Chipone ICN6211

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ICN6211 Specification V0.

ICN6211 Specification
MIPI® DSI BRIDGE TO RGB output

Revision 0.4

NOTICE NOTICENOTICENOTICENOTICE

This design and all of its related documentation constitutes valuable and confidential
property of Chipone Technology (Beijing) Co., Ltd. It is licensed for use as expressly
stated in the written license Agreement between Chipone Technology (Beijing) Co.,
Ltd and its customers. Any other use or redistribution of this design and all related
documentation is expressly prohibited.

This design and all related documentation have been released by Chipone Technology
(Beijing) Co., Ltd to its customers under a Non Disclosure Agreement (NDA).
Disclosure of this design outside of this agreement is expressly prohibited.

NOTICE NOTICENOTICENOTICENOTICE

Chipone Technology (Beijing) Co., Ltd


th
13 Floor, Test Tower, Building 4, 31 Middle North Third Ring Rd.,
Haidian District, Beijing, 100088
PRC
Contact: Simon Liu
Email: [email protected]

香港众鑫微电子有限公司 严晓叶 13713761058 q619733673

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ICN6211 Specification V0.4

Revision History

Rev Date Author Description

0.1 2014-03-25 Simon_Liu Initial version


0.2 2014-04-23 Simon_Liu 1. Update pin diagram and pin description
2. Add FRC/Hi-FRC function
3. Add RGB out clock phase control description
0.3 2014-06-19 Simon_Liu Update package diagram
0.4 2014-07-04 Simon_Liu VDD2 & VDD3 should be in same domain.

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ICN6211 Specification V0.4

Table of Contents
1 Introduction ................................................................................................................ - 5 -
1.1 Feature List ............................................................................................................................................ - 5 -

2 Functional Block Diagram ........................................................................................ - 6 -


3 System Application Diagram .................................................................................... - 7 -
4 Pin Diagram ................................................................................................................ - 8 -
5 Pin Description ........................................................................................................... - 9 -
6 Function Description ................................................................................................ - 11 -
6.1 MIPI Receiver...................................................................................................................................... - 11 -
6.1.1 DSI Lane Merging ................................................................................................................................. - 11 -
6.1.2 DSI Pixel Stream Packets ...................................................................................................................... - 11 -
6.1.3 DSI Video Transmission sequence ........................................................................................................ - 13 -
6.2 RGB output .......................................................................................................................................... - 15 -
6.3 RGB Clock phase adjust ..................................................................................................................... - 16 -
6.4 Bist mode .............................................................................................................................................. - 16 -
6.5 FRC/Hi-FRC function......................................................................................................................... - 17 -
6.6 DSI access local registers .................................................................................................................... - 17 -
6.6.1 Write local registers .............................................................................................................................. - 17 -
6.6.2 Read local registers ............................................................................................................................... - 17 -
6.7 I2C access local registers .................................................................................................................... - 18 -

7 DC and AC Electrical Characteristics ................................................................... - 19 -


7.1 ABSOLUTE MAXIMUM RATING .................................................................................................. - 19 -
7.2 RECOMMENDED OPERATING CONDITIONS .......................................................................... - 19 -
7.3 Electrical Characteristics.................................................................................................................... - 20 -
7.3.1 MIPI DSI INTERFACE ........................................................................................................................ - 20 -
7.3.2 RGB output ........................................................................................................................................... - 21 -
7.4 SWITCHING CHARACTERISTICS ............................................................................................... - 21 -

8 Package information ................................................................................................ - 23 -


Important Notice .................................................................................................................... - 24 -

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ICN6211 Specification V0.4

Table of figures
Figure 2-1 ICN6211 function block diagram ..................................................................................................... - 6 -
Figure 3-1 ICN6211 system application diagram ............................................................................................... - 7 -
Figure 4-1 ICN6211 QFN48 pin diagram (Top View) ....................................................................................... - 8 -
Figure 6-1 DSI multi-lanes HS Transmission Example ................................................................................... - 11 -
Figure 6-2 DSI RGB666 Color format, Loosely Long Packet ......................................................................... - 12 -
Figure 6-3 DSI RGB666 Color format, Tightly Long Packet .......................................................................... - 12 -
Figure 6-4 DSI RGB888 Color format, Long Packet ....................................................................................... - 12 -
Figure 6-5 Non-Burst Mode with Sync Pulses ................................................................................................. - 13 -
Figure 6-6 Non-Burst Mode with Sync Events ................................................................................................ - 13 -
Figure 6-7 Burst mode ...................................................................................................................................... - 14 -
Figure 6-8 RGB output clock phase delay ........................................................................................................ - 16 -
Figure 6-9 Bist mode pattern sequence ............................................................................................................ - 16 -
Figure 7-1 DSI HS UI timing definition ........................................................................................................... - 20 -
Figure 7-2 DSI HS/LP signaling and Contention Voltage................................................................................ - 21 -
Figure 7-3 RGB output timing ......................................................................................................................... - 22 -
Figure 7-4 Power on and RESET and ULPS timing ........................................................................................ - 22 -

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ICN6211 Specification V0.4

1 Introduction
ICN6211 is a bridge chip which receives MIPI® DSI inputs and sends RGB outputs.

MIPI® DSI supports up to 4 lanes and each lane operates at 1Gbps maximum; the totally maximum input
bandwidth is 4Gbps; and the MIPI defined ULPS(ultra-low-power state) is also supported. ICN6211 decodes
MIPI® DSI 16bpp RGB565 and 18bpp RGB666 and 24bpp RGB888 packets.

The RGB output 18 or 24 bits pixel with pixel clock range of 25MHz to 154MHz.

ICN6211 support video resolution up to FHD (1920x1080) and WUXGA(1920x1200).

ICN6211 adopts QFN48 pins package.

1.1 Feature List


 Supports MIPI® D-PHY Version 1.00.00 and MIPI® DSI Version 1.02.00.

 Single Channel DSI Receiver with One, Two, Three and Four lanes configurable, each lanes operates up to
1Gbps.

 Receives 16bpp RGB565 and 18bpp RGB666 and 24bpp RGB888 packets defined by DSI.

 Supports MIPI Low State, Ultra-Low Power State, Shut Down mode.

 Output RGB with pixel clock range of 25MHz to 154MHz.

 RGB output supports flexible swap.

 Can adjust RGB Clock output phase(with 1/4, 1/2, 3/4 and fine adjust option) .

 Provides FRC/Hi-FRC function to improve 18bpp image performance.

 power supply : 1.8V/2.5V/3.3V for RGB output; 1.8V/2.5V/3.3V for MIPI and digital IO.

 provide I2C slave interface.

 package: QFN48-pins with e-pad.

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ICN6211 Specification V0.4

2 Functional Block Diagram


Following figure shows a functional block diagram of the ICN6211.

Red[7:0]
LANE0
DA0P/N LP_TX Green[7:0]
LP_RX
Blue[7:0]
HS_RX
RGB Hsync
output
DA1P/N LANE1 LANE VIDEO FRC/ Vsync
same as lane0 MERGE RECOVER Hi-FRC
DE
DA2P/N LANE2 PCLK
same as lane0

DA3P/N LANE3
same as lane0

DACP/N LANE_CLK
LP_RX
HS_RX PLL

I2C SLAVE SCL/SDA

REFCLK

Figure 2-1 ICN6211 function block diagram

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ICN6211 Specification V0.4

3 System Application Diagram


In the diagram below shows the ICN6211’s system application.

mipi_lane0 Red[7:0] Source


mipi_lane1 Green[7:0] driver
Application mipi_lane2 Blue[7:0] PANEL
ICN6211 TCON
Processor mipi_lane3 HS/VS/DE Gate
mipi_clk PCLK
driver

Figure 3-1 ICN6211 system application diagram

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ICN6211 Specification V0.4

4 Pin Diagram

DATA_DE
DATA5
DATA4
DATA3
DATA2
DATA1
DATA0

VSYNC
HSYNC
DATA6

PCLK
GND
36 35 34 33 32 31 30 29 28 27 26 25
DATA7 37 24 VDD2
DATA8 38 23 DA3N
DATA9 39 22 DA3P
VCORE 40 21 DA2N
DATA10 41 20 DA2P
DATA11 42 CHIPONE 19 DACN
DATA12 43 ICN6211 QFN48 18 DACP
DATA13 44 17 DA1N
DATA14 45 16 DA1P
DATA15 46 15 DA0N
DATA16 47 14 DA0P
DATA17 48 13 REF_CLK
1 2 3 4 5 6 7 8 9 10 11 12
DATA18

VDD1
DATA19
VDD3
DATA20
DATA21
DATA22
DATA23
TEST
SCL
SDA
EN

Figure 4-1 ICN6211 QFN48 pin diagram (Top View)

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ICN6211 Specification V0.4

5 Pin Description
Name Pin Number I/O Description

MIPI interface

DA0P/DA0N 14/15 Input MIPI® D-PHY, data LANE0.

DA1P/DA1N 16/17 Input MIPI® D-PHY, data LANE1.

DA2P/DA2N 20/21 Input MIPI® D-PHY, data LANE2.

DA3P/DA3N 22/23 Input MIPI® D-PHY, data LANE3.

DACP/DACN 18/19 Input MIPI® D-PHY, clock LANE.

RGB interface

PCLK 25 Output Pixel clock

HSYNC 26 Output Horizontal sync signal

VSYNC 27 Output Vertical sync signal

DATA_EN 28 Output Data enable signal

DATA0 29 Output DATA0 ~ DATA23 output video data.

DATA1 30 Output Red/Green/Blue color and bit order mapped onto DATA0 ~
DATA23 can be swapped flexibly, please refer to “RGB
DATA2 31 Output
output swap table”.
DATA3 32 Output

DATA4 33 Output

DATA5 34 Output

DATA6 36 Output

DATA7 37 Output

DATA8 38 Output

DATA9 39 Output

DATA10 41 Output

DATA11 42 Output

DATA12 43 Output

DATA13 44 Output

DATA14 45 Output

DATA15 46 Output

DATA16 47 Output

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ICN6211 Specification V0.4
DATA17 48 Output

DATA18 1 Output

DATA19 2 Output

DATA20 4 Output

DATA21 5 Output

DATA22 6 Output

DATA23 7 Output

MISC

EN 11 input When EN is low, this chip is reset.

REF_CLK 13 input Optional reference clock for RGB output clock.

SCL 9 input Local I2C bus, weakly PULL UP.

SDA 10 inout Local I2C bus, weakly PULL UP.

TEST 8 input For test, when work, connect to GND.

Weakly PULL DOWN.

Power/Ground

GND 35 Power Ground

VDD1 12 Power MIPI RX power supply, can be 1.8V/2.5V/3.3V

VDD2 24 Power PLL power supply, can be 1.8V/2.5V/3.3V

VDD3 3 Power RGB output power supply, can be 1.8V/2.5V/3.3V

VCORE 40 Power Output from voltage regulator for digital core.

NOTE:

1. The use of two ceramic capacitors(2 x 1uF and 2 x 0.01uF) with pin VCORE provides good performance.
At least, one 1uF and one 0.01uF capacitor is necessary. Also, the trace between the decoupling capacitor
and pin should minimized.

2. REF_CLK can be used as the reference clock for RGB output. When it is not used, this pin should be
connected to GND.

3. SCL/SDA/EN/TEST should be corresponding to VDD1 power supply.

4. VDD2 and VDD3 should be in the same power domain.

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ICN6211 Specification V0.4

6 Function Description

6.1 MIPI Receiver

6.1.1 DSI Lane Merging


ICN6211 support four DSI data lanes, and may be configured to one, two or three DSI data lanes. Unused DSI
input lanes should be left unconnected or driven to LP11 state.

Following figure illustrates the lane merging function for 4-lane, 3-lane, 2-lane and 1-lane separately.

Figure 6-1 DSI multi-lanes HS Transmission Example

6.1.2 DSI Pixel Stream Packets


ICN6211 receives and interpret 18bpp(RGB666) , 24bpp(RGB888) DSI packets and translates to video stream.

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ICN6211 Specification V0.4

Figure 6-2 DSI RGB666 Color format, Loosely Long Packet

Figure 6-3 DSI RGB666 Color format, Tightly Long Packet

For the RGB666 tightly packet, the total line width(displayed plus non-displayed pixels) should be a multiple of
four pixels(nine bytes).

Figure 6-4 DSI RGB888 Color format, Long Packet


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ICN6211 Specification V0.4

6.1.3 DSI Video Transmission sequence


ICN6211 supports Non-Burst Mode with Sync Pulses, Non-Burst Mode with Sync Events and Burst mode.

 Non-Burst Mode with Sync Pulses: enables the peripheral to accurately reconstruct original video timing,
including sync pulse widths.

 Non-Burst Mode with Sync Events: similar to above, but accurate reconstruction of sync pulse widths is not
required, so a single Sync Event is substituted.

 Burst mode: RGB pixel packets are time-compressed, leaving more time during a scan line for LP
mode(saving power).

For all three sequences, the first line of a video frame shall start with a VSS packet, and all other lines start with
VSE or HSS. The position of the synchronization packets in time is of utmost importance since this has a direct
impact on the visual performance of the display panel; that is, the LVDS output video timing(HS-Horizontal
sync and VS-Vertical sync) are generated based on the synchronization.

Figure 6-5 Non-Burst Mode with Sync Pulses

Figure 6-6 Non-Burst Mode with Sync Events

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ICN6211 Specification V0.4

Figure 6-7 Burst mode

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ICN6211 Specification V0.4

6.2 RGB output


ICN6211 supports RGB666 and RGB888 output.

In following table:

Group_0[7:0] = { DATA7, DATA6, DATA5, DATA4, DATA3, DATA2, DATA1, DATA0};

Group_1[7:0] = { DATA15, DATA14, DATA13, DATA12, DATA11, DATA10, DATA9, DATA8}

Group_2[7:0]= {DATA23, DATA22, DATA21, DATA20, DATA19, DATA18, DATA17, DATA16};

Red0[7:0], Green0[7:0], Blue[7:0] is the input video data.

For RGB666, color[5] is MSB & color[0] is LSB;

For RGB888, color[7] is MSB & color[0] is LSB.

Color may be red or green or blue.

Group_X may be Group_0 or Group_1 or Group_2.

RGB color swap mode


RGB_SWAP 000 001 010 011 100 101

Group_0 Red[7:0] Red[7:0] Green[7:0] Green[7:0] Blue[7:0] Blue[7:0]

Group_1 Green[7:0] Blue[7:0] Red[7:0] Blue[7:0] Red[7:0] Green[7:0]

Group_2 Blue[7:0] Green[7:0] Blue[7:0] Red[7:0] Green[7:0] Red[7:0]

Data bit order mode


RGB666 RGB888
BIT_ORDER
000 001 010 011 100 101

Group_X[7] invalid invalid Color[5] Color[0] Color[7] Color[0]

Group_X[6] invalid invalid Color[4] Color[1] Co]lor[6 Color[1]

Group_X[5] Color[5] Color[0] Color[3] Color[2] Color[5] Color[2]

Group_X[4] Color[4] Color[1] Color[2] Color[3] Color[4] Color[3]

Group_X[3] Color[3] Color[2] Color[1] Color[4] Color[3] Color[4]

Group_X[2] Color[2] Color[3] Color[0] Color[5] Color[2] Color[5]

Group_X[1] Color[1] Color[4] invalid invalid Color[1] Color[6]

Group_X[0] Color[0] Color[5] invalid invalid Color[0] Color[7]

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ICN6211 Specification V0.4

6.3 RGB Clock phase adjust


ICN6211 provides RGB output clock phase adjust options, which can compensate the mismatch in case of
routing or other reasons, such will make easier for PCB routing or system cable connection.

The output RGB clock can be aligned with data/hsync/vsync/data_de, or delayed by 1/4, 1/2, 3/4 phase. Further
more, for each pahse, fine delay adjust can be added by fixed delay with the range between -2ns and +2ns.

DATA/DE
HSYNC/VSYNC
fine adjust
[-2ns,+2ns]
PCLK_phase0

PCLK_phase1

PCLK_phase2

PCLK_phase3

Figure 6-8 RGB output clock phase delay

6.4 Bist mode


ICN6211 goes into bist mode when configure register is enabled, five built-in images as below are displayed
sequentially; and the interval time can be set (default is about 2ms).

Pattern1: White Pattern2: Black

Pattern5: Blue Pattern4: Green Pattern3: Red

Figure 6-9 Bist mode pattern sequence

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ICN6211 Specification V0.4

6.5 FRC/Hi-FRC function


If we display directly RGB888 video data on panel with capability of RGB666, the grey will be lost and the
image’s quality will be degraded. ICN6211 provides FRC/Hi-FRC functions to process the image data and
provide a more attractive image performance for RGB666 panel.

6.6 DSI access local registers

6.6.1 Write local registers


There are two methods to write local registers.

These two method must be used under ESCAPE mode.

 Use Generic Short WRITE with 2 parameters( DI = 0x23)

The format is as below:

DI(0x23) + offset[7:0] + data + ECC.

Please note that the offset is only 8bits.

Also, this method can write only one data in each packet.

 Use Generic Long Write( DI = 0x29)

The format is as below:

DI(0x29) + WC[7:0] + WC[15:8] + ECC + offset[7:0] + data(1) + data(2) + …… + data(n) + CHKSUM[7:0] +


CHKSUM[15:8].

where: n = WC[15:0] – 1..

In this case, the data length can be 65535 maximum.

6.6.2 Read local registers


Use Generic READ with 2 parameters(0x24), this method can be used under HS mode or ESCAPE MODE.

The format is as below:

DI(0x24) + offset[7:0] + length[7:0] + ECC.

Please note that the offset is only 8bits.

The read length can be 255 maximum.

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ICN6211 Specification V0.4

6.7 I2C access local registers


ICN6211 support standard I2C protocol with speed up to 400K.

The chip device address is determined by the pin “ADDR” as below table:

BIT7(MSB) BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0(W/R)

0 1 0 1 1 0 ADDR 0/1

When ADDR = 1, device address is 0x5A(Write) and 0x5B(Read);

When ADDR = 0, device address is 0x58(Write) and 0x59(Read).

following example is operation procedure with ADDR = 0.

 Write one byte to certain offset

ST  0x58  ACK  OFFSET  ACK  DATA  ACK  STOP.

 Write more bytes to successive address.

ST  0x58  ACK  OFFSET  ACK  DATA0  ACK  DATA1  ……  DATAn  ACK 


STOP.

 Read data from certain offset.

ST  0x58  ACK  OFFSET  ACK  RESTART  0X59  ACK  DATA0  ACK  DATA1
 ……  DATAn  NACK  STOP.

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ICN6211 Specification V0.4

7 DC and AC Electrical Characteristics

7.1 ABSOLUTE MAXIMUM RATING


MIN MAX UNIT

Supply Voltage Range VDD1 & VDD2 & VDD3 -0.3 3.66 V

Input Voltage Range EN & SCL & SDA -0.5 VDD1 + 0.3 V

DSI input -0.4 1.4 V

Storage Temperature Ts -65 105 ℃

Electrostatic discharge Human Body Model ±2 KV

Charged-device model ±500 V

Note: Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.

7.2 RECOMMENDED OPERATING CONDITIONS


MIN TYP MAX UNIT

VDD VDD1 & VDD2 & VDD3 power supply 1.65 3.66 V

VPSN Supply noise on any VCC pin f(noise) >


0.05 V
1MHz

TA Operating free-air temperature -40 85 ℃

TCASE Case temperature 92.2 ℃

VDSI_PIN DSI input pin voltage range -50 1350 mV

f(I2C) Local I2C input frequency 400 KHz

fHS_CLK DSI HS clock input frequency 40 500 MHz

tsetup DSI HS data to clock setup time(Figure 7-1) 0.15 UI

thold DSI HS data to clock hold time(Figure 7-1) 0.15 UI

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ICN6211 Specification V0.4

Figure 7-1 DSI HS UI timing definition

7.3 Electrical Characteristics

7.3.1 MIPI DSI INTERFACE


Refer to Figure 7-2.

parameter Description MIN TYP MAX UNIT

VIL Low Power logic 1 input voltage 880 mV

VIH Low Power logic 0 input voltage 550 mV

|VID| HS differential input voltage: |Vdp – Vdn| 70 200 270 mV

|VIDT| HS differential input voltage threshold 50 mV

VIL-ULPS Low Power receiver logic 0 voltage, ULP


300 mV
state

VCMRX(DC) Common-mode voltage HS receive mode 70 330 mV

△VCMRX(HF) HS common-mode interference 100 mV

VIHHS HS single-ended input high voltage 460 mV

VILHS HS single-ended input low voltage -40 mV

VTERM-EN Single-ended threshold for HS termination


450 mV
enable

ZID Differential input impedance 80 100 124 Ω

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ICN6211 Specification V0.4

Figure 7-2 DSI HS/LP signaling and Contention Voltage

7.3.2 RGB output


parameter Description MIN TYP MAX UNIT

VOH output voltage, high level 0.8 * VDD3 VDD3 V

VOL Output voltage, low level 0 0.2 * VDD3 V

7.4 SWITCHING CHARACTERISTICS


Parameter Description MIN TYP MAX UNIT

DSI

tGS DSI LP input pulse rejection 300 ps

RGB output (refer to Figure 7-4)

FCLK Output pixel clock 20 154 MHz

TCKH Pixel clock HIGH period 40% 50% 60%

TCKL Pixel clock HIGH period 40% 50% 60%

TDLY DATA and sync signals related to PCLK 0 800 ps

REFCLK

FREFCLK REFCLK Frequency 25 154 MHz

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ICN6211 Specification V0.4
tr, tf REFCLK rise and fall time 0.1 1 ns

tpj REFCLK peak-to-peak phase jitter 50 ps

Duty REFCLK duty cycle 40% 50% 60%

EN, ULPS, RESET (refer to Figure 7-5)

ten Enable time from EN or ULPS 1 ms

tdis Disable time to standby 0.1 ms

treset Reset time 10 ms

FCLK
TCKH TCKL

PCLK
TDLY

HSYNC/VSYNC/DE
TDLY

DATA[23:0]

Figure 7-3 RGB output timing

Figure 7-4 Power on and RESET and ULPS timing

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ICN6211 Specification V0.4

8 Package information

Millimeter
Item Symbol
Min Typ Max
Total Thickness A 0.7 0.75 0.8
Stand Off A1 0 0.035 0.05
Mold Thickness A2 --- 0.55 0.57
L/F Thickness A3 0.203 REF
Lead Width b 0.15 0.20 0.25
D 6 BSC
Body Size
E 6 BSC
Lead Pitch e 0.4 BSC
J 4.1 4.2 4.3
EP Size
K 4.1 4.2 4.3
Lead Length L 0.35 0.4 0.45
Package Edge
aaa 0.1
Tolerance
Mold Flatness bbb 0.1
Co Planarity ccc 0.08
Lead Offset ddd 0.1
Exposed Pad Offset eee 0.1

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ICN6211 Specification V0.4

Important Notice
Chipone Technology (Beijing) Co., Ltd. (Chipone) reserves the right to make changes to their products or to discontinue any
product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before
placing orders, that information being relied on is current and complete. All products are sold subject to the terms and
conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement,
and limitation of liability.

Chipone warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance
with Chipone’s standard warranty. Testing and other quality control techniques are utilized to the extent Chipone deems
necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those
mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF


DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). CHIPONE SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF CHIPONE PRODUCTS IN SUCH APPLICATIONS IS
UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be
provided by the customer to minimize inherent or procedural hazards.

Chipone assumes no liability for applications assistance or customer product design. Chipone does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual
property right of Chipone covering or relating to any combination, machine, or process in which such semiconductor
products or services might be or are used. Chipone’s publication of information regarding any third party’s products or
services does not constitute Chipone’s approval, warranty or endorsement thereof.

Copyright ◎ 2013, Chipone Technology (Beijing) Co., Ltd.

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