Introduction
Introduction
Introduction
ISBN: 9781264257584
Authors: Eun Sok Kim Ph.D.
D. Introduction
Commercial applications of microelectromechanical systems (MEMS) have ever been growing for many decades, starting with
silicon pressure sensors. Some of the commercially successful MEMS include accelerometers, gyroscopes, digital mirror array
of 0.3–1 million movable mirrors, microbolometers for room temperature infrared (IR) sensing or for night vision. The nighttime
vision without ultra low temperature for a camera is possible because of excellent thermal isolation made possible through
MEMS structure, while the large number of movable mirrors is possible due to the unique features of MEMS fabrication
process. There is currently no other technology that will allow an array of 0.3–1 million movable micromirrors on a single chip.
More recently, MEMS microphones have been replacing conventional electret condenser microphones (ECMs), largely due to
the MEMS microphones' ability to withstand the soldering temperature of about 250°C which allows them to be mounted on
printed circuit boards (PCBs) through robotic pick-and-placement. Another MEMS commercialization success has lately been
film bulk acoustic-wave resonators (FBARs) for RF front-end filters for cell phones, as FBARs offer high-quality resonant
characteristics due to air-backing on top and bottom of a piezoelectric film, made possible by MEMS fabrication processing.
The growth of MEMS commercialization has lately been 30% annually, and as of 2020, MEMS market is about a tenth of
integrated circuits (IC) market.
One notable example of IoT is a wearable activity tracker, such as FitBit. It contains a microcontroller, MEMS inertial sensors to
sense the wearer's motion, light-emitting diode (LED) and photodetector, analog-to-digital converter, RF communication circuits
and antenna, and battery. It is an intelligent edge device that processes sensed signal and communicate the data wirelessly to
the cloud.
Edge devices may include actuators and/or biomedical platform, in addition to sensors. The number of the expected edge
devices containing sensors and actuators is astronomically large. In comparison, the number of personal computers or laptops
is limited, while the number of smartphones is 10 times more. With edge devices, though, the number quickly reaches hundreds
of billions or even trillion. Thus, the manufacturing costs for edge devices must be very low, likely below $1 per unit. There is
currently no technology, other than MEMS technology, that will allow such a massive number of edge devices to be
manufactured at such a low cost.
Another advantage of MEMS is that sensor or actuator can be integrated with IC on a single chip. By having a sensor and IC on
a single chip, parasitic capacitance between the sensor and the IC can precisely be characterized, and the sensor's minimum
detectable signal level can be improved greatly. Also, with IC already integrated on a single chip with a sensor, the integrated
sensor can be small and inexpensive. In other words, through integration of MEMS with complementary metal—oxide
semiconductor (CMOS) on a single chip or in a single package, the size, weight, power, and cost (SWaP-C) can be reduced. One
of the commercially successful MEMS is an accelerometer integrated with signal-processing and temperature-compensating
circuits on a single chip.
Another aspect of MEMS that excites me is that it is open-ended, with so much application and innovation wide open for well-
educated and motivated MEMS engineers. Engineers and scientists with multidisciplinary knowledge and good ideas will be
able to benefit the world greatly through many new MEMS-based devices and systems.
It is likely that MEMS will be the key technology for the "next big thing," but how big the impact of MEMS will depend on the
people who work on MEMS, and create MEMS devices and their applications. In other words, innovative engineers and
scientists will be the key on how strong MEMS' future impact on human lives will be.
So, let us delve into learning microfabrication and MEMS processing technologies, transduction principles, RF and optical
MEMS, mechanics and inertial sensors, film properties and issues as well as silicon pressure sensors and MEMS microphone,
microfluidic systems and bio-MEMS, vibrational energy harvesting, and interface analog and nonlinear circuits for MEMS.
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