MS5611 01ba03
MS5611 01ba03
MS5611 01ba03
Fast conversion down to 1 ms
Low power, 1 µA (standby < 0.15 µA)
QFN package 5.0 x 3.0 x 1.0 mm3
Supply voltage 1.8 to 3.6 V
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Operating range: 10 to 1200 mbar, -40 to +85 °C
I2C and SPI interface up to 20 MHz
No external components (Internal oscillator)
Excellent long term stability
FEATURES
FIELD OF APPLICATION
Mobile altimeter / barometer systems
Bike computers
Variometers
Height sensing for medical alarms
Indoor navigation
TECHNICAL DATA
Sensor Performances (VDD = 3 V)
Pressure Min Typ Max Unit
Range 10 1200 mbar
ADC 24 bit
0.065 / 0.042 / 0.027
Resolution (1) mbar
/ 0.018 / 0.012
Accuracy 25°C, 750 mbar -1.5 +1.5 mbar
Error band, -20°C to +85°C,
-2.5 +2.5 mbar
450 to 1100 mbar (2)
0.5 / 1.1 / 2.1 / 4.1 /
Response time (1) ms
8.22
Long term stability ±1 mbar/yr
Temperature Min Typ Max Unit
Range -40 +85 °C
Resolution <0.01 °C
Accuracy -0.8 +0.8 °C
Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one pressure point
PS
Meas. MUX
CSB
SENSOR +IN Digital
Interface SDI/SDA
dig. SDO
PGA ADC
-IN Filter SCLK
Sensor Memory
Interface IC (PROM)
128 bits
SGND
GND
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Min. Typ. Max Unit
Supply voltage VDD -0.3 +4.0 V
Storage temperature TS -40 +125 °C
Overpressure Pmax 6 bar
Maximum Soldering
Tmax 40 sec max 250 °C
Temperature
Human Body
ESD rating -4 +4 kV
Model
JEDEC standard
Latch up -100 +100 mA
No 78
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min. Typ. Max Unit
Operating Supply voltage VDD 1.8 3.0 3.6 V
Operating Temperature T -40 +25 +85 °C
OSR
12.5
4096
6.3
Supply current 2048
IDD 3.2 µA
(1 sample per sec.) 1024
1.7
512
0.9
256
Peak supply current during conversion 1.4 mA
Standby supply current at 25°C 0.02 0.14 µA
VDD Capacitor From VDD to GND 100 nF
FUNCTIONAL DESCRIPTION
VDD
PS
Meas. MUX
CSB
SENSOR +IN Digital
Interface SDI/SDA
dig. SDO
PGA ADC
-IN Filter SCLK
Sensor Memory
Interface IC (PROM)
128 bits
SGND
GND
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 128-
bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller software
and used in the program converting D1 and D2 into compensated pressure and temperature values.
SERIAL INTERFACE
The MS5611-01BA has built in two types of serial interfaces: SPI and I2C. Pulling the Protocol Select pin PS to low
selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
SPI MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In
the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds
on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that
other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the
end of the command execution (for example end of conversion). The best noise performance from the module is
obtained when the SPI bus is idle and without communication to other devices during the ADC conversion.
I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In I 2C-Mode
the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to use two sensors
with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND (do not leave
unconnected!).
COMMANDS
The MS5611-01BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Start
Maximum values for calculation results:
PMIN = 10mbar PMAX = 1200mbar
TMIN = -40°C TMAX = 85°C TREF = 20°C
Convert
Readcalibration datadata
calibration into coefficients (see bit pattern
(factory calibrated) from of W1 to W4)
PROM
Read
Read digitalpressure
digital pressure and
and temperature
temperaturedata
data
Calculate temperature
[2]
Difference between actual and reference temperature
dT signed int 32 25 -16776960 16777216 2366
dT = D2 - TREF = D2 - C5 * 2 8
Actual temperature (-40…85°C with 0.01°C resolution) 2007
TEMP signed int 32 41 -4000 8500
TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 223 = 20.07 °C
Calculate
Calculate temperature compensated
temperature compensated pressure
pressure
Notes
[1] Maximal size of intermediate result during evaluation of variable
[2] min and max have to be defined
[3] min and max have to be defined
[4] min and max have to be defined
Figure 2: Flow chart for pressure and temperature reading and software compensation.
Yes No
TEMP<20°C
Low temperature
Low temperature High temperature
2 31
T2 = dT / 2 T2 = 0
OFF2 = 5 (TEMP – 2000)2 / 21 OFF2 = 0
SENS2 = 5 (TEMP – 2000) / 2
2 2
SENS2 = 0
Yes No
TEMP<-15°C
Low temperature
Very low temperature
OFF2 = OFF2 + 7 (TEMP + 1500)
2
TEMP = TEMP - T2
OFF = OFF - OFF2
SENS = SENS - SENS2
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.
SPI INTERFACE
COMMANDS
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will
return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the
PROM read command using the a2, a1 and a0 bits.
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device ROM from an unknown condition
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
2.8ms RELOAD
SDO
PS
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
2.8ms RELOAD
SDO
PS
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not
executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result.
If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final
result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect
result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
8.22ms ADC CONVERSION
SDO
PS
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 27 28 29 30 31
SCLK
CSB
SDI
READING 24BIT ADC RESULT MSB FIRST
SDO
PS
Figure 8: ADC Read sequence
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
CSB
SDI
READING 16BIT PROM VALUE MSB FIRST
SDO
PS
Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5611-01BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does not
have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by
the SDA being blocked by the module in the acknowledge state. The only way to get the MS5611-01BA to function
is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1 1 1 0 1 1 CSB 0 0 0 0 0 1 1 1 1 0 0
Device Address command
S Device Address W A cmd byte A P
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0
Device Address command
S Device Address W A cmd byte A P
1 1 1 0 1 1 CSB 1 0 1 1 0 0 X X X X 0 X X X X X X X X 0
Device Address data data
S Device Address R A Memory bit 15 - 8 A Memory bit 7 - 0 N P
CONVERSION SEQUENCE
A conversion can be started by sending the command to MS5611-01BA. When command is sent to the system it
stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read
command, when an acknowledge appears from the MS5611-01BA, 24 SCLK cycles may be sent to receive all
result bits. Every 8 bit the system waits for an acknowledge signal.
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0
Device Address command
S Device Address W A cmd byte A P
1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0
Device Address command
S Device Address W A cmd byte A P
1 1 1 0 1 1 CSB 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
Device Address data data data
S Device Address R A Data 23-16 A Data 8 - 15 A Data 7 - 0 N P
A D D D D D D
D D D D D D D D D D
B B B B B B
d 1 1 1 1 1 1
B B B B B B B B B B
d 9 8 7 6 5 4 3 2 1 0
5 4 3 2 1 0
0 16 bit reserved for manufacturer
1 Coefficient 1 (16 bit unsigned)
2 Coefficient 2 (16 bit unsigned)
3 Coefficient 3 (16 bit unsigned)
4 Coefficient 4 (16 bit unsigned)
5 Coefficient 5 (16 bit unsigned)
6 Coefficient 6 (16 bit unsigned)
7 CRC
APPLICATION CIRCUIT
The MS5611-01BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
It is designed for low-voltage systems with a supply voltage of 3 V.
MS5611-01BA
MS5611-01BA
Figure 17: Typical application circuit with SPI / I2C protocol communication
PIN CONFIGURATION
Pin Name Type Function
1 VDD P Positive supply voltage
Protocol select
2 PS I PS high (VDD) I2C
PS low (GND) SPI
3 GND G Ground
4 Chip select (active low),
CSB I
5 internal connection
6 SDO O Serial data output
SDI / Serial data input /
7 I / IO
SDA I2C data IO
8 SCLK I Serial data clock
Reserved area:
Please do not route
tracks between pads
SHIPPING PACKAGE
MOUNTING
The MS5611-01BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
CLEANING
The MS5611-01BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble
the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the
sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of
type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential
to ground machines and personnel properly during assembly and handling of the device. The MS5611-01BA is
shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of
the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor must
be placed as close as possible to the MS5611-01BA VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
10000000
9000000
8000000
ADC-value D1 (LSB)
7000000 -40°C
20°C
85°C
6000000
5000000
4000000
3000000
0 100 200 300 400 500 600 700 800 900 1000 1100
Pressure (mbar)
12000000
11000000
10000000
9000000
ADC-value D2 (LSB)
8000000
7000000
6000000
5000000
4000000
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
1.5
85°C
60°C
1 20°C
0°C
-40°C
Pressure error (mbar)
-0.5
-1
-1.5
-2
Pressure (mbar)
28
26
24
22
20
18
Pressure error (mbar)
16
Perror(1000,1st order)
14 Perror(1000,2nd order)
12 Perror(800,1st order)
Perror(800,2nd order)
10
Perror(450,1st order)
8
Perror(450,2nd order)
6
-2
-4
-40 -20 0 20 40 60 80
Temperature (°C)
15
10
Temperature error (°C)
-5
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
ORDERING INFORMATION
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DA5611-01BA03_011
000056111624 ECN1742