VO14642AT, VO14642AABTR 1 Form A Solid-State Relay: Vishay Semiconductors
VO14642AT, VO14642AABTR 1 Form A Solid-State Relay: Vishay Semiconductors
VO14642AT, VO14642AABTR 1 Form A Solid-State Relay: Vishay Semiconductors
www.vishay.com
Vishay Semiconductors
1 Form A Solid-State Relay
FEATURES
• High speed SSR - ton/toff < 800 μs
S DC S'
• Maximum RON 0.25 Ω
6 5 4
• Isolation test voltage 5300 VRMS
• Load voltage 60 V
• Load current 2 ADC configuration
• DIP-6 package
• Clean bounce free switching
1 2 3 • TTL / CMOS compatible input
• Available on tape and reel
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Instrumentation
LINKS TO ADDITIONAL RESOURCES
• Industrial controls
• Security
Product Page Design Tools Models
• Automatic measurement equipment
ORDERING INFORMATION
DIP-6 SMD-6
V O 1 4 6 4 2 A x x T R
PACKAGE
SMD-6, tape and reel VO14642AABTR
DIP-6, Tubes VO14642AT
DC mode
2.0
Load Current/A
1.5
AC/DC mode
1.0
0.5
0.0
-50 -25 0 25 50 75 100
Ambient Temperature/°C
Fig. 1 - Load Current (AC/DC) vs. Temperature
THERMAL CHARACTERISTICS
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Maximum LED junction temperature At 25 °C Tjmax. 125 °C
Maximum output die junction temperature At 25 °C Tjmax. 125 °C
Thermal resistance, junction emitter to board At 25 °C θEB 176 °C/W
Thermal resistance, junction emitter to case At 25 °C θEC 208 °C/W
Thermal resistance, junction detector to board At 25 °C θDB 67 °C/W
Thermal resistance, junction detector to case At 25 °C θDC 134 °C/W
Thermal resistance, junction emitter to junction detector At 25 °C θED 310 °C/W
Thermal resistance, case to ambient At 25 °C θCA 2180 °C/W
Note
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal
characteristics of optocouplers application note.
TA
θCA
Package
TC
θDC θEC
θDB
θEB
TB
θBA
19996
TA
PIN CONFIGURATION
1 6 1 6
Anode Load Anode
2 5 2 5
Cathode Cathode
3 4 3 4
Do not use Load Do not use
20545
VL
1.25 ms
Input
Output
TON
TOFF
Output 90 %
10 %
20991-1
160
Maximum Safety Input Current (mA)
450
400 140
0 0
0 25 50 75 100 125 150 175 200 0 25 50 75 100 125 150 175 200
Ambient Temperature (°C) Ambient Temperature (°C)
IF = 50 mA
1.6
IF - Forward Current (mA)
IF = 30 mA
2nd line
2nd line
1.4
1st line
2nd line
2nd line
1st line
Tamb = 25 °C
1.3
IF = 10 mA
1 100 100
Tamb = -55 °C 1.2
IF = 5 mA
1.1 IF = 1 mA
0.1 10 1.0 10
0.8 1.0 1.2 1.4 1.6 1.8 -55 -35 -15 5 25 45 65 85
VF - Forward Voltage (V) Ambient Temperature (°C)
Fig. 4 - Forward Voltage vs. Forward Current Fig. 7 - LED Voltage vs. Temperature
0.8
1.4
Leakage Current (nA)
0.7
for Switch Turn-On
1000 1000
0.6
2nd line
2nd line
2nd line
1st line
1st line
0.5 1.2
0.4
100 100
0.3
1.0
0.2
0.1 Normalized to Tamb = 25°C
0 10 0.8 10
-55 -35 -15 5 25 45 65 85 -40 -20 0 20 40 60 80
Ambient Temperature (°C) Ambient Temperature (°C)
Fig. 5 - LED Leakage Current vs. Ambient Temperature Fig. 8 - LED Forward Current for Switch Turn-On vs.
Ambient Temperature
1.6 IL = 1 A
15
Leakage Current (nA)
1.4
1000 1000
2nd line
2nd line
1.2
2nd line
1st line
1st line
Line 1
10
1.0
100 100
0.8
5
0.6
0 10 0.4 10
-55 -35 -15 5 25 45 65 85 -55 -35 -15 5 25 45 65 85
Ambient Temperature (°C) Temperature (°C)
1000 1000
73 720
2nd line
2nd line
2nd line
1st line
1st line
2nd line
70 620
67 520
100 100
64
420
61
58 320
55 10 220 10
-55 -35 -15 5 25 45 65 85 5 10 15 20
Ambient Temperature (°C) Forward Current (mA)
Fig. 10 - Turn-Off Time vs. Temperature Fig. 13 - Turn-On Time vs. Forward Current
200
Switch Caoacitance (pF)
80
toff - Turn-Off Time (µs)
1000 1000
150
2nd line
2nd line
2nd line
2nd line
1st line
1st line
60
100
100 100
40
50
20 10 0 10
5 10 15 20 0 10 20 30 40 50 60
Forward Current (mA) Applied Voltage (V)
Fig. 11 - Turn-Off Time vs. Forward Current Fig. 14 - Switch Capacitance vs. Applied Voltage
Axis Title
700 10000
IF = 10 mA, IL = 1 A, tP = 5 ms
650
Turn-On Time (μs)
600 1000
2nd line
2nd line
1st line
550
500 100
450
400 10
-55 -35 -15 5 25 45 65 85
Ambient Temperature (°C)
3.55 ± 0.25
0.25 ± 0.10
1.00 ± 0.10
0.25 ± 0.20
Leads coplanarity
2.54 nom. 0.60 min. 8.00 min. 0.1 max.
2 x 2.54 = 5.08
6 5 4
Recommended footprint
5.08
1.50
2.54
DIP-6
7.60 max. 7.62 typ.
7.25 ± 0.10 6.65 ± 0.15
0.79 typ.
3.55 ± 0.25
6.09 ± 0.25
0.70 ± 0.20
3.04 ± 0.25
1.00 ± 0.10
0.50 ± 0.10
2.54 nom. 3° to 9
° .10
0.25 ± 0
2 x 2.54 = 5.08
6 5 4
1 2 3
VO14642
V XXXX 68
Notes
• XXXX = LMC (lot marking code)
• Tape and reel suffix “TR” is not part of the package marking
7.5 ± 0.1
16.0 ± 0.3
CL 7.77 ± 0.1
3.9 ± 0.1
12.0 ± 0.1 10.3 ± 0.1
4.4 ± 0.1
1.5 min.
TUBE PACKING
TYPE UNITS/TUBE TUBES/BOX UNITS/BOX
DIP-6 50 40 2000
SOLDER PROFILES
Axis Title Axis Title
300 10000 300 10000
5s
Lead temperature Max. 260 °C
250 250 255 °C
235 °C to 245 °C
240 °C
260 °C Second Full line: typical
wave 217 °C
First wave Dotted lines:
Temperature (°C)
Temperature (°C)
2nd line
2nd line
2nd line
ca. 2 K/s
1st line
1st line
0 10 0 10
0 50 100 150 200 250 0 50 100 150 200 250 300
948626 Time (s) 19841 Time (s)
Fig. 16 - Wave Soldering Double Wave Profile According to Fig. 17 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for DIP Devices J-STD-020 for SMD Devices
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
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