BM Probe Catalog - en

BondMaster
Probes and Accessories Catalog
• Pitch-Catch Probes
• Mechanical Impedance Probes
• Resonance Probes
• Accessories
920-139A-EN
The Company
Olympus NDT designs and manufactures ultrasonic and eddy current test systems for manual and automated nondestructive testing.
These systems are used throughout the world for the analysis of defects resulting from processes such as welding, extrusion, and cast-
ing, as well as from wear, corrosion, and fatigue.
Our broad field of activity includes aerospace and automotive manufacturing, petrochemical industries, construction welding, and
in-service inspection.
To serve these markets, Olympus NDT has manufacturing facilities in Canada and the United States. We manufacture state-of-the-art
conventional and phased-array ultrasonic equipment and probes for the inspection of a wide range of tubes, plates, welds, and com-
posite structures.
Standard probes can be ordered efficiently and delivered quickly; custom probes may be designed, developed, and manufactured.
Strict adherence to quality procedures ensures that reliable, long-life probes are delivered to the user, and that probe-to-probe repeat-
ability is assured.
Olympus NDT continues to lead the way in terms of the technology, design, and development of standard- and application-specific
probes and accessories. Easy ordering, superior quality, and quick turnaround are the goals of the teams making these probes—cus-
tomer service is an everyday focus.
We invite you to browse this catalog to find out more about the BondMaster 1000e+ probes for aerospace maintenance and manufac-
turing, composite bond testing, and automotive applications.
Olympus NDT offers products and services from several high-quality brands: R/D Tech, Panametrics-NDT, NDT Engineering, Sonic,
and Nortec. For many decades these brands have earned excellent reputations for providing cost-effective solutions and excellent sup-
port and customer service.
Warranty
Olympus NDT Inc. offers a ninety-day warranty on all probes sold. These products are guaranteed against all defects in materials and
manufacturing.
All products covered by this warranty must be examined by Olympus NDT Inc. and receive its approval in advance before any repairs
or replacement are made. Any shipping costs are at the expense of the customer.
The warranty excludes defects and deterioration due to normal wear and tear, or caused by an external accident such as:
• Incorrect assembly
• Poor maintenance
• Incorrect usage
• Exposure to temperatures outside the range of –20 °C to 60 °C for storage, or 10 °C to 40 °C for operation
• Voltage beyond recommended limits
• Unforeseen modifications of the product
Olympus NDT will honor claims for defective products if submitted within 90 days from the date of shipment, provided that the prod-
uct has not been improperly used and is subject to its inspection.
Olympus NDT Inc. will not be held responsible in any way whatsoever for direct, indirect, special, incidental, or consequential dam-
ages resulting from possession, use, improper installation, accident, service, modification, or malfunction of the product (including,
without limitation, damages for loss of business profits, business interruption, loss of business information, or other pecuniary loss), or
from service or modification of the product by anyone other than Olympus NDT Inc. or an authorized Olympus NDT service center.
Disclaimer
This document was prepared with particular attention to usage to ensure the accuracy of the information contained therein. It corre-
sponds to the version of the products manufactured prior to the printing date. There may, however, be some differences between the
catalog and the products if the products have been modified thereafter.
2
Table of Contents
The Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Warranty. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
BondMaster 1000e+ Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Numbering System Used to Identify BondMaster 1000e+ Probes . . . . . . . . . . . . . . . . 4
BondMaster 1000e+ Test Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pitch-Catch Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mechanical Impedance Analysis (MIA) Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Resonance Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pitch-Catch Probes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
S-PC-P1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
S-PC-P2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
S-PC-P3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
S-PC-P11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
S-PC-P12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
S-PC-P13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPO-5629-P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SPO-5629-PHV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
S-PC-DHV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Mechanical Impedance Analysis (MIA) Probes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
S-MP-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
S-MP-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
S-MP-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
S-MP-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
S-MP-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
BMM-H Probe Housing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Resonance Probes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
S-PR-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
S-PR-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
S-PR-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
S-PR-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
S-PR-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Typical BondMaster 1000e+ Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Pitch-Catch Probes Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
MIA Probes Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Resonance Probes Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
BondMaster 1000e+ Probe Kits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Enhanced Probe Kit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Basic Probe Kit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Probe Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Deluxe Probe Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Northrop Deluxe Probe Kit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Air Force Probe Kit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
BondMaster 1000e+ General Accessories. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
BondMaster Pitch-Catch Refurbishment Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Procedures for Replacing Probe Tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
BondMaster Probe Chronology and Compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
www.olympusNDT.com 3
BondMaster 1000e+ Technology
The BondMaster™ 1000e+ is a versatile, full-multimode instrument offering pitch-catch, MIA (mechanical impedance analysis), and
resonance modes. This choice of technologies allows the user to select the best method for a particular application and to inspect a
wide variety of composite materials. Each of the three test modes requires specific probes. This catalog will help you to choose the best
probe for your application.
Five inspection methods are available to inspect for defects in
the wide range of materials being used in adhesive-bonded joints
today. The selected method and any adjustments can be set up
in the laboratory and stored in memory for later use in the field.
After the optimum inspection method is selected, the operator
simply connects the required probe to the instrument—the Bond-
Master 1000e+ is then automatically configured for the type and
frequency of the connected probe.
If the instrument has not been set up for a particular application,
the operator must choose the inspection method to use as well
as the corresponding probe. The BondMaster is automatically
configured upon connection of the probe; the operator then
selects the parameters required to evaluate the joint, according
to specific bond-calibration standards.
There are three inspection methods for the pitch-catch test mode:
the pitch-catch swept method, the pitch-catch impulse method,
and the pitch-catch RF method. Eight different probes are used to
cover the various inspection methods used with the pitch-catch
mode. This simple mode, which uses no couplant, is generally
preferred when it is applicable.
Five probes are available for the MIA mode. This mode requires
no couplant; a small contact area makes this mode well suited
for use on irregular surfaces, and for detecting small defects. It
is also suitable for continuous or mechanical scanning by using
spring loading or constant pressure on the probe tip.
The resonance mode features six probes that are especially well
suited for detecting disbonds or delamination in thin-skinned
composites. The resonance mode is typically used for skin-to-
skin inspections.
Numbering System Used to Identify BondMaster 1000e+ Probes
Product type
S-PC-P1L Linked
Probe mode Probe number
Glossary Used to Identify BondMaster Probes
Product type Probe number

S = sensor P1 = probe 1
SPO = special product order PHV= probe high voltage
BMM-H = BondMaster MIA housing Linked
Probe mode L = all probes can be ordered as linked; this provides support
PC = pitch-catch mode
for second-level PowerLink™ on the BondMaster™ 1000e+
MP = MIA mode
PR = resonance mode and on newer BondMaster instruments.
Note: When ordering BondMaster probes, use the order number provided in this catalog. For example: 9317812, for the S-PC-P1 probe.
4
BondMaster 1000e+ Test Modes
Pitch-Catch Test Mode
This mode uses high-frequency sound waves to
Over good bond Over bad bond
transmit surface waves into the test part. A separate
receiving element, a set distance from the transmit-
ter, picks up the energy transmitted into the mate-
rial. The sound waves are carried in a plate-wave
mode across the test piece between the two probe Acoustic energy
Transmit Receive Transmit Receive
tips. The return signals are detected and a phase-
Disbond
amplitude display is used to show the effects of
good and bad bonds on the sound path. This test
mode is typically used for skin-to-core defects.
Mechanical Impedance Analysis (MIA) Test Mode

The mechanical impedance analysis test mode
Over good bond Over bad bond
uses a single-tipped dual-element probe. A drive
element generates sound waves and a receive ele-
ment detects the effect of the structure on probe-
tip loading. During setup, the drive frequency
is swept from 2 kHz to 10 kHz to establish the
optimum test frequency. Testing is then performed
at a fixed frequency.
When the drive and receive elements are nulled
on a good bond, they vibrate together at the same In phase Phase shift
phase and amplitude. When the probe is placed
on a structure, the receiving element is affected by
the sample stiffness, which varies from bonded to
disbonded conditions. This change is monitored as
a comparison between the drive and receive phase
and amplitude signals. This test mode is typically
used for skin-to-core defects. Disbond
Resonance Test Mode

The contact transducer is driven at its resonance Top skin
frequency and coupled to the sample using a
low-viscosity couplant. This is critical for obtaining
repeatable results; standard UT couplant should
not be used. Impedance changes in the sensor
are analyzed to detect changes in the test sample.
Resonance is generally used for detecting skin-to-
skin disbonds such as with aircraft lap joints. This
mode also works well for disbonds and delaminat-
ed materials. In many cases the delamination depth
Glue line
can be estimated by the signal phase rotation. This
Defects
test mode is typically used for skin-to-skin or inter- -
laminar defects. CERAMIC

+
Note: Dimensions listed herein are approximate and are not to be used for design purposes.
Pitch-Catch Probes
Features
1. Quick inspection
2. Very easy to calibrate
3. High sensitivity to disbonds and material thicknesses
4. Capable of broadband and high voltage, offering additional capabilities for thicker laminates of stiffer materials.
5. Requires no couplant.
S-PC-P1
Order number: 9317812
Specifications
Operation mode: Pitch-catch
Frequency: Low
Tips: Fixed tips, 17 mm (0.67 in.) spacing.
Detection capability: Typically 12.7 mm (0.5 in.) or larger
Typical applications
• Detect disbonds between the skin and the core of composite
structures.
• Detect disbonds and core cutouts between the core and the skin
of honeycomb structures.
• Detect delamination between structural layers.
S-PC-P1L
L: Ordered with PowerLink™
6
S-PC-P2
Specifications
Frequency: Low
Tips: Spring-loaded tips, 19 mm (0.75 in.) spacing.
structures.
S-PC-P2L
S-PC-P3
Specifications
Frequency: High
Tips: Spring-loaded tips, 19 mm (0.75 in.) spacing
structures.
S-PC-P3L
S-PC-P11
Specifications
Frequency: Broadband
Tips: Spring-loaded tips, 17 mm (0.67 in.) spacing
structures.
S-PC-P11L
S-PC-P12
Specifications
Tips: Fixed tips, 17 mm (0.67 in.) spacing.
structures.
S-PC-P12L
S-PC-P13
Specifications
Frequency: Broadband, high-drive.
Tips: Spring-loaded tips, 17 mm (0.67 in.) spacing.
structures.
S-PC-P13L
SPO-5629-P
Specifications
Tips: Spring-loaded tips,12.7 mm (0.5 in.) spacing.
structures.
SPO-5629-PL
8
SPO-5629-PHV
Specifications
Frequency: Broadband, high voltage.
Tips: spacing 12.7 mm (0.5 in.), spring-loaded tips.
structures.
SPO-5629-PHVL
S-PC-DHV
Specifications
Operation mode: Pitch-catch, differential high-voltage.
Frequency: 5.1 kHz for structures thicker than 25.4 mm; 6 kHz to
12 kHz for structures thinner than 25.4 mm.
Pulse: Between 1 and 3
Tips: Four tips
Detection capability: Successful with a wide variety of materials, includ-
ing plastics and wood laminates.
structures.
• Developed for detection of far-surface skin-to-core defects.
Mechanical Impedance Analysis (MIA) Probes
Features
1. Easy to calibrate
2. Sensitive to smaller defects
3. Can be used on irregular and curved surfaces.
4. Works well to detect disbonds in crushed core conditions.
5. Suitable for continuous or mechanical scanning by using spring loading or constant pressure on the probe tip.
6. Requires no couplant.
S-MP-1
Specifications
Operation mode: MIA
Probe design: Right angle probe, not spring-loaded.
Tips: 12.7 mm (0.5 in.) tip diameter
Detection capability: Detect defects in graphite-composite skin bonded
to honeycomb.
• Can be used on irregular or curved surfaces.
• Suitable for detecting skin-to-core disbonds, crushed core, and
other typical skin-to-core bondline defects.
• Is used where there is limited access.
10
S-MP-2
• Works well on disbonds, crushed core, and bond defects on
the inside walls of composite structures.
• Is used where access is limited.
Specifications
Operation mode: MIA
Probe design: Straight probe, not spring-loaded.
Detection capability: Detect defects in graphite-composite skin
bonded to honeycomb.
S-MP-3
Specifications
Operation mode: MIA
Probe design: Right angle probe, requires BMM-H for spring loading.
Detection capability: Detect defects in graphite-composite skin
bonded to Nomex® honeycomb. 2-ply through 7-ply skin thickness.
Defects sized 25.4 mm by 50.8 mm. And 2-ply through 18-ply.
Defect size of 12.7 mm (0.5 in.) or larger.
• Suitable for detecting skin-to-core disbonds, crushed core,
and other typical skin-to-core bondline defects.
• Is suitable for continuous or mechanical scanning by using
S-MP-3L
S-MP-4
Specifications
Operation mode: MIA
Probe design: Right angle probe, requires BMM-H for spring loading.
Detection capability: Detect, on metal to metal, defects up to 2 mm
(0.08 in.) thickness in the bondline, 6.35 mm (0.25 in.) defect size
or larger; and on Fiberglass bonded to a foam core, defect size
of 12.7 mm (0.5 in.) or larger, and a maximum skin thickness of
6.35 mm (0.25 in.).
• Suitable for detecting skin-to-core disbonds, crushed core,
and other typical skin-to-core bondline defects.
• Is suitable for continuous or mechanical scanning by using
S-MP-4L
S-MP-5
Specifications
Operation mode: MIA
Probe design: Right angle probe, adjustable spring tension.
Detection capability: Internally spring-loaded three-position tension ad-
justments for greater consistency and accuracy. Especially well suited for
overhead inspection. Features removable Delrin® wear shoe.
• Suitable for detecting skin-to-core disbonds, crushed core, and
other typical skin-to-core bondline defects.
• Is suitable for continuous or mechanical scanning by using spring
loading or constant pressure on the probe tip.
S-MP-5L
BMM-H Probe Housing

Designed for use with S-MP-3 and S-MP-4 probes. Ensures constant
pressure is being applied to the part. Also greatly enhances stabil-
ity while keeping the probe perpendicular to the inspection surface.
Incorporates a Teflon® wear shoe. Spring-loaded probe holder.
12
Resonance Probes
Features
1. These probes work well for skin-to-skin disbonds and delaminated materials.
2. Determine in which layer defects are located for multilayer skin applications.
3. Can detect corrosion between layers.
S-PR-1
Specifications
Operation mode: Resonance
Frequency range: 35 kHz (±5 kHz)
Tips: 15.9 mm (0.63 in.) diameter case
Detection capability: Determine in which layer defects are located for
multilayer skin applications. For metal or composite applications.
• Used to inspect adhesive-bonded joints and detect corrosion in
multilayered joints.
• Can also find delamination and determine the thickness of
structures.
S-PR-1L
S-PR-2
Specifications
multilayer skin applications. For metal or composite applications.
• Used to detect adhesive-bonded joints and corrosion in
• Can also find delamination and the thickness of structures.
S-PR-2L
S-PR-3
Specifications
multilayer skin applications. For metal or composite applications. Detect
defects sized 12.7 mm (0.5 in.) or larger in fiberglass bonded to a foam
core. Maximum skin thickness is 6.35 mm (0.25 in.).
• Used to detect adhesive-bonded joints and corrosion in
• Can also find delamination and the thickness of structures.
S-PR-3L
S-PR-4
Specifications
Tips: 12.7 mm diameter case (0.5 in.)
defects size 12.7 mm (0.5 in.) or larger in fiberglass bonded to a foam
core. Maximum skin thickness is 6.35 mm (0.25 in.).
• This probe is used to detect adhesive-bonded joints and corrosion
in multilayered joints.
• It can also detect delamination and the thickness of structures.
S-PR-4L
14
S-PR-5
Specifications
defects sized 12.7 mm (0.5 in.) or larger on metal to metal. Defects from
2 mm (0.08 in.) (0.08 in.) up to 25.4 mm (1 in.) thickness in the bondline.
S-PR-5L
S-PR-6
Specifications
multilayer skin applications. Defect size 12.7 mm (0.5 in.) or larger for
graphite-composite defects; skin thickness, 2 ply through 18 ply.
S-PR-6L
Typical BondMaster 1000e+ Applications
Application Pitch-catch MIA Resonance
Metal-to-metal defects, up to 2.03 mm (0.08 in.) thickness in ✔ ✔

the bondline, 6.35 mm (0.25 in.) defect size or larger. (SM-P-2 or 4) (S–PR- 4, 5, or 6)
Metal-to-metal defects, up to 2.03 mm (0.08 in.) thickness in ✔ ✔ ✔

the bondline, 19.05 mm (0.75 in.) defect size or larger. (All probes) (All probes) (All probes)
Metal-to-metal defects, from 2.03 mm (0.08 in.) up to 25.4
mm (1 in.) thickness in the bondline, 12.7 mm (0.5 in.) defect ✔
size or larger. (S-PR-3, 4, or 5)
5 ply of graphite-composite skin bonded to aluminum. Hon- ✔ ✔

eycomb defect size, 12.7 mm (0.5 in.) or larger. (All probes) (All probes)
Graphite-composite skin bonded to Nomex honeycomb. 2 ply
through 7 ply skin thickness. Defects size 25.4 mm (1 in.) by ✔ ✔
50.8 mm (2 in.). (All probes) (All probes)
Graphite-composite defects, skin thickness 2 ply through 18 ✔ ✔ ✔

ply. Defect size 12.7 mm (0.5 in.) or larger. (S-PC-2 or 3) (SM-P-3 or 4) (S–PR-3, 4, 5, or 6)
Determine in which layer defects are located for multilayer ✔

skin applications. Metal or composite applications. (All probes)
Fiberglass bonded to a foam core. Maximum skin thickness ✔ ✔

6.35 mm (0.25 in.). Defect size 12.7 mm (0.5 in.) or larger. (All probes) (SM-P-2 or 4)
Pitch-Catch Probes Table

Order number Description
9317812 S-PC-P1: Low-frequency, fixed tips, 17 mm (0.67 in.) tip spacing.

9322117 S-PC-P1L: Low-frequency, fixed tips, 17 mm (0.67 in.) tip spacing (PowerLink)
9317854 S-PC-P2: Low-frequency, spring-loaded tips, 19 mm (0.75 in.) tip spacing.
9322118 S-PC-P2L: Low-frequency, spring-loaded tips, 19 mm (0.75 in.) tip spacing (PowerLink).
9317855 S-PC-P3: High frequency, spring-loaded tips, 19 mm (0.75 in.) tip spacing.
9322119 S-PC-P3L: High frequency, spring-loaded tips, 19 mm (0.75 in.) tip spacing (PowerLink).
9317797 S-PC-P11: Broadband, spring-loaded tips, 17 mm (0.67 in.) tip spacing.
9322115 S-PC-P11L: Broadband, spring-loaded tips, 17 mm (0.67 in.) tip spacing (PowerLink).
9322074 S-PC-P12: Broadband, fixed tips, 17 mm (0.67 in.) tip spacing, high voltage.
9322120 S-PC-P12L: Broadband, fixed tips, 17 mm (0.67 in.) tip spacing, high voltage (PowerLink).
9322076 S-PC-P13: Broadband, spring-loaded tips, 17 mm (0.67 in.) tip spacing, high voltage.
9322121 S-PC-P13L: Broadband, spring-loaded tips, 17 mm (0.67 in.) tip spacing, high voltage (PowerLink).
9318169 SPO-5629-P: Broadband, spring-loaded tips, 13 mm tip spacing.
9322151 SPO-5629-PL: Broadband, spring-loaded tips, 13 mm tip spacing (PowerLink).
9322184 SPO-5629-PHV: Broadband, spring-loaded tips, 13 mm tip spacing, high voltage.
9322185 SPO-5629-PHVL: Broadband, spring-loaded tips, 13 mm tip spacing, high voltage (PowerLink).
9323942 S-PC-DHV: Broadband, four spring-loaded elements.
16
MIA Probes Table
9317806 S-MP-1: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317807 S-MP-2: Straight probe, 6.35 mm (0.25 in.) tip diameter.
S-MP-3L: Right angle probe, 12.7 mm (0.5 in.) tip diameter. Can be used with spring-loaded BMM-H housing
9322123
(PowerLink).
S-MP-4L: Right angle probe, 6.35 mm (0.25 in.) tip diameter. Can be used with spring-loaded BMM-H housing
9322116
(PowerLink).
S-MP-5L: Right angle probe, 12.7 mm (0.5 in.) tip diameter. Internally spring-loaded three-position tension ad-
9322122 justments for greater consistency and accuracy. Especially well suited for overhead inspection. Features remov-
able Delrin wear shoe (PowerLink).
BMM-H: Designed for use with S-MP-3 and S-MP-4 probes. Ensures constant pressure is being applied to the
9316874 part. Also greatly enhances stability while keeping the probe perpendicular to the inspection surface. Incorpo-
rates a Teflon wear shoe. Spring-loaded probe holder.
Resonance Probes Table

9317809 S-PR-1: 35 kHz (±5 kHz) in a 15.9 mm (0.63 in.) diameter case
9322112 S-PR-1L: 35 kHz (±5 kHz) in a 15.9 mm (0.63 in.) diameter case (PowerLink).
BondMaster 1000e+ Probe Kits
Enhanced Probe Kit
The best combination of price and performance, offering the most versatile collection of BondMaster probes.
Order number: B1000-PK-01
Quantity Model Description

1 S-MP-5L Internally spring-loaded MIA probe
1 S-PC-P13L Broadband high-voltage P-C probe
1 S-PC-P12L Pitch-catch probe
1 S-PR-3L 110 kHz resonance probe
1 SBM-CPM-P11 Cable (P-C and MIA)
1 SBM-CR-P6 Cable (resonance)
1 Couplant (4 oz) For use with resonance probes
1 Probe case
18
Basic Probe Kit
Low cost with good functionality

1 S-MP-3 Standard size tip
1 BMM-H Probe housing
1 S-PC-P11 Pitch-catch probe
1 S-PR-4 165 kHz resonance probe
1 Probe case
Probe Kit
Increased functionality and versatility

1 S-MP-3 Standard size MIA probe
1 S-MP-4 Small MIA probe
1 Probe case
Deluxe Probe Kit

Exceptional functionality and versatility

1 Probe case
Northrop Deluxe Probe Kit
Northrop specific kit

1 Probe case
Air Force Probe Kit

Air Force specific kit

1 S-PR-2 65 kHz Resonance Probe
1 S-PC-P1 Pitch-catch probe, low voltage.
1 S-PC-P12 Pitch-catch probe, high voltage.
1 S-MP-5 Internal spring MIA probe
1 Teflon Tape 1
⁄4 in. wide roll
1 Couplant 4 oz For use with resonance probes
BondMaster 1000e+ General Accessories

Order number Descriptions Use
Cables
9117789 SBM-CPM-P11: 11-pin to 11-pin cable Use with pitch-catch and MIA probes.
9117790 SBM-CR-P6: 11-pin to 6-pin cable Use with resonance probes.
9117790 SBM-CR-P7: 11-pin to 7-pin cable Use with resonance probes.
Accessories
Use to optimize pitch-catch RF and impulse inspections above
9522107 Flush-mount tuning adapter
15 kHz.
3308193 Couplant (4 oz) Use with all resonance probes.
3303965 ¼ in. wide Teflon tape Use to protect the tips of MIA and resonance probes.
20
Probe Stabilization Tips and Active Probe Tips
Order number 2319989 1817235 2317768 2319970 2319988 2319939
Probe tips, Active probe tips, Mushroom Probe tips,

Description Probe tips Probe tips
chisel with O-rings tips round
To fit S-PC-P1 3
To fit S-PC-P2 2
To fit S-PC-P3 2
To fit S-PC-P11* 3 2 2
To fit S-PC-P12 3
To fit S-PC-P13* 3 2 2
To fit SPO-5629-P 2
To fit SPO-5629-PHV 2
4
To fit S-PC-DHV
(2 sets of 2 required)
* Tips are also available as a kit; see below.
BondMaster Pitch-Catch Refurbishment Kit
Stabilization probe tips
Order number: 2319939 Order number: 2319988
Active probe tips
Order number: 2317768 Order number: 2319970
Order number Description Use
Contain 3 x 2317768 and 2 x 2319970 (3 chisel-probe

tips and 2 active-probe tips with O-rings).
Used to change all the tips on the S-PC-P11 and S-PC-

B1000-PK-02
P13 probes.
Procedures for Replacing Probe Tips
Probe configurations include two fixed or spring-loaded active-
probe tips, and three white-plastic stabilization tips. Frequent or
inappropriate use will lead to deterioration of the tips. You can
easily and quickly replace the tips with new ones by following
the steps below.
1. Turn the probe and identify the tips that need to be replaced.
Probe stabilization tips
Active probe tips
To replace the active probe tips

1. With a pair of pliers or with your fingers, lightly grip the tips and pull them out of the probe.
2. Insert new active tips. You can use alcohol on the tips to make it easier to insert them into the probe.
To replace the probe stabilization tips

1. It is important to replace the stabilization tips one by one. After unscrewing each tip (with pliers or with your hands), make sure
that you replace the tip before removing the next one.
22
BondMaster Probe Chronology and Compatibility
Commercial detach-
Commercial detach- Navy (potted) probes
able probes with Commercial detach-
able probes* with with
resister and able probes with
resister and EPROM resister for PowerLink.
Instrument enhanced EPROM resister for PowerLink:
for PowerLink. Pitch- Resonance no. 3 and
for PowerLink. Pitch- Pitch-catch, MIA, and
catch, MIA, and reso- no. 5, pitch-catch
catch, MIA, and reso- resonance probes.
nance probes. no.1.
nance probes.
Navy BondMaster,
software version 1c ✔ ✔ ✔
Commercial BondMaster,
software version 1c ✔ ✔ ✔
Commercial BondMaster,
software version 2a ✔
LW Sonic BondMaster-Grey,
software version 2c ✔
LW Sonic BondMaster-
Black, software version 2d ✔ ✔
BondMaster 1000 ✔ ✔
BondMaster 1000+ ✔ ✔
BondMaster 1000e+ ✔ ✔
* S-MP-5, S-PC-P12, S-PC-13 probes will not work on Navy BondMaster and Commercial BondMaster (software version 1c).
Instrument identification:
• Navy BondMaster is typically painted white.
• Commercial BondMaster has a large lead-acid battery located at the back of the unit.
• LW Sonic BondMaster uses D-cell batteries.
• BondMaster 1000 uses 2 NiMH batteries
• BondMaster 1000+ uses 1 Li-ion battery
• BondMaster 1000e+ uses a field-replaceable Li-ion battery
Instrument probe connector:
All instruments listed above use an 11-probe connector at the front of the instrument.
Resonance probes:
There have been several different connectors on resonance probes. Use CAUTION to avoid cable-compatibility problems!
• Resonance no. 3 and no. 5: cable is potted into the probe.
• BMR-x probes use a 4-pin connector and an 11-pin to 4-pin cable (9116754)
• SPR-x and SPR-xL probes once used a 7-pin connector.
• SPR-x and SPR-xL probes are currently configured with a 6-pin connector, unless specifically requested with a 7 pin.
PowerLink™
With the PowerLink option, when a probe is connected to the BondMaster, the probe is identified and the instrument is automatically
configured for the probe type.
All BondMaster probes use some form of PowerLink. Certain probe types (S-PC-xL, S-MP-xL, S-PR xL) have enhanced PowerLink func-
tionality, which allows the instrument setting to be factory programmed into the probe.
How to Order
For pricing or for additional information, consult the ordering information outlined on page 4 and call your local sales representative.
To quickly locate your local sales representative, go to www.olympusNDT.com.
Disclaimer
This document was prepared with particular attention to usage to ensure the accuracy of the information contained therein. It corresponds
to the version of the products manufactured prior to the printing date. There may, however, be some differences between the catalog and the
products if the products have been modified thereafter.
The information contained in this document (including photographs, drawings, descriptions, and technical data) is subject to change without
notice.
www.olympusNDT.com
[email protected]
Olympus NDT
48 Woerd Avenue • Waltham, MA 02453 • USA
Tel.: (1) 781-419-3900 • Fax: (1) 781-419-3980
12569 Gulf Freeway • Houston, TX 77034 • USA
Tel.: (1) 281-922-9300 • Fax: (1) 952-487-8877
Olympus NDT UK LTD.
12 Nightingale Close • Rotherham, South Yorkshire S60 2AB • UK
Olympus Singapore PTE. LTD.
491B River Valley Road 12-01/04, Valley Point Office Tower, 248373 • Singapore
Olympus Australia PTY. LTD.
PO Box 985 • Mount Waverley, VIC 3149 • Australia
BM_Probe_Catalog_EN_0803 • Printed in Canada • Copyright © 2007–2008 by Olympus NDT.
All specifications are subject to change without notice. All brands are trademarks or registered trademarks of their respective owners.

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BondMaster

Probes and Accessories Catalog

Numbering System Used to Identify BondMaster 1000e+ Probes

Glossary Used to Identify BondMaster Probes

Product type Probe number

Mechanical Impedance Analysis (MIA) Test Mode

Resonance Test Mode

laminar defects. CERAMIC

BMM-H Probe Housing

Metal-to-metal defects, up to 2.03 mm (0.08 in.) thickness in ✔ ✔

Metal-to-metal defects, up to 2.03 mm (0.08 in.) thickness in ✔ ✔ ✔

5 ply of graphite-composite skin bonded to aluminum. Hon- ✔ ✔

Graphite-composite defects, skin thickness 2 ply through 18 ✔ ✔ ✔

Determine in which layer defects are located for multilayer ✔

Fiberglass bonded to a foam core. Maximum skin thickness ✔ ✔

Pitch-Catch Probes Table

9317812 S-PC-P1: Low-frequency, fixed tips, 17 mm (0.67 in.) tip spacing.

9317854 S-PC-P2: Low-frequency, spring-loaded tips, 19 mm (0.75 in.) tip spacing.

9318169 SPO-5629-P: Broadband, spring-loaded tips, 13 mm tip spacing.

9322151 SPO-5629-PL: Broadband, spring-loaded tips, 13 mm tip spacing (PowerLink).

9322184 SPO-5629-PHV: Broadband, spring-loaded tips, 13 mm tip spacing, high voltage.

9323942 S-PC-DHV: Broadband, four spring-loaded elements.

Resonance Probes Table

Quantity Model Description

Quantity Model Description

Quantity Model Description

Deluxe Probe Kit

Quantity Model Description

Quantity Model Description

Air Force Probe Kit

Quantity Model Description

BondMaster 1000e+ General Accessories

9117790 SBM-CR-P6: 11-pin to 6-pin cable Use with resonance probes.

9117790 SBM-CR-P7: 11-pin to 7-pin cable Use with resonance probes.

Probe tips, Active probe tips, Mushroom Probe tips,

* Tips are also available as a kit; see below.

BondMaster Pitch-Catch Refurbishment Kit

Stabilization probe tips

Order number: 2319939 Order number: 2319988

Active probe tips

Order number: 2317768 Order number: 2319970

Order number Description Use

Contain 3 x 2317768 and 2 x 2319970 (3 chisel-probe

Used to change all the tips on the S-PC-P11 and S-PC-

Probe stabilization tips

Active probe tips

To replace the active probe tips

To replace the probe stabilization tips

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