30089646 Technical Manual SPARK V6 0

4th
Technical Manual for
SPARK
Document Part No.: 30089646

2021-11
Document Version: 6.0
WARNING: Carefully read and follow the instructions provided in this document before
servicing the instrument.
WARNING: For the installation of a Spark instrument follow the IQ and OQ checklists.
For maintenance of a Spark instrument follow the PM checklist.
After repair of a Spark instrument follow the OQ checklists.
Notice
Every effort has been made to avoid errors in text and diagrams; however, Tecan Austria GmbH assumes
no responsibility for any errors, which may appear in this publication.
It is the policy of Tecan Austria GmbH to improve products as new techniques and components become
available. Tecan Austria GmbH therefore reserves the right to change specifications at any time with
appropriate validation, verification, and approvals.
We would appreciate any comments on this publication.
Manufacturer
Tecan Austria GmbH
Untersbergstr. 1A
A-5082 Grödig
T +43 62 46 89 330
F +43 62 46 72 770
E-mail: [email protected]
www.tecan.com
Copyright Information
The contents of this document are the property of Tecan Austria GmbH and are not to be copied,
reproduced or transferred to another person or persons without prior written permission.
Copyright © Tecan Austria GmbH
All rights reserved.
Printed in Austria
CE Declaration of Conformity
See the Instructions for Use.
Area of Application – Intended Use

See chapter 2.2 Intended Use (Hardware and Software).
About the Technical Manual

Original Instructions. This document describes the SPARK multifunctional microplate reader. It is
intended as reference for the service technician. This document describes how to:
• Install the instrument.
• Perform service and maintenance on the instrument.
2 Technical Manual for - SPARK - Part No. 30089646 - Version 6.0 2021-11
Remarks on Screenshots
The version number displayed in screenshots may not always be the one of the currently released version.
Screenshots are replaced only if content related to the application has changed.
Trademarks
The following product names and any registered and unregistered trademarks mentioned in this document
are used for identification purposes only and remain the exclusive property of their respective owners:
• Spark®, SparkControlTM, Spark-StackTM, NanoQuantTM, Tecan® and the Tecan Logo are trademarks
of Tecan Group Ltd., Männedorf, Switzerland
• Windows® and Excel® are registered trademarks of Microsoft Corporation, Redmond, WA, USA
• Greiner® is a registered trademark of Greiner Labortechnik GmbH, Frickenhausen, Germany
• Chroma-GloTM is a trademark of Promega Corporation Madison, WI, USA
• BRET2TM is a trademark and PerkinElmer® is a registered trademark of PerkinElmer, Inc., Waltham,
Massachusetts, USA
• HTRF® is a registered trademark of Cisbio Bioassays, Parc Marcel Boiteux, 30200 Codolet, France
• AlphaScreen®, AlphaLISA® and AlphaPlexTM are registered trademarks of PerkinElmer, Inc.,
Waltham, Massachusetts, USA
• RoboFlask® is a registered trademark of Corning, Inc., New York, USA
2021-11 Technical Manual for - SPARK - Part No. 30089646 - Version 6.0 3
Warnings, Cautions, and Notes
The following types of notices are used in this publication to highlight important information or to warn the
user of a potentially dangerous situation:
NOTE: Gives helpful information.
CAUTION: Indicates a possibility of instrument damage or data loss if instructions are not
followed.
WARNING: Indicates the possibility of severe personal injury, loss of life or equipment
damage if the instructions are not followed.
WARNING: This symbol indicates the possible presence of biologically hazardous material.
Proper laboratory safety precautions must be observed.
WARNING: This symbol indicates the possible presence of flammable materials and a risk of
fire. Proper laboratory safety precautions must be observed.
WARNING: Indicates laser. Do not stare into the beam!
ATTENTION: Negative environmental impacts associated with the treatment of waste.

• Do not treat electrical and electronic equipment as unsorted municipal waste.
• Collect waste electrical and electronic equipment separately.
FOR CALIFORNIA RESIDENTS ONLY:

WARNING: This product can expose you to chemicals such as lead which is known to the
State of California to cause cancer and birth defects or other reproductive harm. For more
information go to: www.P65warnings.ca.gov/product.
Symbols
CE conformity marking Serial Number
Date of Manufacture Single use only
Manufacturer NRTL TÜV SÜD Mark
Catalog number USB Symbol
Consult Instructions for Use Use by date
China RoHS Symbol WEEE Symbol
Table of Contents
Table of Contents ....................................................................................................................................... 6
1 Safety .......................................................................................................................................... 15
2 General Description .................................................................................................................. 16
2.1 Instrument ........................................................................................................................... 16
2.2 Intended Use (Hardware and Software) ............................................................................ 16
2.3 User Profile.......................................................................................................................... 17
2.3.1 Professional User – Administrator Level .................................................................................................. 17
2.3.2 End User or Routine User ........................................................................................................................ 17
2.3.3 Service Technician ................................................................................................................................... 17
2.4 Multifunctionality ................................................................................................................ 17
2.5 Microplate Requirements ................................................................................................... 18
2.5.1 Filling Volumes/Smooth Mode ................................................................................................................. 19
2.6 Onboard Control Buttons................................................................................................... 20
2.7 Instrument LEDs ................................................................................................................. 20
2.8 Rear View............................................................................................................................. 21
2.9 Instrument Dimensions ...................................................................................................... 23
3 Instrument Installation .............................................................................................................. 36
3.1 Spark Installation ................................................................................................................ 36
3.2 Installation Requirements for Spark ................................................................................. 36
3.2.1 Required Working Area ............................................................................................................................ 36
3.3 Unpacking & Inspection ..................................................................................................... 36
3.4 Power Requirements .......................................................................................................... 37
3.5 Subpackages ....................................................................................................................... 37
3.6 Options Packages ............................................................................................................... 37
3.7 Removal of the Transport Locks ....................................................................................... 39
3.8 Power Requirements .......................................................................................................... 40
3.9 Switching the Instrument On ............................................................................................. 40
3.10 Switching the Instrument Off ............................................................................................. 41
3.11 Preparing the Instrument for Shipping ............................................................................. 42
3.11.1 Parking Procedure ................................................................................................................................... 43
3.11.2 Installing the Plate Carrier Transport Locks ............................................................................................. 45
3.11.3 Packing the Spark without the Cooling or Cyto Module ........................................................................... 47
3.11.4 Packing the Spark with the Cooling or Cyto Module ................................................................................ 49
3.11.5 Packing the Injector Module ..................................................................................................................... 51
4 Plate Control .............................................................................................................................. 53
4.1 Z-Position ............................................................................................................................ 53
4.2 Shaking ................................................................................................................................ 53
4.3 Incubating/Cooling Position .............................................................................................. 54
4.4 Lid Lifter .............................................................................................................................. 54
4.5 Securing the RoboFlask Cell Culture Vessels ................................................................. 55
5 Spark Platform ........................................................................................................................... 56
6 Instrument Specifications ........................................................................................................ 58
7 Cleaning and Maintenance ....................................................................................................... 59
7.1 Introduction ......................................................................................................................... 59
7.2 Liquid Spills ........................................................................................................................ 59
7.3 Instrument Decontamination/Disinfection ........................................................................ 59
7.3.1 Disinfection Solutions ............................................................................................................................... 60
7.3.2 Disinfection Procedure ............................................................................................................................. 60
7.3.3 Safety Certificate ...................................................................................................................................... 60
7.4 Disposal ............................................................................................................................... 61
7.4.1 Disposal of Packaging Material ................................................................................................................ 61
7.4.2 Disposal of Operating Material ................................................................................................................. 61
7.4.3 Disposal of the Instrument ....................................................................................................................... 61
7.5 NanoQuant Maintenance .................................................................................................... 62
7.5.1 Cleaning Procedure with Ultrasonic Bath................................................................................................. 62
7.5.2 Cleaning Procedure with Kimwipe ........................................................................................................... 62
7.6 Injector Cleaning and Maintenance ................................................................................... 62
7.7 Maintenance and Cleaning of the Cell Chip Adapter ....................................................... 63
7.8 Liquid Cooling Device Maintenance ................................................................................. 63
8 Service Tools & Kit .................................................................................................................... 64
8.1 General ................................................................................................................................ 64
8.2 Bottom Level ...................................................................................................................... 64
8.3 Middle Level........................................................................................................................ 65
8.4 Top Level ............................................................................................................................ 66
9 Spectrometer Tools ................................................................................................................... 66
9.1 USB 4000 Spectrometer Kit ............................................................................................... 66
9.2 Flame Spectrometer Kit ..................................................................................................... 66
10 Hellma Glass Cuvette ................................................................................................................ 67
10.1 Description of the Cuvette................................................................................................. 67
10.1.1 Intended Use ........................................................................................................................................... 67
10.1.2 Recalibration of Hellma Glass Cuvette .................................................................................................... 67
11 Removing the Instrument Cover .............................................................................................. 68
11.1 Removing the Top Cover ................................................................................................... 68
11.2 Removing the Optics Base Plate ...................................................................................... 69
11.3 Installation of Optics Base Plate....................................................................................... 78
11.4 Removing the Bottom Plate .............................................................................................. 78
12 Electronics & Interfaces ............................................................................................................ 79
12.1 Electronic Components ..................................................................................................... 79
12.2 Motor Tool........................................................................................................................... 79
12.3 Motor Overview .................................................................................................................. 79
12.4 CAN Bus System ................................................................................................................ 80
12.5 Handshake System ............................................................................................................ 80
12.6 USB ..................................................................................................................................... 80
12.7 Firmware Overview ............................................................................................................ 81
12.8 Overview of the Electronics .............................................................................................. 81
12.8.1 Disconnecting the Plug Connector .......................................................................................................... 81
12.9 PODI Board ......................................................................................................................... 82
12.9.1 Electronic Hub PODI Board ..................................................................................................................... 83
12.9.2 Electronic Hub PODI Board - Noise Reduction ....................................................................................... 84
12.9.3 Main Transport Board .............................................................................................................................. 86
12.9.4 Replacement of Rear Fans ...................................................................................................................... 88
12.9.5 Replacement of Power Supply ................................................................................................................ 89
12.9.6 Replacement of Front Button Key Foil ..................................................................................................... 92
13 Plate Transport ........................................................................................................................... 93
13.1 General Description ........................................................................................................... 93
13.2 Mechanical System of the Transport ................................................................................ 93
13.3 Electronic System of the Transport .................................................................................. 94
13.3.1 Y-Board of the Transport ......................................................................................................................... 94
13.3.2 X-Board of the Transport ......................................................................................................................... 95
13.3.3 Z-Board of the Transport ......................................................................................................................... 96
13.4 Assembly/Reassembly of the Transport .......................................................................... 97
13.4.1 Replacing the Y-Ribbon Cable of the Transport ...................................................................................... 98
13.4.2 Replacing the X-Board of the Transport .................................................................................................. 99
13.4.3 Replacing the Y-Board of the Transport ................................................................................................ 100
13.4.4 Replacing the Z-Board of the Transport ................................................................................................ 101
13.4.5 Replacing the X-Transport Motor ........................................................................................................... 102
13.4.6 Replacing the Y-Transport Motor ........................................................................................................... 103
13.4.7 Replacing the Z-Transport Motor ........................................................................................................... 104
13.4.8 Adjustment of X-Motor and Belt Tension of Transport........................................................................... 106
13.4.9 Adjustment of Y-Motor and Belt Tension of Transport........................................................................... 107
13.4.10 Replacing the X-Belt of the Transport.................................................................................................... 108
13.4.11 Replacing the Y-Belt Transport .............................................................................................................. 108
13.4.12 Replacing the Z-Belt Transport .............................................................................................................. 109
13.4.13 Replacing the X-Guide of Plate Transport ............................................................................................. 110
13.4.14 Replacing the Y-Guide of Plate Transport ............................................................................................. 112
13.4.15 Replacing the Z-Guide of Plate Transport ............................................................................................. 114
13.4.16 Replacing the Plate Carrier .................................................................................................................... 116
13.4.17 Adjust the Plate Carrier .......................................................................................................................... 117
13.5 Plate Transport – Service Software ................................................................................ 124
13.5.1 Adjustment Plate Transport ................................................................................................................... 125
13.5.1.1 Z-Min Position Offset ............................................................................................................................. 125
13.5.1.2 Z-Max Position Offset ............................................................................................................................ 126
13.5.1.3 Resolution X/Y ....................................................................................................................................... 127
13.5.1.4 Plate Load Position Left & Right ............................................................................................................ 128
13.5.1.5 Plate Detection Sensor Offset ................................................................................................................ 129
13.5.2 Test Plate Transport ............................................................................................................................... 130
13.5.2.1 Plate Carrier Tilt ..................................................................................................................................... 130
13.5.2.2 Plate Carrier Rotation Angle .................................................................................................................. 132
13.5.2.3 Resolution X/Y ....................................................................................................................................... 133
13.5.2.4 Plate Detection Sensor Offset Check..................................................................................................... 133
13.5.2.5 Step loss Test X, Y, Z ............................................................................................................................ 135
13.5.2.6 Step loss Test X,Y,Z (DISABLE FLAPS) ............................................................................................... 136
14 Absorbance Module ................................................................................................................ 137
14.1 General Description .......................................................................................................... 137
14.2 Optical System Absorbance ............................................................................................ 137
14.3 Absorbance Cuvette ......................................................................................................... 138
14.3.1 Replacing the Absorbance Cuvette ........................................................................................................ 138
14.3.2 Replacing the Absorbance Detector Board ............................................................................................ 139
14.4 Absorbance Monochromator ........................................................................................... 140
14.5 Absorbance Measurement Head ..................................................................................... 140
14.6 Absorbance Detector........................................................................................................ 140
14.7 Mechanical System Absorbance ..................................................................................... 141
14.8 Electronic System Absorbance ....................................................................................... 141
14.8.1 Replacing the Absorbance Boards ......................................................................................................... 142
14.9 Disassembly and Adjustment of the Absorbance Monochromator ............................. 143
14.9.1 Replacing the Absorbance Flash Lamp Module .................................................................................... 146
14.9.2 Replacing OSF Filter and the Absorbance Motor .................................................................................. 148
14.9.3 Replacing the Absorbance Measurement Head .................................................................................... 149
14.9.4 Replacing the Absorbance Detector ...................................................................................................... 150
14.9.5 Replacing and Adjusting the Absorbance Mirror .................................................................................... 151
14.10 Absorbance – Service Software ...................................................................................... 154
14.10.1 Adjustment Absorbance ......................................................................................................................... 155
14.10.1.1 Flash Energy .......................................................................................................................................... 155
14.10.1.2 Plate Transport Offset X/Y ..................................................................................................................... 156
14.10.1.3 Plate Transport Offset Z ......................................................................................................................... 157
14.10.1.4 Wavelength Accuracy ABS .................................................................................................................... 158
14.10.1.5 Wavelength Accuracy CUV .................................................................................................................... 159
14.10.1.6 Order Sorting Filter Offset ...................................................................................................................... 160
14.10.1.7 Measurement Ranges ABS .................................................................................................................... 161
14.10.1.8 Measurement Ranges CUV ................................................................................................................... 162
14.10.1.9 Measurement Head Position ABS.......................................................................................................... 163
14.10.1.10 Measurement Head Position CUV ......................................................................................................... 165
14.10.2 Test Absorbance .................................................................................................................................... 166
14.10.2.1 Plate Transport Offset Check X/Y .......................................................................................................... 166
14.10.2.2 Plate Transport Offset Check Z .............................................................................................................. 167
14.10.2.3 Wavelength Accuracy Check ABS ......................................................................................................... 168
14.10.2.4 Wavelength Accuracy Check CUV ......................................................................................................... 169
14.10.2.5 Measurement Ranges Check ABS ........................................................................................................ 170
14.10.2.6 Lamp Stability Check ............................................................................................................................. 171
14.10.2.7 Blocking Spatial Check .......................................................................................................................... 172
14.10.2.8 Blocking Spectral Check ........................................................................................................................ 173
14.10.2.9 Darknoise Check ABS ............................................................................................................................ 174
14.10.2.10 Darknoise Check CUV ........................................................................................................................... 175
14.10.2.11 Reference Signal Check ABS ................................................................................................................ 176
14.10.2.12 Reference Signal Check CUV ................................................................................................................ 177
14.10.2.13 Baseline Flatness Check ........................................................................................................................ 178
14.10.2.14 Steploss Test Grating Motor & OSF Motor ............................................................................................ 178
15 Fluorescence Module.............................................................................................................. 179
15.2 Fluorescence Optical System .......................................................................................... 180
15.2.1 FI Filter ................................................................................................................................................... 180
15.2.2 FI-Monochromator .................................................................................................................................. 181
15.2.3 FI Hybrid (Fusion) Monochromator ........................................................................................................ 182
15.2.4 FI Bottom ................................................................................................................................................ 183
15.2.5 Replacement of FI Bottom ..................................................................................................................... 183
15.2.6 Replacement of Bottom Aperture Wheel Motor ..................................................................................... 184
15.2.7 Installation of Bottom Aperture Wheel Motor ......................................................................................... 185
15.2.8 Replacement of Splash Guard Motor FI Bottom .................................................................................... 186
15.2.9 Installation of Splash Guard Motor ......................................................................................................... 186
15.3 Fluorescence Enhanced .................................................................................................. 188
15.3.1 FI Monochromator Enhanced ................................................................................................................ 188
15.3.2 FI Bottom Enhanced .............................................................................................................................. 189
15.3.3 Fan for Flash Lamp Enhanced .............................................................................................................. 189
15.3.4 Universal Measurement Head User Dichroic......................................................................................... 190
15.4 Electronic System of the Fluorescence Module ............................................................ 191
15.4.1 Fluorescence Bottom Board .................................................................................................................. 191
15.4.2 Fluorescence Monochromator Board .................................................................................................... 191
15.4.3 Replacement of FI EX & EM Monochromator ........................................................................................ 192
15.4.4 Replacement of FI Mono EX & EM Board ............................................................................................. 195
15.4.5 Replacement of FI Flash Lamp .............................................................................................................. 196
15.4.6 Replacement of FI Flash Lamp Enhanced ............................................................................................ 197
15.5 FI Universal Measurement Head ..................................................................................... 198
15.5.1 General Description ............................................................................................................................... 198
15.5.2 Optical System of the Fluorescence Measurement Head ..................................................................... 199
15.5.3 Mirror Slide Fluorescence ...................................................................................................................... 202
15.5.4 Filter Slides Fluorescence ..................................................................................................................... 202
15.5.5 Fluorescence Filters .............................................................................................................................. 203
15.5.6 Installing and Removing Fluorescence Filters ....................................................................................... 204
15.5.7 Fluorescence Universal Measurement Board........................................................................................ 204
15.5.8 Assembly/Reassembly and Adjustment ................................................................................................ 207
15.5.9 Bottom Fiber Assembly/Reassembly ..................................................................................................... 207
15.5.10 Replacement/Reassembly FP Motor ..................................................................................................... 207
15.5.11 Assembly/Reassembly of the Filter Slide Motor .................................................................................... 208
15.6 Fluorescence – Service Software ................................................................................... 210
15.6.1 Adjustment Fluorescence ...................................................................................................................... 210
15.6.1.1 Plate Transport Offset Z ........................................................................................................................ 210
15.6.2 FI-Top Plate Transport Offset ................................................................................................................ 211
15.6.2.1 Plate transport Offset X/Y Mono/Filter, Filter/Mono, Mono/Mono, Filter/Filter ....................................... 211
15.6.3 FI-Bottom Plate Transport Offset ........................................................................................................... 212
15.6.3.1 Plate Transport Offset X/YMono/Filter, Filter/Mono, Mono/Mono, Filter/Filter ....................................... 212
15.6.4 FI-Pol Plate Transport Offset ................................................................................................................. 213
15.6.4.1 Plate Transport Offset X/Y FP ............................................................................................................... 213
15.6.4.2 Filter Slide Offset ................................................................................................................................... 214
15.6.4.3 Mirror slide Offset .................................................................................................................................. 215
15.6.4.4 FP Wheel Offset .................................................................................................................................... 216
15.6.4.5 Bottom Wheel Offset .............................................................................................................................. 217
15.6.4.6 Define Filterslide Excitation & Emission ................................................................................................ 218
15.6.4.7 Wavelength Accuracy EX ...................................................................................................................... 219
15.6.4.8 Wavelength Accuracy EM ...................................................................................................................... 220
15.6.4.9 Max Intensity Wavelength ...................................................................................................................... 221
15.6.5 Test Fluorescence ................................................................................................................................. 222
15.6.5.1 Signal To Blank ...................................................................................................................................... 222
15.6.5.2 3D Spectrum Check ............................................................................................................................... 223
15.6.5.3 Lamp Stability ........................................................................................................................................ 224
15.6.5.4 FI-Top Plate Transport Offset Check ..................................................................................................... 225
15.6.5.4.1 FI-Top Plate Transport Offset Check X/Y MONO/FILTER, FILTER/MONO, MONO/MONO,
FILTER/FILTER ..................................................................................................................................... 225
15.6.5.5 FI-Bottom Plate Transport Offset Check ................................................................................................ 226
15.6.5.5.1 FI-Bottom Plate Transport Offset Check X/Y MONO/FILTER, FILTER/MONO, MONO/MONO,
FILTER/FILTER ..................................................................................................................................... 226
15.6.5.6 FI-Pol Transport Offset Check ............................................................................................................... 227
15.6.5.7 Wavelength Accuracy Check EX ........................................................................................................... 228
15.6.5.8 Wavelength Accuracy Check EM .......................................................................................................... 229
15.6.5.9 Mirror Slide Offset Check FI-Top ........................................................................................................... 230
15.6.5.10 Mirror Slide Offset Check FI-Bottom ...................................................................................................... 231
15.6.5.11 Reference Signal Check Mono .............................................................................................................. 232
15.6.5.12 Reference Signal Check Filter ............................................................................................................... 233
15.6.5.13 Darknoise Check ................................................................................................................................... 234
15.6.5.14 Polarization Check ................................................................................................................................. 235
15.6.5.15 Filter Slide Memory Check ..................................................................................................................... 236
15.6.5.16 Optical Path Inspection .......................................................................................................................... 237
15.6.5.17 FI Steploss Tests ................................................................................................................................... 238
15.6.5.18 Signal to Blank Dichroic Check (FI TOP)............................................................................................... 239
16 Luminesence System ..............................................................................................................240
16.1 General Description ......................................................................................................... 240
16.2 Safety Precautions Luminescence ................................................................................. 241
16.3 Replacement and Adjustment Of Lumi Module ............................................................. 242
16.4 Replacement of Lumi Fibers ............................................................................................ 243
16.5 Replacement of Well Temperature Sensor ..................................................................... 244
16.6 Replacement of Lumi Alpha LASER................................................................................ 244
16.7 Electronic System Luminescence ................................................................................... 245
16.8 Replacement of Luminescence Measurement Head ..................................................... 246
16.9 Replacement of LASER Safety Board ............................................................................. 247
16.10 Luminescence – Service Software .................................................................................. 248
16.10.1 Adjustment Luminescence ..................................................................................................................... 248
16.10.1.1 Plate Transport Offset Z ......................................................................................................................... 248
16.10.1.2 Plate Transport Offset X/Y ..................................................................................................................... 249
16.10.2 Test Luminescence ................................................................................................................................ 250
16.10.2.1 Plate Transport Offset Check Z, ALPHA, WELL_TEMP ........................................................................ 250
16.10.2.2 Plate Transport Offset Check X/Y, ALPHA, WELL_TEMP .................................................................... 251
16.10.2.3 Lid Check ............................................................................................................................................... 253
16.10.3 Steploss Test Lower Filterwheel, Upper Filterwheel, Measurement Head ............................................ 254
17 Lid Lifter ................................................................................................................................... 255
17.2 Electronic System ............................................................................................................. 255
17.3 Replacement of Lid Lifter Module ................................................................................... 256
17.4 Replacement of Lid Lifter Sensor .................................................................................... 256
18 Injector ..................................................................................................................................... 257
18.2 Description of the XE 1000............................................................................................... 257
18.3 Electronic System of the Injector .................................................................................... 259
18.4 Liquid System of the Injector ........................................................................................... 259
18.5 Storage Bottles ................................................................................................................. 260
18.6 Injector Carrier .................................................................................................................. 260
18.7 Priming and Washing ....................................................................................................... 261
18.8 Replacement and Adjustment of the Injector Carrier .................................................... 261
18.8.1 Replacing the Sensors of the Injector Carrier ........................................................................................ 262
18.8.2 Replacement of the Pump Module ......................................................................................................... 262
18.8.3 Replacement of Key Board Foil of the Pump Module ............................................................................ 263
18.8.4 Replacement of the Pump Module Electronics ...................................................................................... 264
18.9 Injector – Service Software .............................................................................................. 265
18.9.1 Adjustment Injector ................................................................................................................................ 265
18.9.1.1 Injector Position Z-Offset ........................................................................................................................ 265
18.9.1.2 Injector Position X/Y-Offset .................................................................................................................... 266
18.9.1.3 Pump Settings ........................................................................................................................................ 268
18.9.2 Test Injector ........................................................................................................................................... 268
18.9.2.1 Injector Prime Check .............................................................................................................................. 268
18.9.2.2 Injection Check ....................................................................................................................................... 269
18.9.2.3 Injection Accuracy Check ....................................................................................................................... 270
18.9.2.4 Injection Detection Sensor Check .......................................................................................................... 272
18.9.2.5 Steploss Test Injector Carrier ................................................................................................................. 272
19 Cell Counting ........................................................................................................................... 273
19.2 Optical System of the Cell Counting Module ................................................................. 273
19.3 Electronic System of the Cell Counting Module ............................................................ 274
19.4 Assembly of the Cell Counting Module .......................................................................... 274
19.4.1 Replacing the Electronics of the Cell Counting Module ......................................................................... 274
19.4.2 Replacement of LED of the Cell Counting Module................................................................................. 275
19.4.3 Replacement of the Aperture Wheel Motor ............................................................................................ 276
19.4.4 Replacement/Installation Camera Module ............................................................................................. 278
19.4.5 Replacement of Illumination Unit of Counting Module ........................................................................... 280
19.5 Cell Counting – Service Software .................................................................................... 281
19.5.1 Adjustment Cell Counting ....................................................................................................................... 281
19.5.1.1 Illumination Center ................................................................................................................................. 281
19.5.1.2 Offset Aperture Wheel ............................................................................................................................ 283
19.5.1.3 Offset X/Y ............................................................................................................................................... 284
19.5.1.4 Focus Position ........................................................................................................................................ 285
19.5.2 Test Cell Counting .................................................................................................................................. 287
19.5.2.1 Uniform Illumination Check .................................................................................................................... 287
19.5.2.2 Offset X/Y Check .................................................................................................................................... 288
19.5.2.3 Focus Position Check ............................................................................................................................ 289
19.5.2.4 Cam Position Check ............................................................................................................................... 291
19.5.2.5 Steploss Test Aperture Wheel ............................................................................................................... 293
20 Heater & Stirrer.........................................................................................................................294
20.2 Mechanical System of Heater & Stirrer .......................................................................... 295
20.3 Electronic System of Heater & Stirrer ............................................................................ 295
20.4 Reassembly and Adjustment of Heater & Stirrer .......................................................... 295
21 Gas Module ...............................................................................................................................296
21.2 Mechanical System of the Gas Module .......................................................................... 296
21.3 Electronic System of the Gas Module ............................................................................ 296
21.4 Assembly/Reassembly of the Gas Board....................................................................... 297
21.5 Assembly/Reassembly of Gas Sensors ......................................................................... 298
21.6 Gas Control Module – Service Software ........................................................................ 299
21.6.1 Gas Sensor Check ................................................................................................................................. 299
21.6.2 Gas Valve Check ................................................................................................................................... 300
21.6.3 Gas Buzzer Check ................................................................................................................................. 301
21.6.4 Optional Gas Control Leak Tightness CO2+O2 Test ............................................................................ 302
22 Replacing the Heating Foil ......................................................................................................303
23 Replacing Ambient Sensor .....................................................................................................305
24 Instrument Flap ........................................................................................................................306
24.2 Assembly/Reassembly of Flaps...................................................................................... 306
25 Cooling Module ........................................................................................................................307
25.2 Cooling Installation .......................................................................................................... 309
25.2.1 Setting up the Liquid Cooling System .................................................................................................... 309
25.2.2 Switching on the External Liquid Cooling Device .................................................................................. 311
25.3 Operating Integrated the Cooling Module ...................................................................... 312
25.4 Draining the Liquid System ............................................................................................. 313
25.5 Assembly/Reassembly of the Cooling Module .............................................................. 314
25.6 Electronic System of Cooling Option ............................................................................. 316
25.7 Replacement of the Cooling Module Board ................................................................... 317
25.8 Liquid Cooling Device (Liquid Chiller) ........................................................................... 318
25.8.1 Replace the Liquid Cooling Device ........................................................................................................ 318
25.8.2 Liquid Cooling Device Maintenance ...................................................................................................... 318
25.9 Replacing Fan Heat Exchanger....................................................................................... 319
25.10 Replacing Fan Cooling Chamber .................................................................................... 319
25.11 Cooling – Service Software ............................................................................................. 320
25.11.1 Tests ...................................................................................................................................................... 320
25.11.2 Function Test ......................................................................................................................................... 320
25.11.3 Fan Check ............................................................................................................................................. 321
25.11.4 Heating Foil Check ................................................................................................................................ 322
25.11.5 Pump Check .......................................................................................................................................... 322
25.11.6 Valve Check ........................................................................................................................................... 323
25.11.7 Empty Cooling System .......................................................................................................................... 324
26 Barcode Module .......................................................................................................................325
26.1.1 Microplates with Barcode ....................................................................................................................... 326
26.2 Electronic System of Barcode Module ........................................................................... 327
26.3 Replacing Barcode Module ............................................................................................. 327
26.4 Replacing Barcode Head and Board .............................................................................. 328
26.5 Barcode – Service Software ............................................................................................ 329
26.5.1 Function Test ......................................................................................................................................... 329
27 Stacker Module.........................................................................................................................330
27.1 Access to the Front Panel ............................................................................................... 331
27.1.1 Onboard Control Buttons ....................................................................................................................... 331
27.1.2 Light Protection for Sensitive Assays/Dark Covers ............................................................................... 332
27.2 Microplate Requirements for the Spark-Stack............................................................... 333
27.2.1 Loading Multiple Microplates into a Plate magazine.............................................................................. 335
27.2.2 Loading a Single Microplate into a Plate magazine ............................................................................... 337
27.2.3 Loading the Plate Magazines onto the Spark-Stack Module ................................................................. 338
27.2.4 Inserting Microplates Directly into the Spark Reader............................................................................. 339
27.2.5 Unloading Processed Microplates Individually ...................................................................................... 341
27.2.6 Unloading a Group of Processed Microplates........................................................................................ 342
27.3 General Description Stacker Module .............................................................................. 343
27.4 Installation and Adjustment of Stacker Module ............................................................. 344
27.5 Installation of Stacker Module on Spark with Integrated Cooling Module................... 349
27.6 Electronic System of Stacker Module ............................................................................. 351
27.7 Replacing Stacker Board ................................................................................................. 353
27.8 Replacing Load/Lock Motor ............................................................................................. 354
27.9 Replacing Z-Motor Stacker .............................................................................................. 356
27.10 Replacing Z–Linear Guide Stacker .................................................................................. 359
27.11 Replacing Stacker Sensors.............................................................................................. 360
27.11.1 Replacing “Stack in Position” Sensor ..................................................................................................... 360
27.11.2 Replacing Stack Empty Sensor .............................................................................................................. 362
27.11.3 Replacing Stack Load Position Sensor .................................................................................................. 363
27.11.4 Replacing Z-Home Sensor ..................................................................................................................... 364
27.12 Stacker – Service Software .............................................................................................. 365
27.12.1 Adjustment Stacker ................................................................................................................................ 365
27.12.1.1 Stacker Load Position LEFT or RIGHT .................................................................................................. 365
27.12.1.2 Stacker Lock Motor Positions ................................................................................................................. 367
27.12.1.3 Stacker Z Load Positions ....................................................................................................................... 368
27.12.1.4 Stacker Lift Sensor Positions ................................................................................................................. 369
27.12.2 Test Stacker ........................................................................................................................................... 369
27.12.2.1 Steploss Tests Inputlock/Outputlock and Steploss InputZ/OutputZ ....................................................... 369
27.12.2.2 Stacker Sensor Test INPUT Stack / OUTPUT Stack ............................................................................. 370
27.12.2.3 Stacker Motion Input Stack Test / Output Stack Test ............................................................................ 371
27.12.2.4 Stacker Module Integration .................................................................................................................... 372
28 Fluorescence Imaging (Cell Imager) ..................................................................................... 374
28.2 Brightfield Imaging ........................................................................................................... 375
28.2.1 Autofocus ............................................................................................................................................... 376
28.3 Fluorescence Imaging ...................................................................................................... 377
28.3.1 Fluorescence Channels and their Excitation and Emission Profiles ...................................................... 377
28.3.2 Image Acquisition ................................................................................................................................... 378
28.4 Specifications for Cell Imager ......................................................................................... 379
28.4.1 General .................................................................................................................................................. 379
28.4.2 Objectives .............................................................................................................................................. 379
28.5 Installation and Adjustment of FIM Module .................................................................... 379
28.6 Installation of Stacker Module on Spark Instrument with FIM Module......................... 380
28.7 Electronic System of FIM Module .................................................................................... 383
28.8 Replacing the Brightfield Module .................................................................................... 384
28.9 Replacing FIM module ...................................................................................................... 385
28.10 Replacing FIM Board ........................................................................................................ 388
28.11 Replacing Fan FIM ............................................................................................................ 389
28.12 Fluorescence Imaging FIM – Service Software .............................................................. 390
28.12.1 Adjustment FIM ...................................................................................................................................... 392
28.12.1.1 LED Power ............................................................................................................................................. 392
28.12.1.2 Brightfield Lighting .................................................................................................................................. 393
28.12.1.3 Z-Offset FIM ........................................................................................................................................... 395
28.12.1.4 Offset X/Y FIM ........................................................................................................................................ 396
28.12.1.5 Z Objective Offset .................................................................................................................................. 397
28.12.1.6 Z Autofocus Offset ................................................................................................................................. 399
28.12.1.7 Magnification .......................................................................................................................................... 400
28.12.1.8 Signal Correction .................................................................................................................................... 401
28.12.2 Tests FIM ............................................................................................................................................... 406
28.12.2.1 Test Offset X/Y ....................................................................................................................................... 407
28.12.2.2 Test Z-Offset .......................................................................................................................................... 408
28.12.2.3 Test Rotation Angle ................................................................................................................................ 409
28.12.2.4 Test Z Objective Offset .......................................................................................................................... 410
28.12.2.5 Test Z Autofocus Offset ......................................................................................................................... 411
28.12.2.6 Test Camera Orientation ........................................................................................................................ 412
28.12.2.7 Test Autofocus Orientation ..................................................................................................................... 413
28.12.2.8 Test Magnification .................................................................................................................................. 414
28.12.2.9 Test Brightfield Lighting .......................................................................................................................... 415
28.12.2.10 Test Uniformity Check ............................................................................................................................ 417
28.12.2.11 Focal Plane Check ................................................................................................................................. 419
28.12.2.12 Signal Correction .................................................................................................................................... 420
28.12.2.13 Steploss Tests FIM ................................................................................................................................ 424
28.12.2.14 Steploss Tests Objective Z-motor .......................................................................................................... 424
28.12.2.15 Steploss Tests FIM Lens Motor ............................................................................................................. 425
28.12.3 Optional Test FIM .................................................................................................................................. 426
28.12.3.1 Objective Position Check ....................................................................................................................... 426
29 Log files.....................................................................................................................................427
29.1 Log Files ........................................................................................................................... 427
29.1.1 SparkControl Log Files .......................................................................................................................... 428
29.1.2 PASS Software Log-Files ...................................................................................................................... 429
30 Service Software PASS ...........................................................................................................430
30.2 System Requirements ..................................................................................................... 430
30.3 Installation of the Service Software ................................................................................ 431
30.4 Login/Authentication ....................................................................................................... 432
30.4.1 PASS Login .......................................................................................................................................... 432
30.4.2 Token Request ..................................................................................................................................... 432
30.5 Set-up the PASS Service Software ................................................................................. 434
30.5.1 How to Configure Test Tools ................................................................................................................. 435
30.6 Dependency of Menu Items (Checks and Adjustments) ............................................... 440
30.7 Menu “File” ....................................................................................................................... 440
30.8 Menu “Instrument” ........................................................................................................... 440
30.8.1 Assemble Instrument ............................................................................................................................. 440
30.8.2 Import Instrument Configuration ............................................................................................................ 442
30.8.3 Firmware Package Version .................................................................................................................... 442
30.8.4 Tables .................................................................................................................................................... 443
30.8.5 Switch Operation Mode to SERVICE (OPERATIONAL)........................................................................ 445
30.8.5.1 Reset Test cases ................................................................................................................................... 446
30.8.5.2 Execute Batch ........................................................................................................................................ 446
30.8.5.3 Function ................................................................................................................................................. 446
30.8.5.4 Instrument Overview .............................................................................................................................. 446
30.8.5.5 Initialize .................................................................................................................................................. 446
30.8.5.6 Instrument Settings ................................................................................................................................ 446
30.8.5.7 Default Out Position ............................................................................................................................... 446
30.8.5.8 Move Microplate .................................................................................................................................... 447
30.8.5.9 Move Filter Out ...................................................................................................................................... 447
30.8.5.10 Move Plate out ....................................................................................................................................... 447
30.8.5.11 Switch Fans to Manual/Automatic ......................................................................................................... 447
30.8.5.12 Read out Error Stack ............................................................................................................................. 447
30.8.6 Send TDCL Commands ......................................................................................................................... 447
30.8.7 Configure Barcode ................................................................................................................................. 447
30.8.8 Read Barcode ........................................................................................................................................ 447
30.9 Menu “Misc” ..................................................................................................................... 448
30.9.1 Select Test Package .............................................................................................................................. 448
30.9.2 Print Default Settings ............................................................................................................................. 448
30.9.3 Verbose Mode ....................................................................................................................................... 448
30.9.4 Open Folder ........................................................................................................................................... 449
30.10 Menu “Configuration” ...................................................................................................... 449
30.10.1 Test Tools .............................................................................................................................................. 449
30.10.2 Set Paths ............................................................................................................................................... 450
30.10.3 Import Firmware Package ...................................................................................................................... 450
30.10.4 Import Test Package .............................................................................................................................. 450
30.10.5 Import Test Selection Configuration ...................................................................................................... 451
30.11 Menu “Help” ..................................................................................................................... 451
30.11.1 About ..................................................................................................................................................... 451
30.12 Overview ........................................................................................................................... 452
30.12.1 Connection Button ................................................................................................................................. 452
30.12.2 Adjustment and Test Groups ................................................................................................................. 453
30.12.3 Basic Functions ..................................................................................................................................... 454
30.12.3.1 Instrument Overview .............................................................................................................................. 454
30.12.3.2 Initialize Instrument ................................................................................................................................ 454
30.12.3.3 Instrument Settings ................................................................................................................................ 455
30.12.3.4 Current Fan Mode Manual/Automatic .................................................................................................... 456
30.12.3.5 Read out Error Stack ............................................................................................................................. 456
30.12.3.6 TDCL - Send FW Commands ................................................................................................................ 456
30.12.4 Send Report Button ............................................................................................................................... 456
30.12.5 Cancel Button ........................................................................................................................................ 456
30.12.6 Plate Detection ....................................................................................................................................... 457
30.13 General .............................................................................................................................. 457
30.13.1 Firmware Download ............................................................................................................................... 457
30.13.2 Configure Instrument .............................................................................................................................. 459
30.13.3 Default Settings ...................................................................................................................................... 460
30.13.4 Write Hardware Versions ....................................................................................................................... 460
30.13.5 Set Serial Numbers ................................................................................................................................ 462
30.13.6 Check Module Communication .............................................................................................................. 463
30.13.7 Adjust - Plate Transport Motor Type ...................................................................................................... 464
30.14 Test Tools .......................................................................................................................... 465
30.14.1 Communication Check Inheco ............................................................................................................... 465
30.14.2 Communication Check Spectrometer .................................................................................................... 466
30.14.3 Communication Check Balance ............................................................................................................. 466
30.15 Instrument ......................................................................................................................... 467
30.15.1 Instrument Adjustments ......................................................................................................................... 467
30.15.1.1 Counter .................................................................................................................................................. 467
30.15.1.2 Ambient Temperature Offset .................................................................................................................. 468
30.15.1.3 Chamber Temperature Offset ................................................................................................................ 469
30.15.1.4 Adjustment - Temperature Offset Heating Top ...................................................................................... 470
30.15.2 Test Instrument ...................................................................................................................................... 472
30.15.2.1 Test - Temperature Offset Heating Top ................................................................................................. 472
30.15.2.2 Ambient Temperature Offset Check....................................................................................................... 474
30.15.2.3 Chamber Temperature Offset Check ..................................................................................................... 474
30.15.2.4 Heating Top Check ................................................................................................................................ 475
30.15.2.5 Front Button Check ................................................................................................................................ 475
30.15.2.6 Status LED Check .................................................................................................................................. 476
30.15.2.7 Fans Check ............................................................................................................................................ 477
30.15.2.8 Lid Lifter Check ...................................................................................................................................... 478
30.15.2.9 Steploss Test Lid Lifter ........................................................................................................................... 479
30.15.2.10 Function Check Flap .............................................................................................................................. 479
30.15.2.11 Temperature Sensor Check ................................................................................................................... 481
30.15.2.12 Standby Control Check .......................................................................................................................... 481
30.16 Finalize Instrument ........................................................................................................... 482
30.16.1 Finalize Instrument ................................................................................................................................. 482
30.16.2 Print Report ............................................................................................................................................ 482
31 Maintenance and Cleaning ..................................................................................................... 484
31.1 Preventive Maintenance Plan .......................................................................................... 484
31.1.1 Yearly (Service Engineer Required) ....................................................................................................... 484
31.2 Cleaning of the Filter Slides............................................................................................. 485
31.3 Heat Exchanger ................................................................................................................. 486
31.4 Heat Exchanger with Peltier Element .............................................................................. 488
31.5 Maintenance of Cell Counting Camera ........................................................................... 489
31.6 Maintenance of Cooling Module ...................................................................................... 490
31.7 Wear Parts of the Injector ................................................................................................ 491
32 Troubleshooting ...................................................................................................................... 492
32.1 PC Power & USB port settings – Windows 10 ................................................................ 492
33 Technical Drawings................................................................................................................. 495
Index ................................................................................................................................................... 511
Tecan Customer Support ....................................................................................................................... 512
1 Safety
• Always follow basic safety precautions when using this product to reduce the risk of injury, fire, or
electrical shock.
• Read and understand all information in the Instructions for Use. Failure to read, understand, and
follow the instructions in this document may result in damage to the product, injury to operating
personnel or poor instrument performance.
• Observe all WARNING and CAUTION statements in this document.
• Never open the instrument while it is plugged into a power source.
• Never force a microplate into the instrument.
• Observe proper laboratory safety precautions, such as wearing protective clothing (gloves, lab coat,
safety glasses, etc.) and using approved laboratory safety procedures.
CAUTION: To ensure the optimal operation of the SPARK, an annual maintenance

procedure must be performed by a Tecan service engineer.
WARNING: If the instructions given in this manual are not followed properly, the safety of
the instrument cannot be guaranteed because the procedures might not be performed
correctly and the instrument could become damaged.
It is assumed that the instrument operators, because of their vocational experience, are familiar with the
necessary safety precautions for handling chemicals and biohazardous substances.
Adhere to the following laws and guidelines:
• National industrial protection law
• Accident prevention regulations
• Safety data sheets of the reagent manufacturers
WARNING: Depending on the applications, parts of the instrument may come in contact with
biohazardous/infectious material. Make sure that only qualified personnel operate the
instrument. In case of service or when relocating or disposing of the instrument, always
disinfect the instrument according to the instructions given in this manual.
2 General Description
2.1 Instrument
The SPARK is a multifunctional microplate reader platform and is robotic compatible.
2.2 Intended Use (Hardware and Software)

The SPARK multimode microplate reader with a modular design is intended for use in research
laboratories. When equipped with all modules, the instrument is intended for the measurement and
measurement data analysis of absorbance, fluorescence, time resolved fluorescence, fluorescence
polarization and luminescence of biological and non-biological samples. For cell based assays, the
instrument is also intended for the determination of cell number. Additionally, the reader is suited for both
endpoint and kinetic measurements with either single or multi-label measurements. The SPARK is
equipped with the SparkControl software for reader control and data reduction.
The user must evaluate this instrument and any associated data reduction packages with their specific
assays to ensure specified performance characteristics of the assay are met. The performance
characteristics of the instrument have not been validated for specific assays.
The SPARK multimode reader is for research use only.
CAUTION: A system validation by the operating authority is required. It is the responsibility

of any operating authority to ensure that the SPARK has been validated for every specific
assay used on the instrument.
2.3 User Profile
2.3.1 Professional User – Administrator Level
The administrator is a person who has suitable technical training and corresponding skills and experiences.
If the product is used as intended, the person is able to recognize and avoid dangers. The administrator
has extensive skills and is able to instruct the end user or the routine user in assay protocols in connection
with a Tecan product within the bounds of the intended use. Computer application skills and good English
skills are required.
2.3.2 End User or Routine User

The end user or routine user is a person who has suitable technical training and corresponding skills and
experiences. If the product is used as intended, the person is able to recognize and avoid dangers.
Computer application skills and good language skills for the respective national language at the installation
site and English are required.
2.3.3 Service Technician

The service technician is a person who has suitable technical training and corresponding skills and
experiences. If the product needs to be serviced or maintained, the person is able to recognize and avoid
dangers. Computer application skills and good English skills are required.
NOTE: Training dates, their duration and frequency are available at your customer support.
Address and phone number can be found in the web:
http://www.tecan.com/customersupport
2.4 Multifunctionality
The fully equipped instrument (Spark 10M or Spark 20M) is able to perform the following measurement
techniques.
Absorbance Fluorescence Scan
Absorbance Scan Fluorescence Polarization
Absorbance Cuvette Luminescence (Glow Type, Flash Type and
Multicolor)
Absorbance Scan Cuvette Luminescence Scan
Fluorescence Intensity Top (FRET) Alpha Technology
Fluorescence Intensity Bottom Cell Counting
Time Resolved Fluorescence (TRF, TR- Cell Confluence
FRET)
The instrument can be equipped with up to two injectors, a heater/stirrer, and a microplate stacker. Special
functionalities (such as cell counting, gas supply and lid lifting, temperature control - heating and cooling -
and humidity control) support cell based studies in particular.
2.5 Microplate Requirements
Any common microplate ranging from 1 to 384-/1536-well formats compliant to the following ANSI/SBS
standards can be measured with any of the above measurement techniques.
• ANSI/SBS 1-2004 (footprint dimensions)
• ANSI/SBS 2-2004 (height dimensions)
• ANSI/SBS 3-2004 (bottom outside flange dimensions)
• ANSI/SBS 4-2004 (well positions)
The Spark 10M supports microplates up to 384 wells. The Spark 20M supports microplates up to 1536
wells.
The supported range of the plate heights is 10 mm (without lid) up to 24.5 mm (including lid). For bottom
measurements, the elevation of the bottom of the well relative to the supporting plate rim must not be larger
than 5.5 mm.
In addition to the above mentioned microplate formats, cuvettes in an adapter, the Tecan NanoQuant Plate,
the Tecan MultiCheck Plate and the Tecan Adapter for Cell Chips can be used with limitations for selected
measurement techniques.
CAUTION: Tecan Austria GmbH has taken great care when creating the Plate Definition
Files (.pdfx) that are delivered with the instrument.
Tecan Austria has taken every precaution to ensure that plate heights and well depths are
correct according to the defined plate type. These parameters are used to determine the
minimum distance between the top of the plate and the ceiling of the measurement
chamber. Additionally, Tecan Austria adds a very small safety gap to prevent any damage
that may occur to the measurement chamber as a result of small changes in plate height.
This has no effect on the performance of the instrument.
Make sure that the selected plate definition file corresponds to the currently used
microplate, so that the safety gap is correctly calculated, otherwise the instrument could
become damaged.
NOTE: For instruments with the Spark-Stack module, additional microplate requirements
apply, see chapter 27.2 Microplate Requirements for the Spark-Stack
2.5.1 Filling Volumes/Smooth Mode
CAUTION: The following microplates can be processed only with the subsequent filling
volumes:
• 1-well plates: <= 15000 µl
Larger filling volumes can lead to an overflow of liquids, which can result in cross-
contamination. Additionally, the spillover can cause damage to the device
(e.g. contamination of the optics and the centering clamp).
If the working volume in the plate definition file (pdfx) is smaller than the above
defined volumes the smaller filling volumes must be used to avoid spilling
(e.g. Corning 384-well plates have a working volume of only 80 µl).
For fluids that have a lower viscosity than aqueous solutions, the filling volume should
additionally be optimized during method validation.
Smooth mode slows down the plate transport movements. Smooth mode is activated by selecting the
appropriate checkbox in the plate strip. Larger filling volumes than the ones defined above may be possible
when Smooth mode is selected; however, the maximum filling volumes for each plate type and application
must be optimized during method validation.
CAUTION: The maximum filling volumes for each plate type and application must be
optimized even if Smooth mode is used.
Smooth mode is selected by default if a plate format with less than 96-wells is selected in the measurement
method. Smooth mode is not available when using the onboard Retract/Eject button to move the plate
in/out.
CAUTION: Smooth mode is not available when using the onboard Retract/Eject button to
move the plate in/out.
NOTE: The Filling Volumes/Smooth Mode parameters listed above also apply to
microplates suitable for use with the Spark-Stack module, e.g. 6- to 1536-well formats (see
chapter 27.2 Microplate Requirements for the Spark-Stack).
2.6 Onboard Control Buttons
The Spark has onboard control buttons to simplify some common tasks.
An On/Off button is available on the front to easily switch the instrument on and off.
The Onboard-Start button is used to start favorite SparkControl Methods directly from
the instrument. It can also be used to stop a measurement, confirm user-defined user
interventions, and to continue kinetic measurements already paused via the software.
The Retract/Eject button allows microplates to be inserted or removed from the

instrument without software activation.
The Eject Filter button is used to move out the filter slides. The filter slides are moved
in automatically at insertion.
NOTE: For functionality of onboard Control Buttons in combination with the installed
microplate stacker module, see chapter 27 Stacker Module.
2.7 Instrument LEDs

The Spark is equipped with multi-color LEDs to optically signal the operation/activity state of the instrument.
The table below gives an overview of possible signals that define which functionalities (Onboard Control
buttons) are available at which instrument state.
Onboard Control Buttons
Led Status Instrument State Retract/ Eject Onboard-
Eject Filter Start
- OFF O O O
- STANDBY (5V) O O O
BLUE IDLE (not connected to SparkControl) X X X
MAGENTA IDLE (connected to SparkControl) X X X
GREEN RUN O O X
RED BLINKING ERROR O O O
YELLOW BLINKING USER INTERACTION X O X
GREEN BLINKING PAUSE X O X
5x CYAN BLINKING ACTION NOT POSSIBLE O O O
Table of LED states and functionalities. O = function not available. X = function available.
2.8 Rear View
Figure 1: Rear view of the instrument
NOTE: This figure is only an example. The labels on the instrument depend on options
installed and destination country.
1 Warranty Label: ATTENTION !
REMOVING OR BREAKING THIS SEAL VOIDS YOUR WARRANTY!
(also on bottom of instrument)
2 Temperature sensor cover
3 Name Plate (example)
4 Label: For Research Use Only.
5 Label: WARNING! Switch off the instrument before plugging in or unplugging the injector
module
6 Label: China RoHS Symbol
7 Label: Class 1 Laser Product
8 Label: Complies with 21 CFR 1040.10 except for deviations pursuant to
Laser Notice No. 50, dated June 24, 2007
9 Main Power Socket
10 Main Power Switch
11 USB 3.0 connection for camera
12 USB connection
13 Injector connection
14 CAN Cable to Cooling Module
15 CO2 connection (max 2 bar)
16 N2 connection (max 2 bar)
17 Supply: liquid cooling
18 Return: liquid cooling
19 Condensate outlet
20 Label: WARNING! Switch off the instrument before plugging in or unplugging the cooling
module
21 CAN Cable to Instrument
Example Name Plate
Contents of the name plate (e.g. model name and article number) may vary depending on the specific
model.
2.9 Instrument Dimensions
All dimensions are given in millimeters.
Instrument Front View
Instrument Side View
Two Syringe Injector with Heater Stirrer - Front View
Two Syringe Injector with Heater Stirrer - Side View
Injector Box - Front View
Injector Box - Side View
Heater/Stirrer - Front View
Heater/Stirrer - Side View
Heater/Stirrer - Top View
Spark with Cooling Module - Front View
Spark with Cooling Module - Side View
Spark with Spark-Stack – Front View
Spark with Stacker – Top View
Spark with Stacker – Rear View
Spark with Cooling Module and Stacker - Side View
Spark with Cooling Module and Stacker - Rear View
3 Instrument Installation
3.1 Spark Installation
When installing, moving, or connecting the instrument, follow the instructions in this document. Tecan does
not accept responsibility for injury suffered by anyone attempting these operations nor for damage incurred
to the instrument. Make sure the laboratory meets all the requirements and conditions described in this
chapter.
3.2 Installation Requirements for Spark

3.2.1 Required Working Area
Select a location to place the instrument that is flat, level, vibration free, away from direct sunlight, and free
from dust, solvents and acid vapors. Allow at least 10 cm distance between the back of the instrument and
the wall or any other equipment and 5 cm distance to any other equipment left and right to the instrument.
Ensure that the plate carrier and injector carrier cannot be accidentally hit when moved out.
Ensure that the main switch and the main cable can be reached at all times and are in no way obstructed.
For information regarding outer dimensions and weight of the instrument, see chapter 2.9 Instrument
Dimensions.
CAUTION: Install the instrument in a location that is flat, level, vibration free, away from
direct sunlight, and free from dust, solvents and acid vapors. Ensure that the plate carrier
and injector carrier cannot be accidentally hit when moved out.
CAUTION: Allow at least 10 cm distance between the back of the instrument and the wall or
any other equipment and 5 cm distance to any other equipment left and right to the
instrument. Do not cover the instrument while it is in operation.
CAUTION: Do not place heavy objects on the instrument cover. The maximum load for the
SPARK cover is 20 kg. However, the load must be distributed evenly across the entire
surface of the cover.
CAUTION: Only use the supplied USB cable. The instrument has been tested with the USB
cable delivered with the instrument. If another USB cable is used, Tecan Austria cannot
guarantee the correct performance of the instrument.
3.3 Unpacking & Inspection

1. Visually inspect the container for damage before it is opened.
Report any damage immediately.
2. Select a location according to chapter 3.2.1 Required Working Area.
3. Place the carton in an upright position and open it.
4. Lift the instrument out of the carton and place it in the selected location. Take care when lifting
the instrument and ensure that it is held on both sides.
5. Visually inspect the instrument for loose, bent or broken parts. Report any damage immediately.
6. Compare the serial number on the rear panel of the instrument with the serial number on the
packing list. Report any discrepancy immediately.
7. Compare the contents of the subpackage to the packing list.
Report any discrepancy immediately.
8. Save packaging materials and transport locks for further transportation purposes.
WARNING: The fully equipped SPARK is a precision instrument and weighs approximately
50 kg. At least two people must carefully lift the instrument from the box.
CAUTION: Do not overload the plate carrier. The maximum load for the plate transport is
275 g. Overloading the plate carrier can cause instrument damage which may require
service.
3.4 Power Requirements

The instrument is auto-sensing and it is therefore unnecessary to make any changes to the voltage range.
Check the voltage specifications on the rear panel of the instrument and ensure that the voltage supplied
to the instrument is correct to this specification.
The voltage range is from 100-120 V and 220-240 V. If the voltage is not correct, please contact your
distributor. Connect the instrument only to an electricity supply system with a protective ground.
CAUTION: Do not use the instrument if the voltage setting is not correct. If the instrument is
switched ON with the incorrect voltage setting it will become damaged.
3.5 Subpackages
NOTE: Always compare the contents of the subpackage with the delivered packing list.
The instrument packaging includes the following items:

• Cables (USB 2.0 and main)
• Software (USB stick)
• Instruction for Use (optional)
• OOB Quality Report
• CE Declaration of Conformity
• Final Test Protocol (COC)
• RoHS Notice
• Cuvette adapter
• Transport Lock Install/Uninstall Procedure
Additional subpackages depend on the modules installed:
• Filter slide metal box (Fluorescence Filter/Fusion Optics Module)
• Magnetic pad (Lid Lifter)
• Hose kit (Gas Control)
• Tecan Adapter for Cell Chips (cardboard box including 15 cell chips (Cell Counter))
• Injector dummy (Injector/Injector Ready)
• RoboFlask metal box (Centering clamp with set screw and spare screw)
• Metal box with user dichroic (including hex key for installation)
3.6 Options Packages
NOTE: Always compare the contents of the packaging with the delivered packing list.
The injector module packaging for one injector (basic module) includes the following items:
• Injector box
• Injector carrier
• Bottle holder
• PVC clasps
• Carbon needle
• Beakers for priming (2 x 1 ml; 1 x 50 ml)
• 125 ml bottle (light protective)
The injector module packaging for the second injector (extension module) includes the following items:
• Injector cardboard box
• Bottle holder
• PVC clasps
• Carbon needle
• Beakers for priming (2 x 1 ml)
The Heater/Stirrer option includes the following items:
• Heater/Stirrer module
• Main cable (basic module)
• Power supply (basic module)
• Beaker glass 100 ml (basic and extension module)
• Magnetic stirring bar (basic and extension module)
• Hex key
The NanoQuant option includes the following items:
• NanoQuant storage box
• NanoQuant Plate
• Pipetting Aid
• Safety Certificate
The Humidity Cassette option includes the following items:
• Humidity Cassette (cassette plus lid)
• Magnetic pad
The Te-Cool option includes the following items:
• Liquid cooling device
• Tubing set
• Condensate tubing
• CAN-cable
• Stoppers
• Coolant concentrate
The Spark-Stack microplate stacker consists of the following items (according to the order):
• Stacker module option
• Short stack option
• Set of 2 plate magazines for 30 plates per run
• Dark covers and lids
• Long stack option
• Set of 2 plate magazines for 50 plates per run
• Dark covers and lids
NOTE: A service engineer is required to install the Spark-Stack option.
CAUTION: All items delivered with the instrument and also all spare parts or supplemental
parts for the instrument are intended for use with the instrument only and are not for
general use.
3.7 Removal of the Transport Locks
CAUTION: Remove the transport lock before operating the instrument.
The instrument is delivered with the plate carrier locked into place, so that it cannot become damaged.
Before the instrument can be used, the transport locks (foam pieces) must be removed using the
following procedure:
1. Ensure that the instrument is disconnected from the main power supply.
2. Remove the tape from the filter compartment doors.
3. Remove the piece of foam from the left plate carrier compartment (see picture below).
4. Move the plate carrier out manually by pulling on the pieces of foam in the right plate carrier
compartment (see picture below).
5. Remove the top piece of foam first and then the bottom piece (see picture below).
6. Move the plate carrier in carefully by hand. It must be pushed in far enough so that th e plate
carrier compartment door can close (see picture below).
7. Rotate the remaining piece of foam 90° counter-clockwise and pull it out of the instrument
(see picture below).
CAUTION: Save packaging materials and transport locks (foam pieces) for further
transportation purposes. The instrument must be shipped only with the original packaging
and installed transport locks.
3.8 Power Requirements

The instrument is auto-sensing and it is therefore unnecessary to make any changes to the voltage range.
Check the voltage specifications on the rear panel of the instrument and ensure that the voltage supplied
to the instrument is correct to this specification.
The voltage range is from 100-120 V and 220-240 V. If the voltage is not correct, please contact your
distributor. Connect the instrument only to an electricity supply system with a protective ground.
CAUTION: Do not use the instrument if the voltage setting is not correct. If the instrument is
switched ON with the incorrect voltage setting it will become damaged.
3.9 Switching the Instrument On
CAUTION: Before the instrument is switched on for the first time, it should be left to stand
for at least 3 hours, so there is no possibility of condensation causing a short circuit.
1. Make sure that the main power switch on the rear panel of the instrument is in the OFF position.
2. Connect the computer to the instrument only with the delivered USB interface cable.
3. Insert the power cable into the main power socket (with protective ground connection) on the
rear panel of the instrument.
4. Connect the USB cable of the camera of the cell module (guided through the rear panel of the
instrument) to the USB 3.0 port of the computer.
CAUTION: The cell module camera must be connected to the USB 3.0 port of the computer
to avoid performance losses.
5. All connected devices must be approved and listed as per IEC 60950-1 Information Technology
Equipment – Safety or equivalent local standards.
6. Connect the injector, if required.
7. Plug in the heater/stirrer, if required.
CAUTION: Switch off the instrument before plugging in or unplugging the injector module.
CAUTION: Switch off the instrument before plugging in or unplugging the cooling module.
8. Switch ON the instrument using the main power switch on the rear panel of the instrument.
9. Start the software to connect to the instrument.
WARNING: Do not reach into the instrument while it is in operation!
3.10 Switching the Instrument Off

1. Ensure that the plate transport is empty.
2. In the SparkControl software, disconnect from the instrument by selecting Exit in the File menu
in the Method Explorer or Shut Down via the expandable Navigation bar on the left side of the
Dashboard.
3. Switch OFF the instrument by either using the onboard control button or the main power switch
on the rear panel of the instrument.
CAUTION: When switched off wait at least 5 seconds until switching the instrument on
again. Instrument errors can occur.
3.11 Preparing the Instrument for Shipping
• Before shipping an instrument with integrated cooling module (Te-Cool) the cooling liquid has to
be removed from the cooling system. See chapter 25.4.
• Before shipping an instrument with equipped the Te-Stack module, the module and the adapter
plate has to be removed. See chapter 27.4 (without cooling module) or see chapter 27.5 (with
cooling module).
CAUTION: Do not ship an instrument with integrated cooling module! Or installed stacker
module Only Tecan authorized service technicians are allowed to prepare instrument for
transportation.
CAUTION: The parking procedure has to be performed and the transport lock must be
mounted before shipping. If the instrument is shipped without these safety measures, the
instrument guarantee is rendered null and void. Use original packaging for shipping.
Before shipping the instrument, perform the parking procedure to avoid any damage to the optics and plate
transport (see 3.11.1 Parking Procedure). After the parking procedure has been performed, the plate carrier
transport locks must be installed (see 3.11.2 Installing the Plate Carrier Transport Locks).
Before shipping, the instrument (including the injector(s), heater/stirrer, humidity cassette, NanoQuant Plate
and any other external optional components) must be thoroughly disinfected (see 0
Instrument Decontamination/Disinfection).
The instrument (including the injector(s), heater/stirrer, humidity cassette, NanoQuant Plate and any other
external optional components) must be shipped in the original packaging.
WARNING: Always move the injector and the heater/stirrer separately, as the two units are
not attached to each other. When carried together, one of the units can easily fall and
become damaged.
3.11.1 Parking Procedure
1. Ensure that the plate transport is empty.

2. Ensure that the injector (dummy) is removed from the injector port.
3. In the SparkControl software, disconnect from the instrument by selecting Exit in the File Menu
in the Method Explorer or Shut Down via the expandable Navigation bar on the left side of the
Dashboard.
4. Use the onboard control buttons to first move out the plate carrier, then move out the filter
slides, and finally to power off the instrument.
5. Press the Eject Filter button to move out the filter slides.
6. Press the Retract/Eject button to remove microplates from plate carrier and keep the plate
carrier in the moved out position.
7. Press the On/Off button for 5 seconds to power off the Spark instrument and to bring all of
the modules into the park position for shipment.
8. On the rear side of the Spark, disconnect the power connector, the USB-cable and, depending on
the instrument, configure all additional modules.
1 Main Power Switch

2 Main Power Socket
3 USB connection
4 USB 3.0 connection for camera
5 Injector connection
8 Supply: liquid cooling
9 Return: liquid cooling
10 Condensate outlet
11 CO2 connection (max 2 bar)
12 N2 connection (max 2 bar)
8. Switch OFF the instrument by using the main power switch on the rear panel of the instrument.
9. Install the plate carrier transport lock (see 3.11.2 Installing the Plate Carrier Transport Locks).
3.11.2 Installing the Plate Carrier Transport Locks
The instrument must be shipped with the plate carrier locked into place, so that it cannot become damaged.
Before the instrument can be shipped, the transport locks (foam pieces) must be inserted using the following
procedure:
1. Ensure that the instrument is disconnected from the main power supply.
2. Hold the plate carrier compartment door down and insert the white piece of foam (shown below)
into the left compartment.
3. With the foam piece inserted, turn it 90° clockwise, so that the pointed end sticks down into the
space between the two compartment openings. This piece of foam holds the compartment doors
open.
4. Move the plate carrier out carefully by hand until it lightly presses against the inserted white
piece of foam from behind and cannot be moved out further.
5. Insert the bottom piece of foam first and then interlock the top piece into place (see picture
below).
6. Move the plate carrier into the right compartment manually as far as it can go by pushing on the
pieces of foam on the plate carrier.
7. Insert the piece of foam into the left plate carrier compartment (see picture below).
8. Tape the filter compartment doors shut (see picture below).
3.11.3 Packing the Spark without the Cooling or Cyto Module
1. Assemble the wooden crate and insert one side wall into the bottom part. Then insert the bottom
foam and keep the rear side part of the foam open to have access for loading the Spark
instrument. (see picture below).
2. Place the Spark instrument on the foam and insert the last rear side foam piece.
(see picture below)
3. Insert the three other side walls to the bottom part of the wooden crate (see picture below).
4. Insert the top foam onto the top of the Spark instrument (see picture below).
5. Place the cardboard box (subpack including filter slide box) onto the white top foam (see picture
below).
6. Close the wooden crate with the top part and secure the crate with a tension belt (metal or
plastic) (see picture below).
3.11.4 Packing the Spark with the Cooling or Cyto Module
1. Assemble the wooden crate and insert one side wall into the bottom part. Then insert the bottom
foam and keep the rear side part of the foam open to have access for loading the Spark
instrument (see picture below).
2. Place the Spark instrument on the foam and insert the last rear side foam piec e
3. Insert the second frame foam around the Spark instrument (see picture below).
4. Insert the three other side walls to the bottom part of the crate (see picture below).
5. Insert the top foam onto the top of the Spark instrument (see picture below).
6. Place the cardboard box (subpack including filter slide box) onto the white top foam
7. Close the wooden crate with the top part and secure the crate with a tension belt (metal or
plastic).
3.11.5 Packing the Injector Module
1. Insert the bottom foam into the cardboard box.
2. Insert the Injector module into the foam and be careful with the CAN-bus wiring.
3. Insert the top foam and guide the injector bar into place through the top foam.
4. Finally insert the top foam
5. Close the top of the cardboard box and tape it shut.
4 Plate Control
The plate transport is capable of moving horizontally (in the x- and y-directions) as well as vertically (in the
z-direction), so that for each measurement mode, top or bottom, the optimal measurement position can be
reached regardless of which plate type or filling volume is used. The movement speed is optimized
according to the plate type and detection mode.
CAUTION: Before starting measurements, make sure that the microplate is inserted correctly.
The position of well A1 has to be on the upper left side.
Figure 2: Microplate on the plate carrier with the A1 well in the upper left -hand corner
CAUTION: Tecan Austria GmbH has taken great care when creating the Plate Definition
Files (.pdfx) that are delivered with the instrument.
We take every precaution to ensure that the plate heights and well depths are correct
according to the defined plate type. These parameters are used to determine the minimum
distance between the top of the plate and the ceiling of the measurement chamber.
Additionally, Tecan Austria adds a very small safety gap to prevent any damage that may
occur to the measurement chamber as a result of small changes in plate height. This does
not affect the performance of the instrument.
Make sure that the selected plate definition file corresponds to the currently used
microplate, so that the safety gap is correctly calculated, otherwise the instrument could
become damaged.
CAUTION: Users should also take care that no potential fluorescent or luminescent
contamination lies on top of the plate as droplets, and also be aware that some plate
sealers leave a sticky residue that should be removed before measurement.
4.1 Z-Position
The height of the objective above the sample can be adjusted using the Z-position function. As excitation
light is reflected by the sample fluid, the Z-adjustment helps to maximize the signal-to-noise ratio.
4.2 Shaking
The Spark is capable of plate shaking before start of a measurement or in between kinetic cycles. Three
shaking modes are available: linear, orbital and double orbital. The shaking amplitude can be selected from
1 to 6 mm in steps of 0.5 mm. The frequency is a function of the amplitude. The shaking duration is
selectable from 1-3600 seconds.
4.3 Incubating/Cooling Position
The Spark has a predefined incubating/cooling position with an optimum temperature distribution. These
positions can be used for shaking or waiting step within a measurement run.
4.4 Lid Lifter

The lid lifter option consists of a permanent magnet and a magnetic pad. The magnetic pad can be mounted
on the lids of all commonly used microplate types with a maximum lid height of 11.5 mm. The magnetic
mechanism can be easily regulated by the software. To attach the pad, peel the paper backing off of the
metal disk and stick the pad onto the center of the lid.
CAUTION: The lid height must not exceed 11.5 mm.
CAUTION: Clean the lid with 70% ethanol before attaching the magnetic pad.
Figure 3: Lid with magnetic pad mounted in the middle
CAUTION: Make sure that the magnetic pad is mounted on the plate lid if Removable
Lid or Humidity Cassette is activated in the method.
CAUTION: Mount the magnetic pad in the middle of the appropriate plate lid to
guarantee optimal performance.
The lid lifter option is used to temporarily remove the lid of the microplate to execute, e.g. injection steps or
measurement steps within the workflow of a long term experiment thus avoiding sample evaporation.
The lid lifter in combination with the gas module option can also be used to improve the gas exchange
between the medium and the surrounding environment in case of cell based studies. Ventilation steps can
be inserted simply into the workflow and timed accordingly.
4.5 Securing the RoboFlask Cell Culture Vessels
A centering clamp is necessary to secure the RoboFlask Cell Culture Vessels (Corning, Inc.) onto the plate
carrier. This centering clamp must be installed before using RoboFlask Cell Culture Vessels. Perform the
following procedure:
• Move the plate transport out

• Put the centering clamp on the plate securing mechanism as indicated in the figure below.
• Fasten the screw by using the enclosed screw driver, taking care to avoid putting pressure on
the plate carrier.
CAUTION: Do not put pressure on the plate carrier when attaching the centering clamp.
A bent plate carrier can negatively influence the performance of the instrument and may
require service.
Two screws
Figure 4: Centering clamp for the RoboFlask Cell Culture Vessels
CAUTION: Do not use the RoboFlask Cell Culture Vessels without the centering clamp.
This can result in damage to the instrument.
NOTE: By using a higher number of flashes and/or a settle time result will be more
accurate.
5 Spark Platform
The Spark is a multimode reader platform. Each instrument variant can be equipped with a large number
of modules and functions. The following chapter provides an overview of the different modules:
Module/Function Characteristics
Absorbance Absorbance (Fast absorbance scan included) or
Absorbance Enhanced (Up to 1536-well)
NanoQuant Plate For low volume nucleic acid samples; Ready to
use Apps available for nucleic acid quantitation
and labeling efficiency.
Cuvette module For Absorbance measurements. Ready to use
app available.
Luminescence Standard Attenuation function (OD1 and OD2).
Up to 384-well.
Luminescence Enhanced Attenuation function (OD1, OD2 and OD3).
Wavelength discrimination.
Luminescence scan included.
Up to 1536-well
Alpha Technology AlphaScreen, AlphaLISA and AlphaPlex.
Alpha Enhanced (Up to 1536-well)
Fluorescence Standard Top Filter-only-, Monochromator-only- or Fusion
Optics-System available.
Up to 384-well.
Fluorescence Standard Bottom Filter-only-, Monochromator-only- or Fusion
VIS or UV-VIS fiber.
Up to 384-well.
Fluorescence Standard Bottom Area Scan Up to 100x100 data points/well
Fluorescence Standard Polarization Filter-only-, Monochromator-only- or Fusion
>300 nm or >390 nm fiber.
Up to 384-well.
Fluorescence Enhanced Top Filter-only-, Monochromator-only- or Fusion
More sensitive than Standard option.
Up to 1536-well.
Fluorescence Enhanced Bottom Filter-only-, Monochromator-only- or Fusion
Equipped with UV-VIS fiber.
1536-well optional.
Fluorescence Enhanced Bottom Area Scan up to 100x100 data points/well
Fluorescence Enhanced Polarization Filter-only-, Monochromator-only- or Fusion
Equipped with >300 nm fiber.
Up to 1536-well
Module/Function Characteristics
Cell Module: Cell Counting and Confluence Cell counting and viability in Tecan Cell Chips
(Ready to use Apps).
Cell confluence in microplates.
Spark-Stack Built-in microplate stacker designed for
automated loading, unloading and restacking of
plates.
Injector (one or two injectors) One or two injector options with different syringe
sizes.
Heater&Stirrer Both injector options can be equipped with
Heater/Stirrer module.
Heating 3 °C above ambient up to 42 °C
Cooling (Te-Cool) 18 °C up to 42 °C.
Gas control CO2 only or CO2 and O2.
Humidity Control Evaporation protection for different plate formats
for long-term studies (with cells).
Lid lifter Interactions during long-term studies (gas
exchange, injection).
Barcode reader Read barcodes automatically.
Fluorescence Standard and Fluorescence Enhanced options cannot be installed together in one
instrument.
6 Instrument Specifications
NOTE: All specifications are subject to change without prior notification.
The table below lists the technical specifications of the basic instrument:
General
Parameters Characteristics
Measurement Software controlled
Interface USB 2.0 or 3.0 (SPARK); 3.0 (SPARK CYTO)
Fusion Optics system Monochromator and Filter (external filter exchange) based
Microplates From 1 well to 1536 well SBS plates
Temperature control From 18° C up to 42 °C
Plate shaking Linear, orbital and double orbital shaking
Light source High energy Xenon flash lamp
Optics Fused Silica Lenses
Fluorescence detector Low dark current photomultiplier tube
Luminescence detector Low dark count photomultiplier tube
Absorbance detector Silicon photodiode
Power supply 100-120 V and 220-240 V, auto-sensing
Power consumption Operation: 350 VA, Standby: 25 VA
Physical
Outer dimensions Width: 494 mm (19.5 in.)
Height: 395 mm (15.5 in.)
Height (with cooling module): 510 mm (20.1 in.)
Height (with injector carrier): 455 mm (17.9 in.)
Depth: 557 mm (21.9 in.)
Depth (carrier moved out): 699 mm (27.5 in.)
Weight
Instrument 40 kg (88 lb.)
Instrument with cooling 50 kg (110 lb.)
module
Injector (2 channel) 4.0 kg (8.8 lb.)
Heater/Stirrer 2.7 kg (6 lb.)
Environmental
Operating temperature +15 °C to +35 °C 59 °F to 95 °F
Operating temperature with active +15 °C to +30 °C 59 °F to 86 °F
cooling
Transportation temperature -30 °C to +60 °C -22 °F to +140 °F
Operating humidity 20 % to 90 % (non-condensing)
Operating humidity with active 20 % to 80 % (non-condensing)

cooling
Transportation humidity 20 % to 95 % (non-condensing)
Operating pressure 700-1050 hPa

Transportation pressure 500-1100 hPa
Overvoltage category II
Pollution degree 2
Usage Commercial
Noise level < 60 dBA
Method of disposal Electronic waste (infectious waste)
7 Cleaning and Maintenance
7.1 Introduction
The cleaning and maintenance procedures are important in order to prolong the instrument's life and to
reduce the need for service. This section contains the following information:
• Liquid Spills
• Instrument Disinfection
• Disinfection Procedure
• Safety Certificate
• Disposal
CAUTION: Keep the plate transport clean! Take special care of the clip mechanism that
secures the microplates. Insufficient plate fixation can lead to instrument damage.
Excessive soiling requires service.
7.2 Liquid Spills

1. Wipe up the spill immediately with absorbent material
2. Dispose of contaminated material appropriately
3. Clean the instrument surfaces with a mild detergent
4. For biohazard spills, clean with B30 (Orochemie, Germany)
5. Wipe cleaned areas dry.
CAUTION: Always switch off the instrument before removing any kind of spills on the
instrument. All spills must be treated as potentially infectious. Therefore, always adhere to
applicable safety precautions (including the wearing of powder-free gloves, safety glasses
and protective clothing) to avoid potential infectious disease contamination.
Additionally, all resulting waste from the clean-up procedure must be treated as potentially
infectious and the disposal must be performed according to the information given in
chapter 7.4 Disposal. If the spill occurs in the instrument, a service technician is required.
7.3 Instrument Decontamination/Disinfection
WARNING: The disinfection procedure should be performed according to national,

regional, and local regulations.
WARNING: All parts of the instrument that come into contact with potentially infectious or
any hazardous material must be treated as potentially infectious areas.
It is advisable to adhere to applicable safety precautions (including the wearing of
powder-free gloves, safety glasses and protective clothing) to avoid potential infectious
disease contamination when performing the disinfection procedure.
WARNING: It is very important that the instrument is thoroughly disinfected before it is

removed from the laboratory or before any service is performed on it.
CAUTION: Ensure that the microplate is removed from the instrument before it is prepared
for shipment. If a microplate is left in the instrument, fluorescent solutions may spill onto
the optical parts and damage the instrument.
Before the instrument is returned to the distributor or service center, all outer surfaces and the plate
transport must be disinfected and a safety certificate must be completed by the operating authority.
If a safety certificate is not supplied, the instrument may not be accepted by the distributor or service
center or custom authorities may hold it.
7.3.1 Disinfection Solutions
The instrument (Front, Cover, Plate transport) should be disinfected using the following solution:
• B30 (Orochemie, Germany)
CAUTION: The disinfection procedure should be performed by authorized trained personnel

in a well-ventilated room wearing disposable gloves and protective glasses and clothing.
7.3.2 Disinfection Procedure
CAUTION: The surface disinfectant can negatively influence the performance of the
instrument, if it is applied or accidentally gets inside the instrument.
CAUTION: Make sure that the microplate has been removed from the instrument before
starting disinfection procedure.
If the laboratory has no specific disinfection procedure the following procedure should be used to disinfect
the outside surfaces of the instrument:
1. Wear protective gloves, protective glasses and protective clothing.
2. Prepare a suitable container for all disposables used during the disinfection procedure.
3. Disconnect the instrument from the main power supply.
4. Disconnect the instrument from any external components that are used.
5. Carefully wipe all outside surfaces of the instrument with a lint-free paper towel soaked in the
disinfection solution.
6. Perform the same disinfection procedure on the plate carrier.
7. Perform the disinfection procedure on any external components that are used with t he
instrument.
8. Complete the Safety Certificate and attach it to the outside of the box so that it is clearly visible.
See below for information about the Safety Certificate, which must be completed before the instrument is
returned to the distributor/ service center.
CAUTION: The plate transport should only be moved manually when the instrument is
disconnected from the main power supply.
7.3.3 Safety Certificate

The Safety Certificate must be requested from your local Tecan Customer Support (refer to
http://www.tecan.com/ for contact information).
To ensure the safety and health of personnel, our customers are kindly asked to complete two copies of
the Safety Certificate and attach one copy to the top of the container in which the instrument is returned
(visible from the outside of the shipping container!) and attach the other copy to the shipping documents
before shipping it to the service center for service or repair.
The instrument must be decontaminated and disinfected at the operating authority’s site before shipping
(see chapter 7.3.2 Disinfection Procedure).
The decontamination and disinfection procedure must be performed in a well-ventilated room by authorized
and trained personnel wearing disposable powder-free gloves, safety glasses and protective clothing.
The decontamination and disinfection procedure must be performed according to national, regional, and
local regulations. If a Safety Certificate is not supplied, the instrument may not be accepted by the service
center.
7.4 Disposal
Follow laboratory procedures for bio-hazardous waste disposal, according to national and local regulations.
This section provides instructions on how to lawfully dispose of waste material accumulating in connection
with the instrument.
CAUTION: Observe all federal, state and local environmental regulations.
CAUTION: Directive 2002/96/EC on waste electrical and electronic equipment (WEEE)

Negative environmental impacts associated with the treatment of waste:
• Do not treat electrical and electronic equipment as unsorted municipal waste
• Collect waste electrical and electronic equipment separately
7.4.1 Disposal of Packaging Material

According to Directive 94/62/EC on packaging and packaging waste, the manufacturer is responsible for
the disposal of packaging material.
Returning Packaging Material

If you do not intend to keep the packaging material for future use, e.g. for transport and storage purposes,
return the packaging of the product, spare parts and modules via the field service engineer to the
manufacturer.
7.4.2 Disposal of Operating Material

CAUTION: Biological hazards can be associated with the waste material (i.e. microplate) of
the processes run on the SPARK.
Treat the used microplate, cell chips, other disposables, and all substances used, in
accordance with good laboratory practice guidelines.
Inquire about appropriate collecting points and approved methods of disposal in your
country, state or region.
7.4.3 Disposal of the Instrument

Please contact your local Tecan service representative before disposing of the instrument.
CAUTION: Always disinfect the instrument before disposing.
Pollution Degree 2 (IEC/EN 61010-1)

Method of Disposal Contaminated waste
CAUTION: Depending on the applications, parts of the instrument may have been in
contact with biohazardous material. Make sure to treat this material according to the
applicable safety standards and regulations.
Always decontaminate all parts before disposal.
7.5 NanoQuant Maintenance
In achieving optimal measurement results, the cleaning of the NanoQuant Plate is one of the most essential
parts of the entire measurement procedure. There are two procedures for cleaning the NanoQuant Plate:
7.5.1 Cleaning Procedure with Ultrasonic Bath

1. Fill an ultrasonic bath with water and place a suitable beaker filled with distilled water into the
ultrasonic bath.
2. Switch on the ultrasonic and immerse the lid of the NanoQuant Plate into the beaker, with
bobbing movements for about 20 seconds. Take care not to immerse the hinge of the plate.
3. Repeat the procedure with the bottom part of the NanoQuant Plate.
4. Remove any surplus water from the NanoQuant Plate with dry and oil-free compressed air.
7.5.2 Cleaning Procedure with Kimwipe

1. Moisten a laboratory Kimwipe with 70 % ethanol and clean the inner and outer surfaces of the
NanoQuant Plate.
2. Moisten a piece of cotton or Kimwipe with distilled water and clean both sides of each quartz
lens on the NanoQuant Plate.
3. Wipe off any excess liquid with a dry Kimwipe.
After cleaning, store the plate in a dirt-free and lint-free place. No lint, nor any kind of dirt or streaks, should
be on the quartz lenses. Any contamination can lead to false measurements. When measuring many
different samples one after the other, the quartz wells can be cleaned with a (wet) Kimwipe. The cleaning
and maintenance procedures are important in order to prolong the NanoQuant Plate’s lifespan and to
reduce the need for servicing. It is recommended to store the cleaned NanoQuant Plate in the original
storage box.
CAUTION: Lint, dirt or fingerprints on the quartz lenses may alter the OD values significantly!
Avoid getting dirt on the spacers as this can lead to a change in the length of the light path
of the NanoQuant Plate and thus alter the OD values. Apply samples only onto clean
quartz lenses!
7.6 Injector Cleaning and Maintenance

The required maintenance may vary with your application. The following procedures are recommended for
optimal performance and maximum life of the injector system.
CAUTION: To avoid reagent mixing and cross-contamination, rinse the whole injector
system thoroughly between different applications requiring the injector(s).
Daily Maintenance
If not otherwise stated by the manufacturer of the kit used, the following tasks must be performed daily:
• Inspect the syringes(s) and tubing for leaks.
• Flush the whole system thoroughly with distilled or deionized water after each use and when the
syringe is not in use. Failure to do so can result in crystallization of reagents. These crystals can
damage the syringe seal and valve plug, which can result in leakage.
CAUTION: Do not allow the syringes(s) to run dry for more than a few cycles.
Weekly/Periodical Maintenance
The injector system (tubing, syringes, inject needles) must be cleaned weekly to remove precipitates such
as salts and eliminate bacterial growth.
Follow these steps to clean the syringe/injector system with 70 % EtOH (ethanol):
1. Depending on the user’s application thoroughly flush the system with buffer or distilled water
before rinsing with 70 % EtOH.
2. Rinse the syringe with 70 % EtOH with syringes fully lowered for 30 minutes.
3. After the 30-minute period, cycle all the fluid from the syringe and tubing into a waste container.
4. Rinse the syringe/injector system with 70 % EtOH.
5. Rinse the syringe/injector system with distilled or deionized water. Leave the fluid pathway filled
for storage.
6. Clean the end of the injector needles carefully with a cotton swab soaked in 70 % ethanol or
isopropanol.
WARNING: Risk of fire and explosion!

Ethanol is flammable and when improperly handled can lead to explosions.
Proper laboratory safety precautions must be observed.
7.7 Maintenance and Cleaning of the Cell Chip

Adapter
The cell chip adapter can be cleaned by applying the following procedure:
1. Wear protective gloves, protective glasses and protective clothing.
2. Empty the cell chip adapter and carefully remove the springs installed on the inside of the
adapter lid.
3. Carefully wipe all outside surfaces of the adapter and the springs with a lint-free paper towel
soaked with 70 % ethanol.
4. Allow to dry.
5. Reinstall springs before using the adapter.
CAUTION: Don’t use the cell chip adapter without springs! Measurement errors may result.
7.8 Liquid Cooling Device Maintenance

For liquid cooling device maintenance, refer to the operating manual, Thermoelectric Re-circulating Liquid
Chiller MRC 150/300 (Laird Technologies GmbH).
For daily maintenance, inspect the tubes for kinks and leaks and check that all tubes are connected
properly. Check if the Liquid Chiller is filled up with cooling fluid.
8 Service Tools & Kit
8.1 General
The Spark is a newly developed reader and therefore new adjustments and service tools are required to
repair the various options of the reader. Some of the tools are self-explanatory and some will be described
in detail and instructions given in the service training.
For the repair of a full loaded Spark reader it is necessary to have all tools available and therefore Tecan
has developed a service case or tool kit equipped with all of the necessary adjustment tools. Extra space
has been reserved for additional tools such as the MultiCheck Plus plate.
Included in this chapter are also lists of external tools which are also required to adjust or repair the Spark
reader. All external tools must be purchased and if necessary calibrated directly at the manufacturer’s site.
NOTE: External tools are needed to perform repairs on the Spark reader.
The service tool kit is comprised of three levels.

• Top Level: screw driver handle with exchangeable bits & spacer
• Bottom Level: Heavy tools are stored like service feet
• Middle Level: Adjustment tools and plates are stored
8.2 Bottom Level
The bottom level consists of:

1. Four piece of service adapter feet. The usage and the functionality are the same as when
previously used with the Infinite reader.
2. Adapter plate for adjusting the plate transport
3. Tools for the injector holder to work with a balance
4. Cable support tools
5. Tool for positioning the absorbance measurement head
6. Tool for adjusting the absorbance mirror
7. Cable holders
Screws for service adapter feet and adapter plate for plate transport
8.3 Middle Level
The middle level consists of:

1. Tools for the injector holder to work with a balance
2. Adapter adjustment (Z-transport).
3. Motor adjustment tool
4. Motor tool power supply with adapter cable, additional adapter cable for the FIM plate transport
motors
5. Service filter slides, EX and EM (EX 485nm, EM 535nm).
6. Tool for cell counting light module to fix focus position
7. Tool for cell counting light module for spacer between LED and aperture wheel
8. Adjustment tool for absorbance cuvette offset
9. Home position pin for fluorescence bottom fiber and FP
10. Home position pin for order sorting filters and aperture wheel FI bottom
11. Adapter plate for Hellma cuvette to adjust absorbance wavelength accuracy
12. Cell counting adjustment plate
13. Plate absorbance with filter BG39 (for blocking test and Z-min offset).
14. Alignment tool for injector X/Y offset and tool to unlock the housing screw
3 piece diffuser for the spectrometer tool needed for fluorescence filter configuration only.
8.4 Top Level
The top level consists of:

1. Spacer for the distance of the order sorting filter
2. screw driver handle with extension
3. exchangeable bits (Allen and Torx bits with ball heads in various size)
4. Hand pump to empty the cooling system
5. Tubing for the cooling module
6. Extension feet for cooling module
7. Screws to fix the extension feet
9 Spectrometer Tools
9.1 USB 4000 Spectrometer Kit
See documentation which is delivered together with the Spectrometer Tool Kit.
9.2 Flame Spectrometer Kit

See documentation which is delivered together with the Spectrometer Tool Kit.
10 Hellma Glass Cuvette
10.1 Description of the Cuvette
The Hellma cuvette from the type 666-F7 consist of didymium glass and will be supplied with a calibration
certificate and a serial number.
More information from the supplier Hellma:

www.hellma-analytics.com/text/273/en/didymium-glass-filter.html
10.1.1 Intended Use

The Hellma glass cuvette can only be used by Tecan trained service technicians. It is used to check the
check and adjust the absorbance wavelength accuracy of monochromator or cuvette Spark instruments.
10.1.2 Recalibration of Hellma Glass Cuvette

The Hellma glass cuvette must be sent only once to Tecan Austria for calibration. An In House Repair Order
= RMA number must be obtained from the regional Help Desk and the following information must be
presented:
• Material number of the Hellma glass cuvette
• Serial number of the Hellma glass cuvette
• Safety Certificate (completely and correctly filled-in).
Finally, pack the aluminum suitcase in a suitable container and send it to the following address:
Tecan Austria GmbH
Untersbergstr. 1A
A-5082 Grödig
RMA 5xxxxxx
NOTE: We recommend sending the spectrometer to Tecan Austria using a reliable shipping
company, which uses a tracking number, so that the location of the package can be
determined along its route.
11 Removing the Instrument Cover
11.1 Removing the Top Cover
To remove the top cover of the Spark readers, use the following procedure:
If the reader is equipped with an injector, remove the injector carrier and the securing ring under the injector
carrier cap by using the injector positioning tool from the tool kit (see chapter 8. Service Tools & Kit).
1. Switch off the instrument and disconnect the power cable and the injector CAN bus cable from the
Spark.
2. Check if the filter slides are in position, so that the instrument cover can be removed freely.
3. Remove the 2 screws on the rear side.

4. Open the filter flap and remove the 2 screws. When removing the two front screws - push the cover
down accordingly to avoid damage to the screws.
5. Lift up the housing.
To install the housing, perform the above steps in reverse order.
11.2 Removing the Optics Base Plate
To get access to the lower level of the Spark reader or the plate transport it is necessary to lift up the optics
base plate. For this procedure it is necessary to use the 4 service adapter feet from the service tool kit (see
chapter 8.2).
NOTE: The optic unit on a full loaded Spark has a weight of 25kg!
To install the 4 adapter and service feet, use the following procedure
NOTE: Depending on the instrument configuration, not all listed steps are required,
however be careful not to skip any numbered steps.
1. Remove the instrument’s top cover (see chapter 11).

2. Remove the 3 screws of the power distribution board (PCBA PODI NR) on the rear side of the
instrument. Also remove the screw on the optic unit and move the PODI PCBA outside to
disconnect the wiring.
CO100 power
3. Disconnect the connector CO100 power connector to the power supply to get full access to the
other connectors on the board.
4. Disconnect the connector CO304, CO305 fan heat exchange, CO306 fan measurement area
• If the Smart Temp option is installed:
Disconnect the ST5 connector of the Peltier-Element of the heat exchanger.
• If the GAS option is installed:

Disconnect the gas buzzer on the rear side of the instrument.
Disconnect the CO105 CAN-bus cable on the top and 24V power cable of the PODI board.
If the stacker option is installed: Disconnect C0103 from the PODI board.
• If the cell counting option is installed:
If the USB 2.0 Camera is installed, disconnect the USB-cable of the camera from the PODI board.
Disconnect the wiring of the laser diode.
5. Then remove the grounding cable (see below).
• If the Fluorescence Bottom option is installed:
Disconnect the ribbon cable from the universal measurement head board.
Disconnect the bottom fibers from the universal measurement head board (see picture below) and
pull them off under the absorbance monochromator.
WARNING:
Be careful not to excessively or unnecessarily bend the optical fibers, as they are very fragile.
Before the transport main board is tipped, the USB cable, the temperature sensor of the heat foil and the
distance holder of the luminescence fiber must be disconnected/removed. Then remove the two screws of
the angle holder and move the holder down carefully.
• If the Luminescence Alpha option is installed
Disconnect the Door Home sensor from the PCBA safety
6. On the PCBA main transport following connections needs to be disconnected:

Plate Detection, Door Home, Door Open, Temperature Chamber und Door Motor (ST803).
• If the Absorbance option is installed:

Remove the 2 screws to remove the small cover of the absorbance MCR.
Loosen the set screw of fiber and pull out the absorbance fiber of the MCR housing carefully.
Disconnect the signal cable of the absorbance reference diode on the PCBA absorbance.
• If the Absorbance Cuvette option is installed:

Loosen the set screw of fiber on the cuvette measurement head and pull out the absorbance
fiber.
ABS Fiber
7. Disconnect the ribbon cable from the Onboard Control buttons key board foil (see picture below).
8. Install the 4 adapters and service feet on the optics base plate.
9. Remove 2 of the M5 screws on the rear side and remove 2 of the M5 screws on the front side
(see picture above).
10. Loosen the 2 middle M5 screws but do not remove the screws (See number 9).
11. Install the 4 angle holder with the screws (See number 10).
12. Install the 4 adapters and the service feet with the thumb screws.
13. Install the 3 brackets to guide the fibers and cables to the bottom chassis, when lifting out the
optics base plate.
14. Lift up the SPARK up onto the front feet, 90° to the back (see picture above).
15. Hold the feet diagonally and turn the SPARK 90° downward until the instrument is completely
turned upside down.
16. Remove the 2 (M5) middle screws.
17. Carefully lift the bottom chassis up and off.
WARNING: Be careful not to bend or damage the fibers or cables.
To install, repeat the above steps in reverse order.
Perform these steps in the Service Software:
General
- 30.13.6 Check Module Communication
Instrument
- 30.15.2.11 Temperature Sensor Check
Cell Counting
- 19.5.1 Adjustment Cell Counting (all)
- 19.5.2 Test Cell Counting (all)
Transport
- 13.5.1 Adjustment Plate Transport
- 13.5.2 Test Plate Transport (all, - except the test Plate Carrier Tilt)
Absorbance
- 14.10.1.2 Plate Transport Offset X/Y
- 14.10.2.1 Plate Transport Offset Check X/Y
- 14.10.2.11 Reference Signal Check ABS/ 14.10.2.12 Reference Signal Check CUV
Fluorescence
- 15.6.1 Adjustment Fluorescence (adjust all FI Top, FP and Bottom Plate Transport Offset X/Y)
- 15.6.5 Test Fluorescence (check all FI Top, FP and Bottom Plate Transport Offset X/Y)
Luminescence
- 16.10.1 Adjustment Luminescence (all)
- 16.10.2 Test Luminescence (all)
Injector
- 18.9.1.1 Injector Position Z-Offset
- 18.9.1.2 Injector Position X/Y-Offset (all)
Gas
- 21.6.1 Gas Valve Check
- 21.6.3 Gas Buzzer Check
FIM
- 28.12.1 Adjustment FIM (all)
- 28.12.2 Tests FIM (all)
11.3 Installation of Optics Base Plate
To install the optics base plate, please see chapter 11.2. When installing the optics base plate on the bottom
chassis, check that the indicator is in the middle when tightening the M5 screws.
11.4 Removing the Bottom Plate
Make sure the instrument is switched off and disconnected from the main power supply before removing
the bottom plate. To take off the bottom plate, remove the 8 screws as shown in the picture above.
12 Electronics & Interfaces
12.1 Electronic Components
Before any electronic components are uninstalled or installed, it is necessary to power off the instrument
and to disconnect them from the power circuit. Furthermore, ESD guidelines must be complied with before
any work on electronic components are performed.
12.2 Motor Tool

The motor tool controls every stepper motor of the Spark reader. With this tool it is possible to move the
motors to their respective home positions. It is also possible to check the function of the home sensors.
Additionally, the tool makes it possible to change the current to the motors.
1 - Power ON/OFF: Main switch for power.

2 - Motor connector: Connection of the stepper
motor
3 - Sensor connection: Connection of the steeper
motor home sensor
4 - Motor current: Adjustment of the stepper motor
current level
5 - Home CCW: Movement in counter clockwise
direction of the home position
6 - CCW: Movement counter clockwise
7 - Home CW: Movement in clockwise direction of
the home position
8 - CW: Movement counter clockwise
9 - 24V Power: DC Power connection to power
supply
10 - Stop: Button for stop during motor run
11 - Sensor polarity: Adjustment of sensor polarity
12 - Home LED: Display blue light when motor is in
home position
12.3 Motor Overview

Sensor Polarity Motor current Button
Motors
Low/High 200/400/800mA CW/CCW
X Motor H 400 CW
Y Motor H 400 CW
Z Motor H 400 CW
Aperture wheel motor (Cell-Counting) H 400 CCW
FP Motor EM H 200 CW
FP Motor EX H 200 CW
Filter slide motor H 400 CW
Flap motor H 400 CW
Injector Z motor H 200 CW
FI-Bottom motor H 200 CCW
Order sorting motor EX&EM H 400 CCW
Order sorting motor Absorbance H 400 CCW
Mirror slide motor
H 200 CW
(universal measurement head)
Lumi aperture wheel motor H 400 CW
12.4 CAN Bus System
For the communication between the sub-modules in the SPARK, a CAN Bus system is used. The CAN Bus
or Controller Area Network is a serial data bus with a transfer rate up to 1,000,000 Bit/s (approx. 30 pages
per second). The CAN consists of a bus structure which means that each bus station which is connected
can communicate with every bus station in the can bus cycle. Each bus station is allowed to send files from
a master.
With the system it is also possible to have multi-casting. This means that more than one bus station can
receive data and evaluate at the same time. The CAN System was developed by BOSCH.
12.5 Handshake System

The four wire flat cable handshake system is connected from the PCBA Main Transport ST302 to the
absorbance monochromator ST403 and the universal measurement head ST403.
The hand shake wire system is a synchronization system for fast measurements such as “on the fly”. It
depends on what the customer selects in the user software. If the transport movement and the amount of
selected flashes allow on the fly measurements then the instrument uses the handshake system to
synchronize the movements with the measurements.
Single measurements with transport slow motion do not need the handshake system. If single
measurements are working and fast on the fly measurements are not working, then check the ribbon cable
from the handshake system or the electronic boards.
MAIN
Transport
ST302
ST 403 ST 403
MCR
FI Head
Absorbance
FW*_Mono FW*_Mono FW*_Mono
Mono Motor MCR MCR

Excitation Emission
The red lines in the overview above show the handshake system.
12.6 USB
USB 2.0 and USB 3.0 technology is used inside the Spark reader.
12.7 Firmware Overview
The Spark has 15 firmware versions and they are split dependent of the configuration on up to 17 PCBAs.
If a module has to be replaced it is important to know which firmware is required (see picture above).
In the service software, it is possible to download a firmware package which includes all the firmware
versions.
All monochromators use the same firmware to control the motors. The results of the measurements of the
absorbance monochromator are calculated on the measurement board. The results of the measurements
of the fluorescence monochromators are calculated on the universal measurements head PCBA. The
fluorescence polarization and the fluorescence bottom use the same firmware to control the stepper motors.
12.8 Overview of the Electronics

The electronics of the Spark use a CAN Bus system for the internal communication with the sub modules.
A USB connection is used to transfer measurement data of the sub-modules. The CPU boards of the EX,
EM fluorescence monochromator and the absorbance monochromator use the same firmware and the
coding will be detected with the connection position of the ribbon cable.
This connection coding will also happen on other modules therefore it is very important to know where the
modules are connected.
NOTE: Always check if the module is corrected connected
Additionally, hand-shake connections are used to control the measurement signals of the monochromators.
Further details about the electronic connections are shown in the electronic overview drawings (see chapter
32).
12.8.1 Disconnecting the Plug Connector
CAUTION: Plug connections of the electronic boards can be only disconnected if the lock is
opened beforehand!
Before disconnecting a connectors of the motors or sensor from a board it is important to push the locking
mechanisms and then the pull the connector.
12.9 PODI Board
The PODI (power distribution board) board has the following functions:
• All USB-connections of the sub modules are connected to the PODI board, therefore it functions
as a USB hub.
• The power will be distributed by the PODI board to each module. The connections are protected
with 2A SMD fuses.
• The CAN-Bus communication to the internal modules
• The power distribution and CAN-Bus communication to the external modules (Injector, Te-Cool)
F100
12.9.1 Electronic Hub PODI Board
The main power from the power supply is connected with connector CO100 to the PODI board (PCBA
PODI NR). The power is distributed on the connectors CO108 – CO115 to the sub modules. The USB
signals are distributed from the connectors CO402 – CO406 to the sub modules. The cell counting camera
is connected to the USB-A connector.
After replacing the board (PCBA PODI NR) the following software steps are needed in the service software:
- 30.8.1 Assemble Instrument (only possible if PASS is open but not connected with the Spark)
General:
- 30.13.1 Firmware Download
- 30.13.2 Configure Instrument
- 30.13.3 Default Settings (only PODI)
- 30.13.5 Set Serial Numbers (XXXXP0XXXX)
- 30.15.1.1 Counter (reset the counter PODI ONTIME)
12.9.2 Electronic Hub PODI Board - Noise Reduction
The main power from the power supply is connected with connector CO100. The power is distributed on
the connectors CO108 – CO115 to the sub modules. The USB signals are distributed from the connectors
CO402 – CO406 to the sub modules. The cell counting camera with USB 2.0 is connected to C0401
connector.
Replacement
After replacing the board (PCBA PODI NR) the following software steps are needed in the service software:
General:
- 30.13.3 Default Settings (only PODI)
- 30.13.5 Set Serial Numbers (XXXXP0XXXX)
- 30.15.1.1 Counter (reset the counter PODI ONTIME)
Fuse (SET 10 PCE FUSE SLOW-BLOW 3A, SET FUSE 2A SLOW BLOW5*20 10PCE) overview:
F114: processor
F115: stacker
F116: PLT element
F100: +5V DC stand-by power
F105-113: measurement modules
F104: PCBA main transport
F300: fans heat exchanger
F301 & 302: heat foil
F111, F112 & F103: the measurement modules
12.9.3 Main Transport Board
The PCBA main transport (PCBA MAIN TRANSPORT MODULE) together with the PCBA PODI (PCBA
PODI NR) provide the central communication for the SPARK reader. (see chapter 12.7).
The main function of the board is to control the plate transport as well as electronic components such as
sensors and motors installed on the bottom chassis.

General:
- 30.13.5 Set Serial Numbers (XXXXM0XXXX)
- 30.13.3 Default Settings (only MTP)
- 30.13.7 Adjust - Plate Transport Motor Type
Instrument:
- 30.15.1.1 Counter
- 30.8.5.6 Instrument Settings - Download the original Settings
- 30.15.1.2 Ambient Temperature Offset Adjustment
- 30.15.1.3 Chamber Temperature Offset Adjustment (Inheco plate needed)
- 30.15.1.4 Adjustment - Temperature Offset Heating Top Adjustment (Inheco plate + adapter
needed, only for Instruments with FW package ≥ 7.xx)
- 30.15.2.2 Ambient Temperature Offset Check
- 30.15.2.3 Chamber Temperature Offset Check (Inheco plate needed)
- 30.15.2.4 Heating Top Check (Inheco plate + adapter needed - only for Instruments with FW
package ≥ 7.xx)
- 30.15.2.8 Lid Lifter Check
Stacker:
- 27.12.1.1 Stacker Load Position LEFT or RIGHT Adjustment
- 27.12.2.4 Stacker Module Integration
12.9.4 Replacement of Rear Fans
To replace the fans (WIRING FAN 45CM) on the rear side see picture below. First the instrument housing
must be removed (see chapter 11.1) and then the PODI board must be removed (see chapter 12.9.5).
1. Remove the plastic frame from the fans.

2. Remove the dust filter.
3. Remove the fan holder by removing the 4 screws.
4. Remove the fan.
5. Disconnect the fans on the PODI board
• CO302 fan rear side panel left
• CO303 fan rear side panel right
Instrument
- 25.11.3 Fan Check
12.9.5 Replacement of Power Supply
To replace the power supply (POWERSUPPLY 350W) it is necessary to power off the instrument and
disconnect the power cable. Then it is save to take off the housing (see chapter 11).
WARNING: First disconnect the power cable before working on the electronics or the power
supply.
1. Remove the screw of the PODI board on the optics base plate.
2. Remove the 3 screws on the rear side of the SPARK to remove the PODI board and disconnect the
power supply connection CO100 from the power supply (top).
3. Remove the 4 screws of the rear panel on the optics base plate.
4. Remove the 4 screws of the power supply on the optics base plate.
5. Remove the 4 screws of the power supply on the rear side.
6. Pull the rear panel off the optics base plate (see picture below).
7. Remove the complete rear panel and disconnect all wires from the power switch.
Disconnect:
GND
N
L
8. Remove the 4 screws on the rear side of the power supply housing to take off the power supply
9. Disconnect the connector and uninstall the power supply.
To install the power supply follow the above steps in reverse order.
WARNING: It is absolutely necessary during the assembly to check that the ground cables
are connected and not missing.
General
Absorbance
- 14.10.2.9 Darknoise Check ABS
Fluorescence
- 15.6.5.13 Darknoise Check
Luminescence
- 16.10.2.3 Lid Check
12.9.6 Replacement of Front Button Key Foil
1. To replace the key foil (KEYBOARD FOIL HOUSING), the connector ST1 needs to be disconnected
first.
2. Remove the foil with the proper tool .

Instrument
- 30.15.2.5 Front Button Check
13 Plate Transport
13.1 General Description
The plate transport of the Spark reader is able to move the microplate in the X, Y and Z directions. It is also
possible to perform various modes of microplate shaking at different frequencies. The transport system has
been designed for very precise positioning of the plate carrier to ensure very accurate and sensitive
measurements with microplates and cell counting slides.
The plate transport is designed that all components are easily replaceable. The individual repair and
adjustment steps are described in the following subsections.
13.2 Mechanical System of the Transport

The movement of the plate transport in the X, Y and Z directions is made possible by means of toothed
belts attached to motor-driven shafts. Guide rollers are used to guide the belts. Additionally, the Y-axis uses
sliding bushings and the X and Z axes use a linear guides. One motor step in the X or Y direction is
9.375 µm
13.3 Electronic System of the Transport
The electronics of the plate transport are divided into three boards. The X, Y and Z boards are connected
to each other by means of ribbon cables. The central control comes from the Transport Main Board (PCBA
MAIN TRANSPORT).
CAUTION: Please follow the ESD guidelines when handling electronics.
13.3.1 Y-Board of the Transport
The Y board is above the Y motor on the upper side of the optics base plate. The board is connected to the
Transport Mainboard via the ST1 ribbon cable. The Y board contains the motor driver for the Y motor
(MOTOR Y-AXIS).
New design of the PCBA TRANSPORT AXIS Y was made for the stacker module and has improvements
for the electrostatic therefore new components ware implemented. All connectors are the same like on the
previous version.
ST2 Y-Motor
(MOTOR Y-AXIS)
ST1 to PCBA Main Transport
(PCBA MAIN TRANSPORT
MODULE)
ST3 to PCBA X
(PCBA TRANSPORT AXIS X
or SET PCBA PLATE
TRANSPORT X-Y-Z)
NOTE: The new PCBA needs an motor settings and is only compatible to new design of the
X and Z PCBA of the plate transport.
Pass software: General->Adjust->Plate Transport Motor Type (30.13.7 Adjust - Plate
Transport Motor Type)
13.3.2 X-Board of the Transport
The X board is connected to the Y board via a ribbon cable. The X board contains the motor driver for the
X motor and the two light barriers, the load position sensors and Y home sensors. From ST3, another ribbon
cable connects the Y board to the Z board.
A new design of the PCBA TRANSPORT AXIS X was made for the stacker module and has improvements
previous version.
ST3 Z-PCBA
(PCBA TRANSPORT AXIS Z or
SET PCBA PLATE TRANSPORT
X-Y-Z)
ST1 X-Motor
(MOTOR X-AXIS)
ST2 to Y-PCBA
(PCBA TRANSPORT AXIS Y or
SET PCBA PLATE
TRANSPORT X-Y-Z)
Y-Load Position Sensor Y-Home Sensor
Y and Z PCBA of the plate transport.
13.3.3 Z-Board of the Transport
The Z board contains the motor driver for the Z-motor and the X home position sensor. The Z-board is
controlled by the X-board via a flat cable to ST3.
A new design of the PCBA TRANSPORT AXIS Z was made for the stacker module and has improvements
previous version.
ST1 Z-Home Sensor

(WIRING SENSOR Z-
HOME 12CM)
ST2 Z-Motor
(MOTOR Z-AXIS)
ST3 to X-PCBA
(PCBA TRANSPORT AXIS X
or SET PCBA PLATE
TRANSPORT X-Y-Z)
X-Home Sensor
X and Y PCBA of the plate transport.
13.4 Assembly/Reassembly of the Transport
To repair the plate transport, remove the optics base plate from the bottom plate (see chapter 11.2).
1. Remove the screws of the Y cable guide, remove the mounting bracket and disconnect the cable
from the X board (ST3).
2. Remove the screws from both cable holders and the bracket
3. Remove the screws from the X cable guide plate
4. Remove X cable guide
5. Disconnect the ribbon cable from the X board.
6. Open the cable holder on the Z board and disconnect the ribbon cable.
To install a new cable, repeat the above steps in reverse order.
13.4.1 Replacing the Y-Ribbon Cable of the Transport
To replace the Y ribbon cable (WIRING 26POL FLAT Y-TRANS.77CM), the optics base plate must first be
removed from the bottom plate (see chapter 11.2).
1. The screws on the back panel (labeled “1” in the picture above) must be removed. The screw next
to the power supply only needs to be loosened.
2. Then the rear panel can be rotated slightly away from the device. After disconnecting ST3 from the
Y board, the connector can be removed downwards.
3. Remove the four screws from the cable guide (two on top and two on the side).
4. Remove the screws of the three cable holders and the bracket.
5. Remove the holding plate.
6. Disconnect the ribbon cable from the X board (ST2).
To install a new cable, repeat the above steps in reverse order.
Perform the following steps in the Service Software:
Plate Transport
- 13.5.1 Adjustment Plate Transport (all)
- 13.5.2 Test Plate Transport (all)
Cell Counting
- 19.5.1.3 Offset X/Y Adjustment
- 19.5.2.2 Offset X/Y Check
For all other installed modules perform the Plate Transport X/Y adjustment and the Plate
Transport Offset Check X/Y
13.4.2 Replacing the X-Board of the Transport
To replace the X board, the optics base plate must first be removed from the base chassis (see
chapter 11.2). The X board is located on the cable guide of the X-ribbon cable.
1. Disconnect the X motor from the X board.

2. Disconnect the ribbon cable.
3. Remove the four screws from the X board.
To install a new board repeat the above steps in reverse order.
(If the new version of the PCBA is used perform the following step: General: Adjust->Plate Transport
Motor Type)
Plate Transport
Cell Counting
13.4.3 Replacing the Y-Board of the Transport
To replace the Y board, the instrument housing must first be removed (see chapter 11.1 Removing the
Top Cover).
1. Disconnect the Y motor (ST2).

2. Disconnect the ribbon cable from Transport Mainboard (ST1).
3. Disconnect the ribbon cable from X board (ST3).
4. Remove the four screws from the Y board.
To install a new board repeat the above steps in reverse order.
(If the new version of the PCBA is used perform the following step: General: Adjust->Plate Transport
Motor Type)
Plate Transport
Cell Counting
13.4.4 Replacing the Z-Board of the Transport
To replace the Z board, the optics base plate must first be removed (see chapter 11.1 Removing the
Top Cover). The Z board is located on the cable guide of the X ribbon cable.
1. Disconnect the home sensor-from the Z board (ST1).

2. Disconnect the Z motor (ST2).
3. Remove both screws from the Z boards.
4. To install the new Z board, repeat the above steps in reverse order.
If the new version of the PCBA is used, perform the following step:
General
- 30.13.7 Adjust - Plate Transport Motor Type
Plate Transport
Cell Counting
For all other installed modules perform the Plate Transport X/Y/Z adjustment and the Plate
Transport Offset Check X/Y/Z
13.4.5 Replacing the X-Transport Motor
The X motor is located on the X traverse of the Plate transport. To replace the X motor (MOTOR X-AXIS),
the instrument’s top cover must first be removed so that the service feet can be attached (see chapter 11.1
Removing the Top Cover).
1. Push the X traverse forward to access the Y cable bracket.

2. Remove the three screws from the X motor.
3. Remove the toothed belt from the motor shaft.
4. Remove the X cable retaining plate → remove the six screws labeled 1 – 4.
5. Disconnect the X motor from the X board
6. Disconnect the adapter plate from the X motor.
7. Attach the new motor to the adapter plate.
8. Attach the toothed belt to the motor shaft and secure it with the three screws.
9. Adjust the belt tension (see chapter 13.4.8).
Plate Transport
Cell Counting
13.4.6 Replacing the Y-Transport Motor
The Y motor (MOTOR Y-AXIS) is located on the upper part of the optics base plate. To replace the Y motor
the instrument housing and the bottom plate must first be removed so that the service feet can be attached
(see chapter 11.1).
1. Disconnect the Y motor from the Y board
2. Disconnect the two ribbon cables (ST1 and ST3) from the Y board
3. Remove the two screws from the Y board bracket.
4. Remove the four screws that secure the Y motor (see picture below, number 1). The work is
easier if the instrument is turned 90° on its side.
5. Remove the Y belt from the motor shaft (see picture below, numbers 2 and 3).
6. Reassemble in reverse order

7. Adjust belt tension (see chapter 13.4.9 Adjustment of Y-Motor and Belt Tension of Transport).

Plate Transport
Cell Counting
13.4.7 Replacing the Z-Transport Motor
To replace the z motor (MOTOR Z-AXIS), the instrument housing and the bottom plate must first be
removed so that the service feet can be attached (see chapter 11.1).
1. Remove the two motor screws

2. Disconnect ST1 and ST2 from the Z board
3. Remove the motor from the Z-Drive Chassis
4. Insert the new motor with the motor connector upside down
5. The motor fastening plate has a slot for positioning the motor and to adjust the belt tension.
6. Use a tension meter to adjust the motor to a force of 22 +/- 5.72 N and tighten with a torque
screwdriver to 0.7 +/- 0.05 Nm.
NOTE: Use a tension meter to adjust the belt tension to 22 ± 5.72 N!
Plate Transport
Cell Counting
13.4.8 Adjustment of X-Motor and Belt Tension of Transport
1. Move the motor to the position that the belt is stretched and tighten the screws to a torque of
0.7Nm +-0.05Nm.
2. During the adjustment, check the belt tension on the side without the belt fastener.
Use belt tension meter to check the belt tension and repeat the process until a value of 72Hz +/-
7.75Hz is reached.
3. Tighten the 3 screws on the motor bracket to a torque of 7Nm +/-0.05 Nm.

Plate Transport
Cell Counting
13.4.9 Adjustment of Y-Motor and Belt Tension of Transport
After the new Y motor is installed, the Y belt must be placed over the motor shaft. The belt is adjusted by
positioning the Y motor.
1. Move the plate transport to the rear most position.
2. Remove the cam switch.
3. Remove the two screws from the side and two from the optics base plate.
The picture below shows how to completely remove the Y cable guide. In practice, this is not entirely
necessary.
4. Use the belt tension meter to adjust the belt tension of the Y belt to 47 +/- 5.5Hz.
5. Tighten the 4 screws with a torque screwdriver to 0.7Nm.

6. Reattach the cam switch.
Plate Transport
Cell Counting
13.4.10 Replacing the X-Belt of the Transport
1. To replace the X belt, the instrument housing and the bottom plate must first be removed so that
the service feet can be attached (see chapter 11.1).
2. The X fastening bracket must also be removed (see chapter 13.4.5).
3. Remove the three screws from the X motor and move it aside.
4. Lift the motor out of the belt.
5. Remove the two upper screws from the belt fastener and remove the belt and the fastener.
6. Connect the belt together using the original belt fastener and place the belt over the motor shaft.
6. Attach the motor and adjust the belt tension (see chapter 13.4.9 Adjustment of Y-Motor and Belt
Tension of Transport).
13.4.11 Replacing the Y-Belt Transport
In order to replace the Y belt, the instrument housing and the bottom plate must first be removed so that
the service can be attached feet (see chapter 11.1).
If it is necessary to replace the belt guide wheel, which is included with the belt as a spare part, it must be
tightened with 2 Nm!
1. Remove the Y-cable holder

2. Remove the cam switch
3. Loosen the four screws of the Y motor
4. Remove the belt fastener and remove the old belt
5. Attach the new belt and attach the belt fastener
6. Adjust belt tension (see chapter 13.4.9 ).
7. Attach the cam switch
13.4.12 Replacing the Z-Belt Transport
To replace the Z belt, the instrument’s top cover must first be removed so that the service feet can be
attached (see chapter 11.1 ). To access the Z belt, the plate carrier has to be removed (see chapter
13.4.16).
NOTE: To perform the work, turn the instrument 90° on its side!
Loosen the two screws on the Z belt fastener.
Remove the Z belt fastener as shown in the photo above and push the transport in the opposite direction
as far as possible.
Remove the eight screws from the holding bracket. Remove the belt by moving it up and down several
times while simultaneously pulling it back and forth to remove.
The new belt must only be inserted between the guide roller and the motor gear.
Position by repeated up and down movement.
Reinstall the plate carrier bracket (see chapter 16.4.15).
Press the belt lock and tighten the screws. Install the plate carrier (see chapter 13.4.16).

Plate Transport
Cell Counting
13.4.13 Replacing the X-Guide of Plate Transport
To replace the X guide (GUIDE LINEAR X), the instrument housing and the bottom plate must first be
removed so that the service feet can be attached (see chapter 11.1).
1. Push carefully the whole plate carrier down until the 4 screws are visible
2. Remove the 4 screws from the X guide see picture below
3. Remove the 7 screws from the X-guide (see picture above).

4. Remove the X-guide
To install the X-Guide, repeat the above steps in reverse order.
To make sure the x guide is properly aligned it is necessary to press the complete guide on the corner
shown in the image above before securing it with the screws.
Again, press in the guide of the Y bushing holders on the edges of both sides before securing the screws.
The edges are there so that no further adjustments are necessary. The screws need to be tightened to a
torque of 1.1 Nm.
Plate Transport
Cell Counting
13.4.14 Replacing the Y-Guide of Plate Transport
In order to replace the Y guide (Y-GUIDE SHAFT WITH BEARING BALL), the instrument housing and the
bottom plate must first be removed so that the service feet can be attached (see chapter 11.1).
It is possible to replace both the guide rods and the guide bushings. The following sections discuss mainly
the guide bushings. The replacement of the guide rods follows logically. Some specific adjustments are
necessary, which are described below.
Move the transport in front and open the Y belt

Remove the 3 screws from the X motor and eject the X belt
Remove the Y guide holder
Remove the left screws from the X guide.
Remove the screws from the cable guide and turn the whole X traverse
Move out the part were the motor is still mounted.
Use a hex key to push out the guiding sleeve.
For inserting it is possible to perform it easily by hand.
NOTE: After installation of the belt, check that the belt tension is 43-51 Hz!
Once the transport is out of the instrument and service feet are mounted, do the following for the left side.
1. Remove the 4 screws from the Y guide.
2. Remove the Y guide holder.
3. Remove the guide with the guide bushings.
4. Remove and install guide sleeves, as already described for the right side.
NOTE: After installation, the transport must be aligned!

Plate Transport
Cell Counting
Transport Offset Check X/Y/Z.
13.4.15 Replacing the Z-Guide of Plate Transport
In order to replace the Z guide (GUIDE LINEAR Z INCL.CARRIAGE), the instrument housing and the
bottom plate must first be removed so that the service feet can be attached (see chapter 11.1).
Remove the plate carrier
1. Loosen the two screws from the belt holder.
2. Remove the 8 screws from the holder.

3. Remove the Carrier Holder.
4. Remove the rail from the guide.
5. Remove the 6 screws from the Z-guide.
To install new Z-guides look to the next picture and follow the steps.
1. Loosely attach the Z-guide.

2. Place the tool between the two guides. The tool is secured with two pins.
3. Press the two guides together.
4. Secure the guides by tightening the screws
5. Push guiding carriage away to tighten the middle screw.
6. The holder with 8 screws is attached to the 2 guiding carriages.

It is important to make sure that the edge of the holder is aligned with the edge of the guiding carriages.
As shown in the picture above with the number 9.
7, When the edges aligned, no further adjustments are necessary.

Reinstall the plate carrier with 8 screws (see chapter 13.4.16).

Plate Transport
Cell Counting
13.4.16 Replacing the Plate Carrier
1. Remove the lock screw under the plate carrier (CARRIER PLATE or CARRIER PLATE FIM)
2. Remove the screw in the middle of the carrier.
3. Remove the plate carrier.
4. Remove the triangular plate (part number 4) from the carrier.
13.4.17 Adjust the Plate Carrier
To adjust the plate carrier, the instrument housing and the bottom plate must first be removed so that the
service feet can be attached (see chapter 11.1).
The adjustment is explained in two steps: First, the plate carrier is checked and adjusted to the correct
inclination. Then the alignment is checked and adjusted until it is square. Both procedures must be
performed. Do not apply only one of the two methods!
The inclination must be adjusted so that the plate carrier tilts up 0.05 mm when no microplates are loaded!
The following initial steps are necessary to set the inclination:
1. Gently press the drive carrier in the Z direction all the way down.
2. Install the 3D articulated measuring tool on the adapter plate (highlighted in pink in the picture below)
from the service tool kit and install both of them on the optics base plate.
3. Install the measurement tool on the position A12 (in the drawing above, the example position is H1).
4. Move the button of the dial gauge to the A12 position (In the general summary above, H1 is shown;
this is only for illustrative purposes).
5. Turn the scale of the measurement tool until the pointer is at zero. Check it while you lift up the
plunger and let it down. The tolerance is 0.2 mm; one full turn is 1 mm. If you look at the measurement
tool you will see 0.1 mm as shown in the picture below.
Note: Before the adjustment the M4x8 must be tightened to 0.75Nm.
Check inclination from A1 to H1, from H1 to H12, from A1 to A12 and from A12 to H12. Move the transport
by turning the stepper motor flywheel mass or axis by hand.
7. If it is necessary to adjust the inclination, use the 2 adjustment set screws, see picture above.
8. If the inclination is from A1 = 0 to A12 = +0.21 or -0.21 mm, turn the set screws until the value is
less than 0.2 mm.
NOTE:
Tolerance on Spark without FIM module = 0.2mm
Tolerance on Spark with FIM module = 0.14mm
NOTE: After successful calibration, the middle M4x8 screw must be secured to
1.3 Nm!
Once the inclination adjustment has been performed, check that the angle of the transport is correct.
1. Push the transport all the way to the right.
2. Install the measurement tool on the position A1.
3. Turn the scale of the measurement tool until the pointer is at zero. Check it while you lift up the
plunger and let the plunger down. The tolerance is 0.2 mm, one full turn is 1 mm. If you look at the
measurement tool you will see 0.1 mm as shown in the picture below.
4. Check now from A1 to H1. Move the transport while turning the flywheel mass from the considering
motor or the motor axis. The tolerance is also 0.2 mm in each direction! Move the transport on the
Y-axis more than once and check the tolerance of the axis. Record the value!
5. Set the button of the gauge to position H1.
6. Turn the pointer to zero. Check it while you lift up the plunger and let the plunger down. The
tolerance is 0.2 mm, one full turn is 1 mm. If you look at the measurement tool you will see
0.1 mm as shown in the picture below.
7. Check now from H1 to H12. Move the transport while turning the flywheel mass from the
considering motor or the motor axis
8. The tolerance is also 0.2 mm in each direction! Move the transport on the X-axis more than once
and check the tolerance of the axis. Record the value!
9. Before you start to adjust the right angle make a sketch like in the picture below.
10. Write down the tolerances of every axis and adjust the position carefully so that it is within all
tolerances. In this example, you have to turn the transport in the upper left direction. This means
the tolerance of the X-axis will increase and the tolerance of the Y-axis will decrease, e.g. Y-axis
0.08 and X-axis 0.07.
11. To adjust, loosen the lock screw in the middle under the plate carrier. In the example above,
loosen screw Nr. 1 and tighten the screw Nr. 2.
12. Repeat the process until the right angle is achieved!
13. Tighten the safety screw (lock screw) with 1.3 Nm.
14. This process may require a few trial and error attempts before succeeding. Once correct, the
tolerance should be lower than 0.2 mm for Spark without FIM and 0,14mm for Spark
instrument with FIM option. as shown in the pictures below.
Tolerance Y axis
Tolerance X axis
Plate Transport
Cell Counting
13.5 Plate Transport – Service Software
New resolution adjustments for each module
released with firmware version 6.22
13.5.1 Adjustment Plate Transport
13.5.1.1 Z-Min Position Offset
Description:
The Z-min adjustment is representative for all Z adjustment in each measurement mode. This
adjustment has to be done after a measurement head was replaced or if any adjustment/replacement of
the plate transport was done.
For this adjustment the blocking plate is used (lowest possible plate format 10mm). The plate transport with
the blocking plate will be moved up (by pressing up/down buttons or arrow keys) to the luminescence
measurement head.
The correct distance between the measurement head and the plate transport will be determined with a
distance tool (0,1mm). From/with this offset, several other Z-Offsets will be calculated in the different
measurement modes. After performing this adjustment all other available Z-offset adjustments have to be
performed.
Procedure:
1. Go to Plate Transport → Adjustment → Z-Min Position
2. Press Start
3. Insert the Blocking Plate
4. Press Next
5. Adjust the Z Offset: for that use a metal strip (0,1mm) and insert them in between the blocking plate
and the luminescence measurement head. Select the stepwidth 10µm, 100µm or 1000µm and use
the up or down button to adjust the offset.
6. The metal strip should be slightly in between these two points. When the offset is reached remove
the strip and press Next.
7. Remove the plate

8. Results will be shown:
Troubleshooting:
- 30.12.3.2 Initialize Instrument
- 13.5.2.5 Step loss Test X, Y, Z – Perform steploss test in z direction
- 13.5.2.3 Resolution X/Y Test
- Change Z-Motor (MOTOR Z-AXIS)
- Check the mechanically movement of the SLIDE CENTERING CARRIER SPARK
13.5.1.2 Z-Max Position Offset
Description:
The Z-Max Position (lowest position of plate transport) will be calculated and is the lowest position of the
plate transport.
Procedure:
1. Go to Plate Transport → Adjustment → Z-Max Position
2. Press Start
3. Software will ask to remove any plate
4. Measurement will performed
5. Results will be shown
Troubleshooting:
- 13.5.2.5 Step loss Test X, Y, Z - Perform Step loss Test Z
- 13.5.2.3 Resolution X/Y - Perform Resolution Test
- Change Z-Motor (MOTOR Z-AXIS)
13.5.1.3 Resolution X/Y
Description:
This adjustment calculates the belt correction factor -> resolution in X and Y direction. The adjustment will
be performed with the MultiCheck plate.
Procedure:
1. Go to Plate Transport → Adjustment → Resolution X/Y
2. Press Start
3. Insert MultiCheck Plate and select the serial number
4. Press Next
5. Measurement will be performed
6. Press Set or Set&Repeat if the spot is not in the center of the cross
7. Result will be shown:
Troubleshooting:
- Check the torsion of the plate carrier (13.4.17 Adjust the Plate Carrier)
- Perform the Plate Transport Tilt Check (13.5.2.1 Plate Carrier Tilt)
13.5.1.4 Plate Load Position Left & Right
Description:
The Plate Load Position adjustment is to define how far the plate transport has to move out. Furthermore
the left/right position can be adjusted. After starting the adjustment, there are several buttons available,
the Set Position, the Home, the Current Settings, the Default and the three arrows. The Set Position button
will be used to set a new determined position and write the values to the main board. The Home button will
be used to move the plate transport to the home position. The Current Settings button will be used to move
the plate transport to the current adjusted position. The Default button will be used to set a default offset
for the plate transport. The arrow keys will be used to move the plate transport in/out, left/right and up and
down. In and out are working always, but the left and right buttons are only working if the plate transport is
inside of the instrument. This is to prevent crashing the plate transport onto the front cover in left or right
direction.
Procedure:
1. Go to Plate Transport → Adjustment → Plate Load Position
2. Press Start
3. The plate carrier will come out at the left side
4. The picture bellow will be shown
5. Use the buttons on each axis to bring the plate carrier to the correct position. The Plate Carrier has
to be in the middle (X-axis) of the flap, so that the screw of the carrier is touching the housing. In the
Y-axis the screw of the plate carrier has to touch the housing so far that it is possible to put a plate
on the carrier easily.
6. Press check step-loss
7. Press move to current position
8. The plate Transport will move to the right position
Troubleshooting:
- Check if something is blocking the plate transport
- 13.5.2.5 Step loss Test X, Y, Z of plate transport
13.5.1.5 Plate Detection Sensor Offset
Description:
This adjustment is to calculate the offset for the plate detection sensors (WIRING MTP SENSORS). The
sensor has two components, one is located on the optics base plate and the other in the bottom chassis.
The adjustment will be performed by measuring the position of the plate carrier lock pin.
The pin position is different with a plate and without a plate. For teaching don't put a plate in the carrier!
Procedure:
1. Go to Plate Transport → Adjustment →Plate Detection Sensor Offset
2. Press Start
3. PASS will ask to remove any plate
4. Measurement will be performed -> press Finish
Troubleshooting:
- Check the sensor wiring (to the main transport board)
- Clean the plate detection sensors
- 13.5.2.5 Step loss Test X, Y, Z of plate transport
- Replace the sensor (WIRING MTP SENSORS)
- 13.5.2 Test Plate Transport (Test Plate Transport)
13.5.2 Test Plate Transport
13.5.2.1 Plate Carrier Tilt

Description:
The Plate Carrier Tilt is to check the plate Transport if it is bended in any direction. For this test the
blocking plate, adapter arm with dial gauge, and the adapter plate is needed. How to use the dial gauge
see 13.4.17.
Procedure:
1. According to Spark configuration if installed remove the absorbance monochromator and if installed
the Lid Lifter module with the metal plate. Before starting to remove the modules disconnect all
electronic connectors on the ABS MCR and on the Lid Lifter.
2. Remove the ABS MCR by removing 3 screws (blue screws) and remove the Lid Lifter metal plate
with 4 (red screws)screws. Sown in the picture above.
3. Install the metal adapter plate from service tool kit on the optic base plate
4. Use the dial gauge and install them on the arm and finally install both on the adapter plate on the
optic base plate see picture below .
5. Press Start and insert the ABS blocking plate from service tool kit
6. Follow the procedure (insert the 3 taken values).
7. Results will be displayed
8. Press Finish and result will be displayed. The limits are different between the plate carrier from
Spark with FIM option to Spark instrument without FIM option.
Without FIM FIM
Troubleshooting:
- If the values are out of range adjust the plate carrier
13.5.2.2 Plate Carrier Rotation Angle
Description:
The Plate Carrier Torsion Test checks the torsion of the plate carrier. The measurement will performed in
Absorbance, with the four outset Pinholes of the MC-Plate, the wells A1, A12, H1 and H12.
Procedure:
1. Go to Plate Transport → Test → Plate Carrier Rotation Angle
2. Press Start
3. The software will ask to insert the MC-Plate -> insert plate -> press Next
5. Press Next
7. Press Finish → final result will be shown
Troubleshooting:
- 13.5.2.1 Plate Carrier Tilt - Check the alignment of the plate carrier with the dial gauge
13.5.2.3 Resolution X/Y
Description:
The Resolution X/Y check is used to check the Resolution X/Y adjustment for each installed option. For
this test the MultiCheck Plate is needed.
Procedure:
1. Go to Plate Transport → Test → Resolution X/Y
2. Press Start
3. The software will ask to insert the MC-Plate -> insert plate -> press Next
5. Result will be shown
Troubleshooting:
- 13.5.1.3 Resolution X/Y Adjustment
- 13.4.17 Adjust the Plate Carrier (check the torsion of the plate carrier)
13.5.2.4 Plate Detection Sensor Offset Check

Description:
This test is used to check the adjusted Plate Detection Sensor Offset and the functionality of the sensors.
Procedure:
1. Go to Plate Transport → Test → Plate Sensor Position
2. Press Start
3. Plate carrier comes out → insert the MultiCheck Plate → press Next / if there is already a MC plate
inside this step will done automatically
4. Plate carrier comes out → remove the MultiCheck Plate→ press Next
Troubleshooting:
- 13.5.1.5 Plate Detection Sensor Offset Adjustment
- Check the sensor wiring (PCBA MAIN TRANSPORT MODULE)
- Clean the plate detection sensors
- Perform Plate Transport Step loss Tests
- Replace the sensor (WIRING MTP SENSORS SPARE)
13.5.2.5 Step loss Test X, Y, Z
Description:
For the Spark for each axis a steploss test is available (X, Y, Z).The step loss test is to evaluate if the
motor is mechanically blocked by defective linear guides or a defective home sensor. Therefore the motor
will be moved to the maximum positions. At the end of the test a result summary with Passed, Failed and
lost steps will be displayed.
Procedure:
1. Go to Plate Transport → Test → choose the step loss test which should be performed
2. Press Start
Troubleshooting:
- Check the connection to the motor
- Check if something is blocking the motor (e.g. plate is fallen into the instrument).
- Check the belt tension (13.4.8 Adjustment of X-Motor and Belt Tension of Transport or 13.4.8
Adjustment of X-Motor and Belt Tension of Transport)
- Try to move the motor by hand (instrument needs to be switched off!) and check for free movement
- Check that flap opens correctly
- The plate carrier is able to move out of the instrument → nothing in front of the flap
- Change the motor (MOTOR X-AXIS, MOTOR Y-AXIS or MOTOR Z-AXIS)
13.5.2.6 Step loss Test X,Y,Z (DISABLE FLAPS)
Description:
This step loss test can be only performed if the optics base plate is removed. This test will not work if the
plate transport is inside the Spark reader. Furthermore this test is to evaluate if the X, Y and Z motor is
mechanically blocked by defective linear guides or a defective home sensor.
At the end of the test a result summary with Passed, Failed and lost steps will be displayed.
Procedure:
1. Go to Plate Transport → Test → choose the step loss test X,Y,Z
2. Press Start
WARNING: Use this step loss test only when the plate transport is outside of the Spark
reader other the plate carrier will crash the flaps
14 Absorbance Module
The absorbance systems are a new generation of monochromators with one grid and an eddy current
brake. The absorbance system has been designed for very precise positioning of the gratings to ensure
very accurate and sensitive measurements for all plate formats. Specifications:
14.2 Optical System Absorbance
The light path is shown in the picture above. In comparison to older Tecan instruments, the measurement
path is from the bottom through the microplate. The absorbance system is split into three main parts, which
are:
• Absorbance Monochromator (MONO ABS)
• Absorbance Measurement Head (HEAD MEAS.ABS)
• Absorbance Detector (DETECTOR ABS)
• Absorbance Cuvette Module (ABS CUVETTE)
The light path is: from the flash lamp → ellipsoid mirror → through the OSF → into the monochromator
(input slit) to the grating →from the grating out of the monochromator (output slit) to the fiber → fiber to the
measurement head (on the bottom side) → on the measurement head is a signal cable connected
(reference signal) → from the measurement head through the sample (microplate) → to the Absorbance
Detector → signal cable to the measurement board of the absorbance monochromator.
The grating is made specifically for absorbance measurements, 1 mm corresponds to 7 nm of the light
spectrum.
14.3 Absorbance Cuvette
The Absorbance Cuvette measurement is similar to the normal absorbance measurement. The light is
guided through a fiber from the absorbance monochromator to the Cuvette measurement head. In the
measurement head is an ellipsoid reflector mounted and a small reference board.
The reflector guides the light 90° through the cuvette to the absorbance measurement board. The
measurement head is the same like the one from the absorbance.
14.3.1 Replacing the Absorbance Cuvette

To replace the measurement head use the following procedure:
1. Remove the 2 screws of the measurement head
2. Take off the measurement head.
To replace the cuvette fiber please use the following procedure:
1. Remove the 2 screws of the metal holder.
2. Take off the fiber.

Absorbance
- 14.10.2.4 Wavelength Accuracy Check CUV
- 14.10.1.8 Measurement Ranges CUV
- 14.10.1.10 Measurement Head Position CUV
- 14.10.2.10 Darknoise Check CUV
- 14.10.2.12 Reference Signal Check CUV
14.3.2 Replacing the Absorbance Detector Board
To replace the absorbance detector board (PCBA ABS DETECTOR CUVETTE) use the following
procedure:
1. Remove the 2 screws of the metal holder.

2. Remove the 2 screws of the detector board.
Absorbance
- 14.10.1.8 Measurement Ranges CUV
- 14.10.1.10 Measurement Head Position CUV
- 14.10.2.10 Darknoise Check CUV
14.4 Absorbance Monochromator
The Absorbance monochromator is equipped with a 6 Watt Xenon flash lamp. This new Monochromator
version is built with one grating which enables it to perform scans from 200 nm to 1000 nm in 1 nm
increments.
14.5 Absorbance Measurement Head
The Absorbance Measurement Head is located on the bottom side of the instrument. In the measurement
head the light beam comes from the fiber and goes to the ellipsoid mirror. Before the light beam goes to
the mirror it is guided through a quartz plate where a part of the light beam is reflected to the reference
diode. From this diode a signal cable is connected to the Absorbance Monochromator.
14.6 Absorbance Detector
The Absorbance Detector detects the light which is coming through the sample. The light is guided through
to the photodiode which is placed behind the lens and the signal is changed into an electronic signal. The
Absorbance Detector is connected to the Absorbance monochromator Measurement Board by a signal
cable.
14.7 Mechanical System Absorbance
The monochromators uses an eddy current brake for a better fine adjustment and control of the grating.
• The feature of the eddy current brake is that that the braking procedure works without any contact
between the brake parts. One of the benefits is the long lifecycle.
• This principle of this type of brake is used in trains and different measurement instruments. In the case
of this monochromator, the brake enables it to perform very fast scans because it is possible to speed
up and slow down the grating very fast.
14.8 Electronic System Absorbance

On the absorbance monochromator two boards are mounted and connected together:
• PCBA MOTOR DRIVE MONO
• PCBA MONO ABS
14.8.1 Replacing the Absorbance Boards
To replace the boards, follow the procedure:

1. Remove instrument Top Cover (see
chapter 11.1).
2. Disconnect all connectors
3. Remove the four screws
4. Exchange the board
Replacement of PCBA MONO ABS:

General
- 30.13.2 Configure Instrument (copy can be used)
- 30.13.5 Set Serial Numbers (module serial number ABS)
- 30.13.3 Default Settings (Download Default Settings – select ABS, Tables: Fast Scan Gain Table
ABS & CUV)
- 30.15.1.1 Counter (check for unusual values)
Instrument Settings and Tables
- Download the original settings for ABS & ABS MEX (if available from the backup)
- Import the original Table (Fast Scan Gain Table and the Encoder Table for (ABS & CUV)
Absorbance
- 14.10.1.4 Wavelength Accuracy ABS (and CUV if available)
- 14.10.1.6 Order Sorting Filter Offset
- 14.10.1.7 Measurement Ranges ABS (and CUV if available)
- 14.10.2 Test Absorbance (all)
Replacement of PCBA MOTOR DRIVE MONO:
General
- 30.13.5 Set Serial Numbers for ABS MEX (XXXXAMXXXX)
- 30.13.3 Default Settings (Download the Default Settings ABS/MEX)
Instrument Settings and Tables:
- Download the original settings ABS/MEX & ABS MEX (if available from the backup)
- Import the original Table (Fast Scan Gain Table and the Encoder Table for (ABS & CUV)
Absorbance
- 14.10.1.4 Wavelength Accuracy ABS (and CUV if available)
- 14.10.1.7 Measurement Ranges ABS (and CUV if available)
- 14.10.2 Test Absorbance (all)
14.9 Disassembly and Adjustment of the Absorbance
Monochromator
Before reassembling:
Perform the steps in chapter 11.1 (remove the instrument top cover).
1. Remove the two screws of the main transport board holder.
2. Turn down the holder.
3. Remove the two screws of the Absorbance MCR coverage.
4. Loosen the set screw.
5. Remove the fiber carefully.
6. Remove the following wiring of the absorbance MCR electronics:

• ST404 USB
• ST401/402 CAN
• ST403 Handshake
• ST201/9 Power supply voltage
• ST701/702 ST801/802
• Signal cables
7. Remove the 3 screws and lift up the complete monochromator.
To install again use the following procedure in the reverse order.
WARNING:
Be careful not to excessively or unnecessarily bend the optical fibers, as they are very
fragile.
Two Instrument symbols are visible after the new ABS monochromator is installed:
• Before connecting the SPARK reader to the Pass software, wait until the SPARK has performed a
full INIT. This will take about 2 min. After the INIT, the instruments symbols will not be shown
grayed anymore. Then run Assemble instrument from the Instrument menu.
• Insert the SPARK reader serial number and click NEXT.
• Continue with Yes.
• Continue with OK to finish the Assemble process.
• Under General, run Set serial number for the MEX part as shown in the picture below. This has to
be done so that the instrument knows now that this new spare mono is part of the instrument.
• The new serial number must be set as follows : the first 4 left digits from the instrument serial
number then AM and the last 4 right digits from the instrument.
• Under General, run Default Settings and Tables for Absorbance (and CUV if available).
WARNING: Select only the absorbance Default Settings!
• Under General, run Firmware Download.

• Run all absorbance adjustments and tests in the PASS software.
14.9.1 Replacing the Absorbance Flash Lamp Module
The lamp of the Spark is one unit, there is no extra power supply needed for the lamp. No specific
adjustments are necessary for the lamp, except that the switch must be in the position “EXT”, because the
lamp is regulated by the Absorbance board.
The Absorbance module consists of the following components: the flash lamp module, the grating unit with
the order sorting filter (OSF) motor and the ellipsoid mirror.
Drawing 1
1. To remove the illuminating unit, the cover plate has to be removed by removing the two screws.
2. In the next step. the whole Absorbance grating and lamp unit can be removed by removing three
screws.
Drawing 2
3. Remove the connectors ST 104, ST 203 from the module PCBA.

4. Remove the four screws to take off the lamp.
Drawing 3
5. Remove the four screws to take off the lamp.
Drawing 4
6. Remove the adaptor plate by removing the four screws.
To install the new flash module perform the above procedure in reverse order.
NOTE: There are 2 pins (see drawing 3). These pins help to fit both modules together and
ensure that the adjustments are performed correctly!

Instrument
- 30.15.1.1 Counter (reset the ABS counters)
Absorbance
- 14.10.1.1 Flash Energy
- 14.10.1.4 Wavelength Accuracy ABS + CUV
- 14.10.1.7 Measurement Ranges ABS + CUV
- 14.10.2.3 Wavelength Accuracy Check ABS
- 14.10.2.5 Measurement Ranges Check ABS
- 14.10.2.6 Lamp Stability Check
- 14.10.2.8 Blocking Spectral Check
- 14.10.2.7 Blocking Spatial Check
- 14.10.2.9 Darknoise Check ABS + CUV
- 14.10.2.11 Reference Signal Check ABS +CUV
14.9.2 Replacing OSF Filter and the Absorbance Motor
After removing the lamp module perform the following

steps:
1. Remove the order sorting filter.
2. Remove the four screws of the order sorting filter
motor.
3. Remove the order sorting filter motor from the
housing.
To assemble the module, follow the above procedure in the reverse

order. After assembling all parts, the distance and the positioning
of the OSF has to be adjusted. For that use the following procedure:
4. Mount the motor and drive the motor to the home position
(see chapter 12.2 Motor Tool).
5. Install the filter on the motor gearing (loosely).
6. Insert in the Adjustment Pin into the hole of the OSF. The
adjustment pin is part of the service tool kit (see chapter 8
Service Tools & Kit)
7. Insert the spacer 0.9 mm (the spacer is part of the service
tool kit see chapter 8 Service Tools & Kit)
8. in between the OSF and the motor and press them lightly
together.
9. Tighten the screw of the OSF (0.9 Nm).

Absorbance
- 14.10.1.7 Measurement Ranges ABS +CUV
- 14.10.2.3 Wavelength Accuracy Check ABS +CUV
- 14.10.2.5 Measurement Ranges Check ABS + CUV
- 14.10.2.14 Steploss Test Grating Motor & OSF Motor
14.9.3 Replacing the Absorbance Measurement Head
Perform the steps of chapter 11.4 (Removing the Bottom Plate)
To remove the measurement head (HEAD MEAS.ABS) use

the following procedure:
1. Remove the two screws at the corners
2. Lift up the measurement head
3. Remove the two screws of the metal clamp
4. Remove the metal clamp
5. Pull out the fiber and disconnect the reference signal
cable
6. To mount the parts again follow the procedure in the
reverse order.
The measurement head itself can only be changed as complete part. Furthermore the reference signal
cable can be changed.
WARNING:
Be careful with the signal cable as the connector is fragile.

Plate Transport
- 13.5.2.3 Resolution X/Y
Absorbance
- 14.10.1.1 Adjustment Absorbance (Measurement Head Position ABS with service tool)
- 14.10.1.3 Plate Transport Offset Z
- 14.10.1.7 Measurement Ranges ABS +CUV
14.9.4 Replacing the Absorbance Detector
To remove the detector use the following procedure:

1. Remove the two screws
2. Lift off the detector (DETECTOR ABS)
3. In absorbance, the detector (DETECTOR ABS) itself and the signal cable (CABEL COAXIAL ABS
DETECTOR) can be changed.
4. When removing the cable, be careful because the connector is very fragile.
Plate transport
- 14.10.1.2 Plate Transport Offset X/Y, 14.10.1.3 Plate Transport Offset Z Adjustments
Absorbance
- 14.10.1.4 Wavelength Accuracy ABS Adjustment
- 14.10.1.7 Measurement Ranges ABS Adjustment
- 14.10.2.9 Darknoise Check ABS
- 14.10.2.11 Reference Signal Check ABS
14.9.5 Replacing and Adjusting the Absorbance Mirror
The following procedure describes how to replace the mirror
1. Remove instrument Top Cover (see chapter 11.1).
2. Remove the three screws of the monochromator
3. Remove the two screws on the holder of the main transport board and move careful down the
holder.
WARNING:
Disconnect the temperature sensor of the chamber and the USB-cable on the
main transport board.
4. Take off the monochromator and turn it up and to the right side.
5. Place the monochromator on the metal angel of the main transport board.
WARNING:
Place the monochromator on the metal angle, but do not place the electronics
on the metal angle and be careful with the bottom fibers and the signal cables!
6. Remove the four screws of the mirror (MIRROR LAMP MONO ABS).
7. Replace the mirror (MIRROR LAMP MONO ABS) and make sure it is placed in the correct
position (as shown in the picture below).
8. Use the mirror tool from the service tool kit to adjust the mirror with the service software
(14.10.1.9 Measurement Head Position ABS)
Mirror Tool
9. After successful adjustment of the mirror with the service software inserts the monochromator
back in the Spark instrument.
Absorbance
- 14.10.1.9 Measurement Head Position ABS
- 14.10.1.7 Measurement Ranges ABS
- 14.10.1.4 Wavelength Accuracy ABS + CUV if applicable
14.10 Absorbance – Service Software
14.10.1 Adjustment Absorbance
14.10.1.1 Flash Energy
Description:
To check the flash energy of the absorbance Xenon flash lamp the firmware will set the gain to zero on the
measurement photo diode. In the next step the software performs the high voltage adjustment to reach the
signal on the photo diode in the range of 25000 to 37000 counts.
Procedure:
1. Go to → Absorbance → Adjustments → Flash Energy
2. Press Start
4. Press Set → Results will be shown
Troubleshooting:
- Change absorbance flash lamp (FLASH LAMP ABS)
- 14.10.1.4 Wavelength Accuracy ABS + CUV in case it is an option
- Check absorbance mirror (MIRROR LAMP MONO ABS - 14.9.5 Replacing and Adjusting the
Absorbance Mirror). Try and clean it with slightly pressured air.
14.10.1.2 Plate Transport Offset X/Y
Description:
The Plate Transport Offset X/Y adjustment is used to adjust the plate carrier to the optimal measurement
position. The adjustment will be performed with the MultiCheck Plate. The adjustment can be performed
with a step size of 100 or 200 (Fine or Coarse).
The measurement will be performed at 485nm with a 21*21 grate (10 flashes, step width 0.1mm). After
measurement procedure the measurement position is displayed in a graphic and the offset is written to the
instrument.
Procedure:
1. Go to → Absorbance → Adjustment → Plate Transport Offset X/Y
2. Press Start
3. Select the serial number of the plate
4. Insert MultiCheck plate → press Next
5. Select the step width → press Next
7. If the spot is in the center of the cross, press “Set”; if not, press “Set and Repeat”
8. This means that the current offset will be set and the measurement will run again to calculate the
correct offset
9. Remove the MultiCheck Plate
10. Press Finish and results will be displayed
Troubleshooting:
- 13.5.1.3 Resolution X/Y (Afterwards Plate Transport X/Y adjustment needs to be done for all
modules!)
- 13.4.17 Adjust the Plate Carrier (Perform Plate Carrier Torsion)
- 13.5.2.5 Step loss Test X, Y, Z
- 14.10.2.14 Steploss Test Grating Motor & OSF Motor14.10.2.11 Reference Signal Check ABS
(+CUV if applicable)
14.10.1.3 Plate Transport Offset Z
Description:
The adjustment will be performed with the a MultiCheck plate at 485nm on well A1 with 200 measurement
points. The transport is moving with a step width of 50µm → the position with the highest signal will be set
as Z-offset. Before this adjustment will be made the Z-Min and Z-Max adjustment has to be performed!
Procedure:
1. Go to Absorbance → Adjustment → Plate Transport Offset Z
2. Press Start
3. Insert MultiCheck Plate and select the serial number
4. Press Next
6. Press Set
Troubleshooting:
- 13.5.1.1 Z-Min Position and 13.5.1.2 Z-Max Position Adjustment
- Make sure that the mechanism that holds the well plate in place is clean. A loose test plate can't be
positioned properly.
14.10.1.4 Wavelength Accuracy ABS
Description:
The Wavelength Accuracy adjustment in absorbance will be performed with Hellma cuvette. The cuvette
has to be placed on the cuvette adapter plate (service tool kit). With this adjustment the absorbance
monochromator will perform a scan form 200 to 1000nm with a step width of 1nm and compares the curve
with the calibration curve of the Hellma cuvette from the norm file.
The adjustment for wavelength accuracy takes about 10 minutes.

Procedure:
1. Go to Absorbance → Adjustment → Wavelength Accuracy ABS
2. Prepare the plate with the cuvette
3. Press Start
4. Place the plate on the plate carrier
5. Press Next
7. Press Set
8. PASS will ask to remove the plate from the plate carrier and press Next
9. The result will be displayed
Troubleshooting:
- Clean lamp and fibers (whole optical path)
- Replace absorbance monochromator (MONO ABS 1CHAN.SPARE)
14.10.1.5 Wavelength Accuracy CUV
The Wavelength Accuracy in Absorbance Cuvette will be performed with Hellma cuvette. With this
adjustment the absorbance monochromator will perform a scan form 200 to 1000nm with a step width of
1nm and compares the calibration curve of the grid with the calibration curve of the Hellma cuvette.
Procedure:
1. Go to Absorbance → Adjustment → Wavelength Accuracy CUV
2. Be sure that no Hellma cuvette is already loaded
3. Press Start and the empty measurement will start
4. Load the Hellma cuvette in the Spark
5. Press Next
6. Measurement will continue until the graph will appears
7. Press Set
9. Press Finish
10. Remove the Hellma cuvette
14.10.1.6 Order Sorting Filter Offset
Description:
With this adjustment the position offset of the order sorting filter motor (which is placed after the flash lamp
on the absorbance monochromator) will be determined. This adjustment has to be done after replacing the
OSF (FILTER OSF MONO ABS) or OSF motor (MOTOR OSF).
Procedure:
1. Go to Absorbance → Adjustment → Order sorting filter Offset
2. Press Start
4. Press Set
5. Results will be show
Troubleshooting:
- 14.10.2.14 Steploss Test Grating Motor & OSF Motor - perform OSF Step loss test
- 14.9.2 Replacing OSF Filter and the Absorbance Motor - check the mechanical adjustment of the
OSF
14.10.1.7 Measurement Ranges ABS
Description:
The measurement ranges (or gain table) is used for the fast scan in absorbance. With this adjustment the
monochromator will scan over the full wavelength ranges to adjust the gain for the reference and the
measurement photo diode (DETECTOR ABS).
Procedure:
1. Go to Absorbance → Adjustment → Measurement Ranges ABS
2. Press Start
3. Measurement will be performed (5min)
4. Press Set
Troubleshooting:
- 14.10.2.14 Steploss Test Grating Motor & OSF Motor - Perform Step loss Test for OSF and Grating
Perform OSF Step loss Test
- Clean the detector or replace it if necessary (DETECTOR ABS SPARE or HEAD MEAS.ABS
1CHAN)
14.10.1.8 Measurement Ranges CUV
With this adjustment the absorbance monochromator will scan over the full wavelength ranges to adjust
the gain for the reference and the measurement photo diode of the cuvette module.
Procedure:
1. Go to Absorbance → Adjustment → Measurement Ranges CUV
2. Press Start
3. Measurement will be performed (5min)
4. Press Set
Troubleshooting:
- Check the detector (DETECTOR ABS)
14.10.1.9 Measurement Head Position ABS
Description:
The measurement head position adjustment is used to adjust the measurement head to the absorbance
detector. This does mean the position must be in the middle to reach a high reference signal on the photo
diode. For this adjustment the Absorbance detector tool is needed (service tool kit).
Procedure:
1. Check if no Plate is placed on the plate carrier!
2. Disconnect the instrument (PASS) and switch off the instrument
3. Disconnect and remove the absorbance detector
4. Install the service feet

5. Switch on the instrument and connect to the software
6. Turn the instrument carefully 90° back (be careful with the cables).
7. Remove the baseplate
8. Loosen the absorbance measurement head
9. Go to Absorbance → Adjustment → Measurement Head Position ABS
10. Do not yet install the tool because the plate transport is still moving and will crash the tool
11. Press Start and switch the lamp with the button “on”
12. Now insert the Absorbance detector tool and connect it to the same connector from absorbance
detector. Ensure that the tool is inserted all the way, to ensure correct reading.
13. Move the measurement head to the highest reachable value. The value has to be higher than the
red line
14. Press finish (without turning off the lamp!).
15. Remove the tool and press Next
16. After the result was displayed, disconnect from the service software and switch off the instrument
17. Mount the baseplate, remove the service feet’s and reassemble the absorbance detector
Troubleshooting:
- Check whether it’s possible to hear the lamp flashing, otherwise do the lamp tests
- Check the absorbance fiber
- Check the connection of the signal cable
- Replace DETECTOR ABS
14.10.1.10 Measurement Head Position CUV
Description:
The measurement head position adjustment is used to adjust the measurement head to the absorbance
cuvette. This does mean the position must be in the middle to reach a high reference signal on the photo
diode. For this adjustment the absorbance cuvette tool is needed (service tool kit).
Procedure:
1. Remove the instrument cover
2. Take off the foam from the cuvette module to reach the measurement head
3. Go to Absorbance → Adjustment → Measurement Head Position ABS CUV
4. Insert the absorbance cuvette tool in the cuvette slot
5. Press Start and switch the lamp with the button “on”
6. Move the measurement head to the highest reachable value. The value has to be higher than the
red line.
7. Press finish (without turning off the lamp!).

8. After the result will be displayed
Troubleshooting:
- Check whether it’s possible to hear the lamp flashing, otherwise do the lamp tests
- Check the cuvette absorbance fiber
- Check the connection of the signal cable to cuvette module
- Replace DETECTOR ABS
14.10.2 Test Absorbance
14.10.2.1 Plate Transport Offset Check X/Y
Description:
The Plate Transport Offset X/Y check is used to verify that the plate carrier is in the optimal measurement
position. The check will be performed with the MultiCheck plate. The adjustment can be performed with a
step size of 200 or 500 (fine or coarse).
During the check, the lamp is flashing and the plate transport moves in X and Y direction. After the
measurement a graphic with the measurement position can be seen.
Procedure:
1. Go to Absorbance → Test → Plate Transport Offset Check X/Y
2. Press Start
6. Press Check
7. Result will be displayed
Troubleshooting:
- 13.5.1.3 Resolution X/Y Adjustment, 13.5.1.1 and 13.5.1.2 Z-Max Position
- 14.10.2.11 Reference Signal Check ABS + CUV if necessary
14.10.2.2 Plate Transport Offset Check Z
Description:
The Plate Transport Offset Check Z verifies the adjustment of the Z-offset.
Procedure:
1. Go to Absorbance → Test → Plate Transport Offset Check Z
2. Press Start
3. Press Next
5. Press Finish
Troubleshooting:
- 14.10.1.3 Plate Transport Offset Z
14.10.2.3 Wavelength Accuracy Check ABS
Description:
The wavelength Accuracy test gives the possibility to check/verify the accuracy of the adjusted
monochromator offset. For this test the Hellma cuvette and the cuvette holder plate is needed (service tool
kit).
Procedure:
1. Got to Absorbance → Adjustment →Wavelength Accuracy Check ABS
2. Press Start
3. Select the Hellma cuvette which should be used → press Next
4. Insert the Hellma Filter Plate (same like for the adjustment)
5. Remove the Hellma Filter Plate → press Next

Troubleshooting:
- 14.10.1.4 Wavelength Accuracy ABS
- Clean the optical fibers
- 30.15.1.1 Counter - check the counters for very large values und reset them if necessary
14.10.2.4 Wavelength Accuracy Check CUV
Description:
The wavelength accuracy test gives the possibility to check/verify the accuracy of the adjusted
monochromator offset for the cuvette. For this test the Hellma cuvette is needed.
Procedure:
1. Got to Absorbance → Adjustment →Wavelength Accuracy Check CUV
2. Start the test → the software will ask to empty the cuvette slot
3. Test will be performed. Until the software is asking for the Hellma cuvette
4. Insert the Hellma cuvette and continue with Finish

5. The curve will be displayed.
6. Click on Finish to see the results
Troubleshooting:
- 14.10.1.5 Wavelength Accuracy CUV
- Clean the fibers
14.10.2.5 Measurement Ranges Check ABS
Description:
The measurement ranges (or gain table) is used for the fast scan in absorbance. With this check the
monochromator will scan over the full wavelength ranges to check the gain for the reference and the
measurement photo diode.
Procedure:
1. Go to Absorbance → Test → Measurement Ranges Check ABS
2. Press Start
Press Check
Troubleshooting:
- 14.10.2.11 Reference Signal Check ABS + CUV if necessary
- Check the photo diodes or replace the diodes
14.10.2.6 Lamp Stability Check
Description:
The Lamp Stability Test is to verify the stability of the absorbance lamp. The test is performed at 260nm
and 485nm for the reference and measurement channel. It calculates the difference between the
measurement and the reference channel. If it is too high the test will fail. Furthermore the test checks if
there is a lamp drop out.
Procedure:
1. Make sure that the cover is placed on the instrument
2. Go to Absorbance → Test → Lamp Stability Check
3. Press Start
4. After the measurement is completed the measurement curves will be displayed
5. Press Finish
Troubleshooting:
- Check the connection cable to the lamp (FLASH LAMP ABS)
- Check that the switch on the lamp is at the position “Ext”
- Clean the lamp (FLASH LAMP ABS)
- Check the adjustment of the measurement head (HEAD MEAS.ABS 1CHAN.)
- Check absorbance mirror (MIRROR LAMP MONO ABS - 14.9.5 Replacing and Adjusting the
Absorbance Mirror). Try and clean it with slightly pressured air.
14.10.2.7 Blocking Spatial Check
Description:
The Blocking Spatial test is used to check the stray light in the monochromator the test will be performed
with the blocking plate (service tool kit). This test will be performed with the wavelength of 485nm and
measure on the whole and the dark position of the blocking plate.
Procedure:
1. Go to Absorbance → Test → Blocking Spatial
2. Press Start
3. Insert Blocking Plate, - press Next
Troubleshooting:
- Clean optical components such as MIRROR LAMP MONO ABS and DETECTOR ABS
- Replace monochromator MONO ABS 1CHAN. (14.9 Disassembly and Adjustment of the
Absorbance Monochromator)
14.10.2.8 Blocking Spectral Check
Description:
The Blocking Spectral Test is used to check the optics (measurement head); the test will be performed with
the blocking plate and with the installed BG39 filter. The measurement will be performed from 200nm to
1000nm.
Procedure:
1. Go to Absorbance → Test → Blocking Spectral
2. Press Start
3. Load blocking plate on the plate carrier – press Next
4. After the measurement the graphic will be displayed
5. Press Finish
6. The results will be shown
Troubleshooting:
- Clean or replace the order sorting filter (MOTOR OSF)
- Replace monochromator MONO ABS 1CHAN. (14.9 Disassembly and Adjustment of the
Absorbance Monochromator)
14.10.2.9 Darknoise Check ABS
Description:
At the Darknoise Check a dark measurement is performed at gain 0 and 255 with 100 flashes per gain.
Procedure:
1. Go to Absorbance → Test → Darknoise Check ABS
2. Press Start
WARNING: Make sure that the instrument cover is closed.
Troubleshooting:
- Replace the cable to the measurement head (CABEL COAXIAL ABS HEAD MEAS.)
- Check the connection; measurement head to absorbance monochromator
- Clean the detector and the measurement head
- Replace the cable to the measurement head (CABEL COAXIAL ABS DETECTOR)
- Replace the measurement head (HEAD MEAS.ABS 1CHAN.)
- Replace the detector of the cuvette (DETECTOR ABS)
- Make sure that the instrument cover is closed and that the injector cap is attached
14.10.2.10 Darknoise Check CUV
Description:
At the Darknoise Check a dark-measurement is performed at gain 0 and 255 with 100 flashes per gain.
Procedure:
1. Go to Absorbance → Test → Darknoise Check CUV
2. Press Start
WARNING: Make sure that the instrument cover is closed.
Troubleshooting:
- Check the connection; measurement head to absorbance monochromator
- Clean the detector and the measurement head of the cuvette
- Replace the cable to the measurement head of the cuvette (CABEL COAXIAL ABS CUVETTE)
- Replace the measurement head of the cuvette (HEAD MEAS.ABS 1CHAN.)
- Replace the detector of the cuvette (PCBA ABS DETECTOR CUVETTE)
- Make sure that the instrument cover is closed and that the injector cap is attached
14.10.2.11 Reference Signal Check ABS
Description:
The “Reference Signal Check” is used to check if reference signal light path. The reference diode for
absorbance is placed in the absorbance measurement head; from there a signal cable is connected to the
absorbance Monochromator board. This test can be used for trouble shooting to see if the fiber is ok. The
measurement will be performed over the full spectrum with a fix gain.
Procedure:
1. Go to Absorbance → Test → Reference Signal Check
2. Press Start
4. Press Finish
Troubleshooting:
- Check the reference signal cable (connectors, wiring damaged).
- Check the adjustment of the measurement head
- 14.10.2.6 Lamp Stability Check (failed: replace the lamp).
- Replace absorbance board or absorbance detector board
14.10.2.12 Reference Signal Check CUV
Description:
The “Reference Signal Check” is used to check if reference signal light path. The reference diode for
absorbance is placed in the absorbance measurement head on the cuvette module. From this module a
signal cable is connected to the absorbance monochromator board. This test can be used for trouble
shooting to see if the fiber is ok. The measurement will be performed over the full spectrum with a fix gain.
Procedure:
1. Go to Absorbance → Test → Reference Signal Check
2. Press Start
4. Press Finish
Troubleshooting:
- Check the reference signal cable (connectors, wiring damaged).
- Check the adjustment of the measurement head
- 14.10.2.6 Lamp Stability Check (failed: replace the lamp).
- Replace absorbance board or absorbance detector board for cuvette
14.10.2.13 Baseline Flatness Check
Description:
The Baseline Flatness test is used to check the general function of the measurement electronics and the
optics. It will be performed over the whole spectrum from 200nm – 1000nm and is calculated in mOD.
Procedure:
1. Go to Absorbance → Test → Baseline Flatness
2. Press Start
Troubleshooting:
- Check the connectors and wiring on the absorbance monochromator
- Replace the boards of the absorbance monochromator (PCBA MOTOR DRIVE MONO and/or
PCBA MONO ABS 1CHAN.- 14.8.1 Replacing the Absorbance Boards)
14.10.2.14 Steploss Test Grating Motor & OSF Motor

Description:
The steploss test is to evaluate if the motor is mechanically blocked. Therefore the motor will be moved to
the maximum position.At the end of the test a result summary with Passed, Failed and lost steps will be
displayed.
Procedure:
1. Go to Absorbance → Test → choose the steploss test Grating Motor or OSF Motor
2. Press Start
Troubleshooting:
- Check the connection to the motor board
- Try to move the OSF motor by hand (when the instrument is switched off) and check for a free
movement. Otherwise Change the OSF motor (MOTOR OSF) according to 14.9.2 Replacing OSF
Filter and the Absorbance Motor
15 Fluorescence Module
The fluorescence option of the Spark can have a variety of combinations. The Fluorescence Top option
has following options:
• Fluorescence Filter module Excitation and/or Emission
• Fluorescence Monochromator in Excitation and/or Emission.
• Fluorescence Fusion optic Module in Excitation and/or Emission
• Fluorescence Filter module Excitation and/or Emission enhanced → only 20M!

• Fluorescence Monochromator in Excitation and/or Emission enhanced → only 20M!
• Fluorescence Fusion optic Module in Excitation and/or Emission enhanced → only 20M!
Enhanced: Bigger diameter of the fiber, 20W Xenon flash lamp, moveable slits.
Same PMT on 10 and 20 M
The Fluorescence Bottom option has following 3 main options:

• Fluorescence Bottom standard
• Fluorescence Bottom enhanced
• Fluorescence Bottom well scan
• Fluorescence Bottom 1536 → only 20M
Fluorescence TOP combinations:
FI Top FI Top FI Top

Filter EX Filter EX Filter EX
Filter EM Mono EM Hybrid EM
with
FI Top FI Top FI Top PMT Enhanced
Mono EX Mono EX Mono EX
FI Top FI Top FI Top

Hybrid EX Hybrid EX Hybrid EX
Fluorescence BOTTOM combinations:
FI Bottom FI Bottom
Standard Enhanced
FI Bottom FI Bottom
Standard Enhanced
Well scan Well scan
User defined Dichroic:

The customer has the possibility to order so called user defined dichroic.
15.2 Fluorescence Optical System
15.2.1 FI Filter
The drawing below shows the light path of the filter system.
The light path is: from the flash lamp -> 90° ellipsoid-mirror -> through the EX fiber (the metal coated fiber
arm is connected to the reference diode) -> to the universal measurement through the EX filter slide ->
dichroic will reflect the light -> through the FI-Top lens -> to the sample -> emitted light from the sample ->
through FI-Top lens and dichroic -> through the EM filter -> into the EM fiber -> to the 90° ellipsoid-mirror
-> to the PMT. The PMT is connected to the FI-Base board, where the measurement/calculation and gain
control is done.
15.2.2 FI-Monochromator
The Fluorescence monochromator of the Spark series readers is designed as a double monochromator
system with two gratings in a single monochromator. The benefits are:
• Reduced stray light
• More precise wavelength selection
The monochromator is equipped with fixed slits allowing a 20 nm bandwidth.
The light from the flash lamp is guided through the 90° ellipsoid-mirror then through the order sorting filter
(OSF) to the first slit of the first grating of the excitation monochromator. The produced wavelength is guided
over the second switching mirror into the middle slit to the second grating. The light goes from the second
grating via the exit slit in the excitation fiber to the universal measurement head.
The universal measurement head is the central measurement unit for fluorescence measurements because
the light path goes through this measurement head down to the microplate. From the microplate, the emitted
light is guided through the dichroic filter into the emission fiber to the input slit on the emission
monochromator. The light goes from the first grating to the switching mirror into the middle slit and to the
second grating. Then the light goes through the exit slit in the order sorting filter (OSF).
Then the light is guided through the 90° ellipsoid-mirror to the photo multiplier tube (PMT). To control the
gratings of the monochromators, an eddy current break is used. The reference signal is detected on the
excitation side of the excitation fiber and is split. One part is connected to the reference diode on the
universal measurement PCBA.
15.2.3 FI Hybrid (Fusion) Monochromator
The drawing below shows the light path of the hybrid system. It shows the fluorescence hybrid option in
position for the filter measurements.
The Fusion Optic option enables the SPARK to measure fluorescence with Filter and/or Monochromator in
one instrument. Therefore the front mount of the monochromator (grating module) is specially designed to
enables the switching between the two measurement modes. To switch between filter/mono the fiber and
the mirror have to be turned 90°. In the picture above the system is switched to filter light path. That means
the light from the lamp is guided from the mirror directly into the fiber to the measurement head to the EX-
filter where the wavelength is selected (depending on the filters in the slide). → equal to EM side.
If the system is switched to the monochromator light path the light is reflected by the mirror into the
monochromator, where the wavelength is selected (see FI Monochromator). → Equal to EM side.
Also different to the example drawing 1 are the installed filter slides for EX and EM in the universal
measurement head to detected in the filter modus the wavelengths of the installed filters. Additional in the
drawing is the FI BOTTOM light path visible.
15.2.4 FI Bottom
The Bottom Measurement Head has the function of

directing the light from the bottom fiber through the
aperture wheel (well scan option) to the 90° Ellipsoid-
Mirror and up directly under the bottom of the microplate.
A shutter is installed on the Bottom Measurement Head
when the Injector Ready option is installed on the SPARK
reader. The shutter has the function of protecting the 90°
ellipsoid-mirror from liquid or dirt.
The motor 1= is the aperture wheel motor

The motor 2= is the splash guard motor.
15.2.5 Replacement of FI Bottom

To replace the FI bottom measurement head, it is necessary to lift up the instrument (bottom up) and
remove the bottom plate (see chapter 11.2).
1. Remove the three screws of the PCBA bottom.

2. Move the PCBA bottom to the side
3. Remove the three screws with the number 3 as shown in the drawing above.
4. Lift up the bottom housing
5. Remove the set screw of the bottom fiber
6. Remove the bottom fiber
To reassemble the parts, please follow the steps in reverse order.

General
- 30.13.1 Firmware Download Download the default settings only for FI bottom
- Import instrument configuration
- 30.13.5 Set Serial Numbers (XXXXFBXXXX)
Fluorescence
- Adjustment and Tests of FI Bottom Plate Transport Offset X/Y
- Adjustment Bottom Wheel Offset
- FI Steploss Test Splashguard Motor
- FI Steploss Test Bottom wheel Motor
15.2.6 Replacement of Bottom Aperture Wheel Motor
To remove both stepper motors of the measurement head use the following procedure:
1. To remove the motor of the aperture wheel remove the 2 set screws.
2. Take off the aperture wheel
3. Remove the 4 screws of the motor

4. To replace the motor remove also the motor holder with 4 screws.
5. Take off the motor
15.2.7 Installation of Bottom Aperture Wheel Motor
For the installation of the aperture wheel stepper motor use the following procedure:
Insert the new motor and follow the description in chapter (15.2.6) in reverse order.
Connect the stepper motor with the motor adjustment tool and move the motor to the home position (see
12.2).
The distance of the aperture wheel to the housing is 1.5mm and this needs to be adjusted with a distance
tool. After adjusting the distance, the set screws of the aperture wheel needs to be tightened.
Fluorescence
- 15.6.3 FI-Bottom Plate Transport Offset
- 15.6.5.5 FI-Bottom Plate Transport Offset Check
- 15.6.4.5 Bottom Wheel Offset
- 15.6.5.17 FI Steploss Tests - Splashguard Motor
- 15.6.5.17 FI Steploss Tests - Bottom wheel Motor
15.2.8 Replacement of Splash Guard Motor FI Bottom
To replace the splash guard motor use the following procedure.
1. Remove the 3 screws of the PCBA Bottom

2. Take off the PCBA Bottom
3. Remove the 2 set screws from the splash guard.
4. Take off the splash guard
5. Remove the 4 screws from the motor
6. Take off the stepper motor
To reassemble the parts, please follow the steps in reverse order
15.2.9 Installation of Splash Guard Motor

For the installation of the splash guard stepper motor use the following procedure:
Figure: 3 mm spacer for FI BOTTOM Enhanced
Figure: 3.6 mm spacer for FI BOTTOM Standard
Insert the new motor and follow the description in chapter (15.2.8) in reverse order. Connect the stepper
motor with the motor adjustment tool and move the motor to the home position (see 12.2).
The distance of the aperture wheel to the housing is 3.0 mm for FI Bottom Enhanced and 3.6 mm for FI
Bottom Standard. This needs to be adjusted with a distance spacers. After adjusting the distance, the set
screws of the splash guard need to be tightened when it is parallel to the housing (see images from above).
CAUTION: It is necessary after installation of splash guard to check with the motor tool that
there is no contact of the splash guard during movement to any housing.
Fluorescence
- 15.6.3 FI-Bottom Plate Transport Offset
- 15.6.5.5 FI-Bottom Plate Transport Offset Check
- 15.6.4.5 Bottom Wheel Offset
- 15.6.5.17 FI Steploss Tests - Splashguard Motor
- 15.6.5.17 FI Steploss Tests - Bottom wheel Motor
15.3 Fluorescence Enhanced
15.3.1 FI Monochromator Enhanced
The Fluorescence TOP option of the SPARK reader uses a double monochromator system. The drawing
below shows the light path of a double monochromator system.
The light from the flash lamp is guided through the 90° ellipsoid-mirror then through the order sorting filter
(OSF) to the first slit wheel of the first grating of the excitation monochromator. The produced wavelength
is guided over the mirror into the middle slit wheel to the second grating. The light goes from the second
grating via the exit slit in the excitation fiber to the universal measurement head.
The universal measurement head is the central measurement unit for fluorescence measurements because
the light path goes through this measurement head down to the microplate (microplate).
From the microplate, the emitted light is guided through the dichroic filter into the emission fiber to the input
slit on the emission monochromator. The light goes from the first grating to the switching mirror into the
middle slit wheel and to the second grating. Then the light goes through the exit slit wheel in the order
sorting filter (OSF). Then the light is guided through the 90° ellipsoid-mirror to the photo multiplier tube
(PMT). The reference signal is detected on the excitation side of the excitation fiber and is split. One part
is connected to the reference diode on the universal measurement PCBA.
The Spark monochromator has variable slits as shown in the picture above (5 nm up to 50 nm).
15.3.2 FI Bottom Enhanced

The Bottom Measurement Head has the function to bring the light from the bottom fiber through the aperture
wheel (well scan option) to the 90° Mirror with lens and up directly under the bottom of the microplate. A
shutter is installed on the Bottom Measurement Head when the Injector Ready option is installed on the
Spark reader. The shutter has the function to protect the 90° lens from liquid or dirt.
The bottom enhanced module of the Spark is equipped with a lens to focus the light to the sample for
measuring 1536 well plates.
15.3.3 Fan for Flash Lamp Enhanced

The bigger 20W flash lamp (FLASH LAMP 20W FI) needs a
fan for additionally cooling. To replace the fan perform the
following steps:
1. Remove the screw number one
2. Remove the angle and screw number 2
3. Disconnect the fan from the PCBA PODI board
4. Replace the fan
For reassembling perform all steps in reverse order.
Instrument
- 30.15.2.7 Fans Check
15.3.4 Universal Measurement Head User Dichroic
Since the Spark 20M it is possible to use user defined dichroics (410nm, 430nm).
In the picture above is the overview of the different measurement heads. With the Spark 20M a slot is
available for a user dichroic mounting. To check if the instrument is equipped with the user dichroic option
check the configuration in PASS or the delivery sheet.
To mount a user defined dichroic proceed as follows:

1. Use the SPARK Control software to move the dichroic out.
2. Go to Method Editor: Instrument -> Mirror or go to Dashboard and press the button Mirror.
3. Set the mirror specific values as can be seen in the table bellow
Excitation Emission
Type Min Max Min Max
410nm 360 395 425 470
430nm 380 415 445 490
458nm 350 450 470 900
593nm 350 558 605 900
660nm 350 650 670 900
4. Click Mirror Out

5. Install the Dichroic, see picture below:
15.4 Electronic System of the Fluorescence Module
15.4.1 Fluorescence Bottom Board
The PCBA FI bottom (PCBA CODABLE) has double function and is also used for the controlling of the FP
motors. This board is also PCBA code able which means this PCBA can change the characteristic of the
hardware mapping (see drawing above).
15.4.2 Fluorescence Monochromator Board
The electronics which is used to control the Fluorescence EX and EM monochromator is the same as the
electronics of the absorbance monochromator.
On the hybrid or fusion option of the fluorescence option is an addition small electronic board installed
which is named PCBA 2-6 motor drive. This small PCBA is used to control the stepper motor 90° ellipsoid-
mirror and the motor of the fiber switch. This additional PCBA is only installed on the hybrid version. The
measurement electronics of the fluorescence option for EX and EM is installed on the PCBA universal
measurement head. This means that the PMT and the flash lamp are not connected to the monochromator.
15.4.3 Replacement of FI EX & EM Monochromator
To replace the fluorescence EX or EM monochromator, follow this procedure:
1. Remove the instrument cover (as described in chapter 11).
2. Disconnect on the EM monochromator the ribbon cable ST3
3. Disconnect on the EX monochromator the ribbon cable ST3
4. Disconnect the EX or EM fiber of the universal measurement head.
5. Disconnect the ribbon cable from the flash lamp
WARNING:
fragile.
In both cases (EX and EM) it is necessary to remove the fiber guide from the currently mounted module
and mount it on the new spare part before you install the new spare part back in the instrument. The
procedure is the same for EX and EM monochromator. Example of replacing the EM monochromator:
To replace the MCR EM it is helpful to use a long Torx screwdriver to remove the two screws (number 2
and 3) on the rear side as shown in the drawing above. On the front side of the MCR EM is one screw to
remove (number 1) as shown in the drawing.
Make sure that the fiber position is the same after you mount the fiber guide to the new module!
Example of replacing the EX monochromator:
To replace the MCR EX it is necessary to use a long Torx screwdriver to remove the two screws (number
1 and 2) on the rear side as shown in the drawing below. On the front side of the MCR EM is one screw to
remove (number 3) as shown in the drawing.
The screws with the number 1 und 2 are not easy to replace because of the housing from the power supply.
Also in EM it is important to exchange the fiber guide from the old module and mount it to the new spare
part. Make sure that the position of the fiber is the same as it was before. Remove the EX or EM fiber
from the universal measurement head.
NOTE: Don’t forget to disconnect the fibers from the universal measurement head.
Replacement of EX Monochromator:
General
- 30.13.3 Default Settings (Download the Default Tables and Settings only for FLUOR MEX)
Instrument
- 30.15.1.1 Counter (reset the counter for FLUOR MEX)
Fluorescence
- 15.6.4.7 Wavelength Accuracy EX, 15.6.4.8 Wavelength Accuracy EM
- 15.6.4.9 Max Intensity Wavelength
- 15.6.5.7 Wavelength Accuracy Check EX, 15.6.5.8 Wavelength Accuracy Check EM
- 15.6.5.3 Lamp Stability
- 15.6.5.2 3D Spectrum Check
- 15.6.5.1 Signal To Blank
- 15.6.5.11 Reference Signal Check Mono
- 15.6.5.12 Reference Signal Check Filter
Replacement of EM Monochromator:
General
- 30.13.3 Default Settings (Download the Default Tables and Settings only for FLUOR MEM)
Instrument
- 30.15.1.1 Counter (reset the counter for FLUOR MEM)
Fluorescence
- 15.6.4.9 Max Intensity Wavelength
- 15.6.5.7 Wavelength Accuracy Check EX, 15.6.5.8 Wavelength Accuracy Check EM
15.4.4 Replacement of FI Mono EX & EM Board
For Replacement of MCR EX:
General
- 30.13.3 Default Settings (Download the Default Tables and Settings only for FLUOR MEX)
- 30.13.5 Set serial number of the MCR module)

- Write the original settings for FLUOR MEX
- Import the original Tables for FLUOR MEX (EX_INTENSITY_CURVE, FLUOR_MEX
ENCODER_TO_WAVE_TABLE)
Fluorescence
- 15.6.4.7 Wavelength Accuracy EX
- 15.6.4.8 Wavelength Accuracy EM
- 15.6.5.7 Wavelength Accuracy Check EX
- 15.6.5.8 Wavelength Accuracy Check EM
For Replacement of MCR EM:

General
- 30.13.1 Firmware Download30.13.2 Configure Instrument (copy can be used)
- 30.13.3 Default Settings (Download the Default Tables and Settings only for FLUOR MEM)
- 30.13.5 Set Serial Numbers (Set serial number of the MCR)
- 30.13.6 Check Module Communication30.15.1.1 Counter (check for unusual values)
- Write the original settings for FLUOR MEM
- Import the original Tables for FLUOR MEM (FITOP PMT1_GAIN_CALIB,
EM_INTENSITY_CURVE, FLUOR_MEM ENCODER_TO_WAVE_TABLE)
Instrument
- 30.15.1.1 Counter (reset the counter for FLUOR MEM FLASH)
Fluorescence
- 15.6.4.7 Wavelength Accuracy EX
- 15.6.4.8 Wavelength Accuracy EM
15.4.5 Replacement of FI Flash Lamp
To replace the lamp module (FLASH LAMP FI) please follow the listed steps:
The instrument housing needs to be removed (see chapter 11.1) as well as the EX monochromator (see
chapter 15.4.3).
If Hybrid option is installed:

Following connectors need to be disconnected: ST100, ST101, ST201, ST202 (small PCBA on the motor
PCBA).
If Monmochromator and Filter (Fusion/Hybrid) option is installed:

On the monochromator and the filter module are no additional connectors
1. Disconnect the connectors for the order sorting filter ST164 and ST203.
2. Remove the 4 screws and take off the lamp module from the monochromator housing or in case of
FI-Filter from the metal angel.
3. The lamp module is attached with 4 screws. To get access to the screw remove first 4 screws of the
metal frame and remove the 4 screws to take off the lamp see drawing below.
4. Disconnect the ribbon cable ST 504 from the lamp module

5. Remove the lamp.
To reassemble the lamp, please follow the steps in reverse order.
Instrument
- 30.15.1.1 Counter (reset the flash lamp counters)
Fluorescence
- 15.6.1 Adjustment Fluorescence (all)
- 15.6.5 Test Fluorescence (all)
15.4.6 Replacement of FI Flash Lamp Enhanced
To replace the lamp module (FLASH LAMP 20W FI), please follow the listed steps:
The instrument housing needs to be removed (see chapter 11.1) and remove the EX monochromator (see
chapter 15.4.3).
If Hybrid option is installed:

Following connectors need to be disconnected, ST100, ST101, ST201, ST202 (small PCBA on the motor
PCBA).
If Monmochromator and Filter (Fusion/Hybrid) option is installed:

On the monochromator and the filter module are no additional connectors
1. Disconnect the connectors for the order sorting filter ST164 and ST203.
2. Remove the 4 screws and take off the lamp module from the monochromator housing or in case of
FI-Filter from the metal angel.
3. The lamp module is attached with 3 screws. To get access to the 3 screws remove first the metal
frame with 4 screws then remove the 3 screws to take off the lamp see drawing below.
4. Disconnect the ribbon cable ST 504 from the lamp module

5. Remove the lamp.
To reassemble the lamp, please follow the steps in reverse order.
Instrument
- 30.15.1.1 Counter (reset the flash lamp counters)
Fluorescence
15.5 FI Universal Measurement Head
For the fluorescence option the central measurement unit is the Universal Measurement Head. This
universal measurement head is installed with every fluorescence option like filter, monochromator or hybrid
to bring the light to the microplate. For the installed options of the fluorescence modules in EX or EM are
all combinations possible.
15.5.1 General Description
Depending on the Spark configuration different components are installed on the universal measurement
head. The drawing above shows a fully loaded fluorescence configuration including fluorescence
polarization (FP).
The light path is always guided through the EX and EM fiber into the measurement head. If the fluorescence
option is equipped with monochromators then the light is guided through the 50% mirror. Otherwise in case
the fluorescence option is equipped with filters then the light is guided through the filters in the filter slide
and through dichroic mirrors.
If the fluorescence option is equipped with bottom then the light is guided through the bottom fibers. In case
it is equipped with FP then additional stepper motors are installed (FILTERWHEEL FP EM MOTOR,
FILTERWHEEL FP EX >300NM MOTOR, FILTERWHEEL FP EX >390NM MOTOR). Depending on the
instrument configuration the correct spare part for the FP Excitation side (>300nm or >390nm) has to be
ordered.
15.5.2 Optical System of the Fluorescence Measurement Head
The drawing below shows the filter option:
The excitation light from the flash lamp is guided through the EX fiber to the FP filter wheel then through
the EX filter to the dichroic or 50% mirror. From the mirror will the light focused through the lens guided
down to the microplate. The emission light shines into the lens and is guided to the dichroic or 50% mirror
to the EM filter and to the FP filter wheel. Then the light is guided through the EM fiber to the detector the
PMT.
The drawing below shows the monochromator option:
The selected wavelengths are provided by the monochromator gratings. The drawing above also shows
the installed FP option.
The drawing below shows the monochromator option with the 50% mirror:
Depending of the user application is the dichroic or the 50% mirror used for the light path.
The drawing shows a fluorescence configuration without the FP option.
The drawing shows how the light is detected via the bottom fibers. On the EX side the light beam is guided
through the fiber. On the EM side the light beam is guided through the mirror to the EM fiber. This
fluorescence configuration shows the hybrid with FP option.
NOTE: On Spark readers which are equipped with fluorescence hybrid option the position of
the filter slide is moving to position “zero” when the user has chosen the monochromator
option.
15.5.3 Mirror Slide Fluorescence

The mirror slide is equipped with two different mirror types: A 50 % mirror and the Dichroic 510. The 50 %
mirror can be used for all fluorescence measurements independent of the selected wavelength. The
Dichroic 510 (e.g. fluorescein, HTRF) has the following performance characteristics: Reflection 320-500
nm (excitation) and Transmission 520-780 nm (emission).
Standard Mirrorslide: 50% mirror, 510 Dichroic
Enhanced Mirrorslide: 50% mirror, 510 Dichroic, 560 Dichroic, 630 Dichroic, (410nm/430nm)
15.5.4 Filter Slides Fluorescence
Two separate filter slides, an excitation and an emission filter slide, enable the user to work with six
independent filter pairs for fluorescence measurements. At the front side of the filter slide is a label with EX
(Excitation) or EM (Emission).
On the backside of each slide is a memory chip where the filter definition is saved. The position 1 is on the
“back side” the position which is as far as in the instrument.
When the system is used with the monochromator option, the filter slide will move to the monochromator
position (see drawing below). Every filter slide has such an monochromator position.
15.5.5 Fluorescence Filters

The optical filters (band pass filters) are mounted in the filter slides (SLIDE FILTER EX EMPTY, SLIDE
FILTER EM EMPTY). The spectral transmission and the bandwidth of the fluorescence filters are optimized
for achieving excellent sensitivity. For filters with an arrow on the side, the light must travel in the same
direction as the arrow.
For filters without an arrow, the end with the metal lip must face away from the light source: Filters have
two different ends – one has a lip and one doesn’t have a lip.
15.5.6 Installing and Removing Fluorescence Filters
No special tool is necessary to install or remove the filters of the excitation or emission filter slide. To install
a filter simply push the button next to the appropriate filter slot, insert the filter and release the button to
secure the filter in the slot. Check that the filter is positioned firmly on the bottom of the filter slot. If the filter
doesn`t get in easily, a Q-tip can be helpful to press the filter in carefully.

Replacement of Filter:
Fluorescence
- 15.6.4.6 Define Filterslide Excitation & Emission
- 30.15.1.1 Counter (Reset the flash counters)
Replacement of Filterslide EX or EM:
Fluorescence
- 15.6.4.2 Filter Slide Offset
- 30.15.1.1 Counter (Reset the flash counters)
- 15.6.5.15 Filter Slide Memory Check
- 15.6.5.17 FI Steploss Tests
15.5.7 Fluorescence Universal Measurement Board

The PCBA FI universal measurement head is installed on a bracket with the housing of the universal
measurement head. In the drawing below it is shown how to replace the PBCA (PCBA FI BASE MODULE).
To replace the PCBA (PCBA FI BASE MODULE) disconnect all connections and the reference fiber. Then
remove the 9 screws to take off the PCBA.
The drawing above gives an overview of the PCBA connectors. When connecting the cables it is important
to check that the ribbon cables ST502, ST503 and ST507 are correctly connected because the coding of
the modules is done via the ribbon cable.
NOTE: It is important that the connectors of the EX MCR ST502 and the connector ST503
EM MCR and the connector ST507 to FP board are correct connected.

General
- 30.13.5 Set Serial Numbers (XXXXF0XXXX)
- 30.13.3 Default Settings (Download the default settings only for FLUOR and the tables
Mirror Reflection Table FLUOR, Mirror Transmission Table FLUOR)
Instrument Settings
- Download the original settings -> save to instrument
Fluorescence
Fluorescence Polarization Board (PCBA CODABLE):
The PCBA FP (PCBA CODABLE) has double function and is also used for the controlling of the
fluorescence bottom motors. This board is also named as PCBA code able which means this PCBA can
change the characteristic with the hardware mapping see drawing above.
Replacement Procedure:
1. Remove the excitation monochromator (see chapter 15.4.3 )
2. Disconnect all connections.
3. Remove the 4 screws to remove the board.

General
- 30.13.5 Set Serial Numbers (XXXXFFXXXX)
- 30.13.3 Default Settings (Download the original settings)
Fluorescence
- 15.6.4 FI-Pol Plate Transport Offset Adj.
- 15.6.4.4 FP Wheel Offset Adj.
- 15.6.5.14 Polarization Check
- 15.6.5.17 FI Steploss Tests – Motor EX
- 15.6.5.17 FI Steploss Tests – Motor EM
15.5.8 Assembly/Reassembly and Adjustment
15.5.9 Bottom Fiber Assembly/Reassembly
WARNING:
fragile.
Loosen the screws (which are shown in blue or marked 1 in the pictures below) so that the fiber can be
removed easily. The pictures below show how and where the fluorescence fibers have to be removed.
FI Bottom Fiber
FI-Top EX Fiber
FI-Top EM Fiber
15.5.10 Replacement/Reassembly FP Motor

To enable the replacement of the FP Motors (FILTERWHEEL FP EM MOTOR, FILTERWHEEL FP
EX >300NM MOTOR, FILTERWHEEL FP EX >390NM MOTOR) the FI-Measurement head angle has to
be loosened. To do that, loosen the two screws on the front side and remove the other two on the back.
Now the board can be moved up so that the motors can be removed.
Remove the FI-Top EX&EM fiber (see chapter 15.5.9).
1. Remove the three screws at the EX FP Motor

2. Remove the motor (upwards).
3. Remove the three screws at the EM FP Motor
4. Remove the motor
5. For reassembly perform the procedure in the reverse order. Afterwards make sure that the filter
slide is moving freely and that the fiber is not touching the FP filter wheel
15.5.11 Assembly/Reassembly of the Filter Slide Motor
6. Remove the two screws and the connector from the FI Measurement Board
7. Remove the Motor (MOTOR FILTER SLIDE FI)
To reassemble perform the procedure in the reverse order. Keep the screws loose because the position
has to be adjusted. Procedure:
1. Insert a filter slide into the instrument

2. Adjust the filter motor (filter slide clearance ca. 0.1 mm).
3. When the motor is in the right position → tighten the screws
Fluorescence
- 15.6.4.2 Filter Slide Offset
- 15.6.4.3 Mirror slide Offset
- 15.6.5.17 FI Steploss Tests – Motor EM
- 15.6.5.17 FI Steploss Tests – Motor EX
15.6 Fluorescence – Service Software
15.6.1 Adjustment Fluorescence

Description:
The Z-Offset for Fluorescence will be calculated with the results of the Z-Min and Max Adjustment. If the
instrument is equipped with filter or hybrid option the filter slide needs to be inserted.
Procedure:
1. Go to Fluorescence → Adjustment → Plate Transport Offset Z
2. Press Start
3. Offset will be calculated and result will be shown:
Troubleshooting:
- 13.5.1.1 Z-Min Position Offset, 13.5.1.2 Z-Max Position Offset
15.6.2 FI-Top Plate Transport Offset
15.6.2.1 Plate transport Offset X/Y Mono/Filter, Filter/Mono, Mono/Mono,

Filter/Filter
Description:
with a step size of 200 or 500 (Fine or Coarse). During the adjustment, the lamp is flashing and the plate
transport moves in X and Y direction to find the best position. After the measurement for the adjustment
there will be a graphic where the measurement position can be seen.
Procedure:
1. Go to Fluorescence → Adjustment → choose the check which should be performed
2. Press Start
3. Insert the MC-Plate
4. Choose the step width
5. Press Next
7. If the spot is in the middle of the cross, press “set”; if not press “Set and Repeat” this means that
the current offset will be set and the measurement will run again to calculate the correct offset
Troubleshooting:
- 13.5.1.3 Resolution X/Y Adj., 13.5.2.3 Resolution X/Y Check
- Check the connections on the Boards, no connector defective, right connection position
- Perform Wavelength Accuracy adjustment
- Check the plate carrier torsion
- Check the fibers visually (any damage)
- Check with a different MC plate
15.6.3 FI-Bottom Plate Transport Offset
15.6.3.1 Plate Transport Offset X/YMono/Filter, Filter/Mono, Mono/Mono,

Filter/Filter
Description:
with a step size of 200 or 500 (Fine or Coarse).During the adjustment, the lamp is flashing and the plate
transport moves in X and Y direction to find the best position. After the measurement for the adjustment
there will be a graphic where the measurement position can be seen.
Procedure:
1. Go to Fluorescence → Adjustment → Fluorescence Bottom → choose the adjustment which should
be performed
2. Press Start
3. Insert the MC-Plate
4. Choose the step width
5. Press Next
7. If the spot is in the middle of the cross, press “set”; if not press “Set and Repeat” this means that
the current offset will be set and the measurement will run again to calculate the correct offset.
Troubleshooting:
- Perform Wavelength Accuracy adjustment
15.6.4 FI-Pol Plate Transport Offset
15.6.4.1 Plate Transport Offset X/Y FP

Description:
The Plate Transport Offset X/Y FP adjustment will be calculated by using the values/offsets of the FI-Top
Plate Transport Offsets.
Procedure:
1. Go to Fluorescence → Adjustment → Plate Transport Offset X/Y FP
2. Press Start
Troubleshooting:
- 15.6.4.7 Wavelength Accuracy EX, 15.6.4.8 Wavelength Accuracy EM Adjustment
- Check the fibers visually (if there is any damage)
15.6.4.2 Filter Slide Offset
Description:
The Filter slide offset needs to be adjusted, that the light beam passes the filter in the middle. After starting
the adjustment the first point is to adjust the EX-Filter slide, choose the step width and move the Filter slide
to the position where the slide is in one row with the measurement head. The software takes this position
as reference position and calculates each filter position from this point.
Procedure:
1. Go to Fluorescence → Adjustment → Filter slide Offset
2. Press Start
3. The EX Filter Slide will went to the current position
4. Select the step width and move the Filter slide with the In/Out button (or with the keys +, -) so far
that the slide is in one row with the measurement head
5. Press Next
6. EM Filter slide has to be adjusted (same procedure like EX).
7. Press Next
Troubleshooting:
- Ensure that a filter slide is inserted
- 15.6.5.17 FI Steploss Tests - Filter slide steploss test
- Check the filter slide whether the teeth are broken
- Adjust the filter slide motors
15.6.4.3 Mirror slide Offset
Description:
This adjustment is used to adjust the correct position of the mirror slide. The mirror slide is equipped with
two different mirror types: A 50 % mirror and the Dichroic 510. The 50 % mirror can be used for all
fluorescence measurements independent of the selected wavelength. The Dichroic 510 (e.g. fluorescein,
HTRF) has the following performance characteristics: Reflection 320-500 nm (excitation) and Transmission
520-780 nm (emission).
Procedure:
1. Go to Fluorescence → Adjustment → Mirror slide Offset
2. Press Start
3. Select MultiCheck plate -> press Next
4. Insert the MultiCheck Plate and press Next
6. Press Set
7. Remove the MultiCheck Plate and press Finish
Troubleshooting:
- 15.6.5.17 FI Steploss Tests - Filter slide steploss test
- Check if something is blocking the Mirror Slide
15.6.4.4 FP Wheel Offset
Description:
The FP wheel Offset adjustment calculates the offset for the FP wheels on the FI measurement head. This
adjustment has to be done after replacing the motors or the FP PCBA.
Procedure:
1. Go to Fluorescence → Adjustment → FP Wheel Offset
2. Press Start
3. Insert a MultiCheck Plate and press Next
5. Press Set
Remove the MultiCheck Plate and press Finish
Troubleshooting:
- 15.6.5.17 FI Steploss Tests - FP Wheel steploss test
- 15.5.10 Replacement/Reassembly FP Motor/replace the defective FP-Wheel
- Remove the filter slides and check that the filter wheel is moving freely. Detach them from the
universal measurement head (15.5.10 Replacement/Reassembly FP Motor)
- Make sure that the fiber or the filter slide is not blocking/jamming the FP filter wheel
15.6.4.5 Bottom Wheel Offset
Description:
The bottom wheel offset adjustment calculates the offset for the FI-bottom wheel on the FI-bottom
measurement head. This adjustment has to be done after replacing the motor or the FI-Bottom PCBA
(PCBA CODABLE).
Procedure:
1. Go to Fluorescence → Adjustment → Fluorescence Bottom → Bottom Wheel Offset
2. Press Start
3. Select/Insert the MultiCheck Plate
4. Press Next
6. Press Finish
Troubleshooting:
- 15.6.5.17 FI Steploss Tests - Bottom Wheel steploss test
- Check the motor connection to the board. (FI-Bottom Motor MOTOR FI BOTTOM → FI Bottom
Board (PCBA CODABLE)
15.6.4.6 Define Filterslide Excitation & Emission
Description:
The Define Filterslide Adjustment is to configure the filter slides. The configuration will be written to the filter
slide board on the rear side of the slides. One filter slide can be equipped with up to six different filters.
Procedure: (same procedure for EX/EM)

1. Go to Fluorescence → Adjustment → Define Filterslide
2. Press Start
3. Insert the Filterslides or if they are already inserted press Next
4. At first define the EX-Slide; go to the position where the filter is inserted. Fill in the Wavelength,
Bandwidth and filter type. Furthermore it`s possible to read out the flash counter for each filter and
to reset them (for the reset procedure please see below). In the description field a name can be set
for the filter.
5. Press Write
Flash counter Reset procedure:

1. Perform the same steps like in the define Filter slide procedure
2. In the first Filter slide define window for the EX slide set the cross at the reset box where you want
to reset the counter
3. Press Write
4. To reset the counter at the EM-Slide and perform the same steps like above
5. Press Write
Troubleshooting:
- 15.6.5.15 Filter Slide Memory Check
- Clean the filter slide contacts on the back
- Try to perform the check with another filter slide or interchange the PCBA from EX to EM and vice
versa
15.6.4.7 Wavelength Accuracy EX
Description:
For the Wavelength Accuracy EX adjustment the Spectrometer is used. Before you start the adjustment
prepare the Spectrometer tool:
• Fix the fiber at position C1 on the Spectrometer plate at the “10mm” mark.
• Put the stray plate on the Spectrometer plate
• Connect the Spectrometer Tool via USB (2.0) to the PC
• The adjustment adjusts the grating of the EX Monochromator.
Procedure:
1. Go to Fluorescence → Adjustment → Wavelength Accuracy EX
2. Press Start
3. Connect the Spectrometer to the PC and press Next
4. If the instrument is equipped the HG Lamp needs to be connected
6. Press Set
7. Remove the Spectrometer plate and press Finish
Troubleshooting:
- Check the Spectrometer (connected to PC, fiber is fixed at 10…)
- 30.10.1 Test Tools - Check the test tool settings in the PASS that they are correct
- 30.14.2 Communication Check Spectrometer
15.6.4.8 Wavelength Accuracy EM
Description:
If Hybrid or Mono Instrument on EX and EM side:
The Wavelength Accuracy for the EM Mono will be performed with the EX Monochromator. The grating of
the EM Mono went to several fix position while the EX Mono makes a scan over the whole spectrum.
If only Mono or Hybrid Instrument only on EM side:
If there is no Mono on the EX side the adjustment has to been done with:
- HG-Lamp + fiber of spectrometer tool + plate of spectrometer tool (fiber at mark 10mm).
- Define on EX filter slide a filter on an empty position with 900nm and cover the position or use a
dummy filter (this blocks the light)
The Wavelength Accuracy for the EM Mono will be performed by taking the peaks of the spectrum from
the HG-Lamp.
Procedure: If Hybrid or Mono Instrument on EX and EM side:
1. Go to Fluorescence → Adjustment → Wavelength Accuracy EM
2. Press Start
4. Press Set
If only Mono or Hybrid Instrument only on EM side:

1. Go to Fluorescence → Adjustment → Wavelength Accuracy EM
2. Press Start
3. Follow the procedure described in the software
5. Press Set
6. Remove the Spectrometer Plate and press Finish
Troubleshooting:
- Check the Spectrometer (connected to PC, fiber is fixed at 10…)
- 30.14.2 Communication Check Spectrometer
15.6.4.9 Max Intensity Wavelength
Description:
This adjustment is used to set the wavelength with the highest signal intensity. This value will be used for
optimizing the gain for fluorescence measurements. For the Spark all changeable bandwidths will be
displayed except for SPARK 10M.
Procedure:
1. Go to Fluorescence → Adjustment → Max Intensity Wavelength
2. Press Start
4. Press Set
Troubleshooting:
- 15.6.5.3 Lamp Stability Test
15.6.5 Test Fluorescence
15.6.5.1 Signal To Blank
Description:
The Signal to Blank check is used to detect if there is any pollution in the instrument or optic. For this check
two measurements will be performed:
• A measurement in a well on the MultiCheck Plate
• A dark measurement
These two values will be compared together and in case the deviation is above a certain threshold the test
will fail.
Procedure:
1. Go to Fluorescence → Test → Signal to Blank Check
2. Press Start
3. Insert MultiCheck plate and press Next
5. Press Next
Troubleshooting:
- Clean the MultiCheck plate with slightly pressured air (especially A2, C3-C6)
- Clean the FI optics (fibers and the lens below the universal measurement head)
15.6.5.2 3D Spectrum Check
Description:
The 3D Scan is used to check that the fluorescence optic is clean and that the OSF offset is set correct. If
the value is higher than 1, the test fails. Most likely the optic has to be cleaned.
Procedure:
1. Go to Fluorescence → Test → 3D Spectrum Check
2. Press Start
3. Insert MultiCheck plate and press Next
5. Press Finish
Troubleshooting:
- Clean optic
15.6.5.3 Lamp Stability
Description:
The Lamp Stability Test is to verify the stability of the fluorescence flash lamp. The test will be performed
at 485 nm for the reference and measurement channel. It calculates the difference between the
measurement and the reference channel. If the difference is too high the test will fail. Furthermore the test
checks if there are any lamp drop outs.
Procedure:
1. Make sure that the cover is placed on the instrument
2. Got to Fluorescence → Test → Lamp Stability Check
3. Press Start
4. After the measurement is completed a chart will come up.
5. Press Next
Troubleshooting:
- Check the connection from the FI PCBA to the FI flash lamp
- Clean and/or replace the lamp (FLASH LAMP FI or FLASH LAMP 20W FI)
- Check the attachment to the universal measurement head
- Make sure that the cover is placed on the instrument
15.6.5.4 FI-Top Plate Transport Offset Check
15.6.5.4.1 FI-Top Plate Transport Offset Check X/Y MONO/FILTER,

FILTER/MONO, MONO/MONO, FILTER/FILTER
Description:
The Plate Transport Offset X/Y check is used to check the plate carrier to the optimal measurement position.
The check will be performed with the MultiCheck Plate. The check can be performed with a step size of
200 or 500 (Fine or Coarse). During the check, the lamp is flashing and the plate transport moves in X and
Y direction to verify the best position. After the measurement for the check there will be a graphic where
the measurement position can be seen.
Procedure:
1. Go to Fluorescence → Test → FI-Top Plate Transport Offset Check → choose the check
2. Press Start
3. Insert the MC-Plate and press Next
4. Choose the step width and press Next
6. Graphic of the spot will be displayed
7. Press Check
Troubleshooting:
- Check the connections on the PCBA
- Check MC pinhole fluorescence bottom position F12 (underneath plate)
15.6.5.5 FI-Bottom Plate Transport Offset Check
15.6.5.5.1 FI-Bottom Plate Transport Offset Check X/Y MONO/FILTER,

FILTER/MONO, MONO/MONO, FILTER/FILTER
Description:
The Plate Transport Offset X/Y check is used to check the plate carrier to the optimal measurement position.
The check will be performed with the MultiCheck Plate. The check can be performed with a step size of
200 or 500 (Fine or Coarse).
During the check, the lamp is flashing and the plate transport moves in X and Y direction to verify the best
position. After the measurement for the check there will be a graphic where the measurement position can
be seen.
Procedure:
1. Go to Fluorescence → Test → FI-Bottom Plate Transport Offset Check → choose the check which
should be performed
2. Press Start
3. Insert the MC-Plate and press Next
4. Choose the step width and press Next
6. Graphic of the spot will be displayed
7. Press Check
Troubleshooting:
- Perform Resolution X/Y adjustment and check
- 15.6.4.7 Wavelength Accuracy EX Adj., 15.6.4.8 Wavelength Accuracy EM Adj.
- Check MC pinhole fluorescence bottom position F12 (underneath plate)
15.6.5.6 FI-Pol Transport Offset Check
Description:
For the Plate Transport Offset Check X/Y FP, the software will use the value of the FI-Top plate transport
offsets.
Procedure:
1. Go to Fluorescence → Test → FI-Pol Plate Transport Offset Check →Plate Transport Offset X/Y
FP
2. Press Start
Troubleshooting:
- 15.6.5.17 FI Steploss Tests FP
- Remove the filter slides
- Check that the filter wheel is moving freely. Therefore detach them from the universal
measurement head (15.5.10 Replacement/Reassembly FP Motor)
- Make sure that the fiber or the filter slide is not blocking/jamming the FP filter wheel
15.6.5.7 Wavelength Accuracy Check EX
Description:
This Test is to verify the wavelength accuracy of the EX-Mono. For this test the spectrometer Tool is
needed.
Procedure:
1. Go to Fluorescence → Test → Wavelength Accuracy Check EX
2. Press Start
3. Connect the Spectrometer to the PC (according to the picture which will pop up in the Pass
software) and press Next
5. Press Next.
6. Remove the Spectrometer Plate.
7. Press Finish and the results will be displayed.
Troubleshooting:
- 15.6.4.7 Wavelength Accuracy EX Adj.
- 15.6.4.8 Wavelength Accuracy EM Adj.
15.6.5.8 Wavelength Accuracy Check EM
Description:
This Test is to verify the wavelength accuracy of the EM-Mono.
(If the Instrument has no EX monochromator, the HG-1 Lamp has to be used -> see the wave. accuracy
adjustment).
Procedure:
1. Go to Fluorescence → Test → Wavelength Accuracy Check EM
2. Press Start
4. Press Finish -> results will be displayed
Troubleshooting:
- 15.6.4.7 Wavelength Accuracy EX Adj.
- 15.6.4.8 Wavelength Accuracy EM Adj.
15.6.5.9 Mirror Slide Offset Check FI-Top
Description:
This adjustment is used to determine the correct offset of the mirror slide.
Procedure:
1. Go to Fluorescence → Test → Mirror slide Offset Check FI-Top
2. Press Start
3. Insert MultiCheck Plate
4. Press Next
6. Press Next
Troubleshooting:
- 15.6.5.17 FI Steploss Tests - Mirror slide steploss test
- Check if something is blocking the Mirror slide
15.6.5.10 Mirror Slide Offset Check FI-Bottom
Description:
This adjustment is used to determine the correct offset of the mirror slide.
Procedure:
1. Go to Fluorescence → Test → Mirror slide Offset Check FI-Bottom
2. Press Start
4. Press Next
6. Press Next
Troubleshooting:
- Check if something is blocking the mirror slide
15.6.5.11 Reference Signal Check Mono
Description:
This test is used to check the reference signal of the monochromator system. The check can be used for
troubleshooting to check if the fibers or the optical signal path is fine. The reference signal is measured on
the FI-Main Board, over the whole spectrum.
Procedure:
1. Go to Fluorescence → Test → Reference Signal Mono
2. Press Start
4. Press Finish.
5. Results will be displayed.
Troubleshooting:
- Check the connection cable to the flash lamp
- Check the fiber if there are any damages
- Clean the lamp and clean the fibers
- Make sure that the reference fiber is mounted to its maximum position on the electronics board
- Remove filter slide on a hybrid system and redo the test
- 15.6.4.7 Wavelength Accuracy EX Adjustment
- Replace PCBA FI BASE MODULE
15.6.5.12 Reference Signal Check Filter
Description:
This test is used to check the reference signal of the Filter-system. The check can be used for
troubleshooting to check if the fibers or the optical signal path is ok. The reference signal is measured on
the FI-Main Board, over the whole spectrum.
Procedure:
1. Go to Fluorescence → Test → Reference Signal Filter
2. Press Start
Troubleshooting:
- 15.6.4.6 Define Filterslide Excitation & Emissionv - check filter slide configuration
- Check the connection cable to the lamp
- Check that the is still powered on at the position “Ext”
- Check the fiber if there are any damages
- Clean the lamp and clean the fiber
- Make sure that the reference fiber is mounted to its maximum position on the electronics board
- Replace PCBA FI BASE MODULE
15.6.5.13 Darknoise Check
Description:
The Darknoise Check is used to check the measurement electronic and the PMT on the emission side. The
measurement will be performed for different gain values.
Procedure:
1. Go to Fluorescence → Test → Darknoise Check.
2. Press Start.
3. Measurement will be performed.
4. Press Next.
Troubleshooting:
- Replace the fluorescence base module board (PCBA FI BASE MODULE)
- Replace fluorescence EM monochromator
15.6.5.14 Polarization Check
Description:
The Polarization Check is used to check the FP optic (filters in the FP wheels).
Procedure:
1. Go to Fluorescence → Test → Polarization Check.
2. Press Start.
3. Insert MultiCheck Plate.
4. Press Next.
5. Measurement will performed and displayed like below
6. Press Next
7. Remove the MultiCheck plate
8. Press Next
10.
Troubleshooting:
- 15.6.5.17 FI Steploss Tests - FP wheel step loss test
- 15.5.10 Replacement/Reassembly FP Motor/replace FP wheels
- Make sure that the wheel is moving freely and that the fiber is not touching the wheel
- Clean MultiCheck plate with slightly pressured air
15.6.5.15 Filter Slide Memory Check
Description:
This check is to verify the function of the filter PCBA on the rear side of each filter slide (EX, EM). For that
the software writes a value on the filter slide and tries to read them out.
Procedure:
1. Go to Fluorescence → Test → Filterslide Memory Check
2. Press Start
Troubleshooting:
- Make sure that the filter slides are inserted
- Clean filter slide board contacts
- Change filter slide (SLIDE FILTER EX EMPTY, SLIDE FILTER EM EMPTY)
15.6.5.16 Optical Path Inspection
Description:
The following test will make the flash lamp constantly flashing at a wavelength of 485nm. This test can be
used to check the optical light direction of the fluorescence excitation side. Further this can be used to
check if a light signal is coming through to the measurement area. The green bar diagram shows the light
intensity of the excitation side and the orange bar diagram the emission side.
Procedure:
1. Go to Fluorescence → Test → Optical Path Inspection
2. Press Start

4. If the Signal is visible click YES
Troubleshooting:
- 15.6.5.3 Lamp Stability Test - Check the flash lamp
- Check that the filter slides are not blocking the light direction (eject and insert the filter slides)
- Check that the reference fiber is inserted to its maximum position on the FI base board (PCBA FI
BASE MODULE)
- Check that the fiber is in correct position
15.6.5.17 FI Steploss Tests
Description:
Following Steploss tests are available for the Spark in fluorescence: Grating Motor EX, Grating Motor EM,
Fiberswitch Motor EX, Fiberswitch Motor EM, OSF Motor EX, OSF Motor EM, Mirrorswitch Motor EX,
Mirrorswitch Motor EM, FP Motor EX, FP Motor EM, Filterslide Motor, Mirror slide Motor, Bottomwheel
Motor, Splashguard Motor, Slit In/Mid for EX and EM.
the maximum positions. At the end of the test a result summary with Passed, Failed and lost steps will be
displayed.
Procedure:
1. Go to the above described directory and choose the step loss test which should be performed
2. Press Start
Troubleshooting:
- Check the connection from the FI PCBA to the corresponding FI motor
- Check if something is blocking the motor
- Try to move the motor by hand (when the instrument is switched off) and check the free movement
- Replace the particular motor
15.6.5.18 Signal to Blank Dichroic Check (FI TOP)
Description:
This test is used to determine correct signal to blank values during fluorescence measurements using the
multi check plate. For the measurement on a Spark the 510, 560 and 625nm dichroic will be used. To run
this test on a Spark instruments the following filters are required in the filters slides:
For Dichroic 510: - Exc. 485nm BW: 20nm; - Em. 535nm BW: 25nm
Procedure:
1. Go to Fluorescence → Test → Signal To Blank Dichroic Check(FITOP)
2. Press Start
4. Press Next
6. Press Next
Troubleshooting:
- Check if something is blocking the mirror slide
16 Luminesence System
The Spark luminescence detection system utilizes the single photon counting measurement technique. This
is based on a dedicated luminescence PMT with appropriate measurement circuitry. This technique is very
robust against noise. It is preferred for measurement of very low light levels. For best performance it is
recommended to use white plates for luminescence measurements.
CAUTION: Switch on the instrument at least 15 minutes before starting a luminescence

measurement. Some components need to warm up to guarantee stable conditions for the
measurement.
Luminescence is available in three different options:

1. Standard (MODULE LUMI STD.)
2. Enhanced (MODULE LUMI ENH.)
3. Alpha (MODULE LUMI ALPHA)
The difference between the luminescence modules lies in the structure of the components. The Standard
module has one motor and one filter wheel, while the Enhanced module has two motors and two filter
wheels to perform BRET and Lumi Scan measurements. The Alpha module has an additional laser and a
third motor for activating an shutter. The shutter has the task of protecting the PMT from reflected laser
light. It only opens the shutter during the measurement and not during excitation by the LASER.
The Lumi measurement head also has an aperture wheel with different apertures that can be moved into
the light path depending on the microplate used (96- and 384-well).This is used only on the Enhanced Lumi
module.
The Standard Lumi module has only a fixed measurement head without a shutter wheel and aperture.
Because of different types of measurement heads the Lumi module will have 2 different fibers, - one for the
Basic only 96 well and one fiber for Enhanced for 384 well.
16.2 Safety Precautions Luminescence
The Alpha module uses a high power laser (680nm/750mW) as the excitation light source. A Spark
instrument equipped with an Alpha module is a LASER CLASS 1 product. The instrument complies with
FDA radiation performance standards, 21 CFR 1040.10, except for deviations pursuant to Laser Notice No.
50, dated June 24, 2007.
The following labels are attached to the rear of the instrument:
The Alpha laser module is classified as a CLASS 4 LASER product according to IEC 60825-1 regulations.
The following warning label is applied to the body of the module inside the instrument:
The laser light is visible to the human eye and is emitted from the end of the excitation fiber. Staring directly
at the laser beam momentarily causes biological damage. Make sure that the laser beam does not hit the
eye of an observer, even if it is through reflective or dispersive surfaces.
WARNING:
Laser Radiation – Do not stare into the beam! Class IV Laser Product Inside.
For installation, use and maintenance it is not necessary to open the laser module! For installation, use,
maintenance and service it is not necessary to operate the laser module with the instrument cover opened!
Any violation of the optic parts or the excitation fiber in particular can cause radiation up to the maximum
level of the laser diode (750 mW at 680 nm).
WARNING:
Use of controls or adjustments or performance of procedures other than those specified
herein may result in exposure to hazardous visible laser light.
16.3 Replacement and Adjustment Of Lumi Module
To replace the Lumi module, please follow the steps below:
1. Disconnect the power and the USB cable from the module
2. Remove the top cover (see chapter 11.1).
3. Remove the fiber from the module (see picture above).

• If the Standard or Enhanced Lumi module is installed, the set screw has to be removed.
• If the Alpha Laser module is installed, then the Alpha fiber needs to be unscrewed.
WARNING:
fragile. Be sure that after replacing that the fibers are attached securely with the screws.
4. Remove the four screws and lift up the module of the instrument.
5. Remove screw number 1 and transport pin number 2 before assembling the new spare part Lumi
module.

General
Luminescence
- 16.10.2.3 Lid Check
- 16.10.3 Steploss Test Lower Filterwheel, Upper Filterwheel, Measurement Head
WARNING: After replacement of Lumi Std. module, send the following firmware command in
the PASS software: CONFIG FILTER=EMISSION CARRIER=UPPER POSITION=1
TYPE=EMPTY
16.4 Replacement of Lumi Fibers
To replace the Lumi fiber (FIBERBUNDLE LUMI 96, FIBERBUNDLE LUMI 384, FIBERBUNDLE LUMI
ALPHA), please follow the steps below:
2. Remove screw Nr.1 from the measurement head, be careful with the parts below the screw
3. Pull out the fiber Nr. 2
4. Remove the cable holder on the main transport board
5. Remove the top fiber connection on the Lumi module
6. Remove the fiber from the module (see picture above).

• If the Standard or Enhanced Lumi module is installed, the set screw has to be removed
• If the Alpha Laser module is installed then the Alpha fiber needs to be unscrewed.
WARNING:
fragile. Be sure that after replacing that the fibers are screwed.
For the new fiber do all steps in reverse order!
Luminescence:
- 16.10.2.3 Lid Check
16.5 Replacement of Well Temperature Sensor
To replace the temperature sensor (WIRING IR SENSOR), please follow the steps below:
2. Remove screw Nr. 1 from the place close to the Lumi measurement head.
3. Pull out the Sensor (WIRING IR SENSOR)
4. Remove the connection of the well sensor on the main transport board
For the new temperature sensor execute all steps in reverse order!

Instrument
- 30.15.1.3 Chamber Temperature Offset
- 30.15.2.3 Chamber Temperature Offset Check
Luminescence
- 16.10.2.3 Lid Check
16.6 Replacement of Lumi Alpha LASER

To replace the Alpha LASER, please follow the steps below:
1. Disconnect the power and the USB cable from the module.
3. Remove the fiber from the Module
4. Remove the 4 screws of the Lumi module to lift up the module
(see picture number 1)
5. Remove the 6 screws of the Alpha Laser (see picture 3)
6. Take off the Alpha Laser (see picture 4)

Luminescence:
- 16.10.2.3 Lid Check
16.7 Electronic System Luminescence
The Lumi module electronics or measurement board is located directly on the Lumi module. On the Spark
reader it is not possible to replace only the electronic. In case of needed replacement the whole Lumi
module needs to be replaced. See below and electronic overview for the connections:
16.8 Replacement of Luminescence Measurement Head
The measurement head (HEAD MEAS. LUMI) for the aperture can be replaced only as complete unit. The
position of the luminescence measurement head is in between of the Lid lifter and the absorbance detection
head. To replace the measurement head see below:
1. Remove the set screw of the fiber

2. Remove fiber and disconnect the motor
3. Remove the 2 screws from the module
4. Take off the module
To install follow the steps in reverse order.

General
Plate Transport
- 13.5.1.1 Z-Min Position Adj.
- 13.5.1.2 Z-Max Position Adj.
- 13.5.1.3 Resolution X/Y Adj.
Luminescence
- 16.10.1.1 Plate Transport Offset Z Adjustment
- 16.10.1.2 Plate Transport Offset X/Y Adjustment
- 16.10.3 Steploss Test Lower Filterwheel, Upper Filterwheel, Measurement Head
For all installed options perform the Adjustments Plate Transport X/Y/Z and the Plate Transport
Offset Checks X/Y/Z
16.9 Replacement of LASER Safety Board
The safety PCBA (PCBA SAFETY ALPHA LASER SET) is designed to ensure LAESR safety. During an
Alpha measurement (MODULE LUMI ALPHA CPL.), the light barrier of the instrument flap is controlled by
the board. If the instrument flap is opened, the power to the laser is interrupted and the beam switched off.
If this happens, the measurement must be started again.
To replace the Safety PCBA perform the following steps:

1. Remove the 3 screws to take off the safety PCBA.
2. Remove the 4 connectors to replace the PCBA
ST3:
ST2:
Connector to Alpha
Home sensor flap
Laser module
ST1:
Connector cable from ST4:
ST802 (PCBA main) Connector to Lumi
to ST1 (PCBA safety) module

General
- 30.15.1.1 Counter
Luminescence
- 16.10.2.3 Lid Check
During the Alpha screen measurement push the instrument flap slightly open (not more than 1 cm) so that
an error occurs to check that the safety PCBA is working.
WARNING: Do not push the instrument flap open more than 1 cm (push slightly).
16.10 Luminescence – Service Software
16.10.1 Adjustment Luminescence

Description:
The Plate Transport Offset Z adjustment is used to adjust the plate carrier to the optimal measurement
position, to minimize the crosstalk. The offset will be calculated.
Procedure:
1. Go to Luminescence → Adjustment → Plate Transport Offset Z.
2. Press Start.
3. Measurement will performed – offset calculated.
4. Result will be displayed.
Troubleshooting:
Perform plate transport adjustments/tests:

- 13.5.1.1 Z-Min Position
- 13.5.1.2 Z-Max Position
16.10.1.2 Plate Transport Offset X/Y
Description:
with a step size of 300 or 500 (Fine or Coarse).
After the measurement for the adjustment there will be a graphic where the measurement position (spot)
can be seen. If the spot is not in the middle of the cross press Set&Repeat. If the offset it is ok press Set.
Procedure:
1. Go to Luminescence → Adjustment → Plate Transport Offset X/Y
2. Press Start.
3. Place the MultiCheck Plate on the plate carrier and switch on the LED on the plate by pushing the
button.
4. Press Next.
5. Select the step width and press Next.
6. Measurement will performed.
7. Graphic will be displayed.
8. Press Set (or Set&Repeat).

Troubleshooting:
modules!)
- Make sure that the LED of the MC-Plate is switched on
- Check the Lumi Fiber visually
- 16.10.3 Steploss Test Lower Filterwheel, Upper Filterwheel, Measurement Head - Perform Lumi
Measurement Head Steploss Test
16.10.2 Test Luminescence
16.10.2.1 Plate Transport Offset Check Z, ALPHA, WELL_TEMP
Description:
This check is used to check the adjusted Z-min offset. The Z offset is important to minimize the crosstalk.
With this check it is possible to check the offset for the luminescence measurement head position, for the
position of the ALPHA laser and for the position of the well temp. Sensor (WIRING IR SENSOR)
Procedure:
1. Go to Luminescence → Test → Plate Transport Offset Check Z
2. Press Start
3. Insert the blocking plate and press Next
4. Move the plate up → put a paper strip or distance tool in between the blocking plate and the Lumi
measurement head → move up the transport, with the arrow keys until you can feel an light
resistance when you are moving the paper.
5. Press Next → remove the plate → press Finish
6. Results will be shown.
Troubleshooting:
Perform plate transport adjustments:
16.10.2.2 Plate Transport Offset Check X/Y, ALPHA, WELL_TEMP
Description:
This check is used to verify and check the adjusted offset. With this check it is possible to check the offset
for the luminescence measurement head position, for the position of the ALPHA LASER and for the
position of the well temperature sensor.
Procedure:
1. Go to Luminescence → Test → Plate Transport Offset Check X/Y.
2. Press Start.
3. Place the MultiCheck Plate on the plate carrier and switch on the LED on the plate by pushing the
button.
4. Press Next.
5. Measurement Result will be displayed.
6. Press Check.
Troubleshooting:
Perform plate transport adjustments:
Luminescence:
- Perform the Plate Transport Offset for Luminescence
- Make sure that the LED of the MC-Plate is switched on
- Check the Luminescence Fiber visually
- Check the connection to the module
- Perform Luminescence Measurement Head Step loss Test
16.10.2.3 Lid Check
Description:
The Lid Check measures the light (brightness) in the instrument. If there is too much light in the
instrument this test or a measurement will be failed.
Procedure:
1. Got to Luminescence → Test → Lid Check.
2. Press Start.
3. Enter the current lux value
4. Press Next.
5. Measurement will performed.
6. Result will be shown.
Troubleshooting:
- Make sure that the instrument cover is placed on the instrument
- Make sure that flaps are closed
- Make sure that injector hood is mounted
- Clean the plate carrier (in case there are liquid spills)
16.10.3 Steploss Test Lower Filterwheel, Upper Filterwheel, Measurement
Head
Description:
the maximum positions. At the end of the test a result summary with Passed, Failed and lost steps will be
displayed.
Procedure:
1. Go to Luminescence → Test → choose the test.
2. Press Start.
3. Steploss test is performed
Troubleshooting:
- Check if something is blocking the motor of the measurement head (HEAD MEAS.LUMI
ENH.ALPHA CPL.)
- Try to move the motor by hand (when the instrument is switched off!) and check for a free
movement
- Change the luminescence module (MODULE LUMI STD.CPL, MODULE LUMI ENH.CPL.,
MODULE LUMI ALPHA CPL.)
17 Lid Lifter
The lid lifter option (LID LIFTER COMPLETE) consists of a permanent magnet and a magnetic pad. The
magnetic pad (LID LIFTER DISCS) can be mounted on the lids of all commonly used microplate types.

The drawing below shows the schematic overview of the lid lifter option.
The monostable electromagnets are showed as powered off in the drawing. This effect is realized with a
permanent magnet. If the lid lifter is powered off the lid pad is held with the permanent magnet. If the lid
lifter is powered on then the magnetic field disappears and the metal pad is released.
On a full workflow the linear stepper motor will move in Z direction downwards to the cover of the microplate.
In this step the mono stabile electro magnets are powered on. With the spring system it is possible to place
the microplate cover smoothly on the microplate. If the right Z position is reached the power of the
permanent magnet is powered off and the mono stabile electro magnets will hold the microplate cover. The
lid lifter move back in home position and the plate transport will move the microplate for the next work flow.
17.2 Electronic System
17.3 Replacement of Lid Lifter Module
1. Disconnect all connections of the PCBA injector/lid lifter (PCBA LID LIFTER)
2. Remove the two screws of the lid lifter module (LID LIFTER COMPLETE)
3. Lift up the module

Instrument
- 30.15.2.9 Steploss Test Lid Lifter
17.4 Replacement of Lid Lifter Sensor

1. Loosen the 8 screws and take off the metal plate
2. After the cover was removed from the Lid Lifter Module follow
the steps
3. Remove the 2 screws Nr. 1

4. Remove the sensor Nr. 2
5. Be careful with the cable guide Nr.3
To assemble the sensor do the steps in reverse order
NOTE: Make sure you have the home sensor flag Nr. 4 in between the light barrier
from the home sensor.

Instrument
18 Injector
The Spark can be optionally equipped with an injector module consisting of two syringe pumps (XP from
Tecan Systems) located in a separate box, which feed two injector needles. The injector needles are
designed to inject liquids into any well larger than or equal to a standard 384 well plate.
The injector consist of 2 components the injector guide which is mounted on the optics base plate and the
injector carrier which can be insert in the guide. The injector guide has a movement in the Z direction to
move the injector carrier. The injector system consist of a 2 tubing system and they tubing length is available
in short and long version. A large mounting nut attaches the top cover to the instrument. The pumps
themselves are located in an external unit.
18.2 Description of the XE 1000

The XE 1000 uses a stepper-motor driven syringe and valve design to aspirate and dispense measured
quantities of liquid. Both the syringe and the valve are replaceable. Functional descriptions and illustrations
of each major XE 1000 component are provided in the sections that follow.
Front View: Rear View:
Syringe and Syringe Drive
The syringe plunger is moved within the syringe barrel by a rack and pinion drive that incorporates a stepper
motor and quadrature encoder to detect lost steps.
The syringe drive has a 30 mm travel length and resolution of 1000 steps. When power is not applied to
the pump, the syringe drive can be moved by pushing up or down firmly on the plunger holder assembly.
This facilitates syringe removal.
The base of the syringe plunger is held to the drive by a self-aligning ball that mates to the carriage. The
top of the syringe barrel attaches to the pump valve by a 1/4-28" fitting.
Figure 18-2.3. Syringe Components

Syringes are available in these sizes: 500 L, 1.0 mL , 2,5 m
Valve and Valve Drive
The valve is made of a Kel-F body and Teflon plug. The plug rotates inside the valve body to connect the
syringe port to the input and output ports. Additionally, there is a bypass position. This position “bypasses”
the syringe and connects the input and output ports. This position is often used for washing out the probe.
The valve is turned by a stepper motor coupled to an encoder to provide positioning feedback.
Figure 18-2.4 -Port Valve Components
18.3 Electronic System of the Injector
The pump module of the Spark reader can be equipped with up to 2 modules. In the pump module there
are 2 types of electronic boards installed. The basic board has a microprocessor with an installed firmware
and the connection with a CAN Bus to the Spark reader. The extension module is only connected to the
basic module with the ribbon cable ST4. The main function of the basic board is to convert the CAN Bus
signal to control the Cavro pumps as well as controlling the key board foil (commands “PRIME” and
“RINSE”).
On both boards are a hardware mapping with jumpers present to evaluate at the basic module with the
microprocessor the key board buttons „PRIME“ and „RINSE“. The mapping is shown in the bubble above
in example position A for the basic board. If it’s in example the jumper on B then it would be mapped as
extension.
18.4 Liquid System of the Injector
The Spark can be optionally equipped with an injector module consisting of two syringe pumps located in
a separate box, which feed two injector needles. The injector needles are designed to inject liquids into any
well larger than or equal to a standard 384 well plate.
Figure 18-1: Schematic view of the injector module
There are up to two pumps available for the Spark.

• Pump A feeds injector needle 1
• Pump B feeds injector needle 2
One Injector Option (one pump): A SPARK instrument equipped with one pump allows injections in all
microplate well types larger than or equal to a standard 384 well plate using the same liquid. All reactions
requiring injection of only one liquid per well can be performed with this option.
Two Injector Option (two pumps): Several reactions, such as flash luminescence reactions or dual reporter
gene assays, require the injection of two independent liquids into the same well. This is achieved by using
the additional injector pump 2. By using pumps 1 and 2, two independent liquids can be dispensed into the
same well of the size larger than or equal to a standard 384-well plate.
18.5 Storage Bottles
Up to two bottles with a volume of 125 ml or two Falcon tubes can be inserted into the injector module.
Additionally, a smaller container may be used via an adapter that can be mounted into the drawer of the
Spark. The standard bottle set supplied with the Injector option consists of:
One 125 ml bottle and one 15 ml bottle for the “One Injector option” or two 125 ml bottles and two 15 ml
bottles for the “Two Injectors option”. In cases in which very small volumes of reagent are required, 15 ml
Falcon tubes can be used. The 125 ml bottles can be used as a support for the Falcon tubes.
Figure 18-2:Storage bottles and adapter for smaller tubes
18.6 Injector Carrier

The carrier, which includes the injector needles, can be easily removed (by the customer) from the
instrument for priming or washing the system and for optimizing the injection speed.
Figure 18-3: Injector ‘carrier’
CAUTION: The injector carrier must be in the service position for washing und priming.
The dead volume of the injection system (injector needles, syringes, valves and tubing) is approximately
100µl after ‘backflush’ for each syringe. The function of the backflush is to return any unused reagent to the
reservoir bottles. The injection speed can be adjusted via the software to allow for good mixing of reagents.
The optimum injection speed depends on the assay parameters, such as viscosity of fluids, the plate format
and the measuring behavior of the liquids.
The removable injector carrier allows this process to be done outside of the instrument where a visual
inspection can be easily performed.
Figure 18-4: Injector-box with injector in ‘service position’
18.7 Priming and Washing
The initial filling step of the injector system (priming) as well as the cleaning step of the injector system
(washing) must take place outside of the instrument. For these procedures the injector carrier is removed
from instrument and put into the service position of the injector box. For priming and washing steps of the
injector system, a default setting for injection speed and volume dispensed is provided. If required the
priming parameters can be adjusted in the injector control window of the SparkControl software.
The prime volume depends on the tubing length. Two types of injector tubing are available: ‘long’: 150 cm,
and ‘short’: 70 cm.
For the initial filling step of the injector system (priming) it is recommended to perform two pump strokes to
remove all air bubbles from the injection system. The prime volume is therefore 2 ml. To save precious
reagents this initial filling step can be performed with distilled water. To replace the water with the required
reagent a second priming step is needed. For this second priming step the priming volume can be reduced
to approximately 1500 µl.
CAUTION: A prime volume below 2 ml in an empty system may result in incomplete filling of
the system, and therefore may negatively affect assay performance.
18.8 Replacement and Adjustment of the Injector

Carrier
To replace the injector carrier (INJECTOR CARRIER) the housing must be removed first (see chapter
11).
To get access to the injector carrier first disconnect the

injector motor ST2, the sensor ST801 and the micro switch
ST6.
1. Remove the 3 screws and lift up the injector carrier.

2. Lift the injector carrier up and out.
The installation of the injector carrier is in the reverse order.

Injector
- 18.9.1.2 Injector Position X/Y-Offset
- 18.9.2.2 Injection Check
- 18.9.2.4 Injection Detection Sensor Check
- 18.9.2.5 Steploss Test Injector Carrier
18.8.1 Replacing the Sensors of the Injector Carrier
On the injector carrier (INJECTOR CARRIER) it is possible to replace the micro switch (WIRING
MICROSWITCH INJECTOR) and the Z-sensor (WIRING INJECTOR HOMESENSOR).
After replacing the injector guide it is possible to replace the micro switch and the Z-sensor (see chapter
18.8).
1. Remove 2 screws of each sensor
2. Replace the sensors
The installation is in the reverse order.

Injector
- 18.9.1.2 Injector Position X/Y-Offset
- 18.9.2.2 Injection Check
- 18.9.2.4 Injection Detection Sensor Check
18.8.2 Replacement of the Pump Module

The injector pump module can be easily replaced from the front.
For replacing the pump modules see steps below:

1. Remove 2 screws on the front
2. Remove the 2 tubing’s from the valve
3. Move the pump module to the front to lift out.

Injector
- 18.9.1.3 Pump Settings
- 18.9.2.3 Injection Accuracy Check
18.8.3 Replacement of Key Board Foil of the Pump Module
To replace the keyboard foil follow the steps as shown in the picture above:
1. Disconnect ST6 from the PCBA Backplane

2. Open the flat cable holder under the module and remove 3 screws
3. Careful lift up the key foil
Perform these steps on the module
- Check the function of the buttons by pushing manually
18.8.4 Replacement of the Pump Module Electronics
To remove the Injector PCBA (PCBA INJECTOR EXTENSION, PCBA BASIC MODULE INJECTOR)
follow the steps:
1. Remove the back cover see picture at chapter 17.10.1
2. Disconnect ST4 flat cable

3. Disconnect ST 6 flat cable from the foil
4. Remove 4 cables from ST8
5. Remove the 2 screws and the PCBA
The procedure is the same for all Injector Modules. The extension has a different PCBA without firmware
and microcontroller. To reinstall the board perform the procedure in reverse order!
General:
- 30.13.1 Firmware Download - update the Firmware
- 30.13.5 Set Serial Numbers (for this module)
- 30.13.3 Default Settings (set the default settings only for injector)
Injector:
- 18.9.1.3 Pump Settings
- 18.9.2.3 Injection Accuracy Check
18.9 Injector – Service Software
18.9.1 Adjustment Injector

18.9.1.1 Injector Position Z-Offset
Description:
The Injection Position Offset Z adjustment is used to adjust the injection position or offset in Z-axis. For this
adjustment, a Cell Slide plate (TEST PLATE ADJ.CELL COU.SPARK) and a metal strip are required.
Procedure:
1. Go to Injector → Adjustment → Injection Position Offset Z
2. Press Start
3. Insert the Cell Slide Plate (TEST PLATE ADJ.CELL COU.SPARK)

4. Press Next
5. Insert the Injector and Press Next
6. Adjust the Z-Offset, until the injector slightly touches the metal strip, which is inserted in between
the cell slide plate and the injector → when finished press Next.
7. Remove the Plate

8. Press Finish
Troubleshooting:
- 13.5.2.5 Step loss Test X, Y, Z (perform Z-Transport step loss test)
- Check the wiring and the connectors on the injector carrier and the Lid Lifter board (PCBA LID
LIFTER)
18.9.1.2 Injector Position X/Y-Offset
Description:
The Plate Transport Offset X/Y adjustment is used to adjust the plate carrier to the optimal injection position.
For this adjustment, the cell slide plate (TEST PLATE ADJ.CELL COU.SPARK) and the injector adjustment
tool are needed. The plate carrier moves automatically to the injection position A1. You would have to look
through the injector adjustment tool to perform the adjustment of position A1. It typically helps to use a lamp
to illuminate the measurement chamber.
Procedure:
1. Go to Injector → Adjustment → Injection Position Offset X/Y
2. Press Start
3. Insert the Injector Adjustment Tool

4. Press Next
5. Insert the Cell Slide Plate

6. Press Next
7. Select the step width → by looking through the injector dummy → the plate carrier has to be moved
until the hole is in the middle of the visible range. When it is finished press Next
8. Remove the Injector Adjustment Tool and the Cell Slide Plate.
9. Press Finish
Troubleshooting:
modules!)
- 13.5.2.5 Step loss Test X, Y, Z (perform Z-Transport step loss test)
18.9.1.3 Pump Settings
Description:
The pump setting adjustment is to set the syringe size which is inserted in the pump module. At the SPARK
it is possible to select the following syringe sizes:
• 0.5ml
• 1.0ml
• 2.5ml
Procedure:
1. Go to Injector → Adjustment → Pump Settings
2. Press Start
3. Choose the pumps were the syringe should be set
4. Press Next
5. Select the inserted syringe size
6. Press Finish
18.9.2 Test Injector

18.9.2.1 Injector Prime Check
Description:
The Prime check is used to check the injection system for the general function, if there is something leaking
or uptight. It is recommended to perform this test after replacing any parts of the injector system.
Procedure:
1. Go to Injector → Test → Injector Prime Check.
2. Press Start.
3. Remove the injector from the carrier and put them to the left side of the Pump Module and place
the tub underneath.
4. Press Next.
5. Select the Prime Volume and click Prime.
6. Check that the injection beam is flowing constantly without breaks → if not follow the trouble
shooting.
7. If the prime circle was ok set the cross at Passed and click Next.
8. Now the same procedure for Pump B if it is available.
9. Press Finish.
Troubleshooting:
- Visually inspect the injection system (tubing bend, blocked,…).
- Make sure that the bottle is filled with water
- Check that the tubing is inserted correctly into the bottle
- Check that the tubing is fixed on the valve
- Check that the needles are clean, if not please clean the end of the injector needles with a cotton
swab soaked in 70% ethanol or isopropanol
18.9.2.2 Injection Check
Description:
This test is to verify that the injection position in X/Y direction is adjusted and that the injection system is
working properly. For this test a 384 well plate is needed.
Procedure:
1. Go to Injector → Test → Injector Accuracy Check.
2. Press Start.
3. Take the Injector into the prime position on the Injector module (left side at pump module).
4. Press Next.
5. Insert the Injector into SPARK.
6. Press Next.
7. Insert a 384-well plate.
8. Press Next.
9. Pump A will start to inject.
10. Check if the injection was successful by taking the plate from the carrier and checking visually →
place the plate again on the plate carrier. If it was successful set Passed and press Next
11. Pump B will start to inject.
12. Same procedure as at Pump A.
13. Press Next.
14. Remove the plate.
15. Press Next.
Troubleshooting:
- Check the Injection System visually (tubing bend, blocked,…)
- Check that the bottle is filled up with water
18.9.2.3 Injection Accuracy Check
Description:
With this test the injector accuracy will be checked. This can be done with balance which is connected to
the computer then the test will be performed automatically. For this test the following tools are required:
• Mettler Toledo Balance
• Injector holder (from the service tool kit)
• RS232 to USB Adapter
In case the balance is not connected to the service software the test can be done manually.
Procedure:
1. Connect the balance to the PC with the Adapter cable
NOTE: Connect the balance to the PC before starting the injector accuracy check!
2. Power on the balance

3. Place the Balance under the injector holder → insert the injector on the holder and adjust them that
the injection beam will pass the air scoop
4. Tare the balance

5. Go to Injector → Test → Injector Accuracy Check
6. Press Start
7. The software asks to move the Injector to weighing position (already done) → press Next
8. Injector System will prime
9. Performing the check → Press Finish
Troubleshooting:
- 30.14.3 Communication Check Balance
- Check the Injection System visually (tubing bend, blocked,…)
- Check that the bottle is filled up with water
18.9.2.4 Injection Detection Sensor Check
Description:
This check is to verify the function of the injector carrier detection sensor.
Procedure:
1. Go to Injector → Test → Injector Detection Sensor Check.
2. Press Start.
3. Remove the injector (or dummy).
4. Press Next.
5. Insert the Injector Dummy.
6. Press Next.
Troubleshooting:
- Check the connectors on the injector detection sensor and the lid lifter board (PCBA LID LIFTER)
- Replace the sensor or carrier module (INJECTOR CARRIER)
18.9.2.5 Steploss Test Injector Carrier

Description:
The steploss test is to evaluate if the motor/module is mechanically blocked. Therefore the motor will be
moved to the maximum positions.
At the end of the test a result summary with Passed, Failed and lost steps will be displayed.
Procedure:
1. Go to Injector → Test → Step loss Test Injector Carrier
2. Press Start
3. Steploss test is perforrmed
Troubleshooting:
- Check if something is blocking the motor/gear
- Check the positioning of the motor shaft
- Change the injector carrier (INJECTOR CARRIER)
19 Cell Counting
The cell counting module is based upon the bright-field illumination technique which is a commonly used
tool for visualization of cells. Bright-field cellular counting requires a difference in contrast between cells
and their surrounding medium. This contrast is caused by the different levels of light absorption of cells and
their media. Counting of cells with low or no contrast can be improved by using various staining procedures.
It consists of an illumination module and a camera module. On the optic base plate is the illumination unit
which is providing light to the sample. On the bottom side is the camera module, which consist the camera
and a laser diode. The laser diode is used for the auto focus.
WARNING: Some Adjustments of Cell Counting have an effect to other modules, such as
example Plate Transport. Therefore, check all other adjustment/test after performing the
Cell Counting adjustments if they are indicated with an exclamation mark and execute
them.
19.2 Optical System of the Cell Counting Module
The cell counting module consists of an illumination module (MODULE LIGHT CELL) and a camera module
(MODULE CAMERA CELL or MOD. CAMERA USB 3.0 CELL COUNTING). The illumination module is
installed on the optics base plate and the camera module is installed in the bottom chassis. The drawing
above is a schematic overview of the cell module. The upper module is the illumination module with a LED
as light source and an aperture wheel.
The emitted light passes through the cell slide, the optics and is detected by the camera. The auto focus
for the sample is performed using a LASER diode on the camera module (MODULE CAMERA CELL or
MOD. CAMERA USB 3.0 CELL COUNTING).
In order to get a good performance it is very important that both modules are aligned well with the
adjustment pin.
19.3 Electronic System of the Cell Counting Module
The illumination module is controlled by the CAN bus connection. The camera module is powered and
controlled by the USB connection, which is connected to the PODI board.
19.4 Assembly of the Cell Counting Module

19.4.1 Replacing the Electronics of the Cell Counting Module
1. Loosen the 4 screws from the housing and lift up the housing
2. Use the centering tool for Cell counting module see service tool kit (see 8.3)
3. Install the centering tool as shown the picture below. Make sure that the centering tool is exactly on
the edge of the iron sheet and tighten the screw of the centering tool. (see bubble in the drawing
below). The tool is needed to keep the original adjustment of Tecan
4. After installing the centering tool, remove the set screw as shown in the picture below.
5. Now it is possible to lift up the upper part which means metal sheet with the LED and
6. Remove the 4 screws on the rear side of the metal sheet to replace the Cell counting electronic.
7. Remove the 4 screws and the spacer from the PCBA cell counting
Replace the board and mount the screws and spacer on the new board. Installation unit is in the reverse
order.
General:
- 30.13.5 Set Serial Numbers (XXXXC0XXXX)
- 30.13.3 Default Settings - set Default Settings (only for CELL Counting)
- Download the original CELL Counting settings to the module
Cell Counting:
- 19.5.1 Adjustment Cell Counting (all)
- 19.5.2 Test Cell Counting (all)
Plate Transport:
19.4.2 Replacement of LED of the Cell Counting Module
To exchange the LED the following steps have to be performed:

1. Loosen the 4 screws from the housing
2. Lift up the housing
3. Remove 4 screws of the power LED.
4. Disconnect ST 2 from the board and remove the power LED.
Installation of the illumination unit is in the reverse order.

Cell Counting
- 19.5.1.2 Offset Aperture Wheel Adjustment
- 19.5.1.4 Focus Position Adjustment
- 19.5.2.3 Focus Position Check
- 19.5.2.1 Uniform Illumination Check
19.4.3 Replacement of the Aperture Wheel Motor
For removing the motor of incidence angle wheel please perform the following steps:
1. Remove the light source (LED CELL COUNTING) and
disconnect ST2 first (see chapter 19.4.2).
2. Loosen the two set screws and remove aperture wheel
3. Remove the 4 screws of the motor (STEP MOTOR)
( see step 3 in the drawing).
4. Disconnect ST100 and ST101 connections of the motor
and take off the motor
5. Install the new motor and attach it with the 4 screws.
6. Install the incidence angle wheel on the motor but do

not full tighten the screw yet.
7. Install the power LED with the 4 screws.
8. Connect the motor and sensor of the incidence angle
wheel to the motor tool.
9. Power on the motor tool and move the motor to the
home position (see chapter 12.2 Motor Tool).
10. The still loose incidence angle wheel must be held in
place by hand and moved to the hole with the biggest
diameter as shown in the picture above. It is important
that the LED is exactly in the middle of the whole.
11. Hold the incidence angle wheel and use the distance tool with 0.2 mm to adjust the distance
between the LED and the incidence angle wheel. (See picture below).
NOTE: The incidence angle wheel must be placed in position when adjusting the distance
with 0.2mm to the LED.
12. Tighten the screw of the aperture wheel

13. Attach the housing and tighten the 4 screws of the housing
General:
- Download the original CELL Counting settings to the module
Cell Counting Adjustments:
- 19.5.1.2 Offset Aperture Wheel
- 19.5.1.1 Illumination Center
- 19.5.1.3 Offset X/Y
- 19.5.1.4 Focus Position
Cell Counting Test:
- 19.5.2.4 Cam Position Check
- 19.5.2.5 Steploss Test Aperture Wheel
Plate Transport:
For all other installed modules perform the Plate Transport X/Y Adjustment and the Plate
19.4.4 Replacement/Installation Camera Module
It is only possible to replace the complete camera module. Repairs are not possible on the module. To
remove the camera module it is necessary to remove the base plate first (see 31.2 ).
NOTE: On all camera modules, the offsets are inclusive. The available offsets have to be
downloaded together with the service software.
CAUTION: When opening the camera lens dirt can accidentally get on the lens. This in turn
leads to measurement errors.
LASER
The SPARK is a CLASS 1 LASER product. The camera module uses a laser diode for auto-focusing. A
SPARK instrument equipped with a cell counting module is a LASER CLASS 1 product. The instrument
complies with FDA radiation performance standards, 21 CFR 1040.10 except for deviations pursuant to
Laser Notice No. 50, dated June 24, 2007.
The following labels are attached to the rear of the instrument.
The camera module is a Class 1 LASER product. The following label is attached to the camera module:
For installation, use, maintenance and service it is not necessary to open the camera module! For
installation, use, maintenance and service it is not necessary to operate the camera module with the
instrument cover opened!
WARNING: Use of controls/adjustments or execution of procedures other than those

specified herein may result in exposure to hazardous visible laser light.
1. Before removing the camera module it is necessary to disconnect the Laser diode.
2. Remove the bottom base plate

3. Disconnect the USB cable of the camera
4. To uninstall the camera module it is necessary to remove 4 screws (see the drawing below).
5. The USB 3.0 camera (MOD.CAMERA USB 3.0 CELLL COUNTING) has an additional USB cable
which is not connected to the PCBA PODI. The USB 3.0 cable is directly connected to the computer
as shown in the picture below.
Cell Counting
- 19.5.1.1 Illumination Center
- 19.5.1.3 Offset X/Y
- 19.5.1.4 Focus Position
- 19.5.2.4 Cam Position Check
Plate Transport
•
19.4.5 Replacement of Illumination Unit of Counting Module
To exchange the Illumination unit follow the steps below:
1. Loosen and remove the 3 screws

2. Disconnect all wiring to the PCBA Cell (2x CAN-Bus, 24V, laser of LED) and lift up to remove the
illumination unit.
3. Insert the new Illumination Unit using the required spacer
4. Connect all wiring to the PCBA Cell
5. Attach the Illumination unit with the 3 screws and continue with service software steps below.
General
- Download the original Cell Counting settings to module
Cell Counting
- 19.5.1 All Adjustment Cell Counting
- 19.5.2 All Test Cell Counting
Plate Transport
19.5 Cell Counting – Service Software
19.5.1 Adjustment Cell Counting

19.5.1.1 Illumination Center
Description:
This adjustment is needed to align the light module (MODULE LIGHT CELL) which is mounted on the optics
base plate to the camera module which is installed on the bottom plate of the Spark. For this adjustment,
the cell counting adjustment pin is required (service tool kit).
Procedure:
1. Go to Cell Counting→ Adjustment → Illumination Center
2. Press Start
3. Remove the protection screw and insert the adjustment pin in the light module
The black adjustment pin is screwed

in red Cell counting tool.
4. Click Next.
5. Now the light module needs to be aligned by removing the three screws on the optics base plate.
6. The module needs to be moved manually until the blue circle is placed on the middle of the ball
head from the adjustment pin.
NOTE: The light module is slid across the base, rather than tilted. Loosen the three
screws only enough to allow the module to slide across the surface. If the screws
are too loose the light module will tilt, which makes the adjustment difficult.
7. If the ball of the pin is in the middle a green circle will be displayed which means the adjustment is
correct.
NOTE:
While the pin is not in the correct position a red circle will be displayed.
8. Now tighten the three screws of the light module

9. Remove again the adjustment pin and re-insert the protection screw.
10. Click Finish to see the results.
Troubleshooting:
- Check the position of the light module mechanically
19.5.1.2 Offset Aperture Wheel
Description:
This adjustment is needed to align the correct position of the aperture wheel. During this adjustment the
software will take between 40 up to 50 pictures to find the correct offset of the aperture wheel. When this
adjustment is performed, all other cell adjustments will be set to “to do”.
Procedure:
1. Go to Cell Counting→ Adjustment → Offset Aperture Wheel.
2. Press Start.
3. A picture of the camera will be displayed with the criteria.
4. Press Set.
Troubleshooting
- Perform step loss test to check the aperture wheel motor (STEP MOTOR)
- Disassemble the light module and check with the motor tool the home position of the aperture
motor.
- If the exposure time is failing the root cause is the light source (MODULE LIGHT CELL)
19.5.1.3 Offset X/Y
Description:
This adjustment is needed to adjust the X/Y offset of the plate transport for the cell counting module. For
this adjustment step the MultiCheck-plate is needed. During the adjustment the software will take pictures
of the wells A1, A12 and H1 and adjust the X/Y offset.
Procedure:
1. Go to Cell Counting→ Adjustment → Offset X/Y.
2. Press Start.
3. Insert the multi check plate.
4. Click Next.
5. Image will appear and shows the center of the well H1.
6. Press Set or if the button is enabled: Set & repeat.

Troubleshooting
- 13.5.2.5 Step loss Test X, Y, Z – plate transport
modules!)
19.5.1.4 Focus Position
Description:
This adjustment is needed to adjust the Z offset and resolution of the plate transport. Further with
adjustment will be the autofocus, brightness and function of the LASER diode from the camera module
adjusted. For the adjustments the cell counting adjustment plate (TEST PLATE ADJ.CELL COU.SPARK
from the service tool kit) is needed.
Procedure:
1. Go to Cell Counting→ Adjustment → Focus Position.
2. Press Start.
3. Insert the Cell counting adjustment plate (ILC slide right side).
4. Click Next.
5. A graphic will appear and shows the first slide.
6. Click Next and the adjustment will be continued.
7. Click Set.
Troubleshooting
- Clean the cell adjustment plate (TEST PLATE ADJ.CELL COU.SPARK)
- Remove the camera module and clean the lens (31.5 Maintenance of Cell Counting Camera)
- Check the connectors (USB and LASER diode)
19.5.2 Test Cell Counting
19.5.2.1 Uniform Illumination Check
Description:
This software step checks the quality of the photos made from the camera.
Procedure:
1. Go to Cell Counting → Test → Uniform Illumination Check.
2. Press Start to make a picture.
3. A picture will be displayed
• If the picture looks like above then it is needed to click the button “Image is Clean”
• If the picture does not looks like above and a dirt is visible click the button “Image is Dirty”
4. The results will be displayed.
Troubleshooting
- 19.5.1.1 Illumination Center Adjustment
19.5.2.2 Offset X/Y Check
Description:
For this X/Y offset check of the plate transport the MultiCheck plate is needed. During the check the
software will take pictures of the wells A1, A12 and H1 from the MultiCheck plate to check the X/Y offset.
Procedure:
1. Go to Cell Counting → Test → Offset X/Y Check
2. Start
3. Insert the MultiCheck plate
4. Click Next
5. The last picture will be displayed
6. Click Finish.
Troubleshooting
- Check step loss X/Y plate transport (13.5.2.5 Step loss Test X, Y, Z)
- Check Offset of Aperture Wheel (19.5.2.5 Steploss Test Aperture Wheel)
19.5.2.3 Focus Position Check
Description:
This software check will check the Z offset and resolution of the plate transport. Further the adjustment of
the autofocus, brightness and function of the laser diode from the camera module will be checked. For the
check the cell counting adjustment plate (TEST PLATE ADJ.CELL COU.SPARK from the service tool kit)
is needed.
Procedure:
1. Go to Cell Counting → Test → Focus Position Check
2. Insert the cell counting adjustment plate (ILC right side)
3. Insert the cell counting adjustment plate (ILC right side)

4. Press Next.
5. The graph of the first slide will be displayed.
6. Press Next and the check will be continued for the second slide.
7. The graph of the second slide will be displayed.
8. Press Finish.
9. The result will be displayed.
Troubleshooting
- Clean the cell adjustment plate (TEST PLATE ADJ.CELL COU.SPARK)
- Check the connectors (USB and LASER diode)
19.5.2.4 Cam Position Check
Description:
This software step will check the position of the camera in the camera module. Further the twist of the
camera and the image enlargement will be checked. For this check the cell counting plate (service tool kit)
will be used.
Procedure:
1. Go to Cell Counting → Test → Cam Position Check
2. Press Start
3. The cell counting adjustment plate needs to be loaded
4. Press Next.
5. Graph of the first slide will be displayed
6. Press Next.
7. The stripes of the ILC slide will be displayed
8. Press Finish.
9. The Results will be displayed.
Troubleshooting
- Clean the cell adjustment plate
- Uninstall the camera module and clean the lens (31.5 Maintenance of Cell Counting Camera)
- Check the connectors (USB and laser diode)
- Replace the camera module (MODULE CAMERA CELL COUNTING or MOD.CAMERA USB 3.0
CELL COUNTING)
19.5.2.5 Steploss Test Aperture Wheel
Description:
the maximum positions.
At the end of the test a result summary with will be displayed.
Procedure:
1. Go to Cell Counting → Test → Steploss Test Aperture
2. Press Start
3. Select how much cycles should be performed
Troubleshooting:
- Try to move the motor by hand (when the instrument is switched off) and check the free movement
- 19.4.3 Replacement of the Aperture Wheel Motor (STEP MOTOR – Shutter Wheel Motor Cell
Counting)
20 Heater & Stirrer
The injector module can additionally be equipped with a heater and magnetic stirrer option. The heater is
designed to keep the injection solution at the desired temperature. The stirring function keeps the injection
solution in motion in order to avoid the accumulation of precipitates or debris on the bottom of the solution
container. Concurrent to the heating and stirring functions, the injection solution is also protected from light
during the entire experiment by the injector cover. The heater and stirrer functions are independently
regulated with control knobs positioned on the module itself without the use of the reader software.
The module consists of a basic module with the electronic and the extension unit which is controlled by the
basic module (BASIC MODULE HEATER STIRRER 1CH, BASIC MODULE HEATER STIRRER 2CH).
With the regulation of 2 potentiometers it is possible to adjust speed of the heater and the level of the
heating foil. The heater and stirrer module has an external power supply with an output of 24V DC
(POWERSUPPLY HEATER STIRRER).
The status of the stirrer and heating function is shown by 2 LEDs. The movement of the stirrer is controlled
by a magnet field under the heating foil, where a stepper motor is installed with a bar magnet.
In case of a defect of the heater and stirrer module the complete module needs to be replaced.
20.2 Mechanical System of Heater & Stirrer
The basic module and the extension module are connected together with 4 screws.
To disconnect both modules it is necessary to remove the screws (labeled with the number 2) in the drawing
above.
20.3 Electronic System of Heater & Stirrer

In the extension module is the electronic installed to control the basic and extension unit.
20.4 Reassembly and Adjustment of Heater & Stirrer

In case of a defect on the heater and stirrer module the complete module needs to be replaced.
21 Gas Module
Two integrated gas inlets allow the control of CO2 and O2 to help maintain stable culture conditions and
improve cell growth. Carbon dioxide concentration is regulated by an inflow of CO2 gas, whereas oxygen
reduction is achieved by supplying N2 gas.
21.2 Mechanical System of the Gas Module

The mechanic systems of the gas module consists of two valves. The valves are used to connect the
external gas source with the Spark reader. The valves are controlled directly by the gas electronics.
21.3 Electronic System of the Gas Module
The gas electronic board (PCBA GAS CONTROL MODULE) controls all functions of the gas module and
the electronics are controlled via the CAN bus system. The gas buzzer is located on the rear of the
instrument close to the fans and emits loud sound when the gas concentration has reached its target.
21.4 Assembly/Reassembly of the Gas Board
For replacing components of the gas module it is needed first to turn the instrument upside down and
remove the bottom plate (see chapter 11.2).
The picture above shows how to replace the electronics (PCBA GAS CONTROL MODULE) by removing
the 4 screws. Connected to the gas electronics are 2 gas sensors, 2 valves (VALVE SOLENOID GAS
CONTROL), a CAN-Bus and the buzzer.
The two gas sensors are responsible to measure the oxygen concentration O2 (SENSOR O2) and the
carbon dioxide (SENSOR CO2) concentration.
WARNING: The gas sensors are very hot when powered on. Temperature can reach 80 °C!
General
- 30.13.1 Firmware Download30.13.5 Set Serial Numbers (XXXXG0XXXX)
- 30.13.3 Default Settings - set Default Settings (only for GCM module)
Gas Control Module

- 21.6.1 Gas Sensor Check
21.5 Assembly/Reassembly of Gas Sensors
The oxygen gas sensor consists of an electrochemical oxygen pump made of zirconium oxide. When the
sensor is connected to low voltage the process starts and the oxygen ions are pumped from the cathode
to the anode. If the sensor detects a gas diffusion barrier on the cathode side, the voltage increases and
saturation current is produced. This current is used to calculate the ambient oxygen concentration.
The picture above shows how to replace the gas sensors. The sensors are installed with two screws on
each side of the metal angle. To get access for replacing the sensors lift up the metal angle. Each sensor
is connected with a wire to the gas board (PCBA GAS CONTROL MODULE).
WARNING: The gas sensors are very hot when powered on. Temperatures can reach
80 °C!
General
Gas Control Module

- 21.6.1 Gas Sensor Check
21.6 Gas Control Module – Service Software
21.6.1 Gas Sensor Check

Description:
The Gas Sensor Check, tests if the sensors are able to detect the “natural” CO2 and O2 level. The O2 level
has to be within 20% to 21% and the CO2 concentration has to be within a range of 0.0% to 0.5% for a
passed test.
Procedure:
1. Go to Instrument → Test → Gas Sensor Check
2. Press Start
3. Measurement will performed, the sensor needs to be heated up → approximately 5 minutes
Troubleshooting:
- Check the connector from the sensors to the gas board (PCBA GAS CONTROL MODULE)
- Replace the affected gas sensor (SENSOR CO2 or SENSOR O2)
- Check the gas module tubing (SET TUBING GAS SPARK)
21.6.2 Gas Valve Check
Description:
The Gas Valve check is to check the function of the Gas valves for O2 and CO2. We suggest switching off
the fans during this test to make it easier to listen to the switching noise of the valves. The fans can be
switched off during this test (30.12.3.4 Current Fan Mode Manual/Automatic).
Procedure:
1. Go to Instrument → Test → Gas Valve Check
2. Press Start
3. Click the Open and then the Close button. If a clicking sound comes up, the valve is ok → select
the Passed box and press next.
4. The same procedure for the CO² valve

5. Press Finish
Troubleshooting:
- Check the connection from the valve to the gas board (PCBA GAS CONTROL MODULE)
- Change the affected valve (VALVE SOLENOID GAS CONTROL)
21.6.3 Gas Buzzer Check
Description:
In the Gas Buzzer Check, the buzzer will be switched on and off to check the function of the buzzer.
Please make sure that no one is too close to the buzzer, because it is very loud.
Procedure:
1. Go to Instrument → Test → Gas Buzzer Check
2. Click Start
3. Follow the procedure in the Software

Troubleshooting:
- Check the connection to the buzzer
- Replace the buzzer
21.6.4 Optional Gas Control Leak Tightness CO2+O2 Test
Description:
In Gas control leak test will be checked whether the instrument is gas proof and that no gas will leak. This
test is optional and is not required for the maintenance. To perform this test a gas bottle CO2 and a gas
bottle N2 is required.
Procedure:
1. Go to Gas Control Module → Test → Optional-> Test Gas Control Leak Tightness CO2+O2
2. Connect the gas bottle CO2 and N2 with the tubing to the gas module
3. Furthermore the injector dummy has to be insert. Afterwards press Next
4. The test will start automatically and the two gas sensors will heat up over 5 min
5. Afterwards the gas proof test will start lasting for 10 min
Troubleshooting:
- Check that the gas bottles are correct connected to the gas module
- Check the tubing of the gas module on the bottom of the SPARK instrument
22 Replacing the Heating Foil
1. To replace the heating foil (PLATE HEATING PREASSEMBLED), remove the optics base plate from
the bottom chassis (see chapter 11.2)
2. Disconnect ST3 Y ribbon cable from the Y board see chapter 13.4.1
3. Disconnect ST602 temperature sensor from the PCBA main transport
4. Disconnect Co301 heating foil from the PCBA PODI hub
5. Remove the 9 countersunk screws from the heating foil.
6. Move out the heating foil as shown in the picture above. Make sure that you guide the temperature
sensor cable carefully through the hole in the optics base plate.
To install a the heating foil, repeat the above steps in reverse order.
WARNING: Make sure to use 0.5 Nm torque for each screw.
Instrument
- 30.15.1.3 Chamber Temperature Offset
- 30.15.1.4 Adjustment - Temperature Offset Heating Top
- 30.15.2.3 Chamber Temperature Offset Check
Plate Transport
- 13.5 Plate Transport (Adjustments and Tests)
Cell Counting
- 19.5.1.3 Offset X/Y (Adjustment and Test)
Transport Offset Check X/Y/Z.
23 Replacing Ambient Sensor
1. Disconnect the sensor connector on the PCBA main transport ST604
2. Remove the rear side part of the sensor by unscrewing
3. Replace the sensor cable
4. To install a the ambient sensor, repeat the above steps in reverse order and make sure that the
metal holder if fixed.
Instrument
- 30.15.1.2 Ambient Temperature Offset Adjustment
24 Instrument Flap
The two instrument flaps are driven jointly by a stepper motor. The two light barriers and the stepper
motor are connected on the PCBA Main transport. The left flap in front of the instrument is not controlled
by the motor this flap is only connected with a magnet holder to the right side flap.
24.2 Assembly/Reassembly of Flaps
To remove the instrument flap, it is necessary to remove the optics base plate to get access to the flaps
which are installed in the bottom chassis.
1. Disconnect all cables what are connected on the PCBA Main transport (ST801door open optical
sensor/ST802 door home optical sensor and ST803 motor).
2. Remove the 4 screws.
3. Lift up the flap and take it off
4. To remove the flap motor (STEMO 40CM), 4 screws have to be removed

5. Remove the flap motor from the belt.
6. Install the new motor and the belt
7. The motor and the belt tension can be adjusted by tightening the 4 screws
8. Connect all cables to the PCBA Main transport (ST801 door open optical sensor/ST802 door home
optical sensor and ST803 motor).

Instrument
- 30.15.2.10 Function Check Flap
Plate Transport
- 13.5 Plate Transport Adjustments/Tests (all)
Cell Counting Adjustment&Test:

- Offset X/Y
25 Cooling Module
The cooling control module enables temperature control in a range from 18 °C up to ambient temperature.
It can only be activated if a target temperature of ≤ 36°C is set.
The cooling option called Te-Cool and is installed below the bottom chassis. All components, except for the
cooling PCBA (PCBA COOLING), are accessible from the bottom by removing the bottom plate. In order to
get access to the cooling PCBA, the Cooling Module must be disassembled from the instrument (bottom
chassis). The following components are contained in the Cooling Module:
WARNING: When working on the cooling module or Liquid Chiller (LIQUID

CHILLER) it is required to wear gloves.
The illustration above is intended to provide a better understanding of the Cooling Module. The liquid cooled
by the Liquid Chiller passes via the input connector to the 3/2 way valve, which is switched by means of an
electromagnet. From the valve in the first position, the liquid is moved directly to the heat exchanger. From
the heat exchanger the liquid flows to the condenser incl. PLT element. There, the moisture is removed
from the air. For this purpose, the liquid element is cooled down by 3 degrees with a PLT. The aim is a
targeted dehumidification at the location. The removed moisture drips into the pan and this waste is
transported by the waste pump out of the instrument. From the condenser, the cycle continues to the output
connector and the liquid cooling device (LIQUID CHILLER).
The system is regulated by a PI control. Once the target temperature is achieved, the 3/2 way valve
switches to the bypass. This means the cooling PCBA (PCBA COOLING)triggers the valve. This is how the
temperature is kept constant. The fan chamber moves the cooled air into the measurement chamber of the
device.
If the user wants to heat in the device, the heating foil is used. This heating foil is used for Heating Top to
heat the device to the maximum high temperature of 42 °C.
25.2 Cooling Installation
25.2.1 Setting up the Liquid Cooling System
CAUTION: If the external liquid cooling device is used after it has been placed in
storage or transported, it should be left to stand for at least 3 hours, to allow for
temperature adjustment.
Before activating the cooling control option, ensure that the designated site meets the following
requirements: Select a location for the external liquid cooling device that is flat, level, vibration free, away
from direct sunlight or heat sources, and free from dust, solvents and acid vapors. Leave sufficient distance
behind the instrument for access to the rear panel.
The external liquid cooling device has an air-cooled refrigeration system. The liquid cooling device must be
positioned so that the air flow is not restricted. Supply and return flow connections must be easily accessible
and all tubes must be installed without sharp bends. A minimum clearance of 0.3 meters on all vented sides
is necessary for adequate ventilation.
CAUTION: Leave enough space between the liquid cooling device and adjacent objects,
0.3 meters on all vented sides. Inadequate ventilation will cause a reduction in cooling
capacity and compressor failure.
Coolant
Only distilled water-propylene-glycol mixture may be used as a coolant. A propylene-glycol concentrate is
obtainable from Tecan. This concentrate (0.25L concentrate) must be diluted with 0.75L distilled water prior
to use to obtain 1L of coolant. Never use any other coolant or tap water to avoid instrument damages
caused by pollution and corrosion!
CAUTION: Only use the recommended coolant in the cooling system, otherwise the
integrated cooling module or the external liquid cooling device could become damaged
(lime scale, impermeability of tubing).
CAUTION: Never operate the liquid cooling device without coolant in the reservoir!
Connection Procedure
CAUTION: Use only cooling tubing with no signs of damage.
The following information details the connection procedure:

1. Spark reader and external liquid cooling device: Make sure that the main power cables are unplugged
and the main power switch is in the OFF position.
2. Connect the coolant OUTLET of the liquid supply of the external liquid cooling device to the
instrument’s SUPPLY port on the back of the integrated cooling module. Use the provided tube.
The arrows indicate the

direction of the coolant
flow
3. Connect the coolant INLET of liquid return of the external liquid cooling device to the instrument’s
RETURN port on the back of the cooling module. Use the provided tube.
4. Connect the integrated cooling module to the cooling port of the SPARK reader using the provided
CAN cable.
5. Connect the condensate tube from the CONDENSATE OUTLET on the rear panel of the instrument
(integrated cooling module). Place a condensate collector at the end of the tube. A condensate
collector is not delivered with the instrument (see figure below).
To condensate
collector
6. Open the coolant reservoir of the external liquid cooling device by removing the cap.
7. Fill the coolant reservoir about 2/3 full with coolant.
8. Close the coolant reservoir of the external liquid cooling device by replacing the cap.
(See figure below).
Coolant reservoir cap
25.2.2 Switching on the External Liquid Cooling Device
1. Make sure that the coolant reservoir is about 2/3 full with coolant.
2. Connect the main power cable of the liquid cooling device to an appropriate AC power
source.
3. Switch on the liquid chiller and let it run in order to fill and vent the cooling system.
Continuously check the filling level during this procedure. If required, add coolant.
4. Set the temperature on the liquid chiller to 12 °C
5. Keep pushing the *Button and push the arrow down key until 12°C is set
6. Connect the Spark instrument to computer and power on Spark

7. Start Pass Software
8. Execute the Valve Check Test in Pass Service Software
9. Pass Software -> Colling->Test->Valve Check
CAUTION:. When Valve Check in Service Pass software was performed liquid is flowing
from Liquid Chiller in the Cooling module and the liquid level in the reservoir is going down
and needs to be refilled imminently
10. Pass Software -> Colling->Test->Valve Check (25.11.6 Valve Check)
25.3 Operating Integrated the Cooling Module
Switch on the main power switch of the external liquid cooling device (LIQUID CHILLER) and set target
temperature to 12 °C. To set the temperature, refer to the operating manual, thermoelectric re-circulating
liquid chiller MRC 150/300 (Laird Technologies GmbH).
Wait for coolant equilibration before starting a measurement by using the cooling function of the
SparkControl software. Depending on target temperature settings, the ambient conditions and the current
temperature of the measurement chamber, this will take 30 to 90 minutes.
Two condensation prevention stoppers are delivered with the instrument (see figure below). They fit into
the slots on the left and the right side of the integrated cooling module. They should not be installed by
default. If installed, the cooling module will heat up and target cooling temperature may not be achieved.
They must be installed if the cooling function operates at full capacity (large difference between ambient
temperature and target temperature) to prevent condensation. Otherwise an accumulation of water might
be observed.
Figure 5: Condensation prevention stoppers (both sides of the instrument)
NOTE: The condensation prevention stoppers must only be installed by the user if a large
difference between ambient temperature and target temperature is expected.
25.4 Draining the Liquid System
Before any repair can start, - the liquid system must be drained.
In the service tool kit is the tubing and the pump for the cooling module. This hand pump should be used
to drain the system liquid.
To drain the cooling system perform the following steps:
1. Use the Pass software and connect to Spark instrument

2. Power Off the external liquid chiller
3. Run the menu “Empty Cooling System” (25.11.7 Empty Cooling System)
4. Use the tubing and the pump to drain the cooling liquid and follow the description given in the
software.
5. Disconnect the Pass software
6. Remove the liquid from the external liquid chiller (the tubing can be used).
7. Remove the tool
8. In order to remove the remaining liquid from the Chiller, place it on a table and let the liquid drain
gravimetrically from the attached hoses into a container
25.5 Assembly/Reassembly of the Cooling Module
WARNING: Before you work on the cooling module make sure that the tubing system is
empty. See 25.4 Draining the Liquid System.
1. For replacing components of the cooling module it is necessary to first remove the top cover and
install the service feet with the extensions for the cooling module (see chapter 8. Service Tool
Kit).
1. Lift up the SPARK Instrument on the front
feet, 180° upside down.
2. Remove the 4 screws and 4 rubber feet
from the bottom plate.
3. Remove the bottom plate and the sealing
shield of the cooling option, as shown in
the picture to the left.
To install, repeat the above steps in reverse

order.
WARNING: Make sure that the liquid system is filled again, refer to chapter 25.8.
For most working steps some of the connectors need to be removed from the Cooling PCBA. This means
that the cooling module must be disassembled from the Spark bottom chassis.
25.6 Electronic System of Cooling Option
The electronics for the cooling is housed on the Cooling PCBA (PCBA COOLING). Once the Cooling
module is installed on a SPARK, the complete temperature control of cooling and heating is taken over by
the PCBA. The PCBA controls the heating film and the fan via the CAN bus. If no Cooling is installed, the
heating is controlled via the Main Transport Board.
25.7 Replacement of the Cooling Module Board
To replace the cooling PCBA (PCBA COOLING) proceed as follows:
1. After removing the cooling module, remove 8

screws and disassemble the cooling module from
the SPARK bottom chassis.
2. Turn the cooling module upside down to get access

to the PCBA (PCBA COOLING)
3. Disconnect all the connectors, see 25.6 Electronic

System of Cooling Option.
4. Remove the 4 screws on the board.
5. To install, repeat the above steps in reverse order.

General
- 30.13.3 Default Settings (download default settings for cooling only)
- 30.13.5 Set Serial Numbers
- 30.15.1.1 Counter
Cooling
- 25.11 Cooling - all adjustments/tests
25.8 Liquid Cooling Device (Liquid Chiller)
Tecan recommends and supports the following Liquid Chiller exclusively: Thermoelectric Re-circulating
Liquid Chiller MRC 150/300 (Laird Technologies GmbH, Germany). Tecan assumes no responsibility
for any other product or water chilling solution. Prior to operate the SPARK reader in combination with the
cooling module, read and follow the instructions in the operating manual provided by the manufacturer of
the Liquid Chiller (Laird Technologies GmbH).
WARNING: Tecan assumes no responsibility for any other liquid cooling device
other than the one recommended in this document.
WARNING: When working on the integrated cooling module or the Liquid Chiller,
it is required to wear gloves.
CAUTION: To ensure optimal operation of the integrated cooling module, an

annual maintenance procedure must be performed by a Tecan service
engineer.
25.8.1 Replace the Liquid Cooling Device

The Liquid Chiller is just connected with 2 tubes to the SPARK.
To replace the Liquid Chiller perform the following steps:

1. Disconnect the IN Tube
2. Disconnect the Out Tube
3. Replace the Liquid Chiller with the new one and connect the tubes again.
4. Fill the system with coolant, see chapter 25.2.1.
Alarm Function/Troubleshooting
For Liquid Chiller alarm functions and for troubleshooting refer to the operating manual, Thermoelectric
Re-circulating Liquid Chiller MRC 150/300 (Laird Technologies GmbH).
25.8.2 Liquid Cooling Device Maintenance

For Liquid Chiller maintenance, refer to the operating manual, Thermoelectric Re-circulating Liquid Chiller
MRC 150/300 (Laird Technologies GmbH).
For daily maintenance, inspect the tubes for kinks and leaks and check that all tubes are connected
properly. Check if the Liquid Chiller is filled with coolant.
25.9 Replacing Fan Heat Exchanger
The heat exchanger is installed into a slot in the cooling module. Lift it out of the slot to unscrew
the fan.
To replace the Fan from the Heat Exchanger perform the following steps:
1. Remove 8 screws and disassemble the cooling module from the SPARK.
2. Disconnect ST8 from the Cooling PCBA (PCBA COOLING) - see 25.6 Electronic System of
Cooling Option
3. Lift Up the heat exchanger out of the slot
4. Remove the 4 screws and the Fan

25.10 Replacing Fan Cooling Chamber
If it is necessary to exchange the chamber fan, first the heating foil must be moved out of the way. To
replace the fan from the heat exchanger perform the following steps:
1. Remove 8 screws and disassemble the cooling module from the SPARK.
2. Disconnect ST7 and ST14 from the Cooling PCBA (PCBA COOLING) - see 25.6 Electronic System
of Cooling Option.
3. Remove the 4 screws and the heating foil
4. Remove the 4 screws and the fan

25.11 Cooling – Service Software
25.11.1 Tests
25.11.2 Function Test

Description:
This test is used to check the cooling unit in general. The test will take about 5min.
Procedure:
Go to Cooling → Test → Function Test
1. Connect the chiller (see chapter 25.2) and press Next
2. Insert the two cooling stoppers to the cooling module and press Next
3. Insert the two cooling stoppers to the cooling module and press Next and the test will start
automatically
4. When the test is finished the results will be displayed.
Troubleshooting:
- Check the liquid system
- Make sure the chiller is switched on and set to 12°C
25.11.3 Fan Check
Description:
This test is used to check the function of the fans in the cooling unit. It helps to switch off the chiller,
because some of the fans are not that loud.
Procedure:
Go to Cooling → Test → Fan Check
1. With the button Off/On it is possible to enable or disable the center fan (WIRING FAN COOLING
CHAMBER). If the fan is hearable then select the checkbox for PASSED. Click Next
2. With the button Off/On it is possible to enable or disable the heat exchanger fan (WIRING FAN
COOLING HEATEXCHANGER). If the fan is hearable then select the checkbox for PASSED. Click
Finish
Troubleshooting:
- Check the electronic connection of the wiring to the fans
- Replace the fan (WIRING FAN COOLING HEATEXCHANGER or WIRING FAN COOLING
CHAMBER)
25.11.4 Heating Foil Check
Description:
The heating check is used to test the function of the heating plate in the cooling. The temperature has to
increase more than 3°C in 3 min.
Procedure:
Go to Cooling → Test → Heating Foil Check
1. Heating procedure will start automatically and will take about 3 min
2. When the test is done the results will be displayed.
Troubleshooting:
- Check the cables to the Cooling module and heating plate.
- Replace the heating plate (HEATING PLATE COOLING MODULE)
25.11.5 Pump Check

Description:
The pump check is used to test the function of the pump.
Procedure:
Go to Cooling → Test → Pump Check
1. The pump will be automatically activated so that it is possible to hear. If the pump is hearable click
Yes.
Troubleshooting:
- Check the cables to the Cooling module and the pump
- Replace the pump (WIRING PUMP COOLING)
25.11.6 Valve Check
Description:
The valve check is used to test the function of the valve.
Procedure:
1. Go to Cooling → Test → Valve CheckThe valve will be automatically switched on. If the valve is
hearable click Yes then a second switch will be done which has to be check by clicking Yes again.
Troubleshooting:
- Check the cables to the cooling module and the valve
- Replace the valve (WIRING SOLENOID VALVE COOLING)
25.11.7 Empty Cooling System
Description:
This menu item is used to empty the cooling module before shipping. The needed tools are in the Service
Tool Kit. (see chapter 8 Service Tools & Kit)
Procedure:
Go to Cooling→ Empty Cooling system ->24.2
1. The software reminds to disconnect the chiller from the SPARK.
2. Empty the cooling module by using the tool from service tool kit
3. When the first circuit is empty accept this by clicking Yes.
4. Repeat the procedure with the service tool for the second circle and accept this by clicking Yes.
5. After the results will be displayed
26 Barcode Module
The Spark multimode reader can be equipped with a barcode reader (BARCODE READER) mounted on
the left or right side of the optics base plate. The Barcode Reader use a 617nm visible red LED for
illumination (no LASER) and additionally for aiming purposes a 528nm visible green LED. Barcode
information is captured using a CMOS sensor with global shutter and 844 x 640 pixel resolution at 60 frames
per second.
The barcode module consists of the electronic for internal module communication via Can Bus system and
the Barcode head for the reading.
26.1.1 Microplates with Barcode
Apply the barcode on the right or left side of the microplate depending on which side the barcode reader is
mounted. The minimum height of the barcode is 3 mm. At the start and end of the barcode, 2 mm of white
space is required. The maximum length of the barcode is 70 mm including the white space at each end.
The barcode must be mounted on the short side of the microplate with a minimum distance of 15 mm from
the front as well as the back edge and 5 mm above the lower edge of the microplate.
Microplate on the plate carrier:
Side view of the microplate:
Min. 3 mm
20 mm
Max. 70 mm incl. white space
5 mm
15 mm
Barcode not allowed in these areas
CAUTION: Yellowed, dirty, folded, wet, or damaged barcode labels must not be used. The
adhesive labels must be flat and without peeled edges. We recommend assuring the
quality of the barcodes, by means of a local SOP.
CAUTION: The barcode is not readable when hidden by the plate lid.
The specified barcode types are:
• CODE 39 • EAN 8 • CODE 2/5 Interleaved
• UPC A • EAN 13 • CODABAR
• UPC E • CODE 128 • CODE 93
26.2 Electronic System of Barcode Module
26.3 Replacing Barcode Module

To replace the Barcode module (BARCODE READER) on the left or right side of the optics base plate, two
screws need to be removed.
If the SPARK reader is equipped with the Barcode module on the left side and additionally with the
absorbance cuvette module then the metal holder of the cuvette module needs to be removed to get access
of the Barcode module see drawing below:
1. Remove 4 screws of the absorbance cuvette module

2. Remove 2 screws of the barcode module
3. Lift off the barcode module
26.4 Replacing Barcode Head and Board
The measurement head can be replaced only as complete unit. To get access of the Barcode head, the
Barcode module needs to be removed from the optics base plate see 26.3.
1. Remove the ribbon cable from the PCBA Barcode (PCBA BARCODE)
2. Remove 2 screws to take of the PCBA Barcode
3. Remove the 2 from the mirror metal angle to replace the barcode head
4. Take off the Barcode head

General
- 30.13.1 Firmware Download30.13.5 Set Serial Numbers (XXXXBCXXXX)
- 30.13.3 Default Settings - set Default Settings (only for Barcode Module)
Instrument
- 30.15.1.1 Counter Adjustment->Counter -> reset the counter BARCODE READ Barcode
Barcode
- 26.5 Barcode – Service Software - Function Test Barcode
26.5 Barcode – Service Software
26.5.1 Function Test
Description:
The barcode test is used to check the function of the barcode module. To perform this test a MultiCheck
plate is required. The software starts automatically reading the barcode.
Procedure:
1. Press Start
4. Test will be performed
5. Press Check
Troubleshooting:
- 30.13.6 Check Module Communication - Check the connection to barcode module
27 Stacker Module
The Spark-Stack is an integrated microplate stacker module, which is available as an option for the SPARK
multimode reader. It is designed for automated loading, unloading and restacking of plates for walk-away
automation of up to 50 non-lidded microplates per run.
The built-in Spark-Stack microplate stacker for automated loading, unloading and restacking of
up to 50 plates per run.
The built-in microplate stacker module uses plate magazines (stacks) as storage containers. The plate
magazines are compatible with non-lidded 6 to 1536-well plates and are provided with light-protection
covers for light-sensitive assays.
The microplates in the plate magazine located at the INPUT position of the Spark-Stack module are loaded
into the Spark reader one after the other. After the measurement has been performed, the processed plates
are collected in the plate magazine at the OUTPUT position.
The grippers of the plate magazines are spring loaded to remain closed in the event of a power failure,
holding the plates in position inside the plate magazines despite the lack of power.
Two different heights of plate magazines are available:

• Two short stacks with a capacity of up to 30 plates (standard 96-well plates) per run
• Two long stacks with a capacity of up to 50 plates (standard 96-well plates) per run
27.1 Access to the Front Panel
By removing the plate magazines from the stacker module, the operator has full access to the front panel
of the SPARK multimode reader, for:
• Exchanging dichroic mirrors
• Exchanging filter slides
• Manual loading of a single plate onto the plate carrier of the Spark reader
• Manual loading of the SPARK MultiCheck plate for performing IQ/OQ
27.1.1 Onboard Control Buttons
If no plate magazine is installed on the Spark-Stack, all onboard control buttons are active. When a plate
magazine is installed on the Spark-Stack, only the Stop function of the Onboard-Start
button remains active. All other onboard control buttons are inactive. Pressing the Onboard-Start
button during a stacker run will stop the stacker run after the current action is completed.
CAUTION: If a stacker run is interrupted using the Onboard-Start button ,

a microplate may remain in the reader. Make sure to remove the microplate from the
reader before starting another stacker run.
CAUTION: In the event of a power failure, make sure to remove the microplate from the
reader and to remove all processed plates from the OUTPUT plate magazine, before
starting a new stacker run.
27.1.2 Light Protection for Sensitive Assays/Dark Covers
The Spark-Stack microplate stacker includes a set of light-protective front and top covers, which can be
quickly inserted into place on the plate magazines. These elements help to shield microplates containing
light-sensitive contents, such as GFP-transfected cells, AlphaScreen, AlphaLISA, AlphaPlex assay plates,
etc. from ambient light in the laboratory.
1. Place the front cover onto 2. Slide the front cover down 3. Place the top cover on
the magnetic strips of the into position. the plate magazine.
plate magazine.
27.2 Microplate Requirements for the Spark-Stack
Any common microplates (without lids) ranging from 6 to 1536-well formats conforming to ANSI / SLAS
standards may be used for performing stacker runs with the Spark-Stack module:
WARNING: Do not use microplates with lids in the Spark-Stack module.
WARNING: Do not use humidity cassettes in the Spark-Stack module.
CAUTION: Make sure that the microplate matches the plate definition in the method to
prevent problems during a stacker run. Always use microplates of the same type and
color.
Specifications Spark-Stack
from 6 to 1536-well formats conforming to ANSI /
Microplates (without lids)
SLAS standards
15 seconds per plate (96-well microplate without
Restacking time
smooth mode)
Required Microplate Dimensions
Overall plate height From 10 mm to 23 mm
Length = 127.76 mm ± 0.5 mm
Footprint
Width = 85.48 mm ± 0.5 mm
Minimum difference between plate height
≥ 6.7 mm
and skirt height
WARNING: Do not touch the inside of the input magazine or the output magazine during a
stacker run.
WARNING: Do not insert or remove plates manually during a stacker run..
Microplates with Barcodes

Microplates with barcodes for identifying plate IDs are especially helpful for stacker kinetic runs.
A SPARK microplate reader equipped with the optional, integrated barcode reader module is required for
barcode reading.
Automated Processing of Cell Chips with the Spark-Stack Module

The plate magazines of the Spark-Stack are compatible with the cell chip adapter of the Spark reader.
Therefore automated loading of Cell chips inserted in the cell chip adapter is possible using the Spark-
Stack microplate stacker module.
Weighting Plates
The stacker comes with two H-shaped stabilizing weight elements (one for each plate magazine). These
elements are designed to weigh down the microplates in the plate magazines for reliable stacking.
NOTE: The plate sensors in the plate magazines recognize the weighting plate, therefore
the weighting plates will not be loaded into the SPARK reader and do not need to be
removed when restacking. Make sure that the weighting plate is always on top of the
plates in the plate magazine.
1. Place a weighting plate on the plates in the input magazine (The middle section is wedge-
shaped. The wider part of the wedge should be facing up for easier gripping).
2. Place a weighting plate at the bottom of the output magazine.
3. The Spark-Stack is now ready for operation.
27.2.1 Loading Multiple Microplates into a Plate magazine
It is possible to load several microplates at once into a plate magazine of the Spark-Stack module by using
a standard 6-, 12-, or 24-well microplate, or a standard half-deepwell or deepwell plate as a platform for the
stack of microplates to be loaded into the plate magazine.
1. Prepare the full amount of microplates to be loaded into the plate magazine for the stacker run.
2. Place a portion of these microplates onto the platform plate. In this example, a standard 12-well
plate is used as a platform plate. Make sure that the microplates are the same type and color and
that well A1 is in the upper left hand corner (closest to A1 label on the back left hand corner of
the plate magazine).
3. Slide the plate magazine over the stack of microplates all the way down until the plate magazine
makes contact with the surface of the lab bench.
4. Lift up the plate magazine. The stack of microplates has been added to the plate magazine.
The platform plate remains on the lab bench.
Load the remaining microplates using the same procedure.
CAUTION: Ensure that no microplates are inserted upside-down.
CAUTION: Ensure that all microplates are inserted with the 'A1' label in the upper left
hand corner.
CAUTION: Always wear gloves when manually inserting microplates into the plate
magazine. Fingerprints or smudges on the optical (bottom) surface of the microplate can
adversely affect reader measurements.
CAUTION: Use only compatible plates. Flexible, and non-level plates, such as PCR-
plates are not suitable.
CAUTION: Do not use microplates that show any form of damage.
CAUTION: Do not use microplates with lids during a stacker run.
CAUTION: If the sealing films or foils are removed from microplates before measurement:
Make sure that the top of the microplates are not sticky from residual adhesive,
otherwise the plates can become stuck together and cause problems with retrieval from
the plate magazine.
Additionally, make sure the microplates are level and have not become bent during the
sealing process.
27.2.2 Loading a Single Microplate into a Plate magazine
Before loading a single microplate into a plate magazine, please ensure that:
• the A1 label on the microplate is closest to the A1 label on the back left hand corner of the plate
magazine,
• the microplate is not upside down, its type and color correspond to the plate definition used in the
method, and
• the microplate is not obviously damaged.
CAUTION: Always wear gloves when manually inserting microplates into the plate
magazine. Fingerprints or smudges on the optical (bottom) surface of the microplate can
adversely affect reader measurements.
1. Manually insert the microplate 2. Gently release the microplate

into the top of the plate magazine at the bottom of the plate magazine.
and carefully lower it towards
the bottom of the stack.
27.2.3 Loading the Plate Magazines onto the Spark-Stack Module
Lift the plate magazines using the handles at the bottom as shown below. Position the plate magazine
above the corresponding position on the Spark-Stack module and push it straight down.
1. Load the plate magazine with the microplates to be processed at the position labelled INPUT.
2. Press the plate magazine down firmly to click it into position.
3. Load the empty plate magazine at the position labelled OUTPUT.
CAUTION: If a plate magazine has not been inserted properly onto the Spark-Stack
module, the Start Stacker button will be disabled. If this happens, press the plate
magazine down to click it into place. Then the stacker run.
CAUTION: If the output magazine is not empty, an error message will appear at the start
of a stacker run. If this happens, clear the plates from the output magazine and restart
the stacker run in the software.
CAUTION: If a plate has been forgotten on the plate carrier inside the SPARK reader, an
error message will appear at the start of a stacker run. If this happens, remove the plate
magazines from the Spark-Stack module. Move out the plate carrier from the SPARK
reader and remove the microplate. Then move the empty plate carrier back into the
SPARK reader. Re-load the plate magazine onto the Spark-Stack module and restart
the stacker run.
CAUTION: Do not load additional microplates into the input magazine while a stacker run
is in progress.
27.2.4 Inserting Microplates Directly into the Spark Reader

By removing both plate magazines from the Spark-Stack module, it is possible to perform single plate
measurements using standard microplates, the SPARK MultiCheck plate or the NanoQuant plate.
WARNING: Move the plate transport out first, before inserting a microplate. Place the
microplate directly on the plate transport of the SPARK reader. Do not place the plate on
the lifting table of the stacker when the No microplates label is visible, indicating that
the plate transport is still located inside the reader. Otherwise this will a cause a collision
with the plate, when the plate transport is moved out of the reader.
If this happens press the onboard Start/Stop button , or press the stop button in the
software.
WARNING: Treat bio-hazardous material according to applicable safety standards and

regulations.
When loading a single plate by hand:
1. If the No Microplates label is visible when you try to load a single plate by hand, this indicates
that the plate carrier is still inside the reader. Do not insert a microplate if this label is visible!
No Microplates label
2. Move the plate transport out first, before inserting a microplate. The No Microplates label is not
visible when the plate carrier is moved out.
3. Place the microplate on the center of plate transport. Ensure that the A1 label on the microplate
is in the upper left hand corner. Always place the microplate on the plate transport – never
directly onto the lifting table of the stacker.
27.2.5 Unloading Processed Microplates Individually
CAUTION: Always wear gloves when unloading microplates from the plate magazine.
1. Gently remove the plate magazine from the Spark-Stack module.

Avoid any tilting of the plate magazine. Place the plate magazine on
the work bench.
2.
2. Carefully grip the microplate 3. Gently slide the microplate

at the top of the stack of plates towards the top of the plate magazine,
in the plate magazine. and then remove the microplate.
Avoid any spilling.
4. Discard the plate according your laboratory procedures.
27.2.6 Unloading a Group of Processed Microplates
CAUTION: Always wear gloves when unloading microplates from the plate magazine.
1. Gently remove the plate magazine from the Spark-Stack module. Avoid any tilting of the plate
magazine.
2. Place the plate magazine on the work bench.
3. Carefully slide one hand underneath the 4. Gently slide the group of microplates
microplate at the bottom of the plate towards the top of the plate magazine, and
magazine, and stabilize the group of then remove the group of microplates.
microplates you want to unload, with the Avoid any spilling.
other hand.
5. Discard the microplates according your laboratory procedures.
27.3 General Description Stacker Module
The TECAN stacker module is mounted in front of the Spark reader. The plate transport moves out to the
input stack (left side) of the stacker.
A linear stepper motor (z-motor) with a spindle moves up until the change position is reached and the
sensor gives the signal to stop. Then the load motor (with extender wheel) turns until the separator fingers
push the plate separator in the stack and a plate is released. Then the z-motor moves down to the home
position. During this movement, the microplate is placed onto the plate carrier of the Spark plate transport.
After the measurement is finished the plate moves out to the output stack (right side).
The whole process is then performed in reverse order.
stack
Separator fingers
27.4 Installation and Adjustment of Stacker Module
For the installation of the stacker module start with the installation of the Stacker adapter plate on the bottom
side of the Spark instrument. Install the 8 screws using a 2 mm hex key as shown in the picture below.
This step can be performed without removing the bottom plate of the Spark instrument.
Loosen the two screws on each side and then pull off the cover manually, see picture below.
Then connect the main cable from the PCBA PODI from the Spark instrument (24V and CAN) to the rear
side of the Stacker (connector Power Input ST803).
Then place the stacker module on the adapter plate of the Spark and move the stacker to the end of the
adapter plate (do not use the software buttons to move in Y direction).
WARNING: Make sure that the length of the feet of the module are adjusted (adjust the nut
using a 10 mm wrench), so that the module is at the same level as the adapter plate.
The module must not be pushed upwards by the feet.
Start with the mechanical adjustment of the Stacker as shown in the picture above.
Open the PASS service software under Stacker>Adjustment>Stacker Load Position Right. The plate
transport will move automatically into the right position and the stacker table will move up to the default
position.
Place a white microplate on the plate carrier then push the plate to the lower left corner of the plate carrier.
With the two adjustment screws (2.5 mm hex key required) the stacker module will be adjusted in the Y
axis.
The goal is to adjust the module, so that there is a distance of 0.5mm between the lower left corner of the
plate carrier and the pins from the stacker table. The target adjustment is displayed in picture above – the
gap is shown in light blue!
The x-axis needs to be adjusted in the Pass service software with the menu Stacker Load Position Right.
In the Pass service software it is possible to use the Check Stacker Load Position button to check the
setup and see if the plate is moving up and down correctly.
After this mechanical adjustment, remove the white Greiner plate. In the Pass service software, click Next
to finish the software adjustment. The plate carrier will move in automatically and the stacker table will move
down to the home position. Now tighten the 2 long bolts on the output stack.
Once again, the goal is to adjust the module, so that there is a distance of 0.5mm between the lower left
corner of the plate carrier and the pins from the stacker table. The resulting adjustment must look like the
picture below – the gap is shown in light blue!
Repeat the same procedure with the left side by using the Pass software-> Stacker Adjustment Stacker
Load Position Left.
Stacker
- 27.12.2.4 Stacker Module Integration
27.5 Installation of Stacker Module on Spark with
Integrated Cooling Module
If the Spark instrument is equipped with the Cooling module, then the cooling module must to be removed
first. Therefore, the following procedure must be performed:
1. Install the service feet with the extensions and then remove the Cooling module.
See chapter 25.5.
2. Install the Stacker adapter plate onto the Spark instrument see chapter 27.4.
3. Re-install the Cooling module onto the Spark instrument.
4. Re-insert the cooling insulation foam into the Cooling module.
5. Re-install the bottom cover under the Cooling module
6. Remove the service feet.
7. Install the 2 extension feet onto the 2 feet of the Stacker module, see picture below.
Extension foot
Stacker foot
8. Continue with the Stacker adjustment see chapter 27.4.
27.6 Electronic System of Stacker Module
The electronic system of the Stacker is equipped with one PCBA, which is only connected to the PODI
board. All sensors and motors of the input and output stacks are connected to the PCBA (PCBA
STACKER), see picture above. The firmware is used to control all motors and sensors of the stacker
module.
For each stacker sensor there is a corresponding LED on the PCBA indicating the current state.
Position Aktion
0 Normal Operation
1 Init. Of both Lock motors
2 Duration test of INPUT
3 Duration test of OUTPUT
4 Duration test of INPUT and OUTPUT
Together with the Switch Testcase and the Start button it is possible to check the basic stacker functions
without the PASS software.
CAUTION: Make sure that for normal operation, the switch is set to 0 (zero).
27.7 Replacing Stacker Board
To replace the Stacker PCBA (PCBA STACKER) remove 4 screws as shown in the picture below:
General
- 30.13.3 Default Settings - download default settings for stacker
- 30.13.5 Set Serial Numbers
Stacker
- Adjustment: 27.12.1.3 Stacker Z Load Positions
- All Stacker Tests (27.12.2 Test Stacker)
27.8 Replacing Load/Lock Motor
The load motor (MOTOR OSF) with the extender wheel is responsible for releasing the plate onto the
transport carrier. There is a load motor on both sides with the procedure replacing it being the same.
To replace the load motor, first the Stacker module must be removed from the Spark instrument and the
front cover must be removed (see chapter 27.4).
1. Remove 2 screws of the motor cover and remove the cover from the load motor.
2. Remove the 2 set screws of the extender wheel.
3. Remove the small washer.
4. Remove the 4 motor screws.
5. Remove the large washer.
6. Pull out the motor towards the back of the stacker.
7. Disconnect ST500 & ST501 from the PCBA for the left side and ST700 & ST701 for the right side.
To install a new motor (MOTOR OSF), perform the steps in reverse order.
After all of the parts are assembled again, the extender wheel must be adjusted. To do this mount the
extender wheel on the motor axis but do not tighten the set screws. Use the PCBA with the round switch
position number 1 and the start button (see chapter 27.6) or Pass software -> Adjust Stacker Lock Motor
Position (27.12.1.2 Stacker Lock Motor Positions) to move the motor to the home position. Use a thickness
gauge (spacer) 1 mm and turn the extender wheel to the upper wheel. Tighten the set screws.
Stacker
- 27.12.2 Test Stacker (all)
27.9 Replacing Z-Motor Stacker
The z-motor (WIRING LINEAR ACTUATOR) is responsible for moving the plates up and down in order to
be placed on the plate carrier. There is a z-motor on the input and output side. The procedure to replace
the motor is the same for both sides. It is recommended to always replace the motor and spindle together.
To replace the z-motor (WIRING LINEAR ACTUATOR), see the following drawing below:
First of all disconnect the motor from the Stacker PCBA ST401.
2. Pull out the whole motor holder carefully.
3. Remove the 2 screws from the stacker table.
4. Lift out the stacker table.
6. Remove the spindle with the holder.
• Follow the 3 steps above to disconnect the motor from the holder.
• Remove the lock nut (1) and the spindle (2) from the holder, see above.
To install the new motor and spindle, perform all steps in the reverse order!
NOTE: If it is not possible to push the spindle back into the motor, use the motor-tool to control
the z-motor. After this procedure, the spindle will move into the motor shaft.
Stacker
- 27.12.1.3 Stacker Z Load Positions Adjustment
- 27.12.2.4 Stacker Module Integration Test
27.10 Replacing Z–Linear Guide Stacker
There is a linear guide (GUIDE LINEAR Z STACKER) on both sides, left and right. The procedure to replace
the linear guide is the same for both sides. To replace the linear guide, first remove the stacker cover (see
chapter 27.4) Second, remove the Stacker PCBA (see chapter 27.7). The following picture shows an
example of the procedure for the left side.
1. Remove the 4 screws from the linear carrier.

2. Remove the stacker table.
3. Pull out the spindle drive with the linear guide.
4. Lift out the linear carrier.
5. Remove the 4 screws from the guide.
6. Remove the complete guide.
To install the new linear guide and spindle assembly, perform all steps in the reverse order!
NOTE: If it is not possible to push the spindle back into the motor, use the motor-tool to
control the z-motor. After this procedure, the spindle will move into the motor shaft.

Stacker
27.11 Replacing Stacker Sensors
CAUTION: When replacing the sensors make sure that the cables/wires are installed and
guided as before.
27.11.1 Replacing “Stack in Position” Sensor

The function of the “stack in position” sensor is to identify if the that the stack is inserted correctly in the
input or output position. This sensor is an inductive sensor (WIRING SENSOR INDUCTIV STACKER
SPARE) which detects if a piece of metal is close to the sensor. There is a sensor on both sides, left and
right. The procedure to replace the sensor is the same for both sides.
First remove the 6 screws, as shown in the picture above.
• Disconnect the sensor from the PCBA ST310 left or ST309 right side.
• Lift up the stacker module frame.
• Loosen the lock nuts.
• Turn the sensor from the frame
After the new sensor is installed, perform all steps in the reverse order!
NOTE: The stack in position sensor must be in line with the frame.

Stacker
- 27.12.2.2 Stacker Sensor Test INPUT Stack / OUTPUT Stack
27.11.2 Replacing Stack Empty Sensor
The stack empty sensor (SENSOR REFLEX 4POL SPARE) indicates that no more plates are in the stack.
This sensor is on both sides, left and right and functions as a reflex light barrier which detects if a microplate
is on the plate carrier. The procedure to replace the sensor is the same for both sides.
1. Remove the 2 screws from the sensor cover.

2. Remove the cover.
3. Turn the sensor and disconnect the cable.
After the sensor is removed perform all steps in the reverse order!

Stacker
- 27.12.2.2 Stacker Sensor Test INPUT Stack / OUTPUT Stack
27.11.3 Replacing Stack Load Position Sensor
The load sensor (SENSOR REFLEX 7POL SPARE) is a reflex light barrier that detects if the stacker table
is in position to load the plate from the stack. For the sensor to detect the load position, a microplate must
be in the plate carrier. There is a sensor on both sides with the same replacement procedure.
1. Remove the screw from the sensor.

2. Turn the sensor and disconnect the cable.
3. Remove the sensor.
After the sensor is removed perform all steps in the reverse order!

Stacker
- 27.12.1.3 Stacker Z Load Positions Adj.
- 27.12.1.4 Stacker Lift Sensor Positions Adj.
- 27.12.2.2 Stacker Sensor Test INPUT Stack / OUTPUT Stack Test
27.11.4 Replacing Z-Home Sensor
The z-home sensor has two functions: determining the z-home position and a real time step loss detection.
This means that if a crash occurs during the z-movement or some other mechanical resistance, the motor
will be switched off and an error message will appear.
This sensor is a light barrier There is a sensor on both sides, left and right. The procedure to replace the
sensors is the same for both sides.
• Remove the stacker cover (see chapter 27.4).

• Remove the Stacker PCBA for the left side sensor (see chapter 27.7).
• Disconnect ST800 for the right sensor.
• Remove the 2 screws from the sensor, see details in the picture above.
• Remove the sensor.
To reassemble, perform all steps in the reverse order!

Stacker
27.12 Stacker – Service Software
27.12.1 Adjustment Stacker

27.12.1.1 Stacker Load Position LEFT or RIGHT
Description:
This adjustment is needed to adjust the plate carrier of the plate transport in the X and Y (mechanically)
directions to the position of the stacker table on the left or right side. The suggested tool for this adjustment
step is a white microplate.
Procedure:
1. Got to Stacker->Adjustment-> Press Start
2. Insert a white microplate on the plate carrier of the plate transport then push the plate to the lower
left corner of the plate carrier.
3. With the two adjustment screws in front of the stacker module, the Y axis can be adjusted (for the
mechanical adjustments, see chapter 27.4).
Do not use the Up and Down buttons for Z and In and Out buttons for Y
4. Use the buttons in the picture to adjust the X direction of the plate carrier
5. For additional help use the Buttons Move Stacker Z UP/Z Down to move the stacker table
6. The target is to have a distance of 0.5mm between the lower left corner of the plate carrier and the
pins from the stacker table. The target adjustment is displayed in picture below – the gap is
shown in light blue!
7. For final check use the button “Check Stacker Load Position”
8. When the adjustment is finished the result will be displayed.
27.12.1.2 Stacker Lock Motor Positions
Description:
This software menu allow to control only the Lock Motors IN and Out. The adjustment of the motor needs
to be done mechanically see 27.8.
Procedure:
1. Got to Stacker->Adjustment-> Press Start
2. Press the Init Button for INPUT or OUTPUT.
3. When the adjustment is finished, press Passed
27.12.1.3 Stacker Z Load Positions
Description:
This adjustment is for the Z height of the stacker table. To find the best position move the stacker table up
until the bottom of the weighting plate is reached. The target adjustment is a distance of 0.3 mm between
the stacker table and the bottom of the weighting plate.
Procedure:
1. Got to Stacker->Adjustment-> Stacker Z Load Positions->Start
2. Install both hotels on the stacker module ->Next
3. Load the weighting plate into the INPUT stack ->Next
4. Adjust the Z height of the stacker table to the bottom of the weighting plate until a distance of 0.3 mm
NOTE: Check the distance only outside of the weighting plate not in the middle.
5. Click Next and perform the same steps on the OUTPUT stack with the weighting plate
6. When both sides are adjusted, the results of the Z adjustment will be displayed
27.12.1.4 Stacker Lift Sensor Positions
Description:
This adjustment is needed in order to adjust the stacker table height to the lift sensors for the Input and
Output stacks.
Procedure:
1. Got to Stacker->Adjustment-> Stacker Lift Sensor Position
2. Load a microplate in the INPUT stack->Next
3. The stacker adjustment will be performed automatically
4. Load a microplate in the OUTPUT stack->Next
5. The stacker adjustment will be performed automatically and the results will be displayed
27.12.2 Test Stacker
27.12.2.1 Steploss Tests Inputlock/Outputlock and Steploss

InputZ/OutputZ
The steploss test is to evaluate if the motors are mechanically blocked. The motor is moved to the maximum
position. At the end of the test, a result summary is displayed.
Procedure:
1. Go to Stacker→ Steploss → choose the test.
2. Press Start and choose how many cycles
3. Steploss Test is performed automatically.
Troubleshooting:
- Replace stacker motor (MOTOR OSF SPARE, WIRING LINEAR ACTUATOR SPARE)
27.12.2.2 Stacker Sensor Test INPUT Stack / OUTPUT Stack
The test is to evaluate the function of the 3 sensors of the Input or Output stack. The sensors need to be
covered manually to check the function of the light barrier of the sensors.
Procedure:
1. Go to Stacker→ Test →Stacker Sensor Test INPUT Stack /OUTPUT Stack.
2. Click Start and manually cover all three sensors follow the instructions the software (see pictures
below)
3. After each sensor is covered, the software automatically switches to the next sensor.
Troubleshooting:
- Check the connection of the specific sensor
- Check if something is blocking the specific sensor (dust or dirt)
- Replace specific sensor (SENSOR REFLEX 4POL SPARE - Stack Empty Sensor, SENSOR
REFLEX 7POL SPARE - Stack Load Position Sensor, WIRING SENSOR INDUCTIV STACKER)
27.12.2.3 Stacker Motion Input Stack Test / Output Stack Test
The test is to check function of the Input or Output Stack. The software will load the microplate from the
stack to the stacker table and after a full movement in Z direction, the microplate will be loaded back in the
stack. With this test, the Z-offset for the stacker table will be checked and also both motors and sensors.
Procedure:
1. Go to Stacker→ Test → Motion Input Stack or Motion Output Stack Test.

2. Click Start, insert the stacks and also one microplate in the Input stack or Output stack
3. Enter how many cycles should be performed ->Next
4. Select the currently loaded microplate type ->Select
5. The test will be performed automatically and after the run, the result will be displayed
Troubleshooting:
- Check the connection of the sensor and motor
- 27.12.1.3 Stacker Z Load Positions - Readjust stacker Z-load Position
27.12.2.4 Stacker Module Integration
The test is to check function Stacker module with an automatic run or a step wise run of microplates. The
length of the test depends on the loaded microplates at least one microplate needs to be loaded in the Input
stack.
Procedure:
1. Go to Stacker→ Test → Stacker Module Integration .

2. Click Start, insert the stacks and 2 microplates in the Input stack
3. Choose the currently loaded microplate type ->select
4. By clicking the button Stack (Single Move) one time, the microplate will be loaded from the input
stack (left side) to the stacker table and from the stacker table to the plate carrier, which moves the
plate into the SPARK. By clicking the button a second time, the plate carrier with the microplate will
move out on the output side (right side) and the microplate will be placed on the stacker table and
the stacker table will move the microplate up into the output stack.
5. By clicking the button Restack (Single Move) two times, the microplate will be moved from the
output stack back to the input stack (the same as above, but in the opposite direction).
6. With the button Automatic Test, the Stacker module will automatically perform a full run. This
means the microplates will be moved from the input stack to the output stack and back again. The
duration of the run depends on the amount of the loaded microplates in the Input stack.
7. After the run, the results will be displayed.
8. Also included in this test are the step loss tests of all motors
Troubleshooting:
- Check the connection of the sensors and motors
- 27.12.1 Adjustment Stacker (all)
28 Fluorescence Imaging (Cell Imager)
If Spark instrument is equipped with the Cell Imager module, the Spark is delivered with a dedicated stand-
alone computer, which meets the required memory- and video-card demands.
Cell Imager module enables wide-field imaging, in both fluorescence and brightfield channels. Four different
fluorescence channels, three levels of magnification (objectives), astigmatism-based autofocusing, whole-
well imaging with well border correction and full environmental control, enable the unique combination of
live-cell cytometry and cell incubation.
For accurate movement of the plate transport, all Spark instruments with the option Cell Imager are
equipped with a different plate carrier type and different X/Y stepper motors (MOTOR PLATE TRANSPORT
X FIM SPARE, MOTOR PLATE TRANSPORT Y FIM SPARE).
Below a schematic drawing of the Cell Imager module:
28.2 Brightfield Imaging
The cell Imager offers an improved brightfield illumination system, which captures a whole well of a 96-well
plate in a single acquired image.
Furthermore, the new astigmatism-based laser autofocus detection produces more accurate results in less
time. Samples are illuminated from the top and image acquisition is performed from the bottom.
The brightfield illumination module consists of a light emitting diode and two lenses. Homogenous
illumination is achieved by acquiring the image at infinity, while high dynamic range imaging is performed
simultaneously in order to compensate for any meniscus effects. The sample plane is imaged by a 2x, 4x
or 10x microscope objective attached to a revolving objective turret and is further guided via a tube lens to
the camera.
See schematic diagram below:
28.2.1 Autofocus
An improved astigmatism-based autofocusing procedure allows for a stable, reliable and time efficient
detection of objects in a microplate.
In the Autofocus module an LED produces light, which is guided to the objectives (2x, 4x or 10x) and imaged
onto the sample inside of the micro plate. The partial reflection of the autofocus light at the sample interfaces
is imaged by the same objective, passes through the multiband dichroic filter and is further transmitted via
a tube lens to the camera. For each measurement, a scan is performed along the optical axis to find the
optimal position.
See schematic diagram below:
28.3 Fluorescence Imaging
The fluorescence module utilizes four color channels, that correspond to the most commonly used dye
classes DAPI/Hoechst, FITC, TIRTC and Cy5.
28.3.1 Fluorescence Channels and their Excitation and Emission

Profiles
Four different LEDs and their corresponding excitation filters may be selected in SparkControl software.
The following table provides information about excitation and emission wavelengths, provided by the
fluorescence module:
Channel λex λem

Blue 381 - 400 nm 414 - 450 nm
Green 461 - 487 nm 500 - 530 nm
Red 543 - 566 nm 580 - 611 nm
Far-red 626 - 644 nm 661 - 800 nm
28.3.2 Image Acquisition
If excited at the appropriate wavelength, the sample in the micro plate emits a fluorescence signal, which
is again passed through the multiband dichroic filter and transmitted via the tube lens to the camera. See
schematic diagram below:
28.4 Specifications for Cell Imager
28.4.1 General
Camera Sony IMX264 CMOS chip, 2456x2054 pixels (=5 megapixel),
pixel size 3.45 µm
Illumination Brightfield LED,
four sets (LED + excitation filter) of different excitation- and emission
wavelengths for fluorescence imaging
Image Wide-field brightfield, digital phase contrast and wide-field
fluorescence
Supported plate- 6-, 12-, 24-, 48-, 96- and 384-well plates
formats
28.4.2 Objectives
The following table summarizes the optical properties of the various selectable Olympus objectives:
Objective 2x 4x 10x
Numerical aperture 0.08 0.13 0.30
Pixel resolution 3.45 µm 1.72 µm 0.69 µm
Optical resolution 4.50 µm 2.77 µm 1.20 µm
Field of view 8.47 mm x 7.09 mm 4.24 mm x 3.54 mm 1.69 mm x 1.42 mm
28.5 Installation and Adjustment of FIM Module

For the installation of the Spark instrument with the FIM module it is important to check the customer
environment according to the IQ checklist and to ensure that the area of the Spark instrument is vibration
free.
Perform these adjustments and tests in the Service Software:
Fluorescence Imaging
- 28.12.1.4 Offset X/Y FIM
- 28.12.2.1 Test Offset X/Y
28.6 Installation of Stacker Module on Spark
Instrument with FIM Module
If the Spark instrument is equipped with Stacker module, then the FIM module housing must be removed
first to install the stacker adapter plate on the Spark bottom housing. Therefore, the following procedure
must be performed:
1. Install the service feet with the extensions see chapter 25.5 and lift up Spark instrument 90° to the
rear side on the service feet
2. Remove 8 screws from the bottom plate.
3. Take off the base plate.
4. Remove the bottom insulation foam.
5. Dismantle the left side extension service foot.
6. Remove the two plastic tubes.
7. Disconnect the camera trigger cable.
8. Disconnect the fan on the PCBA FIM ST 405.
9. Remove the 8 screws from the FIM module bottom housing
WARNING: Do not touch the surface of the mirror or lens of the FIM module.
10. Pull the FIM bottom housing to release the housing from the Spark instrument bottom.
11. Slide the FIM bottom housing to the left
12. When the cutout of the housing is free, the complete FIM bottom housing can be removed.
13. Install the stacker module adapter plate
14. Attach the adapter plate with the 8 screws.
15. Install the FIM bottom housing back on, connect all wirings and attach the base plate with foam.
Perform all the listed steps in reverse order.
16. Install the Stacker module onto the adapter plate
17. Install the Stacker extension feet.
18. Continue with the Stacker adjustment see chapter 27.4.
28.7 Electronic System of FIM Module
The electronic system of the FIM module is equipped with one main PCBA (PCBA MAIN MODULE FIM),
which is connected to with CAN Bus wiring to other PCBAs. The power connector is connected to the PCBA
PODI.
All LEDs, motors and sensors are connected to the main FI PCBA FIM (PCBA MAIN MODULE FIM). The
other small PCBAs like the vibration PCBA and the objective PCBA are connected to the main FIM PCBA,
see picture above.
The Firmware is used to control all LEDs, motors and sensors of the FIM module.
28.8 Replacing the Brightfield Module
To replace the brightfield module (MODULE BRIGHTFIELD CPL.FIM), first the Spark housing needs to be
removed.
1. Disconnect the two connectors

3. Lift up the bright filed module
To install a new module, perform the steps in reverse order.
28.9 Replacing FIM module
To remove the FIM module, follow the steps below:
1. Install the service feet with the extensions, see chapter 25.5 and lift up Spark instrument 90° to the
rear side on the service feet
2. Remove the 8 screws from the bottom plate.
5. Disconnect following connectors on the PCBA FIM:
• ST 405 Fan camera
• ST 404 CAN Bus
• ST 403 CAN Bus
• ST 702 Brightfield LED
• ST 603 Vibration Module PCBA
6. Loosen the two screws of the USB Connector of the USB Camera and remove the cable.
7. Remove the camera tubes

8. Remove the three modules screws (the screws can be loosened but not removed)
9. Lift up the FIM module
To install the FIM module, follow the steps below:
1. Remove the dust cover of the objective

2. Insert the FIM module
3. Tighten the three screws of the module
4. Connect following connectors on the PCBA FIM
• ST 405 Fan camera
• ST 404 CAN Bus
• ST 403 CAN Bus
• ST 702 Brightfield LED
• ST 603 Vibration Module PCBA
5. Connect the USB camera and tighten the two screws

6. Insert the insulation foam
7. Attach the bottom plate with the 8 screws
WARNING: Do not touch the surface of the mirror or lens of the FIM module.
General
- Adjustment of bright field - loosen 4 screws and readjust module
Plate Transport
28.10 Replacing FIM Board
To replace the PCBA MAIN MODULE FIM, it is necessary to remove the FIM module first. See chapter
28.9.
Disconnect all connectors from the PCBA and remove 4 screws to replace the PCBA, see drawing above.
To install the new PCBA, perform the steps in reverse order.
General
- 30.13.3 Default Settings (Download default settings)
- Import original FIM settings
- 30.13.5 Set Serial Numbers - Set serial number of FIM module
28.11 Replacing Fan FIM
To remove the fan of the FIM module (WIRING FAN FIM), follow the steps below:
1. Install the service feet with the extensions see chapter 25.5 and lift up Spark instrument 180° bottom
up.
2. Remove the 8 screws from the bottom plate.
5. Remove the 4 screws from the fan on the rear side of the Spark
6. Disconnect the connector ST405 on the PCBA FIM.
7. Remove the tubing
8. Lift up the fan to remove it.
To install the new fan, perform the steps in reverse order.
Instrument
28.12 Fluorescence Imaging FIM – Service Software
NOTE: To adjust or to test the Fluorescence Imaging module the FIM test plate is required.
NOTE: In oder to do the field upgrade “Signal Correction” an additional test tool is required.
The test plate (PLATE TEST SIGNAL CORRECTION CYTO) is used in the process of generation of a set
of reference images from the Fluorescence Imaging Module (FIM) in Spark Cyto in order to provide
information on the opto-electronic noise factors generated by the camera, illumination, and optics during
image acquisition. These images shall be used in the SparkControl software to correct the camera raw
image signal upon sample image acquisition.
28.12.1 Adjustment FIM
28.12.1.1 LED Power
Description:
This adjustment is needed to adjust all LED current of the FIM module. This adjustment will be performed
without the FIM test plate.
Procedure:
1. Go to FIM→ Adjustment → select LED Power
2. Press Start and remove the any plate from plate carrier.
3. Press Finish and the results will be displayed
Troubleshooting:
- Check all connection on the PCBA FIM (PCBA MAIN MODULE FIM)
- Replace PCBA FIM (PCBA MAIN MODULE FIM)
28.12.1.2 Brightfield Lighting
Description:
This adjustment is needed to adjust the alignment of the brightfield module. For this adjustment no FIM test
plate is needed because of direct light way which will be checked for intensity and CV.
Procedure:
1. Go to FIM→ Adjustment → choose the Brightfield Lighting
2. Press Start and remove the any plate from plate carrier.
3. Press next
4. Now remove the instrument cover and manually adjust the alignment of the Brightfield module with
the 4 screws
Bad adjustment to high CV value
5. If CV value is less than <3 % this means that light intensity is good
6. Press next
7. Picture will be taken of each of the three lenses
8. Press next
Troubleshooting:
- 28.12.2.9 Test Brightfield Lighting - check the function of bright field module
- Check for dust on the surface on the objective and on the bright field module
28.12.1.3 Z-Offset FIM
Description:
This adjusted is used to adjust Z the offset for the three objectives 2x, 4x, 10x. No test plate is required
because adjustment will only set the Z-offset FIM based on the Z-Max offset of the plate transport.
Procedure:
1. Go to FIM→ Test → choose the Z-Offset
2. Press Start and the calculation will be started automatically
28.12.1.4 Offset X/Y FIM
Description:
This adjustment is needed to adjust the X/Y offset of the plate transport for the FIM module. For this
adjustment step the FIM plate is needed. During the adjustment the software will adjust the position A1,
A12 and H1 from the FIM plate to adjust the X/Y offset. This adjustment will be performed for all three
lenses.
Procedure:
5. Go to FIM→ Adjustment → choose the Offset X/Y
6. Press Start and choose the FIM test plate
7. Insert the test plate on the plate carrier with A1 to the upper corner.
8. Adjustment will be performed automatically for all three lenses.
9. Press Set and results will be displayed.
Troubleshooting:
- Check that the FIM plate (PLATE TEST FIM) is correct inserted
- Check the function of the bright field module
- Check X/Y FIM resolution
- Check for dust on the surface on the objective
28.12.1.5 Z Objective Offset
Description:
This adjustment is needed to adjust Z offset for the three objectives 2x, 4x, 10x. For this adjustment is the
FIM test plate (PLATE TEST FIM) needed to find the focus position for each object when a MTP plate is
loaded on the plate carrier.
Procedure:
1. Go to FIM→ Adjustment → choose the Z Objective Offset
4. Adjustment will be performed automatically for all three objects 2X, 4X, 10X in coarse
5. After coarse adjustment press next and the fine adjustment will be stated. If the graph peak is not
at one point use the Set and repeat button to readjust
6. If all 3 peaks in one line press Finish and result will be displayed.
Troubleshooting:
- Check if FIM plate (PLATE TEST FIM) is correct inserted
- Check function of the bright field module
- Check function of the Objective Z-motor and FIM lens motor
28.12.1.6 Z Autofocus Offset
Description:
This adjustment is needed to set the Autofocus offset for the three lenses 2x, 4x, 10x.This FIM test is
needed because of the grid line which is used to adjust the focal position for all of the three lenses.
Procedure:
1. Go to FIM→ Adjustment → choose the Z Autofocus Offset
2. Press Start and choose the FIM test plate (PLATE TEST FIM)
4. Adjustment will be performed automatically for all three lenses 2X, 4X, 10X
5. Press Finish and result will be displayed.
Troubleshooting:
- 28.12.2.9 Test Brightfield Lighting - check the function of bright field module (MODULE
BRIGHTFIELD CPL.FIM)
- Check for dust on the surface of the lens
28.12.1.7 Magnification
Description:
This adjustment is needed to set the magnification factor for each lens. The FIM test plate (PLATE TEST
FIM) is used to have the grid lines in the objectives for the adjustment.
Procedure:
1. Go to FIM→ Adjustment → choose Magnification
4. Adjustment will be performed automatically for all three objectives 2X, 4X, 10X
5. Press Finish and results will be displayed.
Troubleshooting:
- Check the function of the bright field module (MODULE BRIGHTFIELD CPL.FIM)
- Check for dust on the surface on the lenses
28.12.1.8 Signal Correction
Description:
This adjustment is used to generate a set of reference images from the Fluorescence Imaging Module.
Based on the information generated by the camera an image correction is calculated. These images shall
be used in the SparkControl software to correct the camera raw image signal upon sample image
acquisition. This adjustment/test is only available to newer Spark Cytos or Sparks where a field upgrade
has been done.
Procedure:
1. Go to FIM-> Adjustment FIM-> Signal Correction
2. Select the signal correction test plate
3. Select the USB drive (drive of the USB stick where the photos are stored.
4. The software asks whether there are already images present.
5. You will receive a notification to remove any plate/test plate from the instrument
6. Connect and insert the signal correction test plate
7. Measurements will be executed
8. Click Next
9. Check the images and click “Next” in case everything looks fine. The images are stored on the
local DHR folder (C:\Users\Public\Documents\Tecan\PassService\DHR\Instrument\).
10. Unplug the signal correction test plate and unplug it from the notebook.
11. Click Next and the results will be displayed.
Troubleshooting:
- Unplug the Test Signal Correction Plate
- Check that the FIM camera is available in the PASS home screen
If this is not the case open the device manager and remove the IDS uEye camera driver
- Re-install the camera driver
28.12.2 Tests FIM
The optional tests are not required for installations or maintenance. Such tests can be used for
troubleshooting.
NOTE: To adjust or to test the Fluorescence Imaging module the FIM test plate is required.
28.12.2.1 Test Offset X/Y
Description:
This test is used to check the X/Y offset of the plate transport for the FIM module. For this test the FIM
plate is needed. During the test the software will check A1, A12 and H1 from the FIM plate to verify the X/Y
offset. The check will be performed for each of the three lenses.
Procedure:
1. Go to FIM→ test → Offset X/Y
4. The check will be perform automatically for all three objects 2X, 4X, 10X
6. Press Check and results will be displayed.
Troubleshooting:
- 28.12.1.4 Offset X/Y FIM Adjustment
- Check that the FIM plate is correct inserted
- Check function of the bright field module
28.12.2.2 Test Z-Offset
Description:
This test is used to check Z the offset for the three objectives 2x, 4x, 10x. No test plate is required because
this tests will only validate the Z-offset FIM based on the Z-Max offset of the plate transport.
Procedure:
1. Go to FIM→ Test → choose the Z-Offset
2. Press Start and the calculation will be started automatically
Troubleshooting:
- 28.12.1.3 Z-Offset FIM Adjustment
- 13.5.1.1 Z-Min Position Offset, 13.5.1.2 Z-Max Position Offset Adjustments of the plate transport
28.12.2.3 Test Rotation Angle
Description:
This test is used to verify the rotate angle of the plate carrier to the FIM module lenses. During the test the
software will check A1, A12 and H1 from the FIM plate to verify the rotation angel. The check will be
performed for all three lenses 2X, 4X and 10X.
Procedure:
1. Go to FIM→ test → Rotation Angle
4. The check will be perform automatically for all three lenses 2X, 4X, 10X
5. Press Next
6. Press Finish and the results will be displayed.
Troubleshooting:
- Adjust the FIM plate carrier (CARRIER PLATE FIM) mechanically
28.12.2.4 Test Z Objective Offset
Description:
This test is used to check Z offset for the three objectives 2x, 4x, 10x. Therefore the FIM test plate is used.
Procedure:
1. Go to FIM→ Test → choose the Z Objective Offset
4. The tests will be perform automatically a check of the three objectives 2X, 4X, 10X
5. Press finish and results will be displayed.
Troubleshooting:
- 28.12.1.5 Z Objective Offset Adjustment
- Check function of the bright field module (MODULE BRIGHTFIELD CPL.FIM)
28.12.2.5 Test Z Autofocus Offset
Description:
This test is used to check Z Autofocus offset for the three lenses 2x, 4x, 10x. This test is using the FIM test
plate to have reference position for the focusing.
Procedure:
1. Go to FIM→ Test → choose the Autofocus Offset
Troubleshooting:
- 28.12.1.6 Z Autofocus Offset Adjustment
- Check that FIM plate is correct inserted
28.12.2.6 Test Camera Orientation
Description:
This test is used to check orientation of the FIM camera to the plate carrier. For this test the FIM test plate
is used. The orientation is measured using images of the ILC slide with the 2x lens.
Procedure:
1. Go to FIM→ Test → choose the Camera Orientation
4. The tests will be perform automatically a check of the orientation of the 2x lens
Troubleshooting:
- Check the function of the Objective Z-motor and FIM lens motor
28.12.2.7 Test Autofocus Orientation
Description:
This test is used to check the orientation of the autofocus grid. For this test the FIM test plate and the 2x
lens is used.
Procedure:
1. Go to FIM→ Test → choose the Autofocus Orientation
4. The tests will be perform automatically a check of the 2x lens
5. Press Finish and result will be displayed.
Troubleshooting:
28.12.2.8 Test Magnification
Description:
This test is used to check adjusted magnification factor for each of the three objectives 2x, 4x, 10x. The
FIM test plate is used to have the grid lines in the objectives for verification.
Procedure:
1. Go to FIM→ Test → choose Magnification
Troubleshooting:
- 28.12.1.7 Magnification Adjustment
28.12.2.9 Test Brightfield Lighting
Description:
This test is performed without any test plate and is used to check all three lenses 2x, 4x, 10x with the light
of the bright filed module to find dirt or dust.
Procedure:
1. Go to FIM→ Test → choose the Z Objective Offset
2. Press Start and remove any plate from plate carrier.
3. Press next and a picture will be taken of every object.
4. After each objective the software stops because the picture needs to be checked with OK
5. If all three objects are OK then the results will be displayed
6. The pictures are automatically saved on C hard disc drive on the DHR of the Pass service
software. Example of saved pictures:
Troubleshooting:
- Check for dust on the surface of the optical lenses
28.12.2.10 Test Uniformity Check
Description:
This test is used to check the homogeneity of the fluorescence illumination for all channels (blue, green,
red and far red) and all three lenses. For this test the FIM test plate is used because of it’s fluorescence
slides.
Procedure:
1. Go to FIM→ Test → select Uniformity Check
NOTE: If there is a dust visible on picture then this dust is related to the surface of the filter
on the FIM test plate
5. After all taken pictures were checked automatically and the result of the CV will be displayed.
6. All pictures are saved on the C hard disc drive in the DHR folder of the Pass service software.
See example below:
Troubleshooting:
- Check for dust on the surface on the objectives
- Check for dust on the FIM test plate
28.12.2.11 Focal Plane Check
Description:
This test is used to check the Z-offset and the flatness of the image plane for all the lenses. Therefore
5 segments of the FIM test plate grid will be analyzed to check the image plane flatness.
Procedure:
1. Go to FIM→ Test → select Focal Plane Check
4. The test will be perform automatically a check of the three objectives 2X, 4X, 10X
Troubleshooting:
- 28.12.1.5 Z Objective Offset Adjustment
28.12.2.12 Signal Correction
Description:
This test requires the signal correction test plate (PLATE TEST SIGNAL CORRECTION CYTO)
Procedure:
1. Go to FIM→ Test → select Signal Correction
2. Select the signal correction test plate
3. Select the USB drive (drive of the USB stick where the photos are stored.
4. You will receive a notification to remove any plate/test plate from the instrument
5. Connect and insert the signal correction test plate
6. Click next
7. Click Next
8. Click Next
9. Unplug the signal correction test plate and unplug it from the notebook.
10. Click Next and the results will be displayed.
Troubleshooting:
- Unplug the Test Signal Correction Plate
- Check that the FIM camera is available in the PASS home screen
- If this is not the case open the device manager and remove the IDS uEye camera driver
- Re-install the camera driver
28.12.2.13 Steploss Tests FIM
28.12.2.14 Steploss Tests Objective Z-motor
Description:
This test is to perform automatically check of the objective Z-motor. The cycle of the steps loss test can be
chosen between 1 and 1000 steps. During the test is no test plate required.
WARNING: Remove any plate of the plate carrier to avoid damages.
Procedure:
1. Go to FIM→ Test → Steploss→ choose Objective Z-Motor
2. Insert the cycle
Troubleshooting:
- Check motor connection
28.12.2.15 Steploss Tests FIM Lens Motor
Description:
This test is to perform automatically check of the FIM Lens motor. The cycle of the steps loss test can be
chosen between 1 and 1000 steps. During the test is no test plate required.
WARNING: Remove any plate of the plate carrier to avoid damages.
Procedure:
1. Go to FIM→ Test → Steploss→ select FIM Lens Motor
2. Insert the cycle
Troubleshooting:
- Check motor connection
28.12.3 Optional Test FIM
28.12.3.1 Objective Position Check
Description:
This test will be performed without any plate on the plate carrier. This test is used to manually move the
three lenses (2x, 4x, 10x) in Z direction with an open instrument flap for a visually check.
Procedure:
1. Go to FIM→ Test → optional → choose Objective Position Check
2. Press Start and object 2x will be moved in Z direction and the flap will open
3. Check manually if movement was ok or if dust is on the object surface when finish press Yes
4. Object 4x will be moved in Z direction
5. Check manually if movement was ok or if dust is on the object surface when finish press Next
6. Object 10x will be moved in Z direction
7. Check manually if movement was ok or if dust is on the object surface when finish press Next.
8. Flap will be closed and results will be displayed.
29 Log files
29.1 Log Files
The Spark instrument generates log files every time when the instrument is connected to the computer.
1. The central storage for all log files of the Spark is following path on the local hard disc drive C:
C:\Users\Public\Documents\Tecan\LogFiles
2. The log files of the SparkControl software as well as the MultiCheck logfiles are saved to the
following path:
C:\Users\Public\Documents\Tecan\LogFiles\SparkControl
Also important is the file Clients.DxDiag.xml. This file contains the information of the users operation
system as well as the computer settings.
3. The log files of the Pass Service Software are saved on following path:
C:\Users\Public\Documents\Tecan\LogFiles\Pass
The log files of the SparkControl are automatically saved and archived when an error appears. A WinZip
folder named Exceptions is automatically generated.
C:\Users\Public\Documents\Tecan\LogFiles\Exceptions
It is also important to know that the exception log file is only saved in case the method has finished and
was not interrupted by the user.
29.1.1 SparkControl Log Files
All actions and measurements of the instrument are logged and can be identified with the unique serial
number. All logs are saved in a designated folder:
C:\Users\Public\PublicDocuments\Tecan\LogFiles\SparkControl\X.X\XXXXXXXXXX
Note: "X.X" is the version of the SparkControl software used on the current PC.
"XXXXXXXXXX" is the Spark serial number.
The log file with the most detailed information is the file named Operation.Host.log
Example of an OperatingHost.log:
To find the last error which appeared in the log file move to the end of the file. 2
1. The defective module is displayed
2. The error which appeared on the module and the defective part is displayed.
29.1.2 PASS Software Log-Files
All adjustments and tests of the instrument are logged and can be identified with the instruments unique
serial number. All logs are saved in a designated folder:
C:\Users\Public\PublicDocuments\Tecan\LogFiles\Pass\X.X\XXXXXXXXXX
Note: "X.X" is the version of the SparkControl software used on the current PC.
"XXXXXXXXXX" is the Spark serial number.
The log file with the most detailed information is the file named Tecan.At.Dragonfly.log
Example of an Tecan.AT.Dragonfly.Log File below:
To find the last error which appeared in the log file, go to the end of the file.
1. The test case in the Pass is displayed were an error appeared
2. The error which appeared on the module and the defective part is displayed.
30 Service Software PASS
The Service Software (PASS) is used to adjust and test the instrument. The Software is grouped into
several sections:
• General
• Test Tools
• Instrument
• Gas Control Module
• Plate Transport
• Absorbance
• Cell Counting
• Fluorescence
• Fluorescence Imaging
• Injector
• Luminescence
• Cell Counting
• Cooling
• Finalize Instrument
The Measurement groups are sub classified into Adjustment and Test. To open the groups please press
the arrow button on the left side of the group name.
The acceptance criteria of the adjustment and test can be seen in the screenshots bellow the procedure.
Furthermore the software recognizes which modules are assembled in the instrument and so only the
adjustments and test is displayed which are possible to perform.
30.2 System Requirements

Supported Recommended
PC Windows compatible PC with a 2.4 GHz (Quad Core)
Pentium compatible processor running
at 2 GHz (Dual Core)
Operating System Windows 7 (32-bit) – SP1
Windows 10 (64-bit)
Memory 4 GB RAM 8 GB RAM

Space 15 GB 10 GB
Requirements For Cell counting
measurements: 160 GB
Monitor Super VGA Graphics Cell Imager module:
4 K Graphics
Resolution 1280 x 1024 1680 x 1050
Color Depth 256
Communication 1 x USB 2.0 1 x USB 2.0
1 x USB 3.0 1 x USB 3.0
SPARKs equipped with a
dedicated cable for the cell
module shall be plugged into
an USB 3.0 port, ideally on a
separate host controller.
This ensures optimal
performance.
30.3 Installation of the Service Software
WARNING: The Spark instrument and the USB cable for camera module must be
disconnect before starting the software installation process
To install the PASS Service Software for the Spark use the following procedure:
1. Copy the PASS setup file from your Training DVD or USB stick to a local directory (Desktop) on your
PC
2. Remove old service software version (make sure that the instrument is disconnected)
3. Delete the database file (C:\Users\Public\Documents\Tecan\Pass\ PassServiceDbV5.09)
4. Delete the following directory %Temp%\Pass
5. Execute the EXE-file (as administrator) to install it on the PC and follow the installation wizard
6. Login with a user and Token and import the Test Package (30.10.4 Import Test Package).
7. Restart the computer after installation has finished.
NOTE: After the installation the computer needs to be restarted.
30.4 Login/Authentication
A token is required and needs to be requested to start the service software. In order to request a token,
internet access is necessary. Nevertheless the service software itself can still be used offline.
ATTENTION: In order to request a token it is necessary to contact the Expertline-AT to

activate the user ([email protected])!
30.4.1 PASS Login

Start the PASS service software and a login window will appear.
The user name consists of your email address. In case the instrument is connected to the computer and
turned-on, the instrument serial number is automatically displayed. In case the Spark is not connected the
instrument id field requires a serial number which manually needs to be entered.
30.4.2 Token Request
Go to the following website:
https://fseauthenticator.tecan.com
Type in your user credentials.
Login select your role, instrument and if applicable the instruments serial number.
Press “Request” and a token will be generated on the bottom.
This token is valid for all Sparks or a specific Spark instrument depending whether a serial number is
entered.
30.5 Set-up the PASS Service Software
After the installation, there are several things to do before the PASS is ready to use.
Perform the steps:
• Install the “IMP Server” Program for the Inheco plate
• Start the Pass Service Software and login
• Import the Test Package (30.10.4 Import Test Package)
o Click the button Import Test Package Button
o Select the directory or device where the Test Package is placed and click the file one time
• Press Next and the Test Package will be loaded to the software.
Go to Configuration → Test Tools and configure the following test tools:
• Balance
• Temperature Measurement Plate (Inheco)
• Spectrometer
• MultiCheck Plate
• Hellma Filter Plate (Hellma Cuvette)
• Fluorescence Imaging Plate (only for FIM module)
• Module Test Adapter (no usage in service software)
30.5.1 How to Configure Test Tools

• For the use of the Pass it is required to configure the Test Tool, so that the test/adjustment can be
performed. Follow the procedure below for the configuration.
Procedure:
- Go to Configuration → Test Tools
- Select (click) on the tool group for which you configure a tool
- Press the “+” to configure a new tool. Press “-“ to delete a tool
Balance:
- Fill in a Serial Number or name in the Serial Number field
- Select the calibration –and expiration date of the balance
- Select a type
Temperature Measurement Plate:

- Select the Calibration Date and Expiration Date of the Inheco Plate
- Select a Type
Spectrometer:
- Select the calibration–and expiration date of the spectrometer
- Select type: Ocean Optics USB4000
MultiCheck Plate:
- Click on the MultiCheck menu item (that it is marked) → press the “+” button
- A window will open → go to the directory were the actual normfile is placed → select them and
press open.
- The data will be loaded into the software
Update the normfile:

When the normfile expires go to the MultiCheck Plate menu item and open it. Select the plate which
should updated → press the “+” and go ahead like the above described procedure.
Hellma Filter Plate:
- Click on the Hellma Filter Plate menu item (that it is marked) → press the “+” button
- A window will open → go to the directory were the actual normfile is placed → select them and
press open.
- The data will be loaded into the software
Update the Normfile:

When the normfile expires go to the Hellma Filter Plate menu item and open it. Select the plate which
should get updated → press the “+” and go ahead like in the above described procedure.
After configuring all tools press the Close button
General: It is not possible to load an expired norm file. Following warning will appear:
And further the expired norm file will be highlighted in red and cannot use in the pass software for tests or
adjustments.
Fluorescence Imaging Plate:
- Click on the Fluorescence Imaging Plate menu item (that it is marked)
- The plate will automatically be defined with a universal normal.
Module Test Adapter:

This test adapter is not used in the service software, - only in the production software. It will be displayed
as tool but there is no function available.
30.6 Dependency of Menu Items (Checks and
Adjustments)
The most of the adjustments have dependencies on each other. For example if the Z-Min adjustment is
performed, all other Z-adjustments (Plate Transport Adjustments) have to be performed.
If a menu item or group has an exclamation mark, the test or adjustment must be performed.
Example:
30.7 Menu “File”
To close the program.

30.8 Menu “Instrument”
30.8.1 Assemble Instrument

This menu item has to be done when the instrument and PASS are not connected. It is only needed after
replacing modules. With this function the instrument serial number will be saved on the new installed
module.
It is important that SPARK reader is not connected to the Pass software!
1. After replacing the module, there will be two symbols displayed when starting the PASS software.
2. Wait until the SPARK reader has performed al full INIT then -> Go to Instrument Assemble
Instrument
3. insert the instrument serial number or load the configuration file.xml to the instrument.
4. The software ask to perform the assemble instrument step (30.8.1 Assemble Instrument)
5. Accept the information and click YES

6. The software ask now to power off the SPARK and if USB 3.0 Cell camera is installed also
disconnect the USB 3.0 connector
7. After the disconnecting step accept the information and click OK and connect normal to the Pass
software
WARNING: For this software menu it is needed that the SPARK reader is not connected to
the Pass service software. If the config.xml is not available on-site, please contact the
Expertline-AT.
30.8.2 Import Instrument Configuration
Description:
With the menu item Import Instrument Configuration you can import the configuration xml file to the
software. This file contents the information about the configuration and options of the instrument.
Procedure:
1. Go to Instrument → Import Instrument Configuration
2. Select → Import Instrument Configuration

3. Choose the directory where the config.xml is located, select it and open the file
4. Select the Next button

5. Result will be displayed. Finally press the finish button.
WARNING: If the configuration file is not available onsite, please contact the local Helpdesk
and request for the configuration file.
30.8.3 Firmware Package Version

With this option it is possible to check which firmware package is on the Spark instrument.
30.8.4 Tables
At the menu item Tables you have the possibility to export or import the tables. These tables are important
for the function of different modules. After replacing a board on a module which needs one of the tables,
the table has to be loaded on the new board. Use the Export button to save the current instrument tables
on the PC. Using the Import button loads the tables onto the instrument. On the list bellow you can see
where each table is saved:
1) Saved on the FI PCBA → has to be loaded on the FI PCBA when replacing the board
2) Saved on the MEX PCBA → has to be loaded on the MEX PCBA, safe after Adjust Wavelength
3a) Saved on the MEM PCBA →has to be loaded on the MEM PCBA
3b) Saved on the MEM PCBA →has to be loaded on the MEM PCBA, safe after Adjust Wavelength.
Export:
- Go to Instrument → Tables → Export
- Select the table which should be exported and press Next
- Select the directory where the tables should been written to or click Next. The default path is the
DHR folder of the instrument.
- Finally click the finish button.
Import:
- Go to Instrument → Tables → Import
- Select the table which should be imported and click Next
- Select the directory where the tables are saved, mark the tables which should be imported and
click Next.
30.8.5 Switch Operation Mode to SERVICE (OPERATIONAL)

WARNING: The instrument will be switched automatically to the SERVICE Mode when
connecting to the PASS service software. The status LED will change to BLUE!
After the repair or service is finished, the mode has to be set back to OPERATIONAL mode
or perform the Finalize menu item! The status LED will change back to MAGENTA.
CAUTION: The SPARK instrument will only connect to the user software, such as
SparkControl or Magellan, if the SPARK instrument is switched to OPERATIONAL mode.
The status light must be MAGENTA.
The software will also display the color of the instrument LEDs:
Service mode
Operational mode
30.8.5.1 Reset Test cases
With this software menu it is possible to set all software points to the original status.
30.8.5.2 Execute Batch

With this software menu it is possible to implement a Patch file.
30.8.5.3 Function
The function menu has following sub menus:
30.8.5.4 Instrument Overview

See chapter 30.12.3.1
30.8.5.5 Initialize
30.8.5.6 Instrument Settings

30.8.5.7 Default Out Position

The default out position of the plate carrier is right. This can be changed in this menu.
30.8.5.8 Move Microplate
In this menu it is possible to move the plate transport to specific positions.
30.8.5.9 Move Filter Out

Menu to move the filter slides out
30.8.5.10 Move Plate out

Menu to manually move the plate transport out.
30.8.5.11 Switch Fans to Manual/Automatic

30.8.5.12 Read out Error Stack

30.8.6 Send TDCL Commands

30.8.7 Configure Barcode

Here it is possible to configure additional barcode types via firmware commands. The firmware commands
can be found in the IFU of the barcode manufacture.
30.8.8 Read Barcode

Here it is possible to perform a barcode reading step
30.9 Menu “Misc”
30.9.1 Select Test Package

The select test package menu gives you the possibility to select the test package which should be used.
Press the load button to load the selected test package.
30.9.2 Print Default Settings

To print out a file with the default settings listed.
30.9.3 Verbose Mode

With activating the verbose mode additional curves will be active in every graph in the pass software. This
mode is disabled by default.
30.9.4 Open Folder
DHR Folder:
Device History Record will create a folder for exported tables and reports.
Logging Folder:
Default software path for Pass software logfiles
Error Logs:
Logfiles and error reports will be written in a zip file
30.10 Menu “Configuration”
30.10.1 Test Tools

See chapter 30.5 Set-up the PASS Service Software and 30.14 Test Tools
30.10.2 Set Paths
Here are all defaults software paths listed for the firmware, templates, etc.
30.10.3 Import Firmware Package

In this menu item it is possible to import a firmware package. This has to be done before the firmware
download can be started.
Procedure:
1. Press the button Import Firmware Package Button
2. Select the directory where the firmware package is saved
3. Click Next and the firmware package will be saved in the directory:
C:\Users\Public\Documents\Tecan\PassService\Firmware
Now it is possible to perform the firmware download (30.13.1 Firmware Download)
30.10.4 Import Test Package

The test package must be imported after the installation of the Pass software to ensure the full function of
the Pass software.
1. Press the button Import Test Package Button
2. Select the directory were the Test Package is saved
3. Press Next and the Test Package will be loaded to the software
4. If a firmware package is installed on the instrument which is not compatible then following warning
will appear and the firmware package needs to be updated.
30.10.5 Import Test Selection Configuration

The wizard for the automated IQ, OQ and PM execution gets the specific test cases from a json file. This
file needs to be updated in case of a customer service information (CSI). The configuration file must not
be imported after the installation.
This json configuration is the basis for the automated execution as described in 30.10.5 Import Test
Selection Configuration.
30.11 Menu “Help”
30.11.1 About
In this menu it is possible to see the version of the test package and the software and other additional
information.
30.12 Overview
1
30.12.1 Connection Button

When the instrument is switched on and the software is started, the Connection Button will have following
status:
Instrument “Not-connected”:
After clicking the current instrument symbol one time, the instrument will be connected and the following
status will appear:
Instrument “Connected”:
The instrument will be switched automatically to the SERVICE Mode when connecting to the PASS service
software. The status LED will change from magenta to BLUE! After the repair or service is finished, the
mode has to be set back to OPERATING mode or perform the Finalize menu item!
30.12.2 Adjustment and Test Groups
In the screenshot above all available Adjustment and Test Groups can be seen. When clicking on the arrow
on the right side of the name, the subfolder will be opened. In the most of the folders are the subfolders
“Adjustment” and “Test”.
Select all items in the test tree
Deselect all items in the test tree
Tests according to the PM Checklist and the instrument configuration are automatically selected.
Tests according to the IQ Checklist and the instrument configuration are automatically selected.
Tests according to the OQ Checklist and the instrument configuration are automatically selected.
Select all required items. All failed or not executed test cases.
Execute all selected tests.
Execute current test or test group.
30.12.3 Basic Functions
Click the buttons on the top to open the menus automatically. The instrument overview is opened by default
at start up.
30.12.3.1 Instrument Overview

The instrument overview will be shown after the software is connected to the instrument. The overview
displays the available modules and functions of the instrument. All modules which are marked green are
connected to the Spark, - all modules which are marked red are not connected. By clicking the buttons on
the left side (ABS, CELL, …) more specific information for each module will be shown. The buttons show
the firmware version.
30.12.3.2 Initialize Instrument

The instrument will perform an initialization step and check if all expected modules and functions are ready
to use. Also all motors will move to their initial states and an error message will appear in case there is any
problem (e.g. such as steploss problems).
30.12.3.3 Instrument Settings
Click Instrument Settings and the software will read all instrument settings. The settings are subdivided into
the main groups (measurement modes). Click the arrow on the right side of the group to open the
corresponding subfolders.
Blue settings mean adjusted value different from the default value
Black settings mean default value
Red settings means missing or wrong settings
Information:
The default value will be always displayed in the second row and the current settings in the first row. See
screenshot below:
default
To change settings manually, double click the value which should be changed and enter the new value.
After changing the settings or to do further steps, there is a drop down menu in the right corner.
Following options are available:
Choose the action which should be performed and press Start Action.
• Reload from instrument: select a setting file and load them from the instrument.
• Save to Instrument: Copy the existing settings from the file and save the setting on the
instrument.
• Export Settings: Save the settings on the PC
• Import Settings: Import settings from instrument:
NOTE: The software will not create a folder with the serial number of the SPARK readers
where all settings are saved.
30.12.3.4 Current Fan Mode Manual/Automatic
In this menu item it is possible to change the status of the fan regulation. Manual = Off, Automatic = On →
Automatic means that the fans are regulated by the temperature sensors of the instrument. This button can
be used e.g. when the instrument is opened, to minimize the noise of the fans during a repair or service.
WARNING: Use this function not longer than 0,5 hours otherwise the SPARK instrument is
getting hot!
30.12.3.5 Read out Error Stack

To read out the error stack press this button. As example:
30.12.3.6 TDCL - Send FW Commands

TDCL means Tecan Device Command Language. To enter firmware commands press the button Send
Commands and menu will appear to enter firmware commands
30.12.4 Send Report Button
The Send Report button is available when an error appears. To send a report press the button and following
menu will open:
Enter an e-mail address and a detailed description and press Send Mail. The addressee will receive the
mail including the error message.
30.12.5 Cancel Button
This button is mostly placed on the left side. It can be used to break up adjustments and tests. The
adjustment or test will be shown as failed after breaking up.
30.12.6 Plate Detection
The PASS has a function, which allows it to “remember” which plate is currently inserted. This means for
example for a plate transport offset adjustment in FI: 1) Insert the MultiCheck plate 2) perform the
adjustment 3) afterwards the plate will remain in the instrument 4) if an adjustment or test with the
MultiCheck plate is started, the PASS skips the step where it asks the user to put the plate on the plate
carrier.
30.13 General
30.13.1 Firmware Download

Description:
In the picture below are all the modules listed, on which a firmware is installed.
All modules or PCBAs with FW (spare parts) come with a certain firmware. This firmware is typically old
and not compatible with the current firmware package. Therefore, the firmware has to be updated to the
current (not the latest) firmware package of the instrument. Only a complete firmware package download
is possible.
Procedure:
1. Go to General → Firmware Download
2. Press Start
3. The actual versions vs. the new versions will be displayed
4. Press Next → Firmware will be update
5. After the download the results will be displayed. In case of a failure it sometimes help to retry the
download
Troubleshooting:
- In case of a failure retry to download the firmware
- Restart the instrument and software
30.13.2 Configure Instrument
Description:
The menu item “Configure Instrument” is to set the Instrument configuration to the instrument. The
configuration will be saved on the Transport Main Board. Therefore the Menu item: Import Instrument
Configuration has to be done before you can execute this menu item. This adjustment has to be done after
replacing the Main Transport PCBA and other measurement boards.
Procedure:
1. Go to General →Configure Instrument (30.13.2 Configure Instrument)
2. Press Start
3. Instrument config. will be written to the instrument
5. Restart the Pass Service software
Troubleshooting:
- Check that correct config.xml has been imported (30.8.2 Import Instrument Configuration)
- Restart the PASS and the instrument
30.13.3 Default Settings
Description:
The Default settings will be loaded to the instrument.
CAUTION: Be aware, if the default settings are loaded to the instrument, the whole
instrument needs to be readjusted! If a problem occurs, restart the instrument, the
software, and the procedure.
Procedure:
1. Go to General → Default Settings
2. Press Start
3. Selection Screen will start. Select all settings or select in single steps.
4. Selected Default Settings will be loaded to the instrument
Troubleshooting:
- Check the communication between PC and Instrument (in the device manager)
30.13.4 Write Hardware Versions

Description:
This adjustment is to set the Hardware Version (Revision level) to the modules.
Procedure:
1. Go to General → Write Hardware Versions
2. Press Start
3. Hardware Versions will be written
Troubleshooting:
- Check the communication between PC and Instrument
- Change the Main Transport Board (PCBA MAIN TRANSPORT MODULE)
30.13.5 Set Serial Numbers

Description:
The menu item “Set Serial Number” must be performed after replacing an electronics board of a module or
a module itself. It can also be used to read out the serial numbers of each module and sub module. The
serial number of the instrument has to be assigned to all modules. Between the first 4 digits and the last
four digits a module indicator has to be assigned. These are the characters for the individual modules:
- M0 – PCBA main transport

- AM – ABS MEX
- C0 – CELL
- G0 – GCM
- I0 – INJ
- FF – FLUOR FP
- FB – FLUOR BOTTOM
- F0 – FLUOR
- C1 – COOLING
- P0 – PODI PCBA
- BC – BARCODE
Procedure:
2. Go to General → Set Serial Numbers
3. Press Start
4. All serial numbers will be listed
5. Fill in the serial number which will be displayed in the row notes
6. Press Next; serial numbers will be written to the instrument
30.13.6 Check Module Communication
Description:
The Module Communication Test checks if the expected modules (according to the configuration file) are
available and if they are communicating via the BUS cable. Furthermore the handshake communication of
the Monochromators will be tested.
Procedure:
1. Go to General → Check Module Communication
2. Press Start
Troubleshooting:
- Check the module connections (CAN-BUS, handshake/USB cable, power cables).
- Check the fuses on the PODI board (12.9.2 Electronic Hub PODI Board - Noise Reduction)
- When powering on the Spark check whether the LEDs on the module PCBAs are flashing three
times red
- 30.8.3 Firmware Package Version (Check firmware version)
- 30.13.5 Set Serial Numbers - Check that the correct serial numbers are set
- Check the connection to the instrument
30.13.7 Adjust - Plate Transport Motor Type
Description:
This adjustment is needed to set the correct type of the installed PCBAs (X,Y,Z) of the plate transport. To
see the difference, the software displays examples of the old and new Y-PCBA. This adjustment was
released with the firmware package version 5.03.
Procedure:
1. Go to General → Adjust: Plate Transport Motor Type
2. Press Start
3. Choose the type of the PCBA from the plate transport check the version of the Y-PCBA
4. After choosing the type, click Finish and the result will be displayed
30.14 Test Tools
30.14.1 Communication Check Inheco

Description:
This test is to verify that the tool is connected to the PC and the PASS is able to communicate with the tool.
Procedure:
1. Go to Test Tools → Communication Check Inheco
2. Press Start
3. Connect the tool to the PC and press Next
Troubleshooting:
- Check if the tool is connected correctly to the PC (device manager)
- Check that the driver in the device manger is installed correctly (use repair function of the PASS
installer)
- Check if the Inheco software is installed
- Press reset button on the Inheco plate
30.14.2 Communication Check Spectrometer
Description:
Procedure:
1. Go to Test Tools → Communication Check Spectrometer
2. Press Start
Troubleshooting:
- Check if the tool is connected correctly to the PC
- Check that the driver in the device manger is installed correctly
- Check that the Ocean Optic driver is up to date
- Check that the correct type is selected in the test tool options (30.10.1 Test Tools)
30.14.3 Communication Check Balance

Description:
Procedure:
1. Go to Test Tools → Communication Check Balance
2. Press Start
Troubleshooting:
- Check if the tool is connected correctly to the PC
- Check if the Targus driver is installed (Otherwise use the repair function of the PASS set-up)
30.15 Instrument
30.15.1 Instrument Adjustments

30.15.1.1 Counter
In this menu it is possible to read and reset all module counters.
The counter for each module can be manually overwritten with a mouse double click.
If only one counter needs to be reset-> select only the specific counter and press Reset Counters.
Afterwards, the software displays the changed counters for each module
30.15.1.2 Ambient Temperature Offset

Description:
The Ambient Temperature Sensor is located on the rear side of the instrument. The sensor is used to
regulate the heat exchanger. When the chamber temperature is 3.5°C higher than the ambient temperature
(if heating is switched off) the heat exchanger will be switched on. Therefore the ambient temperature needs
to be calibrated.
Procedure:
1. Go to Instrument → Adjustment → Ambient Temperature Offset
2. Press Start
3. The software will ask for the current temperature (room temperature) enter them in the box
4. Press Next
5. The sensor will be calibrated to the new offset
Troubleshooting:
- Check the sensor wiring (23 Replacing Ambient Sensor)
30.15.1.3 Chamber Temperature Offset
Description:
To calibrate the chamber temperature sensor and the well temperature sensor of luminesce alpha screen
the Inheco plate must be used.
The chamber temperature sensor is used to regulate the heating inside the measurement chamber of the
SPARK. This sensor is installed in the bottom chassis. Additionally, with this chamber temperature
adjustment, the well temperature sensor (installed on the optics base plate to regulate the alpha laser) will
be calibrated as well.
WARNING: Check that the Inheco Plate is switched on (LED is flashing green) and that the
battery is full loaded. The Adjustment will take about 1h:30min or 2h:20min if AlphaScreen
Well Temperature Sensor is installed.
Procedure:
1. Go to Instrument → Adjustment → Chamber Temperature Offset
2. Press Start
3. Connect the plate to the PC and press Next
4. Disconnect the USB connection to the plate → insert the plate on the plate carrier and press Next
5. Measurement will performed and the duration time will be displayed.
• Without Luminescence Alpha screen well temperature sensor the time is approximately
With installed luminescence alpha screen well temperature sensor the time is approximately
6. Take the plate form the plate carrier and press Next
7. Connect the plate via USB to the PC and press Next → the measured data will be read out
Troubleshooting:
- 30.14.1 Communication Check Inheco
- Check that the Inheco plate is switched on
- Check the sensor wiring (Plate Transport Main Board)
- Replace the sensors (WIRING SENSOR TEMPERATURE 110CM)
30.15.1.4 Adjustment - Temperature Offset Heating Top
Description:
This adjustment is only available on Sparks with at least FW 6.22. To calibrate the top temperature sensor
the INHECO plate as well as the plate adapter must be used.
The top temperature sensor is used to prevent the probability of condensation on the well plate. The sensor
is installed on the top of the measurement chamber. The INHECO needs to be inserted upside down and
covered with an aluminum plate. The test tool is brought into contact with heating plate.
WARNING: Check that the INHECO plate is switched on (LED is flashing green) and that
the battery is fully charged. The adjustment will take about 1h:10min with cooling module.
Procedure:
9. Go to Instrument → Adjustment → Adjust: Temperature Offset Heating Top
10. Press Start
11. Disconnect USB Camera (Only for instruments with USB 3.0 camera)
12. Connect the INHECO plate to the PC and press Next
13. Connect the chiller to the instrument. Turn it on and set the temperature to 12°C.
14. Insert the cooling stoppers into the instrument
15. Disconnect the USB connection to the plate → insert the INHECO plate on the plate carrier and
press Next
16. Measurement will be performed and the duration time will be displayed.
19. Connect USB Camera (Only for instruments with USB 3.0 camera)
Troubleshooting:
- Check that the Inheco plate is charged and switched on
- Check the sensor wiring (to the Plate Transport Main Board)
- Replace the sensor (WIRING SENSOR TEMPERATURE 110CM )
- Check whether a fuse is blown on the PODI board. Therefore bring a Multimeter and measure the
3A fuses (F301 & F302).
- Replace the power supply (POWERSUPPLY 350W, 12.9.5 Replacement of Power Supply)
- Replace the PODI board itself (12.9.1 Electronic Hub PODI Board)
- Replace the heating plate (22 Replacing the Heating Foil)
- Cooling stoppers are inserted (for instrument with cooling)
30.15.2 Test Instrument
30.15.2.1 Test - Temperature Offset Heating Top
Description:
This test is only available on Sparks with at least FW 6.22. To calibrate the top temperature sensor the
INHECO plate as well as the plate adapter must be used.
The top temperature sensor is used to prevent the probability of condensation. This sensor is installed on
the top of the measurement chamber. The INHECO needs to be inserted upside down and covered with
an aluminum plate. The test tool is brought into contact with heating plate.
WARNING: Check that the INHECO plate is switched on (LED is flashing green) and that
the battery is fully charged. The adjustment will take about 40min with cooling module.
Procedure:
1. Go to Instrument → Adjustment → Test: Temperature Offset Heating Top
2. Press Start
3. Disconnect USB Camera (Only for instruments with USB 3.0 camera)
4. Connect the plate to the PC and press Next
5. Connect the chiller to the instrument. Turn it on and set the temperature to 12°C.
6. Insert the cooling stoppers into the instrument
8. Measurement will be performed and the duration time will be displayed.
11. Connect USB Camera (Only for instruments with USB 3.0 camera)
Troubleshooting:
- Check that the INHECO plate is charged and switched on
- Check the sensor wiring (Plate Transport Main Board).
- Replace the temperature sensor (WIRING SENSOR TEMPERATURE 110CM)
- Check whether a fuse is blown on the PODI board. Therefore bring a Multimeter and measure the
3A fuses (F301 & F302).
- Replace the power supply (POWERSUPPLY 350W, 12.9.5 Replacement of Power Supply)
- Replace the PODI board itself (12.9.1 Electronic Hub PODI Board)
- Replace the heating plate (22 Replacing the Heating Foil)
- Cooling stoppers are inserted (for instrument with cooling)
30.15.2.2 Ambient Temperature Offset Check
Description:
The Ambient Temperature Offset Check is used to verify the calibration of the sensor. The software asks
for the current temperature (room temperature) and compares it with the temperature at the sensor. If the
difference is too high (1°C) the test will be failed.
Procedure:
1. Go to Instrument → Test → Ambient Temperature Offset Check
2. Press Start
3. Tip in the current room temperature
Troubleshooting:
- 30.15.1.2 Ambient Temperature Offset
- Change the sensor (WIRING SENSOR TEMPERATURE 110CM)
- Check wiring of the ambient sensor
30.15.2.3 Chamber Temperature Offset Check

Description:
The Chamber Temperature Offset Check is used to verify the determined offset of the chamber temperature
and the offset of the well scan temperature offset adjustment.
WARNING: Check that the Inheco plate is switched on (LED is flashing green) and that the
battery is fully charged. The adjustment will take about 50 min and 01h:10min if the
luminescence alpha screen well temperature sensor is installed.
Procedure:
1. Go to Instrument → Test → Chamber Temperature Offset Check
2. Press Start
3. Connect the Inheco Plate to the PC via USB → press Next
5. Measurement will performed and the duration time will be displayed.
Without Luminescence Alpha screen well temperature sensor the time is approximately
6. With installed luminescence alpha screen well temperature sensor the time is approximately
7. Take the plate form the plate carrier

30.15.2.4 Heating Top Check
Description:
The Heating Top Check is used to check if the heating is able to generate a temperature difference larger
than 5 °C within 3 minutes.
Procedure:
1. Go to Instrument → Test → Heating Top Check
2. Press Start
3. Heating up starts (3 min).
Troubleshooting:
- Check the power connector from the heating foil on the PODI Board (Connector CO301).
- Check the sensor connector on the Main Transport Board (Connector ST602).
- Check the voltage on the PODI Board (Connector CO301).
- Change heating foil (PLATE HEATING PREASSEMBLED)
- Change PODI Board (PCBA PODI NR)
30.15.2.5 Front Button Check

Description:
This test is to verify the function of the keyboard foil on the Spark.
Procedure:
1. Go to Instrument → Test → Front Buttons Check
2. Press Start
3. The software will ask to press each button, follow the procedure
Troubleshooting:
- Check the connection from the keyboard foil to the keyboard PCBA (KEYBOARD FOIL HOUSING,
PCBA FOIL HOUSING)
- Check the wiring foil keyboard board to the Plate Transport Main Board
30.15.2.6 Status LED Check
Description:
In the Status LED Check the software will show different colors on the instruments status LED. There will
be the following colors: Red, Blue, Green, Magenta. The technician has to confirm that the proper color is
displayed.
The different colors show the status of the Spark. An overview about all status can be seen in chapter 2.6.
Procedure:
1. Go to Instrument → Test → Status LED Check
2. Press Start
3. The software will ask for the status of the LED : off, red, green, blue; check the color on the
instrument, press Yes or No and then Next
Troubleshooting:
- Check the connection of the flat cable (LED PCBA to plate transport PCBA).
- Replace Status LED (PCBA POWER ON LED)
30.15.2.7 Fans Check
Description:
For the Fan Check the fans will be switched on and off. The test is grouped into separate sections according
to the Spark instrument configuration. In case they can be switch hearable on/off, the PASSED box has to
be checked.
Procedure:
1. Go to Instrument → Test → Fans Check
2. Press Start
Follow the steps, as an example:
3. Press ON → check if the fans are running → press OFF → check that the fans are not running any
more
4. If the fans are working correctly check the PASSED box and press Next. Follow this procedure for
each fan.
Troubleshooting:
- Check connection to the fans (PCBA PODI, cable, connectors).
- Check that nothing is mechanically blocking the fan
- Replace fan
- Replace the PCBA PODI
30.15.2.8 Lid Lifter Check
Description:
The Lid Lifter Check is used to check the function of the Lid Lifter. For this test a well plate and lid with a
lid lifter pad is needed. The well plate with the lid will be put on the plate carrier. The plate carrier moves
into the instrument → the lid is removed from the plate → plate carrier moves out of the instrument.
Procedure:
1. Go to Instrument → Test → Lid Lifter Check
2. Press Start
3. Select the plate type and press Next
4. Insert the test plate and press Next
5. Check if the cover has been lifted from the plate → select Yes/No and press Next
6. Check if the cover has been placed on the plate → select Yes/No and press Next
7. Remove the plate and press Next → Results will be displayed
Troubleshooting:
- Check the wiring and that the connectors plugged in correctly
- Replace the Lid Lifter (LID LIFTER COMPLETE)
30.15.2.9 Steploss Test Lid Lifter
Description:
The steploss test is to evaluate that the motor is not mechanically blocked. Therefore the motor will be
moved to the maximum positions. The number of cycles can be defined from 1 to 1000 cycles. At the end
of the test a result summary with all the passed, failed and lost steps will be displayed.
Procedure:
1. Go to Instrument → Test → Steploss Test Lid Lifter
3. Press Start
Troubleshooting:
- Check the connectors on the Lid Lifter PCBA and the connection to the Transport Main Board
- Try to move the Lid Lifter with the Motor Test Tool (12.2 Motor Tool)
- Replace the Lid Lifter (LID LIFTER COMPLETE)
30.15.2.10 Function Check Flap

Description:
This test checks whether the flap is able to move to the “door open position”. There is a sensor on the
right side where the motor for the flap is placed. This sensor detects if the door is opened or closed. The
number of cycles can be defined from 1 to 1000 cycles.
Procedure:
1. Go to Instrument → Test → Function Test Flap
3. Press Start
Troubleshooting:
- Check if something is mechanically blocking the flap
- Try to move the flap with the motor test tool (12.2 Motor Tool)
- Check the positioning of the metal flag
- Check and clean the sensor which detects the metal flag
- Check the connection to of the motor and the sensor to the main transport board (WIRING FLAP
SENSOR SPARE, STEMO 40CM).
30.15.2.11 Temperature Sensor Check
Description:
This test is used to check all temperature sensors of a Spark instrument.
Procedure:
1. Go to Instrument → Test → Temperature Sensor Check
2. Press Start
Troubleshooting:
- Check the connector and cable of the sensor (WIRING SENSOR TEMPERATURE 110CM,
WIRING IR SENSOR)
30.15.2.12 Standby Control Check

Description:
This test is used to check the function of the heat exchanger. The Spark will cool down until the target
temperature (chamber sensor) has reached 6°C above the temperature level of the ambient sensor. In
the second step the temperature will cool down until the target temperature of the chamber sensor has
reached 3°C above the ambient sensor.
Procedure:
Go to Instrument → Test → Standby Control Check
1. Press Start
2. If the Spark instrument is equipped with a Te-Cool module and following instructions will appear.
Follow the instructions and click Next
3. Press Next and the cooling down step will start automatically.
4. After approximately 30min the results will be displayed
Troubleshooting:
- Check Ambient temperature offset (WIRING SENSOR TEMPERATURE 110CM)
- Check Chamber temperature offset (WIRING SENSOR TEMPERATURE 110CM)
- Replace heat exchanger (MODULE HEATEXCHANGER)
30.16 Finalize Instrument
30.16.1 Finalize Instrument

Description:
The “Finalize Instrument” sets the Instrument from Service Mode to Operational Mode and clears the
error stack, and in addition all settings and tables will be exported.
Procedure:
1. Go to Finalize Instrument → Finalize Instrument.
2. Click Start.
3. Follow the instructions in the software and remove the plate and the filter slides
4. All settings and tables will be saved in the DHR folder
5. Instrument will be set back to Operational Mode
30.16.2 Print Report

Description:
This menu item is used to generate a print-out/report (DHR-Report) where all test/adjustment results are
listed. This menu item has to been done after every service operation.
Procedure:
1. Go to Finalize Instrument → Print Report
2. Click Start
3. A report will be generated
31 Maintenance and Cleaning
31.1 Preventive Maintenance Plan
WARNING: All parts of the instrument that come into contact with potentially infectious
material must be treated as potentially infectious areas.
It is advisable to adhere to applicable safety PRECAUTIONS, (including the wearing of
powder-free gloves, safety glasses and protective clothing) to avoid potential infectious
disease contamination when performing cleaning procedures and also when making
adjustments to the instrument.
WARNING: Risk of fire and explosion!

Prior to cleaning the outer surface of the instrument, switch off the instrument and
disconnect it from the main power supply!
Ethanol is flammable and when improperly handled can lead to explosions and/or fire.
proper laboratory safety precautions must be observed.
31.1.1 Yearly (Service Engineer Required)

For the maintenance Tecan Austria developed Maintenance check lists.
All maintenance steps must be performed with the required PM checklist.
31.2 Cleaning of the Filter Slides
Clean the filters on the excitation and emission side using an optical cleaning solution. It is also
recommended to use lens tissue.
31.3 Heat Exchanger
To reach the heat exchanger, it is necessary to turn the instrument on its side (see drawing).
WARNING: Do not scratch the device!
Optionally, it is possible to install the service adapter feet.

(see chapter 8) and turn the SPARK 90° to the back.
1. Remove the bottom plate by removing 8 screws
2. To remove the heat exchanger 4 screws must be removed as shown in the following drawing.
The fans of heat exchanger must be cleaned with compressed air.
WARNING: Be careful that no dust comes into the instrument!
To get access to the heat exchanger the two fans needs to be to be removed. Use the following
procedure below:
1. Remove the 4 screws of the first fan
2. Take off the first fan
3. Remove the 4 screws of the second fan
4. Take of the second fan
WARNING: It is strictly forbidden to open the housing of the heat exchanger because of gas
proof!
Instrument
31.4 Heat Exchanger with Peltier Element
This heat exchanger module was designed to reduce the noise level of both fans.
To remove the Heat Exchanger module, use the following procedure:
1. Remove the bottom plate by removing 8 screws
2. To remove the heat exchanger 6 screws must be removed as shown in the following drawing.
The fans on both sides of heat exchanger must be cleaned with compressed air.
WARNING: Be careful that no dust gets into the instrument!
Instrument
- 30.15.2.12 Standby Control Check
31.5 Maintenance of Cell Counting Camera
1. Before the camera module is removed, the connector of the laser diode must be disconnected.
To get access to the camera module it is necessary to turn the instrument on its side to remove
the bottom plate.
2. As shown in the following drawing below, it is necessary to remove four screws to remove the
complete module.
3. The module is pinned and can be easily reinstalled.
4. The lens must be cleaned with compressed air (oil free).

5. After removing the camera module.
6. Reinstall in reverse order as shown in chapter 11.4.
7. Place the instrument back in the upright position.
WARNING: The use of controls or adjustments, or the performance of procedures other

than those specified herein may result in hazardous radiation exposure!
31.6 Maintenance of Cooling Module
1. For the maintanance of the cooling module drain the coolant (see chapter 25.11.7 Empty
Cooling System) and dispose the coolant liquid
2. Place the Spark next to an edge in order to have access to the condensation tub at the bottom.
3. Remove the condensate tub by removing the 6 screws
4. Clean the condensate tub (if available with disinfectant)
5. Reinstall the tub by following the above steps in reverse order.

6. Refill the coolant into the system
31.7 Wear Parts of the Injector
The drawing from above should give a understanding. Replace the parts according to the maintenance
checklist.
1. Remove the tubing connectors from the valves (VALVE XE 3 PORT 1/4 28)
2. Remove the two screws from the valves and replace them as well as the syringes.
3. Take the aspirating tubes (TUBING ASPIRATION INJECTOR) from the guides and replace them
4. Replace the injector (INJECTOR 2 NEEDLE LONG or INJECTOR 2 NEEDLE SHORT) including
the dispense tubing.
32 Troubleshooting
32.1 PC Power & USB port settings – Windows 10
In case the customer is doing long-term kinetics or measurements over an extended period of
time we recommend to check the USB power settings. Wrong power settings could cause time-
outs or steploss error of the plate transport.
Your PC may require administrator privileges to make these adjustments. If that is the case,
consult with an IT administrator at the customer.
1. Open Device Manager – Find it with the text “device manager” in the Windows Start menu
Search field.
2. In the Device Manager Window, Left click on “Universal Serial Bus controllers”.
3. As in the example above, for each and every item in the list of USB controllers, right click
and select “Properties” to reveal the various settings available for the controller.
4. As shown on the right, for every controller that has a Power Management settings tab, be
sure that the box for “Allow the computer to turn off this device to save power” is not
checked.
5. From the Windows Start menu search on the text “Power Options” and select the search
result “Power options”. This will take you to Control Panel ->Hardware and Sound ->
Power Options
6. The recommended plan is “High Performance”. Even if your current plan is Balanced or
something else, select the “Change plan settings” link.
7. For the “Put the computer to sleep/ Plugged in” setting, select Never
8. Then select “Change Advanced Power Settings”. Look for these settings in Advanced
settings. Not all PC’s have these settings. The screen shots below are examples and not
a comprehensive set of all views for the steps 9-12
9. For Hard disk: Turn off hard disk after:
Setting = 0
10. For Sleep

• Sleep after: Setting = Never
• Allow hybrid sleep: Setting = Off
• Hibernate after: Setting = Off
11. For USB Settings

USB selective suspend setting: Setting = Disabled
12. Power buttons and lid

Power button action: Setting = Shut down
13. Some PC operating systems will also have this option for
Control Panel\Hardware and Sound\Power Options\System Settings
Select: “Change settings that are currently unavailable
De-select “Turn on fast startup”
33 Technical Drawings
Index
Plate Carrier
C Transport Lock ................................................................ 39
Cleaning ................................................................ 484 Plate Control ............................................................ 53
Cleaning and Maintenance ...................................... 59 Power Requirements ......................................... 37, 40
Preventive Maintenance Plan ................................ 484
D
Disinfection R
Instrument ....................................................................... 59 Rear View ................................................................ 21
Procedure ....................................................................... 60
Recalibration ............................................................ 67
Safety Certificate ............................................................ 60
Disinfection Solutions .............................................. 60 Removal of Instrument’s Top Cover ........................ 68
Disposal S
Instrument ....................................................................... 61
Operating Material .......................................................... 61 Safety Certificate ..................................................... 60
Packaging Material ......................................................... 61 Safety Precautions .................................................. 15
Shaking.................................................................... 53
I Shipping the Instrument ........................................... 42
Incubating Position .................................................. 54 Smooth Mode .......................................................... 19
Instrument Spark-Stack ............... 18, 38, 330, 333, 335, 339, 341
Decontamination/Disinfection ......................................... 59 Specifications .......................................................... 58
Dimensions ..................................................................... 23
Spills ........................................................................ 59
Disinfection Procedure ................................................... 60
Disinfection Solutions ..................................................... 60 Subpackage............................................................. 37
Installation....................................................................... 36 Switching the Instrument On .................................... 40
Power Requirements ................................................ 37, 40 Syringe .................................................................. 258
Preparing for Shipping .................................................... 42 Syringe Components ............................................. 258
Safety Certificate ............................................................ 60
Specifications ................................................................. 58 Syringe Plunger ..................................................... 258
Switching On .................................................................. 40 Syringe Sizes ......................................................... 258
Intended Use ........................................................... 67
T
L Transport Locks
Lid Lifter ........................................................... 54, 255 Removal .......................................................................... 39
Liquid Spills ............................................................. 59 U
M Unpacking & Inspection ........................................... 36
Maintenance .......................................................... 484 User Profile .............................................................. 17
Instrument ....................................................................... 59
Yearly............................................................................ 484
V
Multifunctionality ...................................................... 17 valve ...................................................................... 258
Valve
O Drive .............................................................................. 258
Onboard Control Buttons ................................... 20, 43 Voltage Range ................................................... 37, 40
P Z
Packaging Material Z-Position ................................................................ 53
Disposal .......................................................................... 61
Returning ........................................................................ 61
Tecan Customer Support
If you have any questions or need technical support for your Tecan product, contact your local Tecan
Customer Support organization. Go to http://www.tecan.com/ for contact information.
Prior to contacting Tecan for product support, prepare the following information for the best possible
technical support (see name plate):
• Model name of your product
• Serial number (SN) of your product
• Software and software version (if applicable).
• Description of the problem and contact person
• Date and time when the problem occurred
• Steps that you have already taken to correct the problem
• Your contact information (phone number, fax number, e-mail address, etc.).

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4th

Technical Manual for

Document Part No.: 30089646

Area of Application – Intended Use

About the Technical Manual

NOTE: Gives helpful information.

WARNING: Indicates laser. Do not stare into the beam!

ATTENTION: Negative environmental impacts associated with the treatment of waste.

FOR CALIFORNIA RESIDENTS ONLY:

CE conformity marking Serial Number

Date of Manufacture Single use only

Manufacturer NRTL TÜV SÜD Mark

Catalog number USB Symbol

Consult Instructions for Use Use by date

China RoHS Symbol WEEE Symbol

CAUTION: To ensure the optimal operation of the SPARK, an annual maintenance

2.2 Intended Use (Hardware and Software)

CAUTION: A system validation by the operating authority is required. It is the responsibility

2.3.2 End User or Routine User

2.3.3 Service Technician

The Retract/Eject button allows microplates to be inserted or removed from the

2.7 Instrument LEDs

Figure 1: Rear view of the instrument

Example Name Plate

Instrument Side View

Heater/Stirrer - Side View

Heater/Stirrer - Top View

3.2 Installation Requirements for Spark

3.3 Unpacking & Inspection

3.4 Power Requirements

The instrument packaging includes the following items:

3.6 Options Packages

NOTE: A service engineer is required to install the Spark-Stack option.

CAUTION: Remove the transport lock before operating the instrument.

3.8 Power Requirements

3.9 Switching the Instrument On

WARNING: Do not reach into the instrument while it is in operation!

3.10 Switching the Instrument Off

1. Ensure that the plate transport is empty.

1 Main Power Switch

8. Tape the filter compartment doors shut (see picture below).

3.11.5 Packing the Injector Module

1. Insert the bottom foam into the cardboard box.

4. Finally insert the top foam

5. Close the top of the cardboard box and tape it shut.

4.4 Lid Lifter

CAUTION: The lid height must not exceed 11.5 mm.

Figure 3: Lid with magnetic pad mounted in the middle

• Move the plate transport out

Figure 4: Centering clamp for the RoboFlask Cell Culture Vessels

Operating humidity with active 20 % to 80 % (non-condensing)

Operating pressure 700-1050 hPa

7.2 Liquid Spills

7.3 Instrument Decontamination/Disinfection

WARNING: The disinfection procedure should be performed according to national,

WARNING: It is very important that the instrument is thoroughly disinfected before it is

CAUTION: The disinfection procedure should be performed by authorized trained personnel

7.3.2 Disinfection Procedure

7.3.3 Safety Certificate

CAUTION: Observe all federal, state and local environmental regulations.

FW_Mono FW_Mono FW*_Mono