test engineer or rmware developer,
LeCroys Protocol Analyzers will help you quickly iden-
tify, troubleshoot and solve all your protocol problems.
LeCroy works closely with industry standards groups such
as the PCI-SIG, PICMG, VITA and the Intel Embedded
Communication Alliance to help developers rapidly bring
to market high performance and reliable PCI Express pro-
tocol test solutions.
LeCroys products include a wide range of probe con-
nections to support VPX, XMC, AMC, ATCA, microTCA,
Express Card, MiniCard, ExpressModule, HP Blade Server
Modules, PCIe external cable, MidBus connectors and
exible mult-lead probes for PCIe 1.0a, 1.1(Gen1 at
2.5GT/s) , PCIe 2.0(Gen 2 at 5 GT/s) and PCIe 3.0(Gen
3 at 8 GT/s).
The high performance SummitTM T3-16 Protocol Analyzer
features the new PCIe extensions for NVMHCI 1.0(SSD
devices), SR-IOV, MR-IOV, and in-band logic analysis.
LeCroy offers a complete range of protocol test solutions,
including analyzers, exercisers, protocol test cards, and
physical layer testing tools that are certied by the PCI-
SIG for ensuring compliance and compatibility with PCI
Express specications.
FEATURES & BENEFITS
V One button protocol error check. Lists all protocol errors
found in a trace. Great starting point for beginning a
debug session.
V Flow control screen that quickly shows credit balances
for root complex and endpoint performance bottlenecks.
Easily nd out why your add-in card is underperforming
on its benchmarks.
V LTSSM state view screen that accurately shows power
state transitions with hyperlinks to drill down to more
detail. Helps identify issues when endpoints go into and
out of low power states.
V Full power management state tracking with LeCroys
Interposer technology. Prevents loosing the trace when
the system goes into electrical idle.
V LeCroys Data View shows only the necessary protocol
handshaking ack/naks so you dont have to be a protocol
expert to understand if root complexes and endpoints
are communicating properly.
V Real Time Statistics puts the analyzer into a monitoring
mode showing rates for any user term chosen. Good for
showing performance and bus utilization of the DUT.
LeCroy Corporation
3385 Scott Blvd.
Santa Clara, CA, 95054
USA
1 800 909-7211 Toll Free
1 408 727-6622 Fax
[email protected]
http://www.lecroy.com
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26 Hardware Engineers Guide to VME, VPX & VXS 2011
CONTACT INFORMATION
Elma Bustronic
What is OpenVPX?
VME bus Variant: VPX
Compatible Architecture: VPX, VPX-REDI
OpenVPX has opened up new denitions for VPX back-
planes and systems. This includes dened Module Proles,
Slot Proles, backplane & chassis congurations, sec-
ondary expansion fabrics and control planes, and higher
speed fabric options.
The VPX Modules and Slots across the backplanes have
been given denitions so that similar Modules will work
within certain Slot congurations. The backplane Congu-
rations have been dened to show the collection of Slot
proles it entails, including information on the data rate,
routing topology, and fabric used. Now, the integrator can
determine that a daughter card Module from X company
can be used in the same backplane slot as Y companys,
when both Module Proles specify the same Slot Prole.
TECHNICAL SPECS
V The backplane slot prole table describes the height, type
of slot (centralized, distributed or hybrid), the pitch, RTM
connector, the corresponding payload and switch cards
that plug in, and the control and dataplane data rates.
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CONTACT INFORMATION
Elma Bustronic
44350 Grimmer Blvd
Fremont, CA 94538
USA
[email protected]
www.bustronic.com
VME, VPX & VXS ONLINE
Explore...
Directory of leading PCI Express solution
providers
Top Stories and News
White Papers
Expert Opinions (Blogs)
Exclusive Videos
Valuable Articles
Ask the Experts
Sign up for the quarterly
VME, VPX & VXS E-Product Alert
www.eecatalog.com/vme Hardware 27
CONTACT INFORMATION
10 Mupac Drive
Brockton, MA 02301
USA
800.926.8722 Toll Free
508.588.6110 Telephone
508.588.0498 Fax
www.sie-cs.com
TECHNICAL SPECS
V J1: 10 fat pipes/high-speed differential channels
V J2: 16 fat pipes/high-speed differential channels
V J2: 20 single-ended signals
AVAILABILITY
Now
APPLICATION AREAS
Military/Aerospace, Industrial, Transportation
VPX Backplanes
VITA 46/48/65 Backplanes
SIE Computing Solutions VPX backplanes are designed
to the latest VITA 46, 48, 65 and OPEN VPX standards.
The 5-slot I/O PLUS(TM) 3U VPX Full Mesh Backplane is
designed for a wide array of VPX applications. The highly
congurable backplane offers high-bandwidth in a com-
pact size and provides greater I/O exibility through I/O
PLUS(TM), an innovative use of congurable I/O daughter
cards to accommodate an array of VPX applications.
FEATURES & BENEFITS
V 5 slot full mesh
V 2 dedicated I/O daughter card slots
V Over 200 watts per slot
V 28 layer board
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CONTACT INFORMATION
Elma Electronic
Elma Electronic
44350 Grimmer Blvd
Fremont, CA 94538
USA
[email protected]
www.elma.com
VPX/VXS Handles & Panels
VME bus Variant: VPX and VXS
Elma offers highly ergonomic latching handles for the
higher insertion forces of VPX and VXS systems. Elmas
VPX handles and panel solutions come in 1.0, 0.85, and
0.80 widths for the various card sizes of the architecture.
The VPX specication calls for the handle to be slightly
offset from typical IEEE handle/panel placement. The
handles feature Elmas two-step latching process and are
highly ergonomic. Elma also offers long versions of its
IEEE and low prole VPX handles for increased leverage.
FEATURES & BENEFITS
V Designed for VXS and VPX systems. Offset formats
specic to VPX designs available.
V Highly ergonomic, in IEEE or low-prole styles.
V Two-step latching process. Pushbutton activates
optional microswitch telling board ready to plug/unplug.
V Panels feature various widths for VPX board pitch
(.80, .85 and 1.0). 3U, 6U, and custom heights.
V Panels are front anodized for scratch-resistance and
back alodined for electrical continuity.
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CONTACT INFORMATION
CONTACT INFORMATION
Tyco Electronics
Tyco Electronics
PO Box 3608
MS 38-55
Harrisburg, PA 17105
United States
1-800-522-6752 Toll Free
1-717-986-7777 Telephone
1-717-986-7575 Fax
[email protected]
www.TheFutureUnleashed.com
Fortis Zd Connector
Tyco Electronics advanced FORTIS ZD high-speed
backplane connector is designed for military and
commercial aerospace applications. As demands on
systems for real-time intelligence intensifies, the
importance of high performance interconnection
becomes critical. Tyco Electronics set out to design
a new connector system that supports increasing
bandwidth requirements in a ruggedized format to
withstand the increased shock and vibration require-
ments of emerging military applications.
FEATURES
V Allows 10 Gb/s+ data rates
V Extreme mechanical and electrical performance for
the most demanding applications
V Modular design allows for user congurability and
modular evolution
V Three shell varieties for application versatility
V Mini-Box contact system provides 4 points of contact
for ultra reliability
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Tyco Electronics
Tyco Electronics
PO Box 3608
MS 38-55
Harrisburg, PA 17105
United States
1-800-522-6752 Toll Free
1-717-986-7777 Telephone
1-717-986-7575 Fax
[email protected]
www.te.com/ADM
Mezalok Connector
Compatible Architecture: XMC
Tyco Electronics Mezalok connector is a high-reliability
mezzanine connector that more than doubles the speed
and durability of competing technology, making it the
most viable option for todays military and commercial
aerospace applications.
The need for embedded electronic systems in rugged plat-
forms has been continually increasing and driving more
stringent requirements for board-to-board connectivity.
TE engineers responded to these needs by developing
a super-fast, super-durable and super-redundant mezza-
nine connector ideal for extreme environments.
FEATURES
V 60 and 114 positions
V Mini-Box contact system provides 4 points of contact
for ultra reliability
V LCP plastic housings offer superior thermal stability
and are low-outgassing
V 114 position footprint compatible to XMC footprint
V 500 mating cycles durability
CONTACT INFORMATION
CES - Creative Electronic Systems SA
TECHNICAL SPECS
V 3U OpenVPX (VITA 65) single board computer with a
Freescale QorIQ P4 processor
V Onboard interconnect with crosspoint switch for
programmable payload prole conguration (PCIex4
Gen2, sRIOx4, 1GE, 10GE)
V Ultra-high-speed advanced memory subsystem (Dual
1, 2 or 4 GBytes DDR3, as well as NAND, NOR and
NVRAM)
V One onboard XMC slot (VITA 42.2, 42.3, 42.6)
V Integrated board management controller and debug-
ging environment
RIOV-2478
VME bus Variant: OpenVPX
Compatible Operating Systems: Linux, VxWorks
Compatible Architecture: 3U OpenVPX, XMC
The RIOV-2478 combines a multi-core processor with
modern interconnect high-speed links and an onboard
crosspoint switch. It features a QorIQ P4080 processor
designed for combined control and dataplane processing.
The 8-core processor design is well suited for applica-
tions, which are highly compute-intensive, I/O intensive
or both. The crosspoint permits exibility of the payload
prole conguration in accordance to OpenVPX, therefore
allowing support of PCIe, sRIO and 10GE over VPX and
XMC. A Board Management Controller is also integrated,
providing high-speed system status monitoring, logging
and dynamic reload (processor and FPGA) functions in
real-time for exceptional mission back-up strategies for
the entire system.
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CONTACT INFORMATION
CES - Creative Electronic
Systems SA
38 avenue Eugene-Lance
Grand Lancy, 1212
Switzerland
00.41.22.884.51.00 Telephone
00.41.22.794.74.30 Fax
[email protected]
http://www.ces.ch
Military & Aerospace ONLINE
Explore...
Directory of leading Military & Aerospace
Solutions
Top Stories and News
White Papers
Expert Opinions (Blogs)
Exclusive Videos
Valuable Articles
Ask the Experts
Sign up for the quarterly
Military & Aerospace E-Product Alert
www.eecatalog.com/military
CONTACT INFORMATION
Dynatem, Inc
Dynatem, Inc
23263 Madero, Suite C
Mission Viejo, CA 92691
USA
800-543-3830 Toll Free
949-855-8569 Fax
[email protected]
www.dynatem.com
TECHNICAL SPECS
V On-board PCI express SVGA Controller
V Front panel SFP+ 10 Gb copper or optical for chassis
to chassis interconnect
V Supports two fully capable PMC/XMC Sites with
PCI-X speeds of up to 133MHz and PCIe x8. Addition-
ally, each XMC site provides a 10G XAUI lane to the
on-board 24-port switch enabling an XMC card to be
part of the 10G fabric
V Available in conduction cooled versions for rugged
applications
V On board 4 GB DDR2 and 16 GB bootable Flash disk
AVAILABILITY
Now shipping
APPLICATION AREAS
Military surveillance, RADAR, data collection, high per-
formance processing
VPQ Intel Quad-Core based VPX SBC
with 24-port 10Gb ENET switch
VME bus Variant: Open VPX compatible prole MOD6-PAY-4F2T-
12.2.2.4
Compatible Operating Systems: Linux, VxWorks, Windows,
Solaris, LynxOS, QNX
Compatible Architecture: VPX, XMC, PMC
VPQ is based upon one quad-core Intel L5408 Xeon Pro-
cessor, an Intel 5100 Memory Controller Hub (MCH), and
an Intel ICH9R I/O Controller Hub (ICH), forming the cen-
tral processing backbone of the design. Up to 4 GBytes
of DDR2 SDRAM are supported with the MCH running at
up to 1066 MHz double data rate speeds.
The VPQ provides unparalleled data processing capabili-
ties. It supports two fully capable PMC/XMC Sites with
extensive User I/O. An on-board Fulcrum FM3224 24-Port
10 Gigabit Ethernet Switch provides full-mesh backplane
data-layer interconnectivity. This allows up to eight VPQ
SBCs to be integrated into a single chassis without the
use of an additional switch board. A PLX PEX8624 PCI
Express Switch provides connectivity to the XMC Sites
and an Intel 82599EB Dual 10 Gigabit Ethernet controller,
which connects to the 10 Gigabit Ethernet Switch. The
Intel 82599EB supports the IEEE 1588 Precision Time
Protocol standard allowing all node boards to be syn-
chronized in the sub-microsecond range. An 82571EB
Dual 1Gigabit Ethernet controller provides 1000Base-T or
1000Base-KX connectivity to the backplane via the VPX
P4 connector.
For convection cooled applications, the VPQ provides a
front panel SFP+ port supporting CX4 copper and Fiber
applications for chassis-to-chassis and rack-to-rack com-
munications.
On-board non-volatile storage includes a 16 GByte Solid
State Flash Drive, 16 Mbit SPI ash memory, and a 16
Mbit Firmware Hub. Four SATA, two USB, VGA, and an
RS232 or RS485 Console port complement the VPQ I/O
through the backplane or rear transition module.
FEATURES & BENEFITS
V Open VPX compatible prole MOD6-PAY-4F2T-
12.2.2.4
V IntelQuad Core L5408 Processor @ 2.13 Hz
V Support for full mesh 10 Gb XAUI interconnect up
to 8 boards on backplane (Ethernet on VPX Fabric
Connector)
V On board Fulcrum 24 port 10 Gb Ethernet XAUI
switch (also available without switch)
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CONTACT INFORMATION
2900 S. Diablo Way, Suite 190
Tempe, AZ 85282
USA
1 800 759 1107 Toll Free
1 602 438 5720 Telephone
EmbeddedComputingSales@
Emerson.com
Emerson.com/EmbeddedComputing
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FEATURES
V Extended temperature range (-40 C to +71 C)
V 2eSST VMEbus protocol enables 320MB/s transfer
rate across the VMEbus
V Board support packages available
V Product support and longevity from the leader in
VMEbus technology
Extended Temp VMEbus SBCs
The Emerson Network Power MVME4100 and MVME7100
product lines are available in extended temperature
range (-40 C to +71 C) variants and support a wide
range of operating and storage temperatures in addition
to increased tolerances for shock. This enables them to
operate in harsh environments while maintaining struc-
tural and operational integrity. In addition, both products
utilize the 2eSST VMEbus protocol which enables
320MB/s transfer rate across the VMEbus.
The MVME4100 features the Freescale 8548E processor
with industry-leading storage options and 512KB non-vol-
atile MRAM It also has dual PMC and up to four optional
XMC sites. The MVME7100 utilizes the system-on-chip
MPC864xD processor, which provides power/thermal,
reliability and lifecycle advantages over alternative
architectures.
OEMs in the industrial automation, medical, defense and
aerospace markets can continue to keep their VMEbus
infrastructures in tact while improving performance and
extending lifecycles with Emerson VME products.
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Industry-leading VME
Support and Longevity
Emerson Network Power continues to provide industry-
leading support and product longevity for its VME
single-board computer product lines. VMEbus tech-
nology continues to be employed by OEMs around the
world in a variety of highly demanding industrial auto-
mation, medical, defense and aerospace applications.
The MVME6100 is designed with the Tundra Tsi148 VMEbus
interface chip enabling 2eSST performance (enabling the
VMEbus to run at a bandwidth of 320MB/s).
The MVME3100 utilizes the system-on-chip MPC8540
processor, which offers power/thermal, reliability and
lifecycle advantages over alternative architectures, and
2eSST VMEbus interface.
The MVME5100/5110 uses the PowerPlus II Architecture
to support full PCI throughput without starving the pro-
cessor from its memory.
The MVME5500 features the MPC7457 processor which
is ideal for data intensive applications by providing bal-
anced performance from the processor, memory, dual
independent local buses and I/O subsystems.
FEATURES
V High performance, rugged and modular construction
V Broad industry support and use
V Continued technology enhancements
V Supported by a range of compatible hardware and
software
CONTACT INFORMATION
2900 S. Diablo Way, Suite 190
Tempe, AZ 85282
USA
1 800 759 1107 Toll Free
1 602 438 5720 Telephone
EmbeddedComputingSales@
Emerson.com
Emerson.com/EmbeddedComputing
FEATURES
V Compliant with the VITA 41.3 VXS specication
V Dual-core Intel
Core i7 processor (1.06 ULV or 2.0

GHz LV)
V Intel
Ibex-M Peak Platform Controller Hub (PCH)

V 4GB or 8GB ECC-protected DDR3-800/1066 memory
V 4GB eUSB ash module; 256K non-volatile F-RAM
(NVRAM)
V Optional HD & mounting kit
iVME7210 Dual-Core VMEbus SBC
The iVME7210, with Intel
Core i7 processor variants and

the Mobile Intel
QM57 Express chipset, is designed for a

range of industrial, medical and military/aerospace appli-
cations including robotics, image processing, radar/sonar,
C4ISR and signal intelligence. The dual-core processor
has integrated memory and graphics controller. On-board
memory includes up to 8GB DDR3 soldered memory and
256KB non-volatile F-RAM, which does not require batteries
or periodic refreshes and offers much greater read/write
cycles and faster performance than ash.
The iVME7210 has additional storage of 64Mb of SPI boot
ash, up to 4GB of embedded USB ash, and an 80GB
SATA hard drive accessory option. Connectivity includes
four GbE ports, up to ve USB 2.0 ports, ve serial ports,
two SATA ports and dual XMC sites or one XMC site with
DVI port.
P0 connectivity includes dual GbE, one USB 2.0 and two
SATA ports. Compatible operating systems include Wind
River VxWorks, Linux, and Green Hills Integrity.
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V Three on-board Gigabit Ethernet interfaces
V USB 2.0 port, ve serial ports and one PMC/XMC site
V Extended temperature (-40 C to +71 C) and rugged
variants
V Hard drive mounting kit and optional rear transition
module available
MVME2500 VME64 Processor Board
The Emerson Network Power MVME2500 SBC features the
latest Freescale QorIQ processors -- the single-core P2010
and dual-core P2020. The e500 v2 core QorIQ processor
uses 45 nanometer technology which delivers an industry-
leading performance-to-power ratio with single-core or
dual-core frequencies up to 1.2 GHz at less than 8W.
On-board memory includes up to 2GB DDR3 memory
and 512KB non-volatile MRAM making it ideal for critical
non-volatile data storage, data logs, dynamic program
updates, and dynamic security. Connectivity includes
three Gigabit Ethernet ports, one USB 2.0 port, ve
serial ports, one internal SATA port and one XMC site.
A hard drive mounting kit is available for SATA rotating
or solid-state hard drives. The extended temperature
models feature an operating temperature range of
-40 C to +71 C and acceptable storage temperatures
have been increased to safely accommodate environ-
ments from -50 C to +100 C.
FEATURES
V 800 MHz or 1.2 GHz Freescale QorIQ P2010 and
P2020 processors
V 1GB or 2GB DDR3-800, soldered down
CONTACT INFORMATION
Kontron
Kontron
14118 Stowe Drive
Poway, CA 92064
Toll Free 888.294.4558
[email protected]
www.kontron.com
programs, applications and emerging technologies. This
allows us to engage with our customers and partners at
any level that works best for them.
Kontron military products cover VME, VPX and include
high performance single board computers and acces-
sories such as backplanes, mezzanine carriers and
enclosures. Turnkey development systems allow cus-
tomers to slash their development schedules.
FEATURES & BENEFITS
V Straightforward VME-VPX migration and PowerPC-
Intel Migration across product portfolio
V Turnkey development platforms for easy board evalu-
ation and software development
V Long Term Supply (LTS) gives extended lifetime
program support up to 15 years
V Standard air- and rugged conduction-cooled versions
for all products
Single Board Computers
VME bus Variant: VPX, OpenVPX, VPX-REDI, VME
Compatible Operating Systems: VxWorks, Linux, LynxOS,
Windows, ElinOS, QNX
Compatible Architecture: XMC, PMC, FMC
With over 20 years experience in VME COTS products
for rugged embedded applications, Kontron offers VME-
VPX products and services ideally suited to military
applications. Our products are designed and qualied to
MIL and ANSI/VITA standards to t the most stringent
requirements. Kontron Long Term Supply (LTS) allows
building efcient program support throughout their
extended lifetime.
Kontron is at the forefront of embedded technology for
military applications and brings together a strong set of
in-house engineering and manufacturing capabilities,
plus an array of specialized product and system designs
that can be readily adapted to meet the demands of new
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CONTACT INFORMATION
Schroff
Schroff
170 Commerce Drive
Warwick, RI 02886
USA
(401) 732-3770 Telephone
(401) 738-7988 Fax
www.schroff.us
FEATURES & BENEFITS
V Extremely rugged construction for heavy load and
seismic concerns
V Excellent EMI shielding and thermal management
performance to protect sensitive equipment and
instruments
V Flexible and versatile platform to meet your current
unique designs and future needs
V Aesthetically pleasing design that compliments
existing equipment
V An economic solution for your electronic enclosure
needs
AVAILABILITY
Available now
APPLICATION AREAS
Electronic systems, controls and power cabinets for
diagnostic imaging equipment and diagnostic instru-
mentation
Varistar - Versatile Cabinet Platform
Schroffs new Varistar cabinet Platform features a
modular, exible design and a comprehensive range
of accessories that allow it to be tailored to meet spe-
cic performance requirements in a broad range of
electronic enclosure applications including commu-
nications, general electronics, medical, and test and
measurement equipment.
Varistars innovative frame prole, constructed from a
welded, corner reinforced, roll formed steel enables it
to have a high load carrying capacity (1800 lb static). It
is designed to meet seismic requirements, in a standard
congured offering.
Varistar truly excels when it comes to managing heat
dissipation with options ranging from passive to
active to fully enclosed liquid cooled systems, and
everything in between. Varistar is able to remove up
to 20KW of heat.
Varistar is supported with a comprehensive line of
accessories including a variety of top covers, solid,
louvered, and plexiglass doors, side panels with
quick release locks and screw in options, standard
and seismic bases, telescoping and fixed shelving,
slide rails, depth members, panel slide mounts,
joining kits, casters, leveling feet, combined casters
and leveling feet, lifting eyes, tip over protection, and
a wide range of cable management including D-rings,
C channels, cable ties, and brackets as well as many
options for removing heat.
Varistar applies the same concept used in achieving
EMC performance to an IP rated gasketing system. A
UL94VO HB rated rubber gasket with adhesive tape
is used to encompass the entire frame, rubber corner
pieces then complete the gasketing seal.
With todays electronic systems and instruments using
high speed processors the need to shield components
from electromagnetic interference is critical. The med-
ical center manager needs to have components that
not only do not interfere with other electronics in the
cabinet but needs to ensure that the cabinet itself does
not radiate interference.
Additional colors, features, and accessories are avail-
able individually or combined as part of a standard
congured cabinet.
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CONTACT INFORMATION
10 Mupac Drive
Brockton, MA 02301
USA
800.926.8722 Toll Free
508.588.0498 Fax
www.sie-cs.com
716 Conduction Cooled
ATR Enclosures
VME bus Variant: VME, VME64X, VXS, VPX, OPEN VPX
716 Conduction Cooled ATR Enclosures
Engineered for strength, lightweight, and maximum
cooling in a conduction cooled environment, the 716
Series incorporates a unique frame and congurable
conducting walls that allow the ATR to be tailored to
meet a wide range of thermal requirements.
FEATURES & BENEFITS
V Expansive range of ARINC sizes
V Easily congurable for custom sizes
V Modular power supply
V AC or DC ltered inputs
TECHNICAL SPECS
V System Performance Monitoring
V Multiple Bus Architectures
V Cold Start Heaters
V Avionics Isolation Tray
V Congurable I/O Panel
AVAILABILITY
Now
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CONTACT INFORMATION
10 Mupac Drive
Brockton, MA 02301
USA
800.926.8722 Toll Free
508.588.0498 Fax
www.sie-cs.com
AVAILABILITY
Now
APPLICATION AREAS
Industrial, Transportation, Military/Aerospace
720 Liquid Cooled ATR Enclosures
VMEbus Variant: VME, VME64X, VXS, VPX, OPEN VPX
720 Liquid Cooled ATR Enclosures
Engineered to provide the ultimate in thermal cooling
performance, the 720 Series is capable of utilizing a
variety of cooling uids such as Polyalphaolen (PAO)
and Ethylene or Propylene glycol/water (EGW) or (PGW).
The conducting walls are uniquely designed for either
front or rear uid access and can be congured with a
mating avionics tray that provides a blind mate/quick dis-
connect feature. The liquid panels are also congured as
a Line Replaceable Unit (LRU) for eld upgrades.
FEATURES & BENEFITS
V Expansive range of ARINC sizes
V Easily congurable for custom sizes
V Modular power supply
V AC or DC ltered inputs
TECHNICAL SPECS
V System Performance Monitoring
V Multiple Bus Architectures
V Cold Start Heaters
V Avionics Isolation Tray
V Congurable I/O Panel
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CONTACT INFORMATION
Elma Electronic
Elma Electronic
44350 S. Grimmer Blvd.
Fremont, CA 94538
USA
215-956-1201 Fax
[email protected]
www.elma.com
TECHNICAL SPECS
V Form Factor: 6U by 4HP (single slot)
V Processor Core: MPC7448
V Two Gigabit Ethernet ports out the backplane
V Disks: Two 2 SATA ash drives
V Power: +5V @ 3.0 A
VME RAIDStor
Elmas VME RAIDStor brings conduction cooled net-
work attached storage (NAS) with RAID capability into
a single 6U slot. Suitable for a multitude of applications,
the module provides as much as a quarter terabyte of
solid-state ash per slot. Within a typical 19 chassis,
network access is available for up to 18 slots in dual
star networks; here, the VME RAIDStor is a client/server
model for highly reliable storage access in todays net-
work centric applications.
The VME RAIDStor is designed to use a multi-tasking
kernel providing network services via TCP/IP. Network
Attached Storage is supported through NFS. Logical
drives are available to clients via NFS export.
FEATURES & BENEFITS
V A much smaller footprint than conventional box level
RAID storage
V Extended temperature range from 40 C to +85 C
V Congurable to RAID levels 0, 1 and 5
V Automatic data re-sync with no impact to the top
level application
V Heartbeat support for seamless fail over
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CONTACT INFORMATION
TECHNICAL SPECS
V 2.16 GHz Intel Core 2 Duo processor
V NVIDIA G73 graphics processor
V Multiple video standards (DVI, VGA, TV)
V Dual channel video output
V Up to 64 GBytes solid state disk
MAGIC1
Compatible Operating Systems: BIOS to support Windows XP,
Linux, VxWorks, OpenGL, DirectX
Using the latest in desktop performance technology,
GE Intelligent Platforms MAGIC1 Rugged Display Com-
puter delivers unprecedented graphics performance
demanded by military and aerospace customers.
Combining the processing power of the Intel Core 2 Duo
with the NVIDIA G73, connected together with 16-lane
PCI Express, the MAGIC1 Rugged Display Processor is
capable of driving the industrys most demanding visual
applications such as embedded training, digital map-
ping, and terrain visualization.
The processing node consists of an Intel T7400 Core 2 Duo
CPU running at 2.16 GHz with 4 Mbytes of L2 cache. The
graphics processing node is based on the dual channel
NVIDIA G73 graphics processing unit, as featured on the
NVIDIA GeForce 7600GT, and incorporates 256 Mbytes
of GDDR3 SDRAM arranged in two banks.
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FEATURES
V High-performance CPU and wide OS support
V Latest 96 core GPU with CUDA/OpenCL/OpenGL
V Fast interprocessor communication and I/O
V Scalable computing platform
V Wide deployed computing application spaceideal
for SWaP-constrained applications
IPN250
VME bus Variant: OpenVPX
Compatible Operating Systems: BIOS, Linux, Windows
The IPN250 is the worlds rst single slot, 6U OpenVPX
GPGPU COTS multiprocessor for rugged Mil/Aero applica-
tions. This innovative processor delivers unprecedented
levels of computing performance for size, weight and
power (SWaP)-constrained platforms at lower cost, cre-
ating new application opportunities that were previously
unthinkable. It enables system integrators to deploy a
single COTS module where previously multiple dispa-
rate modules would have been requiredundertaking,
for example, front end processing of sensor-acquired
data, digital signal processing, backend processing
and graphics/video processing while delivering high-
resolution, mission-critical data more rapidly than has
previously been possible.
CONTACT INFORMATION
2500 Austin Drive
USA
1-800-433-2682 Toll Free
1-800-433-2682 Telephone
www.ge-ip.com
2500 Austin Drive
USA
1-800-433-2682 Toll Free
1-800-433-2682 Telephone
www.ge-ip.com
Browse the EECatalog
White Paper Library
www.EECatalog.com
ABSTRACT:
&ommunications networks are very different from other kinds of computing
applications. Networks require both very high reliability and very high
performance. Not only must they process large volumes of data at high speed,
but they must do so while limiting their downtime to minutes per year. Network
failures can have huge economic consequences and can even result in the loss
of life. $dditionally, in this post-9/11 world, failure also has a national security
dimension. On top of all this, providers are under pressure to lower costs and
become more efficient in their operations.
7his technical whitepaper introduces MontaVista Linux &arrier Grade Edition
what it is, how it evolved, and how it provides a foundation for developing and
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Accelerate Your Projects into the Future
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