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    8 Bonding

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    Gavino Tabuzo

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    © All Rights Reserved
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    8 Bonding

    Uploaded by

    Gavino Tabuzo
    80 views34 pages

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    8-bonding

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    Copyright:

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    80 views34 pages

    8 Bonding

    Uploaded by

    Gavino Tabuzo

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    © All Rights Reserved
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    Bicsi Chapter 8 Bonding and Grounding (Earthing) Chapter 8 includes requirements, methods, and practices for establishing the telecommunications bonding infrastructire. For information on bonding and grounding (earthing) of OSP infrastructure, see Chapter 12: Outside Plant snd the BICSL OSPDRM. ‘chapter 8: Boning and Grounding (Earthing) Table of Contents Bonding and Grounding (Earthing).....-+-+200005 28-1 Introduction... « ese ned Safety a2 Planning ‘ Beene) Equipment Manufacturer's Warranty PTS. BS ‘Assignment of Responsibilities abe coors. O-3 Components Se TA. 84 Alternating Current (ac) Grounding (Earthing) Electrode System... . 8-5 Overview we 8S Purpose. ci 8S ‘Alternating Current (3c) Grounding (Earthng) Electrode System Components... 8-5 Important Items for Information and Communications Technology (ICT) Distribution Designers to Consider 86 Recommended Testing Procedures and Criteria 87 True Root Mean Square (rms) Aternating Current (ac) Measurements end Direct Current (de) Measurements. Two-Point Bonding Measurements . Equipment Grounding (Earthing) System. Overview Equlpment Grounding (Earthing) System Components Impedance ofthe Equipment Grounding (Earthing) System ‘Measuring the Equipment Grounding (Earthing) Conductor Impedance. Isolated Ground (IG) - a 810 ‘Supplementary Bonding Grid (SBG) oe 8410 Telecommunications Bonding Infrastructure. Overview be 12 Criteria an Bonding System Practices . au ‘Small Systems See os Large Systems enneennnrnns eas Entrance Fecity (EF). expe 17 Primary Bonding Busbar (PBB) a7 Placement ofthe Primary Bonding Busbar (PBB) 17 Bonding tothe Aterating Current (2c) Grounding (artn9) Electrode System. = 17 [Adational Bonding Connections tothe Primary Bording Busbar (BE 18 ‘Chapter 8: Bonding and Grounding (Earthng) Equipment Room (ER) a 18 Equipment Room (ER) Secondary Sanding Busbar (S88) ss Referencing the Equipment Room (ER) Secondary Bonding Busbar (SB)... . 8-19 ‘elecommunications Room (TR) a9 Telecommunications Room (TR) Secondary Bonding Busbar (SEB)... ...... 819 feferencng te Teeconmuniations Room (TR) Secondary Boing Busbar (588)... eevee B19 Telacommunicatons Bonding Backbone (TB) ceeess B19 Backbone Bonding Conductor (BBC)... .-.- te. 820 Sizing of Bonding Conductors... 7 se 820 LUmiatons of Bonding Conductor Calculation tees 822 {Quick Determination of Bonding Conductor Size 822 Bonding Connections. 822 Inspection of Telecommunications Bonding Connections 823 Testing the Integnty of Telecommunications Bonding Connections 823 Equipment Rack Bonding and Grounding (Earthing) Cable Tray Bonding aaa Lightning Exposure... ‘Overview National Fire Protection Association (NFPA) Standard 780 226 Extended Zone of Protection 2828 TORN, Faweaiion CT ‘chapter 8: Bonding and Grounding (Erthing) Figures Figure 8.1 Typical supplementary bonding grid... a Figure 8.2 Small systems - a Figure 8.3 Recommended large system arrangement . Figure 8.4 Typical PBB... Reena td Figure 8.5 Typical SBB . ... coe Figure 8.6 Equipment rack bonding and grounding (earthing) Figure 8.7 Zone of protection... . Figure 8.8 Cone of protection, Figure 8.9 Extending zone of protection Tables Table 8.1 Telecommunications bonding component terns cross-reference 82 Table 8.2 Basic guide to calculating bonding conductor resistance values. 8-21 ‘chapter 8: Bonding and Grounding (Eating) jonding and Grounding (Earthing) Introduction Distinct diferences exit between the terms bonding md grounding. Generally speaking, ‘rounding (earthing is the eatablishment of reference forthe eestrial power source (ac ford) the elecca eguipmen, or oth, Boning isthe connection intended safely and ‘Mfetvely equalize the potent dflerences between two metallic ems (eg, an SBD and a ‘metalic cable tay) The bonding and grounding (earthing) infastructure ca telecommunication installation is an essential part ofan ICT distribution designer's responsibilities. This chapter provides some background information, design considerations, and sting verification pred hat can hop the ICT distribution designer make logical, technically sound chowes when confronted ‘witha Vari of tlecommunicatons equipment or eeeommunications cabling installations. ‘The references to coves, standards, metho, and best practices used inthis chapter are dived fom documents suchas ANSUBICSIN3, Planning and Intalation Methods for the ‘Bonding an Grownding of Telecommanication and ICT Stems and Infasracare, ANSITIA-607, ISO/IEC 30129, NFPA 70, NFPA 7, and publications hy TEEE®, Adina standards related to bonding and grounding (curthing)may be fund inthe Appendix A of this manual IMPORTANT: Regions and counties have loa and pete requirements relating to bonding and grounding (earthing) that ier from the contents ofthis chapter ‘The information in ths chapter is based on the existing references, Special stations (8, ‘alts, electrical powerplant faites, shielded rooms are not specifically addressed in this chapter Public uty companies eg. tlephone companies, power companies) ae responsil forthe grounding earthing) and lightning protection oftheir service EFS Every effort has been made to ensure that these reconmendatins are technically accurate and provide the necessary ste and personne safety. However, local conitons may Fequie addtional pofesional investigations, meations, or safeguard to mest specific requirement fo the: * Life, property, and equipment safety. + Region “The information in his chapter doesnot replace inteational, federal, stat, local, rote plicable codes, laws, oregulaions.Speific applications may contain variables that ae ‘beyond the contol or the sape ofthis manual. Taking this nto consideration, the application ‘ofthis information cannot guarantee the desired echnical results IMPORTANT: All design and construction for bondirg and grounding (cating) must meet or exceed applicable codes, standard, regulations and AHI rulings ‘Saeco ‘Chapter 8: Bonding and Grounding (Lrthing) Introduction, continued Table 8.1 ‘With he publication of ANSUTTA-607 and ISOMTEC 30129 in 2015, new terms and acronyms for telecommunicatons bonding components were adoptc. Table &1 provides across reference between the new terms and acronyms and the previous ones. The new teams and aeronyms ar used throughout this chapter. Terms and eronyms not inthe table were ‘inching, ‘Telecammuncatons bonding component terms cross-reference prvi eal Grounding squin (GE) Bacto bang ond OBC) Teecmmunictns msn grounding aibr Primary bonding basta (PBB) cmc) Rak pounding babar (ROB) Rack toning ar RB) ‘eases psig bbe (108) Sorin bean uber (SEB) pSeies Gee pene ee secre aa kag cia wc cme A primary responsitliy ofthe ICT distribution designe safeguarding personnel, rope, and equipment om foreign electrical vltages and curtens. (Foreign refers to eleciial ‘Voltage o currents tht normaly are not cared by or expected inthe tlecommnications Aisctaton systems) “The rests of such disturbances could bs + Death or injury de to electrical shock. + Destruction of electronic equipment and propety due to erica. ‘+ Component malfunction or degradation, + Work or proces disruption “The ICT distribution designer must consider: + Lightning. + PR. + Contact with clctricl power crus. EM. RFI EMC. Chapter 8: Bonding ané Grounding (earthing) Safety, continued Planning ‘The increasing customer requests for personnel and ccuient moves andthe use of newer, more sensitiv, integrated electronic equipment now dictate an environment where electrical protection must bea top pony ICT distribution designers ae not responsible for engineering the portion ofthe electrical system rated oa electrical ground faults, ai trmialightsing protection systems (6. lightning ros), or surge protectin. However, CT distribution designers must be familiar with the basic components and functionalities ofthese systems and be abe 10 provide the ertial information for ther design scheme to ICT installers “The best time to design a bonding grounding (cating), and protection scheme for structre i during the intial planning and constrston phases ofa project The ICT Aisrbution designer should work with the architest and elect engineer to plan out the {elecommuncations bonding infastuctre. ‘The advantages of having system components planed designed, and bili ram the begining ae: + Beter acces to he installation areas, + System component protection from mechani + Improved aeshtis gained by concealment + Lower coat I isp acement and environmental effets In many cases, however, ICT dsributon designers mis incorporate fective bonding and rounding (earthing) arstepes fra building or sractre that has bee in ple for yar. Equipment Manufacturer's Warranty “The ICT distribution designer mst become familie withthe equipment manuictre's requirement for equipment bonding and grounding (carthing) A faulty bonding and grounding (earthing) design may result in damage to expensive equipment and the voiding of ‘the manufacturer's warranty. I the ICT disribtion designer nds confit btweun a local safety coe, BICSI guidelines, an the manufacturer's requiements, the confit shouldbe resolved wih the AHI before proceeding. Assignment of Responsibilities Several distint systems provide diferent, bt complenentry, protection capabilities, The ICT distin designer should ensre that esposibiiies foreach protection som ae established, Ifthe customer has not yet insted specific protection ste, the ICT ‘istbuton designer Should note it and ecommend a uable protection wheter is part ofthe bi or handled by other professionals. Telecommuaications protection en be severely ‘compromised without a coordinated effort among the rarious protection stem designers. aes aon ‘Chapter 8: Bonding and Grounding (Larthing) Components ‘The ICT distribution designer typically is responsible fore elecommunications bonding and grounding (eating) andthe elecommunications cteit protectors. Although the ICT disibation designer usually i not respesible for the other sysems, ‘working in a building without ecopnizing and understanding the purpose af the oer Stems isnot safe. A clear understanding a these systems provides a ass for Tuer training and collborating with specialists i necessary ‘The ICT distribution designer must recognize that the following three substems constating ‘he bonding and grounding (earthing) system should bein place at ever site + ae grounding (carting letrode system (also known asthe carting system in some ‘countries uipment rounding (earthing) system (aso known ashe equipment bonding system in some counties) + Telesommunicatons bonding infasrstre ‘Because the purpose of each ofthese subsystem i unique, one cant be sein place af the ‘other two. The installation requirements, improvement mebods, and test methods ofthe thnce ‘systems also vary greatly Alternating Current (ac) Grounding (Eart ‘Chapter 8: Bonding and Grounding (arthing) 19) Electrode System Overview Purpose ‘The ICT sribuion designer may bave no auority over the ae grounding (earthing)

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