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    PD Design 9

    Uploaded by

    Kanhaiya Mishra
    The document discusses design for manufacturing steps after signal routing is complete, including antenna fixing, metal filling, metal slotting, adding redundant contacts, and wire spreading to address manufacturing issues like gate oxide integrity, via resistance, random particle defects, metal erosion, metal liftoff, and metal over-etching.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    PD Design 9

    Uploaded by

    Kanhaiya Mishra
    62 views17 pages
    The document discusses design for manufacturing steps after signal routing is complete, including antenna fixing, metal filling, metal slotting, adding redundant contacts, and wire spreading to address manufacturing issues like gate oxide integrity, via resistance, random particle defects, metal erosion, metal liftoff, and metal over-etching.

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    pd design 9

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    The document discusses design for manufacturing steps after signal routing is complete, including antenna fixing, metal filling, metal slotting, adding redundant contacts, and wire spreading to address manufacturing issues like gate oxide integrity, via resistance, random particle defects, metal erosion, metal liftoff, and metal over-etching.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    62 views17 pages

    PD Design 9

    Uploaded by

    Kanhaiya Mishra
    The document discusses design for manufacturing steps after signal routing is complete, including antenna fixing, metal filling, metal slotting, adding redundant contacts, and wire spreading to address manufacturing issues like gate oxide integrity, via resistance, random particle defects, metal erosion, metal liftoff, and metal over-etching.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 17

    Objective

    Performkeydesignformanufacturingstepsrequiredafterthesignal routingiscomplete:

    *Antennafixing *Metalfilling *Metalslotting *Addingredundantcontacts *Wirespreading

    RVVLSICONFIDENTIAL

    DesignstatusatstartofDFMphase
    Placement

    Standardcellsareplaced ClocktreeandHFNbuffersareplaced Allclock,signalandP/Gnetshavebeencompletelyrouted Allrouterelatedoptimizationsarecompleted: SetupandHoldtime:met Maximumcapacitancelimitsmet Maximumsignaltransitiontimesmet DesignisDRCclean

    CTS

    Routing

    Designfor manufacturability

    RVVLSICONFIDENTIAL

    Manufacturingissues
    Astrocanaddressseveralissuestoincreasemanufacturingyield: GateOxideintegrityantennafixing Viaresistanceandreliabilityextracontacts RandomParticledefectWirespreading Metalerosionmetalslotting Metalliftoffmetalslotting MetalOverEtchingmetalfill

    RVVLSICONFIDENTIAL

    GateOxideIntegrity
    Metalwires(antennae)placedinanEMfieldgeneratevoltagegradients. Duringthemetaleachstage,strongEMfieldsareusedtostimulatetheplasmaetchant. ResultantvoltagegradientsatMOSFETgatescandamagethethinoxide.

    RVVLSICONFIDENTIAL

    AntennaRules
    Aslengthofwireincreasesduringprocessing,thevoltagestressingthegateoxide increases. Antennarulesdefineacceptablelengthofwires.

    *AntennaRatios:
    metal2 AreaofmetalconnectedtoGate CombinedAreaofGate metal1

    poly

    RVVLSICONFIDENTIAL

    MetalSplittingOrlayerJumping
    BeforeLayerJumping

    metal3 M1 blockage

    M3blockage

    metal1 Unacceptableantennaarea

    Gate poly

    Driver diffusion

    RVVLSICONFIDENTIAL

    MetalSplittingOrlayerJumping
    AfterLayerJumping,tomeetAntennarules

    metal3 M1 blockage

    M3blockage

    metal3

    metal1 Acceptableantennaarea

    Gate poly

    Driver diffusion

    RVVLSICONFIDENTIAL

    InsertingDiodes
    BeforeInsertingDiodes metal3

    metal1 DiodeInhibitslargevoltageswings onmetaltracks metal3

    metal1 Duringetchphase,thediodeclamps thevoltageswings.


    RVVLSICONFIDENTIAL

    Antennaviolationsfixingflow
    Routing&related Routing&related Routing&related Routing&related Routing&related optimizations optimizations optimizations optimizations optimizations

    RouteDRC violations?
    No Setantennarules Search&Repair InsertAntennaDiodes forallremaining violations RemainingDesignfor
    RVVLSICONFIDENTIAL Manufacturability

    Yes

    Search&Repair

    Viaresistanceandreliability

    Replacingoneviawithmultipleviascanimproveyield&timing(seriesRreduction) Astroinsertsmultipleviaswithoutrerouting

    extra vias added

    RVVLSICONFIDENTIAL

    RandomParticleDefects
    Randommissingorextramaterialcausesopensorshortsduringthefabricationprocess.

    *Wiresatminimumspacingaremostsusceptibletoshorts *Minimumwidthwiresaremostsusceptibletoopens Conductivedefectswithincritical areacausingshorts Nonconductivedefectswithin criticalareacausingopens

    Critical Areas metal3

    Conductivedefectsoutsidecritical areacausingnoshorts

    Nonconductivedefectsoutside criticalareacausingnoopens
    RVVLSICONFIDENTIAL

    WireSpreading+Widening
    Spreadwirestoreduceshortcriticalarea

    pushroutesofftrackbyhalfpitch willnotpushfrozennets Widenswirestoreduceopencriticalarea WireTracks

    SpreadingoffTrack

    RVVLSICONFIDENTIAL

    Widening

    MetalErosion
    Thewaferismadeflat(planarized)byaprocesscalledChemicalMechanicalPolishing (CMP) Metalsaremechanicallysofterthandielectrics:

    *CMPleavesmetaltopswithaconcaveshapedishing *thewiderthemetalthemorepronouncedthedishing *Widetraceswithlittleinterveningdielectricandcanbecomequitethin dishing thissevereiscallederosion. Processrulesspecifymaximummetaldensityperlayertominimizeerosion.

    Trytogetpicforthis

    RVVLSICONFIDENTIAL

    MetalLittoff
    Conductorsanddielectricshavedifferentcoefficientsofthermalexpansion:

    Stressbuiltsupwithtemperaturecycling Metalscandelaminate(litoff)withtime Widemetaltracesaremorevulnerablethannarrowones Maximummetaldensityrulesalsoaddressthisissue.

    MetalThermalExpansion

    Dielectric
    DielectricThermalExpansion
    RVVLSICONFIDENTIAL

    MetalSlotting
    Slottingwidewiresreducesthemetaldensity Slotsminimizesstressesbuildup,reducinglitofftendency PrimarilyusedonPowerandGroundtraces: Slottingparameterscanbesetlayerbylayer Slideclearance

    Canapplytoanyothernetifwideenough OpenSlot SlideSpace

    Width

    EndSpace
    RVVLSICONFIDENTIAL

    Lenght

    MetalOverEtching
    Anarrowmetalwireseparatedfromothermetalrecievesahigherdensityofetchantthan Thenarrowmetalcangetoveretched Minimummetaldensityrulesareusedtocontrolthis.

    closelyspacedwires

    RVVLSICONFIDENTIAL

    Metalfill
    Fillsemptytrackswithmetalshapestomeettheminimummetaldensityrules Usesupmostoftheremainingroutingresource: Nofurtherroutingorantennafixescanbedone

    RVVLSICONFIDENTIAL

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