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    Tds Pai Sac0307 Lead Free Wire

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    CHANDAN

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    © All Rights Reserved
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    Tds Pai Sac0307 Lead Free Wire

    Uploaded by

    CHANDAN
    15 views2 pages

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    © All Rights Reserved
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    Download as docx, pdf, or txt
    15 views2 pages

    Tds Pai Sac0307 Lead Free Wire

    Uploaded by

    CHANDAN

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Download as docx, pdf, or txt
    of 2

    TDS No: TDS-PAI-038

    TECHNICAL DATA SHEET Revision Date: Apr 1st 2023


    Revision No: 001

    PAI SAC0307 Lead Free Solder Wire


    PRODUCT DESCRIPTION
    PAI SAC0307 is as RoHS Compliance Lead-Free Solder Wires which are being formulated with High Virgin Raw Metals
    Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with
    Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also, an increase flow rate & reduced
    impurities found. PAI SAC0307 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics
    Industry Today.

    STORAGE AND HANDLING


     Do not use Fire near storage area.
     Store in Dry, Cool and Non-Corrosive environment.
     Wear Personal Protective Equipments while Handling.
     Wear Personal Protective Equipments while Processing.
     PAI Flux-cored solder wires have a 3 year Self Life from the date of manufacture.

    PRODUCT SPECIFICATION

    Sr. No. Item Specification Standard


    1 Appearance Bright and shiny surface finishes
    2 Alloy Sn/Ag0.3/Cu0.7 ISO 9453
    3 Melting Point 217~2260C ISO 9453
    4 Flux Content 1.1%, 2.2% & 3.3% ±0.1% JISZ3283
    5 Gravity 7.4
    6 Spread ability >80% JISZ3197
    7 Packaging 500g,
    8 Diameter/Tolerance Upto0.30mm±0.02mm JISZ3283
    9 Flux Type JF9,JF18
    10 RoHS Complaint Yes International Standards
    11 Features Excellent solder joint reliability. Superior joint strength.
    Excellent thermal & mechanical fatigue resistance. Low cleaning
    required after solder joint
    12 Purpose For use in applications requiring good activation.

    PHYSICAL PROPERTIES.

    Sr.# Test Item Test Result Test Method


    1 Silver Chromate Test PASS JIS Z 3197:2021 8.1.4.2.3
    2 Copper Mirror Test PASS JIS Z 3197:2021 8.4.2
    3 Copper plate Corrosion PASS JIS Z 3197: 2021 8.4.1
    4 S.I.R Test 1×109Ω or over IPC-TM-650, 2.6.3.3
    Condition A
    (7 days, 40°C/90% RH)

    Regd Off & Works:


    353, GIDC Estate, Waghodia-391760. Dist : Vadodara.
    Phone: +91 2668 262718-9. Fax : +91 2668 262556
    E-Mail : [email protected] URL:www.persangalloy.com
    TDS No: TDS-PAI-038
    TECHNICAL DATA SHEET Revision Date: Apr 1st 2023
    Revision No: 001

    Condition B
    1×108 Ω or over JIS Z 3197:2021 8.5.3
    (7 days, 85°C/85% RH)
    5 Electro migration Test Pass JIS Z 3197:2021 8.5.4

    ALLOY COMPOSITION.
    Sn Pb Zn Sb Fe Ni Cu Cd Bi As Ag Al

    0.07% 0.001% 0.1% 0.02% 0.01 to 0.5%- 0.01% 0.06% 0.03% 0.2 to 0.001%
    Rem
    MAX MAX MAX MAX 0.07 0.9% MAX MAX MAX 0.4 MAX

    Hg In Au Cr Ge

    0.1% 0.1% 0.05% 0.1% 0.02%


    MAX MAX MAX MAX MAX

    APPLICATION

    A preferred typical Solder tip temperature would be between 380°C to 450°C. Heat both the land area and component lead to
    be soldered with the iron tip prior to applying the solder wire to land area or component lead. To maximize tip life and reduce
    solder spattering, do not feed wire directly to iron tip.

    PAIPL recommend maintaining shop floor humidity between 40% to 60% RH

    For more details, please visit Our Website at www.persangalloy.com or write to us on [email protected]

    DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not guaranteed. No statement or
    recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OF MERCHANTABILITY, WARRANTY OF FITNESS FOR A PARTICULAR
    PURPOSE OR ANY IMPLIED WARRANTY IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express, implied, or statutory. Products are warranted to be free from defects in material and
    workmanship at the time sold. The sole obligation of the seller and manufacturer under this warranty shall be to replace any noncompliant product at the time sold. Under no circumstances shall the manufacturer or seller be liable for
    any loss, damage or expense, direct, indirect, incidental or consequential, arising out of the inability to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies
    operating parameters beyond those stated above, or if products are used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect,
    incidental and consequential damages that may result from use of the products under such conditions, and agrees to exonerate, indemnify, defend and hold harmless PAI, Incorporated and its affiliates therefrom. No suggestion for
    product use nor anything contained herein shall be construed as a recommendation to use any product in a manner that infringes any patent or other intellectual property rights, and seller and manufacturer assume no responsibility
    or liability for any such infringement.
    All rights reserved. “(R)” and “TM” are registered trademarks of Persang Alloys Industries Pvt. Ltd. and its group of companies.

    Regd Off & Works:


    353, GIDC Estate, Waghodia-391760. Dist : Vadodara.
    Phone: +91 2668 262718-9. Fax : +91 2668 262556
    E-Mail : [email protected] URL:www.persangalloy.com

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