TECHNICAL NOTE

Large Current External FET Controller Type Switching Regulators

High temperature ESD

Single-output High-frequency Step-down

operating Resistance

Now available Now available

Switching Regulator(Controller type)

BD9850FVM

Dual-output Step-up, Negative, Step-down

Switching Regulator(Controller type)
BD9851EFV

Description
The BD9850FVM is a 1-channel DC/DC step-down switching regulator controller, while the BD9851EFV is a 2-channel DC/DC
step-down switching regulator controller. The BD9850FVM is adaptable for a maximum switching frequency of 2 MHz and the
BD9851EFV for that of 3 MHz. Both provide space saving in all applications.

Features
1) Adaptable for 2-MHz switching frequency (externally variable) (BD9850FVM)
Adaptable for 3-MHz switching frequency (externally variable) (BD9851EFV)
2) FET direct drive
3) High-accuracy reference voltage (Accuracy: ±1%)
4) Built-in Under Voltage Lock Out circuit (UVLO)
5) Built-in Thermal Shutdown circuit (TSD)
6) The BD9851EFV provides two channels:
Channel 1 available for selection of step-down/step-up switching
Channel 2 available for selection of step-down/inverting switching.
7) Compact MSOP8 package (BD9850FVM) / HTSSOP-B20 package (BD9851EFV)

Applications
TFT panel, TA / Router, digital consumer electronics, PC, and portable CD/DVD/DVC

Product lineup
BD9850FVM BD9851EFV
Input range 4V to 9V 4V to 18V
Oscillation frequency range 100kHz to 2MHz 10kHz to 3MHz
External synchronization Not provided Not provided
Standby function Not provided Provided
Operating temperature – 40˚C to 85˚C –40˚C to 85˚C
Package MSOP8 HTSSOP-B20

Sep. 2008

ROHM CO., LTD .

Absolute maximum ratings (Ta=25˚C)

BD9850FVM

Item Symbol Rating Unit

Power supply voltage Vcc 10 V
Storage temperature Tstg –55 to +150 ºC
Operating temperature Topr –40 to +85 ºC
Power dissipation Pd 587 * mW
Maximum junction temperature Tjmax +150 ºC
*Reduce by 4.7 mW/ ºC over 25ºC (When mounted on PCB of 70mm ×70mm ×1.6mm)

BD9851EFV

Item Symbol Rating Unit

Power supply voltage
Vcc 20 V
(Between Vcc and GND)
Between VREF and GND VREF 7 V
Between OUT1 and PVcc1
Vouth 20 V
Between OUT2 and PVcc2
Between OUT1, OUT2 and PGND Voutl 20 V
(*)
Power dissipation Pd 1000 mW
Operating temperature Topr –40 to +85 ºC
Maximum junction temperature Tjmax +150 ºC
Storage temperature Tstg –55 to +150 ºC
(*)Reduce by 8.0 mW/ ºC over 25ºC (When mounted on PCB of 70mm ×70mm ×1.6mm)

Recommended operating range

BD9850FVM
Limits
Item Symbol Unit
min. Typ. max.
Power supply voltage Vcc 4 7 9 V
Oscillation frequency fosc 100 – 2000 kHz
Operating temperature Topr –40 – + 85 ºC

BD9851EFV
Limits
Item Symbol Unit
min. Typ. max.
Power supply voltage Vcc 4 12 18 V
Oscillation frequency fosc 10 300 3000 kHz
Timing resistor RRT 3.3 – 47 kΩ
Timing capacitor CCT 33 – 10000 pF

2/16
 BD9850FVM

Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=7V, fosc=600kHz)

Limits
Item Symbol Unit Conditions
min. Typ. max.
[Oscillator block]
Oscillation frequency fosc 510 600 690 kHz RRT = 24kΩ
Frequency regulation FDV –5 0 5 % Vcc = 4V to 9V
Oscillator amplitude voltage Vpptr – 0.5 – V *
[Soft start / SW block]
CTL/SS pin sink current ISS –1.90 –1.00 1.00 μA VCTL/SS = 1.5V
CTL / SS pin clamp voltage VSS 2.2 2.4 2.6 V
CTL threshold voltage VCTLTH 1.2 1.3 1.4 V
[PWM comparator block]
0% threshold voltage D0 1.5 1.6 1.7 V fosc = 600kHz
100% threshold voltage D100 2.0 2.1 2.2 V fosc = 600kHz
[Error Amp block]
Threshold voltage VIN 0.98 1.00 1.02 V AV = 0dB *
Frequency bandwidth BW 1.5 3.0 – MHz *
Voltage gain Av – 70 – dB
Input bias current IIB –150 –70 – hA
Maximum output voltage VCH 2.3 2.4 2.6 V
Minimum output voltage VCL – 0.03 0.20 V
Output source current IOl –3.1 –1.6 –1.0 mA VFB = 1.0V
Output sink current IOO 12 50 125 mA VFB = 1.0V
[VREF block]
VREF output voltage VREF 2.475 2.500 2.525 V IVREF = 0mA
FREF load regulation ΔVREFl0 – – 10 mV IVREF = 0mA to –1mA
VREF current capacitance IVREF –45 –16 –1 mA
[Total device]
Standby current ICCS 420 610 960 μA
Average supply current ICCA 3.4 5.0 7.8 mA At no load
[Output block]
ON resistance RON 0.9 2.5 8.0 Ω
Output transient time Tr/ Tf – 20 – nsec Cout = 1000pF *
[Under voltage lockout block]
Threshold voltage VUT 3.7 3.8 3.9 V Vcc sweep down
Hysteresis width VUThy 0.05 0.10 0.15 V
*Design guarantee
*Not designed to be radiation-resistant.

3/16
 BD9851EFV

Electrical characteristics (Unless otherwise specified, Ta=25˚C, Vcc=12V, fosc=300kHz, STB=3V)

Limits
Item Symbol Unit Conditions
min. Typ. max.
[Total device]
Standby mode circuit current Iccst – – 5 μA STB=0V
Operation mode circuit current Icc 1.5 2.5 4.1 mA FB1, FB2=0V
[Reference voltage block]
Output voltage VREF 2.475 2.500 2.525 V Io=–0.1mA
Input stability DVli – – 10 mV Vcc=4Vto18V, Io=–0.1mA
Load stability DVlo – – 10 mV Io=–0.1mA to –1mA
Short circuit mode output current Ios – 45 –12 –3 mA
[Oscillator block]
Oscillation frequency fosc 270 300 330 kHz RRT=24kΩ, CCT=220pF
Oscillation frequency regulation Dfosc –2 0 2 % Vcc=4Vto18V
[Error Amp block]
Threshold voltage Vthea 0.98 1.00 1.02 V Ch1
Input offset voltage Vofst –10 0 10 mV Ch2
Common-mode input voltage range Vcm 0.3 – 2.0 V Ch2
Input bias current Ibias –150 –70 – nA
Voltage gain Av 60 75 90 dB DC *Design guarantee
Frequency bandwidth Bw 3 6 13 MHz MHz *Design guarantee
Maximum output voltage Vfbh VREF –0.1 – VREF V
Minimum output voltage Vfbl – – 0.1 V
Output sink current Isink 1.6 6 16 mA FB pin
Output source current Isource –260 –160 –90 μA FB pin
[PWM comparator block]
0% threshold voltage Vth0 1.21 1.31 1.41 V FB voltage
100% threshold voltage Vth100 1.74 1.84 1.94 V FB voltage
DTC bias current Idtc –1 – 1 μA
[FET driver block]
RONN 1.5 3 3 Ω When OUT = Lo
ON resistance
RONP 1 2 2 Ω When OUT=Hi
Vselh Vcc – 0.2 – – V In step-down switching
SEL1 input voltage range
Vsell 0 – – V In step-down switching
[Control block]
Threshold voltage Vstb 0.6 1.5 1.5 V
Sink current Istb 6 15 15 μA STB = 3V
[Short circuit protection circuit (SCP) block]
Timer start voltage Vtime 2.2 2.3 2.3 V FB voltage
Threshold voltage Vthscp 1.4 1.5 1.5 V SCP voltage
Standby mode voltage Vstscp – 10 10 mV SCP voltage
Source current Vsoscp –3.2 –2.0 –2.0 μA SCP=0.75V
[Under voltage lockout block (UVLO)]
Threshold voltage Vuvlo 3.58 3.7 3.7 V Vcc sweep down
Hysteresis width DVuvlo 0.05 0.11 0.11 V
*Design guarantee
4/16
Characteristic data
(BD9850FVM)

1.02 100

1.015 90
ERROR-AMP. THRESHOLD VOLTAGE : VINV(V)

87
1.01
70

ON DUTY : DON(%)
1.005
60

1 50

0.995 40

30
0.99
20
0.985
10
0.98 0
–40 –20 0 20 40 60 80 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2

AMBIENT TEMPERATURE : Ta(˚C) FB VOLTAGE : VFB(V)

Fig.1 Error Amp threshold voltage vs. Ambient temperature Fig.2 FB voltage vs. ON Duty

1000 1000

900 900

800 800 Vcc=10V

OUT SOURCE CURRENT : IOUT [mA]

OUT SINK CURRENT : IOUT [mA]

700 Vcc=10V 700
Vcc=7V
600 600
Vcc=7V
500 500

400 400
Vcc=4V
300 Vcc=4V 300

200 200

100 100

0
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2

(VCC-OUT)VOLTAGE : VO(V) OUT VOLTAGE : VO(V)

Fig.3 (Vcc-OUT) Voltage vs. Output source current Fig.4 Output voltage vs. Output sink current

2.53 650

640
2.52
OSCILLATING FREQUENCY : FOSC [kHz]

630

620
VREF VOLTAGE:VREF [V]

2.51
610
RT=24kΩ
2.5 600

590
2.49
580

570
2.48
560

2.47 550
–40 –20 0 20 40 60 80 –40 –20 0 20 40 60 80

AMBIENT TEMPERATURE : Ta [˚C] AMBIENT TEMPERATURE : Ta [˚C]

Fig.5 VREF vs. Ambient temperature Fig.6 Oscillation frequency vs. Ambient temperature

5/16
(BD9851EFV)

1.02 100

90
ERROR-AMP. THRESHOLD VOLTAGE : VEATH (V)
1.015
80
1.01
70

ON DUTY : DON (%)

1.005
60

1 50

40
0.995
30
0.99 fosc=1MHz
20 fosc=300kHz
0.985
10

0.98 0
–40 –20 0 20 40 60 80 1.2 1.3 1.4 1.5 1.6 1.7 1.8 19

AMBIENT TEMPERATURE : Ta(˚C) DTC VOLTAGE : VDTC (V)

Fig.7 Error Amp threshold voltage vs. Ambient temperature Fig.8 FB voltage vs. ON Duty

1000 1000
Vcc=20V
900 900

800 800
OUT SOURCE CURRENT : IOUT (mA)

OUT SINK CURRENT : IOUT (mA)

Vcc=12V Vcc=20V
700 700

600 600
Vcc=12V
500 500

400 400
Vcc=4V
300 300 Vcc=4V

200 200

100 100

0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 0 1.5 2 2.5 3 3.5 4

(Vcc-OUT) VOLTAGE : VO(V) OUT VOLTAGE : VO (V)

Fig.9 (Vcc-OUT) Voltage vs. Output source current Fig.10 Output voltage vs. Output sink current

2.55 320
RRT=24kΩ
2.54 315 CCT=220pF
OSCILLATING FREQUENCY : FOSC (kHz)

2.53
310
REFERENCE VOLTAGE : VREF (V)

2.52
305
2.51

2.5 300

2.49
295
2.48
290
2.47
285
2.46

2.45 280
–40 –20 0 20 40 60 80 –40 –20 0 20 40 60 80

AMBIENT TEMPERATURE : Ta(˚C) AMBIENT TEMPERATURE : Ta(˚C)

Fig.11 VREF vs. Ambient temperature Fig.12 Oscillation frequency vs. Ambient temperature

6/16
Block diagram / Pin assignment
(BD9850FVM)

Vcc

Vcc VREF RT
1 4 8

Vcc
U.V.L.O VREF
TRI

Vcc
5
INV
2
Error Amp Clamper OUT
1.0V VREF Vo
PWM COMP

6
FB

T.S.D

7 3
CTL/SS
GND

Fig.13 BD9850FVM Block diagram

CTL/ SS

INV
RT

Pin No. Pin name Function

FB

1 Vcc Power supply

2 OUT FET driver drive output

3 GND Ground
4 VREF Reference voltage (2.5V±1%) output
5 INV Error Amp inverting input
6 FB Error Amp output
GND
OUT

7 CTL /SS Control/Soft start common

VREF
Vcc

8 RT Oscillation frequency setting resistor connection

(BD9851EFV)
Vcc

Vcc
18 Pin No. Pin name Function
Both channels 19 STB
VREF VREF ON/OFF
17 1 SEL1 CH1 drive FET setting (Vcc short: P-ch drive, GND short: N-ch drive)
(2.5V)

Vcc
FB1
2 RT Oscillation frequency setting resistor connection
15 SEL1
Vo1 1
3 CT Oscillation frequency setting capacitor connection
Vcc
PVcc1
4 NON2 Error Amp non-inverting input (CH2)
12
16 – 5 INV2 Error Amp inverting input (CH2)
INV1
– OUT1
+ – 11 6 FB2 Error Amp output (CH2)
+
1V
VREF 7 DTC2 Maximum duty/soft start setting (CH2)
Vo1

DTC1 8 PVCC2 FET driver block power supply input (CH2)

13
+
+ PGND 9 OUT2 FET driver block output (CH2)
– 10
FB2
6
2.3V 10 PGND FET driver block ground
Vo2
Vcc
11 OUT1 FET driver block output (CH1)
PVcc2
8
VREF 12 PVCC1 FET driver block power supply input (CH1)
5 –
INV1
– OUT2
NON2 + – 9 13 DTC1 Maximum duty/soft start setting (CH1)
4
+
VREF
DTC2 14 SCP Short circuit protection timer setting capacitor connection
7 Vo2

15 FB1 Error Amp output (CH1)

RT
2
OSC 16 INV1 Error Amp inverting input (CH1)
CT
3
GND 17 VREF Reference voltage (2.5V±1%) output
20
SCP 14 Tmer
Latch 18 VCC Power supply input

19 STB ON/OFF control

Fig.14 BD9851EFV Block diagram 20 GND Ground

FIN on Make FIN on the reverse open or ground to GND (pin 20)
PVcc1
OUT1

–
DTC1
GND

INV1

SCP
VREF

FB1
STB
Vcc

reverse (However, open FIN on the reverse will degrade radiation performance.)
NON2

PGND
PVcc2
OUT2
DTC2
SEL1

INV2
FB2
RT
CT

7/16
 Description of operations

1) Reference voltage block

The reference voltage block generates a constant voltage with temperature compensated through inputting the power supplied from
the Vcc pin. The output voltage is 2.5 V, with a ±1% accuracy. To cancel noises, insert a capacitor with a low ESR (several tens of mΩ)
between the VREF and GND pins. It is recommended to use a ceramic capacitor of 1μF for this purpose.

2) Triangular wave oscillator block

By connecting the resistor and capacitor of frequency settings to the RT and CT pins (only to RT pin on the BD9850FVM), a triangular
wave will be generated and then input to the PWM comparators of Channels 1 and 2.

3) Error Amp block

The Error Amp block detects the output voltage of the INV pin, amplifies an error with the set output voltage, and then outputs the
error from the FB pin. The comparison voltage is 1 V, with a ±2% accuracy. (The Channel 2 of the BD9851EFV uses the NON pin input
voltage as a reference.)
Inserting a resistor and capacitor between the INV and FB pins will conduct phase compensation.

4) PWM comparator block

The PWM comparator block converts the output voltage (FB voltage) into a PWM waveform and outputs it to the FET driver.
<Dead time control> (Only available on the BD9851EFV)
Inputting a voltage, divided by resistance of the VREF pin in the DTC pin, will allow maximum ON duty setting.
<Soft start (BD9850FVM)>
Inserting a capacitor between the CTL/SS and GND pins will allow the soft start function to control the rising output voltage.
<Soft start (BD9851EFV)>
Inserting a capacitor between the DTC and GND pins will allow the soft start function to control the rising output voltage.
Furthermore, the overshoot of output voltage at startup can be derated. Adding a Schottky diode between the FB and DTC
pins will make it possible to suppress the overshoot rate (only available with step-down application).

5) FET driver block

This block is a push-pull type driver enabling direct drive of external MOS FET.
<Setting of step-down/step-up switching (Only available for Channel 1 of BD9851EFV)>
For the Channel 1, SEL1 pin setting will determine the application function.
Set the SEL1 pin to step-down (P-ch drive) mode for short-circuiting Vcc or to step-up (N-ch drive) mode for short-circuiting GND.
Furthermore, be sure to short-circuit the SEL1 pin to Vcc or GND pin.

6) Standby function
(BD9850FVM)
The CTL/SS pin allows for output ON/OFF control. Set the CTL/SS pin voltage to “H” to activate the output ON control.
(BD9851EFV)
The STB pin allows for output ON/OFF control. Set the STB pin voltage to “H” to activate the output ON control.
The standby mode circuit current should be set to less than 5 μA.

7) Short circuit protection circuit (SCP) (Only available on BD9851EFV)

The SCP is a timer-latch type short circuit protection circuit.
If the output voltage of either channel drops below the set voltage, the Error Amp will be activated to increase the FB voltage and
initiate charging the capacitor connected to the SCP pin with a 2 μA current. When the SCP pin voltage exceeds 1.5 V, the latch circuit
will be activated to fix the output of both channels at OFF and, at the same time, the DTC pin at “L” level.
In order to rest the latch circuit, set the STB pin to “L” level once, and then to “H” level. Or, turn ON the power supply again.
Furthermore, if the short circuit protection circuit is not used, short-circuit the SCP pin to the GND pin.

8) Under Voltage Lock Out (UVLO) circuit

The UVLO is a protection circuit to prevent the IC from malfunctioning when the power supply turns ON or if an instantaneous power
interruption occurs.
When the Vcc voltage falls below 3.8 V (or 3.7 V on the BD9851EFV), the output of both channels will be fixed at “OFF” and, at the same
time, the DTC pin at “L” level. Hysteresis width of 0.1 V (or 0.11 V on the BD9851EFV) is provided for the detection voltage and release
voltage of the UVLO in order to prevent malfunctions of the IC which may result from variations in the input voltage due to threshold
online.
Furthermore, if the latch circuit is activated through the short circuit protection circuit, the circuit will be reset by this UVLO.

9) Thermal shutdown circuit (TSD)

The TSD is a protection circuit to prevent the destruction of the IC due to abnormal heat generation.
If the TSD detects an abnormal heat generation (175˚C) on the chip, the output of both channels will be fixed at “OFF” and, at the same
time, the DTC pin at “L” level. Hysteresis width (15˚C) is provided for the superheat detection and release temperatures in order to prevent
malfunctions of the IC which may result from variations in the input voltage due to threshold online.
Furthermore, if the latch circuit is activated through the short circuit protection circuit, the circuit will be reset by this TSD.

8/16
Timing chart
• In startup/normal operation
(BD9850FVM) FB pin voltage
Soft start set voltage
Oscillator output

Control threshold

OUT pin waveform

Vcc waveform

Output voltage
waveform

Fig.15 BD9850FVM Timing chart

(BD9851EFV)

Vcc pin voltage

waveform
3.8V

Output short circuit 1.5V

SCP pin voltage

waveform

FB
CT DTC

2.3V

OUT pin voltage

waveform

Output voltage
waveform

Fig.16 BD9851EFV Timing chart

9/16
 Description of external components
• Setting of output voltage (BD9850FVM)
Setting of output voltage for the step-down application can be calculated by the formula below :

Setting procedure Application

Vo = Vthea × (R1 + R2) / R2 [V] Vo

(Vthea: Error Amp threshold voltage Typ. 1.0 [V])

R1
INV (5)
R2

Setting of output voltage (BD9851EFV)

Setting procedure Application

• Step-down (CH1), Step-up (CH1) Vo1

Vo1 = Vthea × (R1 + R2) / R2 [V]
(Vthea: Error Amp threshold voltage Typ. 1.0 [V])
R1
INV1 (16)
R2

• Step-down (CH2) VREF (17)

Vo2 = VNON2 × (R1 + R2) / R2 [V] Vo2 R3
VNON2 = 2.5 × R4 / (R3 + R4) [V] NON2 (4)
However, set the NON2 pin voltage to 0.3 to 2.0 V. R4
R1
INV2 (5)
R2

• Inverting (CH2) VREF (17)

Vo2 = 2.5 – {(2.5 - VINV2) X (R1 + R2) / R1} [V] R3
VINV2 = 2.5 × R4 / (R3 + R4) [V] INV2 (5)
However, set the INV2 pin voltage to 0.3 to 2.0 V R4
R1
NON2 (4)
R2
Vo2

Setting of oscillation frequency (BD9850FVM)

Connecting a resistor to the RT pin (pin 2) allows for the setting of oscillation frequency.

10000
RT (2)

RRT
Oscillating frequency [kHz]

1000

Fig.17 Setting procedure for BD9850FVM

oscillation frequency

100
1 10 100 1000
Timing resistance(RT) [kΩ]

Fig.18 RT vs. Oscillation frequency

10/16
• Setting of oscillation frequency (BD9851EFV)
Connecting a resistor to the RT pin (pin 2) and a capacitor to the CT pin allows
for the setting of oscillation frequency. RT (2)
RRT

CT (3)
CCT

Fig. 19 Setting procedure for BD9851EFV oscillation frequency

1000 1000

CCT=33pF
Oscillating Frequency (kHz)

Oscillating Frequency (kHz)

CCT=220pF
1000 1000

RRT=4.7kΩ
CCT=1200pF

100 100 RRT=24kΩ

10 10
1 10 100 10 10 100 1000
Timing Resistance (kΩ) Timing Capacitance(pF)

Fig. 20 RT vs. Oscillation frequency Fig. 20 CT vs. Oscillation frequency

• Setting of timer of short circuit protection circuit (BD9851EFV)

Setting procedure Application

TSCP = 7.45 × 105 × CSCP

TSCP : Time from output short circuit to latch stop [sec] SCP (14)
OSCP : Capacitance of capacitor between the SCP and CSCP
GND pins [F]

• Setting of maximum duty (BD9851EFV)

Setting procedure Application

DUTY(max.) = 100 × (VDTC – Vth0) / (Vth100 – Vth0)

VDTC = 2.5 × R2 / (R1 + R2) VREF (17)

DUTY(max.) : Maximum duty [%] R1

VDTC : DTC pin voltage [V] DTC (13)(7)

Vth0 : 0% duty threshold voltage [V] R2
Vth100 : 100% duty threshold voltage [V]

• Pin treatment of unused channels (BD9851EFV)

(18) (17) (18)
Vcc VREF Vcc

SEL1 NON2 INV FB DTC PVcc OUT

(1) (16) (15) (13) (12) (11)
(4) (5) (6) (7) (8) (9)

Upper : Pin No. to be treated when the CH1 is not used

Lower : Pin No. to be treated when the CH2 is not used

Fig. 22 Pin treatment procedure for unused channel on BD9851EFV

In order to use one channel, treat the pins of unused channel as shown above.

11/16
5
 Application circuit / Directions for pattern layout
(BD9850FVM)

RT
Vo
Vcc R1

Vcc RT

OUT C1 OUT CT/SS

GND FB

* R1 GND
Vcc Vcc RT VREF INV
C1
* C1
OUT CTL/SS C1: In order to reduce ripple noises, set the shortest
GND FB distance between the VCC pin and the capacitor pin,
C2 VREF
and the GND pin and the capacitor pin. Furthermore,
1µF VREF INV the OUT line may pass under the C1.
*
ON/OFF C2: In order to reduce ripple noises, set the shortest
[ HL::ON
OFF
] pattern between the VREF pin and the capacitor pin,
and the GND pin and the capacitor pin.
R1: In order to stabilize the switching frequency, set the
smallest pattern area so that PCB parasitic
capacitance for the RT pin will be minimized.
Fig.23 BD9850FVM Reference application

1 SEL1 GND 20 1 SEL1 GND 20

2 RT STB 19 STB 2 RT STB 19 STB

3 CT VCC 18 Vcc 3 CT Vcc 18 Vcc
4 NON2 VREF 17 GND 4 NON2 VREF 17 GND
5 INV2 INV1 16 5 INV2 INV1 16

6 FB2 FB1 15 6 FB2 FB1 15

7 DTC2 SCP 14 7 DTC2 SCP 14

8 PVCC2 DTC1 13 8 PVcc2 DTC1 13

9 OUT2 PVcc1 12 9 OUT2 PVcc1 12

Vo2 10 PGND OUT1 11
Vo2 10 PGND OUT1 11
Step-down Inverting
Vo1 VO1
Step-down Step-up

Fig.24 Step-down/Step-up application Fig.25 Step-up/Inverting application

Equivalent circuit
(BD9850FVM)
2PIN(OUT) 4PIN(VREF) 5PIN(INV)
Vcc Vcc
Vcc
1.67k
50k
250k

OUT VREF
INV

200k

193k
GND GND GND

6PIN(FB) 7PIN(CTL/SS) 8PIN( R T )

Vcc Vcc VREF
20k 5k
100k

FB
500k
20p CTL/SS
RT
1k

200k
GND GND GND

Fig.26 Equivalent circuit (BD9850FVM)

12/16
BD9851EFV
1PIN (SEL1) 2PIN (RT) 7,13PIN (DTC2,DTC1)
Vcc Vcc Vcc VREF VREF Vcc Vcc

SEL1
DTC
RT

9PIN (OUT2) 3PIN (CT) 4PIN (NON2)

Vcc Vcc PVcc2
VREF Vcc Vcc
VREF VCC VREF VREF VREF VREF VREF

OUT2 CT NON2

PGND

11PIN (OUT1 ) 14PIN (SCP) 5,16PIN (INV2,INV1)

VREF Vcc Vcc
Vcc Vcc PVcc1 VREF Vcc VREF Vcc

OUT1 SCP INV

6,15PIN (FB2,FB1) 17PIN (VREF) 19PIN (STB)

Vcc Vcc Vcc
VREF Vcc VREF VREF Vcc

STB
FB
VREF

Fig.27 Equivalent circuit (BD9851EFV)

Cautions on use
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices,
thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the
absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) GND potential
Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential
voltage including an electric transients.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive
and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuitís power
lines.
5) Operation in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Thermal shutdown circuit (TSD circuit)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off
to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating
this circuit or use the IC in an environment where the operation of this circuit is assumed.
7) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the
inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC.

13/16
8) IC pin input
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. Pin junctions are formed at the
intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each
potential is as follows:
When GND > Pin A and GND > Pin B, the Pin junction operates as a parasitic diode.
When Pin B > GND > Pin A, the PñN junction operates as a parasitic transistor.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits,
operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the
GND (P substrate) voltage to an input pin, should not be used.

Resistor Transistor (NPN)

B
(Pin A) (Pin B)
C E

GND
N
P+ P P+ P+ P P+

N N
N N N N

Player Player
Parasitic element

GND Parasitic element GND

(Pin B)

(Pin A) C
B
Parasitic element E

GND
GND
Other proximity element
Parasitic element

Fig. 28 Typical simple construction of monolithic IC

9) Common impedance
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage on the power ground
line may damage the device.

10) On the application shown below, Vcc is short-circuited to the Ground with external diode charged, internal circuits may be damaged.
recommended to insert a backflow prevention diode in series with the Vcc or a bypass diode between each pin and Vcc.

Bypass diode

Backflow prevention diode

Vcc

Output pin

Fig. 29

14/16
 11) Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to verify circuit
characteristics for your particular application. Modification of constants for other externally connected circuits may cause variations in both static
and transient characteristics for external components as well as this Rohm IC. Allow for sufficient margins when determining circuit constants.
Oscillation frequency setting resistor
12) For the oscillation frequency setting resistor to be inserted between the RT pin and the GND pin, mount this resistor close to the RT pin and
provide the shortest pattern routing.

Thermal derating characteristics

PD(W) MSOP 8 PD(W) HTSSOP-B20
0.8 5

(2) 0.59 W 4
0.6
POWER DISSIPATION : Pd [W]

POWER DISSIPATION : Pd [W]

(4) 3.20W
3
(1) 0.30 W
0.4 (3) 2.30W
Wiring width 0.4mm
Pd = 0.50 W 2
qjc = 200˚C/W
(2) 1.45W
0.2 (1) 1.00W
1

0 0
0 25 50 75 100 125 150 0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta [˚C] AMBIENT TEMPERATURE : Ta [˚C]
(1) : Single piece of IC (1) : Single piece of IC
(2) : With ROHM standard PCB mounted PCB size: 70mmX70mmX1.6 mm2 (PCB incorporates thermal via)
(Glass epoxy PCB of 70mmX70mm X1.6mm) Copper foil area on the reverse side of PCB: 10.5X10.5mm2
(2) : 2-layer PCB (Copper foil area on the reverse side of PCB: 15mmX15mm
(3) : 2-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm
(4) : 4-layer PCB (Copper foil area on the reverse side of PCB: 70mmX70mm

Fig.30 Fig.31

Selection of order type

B D 9 8 5 0 F V M T R

ROHM Product No. Package type Taping type

model name 9850=10V FVM=MSOP8 TR=Reel-type embossed carrier tape (MSOP8)
9851=20V EFV=HTSSOP-B20 E2=Reel-type embossed carrier tape (HTSSOP-B20)

MSOP8

<Dimension> <Package specifications>

Package style Embossed carrier tape
Quantity 3000 pieces /reel
2.9 ± 0.1
TR
0.29 ± 0.15

8 5 Packaging
0.6 ± 0.2

(When holding a reel in left hand and pulling out the tape with
4.0 ± 0.2
2.8 ± 0.1

direction
right hand, No. 1 pin appears in the upper right of the reel.)
1 4 +0.05
0.475 0.145 –0.03
0.9max.

+0.05
0.22 –0.04
0.08 M
0.75 ± 0.05
0.08 ± 0.05

0.65 0.08 S

No. 1 pin Pulling-out side

(unit : mm) Reel

HTSSOP-B20

<Dimension> <Package specifications>

Package style Embossed carrier tape (Moisture-proof specificatin)
Quantity 2500 pieces /reel
6.5 ± 0.1
E2
20 11
Packaging
(When holding a reel in left hand and pulling out the tape with
0.5 ± 0.15

direction
6.4 ± 0.2
4.4 ± 0.1

1.0 ± 0.2

right hand, No. 1 pin appears in the upper left of the reel.)

0.325 1 10 +0.05
0.17 +0.03
1.0max.

S
0.08 S
0.85 ± 0.05
0.08 ± 0.05

+0.05
0.65 0.2 +0.04
12.34

12.34

12.34

12.34

12.34

12.34

12.34

12.34

No. 1 pin Pulling-out side

(unit : mm) Reel

15/16
Catalog No.08T679A '08.9 ROHM ©
 Datasheet

Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
 Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.