This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles

for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Designation: B488 − 18

Standard Specification for

Electrodeposited Coatings of Gold for Engineering Uses1
This standard is issued under the fixed designation B488; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.

1. Scope B183 Practice for Preparation of Low-Carbon Steel for

1.1 This specification covers requirements for electrodepos- Electroplating
ited gold coatings that contain not less than 99.00 mass % gold B242 Guide for Preparation of High-Carbon Steel for Elec-
and that are used for engineering applications. troplating
B253 Guide for Preparation of Aluminum Alloys for Elec-
1.2 Specifically excluded from this specification are troplating
autocatalytic, immersion, and vapor deposited gold coatings. B254 Practice for Preparation of and Electroplating on
1.3 Gold coatings conforming to this specification are em- Stainless Steel
ployed for their corrosion and tarnish resistance (including B281 Practice for Preparation of Copper and Copper-Base
resistance to fretting corrosion and catalytic polymerization), Alloys for Electroplating and Conversion Coatings
bondability, low and stable contact resistance, solderability, B322 Guide for Cleaning Metals Prior to Electroplating
and infrared reflectivity. Several types of coatings, differing in B343 Practice for Preparation of Nickel for Electroplating
gold purity and hardness, are covered by this specification. with Nickel
1.4 The values stated in SI units are to be regarded as the B374 Terminology Relating to Electroplating
standard. Values provided in parentheses are for information B481 Practice for Preparation of Titanium and Titanium
only. Alloys for Electroplating
B482 Practice for Preparation of Tungsten and Tungsten
1.5 The following hazards caveat pertains only to the test Alloys for Electroplating
methods section, Section 9, of this specification: This standard B487 Test Method for Measurement of Metal and Oxide
does not purport to address all of the safety concerns, if any, Coating Thickness by Microscopical Examination of
associated with its use. It is the responsibility of the user of this Cross Section
standard to establish appropriate safety, health, and environ- B489 Practice for Bend Test for Ductility of Electrodepos-
mental practices and determine the applicability of regulatory ited and Autocatalytically Deposited Metal Coatings on
limitations prior to use. Metals
1.6 This international standard was developed in accor- B499 Test Method for Measurement of Coating Thicknesses
dance with internationally recognized principles on standard- by the Magnetic Method: Nonmagnetic Coatings on
ization established in the Decision on Principles for the Magnetic Basis Metals
Development of International Standards, Guides and Recom- B504 Test Method for Measurement of Thickness of Metal-
mendations issued by the World Trade Organization Technical lic Coatings by the Coulometric Method
Barriers to Trade (TBT) Committee. B507 Practice for Design of Articles to Be Electroplated on
Racks
2. Referenced Documents
B542 Terminology Relating to Electrical Contacts and Their
2.1 ASTM Standards:2 Use
B558 Practice for Preparation of Nickel Alloys for Electro-
plating
1
This specification is under the jurisdiction of ASTM Committee B08 on B567 Test Method for Measurement of Coating Thickness
Metallic and Inorganic Coatingsand is the direct responsibility of Subcommittee by the Beta Backscatter Method
B08.04 on Precious Metal Coatings.
Current edition approved Aug. 1, 2018. Published October 2018. Originally B568 Test Method for Measurement of Coating Thickness
approved in 1968. Last previous edition approved in 2011 as B488 – 11. DOI: by X-Ray Spectrometry
10.1520/B0488-18.
2
B571 Practice for Qualitative Adhesion Testing of Metallic
For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Coatings
contact ASTM Customer Service at [email protected]. For Annual Book of ASTM
Standards volume information, refer to the standard’s Document Summary page on B578 Test Method for Microhardness of Electroplated Coat-
the ASTM website. ings

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 B488 − 18
B602 Test Method for Attribute Sampling of Metallic and 4. Classification
Inorganic Coatings 4.1 Types of Coatings—A coating shall be specified by a
B678 Test Method for Solderability of Metallic-Coated combination of the following:
Products 4.1.1 Type, characterizing minimum purity in accordance
B697 Guide for Selection of Sampling Plans for Inspection with 4.2.1,
of Electrodeposited Metallic and Inorganic Coatings 4.1.2 Code, designating Knoop hardness in accordance with
B735 Test Method for Porosity in Gold Coatings on Metal 4.2.3, and
Substrates by Nitric Acid Vapor 4.1.3 a numeral designating thickness in micrometers (µm)
B741 Test Method for Porosity In Gold Coatings On Metal in accordance with 4.3.
Substrates By Paper Electrography (Withdrawn 2005)3
B748 Test Method for Measurement of Thickness of Metal- 4.2 Purity and Hardness:
lic Coatings by Measurement of Cross Section with a 4.2.1 Purity—The 2001 issue of this standard established
Scanning Electron Microscope new ASTM Type designations, which are identical to the
B762 Test Method of Variables Sampling of Metallic and original standard (MIL-G-45204, which is now MIL-DTL-
Inorganic Coatings 45204), established for electrodeposited gold and they are
B765 Guide for Selection of Porosity and Gross Defect Tests outlined in the following table.
for Electrodeposits and Related Metallic Coatings Mass Percent Gold, Minimum, New ASTM MIL-DTL- Old ASTM
Excluding Potassium, Carbon & Type 45204 Type Type
B799 Test Method for Porosity in Gold and Palladium Nitrogen
Coatings by Sulfurous Acid/Sulfur-Dioxide Vapor 99.70 I I 2
B809 Test Method for Porosity in Metallic Coatings by 99.00 II II 3
99.90 III III 1
Humid Sulfur Vapor (“Flowers-of-Sulfur”)
D1125 Test Methods for Electrical Conductivity and Resis- NOTE 1—It is commonly accepted that a gold purity of 99.7 % is
tivity of Water defined as no more than 0.3 % of total codeposited metallic components,
excluding potassium and sodium. Likewise, 99.9 % purity is recognized to
D3951 Practice for Commercial Packaging mean no more than 0.1 % of total codeposited metal impurities, excluding
F390 Test Method for Sheet Resistance of Thin Metallic potassium and sodium. Almost all gold electrodeposits will contain
Films With a Collinear Four-Probe Array potassium, carbon, and nitrogen that are precipitated in the deposit. In the
case of Type I gold, the co-deposited potassium has been shown to
2.2 U.S. Government Standards:4 improve durability and is desirable for that reason.6,7
MIL-DTL-45204 Gold Plating, Electrodeposited
MIL-STD-1916 DOD Preferred Methods for Acceptance of 4.2.2 Gold purity is calculated by subtraction of the sum of
Product all non-gold metals in mass %, excluding potassium (K) and
sodium (Na), from 100 %. The presence of Carbon (C),
2.3 ANSI/ASQC Standard:5 Nitrogen (N), Hydrogen (H), Na, and K contained in the
ANSI/ASQC Z1.4 Sampling Procedures and Tables for In- electrodeposit are not included in the calculation.
spection by Attributes 4.2.3 Hardness—Hardness values shall be specified by
ASTM Code. The military standard designation of Grade is
3. Terminology included for reference.
3.1 Definitions—For definitions of terms used in this speci- Knoop Hardness Range ASTM Code MIL-DTL-
fication refer to Terminologies B374 or B542. 45204 Grade
90 HK25 maximum A A
3.2 Definitions of Terms Specific to This Standard: 91–129 HK25 B B
90–200 HK25 (see Note 2) ...
3.2.1 significant surfaces—defined as those normally visible 130–200 HK25 C C
(directly or by reflection) or essential to the serviceability or >200 HK25 D D
function of the article. Can be the source of corrosion products NOTE 2—ASTM Code B has previously been specified for hardness
or tarnish films that interfere with the function or desirable grade 90–200. This hardness grade has been eliminated and replaced with
appearance of the article. The significant surfaces shall be hardness grade 91–129 in accordance with MIL-DTL-45204.
indicated on the drawings of the parts or by the provision of 4.2.4 Relationship Between Purity and Hardness—The fol-
suitably marked samples. lowing combinations of purity and hardness ranges are repre-
3.2.2 underplating—a metallic coating layer between the sentative of good commercial practice:
basis metal or substrate and the topmost metallic coating. The New ASTM Type Old ASTM Type Code
thickness of an underplating is usually greater than 1 µm (40 I 2 A, B and C
II 3 B, C and D
µin.), in contrast to a strike or flash, which is thinner. III 1 A only
4.3 Thickness—Thickness shall be specified by an Arabic
numeral that designates the minimum linear thickness in
3
The last approved version of this historical standard is referenced on
www.astm.org.
4
Available from Standardization Documents Order Desk, DODSSP, Bldg. 4,
6
Section D, 700 Robbins Ave., Philadelphia, PA 19111-5098, http:// Whitlaw, K. J., Souter, J. W., “The Role of Codeposited Elements in Gold
dodssp.daps.dla.mil. Plated Contacts,” Trans. Inst. Metal Fin., Vol 62, No. 1, 1984, pp. 29–31.
5 7
Available from American National Standards Institute (ANSI), 25 W. 43rd St., Whitlaw, K. J., Souter, J., Wright, I.S., Nottingham, M., “Wear Properties of
4th Floor, New York, NY 10036, http://www.ansi.org. High Speed Gold Electrodeposits,” Electrical Contacts, 30th., 1984, pp. 33–45.

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 B488 − 18
micrometers (µm). Examples of commonly specified thick- observance of the best plating practice. Any such defects on
nesses are shown in Table 1. significant surfaces shall be brought to the attention of the
4.3.1 See 7.4.2 for thickness tolerances. purchaser.
4.3.2 Instead of specifying the thickness in micrometers, the 6.2.3 The basis metal shall be subject to such cleaning
purchaser may specify the mass of gold per unit area (coating procedures as are necessary to ensure a satisfactory surface for
weight) in milligrams per square centimeter. Unless otherwise subsequent electroplating (see Practices B183, B242, Guide
specified, the density of gold is assumed to be 19.3 g/cm3 for B253, Practices B254, B281, B322, B343, B481, B482, and
Type III and 17.5 g/cm3 for Type I and Type II. B558).
NOTE 3—The density of Type III gold coatings will be less than or equal
6.2.4 Proper preparatory procedures and thorough cleaning
to 19.3 g/cm3, but not less than 18.5 g/cm3. of the basis metal are essential for satisfactory adhesion and
NOTE 4—When significant surfaces are involved on which the specified performance of these coatings. The surface must be chemically
thickness of deposit cannot readily be controlled, such as threads, holes, clean and continuously conductive, that is, without inclusions
deep recesses, bases of angles, and similar areas, the purchaser and the or other contaminants. They must be smooth and as free of
supplier should recognize the necessity for either thicker deposits on the
more accessible surfaces or for special racking. Special racks may involve scratches, gouges, nicks, and similar imperfections as possible.
the use of conforming, auxiliary, bipolar electrodes, or nonconducting NOTE 5—A metal finisher can often remove defects through special
shields. treatments such as grinding, polishing, abrasive blasting, chemical
treatments, and electropolishing. However, these may not be normal in the
5. Ordering Information treatment steps preceding the plating and a special agreement is indicated.
5.1 To make the application of this standard complete, the 6.3 If required by the purchaser (see 5.1.7), steel parts with
purchaser needs to supply the following information to the a hardness greater than 31 HRC shall be given a suitable stress
supplier in the purchase order or other governing document. relief heat treatment prior to plating, and an embrittlement
5.1.1 The name, designation, and date of issue of this relief bake after plating. Such relief baking shall not reduce the
specification. hardness to a value below the specified minimum. Acid
5.1.2 Classification: Type, Code, and thickness (or mass per pickling of high strength steels shall be avoided.
unit area) (see Section 4). 6.3.1 The coating shall be applied after all basis metal heat
5.1.3 Presence and thickness of underplating, if required treatments and mechanical operations on significant surfaces
(see 3.2.2). have been completed.
5.1.4 Significant surfaces shall be specified (see 3.2.1).
5.1.5 Requirement, if any, for performance testing such as 6.4 Racking—Parts should be positioned so as to allow free
porosity testing (see 9.6), solderability testing (see Appendix circulation of solution over all surfaces. The location of rack or
X4), ductility testing (see 9.7), etc. wire marks in the coating shall be agreed upon between the
5.1.6 If the substrate is one that requires a nickel underplat- purchaser and the supplier.
ing (see 6.5.1 and Appendix X6). 6.5 Plating Process:
5.1.7 Whether or not stress relief has been or is to be done, 6.5.1 Nickel Underplating—For thickness Classes except
whether embrittlement relief bake is to be done (steel parts 5.0, a nickel underplating shall be applied before the gold
only). coating when the product is made from copper or copper alloy.
5.1.8 Sampling plan employed (see Section 8). Nickel underplatings are also applied for other reasons (see
Appendix X6).
6. Manufacture
NOTE 6—When the thickness of the nickel underplate has a detrimental
6.1 Any process that provides an electrodeposit capable of impact on the mechanical properties or bondability of the substrate, the
meeting the specified requirements is acceptable. nickel thickness may be reduced to a non-detrimental level as specified by
the purchaser.
6.2 Substrate: NOTE 7—In certain instances in which high-frequency analog signals
6.2.1 The surface condition of the basis metal should be are employed, such as in wave guides, the magnetic properties of nickel
specified and should meet this specification prior to the plating may attenuate the signal.
of the parts. NOTE 8—In applications in which forming or flaring operations are to
6.2.2 Defects in the surface of the basis metal such as be applied to the plated component, a ductile nickel electrodeposit should
be specified.
scratches, porosity, pits, inclusions, roll and die marks, laps,
cracks, burrs, cold shuts, and roughness may adversely affect 6.5.2 Strikes—It is recommended to apply a gold strike to
the appearance and performance of the deposit, despite the the underplate or substrate, except if the latter is silver or
platinum, prior to applying the gold top coating.
TABLE 1 Coating Thickness 6.5.3 Plating—Good practice calls for parts to be electri-
Class Minimum Thickness, µm
cally connected when entering the gold plating solution. A
0.25 0.25
minimum of 0.5 V is suggested.
0.50 0.50
NOTE 9—For rack and barrel plating processing, residual plating salts
0.75 0.75
1.0 1.0
can be removed from the articles by a clean, hot (50 to 100°C) water rinse.
1.25 1.25 A minimum rinse time of 2.5 min (rack) or 5 min (barrel) is suggested.
2.5 2.5 Best practice calls for a minimum of three dragout rinses and one running
5.0 5.0 rinse with dwell times of 40 s in each station when rack plating and 80 s
when barrel plating. Modern, high-velocity impingement-type rinses can

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 B488 − 18
reduce this time to a few seconds. This is particularly useful in automatic layer of Type III (Code A) gold. Typical thicknesses of the Type III gold
reel-to-reel applications in which dwell times are significantly reduced. underlayer are 10 to 30 % of the total specified thickness. However, care
must be taken to ensure that the thickness of the Type I or Type II gold
7. Coating Requirements topcoat is sufficient so as not to compromise wear properties. When
measuring the total gold thickness of duplex composite coatings, a density
7.1 Nature of Coating—The gold deposit shall meet the of 17.5 g/cm3 should be employed (see 9.4).
appropriate purity requirements as put forth in the following:
7.1.1 Type I coatings shall contain at least 99.70 mass % 7.4.2 The thickness of the gold coating shall be equal to or
gold, excluding potassium, sodium, carbon and nitrogen. For exceed the specified thickness throughout the significant sur-
Type I Code A (“soft”) coatings only, metallic hardening agents face (see 3.2.1). When plated parts are used in mating
such as nickel, cobalt or iron combined, shall be less than 0.05 applications, the maximum thickness shall not exceed the
mass % and none of these three elements shall be present in an tolerance specified for the part on its engineering drawing. It is
amount greater than 0.03 mass %. All other metals excluding customary that allowance for plated coatings be included
potassium and sodium are considered impurities and shall not within the part tolerance.
be present in amounts greater than 0.05 mass % combined. For NOTE 11—The coating thickness requirement of this specification is a
Type I Code B and C coatings, metallic hardening agents such minimum requirement: that is, the coating thickness is required to equal or
as nickel, cobalt or iron combined shall be equal to or less than exceed the specified thickness throughout the significant surfaces, while
conforming to all maximum allowed thicknesses created by part dimen-
0.3 mass %. All other metals are considered impurities and sional tolerances given in the engineering drawing. Variation in the
shall not be present in amounts greater than 0.05 mass % each, coating thickness from point to point on a coated article is an inherent
0.1 % combined. The gold purity shall be calculated by characteristic of electroplating processes. Therefore, the coating thickness
determining the content of all non-gold metals in mass % at any single point on the significant surface will sometimes have to
(except potassium and sodium) and subtracting this value from exceed the specified value in order to ensure that the thickness equals or
exceeds the specified value at all points. Hence, most average coating
100 %. thicknesses will be greater than the specified value; how much greater is
7.1.2 Type II coatings shall contain at least 99.00 mass % largely determined by the shape of the article (see Practice B507) and the
gold, excluding potassium, sodium, carbon and nitrogen. Type characteristics of the plating process. In addition, the average coating
II coatings may contain metallic hardening agents, such as thickness on articles will vary from article to article within a production
lot. Therefore, if all the articles in a production lot are to meet the
nickel, cobalt or iron, which may be present in amounts greater thickness requirement, the average coating thickness for the production lot
than 0.3 mass %. All other metals, excluding potassium and as a whole will be greater than the average necessary to ensure that any
nitrogen, shall be considered impurities and shall not be single article meets the requirement (see 8.1).
present in amounts greater than 0.1 mass % each. The gold 7.5 Adhesion—The gold coatings shall be adherent to the
purity shall be calculated by determining the content of all substrate when tested by one of the procedures summarized in
non-gold metals in mass % (except potassium and sodium) and 9.5.
subtracting this value from 100 %.
7.1.3 Type III coatings shall contain at least 99.90 mass % 7.6 Integrity of the Coating:
gold, excluding potassium, sodium, carbon and nitrogen. 7.6.1 Gross Defects/Mechanical Damage—The coatings
Individual metal impurities shall not be present in a quantity shall be free of visible mechanical damage and similar gross
greater than 0.04 mass %. Iron, nickel and cobalt combined defects when viewed at magnifications up to 10×. For some
shall be less than 0.05 mass %, and none of these three applications this requirement may be relaxed to allow for a
elements shall be present in an amount greater than 0.03 mass small number of such defects (per unit area), especially if they
%. All non-gold metals, excluding potassium and sodium, are are outside or on the periphery of the significant surfaces (see
considered impurities and shall not be present in amounts 7.6.2).
greater than 0.1 mass % combined. The gold purity shall be 7.6.2 Porosity—Almost all as-plated electrodeposits contain
calculated by determining the content of all non-gold metals in some porosity. The tolerable amount of porosity in the coating
mass % (except potassium and sodium) and subtracting this depends on the severity of the environment that the article is
value from 100 %. likely to encounter during service or storage. If the pores are
few in number or away from the significant surfaces, their
7.2 Hardness—The gold coating shall have a Knoop hard- presence can often be tolerated. Such acceptance (or pass-fail)
ness within the specified range as shown in 4.2.3 when tested criteria, if required, shall be part of the product specification for
in accordance with 9.2. the particular article or coating requiring the porosity test (see
7.3 Appearance—Gold coatings shall be coherent, 9.6 for porosity testing).
continuous, and have a uniform appearance to the extent that
the nature of the basis metal and good commercial practices 8. Sampling
permit. 8.1 The supplier is urged to employ statistical process
7.4 Thickness: control in the coating process. Properly performed, this process
7.4.1 The gold coating shall have a thickness on the will ensure coated products of satisfactory quality and will
significant surfaces in accordance with 4.3 unless otherwise reduce the amount of acceptance inspection. The sampling plan
specified. used for the inspection of the quality of the coated articles shall
be as agreed upon between the purchaser and the supplier.
NOTE 10—Where Type I (Code B or C) or Type II (Code B or C) gold
is specified, improved protection of the underlying metals can be obtained NOTE 12—Usually, with a collection of coated articles, the inspection
by applying a duplex gold composite coating consisting of an underlying lot (see 8.2) is examined for compliance with the requirements placed on

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 B488 − 18
the articles, a relatively small number of the articles, the sample, is standards having a density identical to that of the coatings to be
selected at random and is inspected. The inspection lot is then classified as measured, or to multiply the reading obtained by factor, f.
complying with the requirements based on the results of the inspection of
the sample. The size of the sample and the criteria of compliance are 19.3
determined by the application of statistics. The procedure is known as f5 (1)
d
sampling inspection. Test Method B602, Guide B697, and Test Method
B762 contain sampling plans that are designed for the sampling inspection where:
of coatings. Test Method B602 contains four sampling plans, three for use d = density of gold coating, g/cm3.
with tests that are nondestructive and one with those that are destructive.
The purchaser and supplier may agree on the plan or plans to be used. If 9.4.1.1 The density of gold coatings depends not only on the
they do not, Test Method B602 identifies the plan to be used. Guide B697 type of gold coating but also on the gold content and the
provides a large number of plans and also gives guidance in the selection composition and purity of the electroplating solution. The
of a plan. When Guide B697 is specified, the purchaser and supplier need
to agree on the plan to be used. Test Method B762 can be used only for density figure, when the above methods are used for measure-
coating requirements that have a numerical limit, such as coating ments of thickness, shall be considered to be 19.3 g/cm3 for
thickness. The test must yield a numerical value and certain statistical Type III coatings and 17.5 g/cm3 for Type I and Type II
requirements must be met. Test Method B762 contains several plans and coatings, unless:
also gives instructions for calculating plans to meet special needs. The (1) the density is supplied by the plating process vendor, or
purchaser and supplier may agree on the plan or plans to be used. If they
do not, Test Method B762 identifies the plan to be used. (2) the density has been measured.
9.4.2 Mass Per Unit Area—Test Methods B504, B567, and
8.2 An inspection lot shall be defined as a collection of
B568 measure the mass of gold per unit area (coating weight)
coated articles that are of the same kind; that have been
directly and independently of the density of gold.
produced to the same specifications; that have been coated by
a single supplier at one time, or at approximately the same NOTE 13—The calibration standards available from the National Insti-
time; under essentially identical conditions; and that are tute of Standards and Technology (NIST)8 are certified in units of mass of
gold per unit area. Other calibration standards for gold are generally
submitted for acceptance or rejection as a group.
certified in thickness units that can be converted to mass per unit area units
9. Test Methods by multiplying by the density of pure gold.

9.1 Deposit Purity—Use any recognized method to deter- Mass per unit area ~ or coating weight! (2)
mine quantitatively the metallic impurities present. Atomic
in mg/cm2 5 19.3 3 thickness ~ µm ! /10
absorption spectrophotometry (or any methods with demon-
strated uncertainty less than 10 %) may be used to determine This conversion should be verified by the supplier of the
the metallic impurities. Initial scanning should be carried out calibration standards.
for all elements in order to detect any unknown or unexpected 9.5 Adhesion—Determine adhesion by one of the following
metallic impurities. Determine deposit purity by subtracting procedures (see Practice B571 for full details).
total impurities in mass from 100 %. Deposit purity should be 9.5.1 Bend Test—Bend the electroplated article repeatedly
determined on samples at plating conditions representative of through an angle of 180° on a diameter equal to the thickness
actual production. of the article until fracture of the basis metal occurs. Examine
9.2 Hardness—Measure hardness in accordance with Test the fracture at a magnification of 10×. Cracking without
Method B578. Deposit hardness should be determined on separation does not indicate poor adhesion unless the coating
samples at plating conditions representative of actual produc- can be peeled back with a sharp instrument.
tion. 9.5.2 Heat Test—No flaking, blistering, or peeling shall be
9.3 Appearance—The coating shall be examined at magni- apparent at a magnification of 10× after the gold electroplated
fications up to 10× for conformance to the requirements of parts are heated to 300 to 350°C (570 to 660°F) for 30 min and
appearance. allowed to cool.
9.5.3 Cutting Test—Make a cut with a sharp instrument and
9.4 Thickness and Mass per Unit Area—Measure thickness
then probe with a sharp point and examine at a magnification
by methods outlined in Test Methods B487, B567, B568, or
of 10×. No separation of the coating from the substrate shall
B748. The method chosen shall be such as to give an
occur.
uncertainty of less than 10 % on the particular coating being
measured. 9.6 Plating Integrity—Porosity shall be determined prefer-
9.4.1 Thickness—The beta backscatter, X-ray fluorescence ably by either Test Method B735, B741, B799, or B809 unless
spectrometry, and coulometric methods measure the mass of otherwise specified. See Guide B765 for guidelines for select-
gold per unit area that is present over the measured area. The ing the appropriate test method.
cross-sectioning and magnetic methods measure the geometri- NOTE 14—The test to be selected will depend upon the gold thickness,
cal thickness of the gold present. Since many gold coatings the nature of the basis metal, the nature and thickness of any intermediate
have a density lower than the theoretical density of gold layers or underplate, the shape of the gold-coated part, and its intended
(19.3 g ⁄cm3), instruments utilizing the measuring principles in service environment.
Test Methods B504, B567, and B568 will often give lower
readings than the microscopical cross-section method. To
convert mass of gold per unit area that is present over the 8
Available from National Institute of Standards and Technology (NIST), 100
measured area to a geometrical thickness, it is necessary to use Bureau Dr., Stop 1070, Gaithersburg, MD 20899-1070, http://www.nist.gov.

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 B488 − 18
9.7 Ductility—When required, determine ductility in accor- and bias of the particular non-destructive technique when
dance with Practice B489. thicknesses of 0.75 µm or above are used.
10.1.2.2 The part shall be covered with gold. The gold
10. Special Government Requirements
thickness on significant surfaces shall be at least 1.25 µm (50
10.1 The following special requirements shall apply when µin.), unless otherwise specified in the drawings or contract.
the ultimate purchaser is the U.S. Government or an agent of Any specific requirement for thicknesses on non-significant
the U.S. Government. surfaces shall be agreed on between purchaser and supplier.
10.1.1 Sampling—For government acceptance, the sampling
10.1.3 Packaging—Parts plated for the U.S. Government
plans specified in MIL-STD-1916 or ANSI/ASQC Z1.4 are to
and Military, including as subcontracts, shall be packaged in
be used instead of the ASTM standards specified in 8.1.
accordance with Practice D3951.
10.1.2 Thickness Testing:
10.1.2.1 In addition to the nondestructive method outlined
in Test Methods B499, B567, and B568, a cross-sectioning 11. Keywords
method, such as that specified by Test Method B487 or B748, 11.1 engineering coatings; engineering gold; gold; gold
can also be used as a referee method to confirm the precision coatings; gold electrodeposits; gold platings; underplate

APPENDIXES

(Nonmandatory Information)

X1. TYPICAL USES

X1.1 The conditions of exposure and the uses of gold coating thicknesses not exceed 0.5 µm for solder applications.
coatings are so varied that it is often not possible to predict the There is evidence to show that when the gold content in the
life of a coating of a given thickness and hardness. Some tin-lead solder joint exceeds about 3 % by weight, embrittle-
typical uses of gold coatings are enumerated below, but the list ment occurs leading to potential solder joint failure.9
is not complete and is intended for general guidance only. X1.1.5 Printed Wiring Boards—Boards that will be sheared
X1.1.1 Type III, Code A Gold—For semiconductor or cropped should not be electroplated with a heavy thickness
components, nuclear engineering, thermocompression of a hard gold because of possible cracking of the gold.
bonding, thermosonic bonding, ultrasonic bonding, Coatings with purities of 99.0 to 99.7 % are used with B or C
solderability, and high-temperature applications. hardness and at thicknesses generally not in excess of 2.5 µm.
X1.1.2 Type I—For general-purpose, high-reliability electri- X1.1.6 Static Separable Connectors—Coatings at any of
cal contacts, and wire wrap connections. the listed purities and with hardnesses A, B, or C are used to
X1.1.3 Type II, General-Purpose Wear Resistant Gold— any thickness up to 5 µm. Selection of the type and thickness
Will not withstand high-temperature applications because the of the gold coating is determined by the desired life in the
hardening agents in the gold coating will oxidize. operating environment of the electroplated component.

X1.1.4 Solderability—Type III golds are preferred for solder 9

Glazer, J., Kramer, P. A., and Morris, J. W., Jr., “Effect of Au on the Reliability
applications. Oxidation of co-deposited metals can make sol- of Fine Pitch Surface Mount Solder Joints,” Proceedings from Surface Mount
dering more difficult. It is strongly recommended that gold International Conference and Exposition , August 25–29, pp. 629–639.

X2. RESISTIVITY

X2.1 When electrodeposited gold coatings are used as TABLE X2.1 Maximum Electrical Sheet Resistivity by the Four
electrical conductor paths, the electroplating process can be Point Probe MethodA
Gold Finishes Ohm per Square
expected to produce coatings having maximum resistivities as
A and B 0.03
specified in Table X2.1. C 0.10
A
When the electroplated coatings are used as electrical conductor paths, the
X2.2 Use any reliable four-point probe method for deter- sheet resistance in ohms per square should be specified and not the coating
mining resistivity of gold coatings. A suggested four-point thickness.
method is detailed in Test Method F390.

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 B488 − 18

X3. RESIDUAL SALTS

X3.1 Electroplated parts are placed in water of known µS/cm. Slowly agitate the solution for 10 min before determin-
conductivity and agitated for a specific time. The conductivity ing the conductivity of the extract. In a closed polyethylene
of the water extract is measured, and the increase in conduc- bottle, the equilibrated water will remain in the range from 0.8
tivity due to residual salts and other conducting impurities is to 1 µS/cm for at least 1 week. Place the specimen in the bottle
calculated. A suggested water extract conductivity test method in accordance with X3.1.
uses a procedure in accordance with Test Methods D1125,
Method A. X3.3 Inspection under a source of ultraviolet light is often
employed to determine whether electroplating salts have been
X3.2 Conductivity of water for extract test shall be 1 µS/cm removed by the rinsing following gold electroplating. The
or less (resistivity 1 MΩ·cm or more). presence of salts is evidenced by a characteristic fluorescence
and should not be confused with fluorescing dirt or dirt
X3.2.1 A sample of the coated parts having a total surface particles.
area of 30 cm3 shall ordinarily be used and extracted in 100
cm3 of equilibrated water. To prepare equilibrated water, fill a X3.4 Water or purging stains, resulting from blind holes or
clean polyethylene bottle half-way with high-purity water from parts that were assembled before electroplating, as
(X3.1), replace the bottle cap, and shake the bottle vigorously normally obtained in good commercial practice, are
for 2 min to equilibrate the water with the carbon dioxide (CO2 permissible, except where they occur on surfaces to which
) in the air. CO2 is a component of air. It is soluble in water and electrical contact is to be made or on which subsequent
forms carbonic acid that ionizes and is at equilibrium at 0.8 soldering operations are performed.

X4. SOLDERABILITY

X4.1 Where solderability requirements are specified, solder-

ability testing shall be done in accordance with Test Method
B678.

X5. MANUFACTURE

X5.1 Substrate Preparation: X5.2.3 Gold coatings on zinc, aluminum, steel, and other
metals normally require underplatings such as copper or nickel
X5.1.1 Practices B183, B242, B253, B254, B281, B322,
of sufficient thickness to impact adequate corrosion protection
B343, B481, and B482 should be used where appropriate for to the basis metal.
the preparation of the applicable basis metal.
X5.2.4 To minimize diffusion, a nickel underplating with a
X5.1.2 When electroplated materials are used for electrical nominal thickness of at least 1.2 µm should be applied before
contacts, cleaning alone may not properly prepare the surface depositing any of these gold finishes on copper and copper
for gold electroplating. If the basis metal is scratched or rough, alloy parts that can be subjected to elevated temperatures. The
it may be necessary to level the surface by processes such as thickness of the underplating should be consistent with end-use
electropolishing, chemical polishing, or the application of a requirements (see 6.5.1).
self-leveling nickel or copper undercoating before gold elec- X5.2.5 A gold strike is often used to precede the final gold
troplating. However, the use of these undercoatings requires coating, to improve adhesion, and to prevent contamination of
the approval of the purchaser. the main gold electroplating solution with metallic impurities.
X5.2 Underplatings: X5.3 Gold Electrolytes—Most gold electroplating solutions
used for producing these coatings are proprietary. Any bath that
X5.2.1 Silver shall not be used as an underplating unless
produces coatings meeting the requirements of the specifica-
specified by the purchaser. tion may be used.
X5.2.2 Copper alloys containing zinc, beryllium, tellurium, X5.3.1 Solution Contamination—Care should be exercised
or lead should be precoated to prevent adhesion problems. If to prevent contamination of gold electroplating solutions with
copper or nickel underplatings are used, they should have a organic or metallic impurities. Copper, zinc, cadmium (from
nominal thickness of at least 1.2 µm. Thickness of the racking materials, bus bars, etc.), iron (from insoluble anodes),
underplating should be consistent with end-use requirements. lead and tin (from solder parts), and silver (from impurities in
With cyanide-sensitive copper alloys, such as those containing the electroplating bath makeup salts) are some of the more
beryllium or tellurium, an acid copper strike is recommended. common contaminants, which, if present in the coating in more

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 B488 − 18
than trace quantities, can have harmful effects on such prop- be readily established by scheduled additions, analyses of the
erties as hardness, solderability, and porosity. electroplating bath constituents should be made on a regularly
X5.3.2 Activated Carbon Treatment—Periodic treatment of scheduled basis. When the work load is erratic, each addition
the solution with activated carbon is recommended to control should be based on bath analyses.
the buildup of organic impurities. This contamination can have X5.3.4 Control of the Gold Deposit—The adhesion,
the effect of producing discoloration of the deposit. Thus, the hardness, and composition of the gold deposit should be
appearance of test coupons may serve as an indication of an
determined on a regularly scheduled basis. Once it has been
approaching need for the activated carbon treatment.
established that the co-deposited metallic impurity limitations
(Warning—Do not store activated carbon in areas in which
are being continuously met in production, frequency of deter-
vapors from solvents and other chemicals may contaminate the
carbon.) mination can be reduced. Appearance, porosity, and thickness
should be determined often enough to ensure compliance with
X5.3.3 Control of the Gold Electroplating Bath—Under specific requirements.
continuous operations, when control of bath composition can

X6. SOME REASONS FOR USING A NICKEL UNDERPLATE

X6.1 Diffusion Barrier: in humid air, provided the environment does not contain
X6.1.1 To inhibit diffusion of copper from the basis metal significant amounts of acidic pollutants (such as sulfur dioxide
(and of zinc from brass) to the surface of the precious metal (SO2) or hydrogen chloride (HCl)).
plating.
X6.4 Tarnish Creepage Inhibitor for Gold—Non-copper
X6.1.2 To inhibit interdiffusion between the basis metal and
base metals will inhibit creepage of copper tarnish films over
the gold top coat (for example, silver and copper), which might
the gold—where the tarnish originates from pores and bare
produce a weak alloy or intermetallic compound at the inter-
face. copper edges.

X6.2 Levelling Layer—To produce a smoother surface than X6.5 Load-Bearing Underlayer for Contacting
the basis metal in order to ensure a lower porosity gold top Surfaces—A hard nickel underplate can serve as a load-bearing
plate (for example, levelling nickel over a rough substrate). foundation for the gold top coat to prevent cracking of hard
X6.3 Pore Corrosion Inhibitor—A nickel underplate under golds and reduce the wear of the precious metal during sliding
the gold top coat will form passive oxides at the base of pores of the contacting surfaces.

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