2021 - An Insight Into Optical Metrology in Manufacturing
2021 - An Insight Into Optical Metrology in Manufacturing
2021 - An Insight Into Optical Metrology in Manufacturing
Technology
Topical Review
E-mail: [email protected]
Abstract
Optical metrology is one of the key technologies in today’s manufacturing industry. In this
article, we provide an insight into optical measurement technologies for precision positioning
and quality assessment in today’s manufacturing industry. First, some optical measurement
technologies for precision positioning are explained, mainly focusing on those with a multi-axis
positioning system composed of linear slides, often employed in machine tools or measuring
instruments. Some optical measurement technologies for the quality assessment of products are
then reviewed, focusing on technologies for form measurement of products with a large metric
structure, from a telescope mirror to a nanometric structure such as a semiconductor electrode.
Furthermore, we also review the state-of-the-art optical technique that has attracted attention in
recent years, optical coherence tomography for the non-destructive inspection of the internal
structures of a fabricated component, as well as super-resolution techniques for improving the
lateral resolution of optical imaging beyond the diffraction limit of light. This review article
provides insights into current and future technologies for optical measurement in the
manufacturing industry, which are expected to become even more important to meet the
industry’s continuing requirements for high-precision and high-efficiency machining.
Keywords: optical metrology, diffractometry, interferometry, deflectometry, scatterometry,
super-resolution, optical coherence tomography
measurement ranges, different surface characteristics, and dif- systems [15, 17, 18]. Optical methods such as classical inter-
ferent fields of application, the major optical measurement ferometry and deflectometry are the main solutions for this
technologies in the manufacturing industry can be classified requirement, due to their contactless, non-destructive and high
into two groups according to their main uses: those used for measurement-throughput characteristics. To date, much effort
precision positioning, and those used for the quality assess- has therefore been made to improve measurement accuracy
ment of products. while expanding the measurement range [19–22].
Optical measurement technologies for precision position- Another increasing demand for optical measurement tech-
ing are key technologies in state-of-the-art manufacturing pro- nologies in today’s manufacturing industry is in the eval-
cesses; for example, the fabrication process for semiconductor uation of micro- or nanometric structures. Conventionally,
products and/or optical components is supported by preci- such small features have been evaluated using scanning elec-
sion sensor technology with a sub-nanometric resolution [1]. tron microscopy (SEM) or atomic force microscopy (AFM)
Figure 1 summarizes the major optical measurement tech- [23–25]. However, due to their disadvantage of low meas-
nologies for precision positioning. They can be divided into urement throughputs, it is preferable to adopt a post-process
those used for the measurement of linear motion or displace- approach for optical measurement technologies capable of
ment, and those used for the measurement of angular motion contactless and non-destructive high-speed measurement in
or displacement. They can be further classified according to the manufacturing industry, where measurement throughput
their measurement principles, such as the speed of light, light is important for QC [3]. To date, much effort has been made to
wavelength, etc. Among these technologies, laser interfero- improve the lateral and vertical resolutions of microscopy, as
meters and optical linear encoders are two of the major sensor well as to realize in-situ automatic optical inspection (AOI).
types employed for precision positioning [4, 5]. By enhan- In addition, some state-of-the-art technologies referred to as
cing the characteristics of light, such as rectilinear propagation super-resolution (SR) techniques have been proposed to over-
and coherence, a sub-nanometric resolution over a measure- come the diffraction limit of optical imaging [26]. Another
ment range of more than several hundred mm can be realized method for overcoming the diffraction limit in optical met-
by these optical sensors. Meanwhile, in recent years, atten- rology is to employ optical scatterometry [7, 27] that meas-
tion has been given to reducing uncertainty in the positioning ures the statistical parameters of a surface under inspection.
of an object in three-dimensional (3D) space [1, 6]. For this This method is not a straightforward one and typically requires
purpose, planar/surface encoders capable of measuring multi- the solution of a complicated inverse problem, and also, the
axis displacement using a planar scale grating are attracting applicable targets are limited to periodic nanostructures. Nev-
attention [7, 8]. Another possible strategy for reducing posi- ertheless, optical scatterometry is finding application in crit-
tioning uncertainty is to reduce Abbe error by feedback com- ical dimension (CD) and overlay measurement in the semi-
pensation for the angular error motion of a positioning system conductor industry, due to its characteristics of being high
using an optical-angle sensor, such as an autocollimator. For throughput, non-destructive, and easy to use in setup.
this reason, some improvements have been made to conven- Furthermore, in recent years, with the advent of new pro-
tional autocollimators, including the employment of optical- cessing technologies such as additive manufacturing [8], the
frequency comb lasers [9–11]. manufacturing industry demand to realize the inspection of not
Optical measurement technologies for the quality assess- only the surface form but also the internal structures of a fab-
ment of products are also key technologies in state-of-the- ricated product has increased.
art manufacturing processes. Figure 2 summarizes the major In responding to the background described above, this
optical measurement technologies used for quality assessment article provides an insight into optical metrology for preci-
[12–14]. They can be divided into those used for the meas- sion positioning and quality assessment in today’s manufac-
urement of the surface form or texture of an object, and those turing industry. In section 2, some optical technologies for
used for the inspection of the internal structure of an object. precision positioning are treated, while mainly focusing on
In terms of the quality control (QC) of products, the import- those of a multi-axis positioning system composed of linear
ance of measuring the surface form or texture is well recog- slides, often employed in machine tools or measuring instru-
nized in today’s manufacturing industry [2, 15, 16]. The major ments in the precision manufacturing industry. We review
technologies for the measurement of surface form or texture high-precision optical displacement sensors and angle sensor
employed in the manufacturing industry are those based on far- technologies used for high-precision positioning, which are
field observation for the evaluation of the actual surface form indispensable for current high-precision machining, as well
or texture of an object. There are four major measuring techno- as application examples of multi-axis measurement. Recent
logies: triangulation, classical interferometry, scanning white technological development trends are also introduced, such as
light interferometry (often referred to as coherence scanning multi-axis optical-sensor technology with a grating reflector
interferometry (CSI)), and deflectometry. These technologies and absolute position-sensing technology that uses an optical-
each have their advantages and limitations in terms of their frequency comb-laser source. Furthermore, laser triangulation
measurement ranges, resolutions, and system sizes, and are sensors are also treated in this section, due to their import-
employed accordingly, based on the purpose (in-line or off- ance [28] in machine shops and factories, where instrument-
line) of the manufacturing process. In recent years, demand ation cost and ease of use in setup are critical issues. The
is increasing for rapid evaluation of large free-form surfaces, subsequent sections treat optical measurement technologies
which can be achieved with superior performance by optical used for quality assessment in today’s manufacturing industry,
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Figure 1. Major optical sensors used for precision positioning (the sensors underlined are treated in section 2).
Figure 2. Major optical measurement technologies for quality assessment (the items underlined are treated in sections 3, 4 and 5).
mainly focusing on technologies used for the form measure- 2. Optical sensor technologies
ment of products, from those with a large metric structure such
as telescope mirrors, to those with a nanometric structure such In the manufacturing industry, lengths and angles are import-
as semiconductor electrodes. In section 3, we treat classical ant physical quantities that determine the form of a fabric-
interferometry and deflectometry for the measurement of large ated component. Sensor technologies for measuring lengths
free-form surfaces, which have been especially in demand and angles are thus important to guarantee the quality of fab-
in recent years, while introducing the latest technologies for ricated products. Besides, optical sensor technologies are one
measuring the surface form of astronomical telescope primary of the key technologies for precision positioning in state-of-
mirrors. In section 4, we introduce the basic principles and the-art manufacturing processes [1]. Among the optical sensor
recent development trends of scanning white-light interfero- technologies developed so far, optical sensors such as laser
metry (SWLI) and scatterometry for the evaluation of micro-or interferometers, optical linear encoders and laser triangulation
nanostructures such as MEMS (microelectromechanical sys- sensors are the main ones often employed in today’s man-
tem) products, nanometric semiconductor electrodes, etc. Fur- ufacturing industry due to their high resolution, high meas-
thermore, in section 5, we address the increasing demands urement throughput, and easy-to-use setup. Table 1 summar-
for even higher resolution and the non-destructive inspec- izes the major optical sensors for length and displacement
tion of internal structures by providing overviews of optical measurements in the manufacturing industry. In particular,
coherence tomography and SR techniques, which are emer- laser interferometers and optical linear encoders are two major
ging measurement technologies in today’s manufacturing sensors employed for precision positioning, due to their high
industry. resolution, extending as far as the sub-nanometre scale [1, 5].
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Linear encoder • Micropattern structures on a scale are employed as graduations for measurement
• Absolute and incrementaltypes are available
• A sub-nanometric resolution over a range of 1 m
• Nanometric resolution
Confocal probe • Confocality of an optical system is employed to detect the distance between an object-
ive lens and a target
• Several tens of nanometers’ resolution over several tens of micrometers with a mode-
locked femtosecond laser source
• Sub-nanometric resolution
Time-of-flight distance • Speed of light is utilized to detect the distance between an optical head and a target
sensor • Sub-micrometer resolution over several hundred m for a femtosecond laser system
Laser triangulation • Detects the axial position of a target as the displacement of a reflected beam on a photo-
sensor detector
• Compact optical head, easy to use in machine shops and factories
• A sub-micrometric resolution over several tens of mm
Optic fiber sensor • Detects fiber deformation by observing the spectrum of transmitted light
• Can be employed to measure temperature and force by observing fiber deformation
• Nanometric resolution over several micrometers
∆f1 = 2vnair f1 2vnair f1 c0 − c0 . (2) environmental control is therefore required for accurate dis-
placement measurement.
Since the difference of the optical frequencies (f 1 –f 2 ) of
the two laser beams from the light source is known, being
a design parameter, the velocity v of the measurement mir- 2.1.2. Optical linear encoders. An optical linear encoder
ror can be obtained by detecting the optical frequency of the [34, 35, 50], which is another of the main optical sensors for
beat signal (f 1 + ∆f 1 –f 2 ). By integrating v with respect to precision positioning, measures the displacement of a scale
time, the displacement of the moving target can be detected. with respect to an optical reading head. Optical linear encoders
A sub-nanometric resolution has been achieved by these laser can be classified into the absolute type [35, 50, 51] and the
interferometers due to their enhancement with a signal inter- incremental type [34, 52]. In the absolute type of optical
polation technique. Also, due to the long working distance of encoder, a scale with a serial code structure such as an M-
the laser interferometer, multi-axis measurement can easily code [53, 54], which is unique over the measuring length of
be achieved by splitting the laser beam into sub-beams and the scale, provides absolute positional information. The abso-
preparing the corresponding multiple receivers. Nowadays, lute type has increased its market share in recent years due to
laser interferometers are widely employed in many applic- its cost, robustness, and high throughput when enhanced by
ations where ultra-precise positioning with feedback from a high-speed image sensor [1]. Meanwhile, most of the abso-
precision displacement sensors is mandatory [19, 44]. Fur- lute scales have an incremental track, which can be employed
thermore, some notable techniques have been developed to in the same manner as the incremental type, to achieve high-
carry out absolute distance measurement by employing mul- resolution position measurement. Figure 4 shows a schematic
tiple wavelengths simultaneously in parallel or in sequence, of the interferential scanning type of linear encoder, which is
or by continuously varying the wavelength [45–47]. Mean- an example of the incremental type. With the use of a scale
while, due to the large optical path difference (OPD) between that has an incremental track composed of equally-spaced
the reference arm and the measurement arm, a laser interfero- line-pattern structures, an interferential scanning-type linear
meter can easily be affected by the fluctuations of the refract- encoder can achieve a sub-nanometric resolution. A light ray
ive index of air, nair , induced by external disturbances such as from a light source is made incident to the scale at a right angle
temperature, humidity, and ambient pressure [48, 49]. Strict to generate diffracted beams, and the first-order diffracted
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can avoid the issues that arise from scale deformation due
to gravity.
The concept of a planar/surface encoder with multiple
measurement beams can also be extended to the measure-
ment of the rotary motion of an object. Figure 8 shows the
optical layout of the Z-θZ sensor [71]. In this setup, 2D sinus-
oidal micropattern structures fabricated on a cylindrical mov-
Figure 6. A surface encoder for the measurement of three-axis ing element by a fast tool servo technique [60] are read by
(XYZ) translational displacement. Reprinted from [58], copyright multiple laser measurement beams. Using a quadrant photo-
(2012), with permission from Elsevier. diode (QPD) with four active cells aligned in a matrix, Z-
directional translational motion and rotational motion about
the Z-axis can be detected simultaneously. It should be noted
that the influence of the form errors of the sinusoidal micro-
that simultaneous three-axis displacement measurement with pattern structures can be reduced by the averaging effect of
a sub-nanometric resolution can be carried out using XY grat- multiple measurement beams.
ings with a pitch of 1 µm [58].
The measurement range of a planar/surface encoder along
the primary axes (XY) is determined by the in-plane size of the 2.1.4. Laser triangulation sensors. Laser triangulation
scale XY grating. With the increase of wafer diameters in the sensors are often employed in industrial fields where fast
semiconductor industry, a measurement range of more than and contactless measurements with a resolution of less than a
500 mm × 500 mm in the primary axes is required for a posi- micrometre are required. Figure 9 shows two types of optical
tioning system. For this purpose, a scale XY grating larger than head for a laser triangulation sensor. The angle of incidence
500 mm × 500 mm is required; however, the fabrication of of the measuring laser beam should be selected based on the
such a large-scale XY grating costs too much. Furthermore, the surface reflectivity of the object under measurement. In the
deformation of a large-scale grating due to gravity could result case of measuring a mirror surface, an oblique incident angle
in a degradation of measurement accuracy. To address these is selected, as shown in figure 9(a). According to the geomet-
issues, the concept of the mosaic grating is introduced for a ric relationship of the setup, the target displacement, ∆d, can
planar/surface encoders [64]. Figure 7 shows a planar encoder be expressed by the following equation:
with a mosaic scale grating composed of several small-scale p
XY gratings aligned in a matrix. As can be seen in the figure, ∆d = ∆h′ cos β (4)
s
a group of optical heads arranged in a matrix for three-axis
displacement measurement is employed to read the in-plane where β is the angle of incidence of the measurement laser
displacement of the mosaic scale grating. Using a stitching beam for the target surface, p is the distance between the tar-
technique on the readings from the group of optical heads, the get surface and the lens, s is the distance between the lens
arrangements of the optical heads and the small-scale gratings and the detector plane, and ∆h′ is the spot displacement on
enable the planar/surface encoder to treat the small-scale XY a position-sensing detector. With the use of image sensors
gratings as a large-scale XY grating. A small-scale grating can such as charge-coupled devices (CCDs) or complementary
easily be fabricated, based on the perspectives of technology metal-oxide-semiconductors (CMOS) as the position-sensing
and cost [65–70]. Furthermore, the mosaic scale grating detectors, the measurement range of a commercial laser
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stationary in space, while the measurement beam is projected same manner as a linear encoder. An interferential scanning-
onto a target reflector capable of traveling along the measure- type rotary encoder, for which the principle of reading the grat-
ment beam’s axis. To obtain a reflected measurement beam ing patterns is almost the same as that of the linear encoder,
with a sufficient light intensity, a retroreflector is employed can carry out angular measurement with a high resolution over
as the target reflector. Pulse trains in the reflected measure- 360◦ . In the national measuring institute of Japan, an encoder
ment beam and those in the reflected reference beam are detec- system with multiple optical heads has achieved a resolution of
ted by a balanced cross-correlator using second-harmonic 0.0015 arc-second while assuring angle measurement accur-
generation (SHG) by a nonlinear optical crystal to obtain acy of ±0.03 arc-second over a range of 360◦ [87]. An optical
the absolute distance to the target reflector [81]. In the pro- rotary encoder can be employed in applications where the rota-
posed method, absolute distance measurement with a sub- tional axis of a measuring object is fixed in space. Therefore,
micrometre precision has been achieved at a working distance it is difficult to employ a rotary encoder in applications where
of 700 m. the working distance between an optical head and a disk scale
Figure 12 shows another example of the measurement of could be changed; for example, in the case of evaluating the
the absolute position of a target using a mode-locked femto- angular error motion of a table in a precision linear slide. In
second laser source in a chromatic confocal probe [83–86]. such a case, angular measurement can be carried out using
A mode-locked femtosecond laser beam from a fiber-based laser interferometers with multiple laser measuring beams if
laser source has a non-uniform spectrum; this characteristic an appropriate laser source and a sufficient number of photore-
of the laser source strongly affects the axial response curve ceivers are available [88, 89].
in a confocal probe for absolute position measurement. To
address this issue, a dual-detector configuration is employed
in the optical setup, as shown in figure 12. By obtaining two 2.2.1. Autocollimator. An alternative method for the cases
axial response curves with two fiber detectors in different con- where a rotary encoder cannot be applied is to employ an
focal setups, the influence of the non-uniform spectrum of the optical autocollimator [90–92]. In an autocollimator, by using
mode-locked femtosecond laser beam, as well as the influence a collimator objective (CO) with a long focal length, a high
of the surface reflectivity of the measurement target, can be resolution of better than 0.01 arc-second can be achieved. By
eliminated through a differential operation. With the enhance- employing a CCD or a CMOS image sensor, a wide meas-
ment of peak-detecting algorithms, absolute positional meas- urement range of over ±1◦ can also be achieved [91]. How-
urement with a resolution of 20 nm has been achieved [83]. ever, since the sensor’s sensitivity is in proportion to the focal
Table 2 summarizes the advantages and disadvantages of length of the CO [93], the size of the sensor tends to become
the optical length and displacement sensors treated in this larger as the sensor sensitivity increases. On the other hand,
section. a laser autocollimator, which is based on laser autocollima-
tion [94] and employs a monochromatic laser source, can be
designed to have a compact size while achieving a high resolu-
tion. Figure 13 shows a schematic of the optical setup of a two-
2.2. Optical angle sensor
axis laser autocollimator having a photodiode with four active
The main optical-angle sensors are summarized in table 3. cells (a QPD) as the photodetector [95]. The use of the pho-
A rotary encoder is one of the major optical-angle sensors todiode makes the sensor sensitivity independent of the focal
employed in manufacturing processes [1, 50]. In a rotary length of the CO [94, 95]. As a result, a compact optical angle
encoder, circumferential patterns on a disk scale’s surface sensor having a high resolution of more than 0.001 arc-second
are employed as the graduations for angle measurement and can be achieved [96]. Furthermore, the use of a multi-cell PD
are read by an optical head. Optical rotary encoders are also can offer a wide measurement range without sacrificing the
classified into the absolute type and the incremental type, in the resolution [97].
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Table 2. Advantages and disadvantages of the optical length and displacement sensors treated in this section.
Rotary encoder • Uses patterns on a disk scale surface as graduations for angular measurement
• Absolute and incremental types are available
• Measurement accuracy of up to ±0.03 arc-second over a measurement range of
360◦
• Can only be applied in cases having a fixed axis of rotation.
Autocollimator • Detects the displacement of a measurement beam reflected from a target sur-
face to measure angular displacement of the target
• Can be applied for in cases with no fixed axis of rotation.
• A high resolution of better than 0.001 arc-second is possible for the laser auto-
collimator
• A wide measurement range over 6◦ can be possible with the use of a mode-
locked femtosecond laser and a grating reflector
Fiber optic gyroscope • Detects the angular velocity of the setup based on the Sagnac effect
• Drift components in the angle reading are not suitable for use in manufacturing
processes
• Nanometric resolution
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Table 4. Advantages and disadvantages of the optical angle sensors treated in this section.
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The accuracy of microstructure measurement using SWLI 4.1.3. Technical advancements for in-situ SWLI. Three key
is affected by several types of inherent errors such as batwing factors can be identified for the successful application of
effects, ghost steps, field- and tilt-dependent dispersion and SWLI in manufacturing, especially for in-situ AOI; improve-
variances of surface optical properties. Leach summarized ment of lateral resolution, adaptability to various surface
the sources of errors in CSI [150]. The batwing effect is a light variances, and environmental-vibration-resistant capab-
well-known example that can be observed around a step dis- ility. Because of their significant effects on the measurement
continuity, especially for the case of measuring a step height accuracy and precision of SWLI, these factors have been ana-
less than the coherence length of a light source [151, 152]. lyzed and studied by many researchers, and significant tech-
The occurrence of the batwing effect shows a significant cor- nological advancements have been made to improve the per-
relation with the measurement parameters of SWLI; in gen- formance of in-situ SWLI.
eral, the shorter the wavelength, the narrower the batwing
size. The batwing effect diminishes when the measurement 4.1.3.1. Improvement of measurement resolution. With
depth exceeds 1 µm. Wyant first proposed a method com- microstructures further reduced in size to meet the increasing
bining phase-shifting and coherence-peak-sensing techniques packaging density of electronic or mechatronic products, the
to break the interval-slope limitation of λ/4 and to avoid the measurement resolution of SWLI becomes extremely crucial.
batwing problem [153]. de Groot further developed a strategy Kino and Chim [160, 161] first tried to resolve aberration
by analyzing the difference between the coherence scanning problems in the Mirau interferometer caused by the uneven
interferogram and the phase profile [154]. Meanwhile, another thickness of the beam splitter. The beam splitter in the Mirau
common error, the so-called ghost step, is regarded as a mis- designs was replaced by an 800 Å-thick silicon nitride film
classification of the fringe order attributed to dispersion. This with a uniformity of 10 Å [162]. The advantage of the correl-
usually occurs at high spatial frequencies where multiple scat- ation microscope lies in enabling phase measurement [163]
tering exists. This kind of error was reported in the measure- to achieve a higher measurement accuracy of up to 5 nm
ment of flat objects using SWLI [152, 155]. An algorithm using an objective with NA = 0.8. To achieve higher res-
was therefore proposed that combines the phase information olution in both the lateral and vertical directions, ultraviolet
and the envelope-calculation method [156] to eliminate the light was employed to enhance the optical diffraction limit.
ghost steps. Olszak [157] further presented a method meas- An optical element inside the interferometer was redesigned to
uring OPD changes from the collected interference fringes. work in the ultraviolet (UV) and deep-UV ranges [164–166].
The method was found to be effective in correcting the influ- The key element in the design is the use of nitrogen-rich
ences of scanning errors and slowly-varying vibrations. Sim- SiN membranes that are mechanically tough and UV trans-
ilarly, a dispersive effect associated with ghost steps can make parent past the 248 nm mercury line, making them best suited
CSI sensitive to surface gradients. Tilt-dependent dispersion, for a UV Mirau interferometer. The interferometry attach-
presented by Lehmann [151] in 2006, is often the cause of 2π ment that was developed was fixed to a microscope object-
errors in CSI measurements, even when the tilt is small com- ive with an NA = 0.9, with which the accuracy of SWLI
pared with the numerical aperture (NA) of a Mirau object- can reach 104 nm. To further enhance the lateral measure-
ive. This kind of error depends on the position of an object ment resolution, a Mirau-type interferometer with a confocal
in the field of view and affects the occurrence of batwing. slit in the illumination path was developed by combining con-
Leach [152, 155] also indicated that systematic errors exist focal microscopy and WLI [167]. When measuring a stand-
when the surface gradient is considerably smaller than the ard target with a pitch of 1.2 µm and a height of 190 nm
acceptance angle of the objective and the mean wavelength using the proposed slit integration, the measurement error
of the white light source. In contrast to regular batwing errors, attributed to the batwing effect can be avoided and the step
the presence of these phase jumps is systematically position- height can be measured and reconstructed more accurately.
dependent and generally increases in severity toward the edge Another technique proposed by Lyulko et al [168] for increas-
of the field of view. This effect also depends strongly on the ing the lateral resolution of the Mirau interferometer involved
polarity of the discontinuity, and the dispersive batwing effect developing an immersion Mirau interferometer to increase the
causes errors in step height measurement. To overcome these NA. Moreover, simultaneous immersion Mirau interferometry
major errors, a dual-wavelength CSI microscope using two (SIMI), which facilitates the simultaneous acquisition of all
LEDs [158] was developed to obtain an accurate surface depth interferograms and eliminates the effects of vibration, was
at the position where ghost steps appeared or surface discon- developed to achieve 3D one-shot imaging with improved
tinuities such as step heights occurred. Apart from these com- lateral resolution [169]. Polarization Mirau interferometry
mon errors, the optical properties of the surface to be meas- makes it possible to image live cells in a medium without
ured are another important uncertainty source in SWLI. This coverslips. To further enhance the lateral resolution to less
type of error commonly occurs when the measured surface is than 100 nm (the definition of nanoscopy), many attempts to
made of materials exhibiting different phase changes on reflec- achieve optical SR have been made in the last two decades
tion or multi-reflection issues [159]. Continuous efforts have [26, 170–182].
been made to minimize these potential errors in SWLI so that In addition to the existing methods illustrated in figure 32,
the measurement performance can be enhanced to satisfy even some unconventional sub-diffraction-limit imaging methods
higher manufacturing demands. have been developed to improve the resolution from the
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Figure 32. Existing technologies for resolution enhancement: far and near fields.
microscale to the nanoscale. Fluorescence-based methods, field, induced by the super-resonance effect (SRE), can be
such as stimulated emission depletion (STED), stochastic picked up and transformed into propagating waves in the far
optical reconstruction (STORM), photoactivated localization field, so that an FWHM spot of up to 0.22λ can be generated.
(PALM), acoustic micro imaging (AMI), reversible satur- Although some breakthroughs have been achieved in near-
able optical fluorescence transitions (RESOLFT) and ground field imaging, these developments nonetheless require that the
state depletion (GSD), have greatly enhanced the resolution objective must be located within an air- or liquid-filled gap of
to a scale of fewtenths of a nanometre [26, 172–174, 183– 100–200 nm from the tested surface. Such a working distance
185]. Model-based reconstruction methods have also been is too short and may not be feasible for many applications,
developed and their feasibility has been demonstrated [183, especially for in-situ manufacturing scenarios. The advantages
184]. However, the development of far-field non-fluorescence of these methods are the achievement of full-field, label-free,
imaging microscopy has faced a problem with restricted dif- contactless and non-destructive imaging for AOI. Apart from
fraction limits and still requires technological breakthroughs. SWLI, this imaging principle has extensive applications, such
Near-field imaging methods, including near scanning optical as confocal microscopy, endoscopy and differential interfer-
microscopy (SNOM), superlenses, hyperlenses, metamateri- ometric contrast (DIC). However, the technical breakthrough
als, and microsphere-assisted microscopy have shown effect- for adaptation to in-situ AOI will involve resolving the short
iveness in achieving nanoscale resolution [177–179, 185– working distance of the objective, since far-field imaging is
189]. A time-efficient 3D SR microscopy method involving definitely essential.
near-field-assisted WLI was proposed using the near-field ima-
ging concept to achieve lateral near-field imaging through a
microspherical superlens [186, 190]. Another microspherical 4.1.3.2. Surface light variances. The accuracy of surface-
superlens was proved to be effective in transforming near- profile reconstruction is determined by the contrast of the
field evanescent waves into far-field transmitting waves with interferogram and the coherence length of the light source.
an imaging lateral resolution of 50 nm and a vertical resol- A difference in intensity between the reference arm and the
ution of 10 nm [191]. Microsphere-assisted WLI microscopy object arm is one of the major limitations of SWLI. This lim-
makes it possible to reach a lateral resolution of a few hundreds itation makes it difficult to measure objects with low sur-
of nm [188]. In addition to the microsphere-assisted principle, face reflectivities such as biological samples or highly scat-
nanoparticle-based metamaterial imaging is also an import- tering surfaces, in which the light reflected from the object
ant emerging method for achieving SR [189]. A propagating is much weaker than that reflected from the reference mir-
incident wave can be scattered by a layer of densely packed ror [159]. In the literature, the concept of polarization-based
dielectric nanoparticles with a diameter of 15 nm as a medium, Mirau interferometry was first introduced by Massig [187]
in which a large nanoscale evanescent-wave illuminating array in 1992, for detecting changes in the distance of a small
15 nm in size can be generated. When a dielectric microsphere reflective measurement surface. Stankewitz then developed
with a diameter range larger than the light wavelength or 1– a variable epi-illumination interference probe, in which the
50 µm is positioned close to an object under test (with an interferometer was equipped with a variable beam split-
air or liquid gap of 100–200 nm), the photons of the near ter with different reflection and transmission ratios [192].
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Figure 36. 3D map and cross-sectional profile of a printed circuit board (PCB) bump measured using (a) an OPMI and (b) conventional
WLI [159].
Apart from the issue of light imbalance mentioned above, using multi-sensors, a frequency shifter, or an acousto-optic
measuring an optically rough surface using WLI does not modulator (AOM) for accurate detection of vibration-induced
guarantee the resolution of the lateral structure of the tested shifted error for phase compensation [219–221]. However, the
surface because the height difference of neighbouring pixels frequency-shifting modulation developed is only applicable to
may exceed the phase ambiguity limit of λ/4 [196, 197]. point measurement and not for full-field imaging.
Moreover, because the measurement errors of WLI are lim- To address vibration in SWLI, phase-shifted errors were
ited by a random shift of individual interference patterns, an corrected using a reference interferometer [216, 217], in which
effective strategy was developed to reduce the measurement the nonlinearity of the PZT was corrected to reduce meas-
uncertainty of WLI by sequentially switching the direction of urement uncertainty. Similarly, using wavelength scanning
illumination [198]. In summary, the measurement uncertainty interferometry, another method was developed to compensate
of SWLI becomes extremely crucial as in-situ AOI faces even for environmental noise in vibration detection and compens-
stricter measurement tolerance requirements. The allowable ation [218]. The main limitation faced by these methods is
measurement uncertainty of SWLI is often only a few nano- an insufficient bandwidth for vibration detection and com-
metres at ±3σ with a confidence level of 99.7%. An effective pensation. To resolve this, Chen [143, 219–221] proposed a
reduction of the measurement uncertainty can be achieved by dual-sensing optical configuration (shown in figure 37) to pre-
controlling and manipulating the surface light variances which cisely detect the vibration displacement of the Mirau objective
may occur in SWLI. and developed an active fringe-locking strategy to immobilize
low-coherence interferograms with a high bandwidth capable
4.1.3.3. Vibration-resistant capability. In-situ SWLI faces of suppressing various environmental vibrations with a fre-
many measurement error sources such as environmental quency up to a few hundreds of Hz. The method developed for
ground or mechanical vibrations, acoustic disturbances, and vibration-induced phase correction was proved effective by an
nonlinearity of the PZT used for axial scanning [143]. improvement of more than six times and a response bandwidth
Although the general strategy is to perform SWLI on a up to several 100 Hz can be realized by developing a real-
vibration-isolation table to minimize vibration, there exist time embedded controller. As well as active feedback com-
unavoidable and undesirable vibrations in an uncontrollable pensation in SWLI for vibration minimization, passive vibra-
shop floor situation with air disturbance coming from an air tion compensation in SWLI was also proposed [222, 223].
conditioner and machine acoustic noises as well as human The advantage of these methods is that no additional active
voices. To resolve this critical issue, some in-situ techniques compensation-system hardware is required. The basic prin-
and strategies have been developed, such as active vibra- ciple is to detect the precise position of the interferometer
tion isolation using a fringe locking mechanism, shorten- with respect to the measuring object to compensate for phase
ing measurement time, and performing simultaneous PSI, errors caused by environmental vibrations or scanner nonlin-
[199–215]. Early research was devoted to active feedback earities. Another strategy is to use the shape information of
in laser interferometry, either by using adaptable wavelength tested objects for vibration compensation [223]. However, in
modulation [201, 212–215] or active control of the reference most cases, the shape information cannot be precisely pre-
arm [202–207]. Some strategies using active feedback con- determined. More recently, SWLI with in-situ vibration com-
trol of low coherent phase-shifting were also applied to bio- pensation was reported for shop-floor depth measurements in a
medical testing [216–218], with some effectiveness shown deep reactive ion etcher [224]. Vibration-compensated SWLI
in measurement error correction. Meanwhile, phase-shifted has thus been demonstrated to be essential for in-situ AOI and
errors caused by undesirable vibration in PSI were reduced other applications in various fields.
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
In comparison with image-based metrology tech- it from the 2-θ scatterometer, we call this type of angu-
niques, which normally allow for the direct determination lar scatterometer a scattering-angle-resolved scatterometer
of dimensional information from the best-focus images (The 2-θ scatterometer can be regarded as an incidence-
acquired,measurement in optical scatterometry is not a ‘what angle-resolved scatterometer). To ensure that there is enough
you see is what you get’ (WYSIWYG) (process, but involves scattering information available for accurate profile recon-
the solution of a complicated inverse-scattering problem. Nev- struction of short-pitch structures, light sources with short
ertheless, optical scatterometry is not restricted by the Abbe illumination wavelengths, such as an extreme ultraviolet
diffraction limit that is encountered in image-based metro- (EUV) light source [236–239] or an x-ray light source
logy techniques. Due to its high-throughput, non-destructive, [240–243], can be employed in scattering-angle-resolved
and ease of in-line integration merits, optical scatterometry scatterometers.
is widely used in the measurement of CDs and overlays in
semiconductor manufacturing [226–231].
In this section, we will give a brief review of optical scat- 4.2.1.2. Spectroscopic scatterometers. Compared with
terometry, with an emphasis on the two main steps involved in angular scatterometers, as shown in figure 37(c), spectro-
its implementation. scopic scatterometers usually adopt broadband light sources.
Similar to the 2-θ scatterometer, most of the spectroscopic
scatterometers collect the reflected (or transmitted) zeroth-
4.2.1. Scatterometric setups. Considering a periodic struc-
order diffracted beam. Also, according to equation (7), the
ture such as a grating, its optical response is governed by the
structure will separate white light from the broadband light
well-known grating equation:
source into a spectrum with different propagating directions at
λ higher diffraction orders. However, all wavelengths from the
sin θi + sin θm = m , (7)
Λ white light propagate in the same direction at the zeroth-order
diffraction, which thus facilitates signal detection. A spectro-
where θi is the incidence angle, θm is the scattering (diffrac-
graph is usually required in the spectroscopic scatterometer to
tion) angle associated with the m-th diffraction order (m = 0,
acquire spectral information from the zeroth-order diffracted
±1, ±2, …), λ is the wavelength of the incident light, and Λ
beam.
is the period (pitch) of the structure. There are many different
The ellipsometric scatterometer is a typical type of spectro-
types of scatterometric setups that can be used to collect the
scopic scatterometer,as shown in figure 39(d), which applies
diffraction information of the structure under test. As shown in
spectroscopic ellipsometry (SE) to the measurement of peri-
figure 39, these scatterometric setups, according to the incid-
odic nanostructures. Ellipsometry is an optical measurement
ence angle θi , the scattering angle θm , and the wavelength of
technique that characterizes thin films (by, for example, film
incident light λ, can be basically categorized into the angular
thickness and optical constants) based on the change in polar-
scatterometer and the spectroscopic scatterometer [7, 27, 225].
ized light before and after the light is reflected (or transmit-
ted) by a sample [244, 245]. Around the year 2000 [246, 247],
4.2.1.1. Angular scatterometers. The 2-θ scatterometer is a ellipsometry was introduced to the measurement of CDs of
typical angular scatterometer which was proposed by McNeil grating structures. As shown in figure 39(d), a polarization
and Naqvi et al for the measurement of short-pitch structures state generator (PSG) and a polarization state analyzer (PSA)
[232, 233]. In the 2-θ scatterometer, as shown in figure 39(a), are usually mounted in the light input and output paths of an
a monochromatic light source, such as a He-Ne laser source ellipsometric scatterometer, respectively. The PSG and PSA
(λ = 632.8 nm), is incident upon a structure under test with are both comprised of polarization components, such as polar-
an incidence angle of θi , and the reflectance or transmit- izers and retarders, which are respectively used to modulate
tance are acquired by scanning the incidence and the corres- and demodulate the polarization states of reflected (or trans-
ponding zeroth-order diffraction angles. There are two main mitted) light beams.
reasons for onlycollecting the zeroth-order diffracted beam The conventional spectroscopic ellipsometer typically
(m = 0 in equation (7). First, the zeroth-order diffracted measures two ellipsometric angles, Ψ (the amplitude ratio) and
beam usually has a larger intensity than higher-order diffrac- ∆ (the phase difference), and is most suitable for characteriz-
ted beams, which thus provides a higher signal-to-noise ratio ing isotropic samples. For anisotropic samples and/or if the
in the measurement. Second, the zeroth-order diffracted beam measurement process contains depolarization, it is necessary
always exists, irrespective of the ratio of λ/Λ and θi accord- to use Mueller matrix ellipsometry (MME), which provides
ing to equation (7). A variant of the 2-θ scatterometer is the up to 16 elements of a 4 × 4 Mueller matrix. Due to the rich
so-called optical Fourier transform scatterometer [234, 235], information contained in the Mueller matrix, Mueller matrix
which employs a high NA objective to measure the reflectance ellipsometric scatterometry (also known as MME-based scat-
for all incident angles simultaneously without any mechanical terometry or Mueller matrix scatterometry) has demonstrated
movement. great potential for the accurate measurement of CDs and over-
In another type of angular scatterometer, shown in lays in semiconductor manufacturing [248–254].
figure 39(b), the detector is scanned or an area array detector Table 5 presents an overview of scatterometry tech-
(e.g. a CCD camera) is used to record the intensities asso- niques. Although we categorize the scatterometry techniques
ciated with different scattering angles θm . To distinguish into angular scatterometry and spectroscopic scatterometry,
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Figure 39. Schematic of different scatterometric setups. (a) and (b) Angular scatterometers; (c) and (d) Spectroscopic scatterometers.
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Angular scat- • Since a single wavelength is used, no • Contain moving components for
terometry assumption about dielectric functions 2-θ scatterometry as well as some
of the sample materials is required for scattering-angle-resolved scattero-
data analysis metry techniques using goniometers,
• Structural pitch can be measured which limit the measurement speed
simultaneously for scattering-angle- • Significant experimental setup
resolved scatterometry required, especially for scattering-
• Relatively easy to extend to short- angle-resolved scatterometry
wavelength ranges, such as EUV and
x-ray
Spectroscopic • Measurement can be very fast, espe- • Need to pre-determine optical con-
scatterometry cially for spectroscopic-reflectometry stants of sample materials in a broad
based scatterometry spectral range
• Very high vertical resolution (sub-nm) • Need achromatic optical components
for ellipsometric scatterometry and detectors with broad spectral
• More measurement information can responsivity
be acquired, especially for MME- • Need delicate calibrations for accur-
based scatterometry, which is bene- ate measurement, especially in ellip-
ficial for parameter decorrelation in sometric scatterometry
data analysis
Kogelnik presented an embryonic form of RCWA in 1969 4.2.2.3. Inverse problem solution. Assume that the struc-
for the calculation of the diffraction efficiencies of thick holo- tural parameters being measured are represented as an M-
gram gratings [266]. Moharam and Gaylord first formulated dimensional vector x = [x1 ,x2 ,…,xM ]T , where the superscript
RCWA for planar gratings [267–269] and then extended it to ‘T’ denotes a matrix (or vector) transpose and xi (i = 1,2,…,N)
surface-relief gratings [270, 271] and 2D gratings [272]. The correspond to the parameters used to describe the paramet-
RCWA method then received extensive attention and research. erized structural profile as illustrated in section 4.2.2.1. The
In the development of the RCWA method, two issues per- measured signature is given by an N-dimensional vector as y
plexed researchers for a long time. One was the slow con- = [y1 ,y2 ,…,yN ]T , where yk (k = 1,2,…,N) can be, in terms of
vergence rate for TM polarization of metallic gratings [271], reflectance (or transmittance), ellipsometric angles, Mueller
and the other was the poor stability of the calculation of deep matrix elements, etc., collected by the above scatterometric
surface-relief or multi-layer gratings [270]. setups at different wavelengths and/or different incident (or
Lalanne [273] and Granet [274] et al found in 1996 that scattering) angles. The corresponding theoretical signature
the convergence rate for metallic gratings in TM polariza- calculated by RCWA for any structural parameter vector x
tion can be dramatically improved by reformulating the eigen- is given by F(x) = [f 1 (x),f 2 (x),…,f N (x)]T . The χ2 function
value problem of the RCWA method. However, the underly- in statistics is usually used to estimate the matching (fitting
ing cause remained unclear to them. Li subsequently found error) between the measured and simulated signatures, which
that the poor convergence for metallic gratings in TM polar- is defined by
ization was caused by an incorrect treatment of permittivity
in the truncated Fourier space, and further presented the Four- ∑
N
2
χ2 = wk [yk − fk (x)] = [y − F(x)]T W[y − F(x)], (8)
ier factorization rules for obtaining faster convergence [275].
k =1
Li’s factorization rules can easily be applied to 1D gratings,
but applying them to 2D gratings is more complicated, since where wk are the weighting factors, which are usually chosen
the decomposition of the electric field into parallel and per- to be the inverse of the variances of the measured signature
pendicular components is less obvious for 2D gratings. σ 2 (yk ) i.e. wk = 1/σ 2 (yk ), and W is an N × N diagonal weight-
To improve the convergence rate for the 2D case, in 1997 ing matrix with the diagonal elements wk . With the above
Lalanne presented a new formulation of the RCWA method by notations, the inverse problem in optical scatterometry can be
introducing a free parameter α to weigh the relative strengths mathematically formulated as a least-squares regression prob-
of the Fourier transformed matrices of the permittivity and lem such that
the inverse of the permittivity [276]. However, it is notice- { }
T
able that the free parameter α can be easily determined for 2D x̂ = arg min [y − F(x)] W[y − F(x)] , (9)
x∈Ω
rectangular gratings, but it is hard to determine for 2D grat-
ings with complex contours. At the same time, Li proposed where x̂ is the expected solution of the inverse problem and Ω
the discretization of the original grating contour by zigzag is the parameter domain.
contours that satisfy Li’s factorization rules [277]. Schuster Many methods can be used for solving equation (9),
et al introduced a normal vector method [278] that fulfills which can overall be categorized into the nonlinear regression
Li’s rules by combining the classical RCWA with Popov method and the library search method [284]. As schematic-
and Nevière’s formulation of the differential method [279]. ally illustrated in figure 42, the nonlinear regression method
However, the normal vector method requires a normal vec- iteratively adjusts the structural parameter vector x using
tor field that relies on structural geometry and does not apply some optimization algorithms [285, 286], such as the Gauss–
to arbitrary structures. Götz et al extended the normal vector Newton algorithm and the Levenberg–Marquardt algorithm,
method with automated vector field generation for arbitrary until the simulated signature F(x) best matches the measured
structures [280]. signature y. In the library search method, a library of simulated
The poor stability in the calculation of deep surface- signatures is constructed first, and then the signature library is
relief or multi-layer gratings was due to the accumulation of searched to find a best-match signature for the measured sig-
numerical errors generated in the solution of the eigenvalue nature. The structural parameter vector that corresponds to the
problem associated with each slice or each layer. Moharam best-match simulated signature in both the nonlinear regres-
et al introduced an enhanced transmittance matrix (T-matrix) sion method and the library search method is taken to be the
approach that was shown to produce numerically stable res- solution of the inverse problem.
ults for deep multilevel surface-relief dielectric gratings [265]. Table 6 presents a comparison between the nonlinear
Li systematically presented two recursive and numerically regression method and the library search method. The non-
stable algorithms, the S-matrix algorithm and the R-matrix linear regression method can achieve an accurate solution,
algorithm, for modeling multi-layered diffraction gratings provided that the structural parameter vector x is assigned an
[281]. It was also demonstrated that the S-matrix algorithm is appropriate initial value during the iteration. Since the solution
preferable to the R-matrix algorithm in terms of numerical effi- in the nonlinear regression method is achieved by an iterative
ciency. Tan proposed an enhanced S-matrix algorithm [282] approach and the RCWA calculation needs to be performed
and an enhanced R-matrix algorithm [283] to further improve for each iteration, the nonlinear regression method is typically
the numerical efficiency of the original S-matrix and R-matrix time-consuming, especially for 2D periodic structures. There-
algorithms, respectively. fore, the nonlinear regression method is not suited for inline
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
4.2.3. Future trends. With the development of advanced 5.1.1. Time-domain OCT (TD-OCT). The first OCT to be
photolithography processes and techniques such as multiple- developed was time-domain OCT (TD-OCT) [301, 302]. A
patterning, directed self-assembly, and EUV lithography, basic time-domain OCT configuration is shown in figure 43.
very-large-scale integrated circuits (ICs) have broken through A typical setup for time-domain OCT is composed of a low-
to the 7 nm process and are expected to continue towards coherence light source, a beam splitter, a reference mirror, an
a 1 nm process [289]. To guarantee the performances of IC objective lens, a 2D scanning stage (lateral stage), a 1D scan-
devices with ever-decreasing feature sizes, logic devices have ning stage (axial stage) and a point detector. The reference mir-
transitted from scaling-driven planar devices (e.g. comple- ror is mounted on the axial stage so that the OPD between the
mentary metal-oxide semiconductors) to 3D transistor archi- two reflected light beams can be changed to generate intens-
tectures (e.g. fin field-effect transistors). Meanwhile, memory ity modulation in the interference signal that is detected by the
devices have also transitted from NAND floating gates to point detector. The interference light intensity reaches its max-
3D multi-layer stacked NAND architectures. State-of-the-art imum value when the OPD is zero, since a low-coherence light
optical scatterometry at the near-atomic scale faces severe source is employed in the setup. The refractive index distribu-
challenges of insufficient sensitivity and terrible parameter tion in the specimen along the axial direction can be measured
correlation [290, 291]. by scanning the specimen in the axial direction while monit-
In response to these challenges, future trends for oring the light intensity with the point detector. To obtain a 3D
optical scatterometry include the extension of illumination image of the refractive index distribution of the specimen, it is
wavelengths to short or ultra-short ranges, such as EUV necessary to scan the lateral stage in the X and Y directions.
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Library search • Well suited for inline applications • Need to construct a signature library
• Can guarantee a global solution prior to measurement
• Need interpolation to achieve a more
accurate solution
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
5.1.4. Industrial applications of OCT. Although OCT was fiber-reinforced plastics (FRP) is another example where non-
developed for biological imaging, several proposals and destructive inspection is required. Carbon-fiber-reinforced
examples of industrial applications have been reported so far. plastics (CFRP) are a kind of FRP that is widely employed
The following is an overview of the relevant papers. in industrial products such as aircraft, automobiles and ships
Non-destructive inspection technology is useful for post- due to their low weight and high strength. However, wrinkle
process QC in production manufacturing. One of the most defects caused by high shear deformation can reduce the com-
common examples is the defect inspection of laminated struc- pressive strength of CFRP [312]. Several trials have therefore
tures such as color filters and polarizers in the liquid crys- been made to apply spectral-domain OCT to the defect inspec-
tal display (LCD) industry [311], where defects in a product tion of FRPs [313, 314].
can be stochastically generated during the manufacturing pro- The compact setup of optical-coherence tomography
cess. Kim et al proposed an inspection method using spectral- enables it to be applied for on-machine measurement. Holder
domain OCT, and demonstrated its effectiveness for the fast et al demonstrated the on-machine measurement of fiber ori-
evaluation of a large LCD [311]. Inspection of defects in entation in laser-ablated CFRP [315]. OCT can also be applied
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Spectral-domain • Obtains depth information from a Fourier transform of the spectra obtained by
OCT a spectrometer
• Axial scanning is not required
• A typical axial resolution is several mm
• Measurement speed at each point is low due to the frame rate of the sensor in
the spectrometer (typically kHz or lower)
• Measurement apparatus is relatively large
∗
Lateral scanning is required
Swept-source • Obtains depth information from a Fourier transform of the spectra obtained by
OCT a swept source
• Extremely high-speed measurement (typically MHz)
• Axial scanning is not required
• A typical axial resolution is 10 mm
• Lateral scanning is required
Full-field OCT • Obtains depth information and 2D images from 2D detectors (Measurement
speed of several tens of Hz)
• OCT with no mechanical scanning is available in combination with swept
sources
• Axial resolution depends on the combined OCT type
• Relatively expensive
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Near-field • Evanescent wave of high-frequency spatial information smaller than the incid-
super-resolution ent wave on the surface is detected.
• Near-field evanescent wave is bridged to far field for detection by inducing a
small probe into the near-field area.
• Tens of nanometre resolution can be achieved.
• Near-field region evanescent wave dependence limits its use to near-surface
features only
Pupil-filtering • Pupil filter for beam shaping enables a main-lobe diameter smaller than the
confocal super- diffraction limit for a lateral super-resolution.
resolution • Confocal approach compensates for the reduced axial resolution by using an
optical-sectioning technique with a pinhole.
• A lateral resolution better than one-third of the incident wavelength can be
achieved. It is difficult to improve it further.
Spatially pat- • Pattern with sub-diffraction-limit features is excited to surface for beating with
terned super- comparable small-scale information.
resolution • Multiple lowered beating frequency images involving the small-scale informa-
tion are then reconstructed for a super-resolution image.
• A resolution better than 100 nm can be achieved; the frequency spectrum of the
excitation pattern affects the super-resolution ability.
• A saturated structured illumination pattern with more frequencies can further
improve the resolution, but the saturation may damage some samples.
Micro-object- • Photonic nanojets (PNJs) with a width of around 0.5 ± 0.2λ are generated by
based super- some micro-objects.
resolution • PNJs enhance visible light backscattering so that smaller features can be
observed in a far field by an ordinary microscope.
• A resolution of between λ/8 and λ/14 at the far field has been achieved.
• Observed results from the microscope need to be further calculated using the
calibrated magnitude of the specific micro-object.
in three dimensions can be achieved. A prototype instrument limits the applications of near-field microscopy. Far-field high-
has achieved lateral and axial resolutions of 200 nm and resolution imaging techniques are thus required in applications
80 nm, respectively, under conditions with a light wavelength where near-field microscopy cannot be applied.
of 633 nm and a probe tip radius of 1 µm. A further study has
demonstrated a lateral resolution of 10 nm with an enhance-
ment to the effective sharpness of the tip [341]. 5.2.2. Pupil-filtering confocal SR imaging. Aiming to
A further improvement of the spatial resolution, down to an improve the lateral resolution of optical imaging, in 1952, di
atomic level, can be realized by the notable probe techniques Francia introduced a method of employing a pupil filter in an
such as the hole-less tetrahedral tip probe, a local magnetic optical imaging system [346]. With the help of an annular illu-
field interferometric aperture-less scanning probe, and so on mination [347] with a pupil filter, as shown in figure 47(a),
[342, 343]. However, due to the rapid decrease in light intens- the diameter of a main lobe can be reduced beyond the dif-
ity with the miniaturization of the fiber probe, the lateral res- fraction limit [348]. Since pupil-filter techniques enable the
olution was limited to several tens of nm. For the evaluation of imaging system to modify the relationship between the amp-
fine semiconductor patterns with a half pitch of 20 nm, a sharp litude and the phase in both the zeroth- and first-order diffrac-
metal probe has been proposed to enhance the optical perform- ted beams, the lateral resolution of an imaging system can be
ance, and a residual layer thickness of 10 nm of nanoimprint improved by optimizing the design parameters of a pupil filter.
lithography has been achieved [344]. It should be noted that a small main lobe can reduce the light
With the rapid development of key technologies in NSOM, intensity, resulting in the degradation of image quality. This
such as probe–sample distance control and the above- issue can be addressed by employing a pinhole in the imaging
mentioned sensing techniques, a commercial NSOM can system, as shown in figure 47(b) [348, 349]; the influences of
provide a competent performance with some state-of-the-art the side-lobes generated by the pupil filter can be reduced with
prototypes; for example, a commercial scattering-type NSOM the enhancement due to the optical sectioning effect in a con-
can provide a spatial resolution of 10 nm [345]. Meanwhile, ventional confocal setup [350–352]. A high lateral resolution
although NSOM has demonstrated its ability in SR imaging, of better than 0.2 µm was achieved under the conditions of
a short near-field region on the order of tens of nanometres λ = 632.8 nm and NA = 0.85 by an imaging system with a
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Meas. Sci. Technol. 32 (2021) 042003 Topical Review
bipolar absolute-differential confocal setup having a shaped PNJ enhancement have been carried out, based on geomet-
annular illumination [349]. ric optics and Mie theory, as well as angular spectrum and
Also, a small focused spot having a long depth of focus was analysis [359].
generated with a radially polarized light whose polarization As well as the theoretical studies, experimental investig-
modulation was controlled by a phase plate having three con- ations have also been carried out to verify the feasibility of
centric regions [353]. With the enhancement of the tight focus- micro-object-based SR microscopy. An early study has been
ing characteristics of a radially polarized illumination with a conducted to show its feasibility in both transmission and
high NA objective as well as the pupil filtering technique in reflection modes with a far-field resolution between λ/8 and
a confocal setup, SR imaging with a lateral resolution beyond λ/14 as shown in figures 49(c) and (d) [329, 360, 361]. Using
the diffraction limit has been realized [348]. a micro-sphere with a diameter of 3 µm, Ferrand verified the
size of a PNJ to be 270 nm at FWHM at a wavelength of
520 nm [362]. Ju employed a self-assembled micro-sphere
5.2.3. Spatially patterned SR. To obtain a resolution bey- to generate remarkably short near-field focal lengths [363].
ond the diffraction limit, some approaches employing spa- From these results, micro-sphere-based SR microscopy is
tially patterned illumination or patterned excitation have been expected to be a viable alternative microscopy technique for
developed. These approaches include so-called structured bioimaging, near-field lithography, optical nanosensing, and
illumination microscopy (SIM), saturated SIM, as well as so on.
stimulated emission depletion (STED). In the following, the In table 9, the characteristics of each of the SR techniques
structured illumination microscope often employed in manu- treated in this section are summarized.
facturing applications is reviewed [354, 355].
Figure 48 shows a schematic of the structured illumina-
tion microscope, where a patterned standing wave structure
is projected onto an object as the illumination field [356]. The 6. Conclusions
spatial frequency of the illumination pattern enables the high-
spatial-frequency components of the object to be shifted to a In this paper, an insight into optical metrology in manu-
lower-frequency region. An image of the object under inspec- facturing has been provided. Today, highly sensitive optical
tion can be reconstructed at a high resolution by obtaining sensors with a sub-nanometer resolution are employed in man-
several images with illumination fields that have different ufacturing processes for precision positioning, as well as in
spatial frequencies and different pattern structures. A pat- post processing for form measurement of a fabricated product
terned illumination field can be obtained from the interference for QC. Some state-of-the-art setups for multi-axis measure-
between several incident beams. With the use of such periodic ment with multiple optical sensors and also a planar/surface
patterned illumination with a sinusoidal intensity modulation, encoder that has planar scale gratings, have been presented.
a moire image with a much lower spatial frequency than that Advances have also been made in optical form interfero-
of the structure of the object under inspection can be captured metry and deflectometry, and until now, many applications
by the microscope. By obtaining several more images while have been developed to evaluate precision optical compon-
scanning the periodic pattern illumination and rotating the tar- ents with a nanometer resolution in the vertical direction.
get object, the sample structure can be reconstructed through With advanced techniques such as sub-aperture stitching inter-
numerical calculations. Under a patterned illumination with ferometry, the form measurement of a large object such as
a high spatial frequency, a lateral resolution of better than the primary mirror of a telescope at a scale of up to several
100 nm can be achieved with an infrared laser source [357]. meters has recently been achieved. The technological innova-
tion in optical form interferometry and deflectometry is expec-
ted to continue due to the strong demands for the fast and
5.2.4. Micro-object-based SR imaging. A new type of SR contactless measurement of large components in many indus-
microscopy, developed in 2004 [358] that uses a photonic trial fields. Furthermore, there is currently strong demand for
nanojet (PNJ), shown in figure 49(a) [329], is attracting measurement of not only the surface form of an object but
attention. When a plane wave is projected onto a micro- also micro- and nanostructures and thin-film structures on an
object, a PNJ is generated behind the object. The modula- object’s surface. Optical microscopy and scatterometry are
tion of the generated PNJ can be detected by an ordinary thus gaining importance in today’s manufacturing industry
optical microscope, as shown in figure 49(b) [329]. In gen- where the miniaturization of components is being accelerated.
eral, the length of a PNJ is approximately 2λ at FWHM, Also, state-of-the-art methods for measuring the internal struc-
while its width is about 0.5 ± 0.2λ at FWHM, depending ture of fabricated products in a non-destructive manner are
on the parameters of the micro-object and its surroundings. attracting attention, as well as SR imaging techniques that
Visible-light backscattering can be enhanced by up to orders can realize a high spatial resolution beyond the diffraction
of magnitude by nanometre-scale dielectric particles within limit.
the PNJ. Furthermore, to obtain a physics-based insight into In the manufacturing industry, where further improvements
PNJ and its SR performance, more theoretical approaches to in accuracy and efficiency are constantly required, the import-
35
Meas. Sci. Technol. 32 (2021) 042003 Topical Review
36
Meas. Sci. Technol. 32 (2021) 042003 Topical Review
Appendix A
37
Meas. Sci. Technol. 32 (2021) 042003 Topical Review
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