1.

Safety Precautions

1-1. Repair Precaution

Before attempting any repair or detailed tuning, shield the device from RF noise or static
electricity discharges.

Use only demagnetized tools that are specifically designed for small electronic repairs,
as most electronic parts are sensitive to electromagnetic forces.

Use only high quality screwdrivers when servicing products. Low quality screwdrivers can
easily damage the heads of screws.

Use only conductor wire of the properly gauge and insulation for low resistance, because of the low margin
of error of most testing equipment.
We recommend 22-gauge twisted copper wire.

Hand-soldering is not recommended, because printed circuit boards (PCBs) can be easily
damaged, even with relatively low heat. Never use a soldering iron with a power rating of
more than 100 watts and use only lead-free solder with a melting point below 250°C (482°F).

Prior to disassembling the battery charger for repair, ensure that the AC power is disconnected.
Always use the replacement parts that are registered in the SEC system. Third-party replacement parts
may not function properly.

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1. Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution

Many semiconductors and ESDs in electronic devices are particularly sensitive to static discharge and can
be easily damaged by it. We recommend protecting these components with conductive anti-static bags
when you store or transport them.

Always use an anti-static strap or wristband and remove electrostatic buildup or dissipate
static electricity from your body before repairing ESDs.

Ensure that soldering irons have AC adapter with ground wires and that the ground wires are properly
connected.

Use only desoldering tools with plastic tips to prevent static discharge.

Properly shield the work environment from accidental electrostatic discharge before opening
packages containing ESDs.

The potential for static electricity discharge may be increased in low humidity environments,
such as air-conditioned rooms. Increase the airflow to the working area to decrease the
chance of accidental static electricity discharges.

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2. Specifications

2-1. GSM General Specification

Item GSM 850 EGSM 900 DCS1800 PCS1900

Freq. Band[MHz] 824~849 880~915 1710~1785 1850~1910

Uplink/Downlink 869~894 925~960 1805~1880 1930~1990

ARFCN range 128~251 0~124 & 975~1023 512~885 512~810

Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate/ 270.833kbps 270.833kbps 270.833kbps 270.833kbps

Bit Period 3.692us 3.692us 3.692us 3.692us

Time Slot Period/ 576.9us 576.9us 576.9us 576.9us

Frame Period 4.615ms 4.615ms 4.615ms 4.615ms

GMSK/ GMSK/ GMSK/ GMSK/ GMSK/

Modulation
8PSK 8PSK 8PSK 8PSK 8PSK

MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

4(GMSK) 4(GMSK) 1(GMSK) 1(GMSK)

Power Class
E2(8PSK) E2(8PSK) E2(8PSK) E2(8PSK)

Sensitivity -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8

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2. Specifications

2-2. GSM Tx Power Class

TX Power TX Power TX Power TX Power

GSM850 EGSM900 DCS1800 PCS1900
control level control level control level control level

5 33±2 dBm 5 33±2 dBm 0 30±3 dBm 0 30±3 dBm

6 31±2 dBm 6 31±2 dBm 1 28±3 dBm 1 28±3 dBm

7 29±2 dBm 7 29±2 dBm 2 26±3 dBm 2 26±3 dBm

8 27±2 dBm 8 27±2 dBm 3 24±3 dBm 3 24±3 dBm

9 25±2 dBm 9 25±2 dBm 4 22±3 dBm 4 22±3 dBm

10 23±2 dBm 10 23±2 dBm 5 20±3 dBm 5 20±3 dBm

11 21±2 dBm 11 21±2 dBm 6 18±3 dBm 6 18±3 dBm

12 19±2 dBm 12 19±2 dBm 7 16±3 dBm 7 16±3 dBm

13 17±2 dBm 13 17±2 dBm 8 14±3 dBm 8 14±3 dBm

14 15±2 dBm 14 15±2 dBm 9 12±4 dBm 9 12±4 dBm

15 13±2 dBm 15 13±2 dBm 10 10±4 dBm 10 10±4 dBm

16 11±3 dBm 16 11±3 dBm 11 8±4 dBm 11 8±4 dBm

17 9±3 dBm 17 9±3 dBm 12 6±4 dBm 12 6±4 dBm

18 7±3 dBm 18 7±3 dBm 13 4±4 dBm 13 4±4 dBm

19 5±3 dBm 19 5±3 dBm 14 2±5 dBm 14 2±5 dBm

- - - - 15 0±5 dBm 15 0±5 dBm

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2. Specifications

2-3. WCDMA General Specification

WCDMA2100(B1) WCDMA1900(B2) WCDMA850(B5) WCDMA900(B8)

Freq.
1920~1980 1850-1910 824~849 880~915
Band[MHz]
2110~2170 1930-1990 869~894 925~960
Uplink/Downlink

UL：9612~9888 UL：9262~9538 UL：4132~4233 UL：2712~2868

ARFCN range
DL：10562~10838 DL：9662~9938 DL：4357~4458 DL：2937~3088

Tx/Rx spacing 190MHz 80MHz 45MHz 45MHz

Mod. Bit rate/ 42.2Mbps(DL) 42.2Mbps(DL) 42.2Mbps(DL) 42.2Mbps(DL)

5.42Mbps(UL) 5.42Mbps(UL) 5.42Mbps(UL) 5.42Mbps(UL)
Bit Period

Time Slot W CD MA W CD MA W CD MA W CD MA
10ms/0.667ms 10ms/0.667ms 10ms/0.667ms 10ms/0.667ms
Period/ HSPA HSPA HSPA HSPA
Frame Period 2ms/0.667ms 2ms/0.667ms 2ms/0.667ms 2ms/0.667ms

QPSK QPSK QPSK QPSK

16QAM 16QAM 16QAM 16QAM
Modulation
64QAM 64QAM 64QAM 64QAM

MS Power
25.7 ~ -49(↓) 25.7 ~ -49(↓) 25.7 ~ -49(↓) 25.7 ~ -49(↓)
(dBm)

Power Class 3(max+24dBm) 3(max+24dBm) 3(max+24dBm) 3(max+24dBm)

Sensitivity -107dBm -104dBm -105dBm -104dBm

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2. Specifications
2-4. LTE General Specification

LTE Band1 LTE Band3 LTE Band5 LTE Band7 LTE Band8

Freq. Band[MHz] 1920~1980 1710~1785 824~849 2500~2570 880~915

Uplink/Downlink 2110~2170 1805~1880 869~894 2620~2690 925~960

UL:18000~18599 UL:19200~19949 UL:20400~20649 UL:20750~21449 UL:21450-21799

ARFCN range
DL:0~599 DL:1200~1949 DL:2400~2649 DL:2750~3449 DL:3450-3799

Tx/Rx spacing
190 95 45 120 45
(MHz)

Channel
Bandwidth 5/10/15/20 1.4/3/5/10/15/20 1.4/3/5/10 5/10/15/20 1.4/3/5/10
(MHz)

QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM

Modulation
256QAM(DL only) 256QAM(DL only) 256QAM(DL only) 256QAM(DL only) 256QAM(DL only)

MS Power
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)

Sensitivity
(QPSK, BW
-97dbm -94dbm -95dbm -95dbm -94dbm
10MHz)
(dBm)

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2. Specifications

LTE Band2 LTE Band28 LTE Band4 LTE Band20 LTE Band28
Freq. Band[MHz]
1850~1910 703~748 1710-1755 832~862 703~748
Uplink/Downlink
1930~1990 758-803 2110-2155 791-821 758-803

ARFCN range UL:18600-19199 UL:27210-27659 UL:19950-20399 UL:24150-24449 UL:27210-27659

DL:600~ 1199 DL:9210 ~ 9659 DL:1950 ~ 2399 DL:6150 ~ 6449 DL:9210 ~ 9659
Tx/Rx spacing
(MHz) 190 55 400 28 55

Channel
Bandwidth
1.4/3/5/10/15/20 3/5/10/15/20 1.4/3/5/10/15/20 5/10/15/20 3/5/10/15/20
(MHz)

Modulation QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM

256QAM(DL only) 256QAM(DL only) 256QAM(DL only) 256QAM(DL only) 256QAM(DL only)
MS Power
(dBm) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)

Sensitivity
(QPSK, BW
10MHz) -95dbm -95.5dbm -97dbm -94dbm -95.5dbm
(dBm)

LTE Band38 LTE Band40 LTE Band41

Freq. Band[MHz]
Uplink/Downlink 2570~2620 2300~2400 2535~2655

ARFCN range UL/DL:37750 ~ UL/DL:38650 ~ UL/DL:40040 ~

38249 39649 41240
Tx/Rx spacing
(MHz) 0 0 0

Channel
Bandwidth
5/10/15/20 5/10/15/20 5/10/15/20
(MHz)

Modulation QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM

256QAM(DL only) 256QAM(DL only) 256QAM(DL only)
MS Power
(dBm) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)

Sensitivity
(QPSK, BW
10MHz) -97dbm -97dbm -95dbm
(dBm))

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2. Specifications

2-5. 5G NR
N1 N3 N5 N7 N8

Freq. Band[MHz] 1920~1980 1710~1785 824~849 2500~2570 880~915

Uplink/Downlink 2110~2170 1805~1880 869~894 2620~2690 925~960

SCS 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ

Tx/Rx spacing
60M 75M 25M 70M 35M
(MHz)

Channel
Bandwidth 5/10/15/20 1.4/3/5/10/15/20 1.4/3/5/10 5/10/15/20 1.4/3/5/10
(MHz)
QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM
Modulation QPSK,16/64QAM
256QAM 256QAM 256QAM 256QAM
(DL&UL) 256QAM

MS Power3
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)

Sensitivity
(QPSK, BW
-97.1dbm -94.1dbm -95.1dbm -95.1dbm -94.1dbm
10MHz)
(dBm)

N20 N28 N38 N40 N41

Freq. Band[MHz] 832~862 703~748

2570~2620 2300~2400 2535~2655
Uplink/Downlink 791-821 758-803

SCS 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ 15KHZ/30KHZ

Tx/Rx spacing3
30M 45M 50M 100M 196M
(MHz)

Channel
5/10/15/20/25/30/40/5 5/10/15/2040/50/60/8
Bandwidth 5/10/15/20 3/5/10/15/20 5/10/15/20
0/60/80 0/90/100
(MHz)
QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM QPSK,16/64QAM
Modulation QPSK,16/64QAM
256QAM 256QAM 256QAM 256QAM
(DL&UL) 256QAM

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 MS Power3
25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓) 25.7~-39(↓)
(dBm)

Sensitivity
(QPSK, BW
-94.1dbm -95.6dbm -97.1dbm -97.1dbm -95.1dbm
10MHz)
(dBm))

N78 N79

Freq. Band[MHz]
3300~3800M 4400~5000M
Uplink/Downlink

SCS 15KHZ/30KHZ 15KHZ/30KHZ

Tx/Rx spacing
500M 600M
(MHz)

Channel
10/15/20/40/50/60/80/
Bandwidth 40/50/60/80/100
90/100M
(MHz)
QPSK,16/64QAM
Modulation QPSK,16/64QAM
256QAM
(DL&UL) 256QAM

MS Power3
25.7~-39(↓) 257~-39(↓)
(dBm)

Sensitivity
(QPSK, BW
-85.6dbm -85.6dbm
100MHz)
(dBm)

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3. Product Function

H/W Specification

Item Description

OS Android 11

2G : 850/ 900/ 1800/ 1900

3G : B1/ B2/ B5/ B8
LTE FDD : B1/ B2/ B3/ B5/ B7/ B8/ B20/ B28
RF
LTE TDD : B38/ B40/ B41(2496MHz~2690MHz. Full Band)
5G: n1/n3/n5/n7/n8/n20/n28/n38/n40/n41/n78/n79
(It may vary depending on the region.)

Battery 5,000mAh

Base Band MediaTek MT6833V

BT 5.0, USB 2.0, GPS/AGPS, Glonass, Galileo, Beidou, NFC

Connectivity
WIFI 2.4G+5G, 802.11a/b/g/n/ac

Rear camera: 48M + 5M + 2M depth

Camera
Front camera: 8MP

Display 6.6” FHD+(1080x2400) TFT LCD

RAM 4GB/6GB

Storage 128GB

Accelerometer, Fingerprint Sensor, Geomagnetic Sensor, Gyro sensor

Sensor
Virtual Proximity Sensing, Virtual Light Sensing

Charger: 9V/1.67A=15W (inbox)

Accessory Data cable: Type C cable
Ear phone: 3.5

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6. Level 1 Repair

6-1. S/W Update

6-1-1. Preparation
S/W Update program: Fenrir 5.17.xxxx
 Mobile Phone
 Data Cable

※ Settings

Data Cable : GH39-01710D

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6. Level 1 Repair

6-1-2. How to use ‘Fenrir’ S/W update program.

1) Launch Fenrir by clicking on the icon on the desktop

- SVH (Fenrir_Home) : It uses Home binary which does not have user data area in the memory when
flashed to a device. (Keep user data)

- SVC (Fenrir_Factory) : It uses Factory binary which erases all user data in the memory when flashed
to a device. (Clear user data)

- SVA (Fenrir_All) : It uses Factory and Home binaries. you can download Home and Factory binary
in a PC(but requires double HDD storage and NW traffic)

2) Input ID & password

※You need to reset the ID information in case of PC change and format and repair,
hard disk change

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6. Level 1 Repair
3) Ensure device has sufficient charge (at least 20%) to start firmware update.

4) Connect the device to PC via data cable.

5) Upon USB connection, you will be presented with below screen.

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6. Level 1 Repair
6) Once device is detected, you will be presented with below screen.
To update S/W, select “S/W Update” or to exit select “SVC Connection”.
If you select “SVC Connection”, only Fenrir connection history (record) will be stored
in the FUS server to support warranty validation. (This is known as “Service Connection” history)

7) Once Fenrir starts, application will display the below screen.

And select the Start button & Agree button.

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6. Level 1 Repair
8) The status circle increases as the update installs.
The update process takes approximately 5-10 minutes to complete.
Do not disconnect the device from USB during processing.

9) Once complete, application will present the below screen indicating update complete.
Click Ok and detach device from USB.

※ Please refer to the user guide for Fenrir uploaded on GSPN for more
detailed information.

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6. Level 1 Repair

6-2. IMEI writing

6-2-1. Preparation
- New IMEI writing Program has been released.
- Supported Model : Models which CAB files are uploaded on HHPsvc INI File category, instead of ini file.
- Refer to below IMEI writing procedure.

- H/W

Data Cable : GH39-01710D

- S/W
① Library Install To use Daseul, library files should be installed.
Refer to SVC Bulletin
“(11-82) Daseul (New IMEI writing Program) Library Install guide_rev1.0”

②Launcher DASEUL_SVC_Launcher_v3.0.12 or higher

-Uploaded on HHPsvc Notice
③ Runtime File 1. DASEUL_IMEI_ALL_Runtime_3.1.281.0_r00405.CAB or higher
-Uploaded on HHPsvc Notice
2. Make ‘ModelName’ folder at the same position with
launcher & Runtime file.

④Model File Copy Model File under the ‘Model Name’ folder

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6. Level 1 Repair

6-2-2. IMEI writing Process

1. Run DASEUL_SVC_Launcher_v3.0.12.exe

2. Select Service Mode

3. Click and Select folder where the Launcher exists

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6. Level 1 Repair

4. Select Model

5. Check IMEI and click System Setting

※Once you setup the setting, you don t have to do it again, unless there is change.
From second run of the IMEI program, check IMEI and click Extract & Run.

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6. Level 1 Repair

6. Check IMEI Write / IMEI Check and click IMEI SVC & Repair Option.

7. Check ‘SVC , User Ticket No’ and click OK

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6. Level 1 Repair

8. Click ‘Hardware Config’

9. Click ‘Port Setting’

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6. Level 1 Repair

10. Select Port Number and SAVE

11.Click OK to proceed

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6. Level 1 Repair

12. Click Model Info and OK when pop-up shows

13. Click OK

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6. Level 1 Repair

14. Input SKU_CODE and BUYER, then click Save button.

※ Refer to HHPsvc→IMEI Review to check SKU Code and buyer

G955UOYN1AQC1

15. Input IMEI Number and click Apply

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6. Level 1 Repair

16. ① Click Start → ②Input IMEI writing ID and Password & OTP → ③Input Ticket No

Model name

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6. Level 1 Repair

17. Connect the phone to PC

※ When you connect the phone, the phone should be turned off.
After connecting the phone, the phone will be booted automatically.

18. IMEI Writing Proceeding

19. IMEI Writing Success

※ Please refer to the user guide for IMEI Writing on GSPN for more
detailed information.

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9. Reference Abbreviation

Reference Abbreviation

― AAC: Advanced Audio Coding.

― AVC : Advanced Video Coding.
― BER : Bit Error Rate
― BPSK: Binary Phase Shift Keying
― CA : Conditional Access
― CDM : Code Division Multiplexing
― C/I : Carrier to Interference
― DMB : Digital Multimedia Broadcasting
― EN : European Standard
― ES : Elementary Stream
― ETSI: European Telecommunications Standards Institute
― MPEG: Moving Picture Experts Group
― PN : Pseudo-random Noise
― PS : Pilot Symbol
― QPSK: Quadrature Phase Shift Keying
― RS : Reed-Solomon
― SI : Service Information
― TDM : Time Division Multiplexing
― TS : Transport Stream

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