Catalog
Catalog
Catalog
2019/2020
・IGBT MODULES
・SiC MODULES
About StarPower
StarPower Semiconductor Ltd. is a leading power module
company located in Jiaxing China about 59 miles southwest of
Shanghai. Founded in 2005, StarPower designs and manufactures
IGBT/SiC/MOSFET/IPM/FRD/Rectifier modules and customized
modules for applications in the area of inverters, welding
machines, inductive heating, UPS, EV/HEV, solar/wind power and
etc. in the power range of 0.5kW up to more than 1MW.
04 1
5
1200V Half Bridge 38
1700V Single 38
1700V Half Bridge with NTC 39
1700V Half Bridge 39
High Power Module Package Outlines 40
SiC Mosfet Modules
C2/B3 Package Series
SiC Mosfet 42
SiC Mosfet Module Package Outlines 43
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
L1 : PIM
L2 : 3 phase bridge/PIM
6
L3 : 3 phase bridge/PIM/NPC
L4 : 3 phase bridge
F1 : PIM/NPC/Boost
F2 : PIM/NPC
Low Power Modules
VCES IC
F3 : PIM
F4 : PIM
7
F5 : PIM
C1:chopper/half bridge
C2.0:chopper/half bridge
8
C2.1:single
C8.0:half bridge
C8.1:half bridge
Medium Power Modules
VCES IC
600 650 1200 1700 50 100 150 200 400 600 800 900
C8.2:H bridge
9
C6.1 white:half bridge
P4:Tri-Pack
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
C3.0:single
C3.1:half bridge
10
C3.2:single
C4.0:single
P1:half bridge
P2:half bridge
SiC Mosfet Modules
VDSS ID
1200 1700 50 120 200 400 600
11
C2 : half bridge
B3 : half bridge
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
F 65 (N,F)*
Circuit Configuration
SG=Single
CU=Chopper Diode Up Side
CL=Chopper Diode Low Side Package Type
HF=Half Bridge C1=94mmx34mmx30mm,Cu Base
HT=Tri-Pack C2=106mmx62mmx30mm,Cu Base
HH=H Bridge C3=140mmx130mmx38mm,Cu Base
HC=Internal Connected H Bridge C4=190mmx140mmx38mm,Cu Base
ML=3 Level,Diode Clampling,NPC1 C5=107mmx45mmx17mm,Cu Base
12
MD 300 HF R 120 C2 S
MD =SiC Mosfet
Modules
Nominal Current
ID(@TC=80℃ ) as e.g. 300=300A
Circuit Configuration
HF=Half Bridge
13
Die Characteristics
R=SiC Mosfet
Package Type
C2=106mmx62mmx30mm,Cu Base
B3=108mmx62mmx17mm,Cu Base
Screening Level
S=Screened for Industrial Applications
H=Screened for High Reliability Applications
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
650V NPC1
Trench FS IGBT,Low Loss
GD75MLX65L3S 650 75 1.45 2.32 0.514 L3.1/20
GD100MLX65L3S 650 100 1.45 3.36 0.384 L3.1/20
GD150MLX65L3S 650 150 1.45 5.48 0.269 L3.1/20
GD75MLX65L3SF 650 75 1.45 2.32 0.514 L3.3/21
GD100MLX65L3SF 650 100 1.45 3.36 0.384 L3.3/21
GD150MLX65L3SF 650 150 1.45 5.48 0.269 L3.3/21
650V PIM
Trench FS IGBT,Low Loss
GD10PJX65L2S 650 10 1.45 0.44 2.968 L2.2/19
GD15PJX65L2S 650 15 1.45 0.67 2.221 L2.2/19
GD20PJX65L2S 650 20 1.45 0.99 1.955 L2.2/19
GD30PJX65L2S 650 30 1.45 1.04 1.222 L2.2/19
GD50PJX65L3S 650 50 1.45 1.74 0.745 L3.0/20
GD10PJX65L2SF 650 10 1.45 0.44 2.968 L2.5/19
GD15PJX65L2SF 650 15 1.45 0.67 2.221 L2.5/19
GD20PJX65L2SF 650 20 1.45 0.99 1.955 L2.5/19
GD30PJX65L2SF 650 30 1.45 1.04 1.222 L2.5/19
GD50PJX65L3SF 650 50 1.45 1.74 0.745 L3.5/21
Low Power Modules
VCES IC VCE(sat) (Eon+Eoff) Rth(J-C) Package
Type V A @Tj=25℃ typ. @Tj=125℃ typ. Circuit
K/W Outline/page
V mJ
1200V PIM
Advanced Trench FS IGBT,Low Loss
GD10PJY120L2S 1200 10 1.70 2.27 1.200 L2.2/19
GD15PJY120L2S 1200 15 1.70 3.11 1.020 L2.2/19
GD25PJY120L3S 1200 25 1.70 4.78 0.710 L3.0/20
GD35PJY120L3S 1200 35 1.70 6.09 0.552 L3.0/20
NPT Low Loss
15
GD10PJK120L1S 1200 10 2.20 1.91 1.600 L1.2/19
GD15PJK120L1S 1200 15 2.20 2.95 1.180 L1.2/19
GD10PJK120L2S 1200 10 2.20 1.91 1.200 L2.2/19
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
650V NPC1
Trench FS IGBT,Low Loss
GD30MLX65F1S 650 30 1.45 1.04 1.400 F1.2/22
GD50MLX65F1S 650 50 1.45 1.74 0.854 F1.2/22
GD75MLX65F1S 650 75 1.45 2.32 0.589 F1.2/22
GD30MLX65F1SF 650 30 1.45 1.04 1.400 F1.4/22
GD75MLX65F1SF 650 75 1.45 2.32 0.589 F1.4/22
16
650V PIM
Trench FS IGBT,Low Loss
GD10PJX65F1S 650 10 1.45 0.44 3.402 F1.1/21
GD15PJX65F1S 650 15 1.45 0.67 2.546 F1.1/21
GD20PJX65F1S 650 20 1.45 0.99 2.241 F1.1/21
GD30PJX65F1S 650 30 1.45 1.04 1.400 F1.1/21
GD30PJX65F2S 650 30 1.45 1.04 1.400 F2.0/22
GD50PJX65F2S 650 50 1.45 1.74 0.854 F2.0/22
GD75PJX65F2S 650 75 1.45 2.32 0.589 F2.0/22
GD10PJX65F3S 650 10 1.45 0.44 3.402 F3.0/23
GD15PJX65F3S 650 15 1.45 0.67 2.546 F3.0/23
GD20PJX65F3S 650 20 1.45 0.99 2.241 F3.0/23
GD30PJX65F3S 650 30 1.45 1.04 1.400 F3.0/23
GD10PJX65F4S 650 10 1.45 0.44 3.402 F4.1/23
GD15PJX65F4S 650 15 1.45 0.67 2.546 F4.1/23
GD20PJX65F4S 650 20 1.45 0.99 2.241 F4.1/23
GD30PJX65F4S 650 30 1.45 1.04 1.400 F4.1/23
GD30PJX65F5S 650 30 1.45 1.04 1.400 F5.1/23
GD50PJX65F5S 650 50 1.45 1.74 0.854 F5.1/23
GD75PJX65F5S 650 75 1.45 2.32 0.589 F5.1/23
Low Power Modules
VCES IC VCE(sat) (Eon+Eoff) Rth(J-C) Package
Type V A @Tj=25℃ typ. @Tj=125℃ typ. Circuit
K/W Outline/page
V mJ
1200V NPC2
Advanced Trench FS Fast IGBT
GD40TLQ120F1S 1200 40 2.00 1.57 0.572 F1.2/22
1200V PIM
Advanced Trench FS IGBT,Low Loss
GD10PJY120F1S 1200 10 1.70 2.27 1.340 F1.1/21
17
GD25PJY120F2S 1200 25 1.70 4.78 0.794 F2.0/22
650V PIM
Trench FS IGBT,Low Loss
GD30PIX65C5S 650 30 1.45 1.0 1.025 C5.0/23
1200V H Bridge
NPT Ultra Fast IGBT
GD50HHU120C5S 1200 50 3.10 7.9 0.316 C5.4/24
19
GD50FFK120C5SP 1200 50 2.20 12.5 0.332 C5.6/25
GD75FFK120C6S 1200 75 2.20 12.4 0.219 C6.2/25
GD100FFK120C6S 1200 100 2.20 18.3 0.219 C6.2/25
1200V PIM
Advanced Trench FS IGBT,Low Loss
GD10PIY120C5S 1200 10 1.70 2.3 1.279 C5.0/23
GD15PIY120C5S 1200 15 1.70 3.1 0.904 C5.0/23
GD25PIY120C5S 1200 25 1.70 4.8 0.728 C5.0/23
GD40PIY120C5S 1200 40 1.70 5.8 0.535 C5.0/23
GD25PIY120C5SN 1200 25 1.70 4.8 0.728 C5.3/24
GD35PIY120C5SN 1200 35 1.70 6.1 0.569 C5.3/24
GD50PIY120C5SN 1200 50 1.70 12.7 0.512 C5.3/24
GD40PIY120C6S 1200 40 1.70 5.8 0.535 C6.0/25
GD50PIY120C6S 1200 50 1.70 12.7 0.512 C6.0/25
GD75PIY120C6S 1200 75 1.70 14.4 0.394 C6.0/25
GD50PIY120C6SN 1200 50 1.70 12.7 0.512 C6.3/25
GD75PIY120C6SN 1200 75 1.70 14.4 0.394 C6.3/25
GD100PIY120C6SN 1200 100 1.70 18.5 0.293 C6.3/25
GD150PIY120C6SN 1200 150 1.70 26.1 0.170 C6.3/25
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
21
Case L2.2 Case L2.5
U G1 V G3 W G5 L1
L2
T2 T1
L3
P1 P
EU G2 EV G4 EW G6 N GB NB B
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
G5 W W G6 E' W
EW
V
V G4
P P T1 T2 EV
G3 E'V
EU
G1 U U G2 E'U
22
12±0.35
51±0.1
48
44.8
41.6
38.4
32
28.8
25.6
22.4
19.2
16
12.8
42.5±0.15
62.8±0.5
48±0.3
53±0.1
9.6
3.2
G3 E3 U U U U G2
3.2
6.4
U U
12.8
∅4.5
䌙㻞
U U E2
16
㻚㻟-0
20±0.2
.1
×
22.5±0.5
8.
5+0
56.7±0.3
25.6
.3
28.8
T1 E1
32
T2 G1
- N N +
E4 G4 - - - - N N N + + + +
23
Case L4.0 Case F1.1
66
B
A
局部视图 A
比例 4 : 1
11.5
1.5
2
1
68.4
15.65
13.5
65.9
64.2
22.5
13 15 17 18 19 20 3
19.8
12 14 16 4.
2-
15
21
24.6
31.5
32.5
5.6
29
局部视图 B 11.25
比例 5 : 1 7.5
22
2-
1
R4
5.6 2.7
.
11 10 9 8 7 6 5 4 3 2 23
5
1.6
0
2.7
5.4
7.5
8.1
15
10.8
13.5
16.2
16.75
20.1
22.8
25.5
25.55
33.5
3.2
55
57.4
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
66
A
B
66 局部视图 A
A 比例 4 : 1
局部视图 A
11.5
比例 4 : 1 B
11.5
1.5
2
1
1.5
2
1
68.4
15.65
65.9
13.5
64.2
15.65
13.5
68.4 38.8
65.9
64.2
13 14 15 16 17 18 19 20
22.6
12 13 14 15 16 17 18 3
22.6 4.
3 14.8 11 12 2-
4. 21
14.55
15.5
19 2-
11
24.6
31.5
32.5
14.8
5.6
局部视图 B 局部视图 B 11.3
29
比例 5 : 1 12.7 10 比例 5 : 1 9 10 22
24.6
31.5
32.5
5.6
8.05
29
11.3
9 20 7.8
2-
9.9
R4
5.6 8.2 8 5.6
.
2-
5
7.1 8 7 6 5 4 3 2 1
R4
0
.
7 6 5 4 3 2 1
5
1
4-
1.6 1.6
1
0
3
11.9
14.9
16.8
20.65
23.65
30.6
33.6
3.2
4-
3.2
0
2.8
22
10.1
12.9
16.8
19.2
30.8
33.6
55
55 57.4
57.4
24
3.83
12.37
10.67
82 0.5
80 19 20 21 22 23 24 25 26 27 28
28.5
71 0.2 29 25
30 16.9
.35
30.8 0.2
37.4 0.5
2-R5
34.80
31 8.6
20
2-
4.30
14.25
7 5 32
18 17 16 15 14 13 12 11 10 9 8 3 2 1 2.8
6 4
0
05
50
4-
26.25
0.
5.
0
2.8
5.6
7.5
8.4
14
22
28
29
35
11.2
14.5
16.8
17.3
19.6
22.4
25.2
31.8
36.5
37.8
43.5
44.8
47.7
52.55
2
1
4-
Low Power Module Package Outlines
4.40
0
3 -0.10 66
0
1.50 -0.10 B
A
43.30 ±0.30
局部视图 A
比例 4 : 1
±0.50
1.50
2
3.40
18.70
20.70
1
17
A
1.5
21.20
2
1
68.4
21.15
19
65.9
64.2
66 ±0.50 22.50
64 22.5
55 ±0.20 19.80 13 15 17 18 19 20 3
19.8
12 14 16 4.
53 2-
51 15 15
21
24.6
31.5
32.5
5.6
11.25
29
11.25
13 15 17 局部视图 B
32.50 ±0.50
R5.5 12 14 16 18 19 20 比例 5 : 1 7.5
0 7.50 22
22 ±0.20
29 ±0.30
2-
31.50
R4
21 5.6 2.7
.
4.30 2.70 11 10 9 8 7 6 5 4 3 2 23
5
22 0
50
1110 9 8 7 6 5 4 3 1 0
.
R4
2
23
1.6
3.2
0
2.7
5.4
7.5
8.1
15
10.8
13.5
16.2
16.75
20.1
22.8
25.5
25.55
33.5
5.40
7.50
8.10
10.80
13.50
16.20
16.75
20.10
22.80
25.50
33.50
0
2.70
15
55
57.4
25
Case F5.1 Case C5.0
6.8
17
3.4
82
71
19 20 21 22 23 24 25 26 27 28
28.5
25
29
3
4.
30 2-
16.9
30.8
37.4
14.25
20
31
8.6
7 5 32
2.8
18 17 16 151413 12 11 10 9 8 6 4 3 2 1
0
2
4-
4-
5.
5
0
2.8
5.6
7.5
8.4
14
22
11.2
14.5
16.8
17.3
19.6
22.4
25.2
28
29
35
26.25
31.8
36.5
37.8
43.5
44.8
47.7
52.55
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
24 17
1 12
26
27
Case C6.2 Case C6.3
27 24 21 19
30
16
33
13
1 3 5 7 9 11
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
Case C6.8
27 24 21 19
30
16
33
13
1 3 5 7 9 11
Medium Power Modules
VCES IC VCE(sat) (Eon+Eoff) Rth(J-C) Package
Type V A @Tj=25℃ typ. @Tj=125℃ typ. Circuit
K/W Outline/page
V mJ
29
GD600CLX65C2S 650 600 1.45 29.9 0.080 C2.0/35
1200V Single
Advanced Trench FS IGBT,Low Loss
GD300SGY120C2S 1200 300 1.70 57.1 0.093 C2.1/35
31
GD600HFY120C2S 1200 600 1.70 103.8 0.040 C2.0/35
1200V H Bridge
NPT Ultra Fast IGBT
GD40HCU120C8S 1200 40 3.10 6.3 0.447 C8.2/36
1700V Single
SPT+ Low Loss and Fast IGBT
GD400SGL170C2S 1700 400 2.40 167.7 0.054 C2.1/35
33
GD100HFL170C1S 1700 100 2.40 56.8 0.217 C1.0/35
650V Tri-Pack
Trench FS IGBT,Low Loss
GD600HTX65P4S 650 600 1.45 22.7 0.120 P4.0/37
35
NPT Ultra Fast IGBT
GD150HFU120C6S 1200 150 3.10 23.7 0.106 C6.1/35
1200V Tri-Pack
37
Case C2.1 Case C6.1
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
9 8 7 6
10 4
11 3
1 2
A
B
38
39
Case P4.0
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
1200V Single
Advanced Trench FS IGBT,Low Loss
GD800SGY120C3S 1200 800 1.70 154 0.028 C3.0/40
GD1200SGY120C3S 1200 1200 1.70 387 0.020 C3.0/40
GD1600SGY120C3S 1200 1600 1.70 573 0.015 C3.0/40
GD2400SGY120C3S 1200 2400 1.70 945 0.011 C3.0/40
GD800SGY120C3SN 1200 800 1.70 154 0.028 C3.2/40
GD1200SGY120C3SN 1200 1200 1.70 387 0.020 C3.2/40
GD1600SGY120C3SN 1200 1600 1.70 573 0.015 C3.2/40
GD2400SGY120C3SN 1200 2400 1.70 945 0.011 C3.2/40
GD2400SGY120C4S 1200 2400 1.70 945 0.011 C4.0/40
GD3600SGY120C4S 1200 3600 1.70 1377 0.008 C4.0/40
1700V Single
SPT+ Low Loss and Fast IGBT
GD800SGL170C3S 1700 800 2.40 512 0.021 C3.0/40
GD1200SGL170C3S 1700 1200 2.40 674 0.017 C3.0/40
GD1600SGL170C3S 1700 1600 2.40 1070 0.013 C3.0/40
GD2400SGL170C3S 1700 2400 2.40 1580 0.010 C3.0/40
GD800SGL170C3SN 1700 800 2.40 512 0.021 C3.2/40
GD1200SGL170C3SN 1700 1200 2.40 674 0.017 C3.2/40
GD1600SGL170C3SN 1700 1600 2.40 1070 0.013 C3.2/40
GD2400SGL170C3SN 1700 2400 2.40 1580 0.010 C3.2/40
High Power Modules
VCES IC VCE(sat) (Eon+Eoff) Rth(J-C) Package
Type V A @Tj=25℃ typ. @Tj=125℃ typ. Circuit
K/W Outline/page
V mJ
41
1700V Half Bridge with NTC
SPT+ Low Loss and Fast IGBT
GD650HFL170P1S 1700 650 2.40 505 0.035 P1.0/41
GD1000HFL170P2S 1700 1000 2.40 590 0.023 P2.0/41
Trench FS IGBT,Low Loss
GD450HFX170P1S 1700 450 1.85 379 0.055 P1.0/41
GD650HFX170P1S 1700 600 1.85 563 0.038 P1.0/41
GD1000HFX170P2S 1700 1000 1.85 763 0.025 P2.0/41
GD1400HFX170P2S 1700 1400 1.85 1250 0.016 P2.0/41
43
STARPOWER
SEMICONDUCTOR LTD.
2019/2020
SiC Mosfet
45
STARPOWER
SEMICONDUCTOR LTD.
Sintering Process For High Reliability
Switzerland
Beijing◆◆Qingdao
Wuhan◆
Jinan◆
Chengdu◆Nanjing◆
Jiax ing▲ Shanghai
◆Shenzhen
▲Headquarter
StarPower Europe AG
Shanghai Dos Technologies Ltd.
Sales Offices
StarPower Europe AG
Ai Ciòss, CH - 6593 Cadenazzo, Switzerland Tel: +41 91 8504141 Fax: +41 91 8401909
www.starpowereurope.com