TSMF1000, TSMF1020, TSMF1030

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Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS Compliant,
890 nm, GaAlAs Double Hetero
FEATURES
• Package type: surface mount
TSMF1000 TSMF1020
• Package form: GW, RGW, yoke, axial
• Dimensions (L x W x H in mm): 2.5 x 2 x 2.7
• Peak wavelength: p = 890 nm
• High radiant power

TSMF1030 • Angle of half intensity:  = ± 17°

• Low forward voltage
• Suitable for high pulse current operation
• Versatile terminal configurations
16758-5
• Package matches with detector TEMD1000
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Compliant to RoHS Directive 2002/95/EC and in
accordance with WEEE 2002/96/EC
DESCRIPTION
TSMF1000 series are infrared, 890 nm emitting diodes in APPLICATIONS
GaAlAs double hetero (DH) technology with high radiant • IrDA compatible data transmission
power and high speed, molded in clear, untinted plastic
• Miniature light barrier
packages (with lens) for surface mounting (SMD).
• Photointerrupters
• Optical switch
• Control and drive circuits
• Shaft encoders

PRODUCT SUMMARY
COMPONENT Ie (mW/sr)  (deg) P (nm) tr (ns)
TSMF1000 5 ± 17 890 30
TSMF1020 5 ± 17 890 30
TSMF1030 5 ± 17 890 30
Note
• Test conditions see table “Basic Characteristics”

ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
TSMF1000 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing
TSMF1020 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing
TSMF1030 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Yoke
Note
• MOQ: minimum order quantity

Rev. 1.8, 30-Jun-11 1 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR 5 V
Forward current IF 100 mA
Peak forward current tp/T = 0.5, tp  100 μs IFM 200 mA
Surge forward current tp = 100 μs IFSM 0.8 A
Power dissipation PV 180 mW
Junction temperature Tj 100 °C
Operating temperature range Tamb - 40 to + 85 °C
Storage temperature range Tstg - 40 to + 100 °C
Soldering temperature t5s Tsd 260 °C
Soldered on PCB, pad dimensions:
Thermal resistance junction/ambient RthJA 400 K/W
4 mm x 4 mm

200 120
180
PV - Power Dissipation (mW)

160 100

IF - Forward Current (mA)

140
80
120
100 60
80 RthJA = 400 K/W RthJA = 400 K/W
40
60
40
20
20
0 0
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
21165 Tamb - Ambient Temperature (°C) 21166 Tamb - Ambient Temperature (°C)

Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature

BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
IF = 20 mA VF 1.3 1.5 V
Forward voltage
IF = 1 A, tp = 100 μs VF 2.4 V
Temperature coefficient of VF IF = 1 mA TKVF - 1.8 mV/K
Reverse current VR = 5 V IR 10 μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 Cj 160 pF
IF = 20 mA Ie 2.5 5 13 mW/sr
Radiant intensity
IF = 100 mA, tp = 100 μs Ie 25 mW/sr
Radiant power IF = 100 mA, tp = 20 ms e 35 mW
Temperature coefficient of e IF = 20 mA TKe - 0.6 %/K
Angle of half intensity  ± 17 deg
Peak wavelength IF = 20 mA p 890 nm
Spectral bandwidth IF = 20 mA  40 nm
Temperature coefficient of p IF = 20 mA TKp 0.2 nm/K
Rise time IF = 20 mA tr 30 ns
Fall time IF = 20 mA tf 30 ns
Cut-off frequency IDC = 70 mA, IAC = 30 mA pp fc 12 MHz
Virtual source diameter d 1.2 mm

Rev. 1.8, 30-Jun-11 2 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TSMF1000, TSMF1020, TSMF1030
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Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

10 000 1000
Tamb < 60 °C
tp/T = 0.005
0.01

Φe - Radiant Power (mW)

IF - Forward Current (mA)

1000 100
0.02
0.05
100 0.2 10
0.5
DC
10 0.1 1

1 0.1
0.01 0.1 1 10 100
10 0 10 1 10 2 10 3 10 4
95 9985 tp - Pulse Length (ms) 94 8007 I F - Forward Current (mA)

Fig. 3 - Pulse Forward Current vs. Pulse Duration Fig. 6 - Radiant Power vs. Forward Current

104 1.6
IF - Forward Current (mA)

103 1.2
IF = 20 mA
Ie rel; Φe rel

102 0.8

101 0.4

100 0
0 1 2 3 4 - 10 0 10 50 100 140
94 8880 VF - Forward Voltage (V) T amb - Ambient Temperature (°C)
94 7993

Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Rel. Radiant Intensity/Power vs. Ambient Temperature

1000 1.25
Φe rel - Relative Radiant Power
Ie - Radiant Intensity (mW/sr)

1.0
100

0.75
10
0.5

1
0.25

0.1 0
100 101 102 103 104 800 900 1000
16189 IF - Forward Current (mA) 20082 λ - Wavelength (nm)

Fig. 5 - Radiant Intensity vs. Forward Current Fig. 8 - Relative Radiant Power vs. Wavelength

Rev. 1.8, 30-Jun-11 3 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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REFLOW SOLDER PROFILE
0° 10° 20°
30° 260
240

ϕ - Angular Displacement
220
Srel - Relative Sensitivity

Temperature (°C)
40° 200
+ 5 °C/s - 5 °C/s
1.0 180

0.9 50° 160

140
0.8 60°
120 60 s to 120 s
70° 5s
100
0.7
80° 80
60
0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 160 180 200 220
94 8248
17172 Time (s)
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile

PRECAUTIONS FOR USE

260 °C max.
1 °C/s to 5 °C/s 10 s max.
1. Over-current-proof
Customer must apply resistors for protection, otherwise Pre-heating 60 s max.
180 °C to 200 °C above 220 °C
slight voltage shift will cause big current change (burn out
will happen).
120 s max.
2. Storage
• Storage temperature and rel. humidity conditions are: 1 °C/s to 5 °C/s
5 °C to 35 °C, R.H. 60 %.
• Floor life must not exceed 168 h, acc. to JEDEC level 3,
J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a 22566
damp proof box with desiccant.
Considering tape life, we suggest to use products within Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020
one year from production date.
• If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C
± 5 °C for 15 h.
• If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.

Rev. 1.8, 30-Jun-11 4 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: TSMF1000

16159

PACKAGE DIMENSIONS in millimeters: TSMF1020

3.8 ± 0.2

Ø 1.9 ± 0.2
0.85

2.7 ± 0.2
1.4
0.75
0.15 ± 0.05

0.3

2.5 ± 0.2
1.1 4.5 ± 0.1
1 ± 0.1
2 ± 0.2

2.3 ± 0.1
0.4
0.5

16160
C A

Rev. 1.8, 30-Jun-11 5 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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PACKAGE DIMENSIONS in millimeters: TSMF1030

16228

REEL DIMENSIONS in millimeters

16 ±0.2
±0.5

Unreel direction
X
60.2

2.
5
±0
.5
178 ±1

Tape position
coming out from reel
5
0.

X
±
13

13.2 ±1.5
Label posted here

Leader and trailer tape:

Parts mounted Empty leader (400 mm, min.)

Drawing-No.: 9.800-5080.01-4
Direction of pulling out
Issue: 3; 11.06.08
Empty trailer (200 mm, min.)
18033

Rev. 1.8, 30-Jun-11 6 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TSMF1000, TSMF1020, TSMF1030
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Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1000

3.05 ± 0.1 4 ± 0.1

Ø 1.55 ± 0.05 2 ± 0.05

1.75 ± 0.1
0.3

5.5 ± 0.05
12 ± 0.3
Feed direction 4 ± 0.1
Anode
Top tape
Push pin through hole

Quantity per reel: 1000 pcs or 5000 pcs 18030

TAPING DIMENSIONS in millimeters: TSMF1020

3.05 ± 0.1 4 ± 0.1

Ø 1.55 ± 0.05 2 ± 0.05
1.75 ± 0.1

0.3
5.5 ± 0.05
12 ± 0.3

Feed direction 4 ± 0.1

Anode
Top tape

Push pin through hole

Quantity per reel: 1000 pcs or 5000 pcs 18031

Rev. 1.8, 30-Jun-11 7 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 TSMF1000, TSMF1020, TSMF1030
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Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1030

3.05 ± 0.1 4 ± 0.1

0.3 Ø 1.55 ± 0.05 2 ± 0.05

1.75 ± 0.1
5.5 ± 0.05

12 ± 0.3
Feed direction 4 ± 0.1
Anode
Top tape
18032
Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs

Rev. 1.8, 30-Jun-11 8 Document Number: 81061

For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 08-Feb-17 1 Document Number: 91000