New Developments and Applications in Scan Head Technology
New Developments and Applications in Scan Head Technology
New Developments and Applications in Scan Head Technology
Andreas Engelmayer
SCANLAB AG
Benzstrasse 28
82178 Puchheim, Germany
ABSTRACT
Galvanometer technology uses high-dynamic-performance rotating mirrors to move and position laser
beams – and thereby significantly speed-up laser processing in a wide variety of applications. This
paper examines the fundamentals of galvanometer-based scan head technology as well as a variety of
applications and their respective setups. We conclude with a look at novel setups for high-precision
manufacturing and welding scan systems using multi-kW lasers and robots.
DSP control boards, with on-board memory, function Besides marking and automotive applications, scan
as the hardware interface between the application systems find use in numerous other applications such
software, scan head and laser. These boards as high-precision material processing for the
synchronize laser control with the scanner electronics industry (discussed later), medical
movements and implement image correction to technology (Lasik eye surgery, OCT), and textile and
ensure that text is precisely positioned without pin- leather processing (cutting, marking or creating
cushion distortion and marked at a constant speed “distressed” effects).
along each vector. Third-party software packages are
available for many standard laser marking
applications (Figure 3).
Laser Scan Head Focal Focus Image Field Scan Speed Application
Aperture Length
CO2 36/33 mm 550 mm 350 µm 0.3 x 0.3 m2 5.0 m/s cutting Cutting
10.6 µm (40 mm at speed
M2 = 1.15 focusing
1–2 kW optics)
Table 1: Overview of typical scan systems and applications. Photos © Sator Laser GmbH, NWL Laser Technologie
GmbH, LasX Industries, Inc., BMW Group, Laservall S.p.A., Vitro Laser GmbH, Trumpf Inc. Laser Technology
Center, Potomac Photonics, Inc.
SCAN SYSTEM FOR MICROMACHINING
The trend toward better, smaller, lighter and lower-
priced products, e.g. cell phones, is in part made
possible by laser-based manufacturing processes.
Typical applications include drilling, cutting,
structuring and material removal on components
such as circuit boards, silicon, ceramics, III-V
compounds, ITO coatings, Mylar and Kapton (see
Figure 6). The structural dimensions involved
generally range from ten to more than a hundred
micrometers. The beam sources employed are often
UV lasers such as frequency-tripled Nd:YVO4 lasers.
Thanks to their beam-positioning performance, Figure 5: Laser micromachining with scan
galvanometer-based scan systems, either alone or in systems. Top: 3D Teflon web for fluidic systems
conjunction with XY tables, offer numerous (© Lumera Laser GmbH) and 15-µm HDIs
advantages: manufactured with “mill-and-fill” technology
(© Potomac Photonics, Inc.). Bottom: Kapton
• High processing speeds processing and micro vias in copper/dielectric
• Optimized processing strategies (© Photomachining, Inc.).
• Minimal thermal loading of work pieces through The achievable static precision of a conventionally
heat transfer calibrated scan system is determined by the sum of its
gain, offset and orthogonality errors, nonlinearities
• Ability to process complex geometries and tolerances of the employed optics. With a
Scan system selection is determined primarily by precisely aligned laser, this is on the order of a few
image field requirements, focus size, processing tens of micrometers. To achieve yet higher precision
speed and precision. A typical scan system for micro requires more sophisticated scan system calibration
materials processing is equipped with a 10-mm (see Figure 6).
aperture and designed for a wavelength of 355 nm.
Such a scan system, with a telecentric objective of
100 mm focal length, can achieve a focus diameter of
less than 10 µm in an image field with 50-mm sides.
Obtainable processing speeds are governed by the
scan system’s dynamic performance and are typically
several hundred millimeters per second for
micromachining.
Achievable precision is determined by static and
dynamic repeatability as well as controller resolution.
Dynamic repeatability – the scan system’s ability to
travel a straight line to the target position without
oscillation or noise – is described by its wobble, jitter
and dither values. Wobble and jitter are mechanical
oscillations of the mirror perpendicular or parallel to
the scan direction. Dither is imprecision introduced by
residual noise of the scanner electronics. This effect is
usually only a factor when processing with lasers of
short wavelength and good beam quality and
therefore plays no role in most conventional
applications. For micromachining, specially optimized Figure 6: Software for precisely calibrating scan
scan systems are available with tracking accuracy to systems.
within just a few micrometers.
Without correction, scan system drift over eight hours
can reach up to 60 µm with the scan system
described above. Drift can be minimized by thermally Camera systems through the scan head are primarily
stabilizing the electronics and motor unit (Figure 7). employed for ascertaining the exact orientations and
For even higher precision, scan systems can be geometries of work pieces to be processed and
equipped with a supplemental high-precision position facilitate control of subsequent processing. Figure 9
detector that enables automatic self-calibration to illustrates the setup. This method requires neither
compensate for thermal and long term drift. tight component tolerances nor precise positioning
and works well with a near-IR or visible laser source.
The special optics required for UV processing often
prohibit use of a vision system through the scan
head.
Laser scanning systems are the ideal laser beam [8] B. Gu, “Laser-Micro-Machining in Semiconductor
positioning tool in many industrial applications. They and Electronics Industries”, ALAC 2004
enable the throughputs necessary for competitive Proceedings
manufacturing and material-saving – thanks to very
high scanning and positioning speeds. Combining [9] M. Li and H. Endert, “Microfabrication Using
scan heads with other handling systems, such as Diode-Pumped Solid-State Lasers”, ALAC 2004
robots, will offer benefits not available through the Proceedings
use of scan systems alone.