pcm1690
pcm1690
pcm1690
PCM1690
Burr-Brown Audio SBAS448B – OCTOBER 2008 – REVISED AUGUST 2015
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PCM1690
SBAS448B – OCTOBER 2008 – REVISED AUGUST 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 6.13 Typical Characteristics .......................................... 12
2 Applications ........................................................... 1 7 Detailed Description ............................................ 17
3 Description ............................................................. 1 7.1 Overview ................................................................. 17
4 Revision History..................................................... 2 7.2 Functional Block Diagram ....................................... 17
7.3 Feature Description................................................. 18
5 Pin Configuration and Functions ......................... 3
7.4 Device Functional Modes........................................ 24
6 Specifications......................................................... 5
7.5 Register Maps ......................................................... 28
6.1 Absolute Maximum Ratings ..................................... 5
6.2 ESD Ratings.............................................................. 5 8 Application and Implementation ........................ 35
8.1 Application Information............................................ 35
6.3 Recommended Operating Conditions....................... 5
8.2 Typical Application ................................................. 36
6.4 Thermal Information .................................................. 6
6.5 Electrical Characteristics: Digital Input/Output.......... 6 9 Power Supply Recommendations...................... 39
6.6 Electrical Characteristics: DAC ................................. 7 10 Layout................................................................... 39
6.7 Electrical Characteristics: Power-Supply 10.1 Layout Guidelines ................................................. 39
Requirements............................................................. 8 10.2 Layout Example .................................................... 39
6.8 System Clock Timing Requirements......................... 8 11 Device and Documentation Support ................. 40
6.9 Audio Interface Timing Requirements for Left- 11.1 Device Support...................................................... 40
Justified, Right-Justified, and I2S Data Formats........ 9 11.2 Documentation Support ........................................ 40
6.10 Audio Interface Timing Requirements for DSP and 11.3 Community Resources.......................................... 40
TDM Data Formats .................................................... 9
11.4 Trademarks ........................................................... 40
6.11 Three-Wire Serial Control Interface Timing
Requirements............................................................. 9 11.5 Electrostatic Discharge Caution ............................ 40
6.12 SCL and SDA Control Interface Timing 11.6 Glossary ................................................................ 40
Requirements............................................................. 9 12 Mechanical, Packaging, and Orderable
Information ........................................................... 40
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
DCA Package
48-Pin HTSSOP With PowerPAD
Top View
RSV2 1 48 RSV2
RSV1 2 47 VCC2
RSV2 3 46 AGND2
RSV1 4 45 RSV2
RSV2 5 44 VOUT1-
LRCK 6 43 VOUT1+
BCK 7 42 VOUT2-
DIN1 8 41 VOUT2+
DIN2 9 40 VOUT3-
DIN3 10 39 VOUT3+
DIN4 11 38 VOUT4-
SCKI 14 35 VOUT5+
RST 15 34 VOUT6-
ZERO1 16 33 VOUT6+
ZERO2 17 32 VOUT7-
AMUTEI 18 31 VOUT7+
AMUTEO 19 30 VOUT8-
MD/SDA/DEMP 20 29 VOUT8+
MC/SCL/FMT 21 28 RSV2
MS/ADR0/RSV 22 27 AGND1
TEST/ADR1/RSV 23 26 VCOM
MODE 24 25 VCC1
Pin Functions
PIN 5-V
I/O PULLDOWN DESCRIPTION
NAME PIN TOLERANT
RSV2 1 — — — Reserved, tied to analog ground
RSV1 2 — — — Reserved, left open
RSV2 3 — — — Reserved, tied to analog ground
RSV1 4 — — — Reserved, left open
RSV2 5 — — — Reserved, tied to analog ground
LRCK 6 I Yes No Audio data word clock input
BCK 7 I Yes No Audio data bit clock input
DIN1 8 I No No Audio data input for DAC1 and DAC2
DIN2 9 I No No Audio data input for DAC3 and DAC4
DIN3 10 I No No Audio data input for DAC5 and DAC6
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted). (1)
PARAMETER MIN MAX UNIT
VCC1, VCC2 –0.3 6.5 V
Supply voltage
VDD –0.3 4 V
Ground voltage
AGND1, AGND2, DGND –0.1 0.1 V
differences
Supply voltage
VCC1, VCC2 –0.1 0.1 V
differences
RST, TEST, MS, MC, MD, SCKI, AMUTEI, AMUTEO –0.3 6.5 V
Digital input voltage (VDD + 0.3) <
BCK, LRCK, DIN1/2/3/4, MODE, ZERO1, ZERO2 –0.3 V
4
(VCC + 0.3) <
Analog input voltage VCOM, VOUT1–8± –0.3 V
6.5
Input current (all pins except supplies) –10 10 mA
Ambient temperature
–40 125 °C
under bias
Junction temperature 150 °C
Lead temperature (soldering, 5s) 260 °C
Package temperature (IR reflow, peak) 260 °C
Storage temperature Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) BCK and LRCK (Schmitt trigger input with 50-kΩ typical internal pull-down resistor).
(2) DIN1/2/3/4 (Schmitt trigger input).
(3) SCKI, TEST/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI (Schmitt trigger input, 5-V tolerant).
(4) RST and MS/ADR0/RSV (Schmitt trigger input with 50-kΩ typical internal pull-down resistor, 5-V tolerant).
(5) ZERO1 and ZERO2.
(6) SDA (I2C mode, open-drain low output) and AMUTEO (open-drain low output).
(1) In differential mode at VOUTx± pin, fOUT = 1 kHz, using Audio Precision System II, Average mode with 20-kHz LPF and 400-Hz HPF.
(2) fS = 48 kHz: SCKI = 512 fS (single), fS = 96 kHz : SCKI = 256 fS (dual), fS = 192 kHz : SCKI = 128 fS (quad).
(3) Allowable minimum input resistance of differential to single-ended converter with D to S Gain = G is calculated as (1 + 2G)/(1 + G) × 5k
for AC-coupled and (1+ 0.9G)/(1 + G) × 15k for DC-coupled connection; refer to Figure 39 and Figure 40 of the Application Information
section.
6.9 Audio Interface Timing Requirements for Left-Justified, Right-Justified, and I2S Data
Formats
(see Figure 2)
MIN MAX UNIT
tBCY BCK cycle time 75 ns
tBCH BCK pulse width high 35 ns
tBCL BCK pulse width low 35 ns
tLRS LRCK set-up time to BCK rising edge 10 ns
tLRH LRCK hold time to BCK rising edge 10 ns
tDIS DIN1/2/3/4 set-up time to BCK rising edge 10 ns
tDIH DIN1/2/3/4 hold time to BCK rising edge 10 ns
6.10 Audio Interface Timing Requirements for DSP and TDM Data Formats
(see Figure 3)
MIN MAX UNIT
tBCY BCK cycle time 40 ns
tBCH BCK pulse width high 15 ns
tBCL BCK pulse width low 15 ns
LRCK pulse width high (DSP format) tBCY tBCY
tLRW
LRCK pulse width high (TDM format) tBCY 1/fS – tBCY
tLRS LRCK set-up time to BCK rising edge 10 ns
tLRH LRCK hold time to BCK rising edge 10 ns
tDIS DIN1/2/3/4 set-up time to BCK rising edge 10 ns
tDIH DIN1/2/3/4 hold time to BCK rising edge 10 ns
tSCH
High 2.0 V
System Clock
(SCKI)
Low 0.8 V
tSCL tSCY
tBCH tBCL
BCK
1.4 V
(Input)
tBCY tLRS
tLRH
LRCK
1.4 V
(Input)
tDIS tDIH
DIN1/2/3/4 1.4 V
Figure 2. Audio Interface Timing Requirements for Left-Justified, Right-Justified, and I 2S Data Formats
tBCH tBCL
BCK
1.4 V
(Input)
tBCY tLRS
tLRH
LRCK
1.4 V
(Input)
tLRW
tDIS tDIH
DIN1/2/3/4 1.4 V
Figure 3. Audio Interface Timing Requirements for DSP and TDM Data Formats
tMHH
MS 1.4 V
MC 1.4 V
tMCY
tMDS
tMDH
Repeated
START START STOP
tD-HD
tBUF tD-SU tSDA-R tP-SU
SDA
tSDA-F
tSCL-R tS-HD
tLOW
SCL
tSCL-F tS-SU
tHI
tS-HD
0.010 0
Sharp Sharp
0.008 Slow Slow
-20
0.006
0.004 -40
Amplitude (dB)
Amplitude (dB)
0.002 -60
0
-80
-0.002
-0.004 -100
-0.006
-120
-0.008
-0.010 -140
0 0.1 0.2 0.3 0.4 0.5 0 1 2 3 4
Normalized Frequency (fS) Normalized Frequency (fS)
0.010 0
Sharp Sharp
0.008 Slow Slow
-20
0.006
0.004 -40
Amplitude (dB)
Amplitude (dB)
0.002 -60
0
-80
-0.002
-0.004 -100
-0.006
-120
-0.008
-0.010 -140
0 0.1 0.2 0.3 0.4 0.5 0 0.5 1.0 1.5 2.0
Normalized Frequency (fS) Normalized Frequency (fS)
Amplitude (dB)
0.002
0
-0.002
-0.004
-0.006
-0.008
-0.010
0 0.1 0.2 0.3 0.4 0.5
Normalized Frequency (fS)
0 0
-1 -1
-2 -2
-3 -3
Amplitude (dB)
Amplitude (dB)
-4 -4
-5 -5
-6 -6
-7 -7
-8 -8
-9 -9
-10 -10
0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 8 10 12 14 16 18 20
Frequency (kHz) Frequency (kHz)
fS = 48 kHz fS = 44.1 kHz
Amplitude (dB)
-4 -20
-5
-6 -30
-7
-8 -40
-9
-10 -50
0 2 4 6 8 10 12 14 1k 10k 100k 1M 10M
Frequency (kHz) Frequency (Hz)
fS = 32 kHz
-90 118
SNR
-96 112
-98 110
-100 108
-102 106
-40 -15 10 35 60 85 -40 -15 10 35 60 85
Temperature (°C) Temperature (°C)
Figure 15. THD+N vs Temperature Figure 16. Dynamic Range and SNR vs Temperature
-92 116
Dynamic Range
-94 114
THD+N (dB)
SNR
-96 112
-98 110
-100 108
-102 106
4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.25 5.50
Supply Voltage (V) Supply Voltage (V)
Figure 17. THD+N vs Supply Voltage Figure 18. Dynamic Range and SNR vs Supply Voltage
0 0
-20 -20
-40 -40
Amplitude (dB)
Amplitude (dB)
-60 -60
-80 -80
-100 -100
-120 -120
-140 -140
-160 -160
0 5 10 15 20 0 5 10 15 20
Frequency (kHz) Frequency (kHz)
0 dB, N = 32768 –60 dB, N = 32768
-20
-40
Amplitude (dB)
-60
-80
-100
-120
-140
-160
0 5 10 15 20
Frequency (kHz)
BPZ, N = 32768
7 Detailed Description
7.1 Overview
The PCM1690 is a high-performance, multi-channel DAC targeted for consumer audio applications such as Blu-
ray DVD players and HD DVD players, as well as home multi-channel audio applications (such as home theaters
and A/V receivers). The PCM1690 consists of an eight-channel DAC. The DAC output type is fixed with a
differential configuration. The PCM1690 supports 16-/20-/24-/32-bit linear PCM input data in I2S- and left-justified
audio formats, and 24-bit linear PCM input data in right-justified, DSP, and TDM formats for various sampling
frequencies from 8 kHz to 192 kHz. The TDM format is useful for saving bus line interface numbers for multi-
channel audio data communication between the DAC and a digital audio processor. The PCM1690 offers three
modes for device control: two-wire I2C software, three-wire SPI software, and hardware modes.
• Audio data interface formats: I2S, LJ, RJ, DSP, TDM
• Audio data word length: 16, 20, 24, 32 Bits
• Audio data format: MSB first, twos complement
DIN1 VOUT1+
DIN2 DAC
DIN3 VOUT1-
Audio Interface
DIN4
VOUT2+
BCK
DAC
LRCK
VOUT2-
VOUT3+
SCK Manager DAC
SCKI
VOUT3-
TEST/ADR1/RSV VOUT4+
MS/ADR0/RSV DAC
MC/SCL/FMT Digital Filter VOUT4-
MD/SDA/DEMP and
MODE Control Interface Volume VOUT5+
ZERO1
2
(SPI/I C/HW) DAC
ZERO2 VOUT5-
AMUTEI
VOUT6+
AMUTEO
DAC
RST
VOUT6-
VCC1 VOUT7+
AGND1 DAC
VCC2 VOUT7-
Power Supply and
AGND2
Common Voltage
VDD VOUT8+
DGND DAC
VCOM VOUT8-
Table 3. DAC Filter OSR, Modulator OSR, and Noise-Free Shaped Bandwidth for Each Sampling Mode
SAMPLING NOISE-FREE SHAPED BANDWIDTH (kHz) (1)
SYSTEM CLOCK
MODE DIGITAL FILTER MODULATOR
FREQUENCY
REGISTER fS = 48 kHz fS = 192 kHz OSR OSR
(xfS)
SETTING fS = 96 kHz
512, 768, 1152 40 N/A N/A ×8 x128
Auto 256, 384 20 40 N/A x8 x64
128, 192 (2) 10 20 40 x4 x32
512, 768, 1152 40 N/A N/A x8 x128
Single 256, 384 40 N/A N/A x8 x128
128, 192 (2) 20 N/A N/A x4 x64
256, 384 20 40 N/A x8 x64
Dual
128, 192 (2) 20 40 N/A x4 x64
Quad 128, 192 (2) 10 20 40 x4 x32
0
DSM_Single DF_Single
-20
DSM_Dual DF_Dual
-40 DSM_Quad DF_Quad
-60
Amplitude (dB)
-80
-100
-120
-140
-160
-180
-200
0 0.5 1.0 1.5 2.0
Normalized Frequency (fS)
SCKI,
BCK, Synchronous Clocks
LRCK
RST
3846 ´ SCKI
VOUT1± to
0.5 ´ VCC
VOUT8± VCOM
(0.5 ´ VCC1)
SCKI,
BCK, Synchronous Clocks Synchronous Clocks
LRCK
3846 ´ SCKI
VOUT1± to
0.5 ´ VCC
VOUT8±
MS
MC
(1)
MD X '0' ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 D7 D6 D5 D4 D3 D2 D1 D0 X X 0 ADR6
SDA
SCL 1 to 7 8 9 1 to 8 9 1 to 8 9 9
St Sp
(1) (2) (3)
Slave Address R/W ACK DATA ACK DATA ACK ACK
Start Stop
Condition Condition
(1) R/W: Read operation if '1'; write operation otherwise.
(2) ACK: Acknowledgment of a byte if '0', not Acknowledgment of a byte if '1'.
(3) DATA: Eight bits (byte); details are described in the Write Operation and Read Operation sections.
Transmitter M M M S M S M S M S S M
Data Type St Slave Address W ACK Reg Address ACK Write Data 1 ACK Write Data 2 ACK ACK Sp
NOTE: M = Master device, S = Slave device, St = Start condition, W = Write, ACK = Acknowledge, and Sp = Stop
condition.
Transmitter M M M S M S M M M S S M M
Data Type St Slave Address W ACK Reg Address ACK Sr Slave Address R ACK Read Data NACK Sp
NOTE: M = Master device, S = Slave device, St = Start condition, Sr = Repeated start condition, W = Write, R =
Read, ACK = Acknowledge, NACK = Not acknowledge, and Sp = Stop condition.
NOTE: The slave address after the repeated start condition must be the same as the previous slave address.
Table 5. Audio Data Interface Formats and Sampling Rate, Bit Clock, and System Clock Restrictions
CONTROL MAX LRCK
FORMAT DATA BITS SCKI RATE (xfS) BCK RATE (xfS) APPLICABLE PINS
MODE FREQUENCY (fS)
2 (1) (2)
I S/Left-Justified 16/20/24/32 192 kHz 128 to 1152 64, 48 DIN1/2/3/4
Right-Justified 24, 16 192 kHz 128 to 1152 (2) 64, 48, 32 (16 bit) (3) DIN1/2/3/4
I2S/Left-Justified DSP 24 192 kHz 128 to 768 64 DIN1/2/3/4
Software
control 24 48 kHz 256, 512 256 DIN1
I2S/ Left-Justified TDM
24 96 kHz 128, 256 128 DIN1/2
(1) 32-bit data length is acceptable only for BCK = 64 fS and when using I2S and Left-Justified format.
(2) 1152 fS is acceptable only for fS = 32 kHz, BCK = 64 fS, and when using I2S, Left-Justified, and 24-bit Right-Justified format.
(3) BCK = 32 fS is supported only for 16-bit data length.
Ch 1 (DIN1) or Ch 3 (DIN2)
LRCK Ch 5 (DIN3) or Ch 7 (DIN4) Ch 2 (DIN1) or Ch 4 (DIN2)
Ch 6 (DIN3) or Ch 8 (DIN4)
BCK
DIN1/2/3/4 N M L 2 1 0 N M L 2 1 0
MSB LSB MSB LSB
Ch 2 (DIN1) or Ch 4 (DIN2)
LRCK Ch 1 (DIN1) or Ch 3 (DIN2) Ch 6 (DIN3) or Ch 8 (DIN4)
Ch 5 (DIN3) or Ch 7 (DIN4)
BCK
DIN1/2/3/4 N M L 2 1 0 N M L 2 1 0 N
MSB LSB MSB LSB
Ch 2 (DIN1) or Ch 4 (DIN2)
LRCK Ch 1 (DIN1) or Ch 3 (DIN2) Ch 6 (DIN3) or Ch 8 (DIN4)
Ch 5 (DIN3) or Ch 7 (DIN4)
BCK
DIN1/2/3/4 0 23 22 21 2 1 0 23 22 21 2 1 0
MSB LSB MSB LSB
Ch 2 (DIN1) or Ch 4 (DIN2)
LRCK Ch 1 (DIN1) or Ch 3 (DIN2) Ch 6 (DIN3) or Ch 8 (DIN4)
Ch 5 (DIN3) or Ch 7 (DIN4)
BCK
DIN1/2/3/4 0 15 14 13 2 1 0 15 14 13 2 1 0
MSB LSB MSB LSB
BCK
Left-Justified Mode
23 22 21 2 1 0 23 22 21 2 1 0 23 22 21
DIN1/2/3/4
2
I S Mode 23 22 21 2 1 0 23 22 21 2 1 0 23 22
DIN1/2/3/4
LRCK
BCK
Left-Justified Mode
DIN1 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22
(Single)
Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7 Ch 8
2
32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs
I S Mode
DIN1 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22
(Single)
Left-Justified Mode
DIN1/2 23 22 1 0 23 22 1 0 23 22 1 0 23 22 1 0 23 22
(Dual)
Ch 1/Ch 5 Ch 2/Ch 6 Ch 3/Ch 7 Ch 4/Ch 8
2 32 BCKs 32 BCKs 32 BCKs 32 BCKs
I S Mode
DIN1/2 23 22 1 0 23 22 1 0 23 22 1 0 23 22 1 0 23 22
(Dual)
LRCK
BCK
Left-Justified Mode
DIN1 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22
(Dual)
Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7 Ch 8
2 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs 32 BCKs
I S Mode
DIN1 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22 0 23 22
(Dual)
Left-Justified Mode
DIN1/2 23 22 1 0 23 22 1 0 23 22 1 0 23 22 1 0 23 22
(Quad)
Ch 1/Ch 5 Ch 2/Ch 6 Ch 3/Ch 7 Ch 4/Ch 8
2 32 BCKs 32 BCKs 32 BCKs 32 BCKs
I S Mode
DIN1/2 23 22 1 0 23 22 1 0 23 22 1 0 23 22 1 0 23 22
(Quad)
Figure 38 shows the DAC analog output during loss of synchronization. During undefined data periods, some
noise may be generated in the audio signal. Also, the transition of normal to undefined data and undefined (or
zero) data to normal data creates a discontinuity of data on the analog outputs, which then may generate some
noise in the audio signal.
DAC outputs (VOUTx) hold the previous state if the system clock halts, but the asynchronous and re-
synchronization processes will occur after the system clock resumes.
State of
Synchronous Asynchronous Synchronous
Synchronization
The input state of the MODE pin is sampled at the moment of power-on, or during a low-to-high transition of the
RST pin, with the system clock input. Therefore, input changes after reset are ignored until the next power-on or
reset. From the mode control selection described in Table 6, the functions of four pins are changed, as shown in
Table 7.
In serial mode control, the actual mode control is performed by register writes (and reads) through the SPI- or
I2C-compatible serial control port. In parallel mode control, two specific functions are controlled directly through
the high/low control of two specific pins, as described in the following section.
RSV Reserved
Reserved; do not use.
ATDAx[7:0] Digital attenuation level setting
Where x = 1 to 8, corresponding to the DAC output (VOUTx).
Each DAC output (VOUT1 through VOUT8) has a digital attenuation function. The attenuation level can be set from 0 dB to
R dB, in S-dB steps. Changes in attenuator levels are made by incrementing or decrementing one step (S dB) for every
8/fS time interval until the programmed attenuator setting is reached. Alternatively, the attenuation level can be set to
infinite attenuation (or mute). R (Range) and S (Step) is –63 and 0.5 for DAMS = 0 and –100 and 1.0 for DAMS = 1,
respectively. The DAMS bit is defined in Register 70 (46h). Table 20 shows attenuation levels for various settings.
The attenuation level for each channel can be set individually using the following formula:
Attenuation level (dB) = S × (ATDAx[7:0]DEC – 255)
where ATDAx[7:0]DEC = 0 through 255.
For ATDAx[7:0]DEC = 0 through 128 with DAMS = 0 or 0 through 154 with DAMS = 1, attenuation is set to infinite
attenuation (mute).
Default value: 1111 1111.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
C2
10 mF R1 R3
VOUT+
+
(4 VPP) 47W
Analog Output
C1
VOUT- (2 VRMS)
+
(4 VPP)
10 mF R1 R3
R2 C2
NOTE: Amplifier is an NE5532A x1/2 or OPA2134 x1/2; R1 = 7.5-kΩ; R2 = 5.6-kΩ; R3 = 360-Ω; C1 = 3300-pF; C2 =
680-pF; Gain = 0.747; f–3 dB = 53 kHz.
R2
C2
R1 R3
VOUT+
(4 VPP) 47W
Analog Output
C1
VOUT- (2 VRMS)
(4 VPP)
R1 R3
R2 C2
NOTE: Amplifier is an NE5532A x1/2 or OPA2134 x1/2; R1 = 15-kΩ; R2 = 11-kΩ; R3 = 820-Ω; C1 = 1500-pF; C2 =
330-pF; Gain = 0.733; f–3 dB = 54 kHz.
PCM1690
1 RSV2 RSV2 48
2 RSV1 VCC2 47
C3
3 RSV2 AGND2 46
4 RSV1 RSV2 45
5 RSV2 VOUT1- 44
R1
6 LRCK VOUT1+ 43
R2
7 BCK VOUT2- 42
R3
8 DIN1 VOUT2+ 41
Audio DSP or R4
Decoder VOUT3- 40
9 DIN2
R5
10 DIN3 VOUT3+ 39
R6
11 DIN4 VOUT4- 38
12 VDD VOUT4+ 37
C1 LPF and Buffer
13 DGND VOUT5- 36
PLL170x R7
14 SCKI VOUT5+ 35
15 RST VOUT6- 34
16 ZERO1 VOUT6+ 33
17 ZERO2 VOUT7- 32
R8
18 AMUTEI VOUT7+ 31
mC or mP 19 AMUTEO VOUT8- 30
R9
20 MD/SDA/DEMP VOUT8+ 29
21 MC/SCL/FMT RSV2 28
22 MS/ADR0/RSV AGND1 27
C4
+ C2
23 TEST/ADR1/RSV VCOM 26
24 MODE VCC1 25 +5 V
Termination +
Circuit C6
+ +3.3 V
C5
0V
3.3 V 24
R10 R10
24 24
0V
NOTE: C1 through C3 are 1-μF ceramic capacitors. C4 through C6 are 10-μF electrolytic capacitors. R1 through R7 are
22-Ω to 100-Ω resistors. R8 and R9 are resistors appropriate for pull-up. R10 is less than 10 kΩ.
-40
Amplitude (dB)
-60
-80
-100
-120
-140
0 1 2 3 4
Normalized Frequency (fS)
10 Layout
VDD VCC
Digital Logic
and DGND Output
Audio Circuits
Processor PCM1690 Digital
Ground
AGND
Analog
Digital Section Analog Section Ground
11.4 Trademarks
E2E is a trademark of Texas Instruments.
Blu-ray is a trademark of Blu-ray Disk Association.
I2S is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
PCM1690DCA ACTIVE HTSSOP DCA 48 40 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 PCM1690
PCM1690DCAR ACTIVE HTSSOP DCA 48 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 PCM1690
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
• Automotive: PCM1690-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
GENERIC PACKAGE VIEW
DCA 48 HTSSOP - 1.2 mm max height
12.5 x 6.1, 0.5 mm pitch SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
www.ti.com
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