Dynamic Cold Plate

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DIRECT-TO-CHIP COOLING

Dynamic Cold Plate


®
Choose Your
Own Path
with Dynamic
Liquid Cooling

Our patented technology


focuses flow to chip hotspots
where it’s needed most

Motivair’s Dynamic® Cold Plates


harnesses innovative fluid dynamics
to redefine direct liquid cooling.

The free-flowing nature of the Dynamic®


Cold Plate accelerates particles and other
contaminants moving through and minimizes
risks of poor water quality. Our patented
technology enables robust performance and
allows CPUs, GPUs. APUs, and FPGAs to
operate at peak performance while reducing
the the possibility of cooling degradation and
costly system failures.

This simple yet effective technology is


optimized for cost efficient and scalable
production, targeted specifically for high-
performance computing, small-to-large
clusters and Exascale class systems.

All products are engineered and


manufactured in the USA, ensuring a
predictable, end-to-end experience while
eliminating the risks of foreign supply chain
disruptions.

DYNAMIC® COLD PLATE MODELS FEATURES

AMD SP5 GENOA


PROCESSOR FAMILY
AMD SP3 MILAN
PROCESSOR FAMILY
AMD INSTINCT
MI300
INTEL® XEON®
SCALABLE PROCESSOR
FAMILY (SAPPHIRE RAPIDS)
NVIDIA SXM5
PROCESSOR FAMILY
(H100 GPU)
INTEL® XEON®
SCALABLE PROCESSOR
FAMILY (ICE LAKE) 1 PATENTED THERMAL
TECHNOLOGY 2 SCALABLE TO
+1000 WATTS 3 NON-FOULING
DESIGN 4 PUSHLOK
CONNECTIONS 5 MADE IN
THE USA
Our technology harnesses Single-phase DLC offers Operate at peak Seamless, make-or-break Ensure a predictable,
innovative fluid dynamics accelerated performance, performance while connection of water transfer end to end experience
to redefine direct liquid scalability out to at least reducing the possibility of lines while eliminating the risks
cooling. 1,500 watts per processor, cooling degradation and of foreign supply chain
a key performance point costly system failures. disruptions.
enabling AI and a broader
adoption of HPC in
enterprise data centers.
Solve Today’s and Tomorrow’s Thermal Challenges

When it comes to addressing thermal challenges, you need to consider the end-to-end solution as a whole
– from the silicon out. Our team of engineers will work with you, leveraging our flexible and broad product
offerings to design optimized solutions for you based on your unique chip designs.

IN-RACK MANIFOLD

Motivair’s stainless steel manifolds provide a common connection point between Motivair’s
Dynamic™ Cold Plates and the supply and return cooling infrastructure system or Coolant
Distribution Unit.

Features
•304 Stainless Steel
•Variable Size Options 42U/48U/50U/Custom
•Universal Top/Bottom Design
•Made in USA

QUICK CONNECTS
Quick Connects provide a seamless, make-or-break connection of water transfer lines for
Motivair’s Dynamic™ Cold Plates

Features
•Designed from the ground up for data center liquid cooling
•Employs an advanced engineering polymers or materials for maximum fluid compatibility
and long service life
•Made in USA

Thermal Mapping
In addition to its portfolio of Dynamic
Cold Plates, Motivair also offers in-
house thermal design to help leverage
liquid-cooled cold plates for high-pow-
ered CPUs, GPUs, and FPGAs Using
advanced CFD software, Motivair can
develop custom server-specific water
loop designs based on your technolo-
gy needs
.
• Providing thermal solutions to en-
able the highest-powered proces-
sors in the IT industry
• Integrating into the most densely
packed server designs on the
market
• Facilitating the highest performance
efficiencies and
densities for HPC, AI and enter-
prise
We cool the most
advanced technology on the planet
We discover, design, and develop resilient thermal technologies and strategies,
and convert that into actionable insights and unparalleled value for our clients.

From climate research to finance, cloud to artificial intelligence, customers trust Motivair’s cooling technologies so they
can break new boundaries and help deliver tomorrow’s innovations faster.
We’re helping our clients discover cures for diseases, combat climate change, and make tomorrow’s data-driven
services more reliable and accessible.

We are touching millions of lives each day by providing the critical cooling technology to support productivity and
innovation that is changing our world.

DIRECT-TO-CHIP COOLING DATA CENTER & IT COOLING


Supercomputing isn’t just in the lab anymore. Designed for and used by the enterprise data center and
The power of high-performance computing is scaling out as more supercomputer owners and operators, our cooling technology is
enterprises and corporations look to utilize artificial intelligence for engineered to help you leap forward in scale, quality, and speed.
advanced decision-making and accelerate digital transformation.

THERMAL MANAGEMENT CLIENT SERVICES GROUP


When it comes to cooling your critical infrastructure, we work to Manage every aspect of your cooling infrastructure, from planning
customize specialty chiller technology for you, rather than selecting and design to start up, commissioning and post-sale performance.
from a catalog Your business depends not only on our products but also our ability
to respond when you need us.

MOTIVAIRCORP.COM | Global Headquarters 5900 Genesee St., Lancaster, NY 14086


©2023 Motivair Corporation. Motivair reserves the right to modify specifications without notice. Reproduction of this brochure in whole or part is prohibited.

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