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    FCBGA带Core基板制造工艺流程 FCBGAProcessflow

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    hhaiddao
    The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

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    Download as PDF, TXT or read online from Scribd

    FCBGA带Core基板制造工艺流程 FCBGAProcessflow

    Uploaded by

    hhaiddao
    48 views18 pages
    The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

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    FCBGA带Core基板制造工艺流程-FCBGAProcessflow

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    The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    48 views18 pages

    FCBGA带Core基板制造工艺流程 FCBGAProcessflow

    Uploaded by

    hhaiddao
    The document describes the FCBGA process which includes 3 main layers: core layer, build-up layer, and final finish. The core layer involves baking the panel, drilling, and copper plating through holes. The build-up layer includes laminating ABF material, laser drilling, lithography, and semi-additive or subtractive copper plating. The final finish involves applying solder mask, surface treatment, and backend processes like routing, presoldering, sawing, and electrical/visual testing.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 18

    FCBGA Process introduction

    ABF FCBGA Process Flow


    (Final finish)

    (Build-up layer)

    (core layer)

    Core Build-up Final


    Backend
    layer layer Finish
    Core layer
    Core Layer

    Panel release Baking Reduce Copper

    Mechanical
    Drill

    Cu Plating
    (Through hole)

    Plug Hole

    Lithography I
    Core layer
    Core Layer

    Panel release

    Mechanical De-burr
    Drill
    Drill

    Cu Plating
    (Through hole)

    Plug Hole

    Lithography I Mechanical machine


    Core layer
    Core Layer

    Panel release

    Mechanical
    Drill

    Cu Plating Electro-less (C Line) Copper plating (Q Line)


    (Through hole)

    Plug Hole

    Lithography I
    Core layer
    Core Layer

    Panel release

    Mechanical
    Drill

    Cu Plating
    (Through hole)

    Plug Hole plugging (Ink) Sanding

    Lithography I
    Core layer
    Core Layer

    Panel release

    Mechanical
    Drill

    Cu Plating
    (Through hole)

    Plug Hole

    Lithography I Subtractive process


    Build-up layer
    Build-up Layer

    ABF MEC treatment Lamination Curing


    Lamination

    Laser Drill

    Lithography II

    Cu Plating
    ABF Material
    Build-up layer
    Build-up Layer

    ABF
    Lamination

    Laser Drill Laser drill De-smear E’less Cu

    Lithography II

    Cu Plating
    Build-up layer
    Build-up Layer

    ABF
    Lamination

    Laser Drill

    Lithography II Semi-additive

    Cu Plating
    D/F Material
    Build-up layer
    Build-up Layer

    ABF
    Lamination

    Laser Drill

    Lithography II

    Cu Plating Cu plating Stripping


    Final Finish
    Final Finish

    Solder Mask MEC treatment coating Exposure Develop Baking ( UV & Oven

    Surface treatment
    Final Finish
    Final Finish

    Solder Mask

    Surface treatment Pre-treatment Surface treatment( IT, OSP ENEPIG)

    Surface Finishing
    表面處理
    Backend
    Backend

    Routing Routing ( Panel to MP or to strip)

    Presolder

    Saw

    Electric test

    Final
    visual test
    Backend
    Backend

    Routing

    Presolder Pre-solder Paste Reflow De-flux

    Saw

    Electric test

    Final
    visual test
    Backend
    Backend

    Routing

    Presolder

    Saw Unit saw Coining

    Electric test

    Final
    visual test
    Backend
    Backend
    4W TST VI Picture

    Routing

    Presolder

    Saw

    Electric test TST

    Final Bump AVI & VI WPG


    visual test inspection inspection inspection
    Thanks for attention

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