Infineon FF450R08A03P2 DataSheet
Infineon FF450R08A03P2 DataSheet
Infineon FF450R08A03P2 DataSheet
FF450R08A03P2
FinalDataSheet
V3.0,2020-05-11
AutomotiveHighPower
FF450R08A03P2
DoubleSideCooledModule
1Features/Description
VCES = 750 V
IC = 450 A
TypicalApplications Description
• AutomotiveApplications The HybridPACKTM DSC S2 is a very compact
• HybridElectricalVehicles(H)EV half-bridge module targeting hybrid and electric
vehicles.
• Optimized for automotive applications with DC link
The module is based on Infineon’s long-term
voltages up to 450 V and gate driver voltage level
experience developing IGBT power modules and
of-8V/+15V
implements the EDT2 IGBT generation, which is an
automotive Micro-Pattern Trench-Field-Stop cell
ElectricalFeatures design optimized for electric drive train applications.
The chipset has benchmark current density
• IntegratedCurrentSensor combined with short circuit ruggedness and
• IntegratedTemperatureSensor increased blocking voltage for reliable inverter
• LowInductiveDesign operation under harsh environmental conditions.
• Blockingvoltage750V The EDT2 IGBTs also show excellent light load
power losses, which helps to improve System
• LowSwitchingLosses efficiency over a real driving cycle. The EDT2 IGBT
• Short-time extended Operation Temperature was optimized for applications with switching
Tvjop=175°C frequencies in the range of 10 kHz. Additionally,
on-die integrated current sensor and temperature
sensor allow precise monitoring of IGBT state.
MechanicalFeatures These features enable enhanced protection and
• 2.5kVAC1minInsulation intelligent control of the system.
• Doublesidedcooling
The innovative and small package is designed for
• Compactdesign
Double Sided Cooling (DSC) with superior thermal
• RoHScompliant performance. The low stray inductance and
increased blocking voltage support the design of
systems with a very high efficiency. Furthermore,
new material combinations and assembly
technologies enable best thermal and electrical
performance at highest reliability and mechanical
robustness.
ProductName OrderingCode
FF450R08A03P2 SP001630036
2IGBT,Inverter
2.1MaximumRatedValues
Parameter Conditions Symbol Value Unit
Collector-emittervoltage Tvj = 25°C VCES 750 V
Implementedcollectorcurrent ICN 450 A
ContinuousDCcollectorcurrent TC = 120°C, Tvj max = 175°C IC nom 300 A
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 900 A
Totalpowerdissipation TC = 25°C, Tvj max = 175°C Ptot 1667 W
Gate-emitterpeakvoltage VGES +/-20 V
1)
with double sided cooling, evaluation according to HybridPACK cool application note
Final Data Sheet 3 V3.0,2020-05-11
FF450R08A03P2
DoubleSideCooledModule
3Diode,Inverter
3.1MaximumRatedValues
Parameter Conditions Symbol Value Unit
Repetitivepeakreversevoltage Tvj = 25°C VRRM 750 V
Implementedforwardcurrent IFN 450 A
ContinuousDCforwardcurrent IF 300 A
Repetitivepeakforwardcurrent tP = 1 ms IFRM 900 A
I²t-value VR = 0 V, tP = 10 ms, Tvj = 150°C I²t 8500 A²s
4Module
Parameter Conditions Symbol Value Unit
Isolationtestvoltage RMS, f = 50 Hz, t = 1 min. VISOL 2.5 kV
Materialofmodulebaseplate Cu
Internalisolation basicinsulation(class1,IEC61140) Al2O3
Creepagedistance terminaltoheatsink
dCreep mm
terminaltoterminal 3.5
Clearance terminaltoheatsink
dClear mm
terminaltoterminal 3.5
Comperativetrackingindex CTI > 600
min. typ. max.
Strayinductancemodule LsCE 15 nH
Storagetemperature Tstg -40 125 °C
Terminalconnectiontorque ScrewM5 M - Nm
Mounting force per clamp F - 750 N
Weight G 31 g
5TemperatureSensor
Parameter Conditions Symbol Min Typ Max Unit
Forwardvoltage ITS = 0.22 mA, Tvj = 25°C VTS 2)
2.220 2.280 2.340 2)
V
temperaturecoefficient(tcr) ITS = 0.22 mA TCTS -5.50 mV/K
1)
with double sided cooling, evaluation according to HybridPACK cool application note
2)
Verified by design, not by test
Final Data Sheet 4 V3.0,2020-05-11
FF450R08A03P2
DoubleSideCooledModule
6CurrentSensor
Parameter Conditions Symbol Min Typ Max Unit
Outputvoltage VCE = 1.85 V, IC = 900 A
Rsense = 2.40 Ω, Tvj = 25°C Vsense 0.55 V
VGE = 15 V
8CharacteristicsDiagrams
outputcharacteristicIGBT,Inverter(typical) outputcharacteristicIGBT,Inverter(typical)
IC=f(VCE) IC=f(VCE)
VGE=15V Tvj=175°C
900 900
Tvj = 25°C VGE = 19V
Tvj = 150°C VGE = 17V
800 Tvj = 175°C 800 VGE = 15V
VGE = 13V
VGE = 11V
700 700 VGE = 9V
600 600
500 500
IC [A]
IC [A]
400 400
300 300
200 200
100 100
0 0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0
VCE [V] VCE [V]
transfercharacteristicIGBT,Inverter(typical) switchinglossesIGBT,Inverter(typical)
IC=f(VGE) Eon=f(IC),Eoff=f(IC)
VCE=20V VGE=-8/+15V,RGon=3.6Ω,RGoff=2.4Ω,VCE=400V
900 40
Tvj = 25°C Eon, Tvj = 150°C
Tvj = 150°C Eoff, Tvj = 150°C
800 Tvj = 175°C 35 Eon, Tvj = 175°C
Eoff, Tvj = 175°C
700
30
600
25
500
E [mJ]
IC [A]
20
400
15
300
10
200
100 5
0 0
5 6 7 8 9 10 11 12 13 0 100 200 300 400 500 600
VGE [V] IC [A]
switchinglossesIGBT,Inverter(typical) transientthermalimpedanceIGBT,Inverter
Eon=f(RG),Eoff=f(RG) ZthJH=f(t)
VGE=-8/+15V,IC=300A,VCE=400V
30 1
Eon, Tvj = 150°C ZthJH : IGBT
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
Eoff, Tvj = 175°C
25
0,1
ZthJH [K/W]
E [mJ]
20
0,01
15
i: 1 2 3 4
ri[K/W]: 0,007845 0,02284 0,08379 0,06864
τi[s]: 0,0003479 0,013 0,1423 0,5561
10 0,001
2 4 6 8 10 12 0,001 0,01 0,1 1 10
RG [Ω] t [s]
reversebiassafeoperatingareaIGBT,Inverter(RBSOA) forwardcharacteristicofDiode,Inverter(typical)
IC=f(VCE) IF=f(VF)
VGE=±15V,RGoff=2.4Ω,Tvj=175°C
1000 900
Ic, Modul Tvj = 25°C
IC, Chip Tvj = 150°C
900 800 Tvj = 175°C
800
700
700
600
600
500
IC [A]
IF [A]
500
400
400
300
300
200
200
100 100
0 0
0 100 200 300 400 500 600 700 800 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4
VCE [V] VF [V]
switchinglossesDiode,Inverter(typical) switchinglossesDiode,Inverter(typical)
Erec=f(IF) Erec=f(RG)
RGon=3.6Ω,VCE=400V IF=300A,VCE=400V
12 12
Erec, Tvj = 150°C Erec, Tvj = 150°C
Erec, Tvj = 175°C Erec, Tvj = 175°C
10 10
8 8
E [mJ]
E [mJ]
6 6
4 4
2 2
0 0
0 100 200 300 400 500 600 2 3 4 5 6 7 8 9 10
IF [A] RG [Ω]
transientthermalimpedanceDiode,Inverter
ZthJH=f(t)
1
ZthJH : Diode
0,1
ZthJH [K/W]
0,01
i: 1 2 3 4
ri[K/W]: 0,01463 0,03657 0,1284 0,09856
τi[s]: 0,0003128 0,01194 0,119 0,4694
0,001
0,001 0,01 0,1 1 10
t [s]
9Circuitdiagram
10Packageoutlines
RevisionHistory
Major changes since previous revision
Revision History
Reference Date Description
V2.0 2018-12-06 -
V2.1 2020-04-16 Correction of package outlines
V3.0 2020-05-11 Final datasheet
Terms&Conditionsofusage
Edition2018-08-01
Publishedby
InfineonTechnologiesAG
81726Munich,Germany
©2018InfineonTechnologiesAG
AllRightsReserved.
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examplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,Infineon
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