Film Capacitors: EMI Suppression Capacitors (MKP)
Film Capacitors: EMI Suppression Capacitors (MKP)
Film Capacitors: EMI Suppression Capacitors (MKP)
© TDK Electronics AG 2023. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics' prior express consent is prohibited.
EMI suppression capacitors (MKP) B32912*5 ... B32918*5
X1 / 530 V AC
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1:2013):
40/110/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Small dimensions Drawing 2
Good self-healing properties
High voltage capability
RoHS-compatible
Halogen-free capacitors available on
request
Terminals
Parallel wire leads, lead-free tinned
Special lead lengths available on request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded), P1 = 20.3 mm
capacitance tolerance (code letter),
Dimensions in mm
rated AC voltage (IEC),
series number, sub-class (X1),
dielectric code (MKP), climatic category, Pin Lead Lead Type Drawing
passive flammability category, approvals. spacing diameter
±0.4 d1 ±0.05
Delivery mode
2 15 0.8 B32912*5 1
Bulk (untaped)
Taped (Ammo pack or reel) 2 22.5 0.8 B32913*5 1
For taping details, refer to chapter 2 27.5 0.8 B32914*5 1
"Taping and packing". 2/4 1)
37.5 1.0 B32916*5 1 / 21)
4 52.5 1.2 B32918*5 2
1) A few individual types only
Approvals
Approval marks Standards Certificate
EN 60384-14:2014/A1:2016 ENEC-04093 (approved by UL Demko)
IEC 60384-14:2013/AMD1:2016
UL 60384-14:2014, CSA E97863
E60384-14:2013
Technical data
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/µs.
Note:
The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the
capacitor.
Mounting guidelines
1 Soldering
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
Recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
The table below summarizes the safety instructions that must always be observed. A detailed
description can be found in the relevant sections of the chapters "General technical information"
and "Mounting guidelines".
ing codes are due to different processes employed and do not affect the specifications of the re-
spective products.
Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
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Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949 stan-
dard. The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and cus-
tomer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance
of unilateral requirements, we hereby like to emphasize that only requirements mutually
agreed upon can and will be implemented in our Quality Management System. For clari-
fication purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad,
CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, InsuGate,
LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap,
PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap
are trademarks registered or pend-ing in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2022-07
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