tl16c752b Ep
tl16c752b Ep
tl16c752b Ep
1FEATURES
• Controlled Baseline • Fast Access Time 2 Clock Cycle IOR/IOW
– One Assembly Site Pulse Width
– Test Site • Programmable Sleep Mode
– One Fabrication Site • Programmable Serial Interface Characteristics
• Extended Temperature Performance of – 5-Bit, 6-Bit, 7-Bit, or 8-Bit Characters
–55°C to 110°C and –40°C to 105°C – Even, Odd, or No Parity Bit Generation and
• Enhanced Diminishing Manufacturing Sources Detection
(DMS) Support – 1, 1.5, or 2 Stop Bit Generation
• Enhanced Product Change Notification • False Start Bit Detection
• Qualification Pedigree (1) • Complete Status Reporting Capabilities in
• Pin Compatible With ST16C2550 With Both Normal and Sleep Mode
Additional Enhancements • Line Break Generation and Detection
• Up to 1.5-Mbps Baud Rate When Using Crystal • Internal Test and Loopback Capabilities
(24-MHz Input Clock) • Fully Prioritized Interrupt System Controls
• Up to 3-Mbps Baud Rate When Using • Modem Control Functions (CTS, RTS, DSR,
Oscillator or Clock Source (48-MHz Input DTR, RI, and CD)
Clock)
• 64-Byte Transmit FIFO
PACKAGE
• 64-Byte Receive FIFO With Error Flags (TOP VIEW)
• Programmable and Selectable Transmit and
TXRDYA
Receive FIFO Trigger Levels for DMA and
DSRA
CTSA
CDA
VCC
RIA
Interrupt Generation
NC
D4
D3
D2
D1
D0
GND
CDB
DSRB
NC
IOW
CTSB
RTSB
IOR
RIB
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TL16C752B-EP
SGLS153B – FEBRUARY 2003 – REVISED DECEMBER 2007 www.ti.com
DESCRIPTION/ORDERING INFORMATION
The TL16C752B is a dual-universal asynchronous receiver/transmitter (UART) with 64-byte FIFOs, automatic
hardware/software flow control, and data rates up to 3 Mbps. The TL16C752B offers enhanced features. It has a
transmission control register (TCR) that stores receiver FIFO threshold levels to start/stop transmission during
hardware and software flow control. With the FIFO RDY register, the software gets the status of TXRDY/RXRDY
for all four ports in one access. On-chip status registers provide the user with error indications, operational
status, and modem interface control. System interrupts may be tailored to meet user requirements. An internal
loopback capability allows onboard diagnostics.The UART transmits data, sent to it over the peripheral 8-bit bus,
on the TX signal and receives characters on the RX signal. Characters can be programmed to be 5, 6, 7, or 8
bits. The UART has a 64-byte receive FIFO and transmit FIFO and can be programmed to interrupt at different
trigger levels. The UART generates its own desired baud rate based upon a programmable divisor and its input
clock. It can transmit even, odd, or no parity and 1, 1.5, or 2 stop bits. The receiver can detect break, idle, or
framing errors, FIFO overflow, and parity errors. The transmitter can detect FIFO underflow. The UART also
contains a software interface for modem control operations, and has software flow control and hardware flow
control capabilities.
The TL16C752B is available in a 48-pin PT (LQFP) package.
(1) For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI Web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
A0 28 I Address 0 select bit. Internal registers address selection.
A1 27 I Address 1 select bit. Internal registers address selection.
A2 26 I Address 2 select bit. Internal registers address selection.
Carrier detect (active low). These inputs are associated with individual UART channels A and B. A low
CDA, 40,
I on these pins indicates that a carrier has been detected by the modem for that channel. The state of
CDB 16
these inputs is reflected in the modem status register (MSR).
Chip select A and B (active low). These pins enable data transfers between the user CPU and the
CSA, 10,
I TL16C752B for the channel(s) addressed. Individual UART sections (A, B) are addressed by providing
CSB 11
a low on the respective CSA and CSB pins.
Clear to send (active low). These inputs are associated with individual UART channels A and B. A
logic low on the CTS pins indicates the modem or data set is ready to accept transmit data from the
CTSA, 38,
I TL16C752B. Status can be tested by reading MSR bit 4. These pins only affect the transmit and
CTSB 23
receive operations when auto CTS function is enabled through the enhanced feature register (EFR) bit
7, for hardware flow control operation.
Data bus (bidirectional). These pins are the eight bit, 3-state data bus for transferring information to or
D0–D4 44–48,
I/O from the controlling CPU. D0 is the least significant bit and the first data bit in a transmit or receive
D5–D7 1–3
serial data stream.
Data set ready (active low). These inputs are associated with individual UART channels A and B. A
DSRA, 39,
I logic low on these pins indicates the modem or data set is powered on and is ready for data exchange
DSRB 20
with the UART. The state of these inputs is reflected in the modem status register (MSR).
Data terminal ready (active low). These outputs are associated with individual UART channels A and
DTRA, 34, B. A logic low on these pins indicates that the TL16C752B is powered on and ready. These pins can
O
DTRB 35 be controlled through the modem control register. Writing a 1 to MCR bit 0 sets the DTR output to low,
enabling the modem. The output of these pins is high after writing a 0 to MCR bit 0, or after a reset.
GND 17 Pwr Signal and power ground
Interrupt A and B (active high). These pins provide individual channel interrupts, INT A and B. INT A
and B are enabled when MCR bit 3 is set to a logic 1, interrupt sources are enabled in the interrupt
INTA, 30,
O enable register (IER). Interrupt conditions include: receiver errors, available receiver buffer data,
INTB 29
available transmit buffer space or when a modem status flag is detected. INTA-B are in the high-
impedance state after reset.
Read input (active low strobe). A high-to-low transition on IOR loads the contents of an internal register
IOR 19 I
defined by address bits A0–A2 onto the TL16C752B data bus (D0–D7) for access by an external CPU.
Write input (active low strobe). A low-to-high transition on IOW transfers the contents of the data bus
IOW 15 I (D0–D7) from the external CPU to an internal register that is defined by address bits A0–A2 and CSA
and CSB.
User-defined outputs. This function is associated with individual channels A and B. The state of these
pins is defined by the user through the software settings of the MCR register, bit 3. INTA-B are set to
OPA, 32,
O active mode and OP to a logic 0 when the MCR-3 is set to a logic 1. INTA-B are set to the 3-state
OPB 9
mode and OP to a logic 1 when MCR-3 is set to a logic 0. See bit 3, modem control register (MCR bit
3). The output of these two pins is high after reset.
Reset. RESET resets the internal registers and all the outputs. The UART transmitter output and the
RESET 36 I receiver input is disabled during reset time. See TL16C752B external reset conditions for initialization
details. RESET is an active-high input.
Ring indicator (active low). These inputs are associated with individual UART channels A and B. A
RIA, 41, logic low on these pins indicates the modem has received a ringing signal from the telephone line. A
I
RIB 21 low-to-high transition on these input pins generates a modem status interrupt, if enabled. The state of
these inputs is reflected in the modem status register (MSR).
Request to send (active low). These outputs are associated with individual UART channels A and B. A
low on the RTS pin indicates the transmitter has data ready and waiting to send. Writing a 1 in the
RTSA, 33, modem control register (MCR bit 1) sets these pins to low, indicating data is available. After a reset,
O
RTSB 22 these pins are set to high. These pins only affect the transmit and receive operation when auto RTS
function is enabled through the enhanced feature register (EFR) bit 6, for hardware flow control
operation.
Receive data input. These inputs are associated with individual serial channel data to the TL16C752B.
RXA, 5,
I During the local loopback mode, these RX input pins are disabled and TX data is internally connected
RXB 4
to the UART RX input internally.
RXRDYA, 31, Receive ready (active low). RXRDY A and B goes low when the trigger level has been reached or a
O
RXRDYB 18 timeout interrupt occurs. They go high when the RX FIFO is empty or there is an error in RX FIFO.
Control Signals
Control Signals
Baud Rate
Generator
Status Signals
UART_CLK
RX
TX
Transmitter FIFO Transmitter Block
TX
64-Byte Logic
A. The vote logic determines whether the RX data is a logic 1 or 0. It takes three samples of the RX line and uses a
majority vote to determine the logic level received. The vote logic operates on all bits received.
FUNCTIONAL DESCRIPTION
The TL16C752B UART is pin-compatible with the ST16C2550 UART. It provides more enhanced features. All
additional features are provided through a special enhanced feature register.
The UART performs a serial-to-parallel conversion on data characters received from peripheral devices or
modems and parallel-to-parallel conversion on data characters transmitted by the processor. The complete
status of each channel of the TL16C752B UART can be read at any time during functional operation by the
processor.
The TL16C752B can be placed in an alternate mode (FIFO mode) relieving the processor of excessive software
overhead by buffering received/transmitted characters. Both the receiver and transmitter FIFOs can store up to
64 bytes (including three additional bits of error status per byte for the receiver FIFO) and have selectable or
programmable trigger levels. Primary outputs RXRDY and TXRDY allow signalling of DMA transfers.
The TL16C752B has selectable hardware flow control and software flow control. Hardware flow control
significantly reduces software overhead and increases system efficiency by automatically controlling serial data
flow using the RTS output and CTS input signals. Software flow control automatically controls data flow by using
programmable Xon/Xoff characters.
The UART includes a programmable baud rate generator that can divide the timing reference clock input by a
divisor between 1 and (216–1).
Trigger Levels
The TL16C752B provides independent selectable and programmable trigger levels for both receiver and
transmitter DMA and interrupt generation. After reset, both transmitter and receiver FIFOs are disabled and so, in
effect, the trigger level is the default value of one byte. The selectable trigger levels are available via the FCR.
The programmable trigger levels are available via the TLR.
Auto-RTS
Auto-RTS data flow control originates in the receiver block (see functional block diagram). Figure 1 shows RTS
functional timing. The receiver FIFO trigger levels used in auto-RTS are stored in the TCR. RTS is active if the
RX FIFO level is below the halt trigger level in TCR[3:0]. When the receiver FIFO halt trigger level is reached,
RTS is deasserted. The sending device (e.g., another UART) may send an additional byte after the trigger level
is reached (assuming the sending UART has another byte to send), because it may not recognize the
deassertion of RTS until it has begun sending the additional byte. RTS is automatically reasserted once the
receiver FIFO reaches the resume trigger level programmed via TCR[7:4]. This reassertion allows the sending
device to resume transmission.
RTS
IOR
1 2 N N+1
Auto-CTS
The transmitter circuitry checks CTS before sending the next data byte. When CTS is active, the transmitter
sends the next byte. To stop the transmitter from sending the following byte. CTS must be deasserted before the
middle of the last stop bit that is currently being sent. The auto-CTS function reduces interrupts to the host
system. When flow control is enabled, the CTS state changes and need not trigger host interrupts because the
device automatically controls its own transmitter. Without auto-CTS, the transmitter sends any data present in the
transmit FIFO and a receiver overrun error can result. Figure 2 shows CTS functional timing, and Figure 3
shows an example of autoflow control.
CTS
A. When CTS is low, the transmitter keeps sending serial data out
B. When CTS goes high before the middle of the last stop bit of the current byte, the transmitter finishes sending the
current byte but it does not send the next byte.
C. When CTS goes from high to low, the transmitter begins sending data again.
UART 1 UART 2
Serial to RX TX Parallel to
Parallel Serial
RX TX
FIFO FIFO
Flow RTS CTS Flow
Control Control
D7−D0 D7−D0
Parallel to TX RX Serial to
Serial Parallel
TX RX
FIFO FIFO
Flow CTS RTS Flow
Control Control
NOTE
It is possible that an Xon1 character is recognized as an Xon Any character which could
cause an Xon2 character to be written to the RX FIFO.
• Special Character [EFR(5)]: Incoming data is compared to Xoff2. Detection of the special character sets the
Xoff interrupt [IIR(4)] but does not halt transmission. The Xoff interrupt is cleared by a read of the IIR. The
special character is transferred to the RX FIFO.
RX
When software flow control operation is enabled, the TL16C752B compares incoming data with Xoff1/2
programmed characters (in certain cases Xoff1 and Xoff2 must be received sequentially (1)). When the correct
Xoff characters are received, transmission is halted after completing transmission of the current character. Xoff
detection also sets IIR[4] (if enabled via IER[5]) and causes INT to go high.
To resume transmission an Xon1/2 character must be received (in certain cases Xon1 and Xon2 must be
received sequentially). When the correct Xon characters are received IIR[4] is cleared and the Xoff interrupt
disappears.
NOTE
If a parity, framing, or break error occurs while receiving a software flow control character,
this character is treated as normal data and is written to the RCV FIFO.
TX
Xoff1/2 characters are transmitted when the RX FIFO has passed the HALT trigger level programmed in
TCR[3:0].
Xon1/2 characters are transmitted when the RX FIFO reaches the RESUME trigger level programmed in
TCR[7:4].
An important note here is that if, after an xoff character has been sent and software flow control is disabled, the
UART transmits Xon characters automatically to enable normal transmission to proceed. A feature of the
TL16C752B UART design is that if the software flow combination (EFR[3:0]) changes after an Xoff has been
sent, the originally programmed Xon is automatically sent. If the RX FIFO is still above the trigger level, the newly
programmed Xoff1/2 is transmitted.
The transmission of Xoff/Xon(s) follows the exact same protocol as transmission of an ordinary byte from the
FIFO. This means that even if the word length is set to be 5, 6, or 7 characters then the 5, 6, or 7 least significant
bits of Xoff1,2/Xon1,2 is transmitted. (Note that the transmission of 5, 6, or 7 bits of a character is seldom done,
but this functionality is included to maintain compatibility with earlier designs.)
It is assumed that software flow control and hardware flow control are never enabled simultaneously. Figure 4
shows an example of software flow control.
(1) When pairs of Xon/Xoff characters are programmed to occur sequentially, received Xon1/Xoff1 characters must be written to the Rx
FIFO if the subsequent character is not Xon2/Xoff2.
8 Submit Documentation Feedback Copyright © 2003–2007, Texas Instruments Incorporated
UART 1 UART 2
Transmit Receive
FIFO FIFO
Data
Parallel to Serial Serial to Parallel
Compare
Xoff-1 Word Programmed Xoff-2 Word
Xon−Xoff
Characters
Reset
Table 2 summarizes the state of registers after reset.
(1) Registers DLL, DLH, SPR, Xon1, Xon2, Xoff1, Xoff2 are not reset by the top-level reset signal RESET,
i.e., they hold their initialization values during reset.
Interrupts
The TL16C752B has interrupt generation and prioritization (6 prioritized levels of interrupts) capability. The
interrupt enable register (IER) enables each of the 6 types of interrupts and the INT signal in response to an
interrupt generation. The IER can also disable the interrupt system by clearing bits 0–3, 5–7. When an interrupt
is generated, the IIR indicates that an interrupt is pending and provides the type of interrupt through IIR[5–0].
Table 4 summarizes the interrupt control functions.
It is important to note that for the framing error, parity error, and break conditions, LSR[7] generates the interrupt.
LSR[7] is set when there is an error anywhere in the RX FIFO and is cleared only when there are no more errors
remaining in the FIFO. LSR[4–2] always represent the error status for the received character at the top of the RX
FIFO. Reading the RX FIFO updates LSR[4–2] to the appropriate status for the new character at the top of the
FIFO. If the RX FIFO is empty, then LSR[4–2] are all zeros.
For the Xoff interrupt, if an Xoff flow character detection caused the interrupt, the interrupt is cleared by an Xon
flow character detection. If a special character detection caused the interrupt, the interrupt is cleared by a read of
the LSR
IER
IOW/IOR
Processor INT 1 1 1 1
IIR
THR RHR
LSR
IOW/IOR
Processor
IER
0 0 0 0
THR RHR
DMA Signalling
There are two modes of DMA operation: DMA mode 0 or 1, selected by FCR[3].
In DMA mode 0 or FIFO disable (FCR[0]=0) DMA occurs in single character transfers. In DMA mode 1 multi-
character (or block) DMA transfers are managed to relieve the processor for longer periods of time.
TX RX
TXRDY RXRDY
TXRDY RXRDY
TX RX
wrptr Trigger
Level
TXRDY RXRDY
rdptr
Trigger
Level
TXRDY RXRDY
wrptr
FIFO Empty
rdptr
Sleep Mode
Sleep mode is an enhanced feature of the TL16C752B UART. It is enabled when EFR[4], the enhanced
functions bit, is set AND when IER[4] is set. Sleep mode is entered when:
• The serial data input line, RX, is idle (see break and time-out conditions).
• The TX FIFO and TX shift register are empty.
• There are no interrupts pending except THR and time-out interrupts.
NOTE
Sleep mode is not entered if there is data in the RX FIFO.
In sleep mode the UART clock and baud rate clock are stopped. Since most registers are clocked using these
clocks, the power consumption is greatly reduced. The UART wakes up when any change is detected on the RX
line, when there is any change in the state of the modem input pins, or if data is written to the TX FIFO.
NOTE
: Writing to the divisor latches, DLL and DLH, to set the baud clock, must not be done
during sleep mode. Therefore it is advisable to disable sleep mode using IER[4] before
writing to DLL or DLH.
NOTE
The default value of prescaler after reset is divide-by-1.
Figure 9 shows the internal prescaler and baud rate generator circuitry.
DLL and DLH must be written to in order to program the baud rate. DLL and DLH are the least significant and
most significant byte of the baud rate divisor. If DLL and DLH value are both zero, the UART is effectively
disabled, as no baud clock is generated.
NOTE
The programmable baud rate generator is provided to select both the transmit and receive
clock rates.
Table 5 and Table 6 show the baud rate and divisor correlation for crystal with frequency 1.8432 MHz and 3.072
MHz respectively.
Figure 10 shows the crystal clock circuit reference.
VCC VCC
Driver
External XTAL1 XTAL1
Clock
C1
Crystal
RP
Optional
Driver
Optional XTAL2 Oscillator Clock RX2 Oscillator Clock
Clock to Baud Generator to Baud Generator
Output Logic XTAL2 Logic
C2
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
(1) Meets TTL levels, VIO(min) = 2 V and VIH(max) = 0.8 V on nonhysteresis inputs.
(2) Applies for external output buffers.
(3) These parameters apply for D7–D0.
(4) These parameters apply for DTRA, DTRB, INIA, INTB, RTSA, RTSB, RXRDYA, RXRDYB, TXRDYA, TXRDYB, TXA, TXB.
(5) These junction temperatures reflect simulated conditions. Absolute maximum junction temperature is 150°C. The customer is
responsible for verifying junction temperature.
(6) The internal oscillator cell can only support up to 24 MHz clock frequency to make the crystal oscillating when crystal is used. If external
oscillator or other on board clock source is used, the TL16C752B can work for input clock frequency up to 48 MHz.
(7) Measurement condition:
(a) Normal operation other than sleep mode: VCC = 3.3 V, TA = 25°C. Full duplex serial activity on all serial (UART) channels at the
clock frequency specified in the recommended operating conditions with divisor of one.
(b) Sleep mode: VCC = 3.3 V, TA = 25°C. After enabling the sleep mode for all four channels, all serial and host activity is kept idle.
TIMING REQUIREMENTS
TA = –55°C to 110°C (L device) , –40°C to 105°C (T device) VCC = 3.3 V + 10% (unless otherwise noted) (see Figures 12
through Figure 19)
PARAMETER TEST CONDITIONS MIN MAX UNIT
td1 IOR delay from chip select 0 ns
(1)
td2 Read cycle delay 2tp(I) ns
td3 Delay from IOR to data 28.5 ns
td4 Data disable time 15 ns
td5 IOW delay from chip select 10 ns
(1)
td6 Write cycle delay 100-pF load 2tp(I) ns
td7 Delay from IOW to output 100-pF load 50 ns
td8 Delay to set interrupt from MODEM input 100-pF load 70 ns
td9 Delay to reset interrupt from IOR 70 ns
td10 Delay from stop to set interrupt 100-pF load 1Rclk
(2)
td11 Delay from IOR to reset interrupt 70 ns
td12 Delay from stop to interrupt 100 ns
(2)
td13 Delay from initial INT reset to transmit start 8 24
td14 Delay from IOW to reset interrupt 70 ns
td15 Delay from stop to set RXRDY 1 Clock
td16 Delay from IOR to reset RXRDY 1 μm
td17 Delay from IOW to set TXRDY 70 ns
(2)
td18 Delay from start to reset TXRDY 16
(1) (2)
td19 Delay between successive assertion of IOW and IOR 4P
th1 Chip select hold time from IOR 0 ns
th2 Chip select hold time from IOW 0 ns
th3 Data hold time 15 ns
th4 Address hold time 0 ns
th5 Hold time from XTAL1 clock↓ to IOW or IOR release 20 ns
tp1, tp2 Clock cycle period 20 ns
tp3 Oscillator/clock speed VCC = 3 V 48 MHz
t(RESET) Reset pulse width 200 ns
tsu1 Address setup time 0 ns
tsu2 Data setup time 16 ns
tsu3 Setup time from IOW or IOR assertion to XTAL1 clock↑ 20 ns
(1)
tw1 IOR strobe width 2tp(I) ns
(1)
tw2 IOW strobe width 2tp(I) ns
ÎÎÎ ÎÎÎÎÎ
TYPICAL CHARACTERISTICS
A0−A2
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
Valid
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
tsu1 th4
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ ÎÎÎÎÎ
CS (A−B) Active
td1 th1
tw1 td2
IOR
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
Active
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ td3
ÎÎÎÎÎÎÎÎÎÎ
td4
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎ
Data ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ
ÎÎÎÎ
ÎÎÎ ÎÎÎÎÎ
D0−D7
ÎÎÎ ÎÎÎÎÎ
Figure 11. General Read Timing
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ ÎÎÎÎÎ
ÎÎÎ ÎÎÎÎÎ
A0−A2 Valid
ÎÎÎÎÎ
ÎÎÎÎÎ
tsu1 th4
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ ÎÎÎÎÎ
CS (A−B) Active
td5 th2
tw2 td6
IOW
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
Active
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ tsu2
ÎÎÎÎÎÎÎÎÎÎ
th3
ÎÎÎÎ
D0−D7 ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
Data ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
Figure 12. General Write Timing
ÎÎÎÎ
ÎÎÎÎ
td19
IOW
IOR
tsu3 th5
XTAL1
td7
RTS (A−B)
DTR (A−B) Change of State Change of State
CD (A−B)
Change of State
CTS (A−B)
DSR (A−B)
td8 td8
td9
td8
Start Stop
Bit Bit
Data Bits (5−8)
RX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
Parity Next
5 Data Bits
Bit Data
6 Data Bits Start
7 Data Bits Bit
td10
INT (A−B)
Active
td11
Active
IOR
RX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
Parity Next
Bit Data
Start
Bit
td15
Active
Data
RXRDY (A−B) Ready
RXRDY
td16
Active
IOR
Figure 16. Receive Ready Timing in Non-FIFO Mode
Start Stop
Bit Bit
Data Bits (5−8)
RX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
td16
Active
IOR
Figure 17. Receive Timing in FIFO Mode
TX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
Parity Next
5 Data Bits
Bit Data
6 Data Bits Start
7 Data Bits Bit
td12
Active
INT (A−B)
Tx Ready
td13 td14
Active Active
IOW
Start Stop
Bit Bit
Data Bits (5−8)
TX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
Next
Parity
Data
Bit
Start
Bit
IOW Active
td17
Active
TXRDY (A−B)
Transmitter Ready
Transmitter
Not Ready
Figure 19. Transmit Ready Timing in Non-FIFO Mode
TX (A−B) D0 D1 D2 D3 D4 D5 D6 D7
Parity
5 Data Bits
Bit
6 Data Bits
7 Data Bits
Active
IOW
td17
TXRDY (A−B)
Trigger
Lead
Figure 20. Transmit Ready Timing in FIFO Mode
Problem Description
When using the non-FIFO (single byte) mode of operation, it is possible that valid data could be reported as
available by either the line status register (LSR) or the interrupt identification register (IIR), before the receiver
holding register (RHR) can be read. In other words, the loading of valid data in RHR may be delayed when the
part operates in non-FIFO mode. The data in the RHr is valid after a delay of one baud-clock period after the
update of the LSR or IIR. The baud-clock runs at 16× the baud rate. The following table is a sample of baud
rates and associated required delays. Depending on the operating environment, this time may well be
transparent to the system, e.g., less than the context switch time of the interrupt service routine.
This problem does not exist when using FIFO mode (64 byte) mode of operation.
BAUDRATE (BIT PER SECOND) REQUIRED DELAY (μs)
1200 52.1 ms
2400 26 ms
4800 13 ms
9600 6.5 ms
19200 3.3 ms
38400 1.6 ms
57600 1.1 ms
115200 0.5 ms
1000000 62.5 ns
PRINCIPLES OF OPERATION
Each register is selected using address lines A[0], A[1], A[2], and in some cases, bits from other registers. The
programming combinations for register selection are shown in Table 7. All registers shown in bold are accessed
by a combination of address pins and register bits.
(1) DLL and DLH are accessible only when LCR bit-7, is 1.
Enhanced feature register, Xon1, 2 and Xoff1, 2 are accessible only when LCR is set to 10111111 (8hBF).
Transmission control register and trigger level register are accessible only when EFR[4] = 1 and MCR[6] = 1, i.e. EFR[4] and MCR[6]
are read/write enables.
FIFORdy register is accessible only when CSA and CSB = 0, MCR [2] = 1 and loopback is disabled (MCR[4]=0).
MCR[7] can only be modified when EFR[4] is set.
Addr RGTR BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 READ/WR
ITE
000 RHR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read
000 THR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Write
001 IER 0/CTS 0/RTS 0/Xoff 0/X Sleep Modem Rx line THR Rx data Read/Writ
interrupt interrupt sleep mode status status empty available e
enable enable mode interrupt interrupt interrupt interrupt
010 FCR Rx trigger Rx trigger 0/TX 0/TX DMA Resets Tx Resets Rx Enables Write
level level trigger trigger mode FIFO FIFO FIFOs
level level select
010 IIR FCR(0) FCR(0) 0/CTS, 0/Xoff? Interrupt Interrupt Interrupt Interrupt Read
RTS? priority Bit priority Bit priority Bit status
2 1 0
011 LCR DLAB and Break Sets parity Parity type Parity Number of Word Word Read/Writ
EFR control Bit select enable stop Bits length length e
enable
100 MCR 1x or 1x/4 TCR and 0/Xon Any 0/Enable IRQ FIFO Rdy RTS DTR Read/Writ
clock TLR loopback enable OP enable e
enable
101 LSR 0/Error in THR and THR Break Framing Parity error Overrun Data in Read
Rx FIFO TSR empty interrupt error error receiver
empty
110 MSR CD RI DSR CTS ΔCD ΔRI ΔDSR ΔCTS Read
111 SPR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
000 DLL Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
001 DLH Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Read/Writ
e
010 EFR Auto-CTS Auto-RTS Special Enable S/W flow S/W flow S/W flow S/W flow Read/Writ
character enhanced control Bit control Bit control Bit control Bit e
detect functions 3 2 1 0
100 Xon1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
101 Xon2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
110 Xoff1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
111 Xoff2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
110 TCR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
111 TLR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read/Writ
e
111 FIFO Rdy 0 0 RX FIFO RX FIFO 0 0 TX FIFO TX FIFO Read
B status A status B status A status
(1) The shaded bits can be modified only if register bit EFR[4] is enabled, i.e., if enhanced functions are enabled.
(2) See the notes under Table 7 for more register access information.
Receiver Holding Register (RHR) and The Receiver Shift Register (RSR)
The receiver section consists of the receiver holding register (RHR) and the receiver shift register (RSR). The
RHR is actually a 64-byte FIFO. The RSR receives serial data from the RX terminal. The data is converted to
parallel data and moved to the RHR. The receiver section is controlled by the line control register. If the FIFO is
disabled, location zero of the FIFO is used to store the characters. (Note, in this case characters are overwritten
if overflow occurs.) If overflow occurs, characters are lost. The RHR also stores the error status bits associated
with each character.
When the LSR is read, LSR[4:2] reflect the error bits [BI, FE, PE] of the character at the top of the RX FIFO (next
character to be read). The LSR[4:2] registers do not physically exist, as the data read from the RX FIFO is output
directly onto the output data-bus, DI[4:2], when the LSR is read. Therefore, errors in a character are identified by
reading the LSR and then reading the RHR.
LSR[7] is set when there is an error anywhere in the RX FIFO and is cleared only when there are no more errors
remaining in the FIFO.
NOTE
Reading the LSR does not cause an increment of the RX FIFO read pointer. The RX FIFO
read pointer is incremented by reading the RHR.
NOTE
TI has found that the three error bits (parity, framing, break) may not be updated correctly
in the first read of the LSR when the input clock (Xtal1) is running faster than 36 MHz.
However, the second read should be correct. It is strongly recommended that when using
this device with a clock faster than 36 MHz, that the LSR be read twice and only the
second read be used for decision making. All other bits in the LSR should be correct on all
reads.
TCR trigger levels are available from 0–60 bytes with a granularity of four.
NOTE
TCR can only be written to when EFR[4] = 1 and MCR[6] = 1. The programmer must
program the TCR such that TCR[3:0] > TCR[7:4]. There is no built-in hardware check to
make sure this condition is met. Also, the TCR must be programmed with this condition
before Auto-RTS or software flow control is enabled to avoid spurious operation of the
device.
NOTE
TLR can only be written to when EFR[4] = 1 and MCR[6] = 1. If TLR[3:0] or TLR[7:4] are
0, the selectable trigger levels via the FIFO control register (FCR) are used for the
transmit and receive FIFO trigger levels. Trigger levels from 4–60 bytes are available with
a granularity of four. The TLR should be programmed for N/4, where N is the desired
trigger level.
When the trigger level setting in TLR is zero, the TL16C752B uses the trigger level setting defined in FCR. If TLR
has a nonzero trigger level value, the trigger level defined in FCR is discarded. This applies to both the transmit
FIFO and receive FIFO trigger level setting.
The FIFORdy register is a read-only register that can be accessed when any of the two UARTs are selected
CSA-B = 0, MCR[2] (FIFO Rdy Enable) is a logic 1 and loopback is disabled. The address is 111.
Set baud rate to VALUE1, VALUE2 Read LCR (03), save in temp
Set LCR (03) to 80
Set DLL (00) to VALUE1
Set DLM (01) to VALUE2
Set LCR (03) to temp
Set Xoff1, Xon1 to VALUE1, VALUE2 Read LCR (03), save in temp
Set LCR (03) to BF
Set Xoff1 (06) to VALUE1
Set Xon1 (04) to VALUE2
Set LCR (03) to temp
Set Xoff2, Xon2 to VALUE1, VALUE2 Read LCR (03), save in temp
Set LCR (03) to BF
Set Xoff2 (07) to VALUE1
Set Xon2 (05) to VALUE2
Set LCR (03) to temp
Set software flow control mode to VALUE Read LCR (03), save in temp
Set LCR (03) to BF
Set EFR (02) to VALUE
Set LCR (03) to temp
Set flow control threshold to VALUE Read LCR (03), save in temp1
Set LCR (03) to BF
Read EFR (02), save in temp2
Set EFR (02) to 10 + temp2
Set LCR (03) to 00
Read MCR (04), save in temp3
Set MCR (04) to 40 + temp3
Set TCR (06) to VALUE
Set MCR (04) to temp3
Set LCR (03) to BF
Set EFR (02) to temp2
Set LCR (03) to temp1
Set xmt and rcv FIFO thresholds to VALUE Read LCR (03), save in temp1
Set LCR (03) to BF
Read EFR (02), save in temp2
Set EFR (02) to 10 + temp2
Set LCR (03) to 00
Read MCR (04), save in temp3
Set MCR (04) to 40 + temp3
Set TLR (07) to VALUE
Set MCR (04) to temp3
Set LCR (03) to BF
Set EFR (02) to temp2
Set LCR (03) to temp1
Read FIFORdy register Read MCR (04), save in temp1
Set temp2 = temp1 y EF; (x sign here means bit-AND)
Set MCR (04) = 04 + temp2
Read FRR (07), save in temp2 Pass temp2 back to host
Set MCR (04) to temp1
Set prescaler value to divide-by-one Read LCR (03), save in temp1
Set LCR (03) to BF
Read EFR (02), save in temp2
Set EFR (02) to 10 + temp2
Set LCR (03) to 00
Read MCR (04), save in temp3
Set MCR (04) to temp3 y 7F; (y sign here means bit-AND)
Set LCR (03) to BF
Set EFR (02) to temp2
Set LCR (03) to temp1
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TL16C752BLPTREP ACTIVE LQFP PT 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 110 16C752BLE
TL16C752BTPTREP ACTIVE LQFP PT 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 16C752BEP
V62/03626-01XE ACTIVE LQFP PT 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 110 16C752BEP
V62/03626-02XE ACTIVE LQFP PT 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -55 to 110 16C752BLE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE OUTLINE
PT0048A SCALE 2.000
LQFP - 1.6 mm max height
LOW PROFILE QUAD FLATPACK
9.2
8.8
7.2
B
6.8
9.2 7.2
8.8 6.8
0.27
48X
0.17
0.08 C A B
44X 0.5
1.6 MAX C
SEATING PLANE
0.1 C
1.45
0.25 1.35
GAGE PLANE
DETAIL A
A15.000
4215159/A 12/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MS-026.
4. This may also be a thermally enhanced plastic package with leads conected to the die pads.
www.ti.com
EXAMPLE BOARD LAYOUT
PT0048A LQFP - 1.6 mm max height
LOW PROFILE QUAD FLATPACK
PKG
SYMM
48 37
SEE SOLDER MASK
DETAILS
48X (1.6)
1
36
48X (0.3)
44X (0.5)
(R0.05) TYP
12 25
13 24
(8.2)
www.ti.com
EXAMPLE STENCIL DESIGN
PT0048A LQFP - 1.6 mm max height
LOW PROFILE QUAD FLATPACK
PKG
SYMM
48 37
48X (1.6)
1
36
48X (0.3)
44X (0.5)
(R0.05) TYP
12 25
13 24
(8.2)
4215159/A 12/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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