AE Assembly Chipbonder

Products a) Basic Chemistry / Technology

Surface mount adhesives in electronics

assembly b) Performance Characteristics

d) Product Selection Criteria & Value Calculation Process

Chipbonder product guide

e) Product Handling

Dot profile Rheology Dotting throughput

Application / Function a) Industries / Segment

Storage condition and control

f) Success / Failure causes

Trouble shooting and ACHs (Application case

history) Testing & Certification a) Type of Test

Introduction to surface mount adhesives in

Electronics assembly covering process, products and equipment b) Application area

Push Testing Hot strength shear testing

b) Standards / Certification

Surface mount adhesive application and

introduction c) Link to customer process, Equip. & Machinery

J -Standard, IPC Standard introduction

Process parameters optimisation for various

customer applications

Dispensing guidelines

What Is A Surface Mount Adhesive?

A glue used to bond planar electronics components on a printed citcuit board temporarily prior to wave soldering operation
DISPENSE ADHESIVE PLACE CHIP HEAT CURE WAVE SOLDER

Adhesive Key Characteristics

Rheology or Dot Profile Wet Strength Cured Strength Hot Strength Moisture Absorption

Adhesive Rheology

Definition: Science of flow in materials

In chipbonder terms: To place a dot of adhesive on the substrate without stringing and to ensure that the adhesive stays in place on the substrate with a predictable dot profile.

Dispensing Background
Chip placement speeds ever increasing Adhesive dispense step increasingly becoming the bottle neck Machine manufacturers increasing dispense capability of machines Adhesives must keep pace High Speed Dispense Chipbonder > 40,000 dots per hour 3621 / 3609

Component Placement Speeds Increasing

50,000
Dispense Speeds, Dots/Hour

40,000 30,000 20,000 10,000 0 1987 Fuji GL1 1990 Fuji GL II 1994 Fuji GLV 1998 Fuji GL 541

Dot Profile
Dot profile produced by dispenser will be affected by:

Volume dispensed Dispensing temperature Needle diameter Needle to board height Needle movement

Green Strength
The standard test for product wet or green strength is the Siemens SN59651
Sliding Impact Test This measures the displacement of components after impact down 300mm incline with 15 Angle

Glass Slide Moisture Absorption Test

Resistance In Molten Solder

IPC SM 817 4.5.13 Hot Solder Dip Test

C1206s on FR4 board are held 12.7mm above a solder bath at 260C
for 60 seconds

They are then floated on the solder surface and agitated for a further
10 seconds

Siemens spec for Shear Strength in Solder for these components is 1N

Hot Strength Testing

FR4 board moves down into solder FR4 with C1206 chips in jig

Solder temperature controller

Solder bath at 260C

Hot Strength Testing

Jig fingers line up to push off C1206 chips

Jig fingers pulled with force gauge after immersion in solder

Solder Bath at 260C

Hot Strength Testing

Force Meter Measures Pull Force in Newtons

Application Methods
Syringe Dispensing

Pneumatic Positive displacement

Pin Transfer Stencil Printing

Conventional metal Mesh screen

Syringe Dispensing

Stencil Printing

Dispensing Method

Parameters:

Time Pressure Temperature Stand-off Height Nozzle size and pitch

Adhesive Quantity

M E T A L L IZ A T IO N A D H E S IV E D O T SM D

B
SO LD ER LAN D PCB

A C

>

A + B

Squashed dot must provide 80% coverage of surface bonding area of SMD
between the copper pads

Dot width to height ratio should be ideally 2:1 to 4:1

Dispensing Nozzle Geometry

0603 Component

Nozzle

c
0603 dot Size 0.4-0.6 mm

Diameter = (0.5 Dot Diameter) = 0.2-0.3 mm Rule of thumb: Nozzle diameter should be x2.5-3 times larger than largest
particle to avoid blocking

Component Dimensions
1206 - 3.0 mm length x 1.50 mm width 0805 - 2.0 mm length x 1.25 mm width 0603 - 1.5 mm length x 0.75 mm width 0402 - 1.0 mm length x 0.50 mm width

Guideline For Adhesive Dot Size For 1206

0.25~0.5mm

Chip resistor or capacitor Needle diameter = 0.4~0.5mm Needle pitch = 1.0~1.3mm

Dot diameter = 0.8~1.0 mm

Guideline For Adhesive Dot Size For 0805

0.15~0.25mm

Chip resistor or capacitor Needle diameter = 0.4mm Needle pitch = 0.8~1.0mm Dot Diameter = 0.6~0.8mm

Critical Parameters

Dot Profile

DOT PROFILE IS DETERMINED BY : Thixotropic recovery rate, viscosity at zero shear rate

substrate Development of Dot Profile

Chipbonder Dot Sizes For Various Component Sizes

SURFACE MOUNT ADHESIVE DOT SIZE FOR VARIOUS COMPONENTS

Imperial-Metric Conversion Table

Chipbonder Selector Guide

3611/3607 Pin Transfer / Stencil Printing 348 General Purpose Syringe Dispensing 3612 / 3614 Varidot / Metal Stencil Printing 3629 Pb Free Low Temp. cure High Speed

3609 /3610 High Speed Dispensing System 7360 Chipbonder Cleaner 3615 Diff to Bond Surface

3616 / 3617 High Speed Stencil Printing

3618 Improved Humidity Resistance and Low Ionic

3621 3622

3619 3620 Low Temp. cure High Speed

Ultra High Speed

Dispensing Chipbonders
3609

High Speed, Good Green Strength Color: Red DPH: 40,000+ Dot Profile: Peaked Cure: 90 seconds @ 150 C Shelf life: 6 months DOM Recommend 3621if ultra highspeed

Ultra High Speed Dispensing Chipbonders

3621

Ultra High Speed Excellent Green Strength Superior Humidity resistance Electrical Properties Room Temperature Storage Color: Red DPH: 47,000+ (Jettable) Dot Profile: Rounded Cure: 90 seconds @ 150 C Shelf Life: 10 months DOM

Low Temperature Cure Chipbonders

3619

High Speed, Low Cure Temperature Color: Red DPH: 40,000+ Dot Profile: Peaked Cure:90 seconds @ 100 C Shelf life: 6 months DOM

Stencil Printing
Current Chipshooters place components at 80,000 chips/hour Current syringe dispenser rates are 40,000+ dots per hour A single board can be stencil printed in 10 second or less

Generic Printer Parameters

Stencil thickness: Stencil material: Squeegee material: Squeegee angle: Squeegee pressure: Squeegee length: Print speed: Print strokes: Separation speed: Snap Off:

250 steel steel 60 2.0 bar 200mm 30mm/s single stroke 1.0mm/s 0 = on contact

Stencil Printing
3616
Key Parameters

High Speed, Dek Proflow Color: Red Speed: 6.0 (150 mm) /
second

Stencil Cleanliness 7360,

Acetone (hazard)

Dot Profile: Rounded Cure: 60 seconds @ 150

C

Stencil Pattern Ambient Temp./Humidity Printer Settings Alignment Accuracy

90 seconds @ 125 C Shelf life : 6 months DOM

Pin Transfer

3607

Key Parameters

Low Moisture Pick Up Color: Red DPH: Pin Transfer Dot Profile: Rounded Cure: 150-180 seconds @ 150 C Shelf life: 4 months DOM

Bath Life Ambient Temp. &

Humidity

Bath Temperature Adhesive Level Pin Configuration

General Process Recommendations

Do not dispense adhesive completely from the syringe (allow at least
2-3cc left in the syringe)

Do not allow dispensed adhesive to remain on the board for more

than 1hr before component is placed

Clean nozzles thoroughly in solvent or ultrasonic bath regularly. Change nozzle every shift if possible. Inspect nozzle after cleaning and replace worn or clogged nozzles. If downloading is done by customer, centrifuge the syringe.

Standard Cure Profile

Typically, cure at 150 deg C > 90 sec

Low Temperature Cure Profile

For 3619, cure at 100 deg C > 90 sec For 3629, cure at 130 deg C > 110 sec

Handling Procedure
35 to 45 deg F (2 to 8 deg C) Refrigerated NOT frozen Requires thawing to dispense temperature prior to use (Thaw upright) Thawing time depends on packaging size (1-2hrs) Too cold is just as bad as too hot. Do not freeze! Prolonged low temperatures (below 0 deg C) can lead to the formation
of freeze/thaw voiding in the product on bringing up to room temperature.

Repeated thermal cycling from refrigerated conditions to room

temperature can cause an increase in viscosity and void formation.

The rate of warming from cold to warm temperatures must be sufficiently

slow to avoid freeze/thaw voiding.

Typical Thaw Profile

 The CAMALOT brand name is synonymous with technology leadership

in dispensing systems for surface mount electronics and chip packaging and assembly applications.

Available in stand-alone and inline configurations, CAMALOTs

systems are ideal for dispensing underfill, encapsulants, solder paste, and adhesives with unmatched speed and accuracy.

CAMALOTs leadership position in dispense pump innovation ensures

that the optimal technology is available for virtually any application.

 Jetting offers many advantages over traditional

needle dispensing

Speed: high flow rate up to 400 mg/second; high

shot rate up to 200 dots per second; no Z-axis motion; jets "on the fly" - no stopping between dots required; less height sensing required; no needle backtracking to prevent fluid stringing.

Quality: High wet-dispense accuracy; smaller

wet-out areas; round, uniform dots; No bent needles; no chipped die; no dripping; reduced part interference; no effects from warpage; no corner buildup.

Easy and quick to clean in 10 minutes or less;

maintenance is tool-free; less waste of fluid due to small wetted path; consumable parts are lower cost.

 In operation, the jet "flies" over the part or substrate, shoots

precise volumes of fluid in dots, lines and patterns. Jetting multiple shots in the same location creates larger dots. Lines and complex shapes are constructed from adjacent dots.

Typical Thaw Profile

Troubleshooting - Stringing
NOZZLE MOTION RELATIVE TO PCB

The adhesive must have the ability to break quickly and cleanly from the nozzle as it is retracting. Older chipbonder grades will not have this property adequately for the latest range of high speed dispensers High speed chipbonder grades can still string if the dispense volume of the adhesive is too small for the nozzle diameter and stand-off height (resulting in a very tall, thin dot)

Troubleshooting - Stringing
The solution is to use a smaller needle diameter/stand-off combination. Increasing the anti-string dwell timer (where available) is another solution Adhesive may be too cold Poor or aged adhesive Increase nozzle temperature might help

TROUBLE SHOOTING Low Bond Strength

dot size too small. Insufficient cure conditions Poor contact between components and PCB. - Contamination or release agent on components. Recommend 3615 for difficult to bond components and packages. - Adhesive quality
Adhesive

Troubleshooting Inconsistent Dot Size

The dot may be too small for the needle diameter, resulting in the poor wetting of the PCB. Temperature changes causing adhesive viscosity variations. Use temperature control and vision system feedback control of dot quantity. Pressure variations due to changing volume and temperature behind the piston. Use vision feedback control of dot quantity. More recent dispensers enable the air to be vented back out of the syringe between dispense-on signals.

Troubleshooting Inconsistent Dot Size

Partial blockage or build up on the walls of the needle. Clean nozzles. Imbalance in flow through multiple needle nozzles. Clean nozzles, check for damage.

Troubleshooting Missing Dots

Missing Dots can occur for one of two reasons:
Nozzle Blockage
Due to foreign particle introduced either during manufacturing of the SMA or during nozzle attachment at the customers site. One common source of blockage is old partially cured adhesive on unclean nozzles

Air Bubbles
If not introduced in the SMA manufacturing process, then air bubbles could be entrapped during the attachment of nozzles and adapters to the syringe.

Troubleshooting Adhesive on Solder Pad

Adhesive dot quantity too much Placement accuracy Stringing Adhesive slump or spread

QUESTIONS?