8662QxxB 976310

GS8662Q08/09/18/36BD-357/333/300/250/200
357 MHz–200 MHz

165-Bump BGA
Commercial Temp
72Mb SigmaQuad-IITM 1.8 V VDD
Industrial Temp Burst of 2 SRAM 1.8 V and 1.5 V I/O
Features Clocking and Addressing Schemes

• Simultaneous Read and Write SigmaQuad™ Interface The GS8662Q08/09/18/36BD SigmaQuad-II SRAMs are
• JEDEC-standard pinout and package synchronous devices. They employ two input register clock
• Dual Double Data Rate interface inputs, K and K. K and K are independent single-ended clock
• Byte Write controls sampled at data-in time inputs, not differential inputs to a single differential clock input
• Burst of 2 Read and Write buffer. The device also allows the user to manipulate the
• 1.8 V +100/–100 mV core power supply output register clock inputs quasi independently with the C and
• 1.5 V or 1.8 V HSTL Interface C clock inputs. C and C are also independent single-ended
• Pipelined read operation clock inputs, not differential inputs. If the C clocks are tied
• Fully coherent read and write pipelines high, the K clocks are routed internally to fire the output
• ZQ pin for programmable output drive strength registers instead.
• IEEE 1149.1 JTAG-compliant Boundary Scan
• Pin-compatible with present 144 Mb devices Each internal read and write operation in a SigmaQuad-II B2
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package RAM is two times wider than the device I/O bus. An input data
• RoHS-compliant 165-bump BGA package available bus de-multiplexer is used to accumulate incoming data before
it is simultaneously written to the memory array. An output
SigmaQuad™ Family Overview data multiplexer is used to capture the data produced from a
The GS8662Q08/09/18/36BD are built in compliance with single memory array read and then route it to the appropriate
the SigmaQuad-II SRAM pinout standard for Separate I/O output drivers as needed. Therefore the address field of a
synchronous SRAMs. They are 75,497,472-bit (72Mb) SigmaQuad-II B2 RAM is always one address pin less than the
SRAMs. The GS8662Q08/09/18/36BD SigmaQuad SRAMs advertised index depth (e.g., the 8M x 8 has an 4M addressable
are just one element in a family of low power, low voltage index).
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Parameter Synopsis
-357 -333 -300 -250 -200
tKHKH 2.8 ns 3.0 ns 3.3 ns 4.0 ns 5.0 ns
tKHQV 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns
Rev: 1.02d 8/2017 1/34 © 2011, GSI Technology

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8662Q08/09/18/36BD-357/333/300/250/200
2M x 36 SigmaQuad-II SRAM—Top View

1 2 3 4 5 6 7 8 9 10 11
NA/SA NC/SA
A CQ SA W BW2 K BW1 R SA CQ
(288Mb) (144Mb)
B Q27 Q18 D18 SA BW3 K BW0 SA D17 Q17 Q8
C D27 Q28 D19 VSS SA SA SA VSS D16 Q7 D8
D D28 D20 Q19 VSS VSS VSS VSS VSS Q16 D15 D7
E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6
F Q30 Q21 D21 VDDQ VDD VSS VDD VDDQ D14 Q14 Q5
G D30 D22 Q22 VDDQ VDD VSS VDD VDDQ Q13 D13 D5
H Doff VREF VDDQ VDDQ VDD VSS VDD VDDQ VDDQ VREF ZQ
J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4
K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3
L Q33 Q24 D24 VDDQ VSS VSS VSS VDDQ D11 Q11 Q2
M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2
N D34 D26 Q25 VSS SA SA SA VSS Q10 D9 D1
P Q35 D35 Q26 SA SA C SA SA Q9 D0 Q0
R TDO TCK SA SA SA C SA SA SA TMS TDI
11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Notes:
1. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35.
2. A2 and A10 are the expansion addresses.

GS8662Q08/09/18/36BD-357/333/300/250/200
1 2 3 4 5 6 7 8 9 10 11
NC/SA NC/SA
A CQ SA W BW1 K R SA SA CQ
(144Mb) (288Mb)
B NC Q9 D9 SA NC K BW0 SA NC NC Q8
C NC NC D10 VSS SA SA SA VSS NC Q7 D8
D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7
E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6
F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5
G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5
J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4
K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3
L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2
M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2
N NC D17 Q16 VSS SA SA SA VSS NC NC D1
P NC NC Q17 SA SA C SA SA NC D0 Q0

Notes:
1. BW0 controls writes to D0:D8. BW1 controls writes to D9:D17.
2. A2 and A7 are the expansion addresses.

GS8662Q08/09/18/36BD-357/333/300/250/200

1 2 3 4 5 6 7 8 9 10 11
NC/SA
A CQ SA SA W NW1 K R SA SA CQ
(144Mb)
NC/SA
B NC NC NC SA K NW0 SA NC NC Q3
(288Mb)
C NC NC NC VSS SA SA SA VSS NC NC D3
D NC D4 NC VSS VSS VSS VSS VSS NC NC NC
F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
G NC D5 Q5 VDDQ VDD VSS VDD VDDQ NC NC NC
J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q1 D1
K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
M NC NC NC VSS VSS VSS VSS VSS NC NC D0
N NC D7 NC VSS SA SA SA VSS NC NC NC
P NC NC Q7 SA SA C SA SA NC NC NC

Notes:
1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7.
2. A7 and B5 are the expansion addresses.

GS8662Q08/09/18/36BD-357/333/300/250/200
8M x 9 SigmaQuad-II SRAM — Top View

1 2 3 4 5 6 7 8 9 10 11
NC/SA
A CQ SA SA W NC K R SA SA CQ
(144Mb)
NC/SA
B NC NC NC SA K BW0 SA NC NC Q4
(288Mb)
C NC NC NC VSS SA SA SA VSS NC NC D4
D NC D5 NC VSS VSS VSS VSS VSS NC NC NC
F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
G NC D6 Q6 VDDQ VDD VSS VDD VDDQ NC NC NC
J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q2 D2
K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC
M NC NC NC VSS VSS VSS VSS VSS NC NC D1
N NC D8 NC VSS SA SA SA VSS NC NC NC
P NC NC Q8 SA SA C SA SA NC D0 Q0

Notes:
1. BW0 controls writes to DQ:D8.
2. A7 and B5 are the expansion addresses.

GS8662Q08/09/18/36BD-357/333/300/250/200
Pin Description Table

Symbol Description Type Comments
SA Synchronous Address Inputs Input —
R Synchronous Read Input Active Low
W Synchronous Write Input Active Low
Active Low
BW0–BW3 Synchronous Byte Writes Input
x18/x36 only
Active Low
NW0–NW1 Nybble Write Control Pin Input
x8 only
K Input Clock Input Active High
K Input Clock Input Active Low
C Output Clock Input Active High
C Output Clock Input Active Low
TMS Test Mode Select Input —
TDI Test Data Input Input —
TCK Test Clock Input Input —
TDO Test Data Output Output —
VREF HSTL Input Reference Voltage Input —
ZQ Output Impedance Matching Input Input —
Qn Synchronous Data Outputs Output —
Dn Synchronous Data Inputs Input —
Doff Disable DLL when low Input Active Low
CQ Output Echo Clock Output —
CQ Output Echo Clock Output —
VDD Power Supply Supply 1.8 V Nominal
VDDQ Isolated Output Buffer Supply Supply 1.5 or 1.8 V Nominal
VSS Power Supply: Ground Supply —
NC No Connect — —
Notes:
1. NC = Not Connected to die or any other pin
2. When ZQ pin is directly connected to VDDQ, output impedance is set to minimum value and it cannot be connected to ground or left
unconnected.
3. C, C, K, K cannot be set to VREF voltage.

GS8662Q08/09/18/36BD-357/333/300/250/200
Background
Separate I/O SRAMs, from a system architecture point of view, are attractive in applications where alternating reads and writes are
needed. Therefore, the SigmaQuad-II SRAM interface and truth table are optimized for alternating reads and writes. Separate I/O
SRAMs are unpopular in applications where multiple reads or multiple writes are needed because burst read or write transfers from
Separate I/O SRAMs can cut the RAM’s bandwidth in half.
SigmaQuad-II B2 SRAM DDR Read
The read port samples the status of the Address Input and R pins at each rising edge of K. A low on the Read Enable-bar pin, R,
begins a read cycle. Data can be clocked out after the next rising edge of K with a rising edge of C (or by K if C and C are tied
high), and after the following rising edge of K with a rising edge of C (or by K if C and C are tied high). Clocking in a high on the
Read Enable-bar pin, R, begins a read port deselect cycle.
SigmaQuad-II B2 Double Data Rate SRAM Read First

Read A NOP Write B Read C Write D Read E Write F Read G Write H
Address A B C D E F G H
BWx B B+1 D D+1 F F+1 H H+1
D B B+1 D D+1 F F+1 H H+1
Q A A+1 C C+1 E
CQ
CQ

GS8662Q08/09/18/36BD-357/333/300/250/200
SigmaQuad-II B2 SRAM DDR Write

The write port samples the status of the W pin at each rising edge of K and the Address Input pins on the following rising edge of
K. A low on the Write Enable-bar pin, W, begins a write cycle. The first of the data-in pairs associated with the write command is
clocked in with the same rising edge of K used to capture the write command. The second of the two data in transfers is captured on
the rising edge of K along with the write address. Clocking in a high on W causes a write port deselect cycle.
SigmaQuad-II B2 Double Data Rate SRAM Write First

Write A Read B Read C Write D NOP Read E Write F Read G Write H NOP
BWx A A+1 D D+1 F F+1 H H+1
D A A+1 D D+1 F F+1 H H+1
Q B B+1 C C+1 E E+1
CQ
CQ
Special Functions
Byte Write and Nybble Write Control
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low
during the data in sample times in a write sequence.
Each write enable command and write address loaded into the RAM provides the base address for a 2 beat data transfer. The x18
version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any
write sequence.
Nybble Write (4-bit) control is implemented on the 8-bit-wide version of the device. For the x8 version of the device, “Nybble
Write Enable” and “NBx” may be substituted in all the discussion above.

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Example x18 RAM Write Sequence using Byte Write Enables

Data In Sample Time BW0 BW1 D0–D8 D9–D17
Beat 1 0 1 Data In Don’t Care
Beat 2 1 0 Don’t Care Data In
Resulting Write Operation

Byte 1 Byte 2 Byte 3 Byte 4
D0–D8 D9–D17 D0–D8 D9–D17
Written Unchanged Unchanged Written
Beat 1 Beat 2
Output Register Control

SigmaQuad-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output
Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the
output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K
and K clocks. If the C and C clock inputs are tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to
function as a conventional pipelined read SRAM.

GS8662Q08/09/18/36BD-357/333/300/250/200
Example Four Bank Depth Expansion Schematic
R3
W3
R2
W2
R1
W1
R0
W0
A0–An
K
D1–Dn
Bank 0 Bank 1 Bank 2 Bank 3
A A A A
W W W W
R R R R
K CQ K CQ K CQ K CQ
D Q D Q D Q D Q
C C C C
C
Q1–Qn
CQ0
CQ1
CQ2
CQ3
Note:
For simplicity BWn, NWn, K, and C are not shown.

Burst of 2 SigmaQuad-II SRAM Depth Expansion
Read A Write B Read C Write D Read E Write F Read G Write H Read I Write J Read K Write L NOP
Rev: 1.02d 8/2017

K
Address A B C D E F G H I J K L
R(Bank1)
R(Bank2)
W(Bank1)
W(Bank2)
BWx(Bank1) F F+1 H H+1 J J+1
D(Bank1) F F+1 H H+1 J J+1
11/34
BWx(Bank2) B B+1 D D+1 L L+1
D(Bank2) B B+1 D D+1 L L+1
C(Bank1)
C(Bank1)
Q(Bank1) A A+1 G G+1 I I+1
CQ(Bank1)
CQ(Bank1)
C(Bank2)
C(Bank2)
Q(Bank2) C C+1 E E+1
CQ(Bank2)
CQ(Bank2)
© 2011, GSI Technology

GS8662Q08/09/18/36BD-357/333/300/250/200
GS8662Q08/09/18/36BD-357/333/300/250/200
FLXDrive-II Output Driver Impedance Control

HSTL I/O SigmaQuad-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to
VSS via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be
5X the value of the desired RAM output impedance. The allowable range of RQ to guarantee impedance matching continuously is
between 175 and 350. Periodic readjustment of the output driver impedance is necessary as the impedance is affected by drifts
in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply voltage and
temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each impedance
evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver is
implemented with discrete binary weighted impedance steps. 
SigmaQuad-II B2 Coherency and Pass Through Functions

Because the SigmaQuad-II B2 read and write commands are loaded at the same time, there may be some confusion over what
constitutes “coherent” operation. Normally, one would expect a RAM to produce the just-written data when it is read immediately
after a write. This is true of the SigmaQuad-II B2 except in one case, as is illustrated in the following diagram. If the user holds the
same address value in a given K clock cycle, loading the same address as a read address and then as a matching write address, the
SigmaQuad-II B2 will read or “Pass-thru” the latest data input, rather than the data from the previously completed write operation.
SigmaQuad-II B2 Coherency and Pass Through Functions

GS8662Q08/09/18/36BD-357/333/300/250/200
Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Read Truth Table
A R Output Next State Q Q
K K K K K
(tn) (tn) (tn) (tn+1½) (tn+2)
X 1 Deselect Hi-Z Hi-Z
V 0 Read Q0 Q1
Notes:
1. X = Don’t Care, 1 = High, 0 = Low, V = Valid.
2. R is evaluated on the rising edge of K.
3. Q0 and Q1 are the first and second data output transfers in a read.
Separate I/O SigmaQuad-II B2 SigmaQuad-II SRAM Write Truth Table

A W BWn BWn Input Next State D D
K K K K K K  K K
(tn + ½) (tn) (tn) (tn + ½) (tn), (tn + ½) (tn) (tn + ½)
V 0 0 0 Write Byte Dx0, Write Byte Dx1 D0 D1
V 0 0 1 Write Byte Dx0, Write Abort Byte Dx1 D0 X
V 0 1 0 Write Abort Byte Dx0, Write Byte Dx1 X D1
X 0 1 1 Write Abort Byte Dx0, Write Abort Byte Dx1 X X
X 1 X X Deselect X X
Notes:
1. X = Don’t Care, H = High, L = Low, V = Valid.
2. W is evaluated on the rising edge of K.
3. D0 and D1 are the first and second data input transfers in a write.
4. BWn represents any of the Byte Write Enable inputs (BW0, BW1, etc.).
x36 Byte Write Enable (BWn) Truth Table

BW0 BW1 BW2 BW3 D0–D8 D9–D17 D18–D26 D27–D35
1 1 1 1 Don’t Care Don’t Care Don’t Care Don’t Care
0 1 1 1 Data In Don’t Care Don’t Care Don’t Care
1 0 1 1 Don’t Care Data In Don’t Care Don’t Care
0 0 1 1 Data In Data In Don’t Care Don’t Care
1 1 0 1 Don’t Care Don’t Care Data In Don’t Care

GS8662Q08/09/18/36BD-357/333/300/250/200

BW0 BW1 BW2 BW3 D0–D8 D9–D17 D18–D26 D27–D35
0 1 0 1 Data In Don’t Care Data In Don’t Care
1 0 0 1 Don’t Care Data In Data In Don’t Care
0 0 0 1 Data In Data In Data In Don’t Care
1 1 1 0 Don’t Care Don’t Care Don’t Care Data In
0 1 1 0 Data In Don’t Care Don’t Care Data In
1 0 1 0 Don’t Care Data In Don’t Care Data In
0 0 1 0 Data In Data In Don’t Care Data In
1 1 0 0 Don’t Care Don’t Care Data In Data In
0 1 0 0 Data In Don’t Care Data In Data In
1 0 0 0 Don’t Care Data In Data In Data In
0 0 0 0 Data In Data In Data In Data In

BW0 BW1 D0–D8 D9–D17
1 1 Don’t Care Don’t Care
0 1 Data In Don’t Care
1 0 Don’t Care Data In
0 0 Data In Data In
x8 Nybble Write Enable (NWn) Truth Table

NW0 NW1 D0–D3 D4–D7
1 1 Don’t Care Don’t Care
0 1 Data In Don’t Care
1 0 Don’t Care Data In
0 0 Data In Data In

GS8662Q08/09/18/36BD-357/333/300/250/200
Absolute Maximum Ratings

(All voltages reference to VSS)
Symbol Description Value Unit

VDD Voltage on VDD Pins –0.5 to 2.9 V
VDDQ Voltage in VDDQ Pins –0.5 to VDD V
VREF Voltage in VREF Pins –0.5 to VDDQ V
VI/O Voltage on I/O Pins –0.5 to VDDQ +0.5 ( 2.9 V max.) V
VIN Voltage on Other Input Pins –0.5 to VDDQ +0.5 ( 2.9 V max.) V
IIN Input Current on Any Pin +/–100 mA dc
IOUT Output Current on Any I/O Pin +/–100 mA dc
TJ Maximum Junction Temperature 125 oC
TSTG Storage Temperature –55 to 125 oC
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Recommended Operating Conditions, for an extended period of time, may affect
reliability of this component.
Recommended Operating Conditions
Power Supplies
Parameter Symbol Min. Typ. Max. Unit
Supply Voltage VDD 1.7 1.8 1.9 V
I/O Supply Voltage VDDQ 1.4 — VDD V
Reference Voltage VREF 0.68 — 0.95 V
Note:
The power supplies need to be powered up simultaneously or in the following sequence: VDD, VDDQ, VREF, followed by signal inputs. The power
down sequence must be the reverse. VDDQ must not exceed VDD. For more information, read AN1021 SigmaQuad and SigmaDDR Power-Up.
Operating Temperature
Parameter Symbol Min. Typ. Max. Unit
Junction Temperature
TJ 0 25 85 C
(Commercial Range Versions)
Junction Temperature
TJ –40 25 100 C
(Industrial Range Versions)*
Note:
* The part numbers of Industrial Temperature Range versions end with the character “I”. Unless otherwise noted, all performance specifications
quoted are evaluated for worst case in the temperature range marked on the device.

GS8662Q08/09/18/36BD-357/333/300/250/200
Thermal Impedance
Test PCB JA (C°/W)  JA (C°/W)  JA (C°/W) JB (C°/W)  JC (C°/W)
Package
Substrate Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s
165 BGA 4-layer 22.300 18.572 17.349 9.292 2.310
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
HSTL I/O DC Input Characteristics

Parameter Symbol Min Max Units Notes
DC Input Logic High VIH (dc) VREF + 0.1 VDDQ + 0.3 V 1
DC Input Logic Low VIL (dc) –0.3 VREF – 0.1 V 1
Notes:
1. Compatible with both 1.8 V and 1.5 V I/O drivers.
2. These are DC test criteria. DC design criteria is VREF ± 50 mV. The AC VIH/VIL levels are defined separately for measuring timing
parameters.
3. VIL (Min)DC = –0.3 V, VIL(Min)AC = –1.5 V (pulse width 3 ns).
4. VIH (Max)DC = VDDQ + 0.3 V, VIH(Max)AC = VDDQ + 0.85 V (pulse width 3 ns).
HSTL I/O AC Input Characteristics

Parameter Symbol Min Max Units Notes
AC Input Logic High VIH (ac) VREF + 200 — mV 2,3
AC Input Logic Low VIL (ac) — VREF – 200 mV 2,3
VREF Peak-to-Peak AC Voltage VREF (ac) — 5% VREF (DC) mV 1
Notes:
1. The peak-to-peak AC component superimposed on VREF may not exceed 5% of the DC component of VREF.
2. To guarantee AC characteristics, VIH,VIL, Trise, and Tfall of inputs and clocks must be within 10% of each other.
3. For devices supplied with HSTL I/O input buffers. Compatible with both 1.8 V and 1.5 V I/O drivers.

GS8662Q08/09/18/36BD-357/333/300/250/200
Undershoot Measurement and Timing Overshoot Measurement and Timing

VIH 20% tKHKH
VDD + 1.0 V
VSS 50%
50% VDD
VSS – 1.0 V
20% tKHKH VIL
Note:
Input Undershoot/Overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 1.8 V)
Parameter Symbol Test conditions Typ. Max. Unit

Input Capacitance CIN VIN = 0 V 4 5 pF
Output Capacitance COUT VOUT = 0 V 6 7 pF
Clock Capacitance CCLK VIN = 0 V 5 6 pF
Note:
This parameter is sample tested.
AC Test Conditions
Parameter Conditions
Input high level 1.25 V
Input low level 0.25 V
Max. input slew rate 2 V/ns
Input reference level 0.75 V
Output reference level VDDQ/2
Note:
Test conditions as specified with output loading as shown unless otherwise noted.
AC Test Load Diagram
DQ
RQ = 250 (HSTL I/O)
VREF = 0.75 V
50
VT = VDDQ/2

GS8662Q08/09/18/36BD-357/333/300/250/200
Input and Output Leakage Characteristics

Parameter Symbol Test Conditions Min. Max
Input Leakage Current
IIL VIN = 0 to VDD –2 uA 2 uA
(except mode pins)
Doff IILDOFF VIN = 0 to VDD –2 uA 100 uA
Output Disable,
Output Leakage Current IOL –2 uA 2 uA
VOUT = 0 to VDDQ
Programmable Impedance HSTL Output Driver DC Electrical Characteristics

Parameter Symbol Min. Max. Units Notes
Output High Voltage VOH1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 1, 3
Output Low Voltage VOL1 VDDQ/2 – 0.12 VDDQ/2 + 0.12 V 2, 3
Output High Voltage VOH2 VDDQ – 0.2 VDDQ V 4, 5
Output Low Voltage VOL2 Vss 0.2 V 4, 6
Notes:
1. IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175 RQ  350
2. IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175  RQ  350.
3. Parameter tested with RQ = 250 and VDDQ = 1.5 V or 1.8 V
4. 0RQ  
5. IOH = –1.0 mA
6. IOL = 1.0 mA

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Operating Currents
-357 -333 -300 -250 -200
Parameter Symbol Test Conditions 0 –40 0 –40 0 –40 0 –40 0 –40

Notes
to to to to to to to to to to
70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C
Operating Current (x36): VDD = Max, IOUT = 0 mA 1195 1205 1100 1110 1060 1070 895 905 740 750
IDD 2, 3
DDR Cycle Time tKHKH Min mA mA mA mA mA mA mA mA mA mA
IDD 2, 3
IDD 2, 3
IDD 2, 3
Device deselected,
Standby Current (NOP): IOUT = 0 mA, f = Max, 275 285 270 280 255 265 240 250 220 230
ISB1 2, 4
DDR All Inputs 0.2 V or VDD – 0.2 mA mA mA mA mA mA mA mA mA mA
V
Notes:
1. Power measured with output pins floating.
2. Minimum cycle, IOUT = 0 mA
3. Operating current is calculated with 50% read cycles and 50% write cycles.
4. Standby Current is only after all pending read and write burst operations are completed.

GS8662Q08/09/18/36BD-357/333/300/250/200
AC Electrical Characteristics
-357 -333 -300 -250 -200
Parameter Symbol Units Notes
Min Max Min Max Min Max Min Max Min Max
Clock
K, K Clock Cycle Time tKHKH
C, C Clock Cycle Time 2.8 8.4 3.0 8.4 3.3 8.4 4.0 8.4 5.0 8.4 ns
tCHCH
tKC Variable tKCVar — 0.2 — 0.2 — 0.2 — 0.2 — 0.2 ns 6
K, K Clock High Pulse Width tKHKL

C, C Clock High Pulse Width 1.12 — 1.2 — 1.32 — 1.6 — 2.0 — ns
tCHCL
K, K Clock Low Pulse Width tKLKH

1.12 — 1.2 — 1.32 — 1.6 — 2.0 — ns
C, C Clock Low Pulse Width tCLCH
K to K High tKHKH
C to C High 1.26 — 1.35 — 1.49 — 1.8 — 2.2 — ns
tCHCH
K to K High tKHKH
1.26 — 1.35 — 1.49 — 1.8 — 2.2 — ns
C to C High tCHCH
K, K Clock High to C, C Clock High tKHCH 0 1.26 0 1.35 0 1.49 0 1.8 0 2.3 ns
DLL Lock Time tKCLock 1024 — 1024 — 1024 — 1024 — 1024 — cycle 7
K Static to DLL reset tKCReset 30 — 30 — 30 — 30 — 30 — ns

Output Times
K, K Clock High to Data Output Valid tKHQV
— 0.45 — 0.45 — 0.45 — 0.45 — 0.45 ns 4
C, C Clock High to Data Output Valid tCHQV
K, K Clock High to Data Output Hold tKHQX

C, C Clock High to Data Output Hold –0.45 — –0.45 — –0.45 — –0.45 — –0.45 — ns 4
tCHQX
K, K Clock High to Echo Clock Valid tKHCQV

— 0.45 — 0.45 — 0.45 — 0.45 — 0.45 ns
C, C Clock High to Echo Clock Valid tCHCQV
K, K Clock High to Echo Clock Hold tKHCQX

–0.45 — –0.45 — –0.45 — –0.45 — –0.45 — ns
C, C Clock High to Echo Clock Hold tCHCQX
CQ, CQ High Output Valid tCQHQV — 0.23 — 0.25 — 0.27 — 0.30 — 0.35 ns 8
CQ, CQ High Output Hold tCQHQX –0.23 — –0.25 — –0.27 — –0.30 — –0.35 — ns 8
tCQHCQH
CQ Phase Distortion 1.00 — 1.10 — 1.24 — 1.55 — 1.95 — ns
tCQHCQH
K Clock High to Data Output High-Z tKHQZ

— 0.45 — 0.45 — 0.45 — 0.45 — 0.45 ns 4
C Clock High to Data Output High-Z tCHQZ
K Clock High to Data Output Low-Z tKHQX1

C Clock High to Data Output Low-Z –0.45 — –0.45 — –0.45 — –0.45 — –0.45 — ns 4
tCHQX1
Setup Times
Address Input Setup Time tAVKH 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 1
Control Input Setup Time (R, W) tIVKH 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 2
Control Input Setup Time (BWX) (BWX) tIVKH 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 3
Data Input Setup Time tDVKH 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns

GS8662Q08/09/18/36BD-357/333/300/250/200
AC Electrical Characteristics (Continued)

-357 -333 -300 -250 -200
Parameter Symbol Units Notes
Min Max Min Max Min Max Min Max Min Max
Hold Times
Address Input Hold Time tKHAX 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 1
Control Input Hold Time (R, W) tKHIX 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 2
Control Input Hold Time (BWX) (BWX) tKHIX 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns 3
Data Input Hold Time tKHDX 0.28 — 0.28 — 0.30 — 0.35 — 0.4 — ns
Notes:
1. All Address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control signals are R, W
3. Control signals are BW0, BW1, and (NW0, NW1 for x8) and (BW2, BW3 for x36).
4. If C, C are tied high, K, K become the references for C, C timing parameters
5. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ. The specs as shown do not imply bus contention because tCHQX1 is a MIN
parameter that is worst case at totally different test conditions (0°C, 1.9 V) than tCHQZ, which is a MAX parameter (worst case at 70°C, 1.7 V). It is not possible for two
SRAMs on the same board to be at such different voltages and temperatures.
6. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
7. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD and input clock are stable.
8. Echo clock is very tightly controlled to data valid/data hold. By design, there is a ±0.1 ns variation from echo clock to data. The datasheet parameters reflect tester guard
bands and test setup variations.

K and K Controlled Read-Write-Read Timing Diagram
Read A Write B NOP Read C Read D Write E Write F Read G Write H NOP
KHKL
KHKH KLKH
Rev: 1.02d 8/2017

KHKHbar
AVKH KHAX
IVKH KHIX
IVKH KHIX
KHIX
IVKH
BWx
22/34
DVKH KHDX
D B B+1 E E+1 F F+1 H H+1
KHCQV
KHCQX
CQ
KHCQV
KHCQX
CQ
CQHQX KHQV
KHQX1 KHQX CQHQV KHQZ
Q A A+1 C C+1 D D+1 G

GS8662Q08/09/18/36BD-357/333/300/250/200
C and C Controlled Read-Write-Read Timing Diagram
Read A Write B NOP Write C Read D Write E Read F Write G Read H NOP
KHKL
KHKH KLKH
Rev: 1.02d 8/2017

KHKHbar
AVKH
KHAX
IVKH
KHIX
IVKH
KHIX
23/34
IVKH KHIX
BWx
DVKH KHDX
D B B+1 C C+1 E E+1 G G+1
KHKL
KHKH KLKH
KHKHbar
CHQX1 CHQZ CHQV CHQX
Q A A+1 D D+1 F F+1 H
CHCQV
CHCQX CQHQX CQHQV
CQ
CHCQV
CHCQX
CQ

GS8662Q08/09/18/36BD-357/333/300/250/200
GS8662Q08/09/18/36BD-357/333/300/250/200
JTAG Port Operation

Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDD.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
JTAG Pin Descriptions
Pin Pin Name I/O Description

Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
TCK Test Clock In
from the falling edge of TCK.
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
TMS Test Mode Select In controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
TDI Test Data In In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
Output that is active depending on the state of the TAP state machine. Output changes in
TDO Test Data Out Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers

Overview
The various JTAG registers, refered to as Test Access Port or TAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.

GS8662Q08/09/18/36BD-357/333/300/250/200
Boundary Scan Register

The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
· · · · · · · ·
Boundary Scan Register
· ·
·
1
0
108
Bypass Register
0
2 1 0
Instruction Register
TDI TDO
ID Code Register
31 30 29 · · ·· 2 1 0
Control Signals
TMS
Test Access Port (TAP) Controller
TCK
Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

GS8662Q08/09/18/36BD-357/333/300/250/200
ID Register Contents
Presence Register
GSI Technology
See BSDL Model JEDEC Vendor
ID Code
Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X X X X X X X X X X X X X X X X X X X X 0 0 0 1 1 0 1 1 0 0 1 1
Tap Controller Instruction Set

Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.

GS8662Q08/09/18/36BD-357/333/300/250/200
JTAG Tap Controller State Diagram

Test Logic Reset
1 0
1 1 1
Run Test Idle Select DR Select IR
0 0 0
1 1
Capture DR Capture IR
0 0
Shift DR Shift IR
1 0 1 0
1 1
Exit1 DR Exit1 IR
0 0
Pause DR Pause IR
1 0 1 0
Exit2 DR 0 Exit2 IR 0
1 1
Update DR Update IR
1 0 1 0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-
tate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.

GS8662Q08/09/18/36BD-357/333/300/250/200

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-
tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-
ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-
ated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-
Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
JTAG TAP Instruction Set Summary
Instruction Code Description Notes

EXTEST 000 Places the Boundary Scan Register between TDI and TDO. 1
IDCODE 001 Preloads ID Register and places it between TDI and TDO. 1, 2
Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO.
SAMPLE-Z 010 1
Forces all RAM output drivers to High-Z.
GSI 011 GSI private instruction. 1
SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. 1
BYPASS 111 Places Bypass Register between TDI and TDO. 1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.

GS8662Q08/09/18/36BD-357/333/300/250/200
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter Symbol Min. Max. Unit Notes

Test Port Input Low Voltage VILJ –0.3 0.3 * VDD V 1
Test Port Input High Voltage VIHJ 0.7 * VDD VDD +0.3 V 1
TMS, TCK and TDI Input Leakage Current IINHJ –300 1 uA 2
TMS, TCK and TDI Input Leakage Current IINLJ –1 100 uA 3
TDO Output Leakage Current IOLJ –1 1 uA 4
Test Port Output High Voltage VOHJ VDD – 0.2 — V 5, 6
Test Port Output Low Voltage VOLJ — 0.2 V 5, 7
Test Port Output CMOS High VOHJC VDD – 0.1 — V 5, 8
Test Port Output CMOS Low VOLJC — 0.1 V 5, 9

Notes:
1. Input Under/overshoot voltage must be –1 V < Vi < VDDn +1 V not to exceed V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ  VIN VDDn
3. 0 V VIN VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDD supply.
6. IOHJ = –2 mA
7. IOLJ = + 2 mA
8. IOHJC = –100 uA
9. IOLJC = +100 uA
JTAG Port AC Test Conditions
Parameter Conditions JTAG Port AC Test Load

VDD – 0.2 V TDO
Input high level
Input low level 0.2 V
50 30pF*
Input slew rate 1 V/ns
VDD/2
Input reference level VDD/2
* Distributed Test Jig Capacitance
Output reference level VDD/2
Notes:
1. Include scope and jig capacitance.
2. Test conditions as shown unless otherwise noted.

GS8662Q08/09/18/36BD-357/333/300/250/200
JTAG Port Timing Diagram

tTKC tTKH tTKL
TCK
tTH
tTS
TDI
tTH
tTS
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
JTAG Port AC Electrical Characteristics

Parameter Symbol Min Max Unit
TCK Cycle Time tTKC 50 — ns
TCK Low to TDO Valid tTKQ — 20 ns
TCK High Pulse Width tTKH 20 — ns
TCK Low Pulse Width tTKL 20 — ns
TDI & TMS Set Up Time tTS 10 — ns
TDI & TMS Hold Time tTH 10 — ns

GS8662Q08/09/18/36BD-357/333/300/250/200
Package Dimensions—165-Bump FPBGA (Package D)
A1 CORNER TOP VIEW Ø0.10 M C BOTTOM VIEW A1 CORNER

Ø0.25 M C A B
Ø0.40~0.60 (165x)
1 2 3 4 5 6 7 8 9 10 11 11 10 9 8 7 6 5 4 3 2 1
A A
B B
C C
D D
E E
1.0
F F
G G
15±0.05
14.0
H H
1.0
J J
K K
L L
M M
N N
P P
R R
A
1.0 1.0
10.0
B 13±0.05
0.15 C
0.20(4x)
SEATING PLANE
1.40 MAX.
0.36~0.46

GS8662Q08/09/18/36BD-357/333/300/250/200
Ordering Information—GSI SigmaQuad-II SRAM

Speed
Org Part Number1 Type Package TJ2
(MHz)
2M x 36 GS8662Q36BD-357 SigmaQuad-II SRAM 165-bump BGA 357 C
2M x 36 GS8662Q36BD-357I SigmaQuad-II SRAM 165-bump BGA 357 I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8662Q36BD-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.

GS8662Q08/09/18/36BD-357/333/300/250/200

Speed
(MHz)
2M x 36 GS8662Q36BGD-357 SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 357 C
2M x 36 GS8662Q36BGD-357I SigmaQuad-II SRAM RoHS-compliant 165-bump BGA 357 I
Notes:

GS8662Q08/09/18/36BD-357/333/300/250/200

Speed
(MHz)
Notes:
SigmaQuad-II Revision History

File Name Format/Content Description of changes
8662QxxB_r1
Creation of datasheet
(Rev1.00a: Updated DLL Lock time to 2048 cycles)
• Removal of 200 MHz and 167 MHz speed bins
8662QxxB_r1_01 Content • Addition of 400 MHz and 350 MHz speed bins
• (Rev1.01a: Removed TA references)
• Update to MP status
• (Rev1.02a: Removed Power-up section and added AN1021 link to
Power Supplies table)
8662QxxB_r1_02 Content • (Rev1.02b: Editorial updates)
• (Rev1.02c: Updated DLL lock time in AC Char table)
• (Rev1.02d: Corrected erroneous information in Input and Output
Leakage Characteristics table)

Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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GS8662Q08BGD-250 GS8662Q09BD-357 GS8662Q36BD-250 GS8662Q09BGD-200I GS8662Q09BD-333I
GS8662Q18BGD-250 GS8662Q18BD-300I GS8662Q18BD-250I GS8662Q08BGD-300I GS8662Q18BGD-300
GS8662Q36BGD-250 GS8662Q08BGD-333 GS8662Q18BD-250 GS8662Q08BD-250I GS8662Q36BD-250I
GS8662Q08BD-250 GS8662Q18BD-200 GS8662Q18BGD-333I GS8662Q08BGD-357 GS8662Q09BGD-333I
GS8662Q18BGD-200 GS8662Q36BD-300I GS8662Q09BGD-250I GS8662Q09BGD-300I GS8662Q36BGD-300
GS8662Q18BGD-200I GS8662Q36BGD-333 GS8662Q18BD-357 GS8662Q18BD-333I GS8662Q36BGD-250I

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GS8662Q08/09/18/36BD-357/333/300/250/200

357 MHz–200 MHz

Features Clocking and Addressing Schemes

tKHKH 2.8 ns 3.0 ns 3.3 ns 4.0 ns 5.0 ns

tKHQV 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns

Rev: 1.02d 8/2017 1/34 © 2011, GSI Technology

2M x 36 SigmaQuad-II SRAM—Top View

B Q27 Q18 D18 SA BW3 K BW0 SA D17 Q17 Q8

C D27 Q28 D19 VSS SA SA SA VSS D16 Q7 D8

E Q29 D29 Q20 VDDQ VSS VSS VSS VDDQ Q15 D6 Q6

J D31 Q31 D23 VDDQ VDD VSS VDD VDDQ D12 Q4 D4

K Q32 D32 Q23 VDDQ VDD VSS VDD VDDQ Q12 D3 Q3

M D33 Q34 D25 VSS VSS VSS VSS VSS D10 Q1 D2

N D34 D26 Q25 VSS SA SA SA VSS Q10 D9 D1

P Q35 D35 Q26 SA SA C SA SA Q9 D0 Q0

R TDO TCK SA SA SA C SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Rev: 1.02d 8/2017 2/34 © 2011, GSI Technology

4M x 18 SigmaQuad-II SRAM—Top View

C NC NC D10 VSS SA SA SA VSS NC Q7 D8

D NC D11 Q10 VSS VSS VSS VSS VSS NC NC D7

E NC NC Q11 VDDQ VSS VSS VSS VDDQ NC D6 Q6

F NC Q12 D12 VDDQ VDD VSS VDD VDDQ NC NC Q5

G NC D13 Q13 VDDQ VDD VSS VDD VDDQ NC NC D5

J NC NC D14 VDDQ VDD VSS VDD VDDQ NC Q4 D4

K NC NC Q14 VDDQ VDD VSS VDD VDDQ NC D3 Q3

L NC Q15 D15 VDDQ VSS VSS VSS VDDQ NC NC Q2

M NC NC D16 VSS VSS VSS VSS VSS NC Q1 D2

N NC D17 Q16 VSS SA SA SA VSS NC NC D1

R TDO TCK SA SA SA C SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Rev: 1.02d 8/2017 3/34 © 2011, GSI Technology

8M x 8 SigmaQuad-II SRAM—Top View

D NC D4 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q4 VDDQ VSS VSS VSS VDDQ NC D2 Q2

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D5 Q5 VDDQ VDD VSS VDD VDDQ NC NC NC

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q1 D1

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q6 D6 VDDQ VSS VSS VSS VDDQ NC NC Q0

M NC NC NC VSS VSS VSS VSS VSS NC NC D0

R TDO TCK SA SA SA C SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Rev: 1.02d 8/2017 4/34 © 2011, GSI Technology

8M x 9 SigmaQuad-II SRAM — Top View

D NC D5 NC VSS VSS VSS VSS VSS NC NC NC

E NC NC Q5 VDDQ VSS VSS VSS VDDQ NC D3 Q3

F NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

G NC D6 Q6 VDDQ VDD VSS VDD VDDQ NC NC NC

J NC NC NC VDDQ VDD VSS VDD VDDQ NC Q2 D2

K NC NC NC VDDQ VDD VSS VDD VDDQ NC NC NC

L NC Q7 D7 VDDQ VSS VSS VSS VDDQ NC NC Q1

M NC NC NC VSS VSS VSS VSS VSS NC NC D1

R TDO TCK SA SA SA C SA SA SA TMS TDI

11 x 15 Bump BGA—13 x 15 mm Body—1 mm Bump Pitch

Rev: 1.02d 8/2017 5/34 © 2011, GSI Technology

Pin Description Table

Rev: 1.02d 8/2017 6/34 © 2011, GSI Technology

SigmaQuad-II B2 Double Data Rate SRAM Read First