En An Ce / Co Nti Nu Ed: Data Sheet
En An Ce / Co Nti Nu Ed: Data Sheet
En An Ce / Co Nti Nu Ed: Data Sheet
Part No.
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DATA SHEET
SDB00129AEB
AN17808A
HSIP012-P-0000E
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AN17808A Contents
Features . 3 Applications 3 Package .. 3 Type .... 3 Block Diagram ......................... 4
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AN17808A
AN17808A
Audio power amplifier IC
Features
Dual 5 W audio power amplifier, with muting circuit and incorporating protection circuits.
Applications
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For low frequency amplifier
Package Type
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3
AN17808A
Block Diagram
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SDB00129AEB
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AN17808A
Application Circuit
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SDB00129AEB
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AN17808A
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SDB00129AEB
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AN17808A
Pin Descriptions
Pin No. 1 2 3 4 5 6 N.C. Channel 1 input Ripple filter Input GND Channel 2 input N.C. Pin name Pin No. 7 8 9 10 11 12 Channel 2 output Mute Output GND VCC Standby Channel 1 output Pin name
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Absolute Maximum Ratings
Parameter A No. 1 2 3 Symbol VCC ICC PD Rating 26.0 4.0 Power supply voltage Power supply current Power dissipation V A 37.5
Unit
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W *2 *1 *1 C C Pa m/s2 m/s2 V V *3 *3 Unit V Notes 7
5 6 7 8
Storage temperature
10
Notes) *1: Ta = 25C except storage temperature and operating ambient temperature.
*2: Ta = 75C with infinite heatsink *3: Do not apply a current or voltage from the external to the terminals not described above.
For circuit current, '+' denotes the current flowing into IC and, '' denotes the current flowing out of IC.
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Symbol VCC
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25 to +75
Request for your special attention and precautions in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
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at io n.