Chipone ICN6211
Chipone ICN6211
Chipone ICN6211
ICN6211 Specification
MIPI® DSI BRIDGE TO RGB output
Revision 0.4
NOTICE NOTICENOTICENOTICENOTICE
This design and all of its related documentation constitutes valuable and confidential
property of Chipone Technology (Beijing) Co., Ltd. It is licensed for use as expressly
stated in the written license Agreement between Chipone Technology (Beijing) Co.,
Ltd and its customers. Any other use or redistribution of this design and all related
documentation is expressly prohibited.
This design and all related documentation have been released by Chipone Technology
(Beijing) Co., Ltd to its customers under a Non Disclosure Agreement (NDA).
Disclosure of this design outside of this agreement is expressly prohibited.
NOTICE NOTICENOTICENOTICENOTICE
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ICN6211 Specification V0.4
Revision History
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ICN6211 Specification V0.4
Table of Contents
1 Introduction ................................................................................................................ - 5 -
1.1 Feature List ............................................................................................................................................ - 5 -
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ICN6211 Specification V0.4
Table of figures
Figure 2-1 ICN6211 function block diagram ..................................................................................................... - 6 -
Figure 3-1 ICN6211 system application diagram ............................................................................................... - 7 -
Figure 4-1 ICN6211 QFN48 pin diagram (Top View) ....................................................................................... - 8 -
Figure 6-1 DSI multi-lanes HS Transmission Example ................................................................................... - 11 -
Figure 6-2 DSI RGB666 Color format, Loosely Long Packet ......................................................................... - 12 -
Figure 6-3 DSI RGB666 Color format, Tightly Long Packet .......................................................................... - 12 -
Figure 6-4 DSI RGB888 Color format, Long Packet ....................................................................................... - 12 -
Figure 6-5 Non-Burst Mode with Sync Pulses ................................................................................................. - 13 -
Figure 6-6 Non-Burst Mode with Sync Events ................................................................................................ - 13 -
Figure 6-7 Burst mode ...................................................................................................................................... - 14 -
Figure 6-8 RGB output clock phase delay ........................................................................................................ - 16 -
Figure 6-9 Bist mode pattern sequence ............................................................................................................ - 16 -
Figure 7-1 DSI HS UI timing definition ........................................................................................................... - 20 -
Figure 7-2 DSI HS/LP signaling and Contention Voltage................................................................................ - 21 -
Figure 7-3 RGB output timing ......................................................................................................................... - 22 -
Figure 7-4 Power on and RESET and ULPS timing ........................................................................................ - 22 -
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ICN6211 Specification V0.4
1 Introduction
ICN6211 is a bridge chip which receives MIPI® DSI inputs and sends RGB outputs.
MIPI® DSI supports up to 4 lanes and each lane operates at 1Gbps maximum; the totally maximum input
bandwidth is 4Gbps; and the MIPI defined ULPS(ultra-low-power state) is also supported. ICN6211 decodes
MIPI® DSI 16bpp RGB565 and 18bpp RGB666 and 24bpp RGB888 packets.
The RGB output 18 or 24 bits pixel with pixel clock range of 25MHz to 154MHz.
Single Channel DSI Receiver with One, Two, Three and Four lanes configurable, each lanes operates up to
1Gbps.
Receives 16bpp RGB565 and 18bpp RGB666 and 24bpp RGB888 packets defined by DSI.
Supports MIPI Low State, Ultra-Low Power State, Shut Down mode.
Can adjust RGB Clock output phase(with 1/4, 1/2, 3/4 and fine adjust option) .
power supply : 1.8V/2.5V/3.3V for RGB output; 1.8V/2.5V/3.3V for MIPI and digital IO.
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ICN6211 Specification V0.4
Red[7:0]
LANE0
DA0P/N LP_TX Green[7:0]
LP_RX
Blue[7:0]
HS_RX
RGB Hsync
output
DA1P/N LANE1 LANE VIDEO FRC/ Vsync
same as lane0 MERGE RECOVER Hi-FRC
DE
DA2P/N LANE2 PCLK
same as lane0
DA3P/N LANE3
same as lane0
DACP/N LANE_CLK
LP_RX
HS_RX PLL
REFCLK
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ICN6211 Specification V0.4
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ICN6211 Specification V0.4
4 Pin Diagram
DATA_DE
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0
VSYNC
HSYNC
DATA6
PCLK
GND
36 35 34 33 32 31 30 29 28 27 26 25
DATA7 37 24 VDD2
DATA8 38 23 DA3N
DATA9 39 22 DA3P
VCORE 40 21 DA2N
DATA10 41 20 DA2P
DATA11 42 CHIPONE 19 DACN
DATA12 43 ICN6211 QFN48 18 DACP
DATA13 44 17 DA1N
DATA14 45 16 DA1P
DATA15 46 15 DA0N
DATA16 47 14 DA0P
DATA17 48 13 REF_CLK
1 2 3 4 5 6 7 8 9 10 11 12
DATA18
VDD1
DATA19
VDD3
DATA20
DATA21
DATA22
DATA23
TEST
SCL
SDA
EN
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ICN6211 Specification V0.4
5 Pin Description
Name Pin Number I/O Description
MIPI interface
RGB interface
DATA1 30 Output Red/Green/Blue color and bit order mapped onto DATA0 ~
DATA23 can be swapped flexibly, please refer to “RGB
DATA2 31 Output
output swap table”.
DATA3 32 Output
DATA4 33 Output
DATA5 34 Output
DATA6 36 Output
DATA7 37 Output
DATA8 38 Output
DATA9 39 Output
DATA10 41 Output
DATA11 42 Output
DATA12 43 Output
DATA13 44 Output
DATA14 45 Output
DATA15 46 Output
DATA16 47 Output
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ICN6211 Specification V0.4
DATA17 48 Output
DATA18 1 Output
DATA19 2 Output
DATA20 4 Output
DATA21 5 Output
DATA22 6 Output
DATA23 7 Output
MISC
Power/Ground
NOTE:
1. The use of two ceramic capacitors(2 x 1uF and 2 x 0.01uF) with pin VCORE provides good performance.
At least, one 1uF and one 0.01uF capacitor is necessary. Also, the trace between the decoupling capacitor
and pin should minimized.
2. REF_CLK can be used as the reference clock for RGB output. When it is not used, this pin should be
connected to GND.
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ICN6211 Specification V0.4
6 Function Description
Following figure illustrates the lane merging function for 4-lane, 3-lane, 2-lane and 1-lane separately.
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ICN6211 Specification V0.4
For the RGB666 tightly packet, the total line width(displayed plus non-displayed pixels) should be a multiple of
four pixels(nine bytes).
Non-Burst Mode with Sync Pulses: enables the peripheral to accurately reconstruct original video timing,
including sync pulse widths.
Non-Burst Mode with Sync Events: similar to above, but accurate reconstruction of sync pulse widths is not
required, so a single Sync Event is substituted.
Burst mode: RGB pixel packets are time-compressed, leaving more time during a scan line for LP
mode(saving power).
For all three sequences, the first line of a video frame shall start with a VSS packet, and all other lines start with
VSE or HSS. The position of the synchronization packets in time is of utmost importance since this has a direct
impact on the visual performance of the display panel; that is, the LVDS output video timing(HS-Horizontal
sync and VS-Vertical sync) are generated based on the synchronization.
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ICN6211 Specification V0.4
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ICN6211 Specification V0.4
In following table:
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ICN6211 Specification V0.4
The output RGB clock can be aligned with data/hsync/vsync/data_de, or delayed by 1/4, 1/2, 3/4 phase. Further
more, for each pahse, fine delay adjust can be added by fixed delay with the range between -2ns and +2ns.
DATA/DE
HSYNC/VSYNC
fine adjust
[-2ns,+2ns]
PCLK_phase0
PCLK_phase1
PCLK_phase2
PCLK_phase3
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ICN6211 Specification V0.4
Also, this method can write only one data in each packet.
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ICN6211 Specification V0.4
The chip device address is determined by the pin “ADDR” as below table:
0 1 0 1 1 0 ADDR 0/1
ST 0x58 ACK OFFSET ACK RESTART 0X59 ACK DATA0 ACK DATA1
…… DATAn NACK STOP.
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ICN6211 Specification V0.4
Supply Voltage Range VDD1 & VDD2 & VDD3 -0.3 3.66 V
Input Voltage Range EN & SCL & SDA -0.5 VDD1 + 0.3 V
Note: Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.
VDD VDD1 & VDD2 & VDD3 power supply 1.65 3.66 V
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ICN6211 Specification V0.4
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ICN6211 Specification V0.4
DSI
REFCLK
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ICN6211 Specification V0.4
tr, tf REFCLK rise and fall time 0.1 1 ns
FCLK
TCKH TCKL
PCLK
TDLY
HSYNC/VSYNC/DE
TDLY
DATA[23:0]
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ICN6211 Specification V0.4
8 Package information
Millimeter
Item Symbol
Min Typ Max
Total Thickness A 0.7 0.75 0.8
Stand Off A1 0 0.035 0.05
Mold Thickness A2 --- 0.55 0.57
L/F Thickness A3 0.203 REF
Lead Width b 0.15 0.20 0.25
D 6 BSC
Body Size
E 6 BSC
Lead Pitch e 0.4 BSC
J 4.1 4.2 4.3
EP Size
K 4.1 4.2 4.3
Lead Length L 0.35 0.4 0.45
Package Edge
aaa 0.1
Tolerance
Mold Flatness bbb 0.1
Co Planarity ccc 0.08
Lead Offset ddd 0.1
Exposed Pad Offset eee 0.1
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ICN6211 Specification V0.4
Important Notice
Chipone Technology (Beijing) Co., Ltd. (Chipone) reserves the right to make changes to their products or to discontinue any
product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before
placing orders, that information being relied on is current and complete. All products are sold subject to the terms and
conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement,
and limitation of liability.
Chipone warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance
with Chipone’s standard warranty. Testing and other quality control techniques are utilized to the extent Chipone deems
necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those
mandated by government requirements.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be
provided by the customer to minimize inherent or procedural hazards.
Chipone assumes no liability for applications assistance or customer product design. Chipone does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual
property right of Chipone covering or relating to any combination, machine, or process in which such semiconductor
products or services might be or are used. Chipone’s publication of information regarding any third party’s products or
services does not constitute Chipone’s approval, warranty or endorsement thereof.
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