Arlon PCB Manufacturer

RAYMING PCB & ASSEMBLY
Arlon PCB Manufacturer

Rayming provide Arlon PCB Manufacturing, Send PCB
files to [email protected], We will quote you Very Soon!
Arlon PCB
Table of Contents
Arlon PCB Manufacturing Service
Arlon PCB Materials for Electronics (MED) is a Division of Arlon LLC a major
manufacturer of specialty high performance laminate
and prepreg materials for use in a wide variety of PCB (printed circuit
board) applications. These applications typically require laminates with
specialized electrical, thermal, mechanical, or other performance
characteristic that exceed those of traditional standard FR-4 materials.
Arlon Electronic Substrates specializes in thermoset resin technology
including polyimide, high Tg multifunctional epoxy, and low loss
thermoset laminate and prepreg systems. These resin systems are
available on a variety of substrates including woven glass and non-woven
PCB Manufacturing & Assembly Services https://www.raypcb.com/

aramid. Typical applications for these materials include advanced
commercial and military electronics such as avionics, semiconductor
testing, heat sink bonding, High Density Interconnect (HDI)
and microvia PCB’s (i.e. in mobile communication products).
Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE),
ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon
thermoset laminates that deliver the electrical performance needed in
frequency-dependent circuit applications such as base station antennas,
phased array radars, power amplifier boards, communications systems,
and various other antenna applications. An exciting product is a lower loss
version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest
thermal expansion, highest phase stability, and lowest moisture
absorption of any product in its class.Request Arlon PCB Quote Now
Request Arlon PCB Manufacturing Quote Now
Arlon PCB Material available Part Number :

Arlon Electronic Materials
Arlon Polyimide Products
Arlon 33N Kerimid 701 (VO) Polyimide
Arlon 35N Kerimid 701 (V1) Polyimide
Arlon 85N Polyimide – Unmodified
Arlon 84N Multifilm Hole-Fill Prepreg
Arlon 38N Low Flow Polyimide Prepreg
Arlon 37N Low-Flow vs. No-Flow Polyimide
Arlon HF-50 Polymide Hole Fill Compound
Arlon Epoxy Products
Arlon 44N “Multifilm” Hole-Fill Prepreg
Arlon 45N Multifunctional Epoxy
Arlon 47N Low-Flow Tetrafunctional Epoxy
Arlon 49N Low-Flow Multifunctional Prepreg

Arlon Legacy Thermount® Products
Arlon 51N Low-Flow Lead-Free
Arlon 55NT Multifunctional Epoxy/Thermount®
Arlon 85NT Polyimide/Thermount®
Arlon 55LM Low Moisture Regain Thermount®
Arlon 55ST Multifunctional Epoxy/Thermount®
Arlon Microwave Products
Arlon CLTE Product Family
Arlon CLTE-XT
Arlon CLTE-AT
Arlon CLTE
Arlon TC Product Family
Arlon TC350
Arlon TC600
Arlon Next Generation of Lower Loss Materials, Available with PIM+
Technology
Arlon AD255A
Arlon AD260A
Arlon AD300A
Arlon AD320A
PTFE and Microdispersed Ceramic reinforced with Commercial Grade
Glass
Arlon AD350A
Arlon AD410
Arlon AD430
Arlon AD450
Arlon AD1000
Arlon Traditional Products – High PTFE to Glass Ratio, Lowest Loss
Woven Fiberglass Reinforced PTFE – Unidirectional Plies
Arlon CuClad 250GT
Arlon CuClad 250GX
Arlon CuClad 233LX
Arlon CuClad 217LX
Arlon Traditional Products – High PTFE to Glass Ratio, Lowest Loss
Non-Woven Reinforced PTFE
Arlon IsoClad 917
Arlon IsoClad 933

Arlon Ultra Thin Laminates with Higher Dielectric Constant
Arlon AD5
Arlon AD10
Arlon Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
Arlon 25N
Arlon 25FR
Arlon Legacy, Low Cost Commercial Based Laminates
Arlon CLTE-LC
Arlon AD250
Arlon AD255
Arlon AD270
Arlon AD320
Arlon AD350
Arlon AD600
Arlon AR1000
Thermoplastic Bonding Films for Stripline and Multilayer Packages

CuClad 6250
CuClad 6700
CLTE-P
Will all the different features of every RF PCB application, we have
developed partnerships with the key material suppliers such as Rogers
PCB, Arlon, Nelco, and Taconic just to name a few. While many of the
materials are very specialized, we do hold significant stock of product in
our warehouseRequest Alaron PCB Quote Now
What sets Arlon PCB apart from other materials?
Arlon
PCB material
Arlon, a term we come across in electronics manufacturing and design
every day. It is often easily overlooked but it has an intriguing history. As

you well know, printed circuit boards are vital for all electronic
devices. Arlon PCB, a prime example of high performance and quality
printed circuit board, becomes ideal for your electronic needs, especially if
you have unique application areas that need superior PCB capabilities. It,
however, becomes crucial to trust an ideal PCB manufacturing and
assembly partner in RayMing PCB and Assembly to ensure quality Arlon
PCBs for your use. But before you engage us or any other Arlon
manufacturing company, let us first understand what an Arlon printed
circuit board means.
Arlon Printed Circuit Board
You can always bank the idea of circuit boards and electronics devoid of
the appropriate fabrication materials as wishful thinking. Circuit
board materials represent a fundamental aspect of the design, production,
and performance of PCBs. It is with this background that this article will
approach the entire subject of Arlon PCB.
So what is Arlon PCB? It implies a circuit board manufactured with
materials from Arlon LLC. The company contains a division specializing in
materials for electronics (MED) that features high-performance Prepreg
and laminate materials. Such materials are deployed in diverse application
areas that demand specialized mechanical, thermal, electrical, and other
vital attributes that surpass traditional FR-4 resources and materials.

Therefore, it becomes crucial for you to get a top Arlon PCB
manufacturer with the capacity to source for every Arlon material needed
and offer fabrication and assembly services for your PCB design needs
and at an agreeable cost.
Arlon PCB Materials
What sets Arlon apart from other materials is the unique chemical
composition that makes it such a reliable and versatile material for
industrial use. Arlon’s versatility is attributable to the unique properties
which make it suitable for a number of different purposes, such as
manufacturing, design, construction and testing. It has peculiarities in its
chemical composition which make it ideal for addressing all these needs.
As alluded to, Arlon PCBs have become a reality with quality Arlon PCB
materials. Arlon electronic materials comprise substrates, conductive
layers, etc. However, all Arlon electronic substrates or Arlon laminates
possess distinct features, courtesy of the thermal resin technology
deployed in their manufacture. It is a technology that incorporates high
glass transition multifunctional epoxy, low loss thermoset, and polyimide
Prepreg and laminate systems. Such resin systems become available on
diverse substrates encompassing non-woven aramid and woven glass.

The conducting layer, mostly copper, always remains the same as other
FR-4 based printed circuit boards, though it comes a little thicker. However,
the Arlon microwave material focuses on fluoropolymers filled with
ceramic and hydrocarbon thermoset laminates with low-loss ceramic. It is
a pool of materials that guarantees the required electrical performance in
the frequency-dependent printed circuit board applications like
communication systems, phased-array radars, base station antennas,
power amplifier boards, and other areas/applications that rely on
the antenna.
Features of Arlon PCB Materials
Arlon printed circuit materials have diverse properties owing to the
different types of materials falling under its classes of Arlon Polyimide
products, low flow products, epoxy products, and SMT or controlled
thermal expansion product material classes. However, before tackling
some product-specific attributes, it becomes important to acknowledge
that all Arlon products have common features. Such attributes include the
following.
 High glass transition temperature. All Arlon printed circuit board
materials, whether Arlon laminate, Arlon fabric, or other integrated
circuit materials, possess a high glass transition temperature
attribute. To better understand this, remember that glass transition

implies the steady and reversible change of an amorphous
substance from its tough and brittle glassy state to a rubbery or
viscous state when subjected to a temperature increase.
 Low loss dielectric thermoset. All Arlon PCB materials have a low
loss thermoset, which means they cannot heat up quickly when
operating in high RF situations. An excellent of such material
includes polyimide, silicone, or PTFE, among other material types.
 Polyimide. In this case, it comes as an Arlon polymer, comprising of
imide monomers under the high-performance category of plastics.
Such a high heat resistance property allows the material to get
deployed in diverse applications that need rugged organic
constituents. Because of this, it gets deployed in the
high-temperature display, fuel cells, military applications, etc.
However, each category of Arlon materials has specific material products,
with each possessing specific features. Therefore, if you want to design an
Arlon printed circuit board, you cannot escape the significance of
understanding these specific Arlon materials and their corresponding
attributes to ensure quality and functional Arlon PCB.
Types and Attributes of Arlon Printed Circuit Board Materials

Polyimide Products
One of the crucial material classes and comprises different types of resin
systems. It includes the following.
 Arlon 33N. It is a flame retardant polyimide composed of a glass
transition/shift temperature of 250 degrees Celsius, a Td or
decomposition temperature at 5% of 389 degrees Celsius, and a
water absorption percentage of 0.21. Additionally, it expands at
1.2% on the Z-axis and with a TC of 0.2.
Application:
The Arlon 33N polyimide finds its application on PCBs designed for
commercial applications that require a rating of UL94-V0. Such
applications need thermal stability and reliability besides superior
performance. Further, it should satisfy the IPC-4101/41and IPC-4101/40.
 Arlon 35N. Similar to the Arlon 33N, it comes as a flame retardant
polyimide whose glass transition temperature is 250 degrees

Celsius. While rated at V1 regarding the UL-94 class, the resin also
comes with a decomposition temperature of 407 degrees Celcius
and a water absorption percentage of 0.26. What’s more? It has a
reduced cure time.
Application:
The Arlon 33N resin system is perfect for applications that need resistance
to PTH failures and a low Z-axis directional expansion when operating. It
is ideal for military down-hole gas and oil drilling, aerospace, and
industrial and commercial electronics.
 Arlon HF-50. It is a powered poly-hole fill compound with a glass
transition temperature of 250 degrees Celsius and a water
absorption percentage of 0.4. The resin system also possesses a
Z-axis expansion of 0.55 and a more than 400 degrees Celsius
decomposition temperature. Additionally, it comes as a via fill
compound.
Application:
It mainly gets deployed in filling clearance holes that connect through-hole
components, especially in metal core printed wiring boards. Consequently,
it finds its application in enhancing thermal conductivity, minimal resin
shrinkage, and crack resistance.

 Arlon 84N. It is a filled polyimide Prepreg material with a glass
absorption percentage of 0.3. The resin system also possesses a
thermal decomposition value of 407 and is ideal for filling heavy
copper. It also meets the IPC-4101/41 and IPC-4101/40.
Application:
It is ideal for filling etched spots in polyimide multilayers with thick copper
layers. Arlon 84N is also instrumental in filling metal core’s clearance
holes.
 Arlon 85N. The high-temperature polyimide material has a glass
absorption percentage of 0.27. It has a Z-axis expansion rate of
1.2% and temperature decomposition of 407 degrees Celsius. The
resin system offers long-term and optimum stability.
Application:
Arlon 85N is ideal for multilayers with high layer counts, especially in
the aerospace, space, military, and other allied industries where thermal
stability and reliability prove crucial.

 Arlon 85HP. Like the Arlon 85N, it is a high-temperature polyimide
resin system with a high glass temperature of over 250 degrees
Celsius and a Z-expansion percentage of 1.0. Additionally, the
material has a thermal decomposition of 430 degrees Celsius and a
water absorption value of 0.32%. The unique blend of the
micro-fine proprietary fine fillers and the polyimide resin ensure
superior performance. It is validated through IPC-4101/40,
IPC-4101/41, and IPC-4101/43.
Application:
It finds its application in mission PWB’s, especially in aerospace, military,
down-hole gas and oil drilling, and space applications.
 Arlon 84HP. The filled polyimide Prepreg material possesses a high
glass transition temperature of over 250 degrees Celsius and a
water absorption level of 0.32%. It also has a thermal
decomposition temperature of 0.5 and a perfect ceramic fill for
thick copper layers. It also satisfies the IPC-4101/40, /41 and is
validated through the IPC-4101/43.
Application:
It is primarily used to fill the thick copper layers, as the ceramic filler
inhibits cracking and reduces shrinkage during drilling the through-hole.

It is vital to note that polyimide products such as double-treated and
reverse-treated resins can become available whenever you want some.
Additionally, it’s also possible to get ultra-thin copper foils for
ultra-fine-line applications.
Epoxy Products
It represents another vital material class of the Arlon PCB. It includes the
following.
 Arlon 44N. It comes as a filled epoxy Prepreg material. It has a glass
transition temperature of 170 degrees Celsius and a thermal
decomposition value of over 300 degrees Celsius at 5%. The Arlon
44N also possesses a water absorption value of 0.1 percent and a
Z-expansion value of 2.2%. It is compatible with orthodox epoxy
fabrication and lamination. Besides all these, it also meets the
IPC-4101/98 requirement.
Application:
It finds its application in filling clearance holes, especially in thin metal
cores.

 Arlon 45N. The multifunctional Prepreg and epoxy material has a
glass transition temperature of 175 degrees Celsius and a
Z-expansion value of 2.4%. It also has a thermal decomposition of at
5% of over 300 degrees Celsius besides a water absorption value of
0.1%. What’s more? It satisfies the IPC-4101/26 requirements and
can be processed under similar conditions as other FR-4
laminations.
Application:
It is ideal for application in high-layer count MLBs either as Prepreg or
lamination material.
Low Flow Products
It also comprises another vital category of Arlon PCB materials. So what
does it entail?
 Arlon 37N. It is a low flow polyimide Prepreg material with a Z-axis
expansion value of 2.3% and a glass transition temperature of 200
degrees Celsius. Additionally, the material possesses a thermal
decomposition value of 340 degrees Celsius and less than 1% water
absorption capacity. It meets the IPC-4101/42 requirement and
proves perfect for bonding multilayer rigid-flex PCB. Additionally, it
gets used in the attachment of heat sinks.

Application:
It finds its application in the military, space, aerospace, industrial, and
commercial PWB electronics.
 Arlon 38N. The second-generation low-flow Prepreg material has a
glass transition temperature of 200 degrees Celsius. Additional
attributes include a water absorption value of less than 1% and a
thermal decomposition value of 330 degrees Celsius.
Application:
Since it is designed to enhance the bond strength and adhesion of the low
flow resin system to the polyimide films, it has many applications. It
includes space, aerospace, military, industrial, and commercial PWB
electronics.
 Arlon 47N. It is a modified epoxy low flow resin material with a
glass transition temperature of 350 degrees Celsius. With a Z-axis
expansion value of 3.5% and a thermal decomposition value of 315
degrees Celsius, the low moisture absorption material (0.1)
becomes ideal for different applications. What’s more? It satisfies
the IPC-4101/21 requirement.
Application:

It is ideal to bond multilayer rigid-flex epoxy PCB, attaching the heat sinks
with the multilayer PCB besides the dielectric insulators. It especially
becomes crucial for military and commercial electronics.
 Arlon 49N. It is a multifunctional low-flow lead material with a glass
transition value of 170 degrees Celsius and thermal decomposition
of 303 degrees Celsius. Additionally, it has a Z-axis expansion of
3.1%, complete with a resin system possessing a water absorption
capacity of 0.1%, and meets the set IPC-4101/26 requirement.
Application:
It is ideal for rigid-flex PCB applications with high-layer count that also
demand high-temperature tolerance and high-performance expectation.
 Arlon 51N. The multifunctional and non-DICY resin comes as a
low-flow Prepreg system material with a glass transition
temperature of 170 degrees Celsius. It also possesses a water
absorption capacity of 0.15% and a Z-axis expansion value of 2.6%.
What’s more? The Arlon 51N satisfies the IPC-4101/126
requirement.
Application:

Perfect for use in the assembly and fabrication process of complex
rigid-flex printed circuit boards, especially when minimum resin flow is
crucial. It is also perfect for lead-free soldering processes.
SMT or Controlled Thermal Expansion
The last of the categories of Arlon materials prove equally important as
the other categories. It comprises the following resin materials.
 Arlon 45NK. The woven aramid-reinforced epoxy material has
a glass transition temperature of 170 degrees Celsius and a Z-axis
expansion value of 2.8%. It also possesses a water absorption
capacity of 0.8% and a thermal decomposition value of more than
300 degrees Celsius. Additionally, the material meets the
IPC-4101/50 (AFN) requirement for its various application.
Application
Arlon 5NK is ideal for compatibility with the LACCC (leadless alumina
ceramic chip carriers) and other low expansion SMT devices.
 Arlon 55NT. It is an epoxy non-woven aramid with a glass transition
temperature value of 170 degrees Celsius. Additionally, it has a
water absorption value of 0.3, a Z-axis expansion value of 3.5, and a

thermal decomposition of 368 degrees Celsius. What’s more? It
passes the IPC-4101/55 requirement. The system combines leadless
processing and compatibility, which makes it efficient and unique. It
is ideal for making light printed circuit boards.
Application:
Arlon 55NT resin system is ideal for PCBs used in aerospace and space
applications.
 Arlon 85NT. It comes as a pure polyimide resin system with a glass
transition temperature of 250 degrees Celsius both for the laminate
and the Prepreg systems. The material also possesses a water
absorption value of 0.6%, a thermal decomposition value of 426
degrees Celsius, and a Z-axis expansion value of 2.3%. What’s more?
It meets the HB UL-94 rating and IPC-4101/53 requirements. Finally,
it features X-Y CTE of 7-9 ppm/°C.
Application:
The polymeric reinforcement makes it ideal for light applications such as
in space and aerospace areas.
 Arlon 85N/CIC. The material comes as a polyimide clad resin system
complete with a CIC. It has a glass transition temperature of 250

degrees Celsius, a Z-axis expansion of 1.5%, and a thermal
decomposition value of 407 degrees Celsius. The material also
possesses a low water absorption value of 0.2% and satisfies the
IPC-4101/40/41 requirements.
It is also fundamental to note that you can get double treated and reverse
treated foils when you order. Further, you can get thin copper foils for
ultra-fine-line applications.
Arlon Microwave Products
Products under the Arlon microwave category are numerous. This section
will detail some of the subcategories and the products.
Arlon TC Product Family
 Arlon TC350
 Arlon TC600
Arlon CLTE Family of Products
 The CLTE-XT
 The CLTE-AT
 The CLTE
Next-Generation Arlon products: Materials with Lower Loss

 The AD255A
 The AD260A
 The AD300A
 The AD320A
PTFE and Micro-dispersed Ceramic (reinforcement with glass termed as
commercial grade)
 The AD350A
 The AD410
 The AD430
 The AD450
 The AD1000
Arlon Traditional Stuffs
 Products with a High PTFE to the Glass Ratio, Reinforced PTFE with
Woven Fiberglass exhibiting Lowest Loss – Unidirectional Plies
 The CuClad 250GT
 The CuClad 250GX
 The CuClad 233LX
 The CuClad 217LX
 Products with High PTFE to the Glass Ratio, Reinforced PTFE that is
Non-Woven exhibiting Lowest Loss

 The IsoClad 917
 The IsoClad 933
Ultra-Thin Arlon Laminates possessing Dielectric Constant that is higher
 The Arlon AD5
 The Arlon AD10
Ceramic Hydrocarbon Arlon Thermoset Prepreg and Laminates
 The Arlon 25N
 The Arlon 25FR
The Low Cost Arlon Legacy Laminates that are Commercial Based
 The Arlon CLTE-LC
 The Arlon AD250
 The AD255
 The Arlon AD270
 The AD320
 The Arlon AD350
 The Arlon AD600
 The AR1000
Films exhibiting Thermoplastic Bonding for Multilayer and Stripline
Packages

 The CuClad 6250
 The CuClad 6700
 The CLTE-P
Designing an Arlon Printed Circuit Board
The design process of an Arlon PCB follows a similar one as other
standard printed circuit boards. However, it becomes crucial to substitute
the materials with the ones from Arlon, as the functionality, stack-up
method, and schematic layout may remain similar. It is also crucial to
enlist the help of current circuit board design software to ensure the
design has the necessary details, proves executable, and will function once
the prototype comes out.
Manufacturing of Arlon PCB
The manufacturing process of an Arlon PCB follows a similar process to
that of other standard PCBs. It includes a design, prototyping,
and high-volume production of the printed circuit board. However, the
materials in your design have to get sourced from Arlon LLC. So it
becomes important to detail this in your BOM before submitting it to
the contract manufacturer.
FAQ Guide to Arlon Printed Circuit Boards

Picking suitable printed circuit board materials for the manufacture of
your circuit boards can prove difficult. However, this frequently asked
question guide will help you settle on the correct Arlon materials for your
high-performance PCB needs.
 How does the Arlon PCB material compare to its equivalents in the
circuit board industry?
PCBs rely on diverse materials for their fabrications. Materials can come
as Rogers, Nelco, Taconic, Isola, or Arlon materials.
 Arlon vs. Rogers PCB materials. While both get deployed to
manufacture high-frequency printed circuit boards, Arlon materials
prove mainly PTFT reinforced fiberglass while Rogers materials
feature woven glass reinforced ceramics or hydrocarbons.
 Arlon vs. Nelco PCB materials. Both materials deploy a polyimide
resin complete with a TG value of around 260 degrees Celsius.
Additionally, both materials can get deployed in PCBs targeted
at high-speed applications. However, most Arlon materials are light,
as aspects such as physical properties and thermal management
prove similar.
 Arlon vs. Taconic PCB material. Both of the materials depend on
PTFT strengthened with other different types of materials.

Consequently, you can deploy both in constructing high-frequency
printed circuit boards.
 Arlon vs. Isola materials. Both materials can come as epoxy
laminates, treated with fire-retardant compounds. Additionally,
both materials are ideal for high-temperature areas of
application.
 What benefits can you derive from using Arlon materials for your
printed circuit board?
Arlon materials have distinctive features that offer plenty of advantages
when deployed in the construction of PCBs. It includes the following.
 Uniform electrical properties on different frequencies
 Top chemical resistance
 Robust and consistent mechanical performance
 Low insertion loss
 Greater dimensional stability
 A higher efficiency when it comes to its antennas
 Suitable for ER-sensitive circuits
 Thermal stability of the dissipation factor and dielectric constant
 Limited waste on the edge trim
 Greater signal integrity
 Low moisture absorption

 A cost-effective board layout and processing process
 Perfect for deployment in humid conditions
 Low tangent loss
 Greater copper bond strength
 Can you consider Arlon materials high performance?
Yes. It is purely based on the classification standards and ability that
exceeds that of a standard FR-4 laminate. Additionally, the application
areas of an Arlon PCB also imply the high-performance tag of their
corresponding materials. For instance, its application in high thermal and
high-speed digital systems.
 What does the term Arlon laminate imply?
It refers to a composite of single or multiple layers of Prepreg and copper.
Final Thoughts
Arlon materials play an instrumental role in the manufacture or
production of Arlon PCBs. If you want to design an Arlon printed circuit
board, then note the types of Arlon materials, some design rules, and
understanding the production process becomes necessary. Additionally,
you also have to consider and select a top contract manufacturer.
Related Posts:

1. Where to buy Arlon 85N PCB
2. Arlon 35n properties and specification in PCB
3. What You Should Know About the Arlon 45NK PCB Material
4. How Arlon 44N PCB Material Impacts PCB’s Performance
https://www.raypcb.com/arlon-pcb/

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RAYMING PCB & ASSEMBLY

Arlon PCB Manufacturer

files to [email protected], We will quote you Very Soon!

Arlon PCB Manufacturing Service

manufacturer of specialty high performance laminate

board) applications. These applications typically require laminates with

specialized electrical, thermal, mechanical, or other performance

characteristic that exceed those of traditional standard FR-4 materials.

Arlon Electronic Substrates specializes in thermoset resin technology

including polyimide, high Tg multifunctional epoxy, and low loss

thermoset laminate and prepreg systems. These resin systems are

available on a variety of substrates including woven glass and non-woven

PCB Manufacturing & Assembly Services https://www.raypcb.com/

aramid. Typical applications for these materials include advanced

commercial and military electronics such as avionics, semiconductor

testing, heat sink bonding, High Density Interconnect (HDI)

and microvia PCB’s (i.e. in mobile communication products).

Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE),

ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon

thermoset laminates that deliver the electrical performance needed in

frequency-dependent circuit applications such as base station antennas,

phased array radars, power amplifier boards, communications systems,

and various other antenna applications. An exciting product is a lower loss

thermal expansion, highest phase stability, and lowest moisture

absorption of any product in its class.Request Arlon PCB Quote Now

Request Arlon PCB Manufacturing Quote Now

Arlon PCB Material available Part Number :

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Arlon Electronic Materials

Arlon Polyimide Products

Arlon 33N Kerimid 701 (VO) Polyimide

Arlon 35N Kerimid 701 (V1) Polyimide

Arlon 85N Polyimide – Unmodified

Arlon 84N Multifilm Hole-Fill Prepreg

Arlon 38N Low Flow Polyimide Prepreg

Arlon 37N Low-Flow vs. No-Flow Polyimide

Arlon HF-50 Polymide Hole Fill Compound

Arlon Epoxy Products

Arlon 44N “Multifilm” Hole-Fill Prepreg

Arlon 45N Multifunctional Epoxy

Arlon 47N Low-Flow Tetrafunctional Epoxy

Arlon 49N Low-Flow Multifunctional Prepreg

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Request Arlon PCB Manufacturing Quote Now

Arlon Legacy Thermount® Products

Arlon 51N Low-Flow Lead-Free

Arlon 55NT Multifunctional Epoxy/Thermount®

Arlon 85NT Polyimide/Thermount®

Arlon 55LM Low Moisture Regain Thermount®

Arlon 55ST Multifunctional Epoxy/Thermount®

Arlon Microwave Products

Arlon CLTE Product Family

Arlon TC Product Family

Arlon Next Generation of Lower Loss Materials, Available with PIM+

PTFE and Microdispersed Ceramic reinforced with Commercial Grade

Arlon Traditional Products – High PTFE to Glass Ratio, Lowest Loss

Woven Fiberglass Reinforced PTFE – Unidirectional Plies

Arlon CuClad 250GT

Arlon CuClad 250GX